CN1788342A - 用于在衬底上堆积材料的模板和方法 - Google Patents

用于在衬底上堆积材料的模板和方法 Download PDF

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CN1788342A
CN1788342A CNA2004800130616A CN200480013061A CN1788342A CN 1788342 A CN1788342 A CN 1788342A CN A2004800130616 A CNA2004800130616 A CN A2004800130616A CN 200480013061 A CN200480013061 A CN 200480013061A CN 1788342 A CN1788342 A CN 1788342A
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aperture
protruding features
template
embryo
substrate
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CN100414676C (zh
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杰弗里·沃森
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Intel Corp
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Abstract

一种用于在要容纳集成电路管芯的衬底上堆积底部填充材料胚的模板和方法。

Description

用于在衬底上堆积材料的模板和方法
发明领域
本发明通常涉及集成电路器件的封装,并且尤其涉及用于在要容纳集成电路管芯的衬底上堆积(deposit)一定量的底部填充材料的模板和方法。
发明背景
为了封装集成电路(IC)芯片或者管芯(例如处理器件或存储器件),该IC管芯一般被安装在衬底上,所述衬底经常是指“封装衬底”。封装衬底包括与IC芯片的引线以及电路电气耦合的多个引线,来路由前往和来自管芯的信号。对于倒装芯片(例如,采用可控坍塌芯片连接(或“C4”)(Controlled Collapse Chip Connect)装配技术),在IC管芯上的结合盘(bondpad)阵列通过连接元件(例如,焊球、焊接柱等)阵列被耦合到封装衬底上对应的引线或“焊盘(land)”阵列。可替换地,使用引线结合(wirebonding)或者另一种合适的方法,IC芯片的结合盘可以被连接到封装衬底上的引线。
由封装衬底提供的电路将IC芯片的引线排布到封装衬底上能够与下一层面的部件(例如,母板、计算机系统、电路板、另外的IC器件等)建立电气连接的各个位置。例如,所述衬底电路可以将所有信号线排布到封装衬底下表面上形成的球栅阵列(或者可替换地,引脚栅阵列)。然后,所述球栅或者引脚栅阵列将封装的IC管芯电气耦合到下一层面的部件,所述部件包括配对的端子(例如,焊盘、引脚插座等)阵列。可替换地,所述电路可以将信号线排布到接近封装衬底周边的地方,其中引线结合可以被使用来将封装的IC芯片耦合到下一层面的部件上。
IC管芯一般使用环氧树脂或者其他合适的粘合剂来附着到封装衬底上。该环氧树脂形成“底部填充”层,所述“底部填充”层不但将管芯附着到封装衬底上,而且为管芯以及在IC管芯结合盘与衬底的引线之间的电气连接(例如,焊料元件)提供机械支撑。为了使得所述底部填充层中的孔隙(void)减到最少,粘合剂(或者“底部填充材料”)一般以团(glob)或堆(mound)的形式堆积在封装衬底上,其中所述团被分配到封装衬底上管芯将被附着的位置。当将管芯向封装衬底挤压时,底部填充材料向外朝管芯的周边流动,使得底部填充材料在管芯的整个下表面(或者其基本部分)的下面形成基本上没有孔隙的并且厚度均匀的层。
