CN1759487A - 具有较小覆盖区的led封装模具 - Google Patents

具有较小覆盖区的led封装模具 Download PDF

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CN1759487A
CN1759487A CNA2003801051227A CN200380105122A CN1759487A CN 1759487 A CN1759487 A CN 1759487A CN A2003801051227 A CNA2003801051227 A CN A2003801051227A CN 200380105122 A CN200380105122 A CN 200380105122A CN 1759487 A CN1759487 A CN 1759487A
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light emitting
emitting die
bar substrate
led
face
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班·P·罗
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Wolfspeed Inc
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Cree Inc
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Abstract

本发明揭示一种发光模具封装(10)和一种制造所述发光模具封装(10)的方法。所述模具封装(10)包括一具有凹槽(26)的杆基底(stem substrate)(20)、一附着到所述凹槽(26)的导线(30)和一安装在所述杆基底(50)上的发光二极管(LED)(50)。一套管(40)、一反射器(60)和一透镜(70)也耦合到所述基底(20)。为了制造所述发光模具封装(10)，形成一长基底，并将导线(30)附着到所述基底。接着，将包括所述附着导线的所述基底切割为预定长度以形成单个杆基底(20)。LED(50)、反射器(60)和透镜(70)耦合到每一个杆基底(20)。

Description

说明书 具有较小覆盖区的LED封装模具
优先权
本申请案根据35 USC第119节、第120节或两者主张2002年12月6日申请的题为“LED package with a long stem body as heat-spreader anda small footprint”的美国临时专利申请案第60/431,501号的权利。
技术领域
本发明涉及封装半导体装置领域，且尤其涉及封装发光二极管。
背景技术
诸如发光二极管的发光二极管(LED)通常封装于引线框封装内。引线框封装通常包括一密封LED的模制塑料体、一透镜部分和一连接到所述LED并延伸到所述塑料体外的薄金属导片。所述引线框封装的金属导片充当导管以为LED提供电源，且同时，其可用以将热量从所述LED中排出。当向LED施加功率以生成光时，所述LED产生热量。所述导片的一部分延伸到所述封装体外以连接到所述引线框封装外部的电路。
LED所产生的热量中的一些由塑料封装体耗散；然而，大部分热量被经由所述封装的金属组件而从LED排出。所述金属导片通常很薄且具有较小的横截面。因此，所述金属导片从LED移除热量的能力收到。此限制了可发送到LED的功率的量，进而限制了可由LED产生的光的量。
为增加LED封装散热的能力，在一个LED封装设计中，将所述LED置于一散热嵌片(heatsink slug)的腔内。接着，除其底表面外，所述散热嵌片被一塑料体所围绕。例如，Lumileds Lighting，LLC的一些LUXEONTM LED封装体现了此一设计。在此，所述散热嵌片增加了LED封装散热的能力；然而，所述LED在腔内的设计制造起来相对较困难且较昂贵。另外，因为其有限的暴露表面(仅为底表面)，所以其热量耗散受到限制。
在另一LED封装设计中，将所述引线框的导片延伸(以各种形状和配置)到所述LED封装体的紧接的边缘(immediate edge)外。这增加了暴露于周围空气的导片部分的表面积。所述延伸导片的增加的暴露表面积增加了LED封装散热的能力；然而，经延伸的导片增加了LED封装的大小，需要电路板上的相对更大的面积。在许多应用中，电路板面积是所稀有且昂贵的因素。
当前引线框封装设计的另一不需要的方面涉及与所述封装的热膨胀相关联的问题。当产生热量时，所述LED封装经历热膨胀。LED封装的每一部分具有不同的热膨胀系数(CTE)。例如，LED的CTE、所述封装体的CTE、所述导片的CTE和透镜的CTE都彼此不同。为此，当加热时，这些部分中的每一个部分经历不同的热膨胀，导致所述封装的部件之间的机械应力，因此不利地影响其可靠性。
因此，存在对一种克服或减少现有技术封装的一个或一个以上缺点的经改良的LED封装的需要。
发明内容
本发明满足此需要。在本发明的第一个实施例中，一发光模具封装包括一杆基底、一导线和一安装在所述杆基底上的发光二极管(LED)。所述杆基底具有一第一端面和一第二端面，并界定至少一个凹槽。所述导线沿着所述杆基底的凹槽，在所述第一端面终止。所安装的发光二极管(LED)安装于所述第一端面上。所述LED与所述杆基底电热接触。所述LED也连接到所述导线。