使用底部填充材料将IC芯片附着到封装衬底的实施例在图1A至1C中示出。参照图1A,封装衬底110包括多个引线或焊盘115,所述焊盘115以阵列的形式排列。注口105或其他分配器(例如,注射器、滴管等)已在封装衬底110的上表面上分配了一团底部填充材料132(例如,环氧树脂)。如图1B中所示,IC管芯120已被放置在衬底110的上方。所述IC管芯120包括多个连接元件125,其中每个连接元件125(例如,焊球、焊柱等)与1C管芯120上的结合盘(图中未示出)相连接。IC管芯120上的连接元件125以阵列方式来排列,所述阵列对应于衬底110上的焊盘115的排列。
现在参照图1C,IC管芯120已与封装衬底110接合以形成IC封装100。管芯120已被挤压在衬底110上,并且底部填充材料132已被迫从管芯120的内部向外流向其周边来形成底部填充层130。通过将底部填充材料132放置在衬底的中心附近(或者焊盘115阵列的中心附近),并且在将管芯120向衬底110挤压的力的作用下强迫所述材料向外流动,底部填充层130中的孔隙被减到最少,并且形成基本上均匀的底部填充层130。然后,可以进行焊料回流来将每个连接元件125电气连接到它在封装衬底110上的配对引线115,并且,如果需要,可以进行底部填充层130的任何后固化(post-curing)。如以上提到的那样,底部填充层130将管芯120附着到封装衬底110上,并且还为衬底到管芯的电气连接(例如,引线115、连接元件125以及管芯结合盘)提供机械支撑。
时间-压力型分配系统(例如图1A中所示的注口105)就在正确的地方并且以希望的形状(即,具有比最终的底部填充层的厚度更大的高度,使得所述底部填充材料在管芯朝衬底的挤压作用下向外流动)堆积底部填充材料而论,已证明是胜任的。但是,这些时间-压力分配器相对较慢,并且它们的使用会对生产线的速度产生负面影响。
附图说明
图1A至1C为示意图,示出了在衬底和IC器件之间分配底部填充材料的常规方法;
图2A至2C为示意图,示出了使用本文所公开的模板在衬底上堆积底部填充材料的方法的实施方案。
图3A是用于在衬底上堆积一定量材料的模板的一个实施方案的透视图。
图3B是图3A中所示出的模板的俯视图。
图3C是图3A中所示出的模板的侧视图。
图3D是使用图3A-3C的模板可以产生的阶梯状胚的透视图。
图3E-3H的中的每个示出图3A-3C的模板的可替换实施方案。
图4A-4D为示意图,示出了使用所公开的模板在衬底上堆积阶梯状底部填充材料胚的方法的实施方案。
图5是示出使用所公开的模板在衬底上堆积底部填充材料胚的方法的实施方案的框图。
图6A是保持有多个衬底的载体的俯视图。
图6B是具有多个孔口的模板的实施方案的俯视图,所述模板被放置在图6A的载体上。
图6C是三维的模板以及图6A和6B的载体各自的侧视图。
具体实施方式
图2A-2C中所示出的是用已堆积在封装衬底上的底部填充材料将IC管芯附着到封装衬底的实施方案,所述底部填充材料是使用本文所公开的模板来堆积的。所公开的模板实施方案提供了用于在衬底上堆积一定量的底部填充材料的有效机制,其中,所堆积的材料的形状由所述模板的设计来确定。模板以及在衬底上堆积材料的方法的实施方案在此是在将IC管芯附着到封装衬底(例如,使用C4装配技术,从管芯到封装衬底的倒装芯片附着)的情况下描述的。但是,应该理解,所公开的实施方案在应用方面不受这样的限制,并且所公开的模板和方法还可以在任何应用中得到使用,其中需要将一定量的材料以希望的形状来分配(例如,将封装的IC器件附着到下一层面的部件(例如电路板))。
参照图2A,衬底110(例如,封装衬底)包括多个引线或焊盘115,所述焊盘115以阵列的方式来排列。已经使用模板将一定量的底部填充材料232堆积在衬底110上,这将在下面详细描述。所述底部填充材料232已被堆积成金字塔或“阶梯”形状,并且材料的所述阶梯状块或“胚”具有比它的周边高度更高的中心高度,并且所述中心高度比在衬底和管芯之间的底部填充材料的最终的、已挤压的层的高度要高。因此,当所述底部填充材料232的阶梯状胚在管芯和衬底之间被挤压时,底部填充材料232将在所述管芯的下面向外流动来形成基本上没有孔隙的底部填充层。
如图2B中所示,IC管芯120已被放置在衬底110的上方。所述IC管芯120包括多个连接元件125,其中每个连接元件125(例如,焊球、焊柱等)与管芯120上对应的结合盘(图中未示出)连接。连接元件125以阵列方式来排列,所述阵列对应于衬底110上的焊盘115的排列。在一个实施方案中,管芯120包括要使用C4装配技术来附着到衬底110的倒装芯片管芯。
参见图2C,所述IC管芯120已与衬底110接合来形成封装的IC器件200。管芯120已被挤压在衬底110上,并且底部填充材料232已被迫从管芯120的内部向外流向其周边来形成底部填充层230。底部填充层230将管芯120附着到衬底110上并且还为衬底到管芯的电气连接(例如,引线115、连接元件125以及管芯结合盘)提供机械支撑。然后,可以进行焊料回流来将每个连接元件125电气连接到它在衬底110上的配对引线115。还有,如果需要,可以进行底部填充层230的后固化。
现在参照图3A至3C,所示出的是模板300的实施方案,所述模板300可以被用来产生在图2A和2B中示出的材料232的阶梯状胚(coupon)。参照图3A、3B和3C,模板300包括具有上表面311和相反的下表面312的板310。板310可以具有任何合适的厚度317,并且,在一个实施方案中,所述板的厚度317在0.1mm到1mm的范围中。
孔口320延伸通过板310。孔口320的尺寸和形状确定了将由所述模板来形成的胚的外部尺寸,并且所述孔口的尺寸和形状通常与管芯的尺寸(或管芯尺寸的范围)匹配,所述模板是针对所述管芯的尺寸(或管芯尺寸的范围)来设计的。在一个实施方案中,孔口320通常在形状上为矩形或者正方形;但是,孔口320可以具有任何合适的形状(例如,圆形)。孔口320可以具有任何取决于管芯的合适尺寸,所述模板是针对所述管芯来设计的。在一个实施方案中,孔口320包括正方形(或者,更一般地,矩形),所述正方形的边的长度范围在3mm和25mm之间。
从板310的上表面311向上延伸的是一个或多个凸起特征,包括凸起特征330a、330b。在一个实施方案中,如图3A-3C中所示出的那样,凸起特征330a、330b中的每一个包括一系列的阶梯,包括阶梯341a、342a、343、342b、341b。可以采用任何合适的高度和数量的阶梯,取决于要用模板300来形成的胚所希望的形状。还有,可以采用任何合适数量的凸起特征330a-b(例如,一个或多于两个)。
模板300,包括具有孔口320和凸起特征330a-b的板310,可以使用任何合适的制造技术由任何合适的材料构成。在一个实施方案中,模板300是使用蚀刻方法(例如,一系列连续的掩模和化学蚀刻步骤)来制造的。在这个实施方案中,模板300可以用铜、铜合金、不锈钢或者任何其他可被蚀刻处理的材料来构成。在另一个实施方案中,所述模板包括模制塑料或者,更一般地,是使用模制方法由任何合适的材料形成的。在又一个实施方案中,模板300是使用电成形方法制造的,其中所述模板包括一系列使用金属镀覆方法构建的层。还有,在再一个实施方案中,孔口(或者多个孔口)320是使用激光切割出来的。
图3D中示出的是底部填充材料的阶梯状胚390的实施方案,如使用图3A-3C的模板300可以产生的那样的。通常,胚390将具有与孔口320的形状和结构相匹配的形状,并且所述形状还与从板310向上延伸的凸起特征330a、330b的轮廓相匹配。在图3A-3D的实施方案中,阶梯状胚390具有多个阶梯,包括阶梯391a、392a、393a、394、393b、392b、391b,这些阶梯通常与凸起特征330a、330b的一系列阶梯相匹配。注意,在阶梯状胚390上的阶梯的级数(例如,4)超过凸起特征330a、330b一系列阶梯中的阶梯的级数(例如,3)。产生这种结果是因为板310本身导致形成阶梯中的一级,其中,板310的上表面311对应于胚390上的阶梯中的第一级(即,阶梯391a、391b)。
所公开的模板的实施方案不限于图2A-2C和3A-3D中示出的阶梯形状。在模板300上的凸起特征330a、330b,以及由模板300形成的胚390,可以是任何所希望的合适形状和/或结构。这一点在图3E至3H中示出,图中的每一个示出了模板300上的凸起特征330a-b的可替换实施方案。通常,凸起特征330a-b的轮廓可以被修整,从而为一批要使用所述模板来堆积的材料提供任何希望的形状。图3E至3H中的每一个所示出的模板300的实施方案可以适合于由模制塑料(或者其他模制材料)产生的模板,而图3A-3C中示出的模板300的实施方案可以适合于使用蚀刻方法制造的模板。
图4A至4D中示出的是使用图3A-3C的模板300来堆积材料胚的方法,而图5示出了使用所述公开的模板来堆积一定量的材料的方法500。注意,在图4A至4C的每一个中,模板300是以虚线来示出的。在下面的讨论中,如文中所使用的那样,应该参考图4A-4D和图5中的每一个。
参照图5中的框510,模板被放置在衬底上,并且底部填充材料被施加到所述模板,如在框520所示。通常,底部填充材料被堆积在模板的上表面上与孔口邻近的地方(例如,图3A和3B中以虚线示出的区域319中)。这一点在图4A中示出,其中模板300(以虚线示出)已被放置在衬底110上,并且底部填充材料494已被放置在模板300上表面上邻近孔口320的地方。底部填充材料494可以包括任何合适的粘合剂或者其他结合剂,例如环氧树脂。在一个实施方案中,所述底部填充材料包括助焊剂(flux)或者其他清洁剂来帮助焊料回流。在另一个实施方案中,底部填充材料包括填料(例如,硅石)来改变所述底部填充材料的机械和/或热性能。例如,可以加入填料来提高底部填充材料的强度和/或可以加入填料来调整底部填充材料的热性能,以与管芯和/或衬底的那些性能相匹配。底部填充材料494的量至少应该基本上与要形成的材料胚的量相等,并且,在一个实施方案中,底部填充材料的量超过生成胚所需要的材料的量。
回到图5,如在框530示出的那样,底部填充材料被迫进入模板300中的孔口320中。可以使用任何合适的装置(例如刮板、刀片、辊或者类似装置)强迫底部填充材料流入孔口320。这一点在图4A至4C中示出。参照图4A,刮板装置470在模板300的上表面311上朝孔口320的方向移动(见箭头473)。当刮板470在模板300的上表面311和凸起特征330a-b上行进时,底部填充材料494被迫进入孔口320中,如在图4B中示出的那样。在图4C中,刮板470已在模板300的孔口320和凸起特征330a-b上完成一次通过,并且被迫进入孔口320中的底部填充材料的量通常与孔口320和凸起特征330a-b的形状相符。注意,一些底部填充材料494可以保留在模板300的上表面311上。当需要填充在孔口320和凸起特征330a-b中的空间时,刮板470可以在孔口320和凸起特征330a-b上进行额外的通过。此外,在一个实施方案中,在被迫进入孔口320中之前,底部填充材料494被预先加热以改善它的流动特性。预先加热温度可以在从80℃至120℃的范围中。
再转到图5,模板可以从衬底移走,如在框540中所示。这一点在图4D中示出,其中模板300已从衬底110搬走,留下阶梯状胚492在衬底110的上表面上。应该理解,由于刮板470(或者其他用来导致底部填充材料流入孔口320中的装置)的运动,当它来回经过凸起特征330a-b的轮廓(例如,所述阶梯)时,胚490可能不会精确地与凸起特征330a-b的轮廓相符(例如,见胚492的圆角,如图4D中所示。)。
回来参照图5,方法500进一步的实施方案在框550至580的每一个中示出。在一个实施方案中,如框550中所示,管芯被放置在阶梯状胚492上(见图2B)。在另一个实施方案中,所述管芯被挤压在衬底上(见图2C),从而导致阶梯状胚的底部填充材料向外流向所述管芯的周边,如框560中所示。在一个实施方案中,施加在管芯和衬底之间的挤压力在从4.9N至98.1N的范围中(例如,这一点可以通过在管芯上放置0.5Kg到10Kg之间的质量来获得)。在又一个实施方案中,框570中示出的是,进行焊料回流来将衬底上的结合盘与管芯上的焊盘电气耦合(例如,通过回流与管芯引线耦合的焊料元件)。底部填充材料在焊料接合点周围凝结(set up)并且固化;但是,底部填充材料可以达到凝胶状态而不是变成完全固化的。因此,在再一个实施方案中,如在框580中所示,如果需要,固化(例如,通过加热)底部填充材料。
在图5的框510至540中所描述的方法(以及框550至580的实施方案)可以被重复用于其他衬底(以及管芯),并且同一模板300可以被重复使用于多个衬底。在一个实施方案中,模板300被设计来用于特定的管芯尺寸,并且所述模板可以被重复使用于特定管芯尺寸的多个管芯附着操作。在另一个实施方案中,模板300被设计成用于一个范围的管芯尺寸,并且所述模板300可以被重复使用于管芯尺寸互不相同的多个管芯附着操作。
至此,具有单个孔口用于形成单个胚的模板已被描述。但是,所公开的实施方案并不限于这种情形。在另一个实施方案中,模板包括多个孔口和凸起特征来形成多个胚。这个实施方案在图6A至6C中示出。
参照图6A,多个衬底660(例如,封装衬底)被放置在载体650(例如,托盘、载带或者其他用于固定多个衬底的类似装置)中。衬底660在载体650上以2×4的阵列方式排列。一般的载体可以有6英寸×12英寸的尺寸并且,根据衬底的尺寸不同,可以保持8至12个衬底。但是,载体可以小到2英寸宽(例如,用于单个衬底或者单列的衬底)。
现在参照图6B和6C,模板600被放置在载体650和多个衬底660上(注意,在图6C中,为清楚起见,模板600被示出为在垂直方向上偏离载体和衬底)。模板600包括板610,所述板610具有包括孔口620a至620h的多个孔口,其中所述孔口一般以与载体650上的衬底660的阵列相匹配的图形来排列。被设置在接近孔口620a-h周边并且从板610的上表面611向上延伸的是多个凸起特征,包括凸起特征630a至6301,如图6B和6C所示。在一个实施方案中,凸起特征630a-k中的每一个包括一系列的阶梯,包括阶梯641a、642a、643、642b、641a,如图6C中所示。模板600可以以类似于以上针对图3A-3C的模板300所描述的方式来制作(例如,通过蚀刻金属或者其他合适的材料,模制的塑料,电形成,等等)。
模板600可以被使用来在载体650中所保持的衬底660上堆积多个底部填充材料胚,即每个衬底上一个胚。胚的形成以类似于以上针对图4A-4D和图5所描述的方式来进行。底部填充材料被分配在上表面611上,在板610的一端,处于邻近孔口中的一些孔口(例如,孔口620a、620b)的区域619中。但是,当刮板(或者其他类似装置)在模板600上行进时,底部填充材料被迫进入所有的孔口620a-h中。因此,在一次操作期间,多个胚能够被堆积在多个衬底上,由此为加工环境提供了更加有效率的方法。如以上所描述的那样,模板600还可以被重复使用。
在此已经描述了用于在衬底上形成材料胚(例如,阶梯状胚)的模板300、600的实施方案,以及用于在衬底上形成这样的胚的方法500的实施方案,本领域普通技术人员将领会所公开的实施方案的优点。所公开的模板使得能够在衬底上堆积具有这样形状的胚,即所述形状将为IC封装中的底部填充层提供所希望的流动特性。胚的形成,或者多个这样的胚的形成,相对较快并且需要很少的生产步骤。所述模板能够使用周知的、低成本的化学蚀刻处理技术来制造,并且所述模板能够被重复使用多次。此外,所公开的实施方案能够与现有的模板设备一起使用。
以上的详细描述以及附图仅仅是说明性的,而非限制性的。提供这些详细描述以及附图主要是为了清楚以及全面地理解所公开的实施方案,并且应该理解其中没有不必要的限制。在没有偏离所公开的实施方案的精神以及所附的权利要求书的范围的情况下,本领域的技术人员可以想到许多对在此描述的实施方案的添加、删除和修改,以及可替换的方案。

Claims (45)

1.一种装置,包括:
具有上表面和相反的下表面的板;
延伸通过所述板的孔口;以及
被设置在接近所述孔口的周边并且从所述板的上表面向上延伸的凸起特征;
其中,被堆积在所述孔口中的材料在形状上基本上与所述孔口和所述凸起特征相符。
2.如权利要求1的装置,其中所述凸起特征包括多个阶梯。
3.如权利要求1的装置,还包括:
被设置在接近所述孔口的周边并且从所述板的上表面向上延伸的第二凸起特征。
4.如权利要求1的装置,其中所述孔口的形状基本上是矩形。
5.如权利要求1的装置,其中所述孔口的形状基本上是正方形。
6.如权利要求1的装置,其中所述板包括金属或者塑料材料。
7.一种装置,包括:
具有上表面和相反的下表面的板;
延伸通过所述板的孔口;
被设置在接近所述孔口的周边并且从所述板的上表面向上延伸的第一凸起特征;以及
被设置在接近所述孔口的周边并且从所述板的上表面向上延伸的第二凸起特征;
其中,被堆积在所述孔口中的材料形成具有基本上对应于所述孔口以及所述第一和第二凸起特征的形状的胚。
8.如权利要求7的装置,其中所述胚包括阶梯状胚。
9.如权利要求7的装置,其中所述第一和第二凸起特征的每一个包括多个阶梯。
10.如权利要求7的装置,其中所述板包括金属。
11.如权利要求10的装置,其中所述板包括铜材料,铜合金材料,以及不锈钢材料中的至少一种。
12.如权利要求7的装置,其中所述板,所述第一凸起特征,以及所述第二凸起特征包括单个部件。
13.如权利要求7的装置,其中所述板包括模制塑料。
14.如权利要求7的装置,其中所述装置是通过蚀刻方法或者电形成方法形成的。
15.如权利要求7的装置,其中所述孔口在形状上是矩形。
16.如权利要求7的装置,其中所述孔口在形状上是正方形。
17.如权利要求7的装置,还包括:
延伸通过所述板的第二孔口;
被设置在接近所述第二孔口的周边并且从所述板的上表面向上延伸的第三凸起特征;以及
被设置在接近所述第二孔口的周边并且从所述板的上表面向上延伸的第四凸起特征;
其中,被堆积在所述第二孔口中的材料形成具有基本上对应于所述第二孔口以及所述第三和第四凸起特征的形状的胚。
18.如权利要求17的装置,其中由所述第二孔口形成的所述胚的所述形状基本上与由所述孔口形成的所述胚的所述形状相同。
19.如权利要求17的装置,其中所述第一和第二凸起特征中的一个,以及所述第三和第四凸起特征中的一个,包括被放置在所述第二孔口和所述孔口之间的一个凸起特征。
20.一种方法,包括:
在衬底上放置模板,所述模板包括延伸通过其中的孔口,以及被设置在接近所述孔口并且从所述模板的上表面向上延伸的凸起特征;
在所述模板的上表面上施加一定量的材料;以及
采用一种装置,通过在所述孔口和所述凸起特征上移动所述装置,强迫所述材料进入所述孔口中。
21.如权利要求20的方法,其中所述凸起特征包括多个阶梯。
22.如权利要求20的方法,还包括移走所述模板,其中在所述孔口中形成的胚保留在所述衬底上。
23.如权利要求22的方法,其中所述胚包括阶梯状胚。
24.如权利要求20的方法,还包括:
在所述胚上放置集成电路管芯;以及
将所述集成电路管芯向所述衬底挤压,其中所述胚的材料向外流向所述集成电路管芯的周边。
25.如权利要求24的方法,其中所述集成电路管芯包括结合盘阵列,以及所述衬底包括对应的焊盘阵列,所述管芯上的所述结合盘中的每一个具有附着到其上的焊料元件,所述方法还包括加热所述衬底和管芯组件来回流所述焊料元件。
26.如权利要求25的方法,还包括固化所述材料。
27.如权利要求20的方法,其中所述材料包括环氧树脂材料。
28.如权利要求20的方法,其中所述材料包括焊料助焊剂。
29.如权利要求20的方法,其中所述材料包括填料。
30.如权利要求29的方法,其中所述填料包括硅石材料。
31.如权利要求20的方法,其中所述装置包括刮板装置。
32.如权利要求20的方法,还包括与其他衬底一起重复使用所述模板。
33.一种方法,包括:
在保持有多个衬底的载体上放置模板,所述模板包括延伸通过其中的对应数量的孔口以及多个凸起特征,每个凸起特征被设置在接近所述孔口中的一个并且从所述模板的上表面向上延伸,其中,每个孔口与所述衬底中的一个对齐;
在所述模板的上表面上施加一定量的材料;以及
采用一种装置,通过在所述孔口和所述凸起特征上移动所述装置,强迫所述材料进入所述孔口中。
34.如权利要求33的方法,其中所述凸起特征中的每一个包括多个阶梯。
35.如权利要求33的方法,还包括移走所述模板,其中在所述孔口的每一个中形成的胚保留在所述衬底中的每一个上。
36.如权利要求35的方法,其中每个胚包括阶梯状胚。
37.如权利要求33的方法,还包括:
在胚中的每一个上放置管芯;以及
将每个管芯向所述载体挤压,其中在每个管芯下面的所述胚的材料向外流向所述管芯的周边。
38.如权利要求37的方法,其中每个管芯包括结合盘阵列,以及每个衬底包括对应的焊盘阵列,所述管芯结合盘中的每一个具有附着到其上的焊料元件,所述方法还包括加热所述衬底和管芯组件来回流所述焊料元件。
39.如权利要求38的方法,还包括固化在每个衬底和管芯组件上的所述材料。
40.如权利要求33的方法,其中所述材料包括环氧树脂材料。
41.如权利要求33的方法,其中所述材料包括焊料助焊剂。
42.如权利要求33的方法,其中所述材料包括填料。
43.如权利要求42的方法,其中所述填料包括硅石材料。
44.如权利要求33的方法,其中所述装置包括刮板装置。
45.如权利要求33的方法,还包括将所述模板重复使用于其他衬底。
CNB2004800130616A 2003-05-14 2004-04-16 用于在衬底上堆积材料的模板和方法 Expired - Fee Related CN100414676C (zh)

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