在本发明的第二个实施例中，一发光模具封装阵列包括一具有一外部散热片和反射碗(reflector bowl)的阵列外壳。所述列外壳界定模具封装间隙。将复数个发光模具封装安装于所述模具封装间隙中，具有一发光模具封装的每一发光模具包括一杆基底、一导线和一安装在所述杆基底上的发光二极管(LED)。所述杆基底具有一第一端面和一第二端面，并界定至少一个凹槽。所述导线沿所述杆基底的凹槽布设，在所述第一端面终止。所安装的发光二极管(LED)安装于所述第一端面上。所述LED与所述杆基底电热接触。所述LED也连接到所述导线。
在本发明的第三个实施例中，揭示了一种制造一发光模具封装的方法。首先，制作一具有一预定长度的杆基底棒，所述杆基底棒界定至少一个凹槽。将导线附着到所述杆基底棒的凹槽上。接着，将所述包括附着导线的杆基底棒切割成预定长度，借此形成一个别杆基底。将所述个别杆基底平面化以形成一第一端面。将一发光二极管(LED)安装在所述第一端面上，所述LED与所述杆基底电热接触，所述LED也连接到所述导线。
从以下详细描述并结合附图，通过对本发明的原理进行例示的方法说明，本发明的其它方面和优点将变得显而易见。
附图说明
图1为根据本发明的一个实施例的发光模具封装的透视图；
图2为图1发光模具封装的分解透视图；
图3为图1发光模具封装的顶视图。
图4为图1A的发光模具封装沿图3所说明的线A-A而切割的的侧视剖面图；和
图5A到5D分别说明图1发光模具的顶视图、侧视图、底视图和侧视剖面图。
具体实施方式
现在将参考说明本发明不同实施例的图1到图4描述本发明。如图中所说明，为了说明的目的相对于其它结构或部分而放大结构或部分的一些大小，因此提供其以说明本发明的总体结构。此外，参考在其它结构、部分或两者上形成的结构或部分描述本发明的各种方面。所属领域的技术人员明了参考在另一结构或部分“上”或“上方”形成的结构涵盖可插入的额外结构、部分或两者。参考在另一结构或部分“上”形成的不具有插入结构或部分的结构在本文中被描述为“直接”形成于所述结构或部分上。
此外，本文使用诸如“上”或“上方”的相对性术语来描述如在图中所说明的一个结构或部分与另一结构或部分的关系。应了解，除图中所描绘的定位外，诸如“上”或“上方”的相对性术语欲涵盖所述装置的不同定位。例如，若将图中的装置翻转，则被描述为在其它结构或部分“上方”的结构或部分现在将被定位在另一结构或部分“下方”。同样，若将图中的装置沿一轴旋转，则被描述为在其它结构或部分“上方”的结构或部分现在将被定位在其它结构或部分的“附近”或其“左方”。文中相同数字代表相同元件。
如为了说明的目的在图中所示，通过一包括一杆基底、导线和一发光二极管的发光模具封装来例示本发明的实施例。所述杆基底具有一第一端面和一第二端面，并界定至少一个凹槽。所述导线附着到所述杆基底的凹槽，终止在所述第一端面。所述发光二极管安装于所述第一端面上并与所述杆基底电热接触。所述LED也连接到所述导线。
所述杆基底形成所述模具封装体，并从所述LED抽取热量(与现有技术中所实施的仅导线从LED抽取热量相反)。因为所述杆基底比所述导线相对更厚，所以其散热能力比现有技术设计更大。所述杆基底沿其整个长度提供一相对巨大的热量及有效的散热能力。因此，可向所述LED输送更多功率，且所述LED可产生更多光。此外，为此，本发明的所述发光模具封装可无需一延伸远离所述封装的单独的散热嵌片或导线。因此，本发明的模具封装可更紧凑、更可靠且制造费用比现有技术的模具封装低。
此外，鉴于很多现有技术LED封装是平坦的，且其所有导片和散热片连接到所述顶面中或在相同平面中作为光学系统。这具有占据有用面积或成为驱动封装的印刷电路板上“不动产”的缺点。本发明的发光模具封装具有一具有相对较长的主体和一相对较小的覆盖区的台阶状。所述较小的覆盖区允许将更多的单元组装成集束(cluster)以为照明应用产生类似于诸如白炽电灯泡或卤素电灯泡的常规光源的高强度光源。
图1为根据本发明的一个实施例的发光模具封装10的透视图。图2为图1发光模具封装10的分解透视图。图3为部分所述发光模具封装10的顶视图。特定地说，图3说明通过透明透镜70所述发光模具封装的一顶视图。图4为图1的发光模具封装沿图3所说明的线A-A而切割的的侧视剖面图。参看图1到图4，所述发光模具封装10包括一杆基底20、导线30和发光二极管(LED)组合50。
所述杆基底20具有一第一端面22和一第二端面24，并由诸如(仅例如)铜、铝或陶瓷材料的导电导热的材料制成。在一些实施例中，可用稀有金属电镀所述第一端面22以确保或改良与所述LED组合50的接合，但此并非必要。所述杆基底20界定至少一个凹槽26。图中说明了四个凹槽26。可通过机械加工或挤压酮、铝或陶瓷形成所述杆基底。可用允许LED晶片附着和接合的金属电镀或抛光所述第一端面22。可电镀、抛光或另外配置所述第二端面24以连接到一外部散热片、外部电路或两者。
每一导线30都沿由所述杆基底20所界定的凹槽26中的一个。所述导线终止于所述第一端面22。事实上，如说说明的，由于在例示实施例中的凹槽26足够深，因此可将导线30安置于所述凹槽26内；然而，通过包裹每一导线的诸如聚酰亚胺的导线绝缘材料，导线30与所述杆基底20电隔离。将每一个所述导线30的导线绝缘的一部分剥开，暴露所述导线的一部分(暴露部分32)以电连接到外电路。可使用高温粘合剂将所述导线30接合到杆基底20。例如可通过电镀将所述导线的第一端面金属化以用于通过将其连接到所述LED的接合线接合。在一些实施例中，取决于所述凹槽26的大小和形状，导线30可要求辊轧成形。例如，所述导线30可为由塑料介电材料绝缘的磁线。
所述LED组合50包括至少一个发光二极管(LED)，并被安装在所述第一端面22上，所述LED与所述杆基底20电热接触。图中为了说明的目的，将LED组合显示为具有四个LED。使用一接合线52将每一个LED连接到导线30中的一个。图3中也说明了所述接合线52。或者，可使用焊料或球状栅格阵列连接将所述LED连接到所述导线。
继续参看图1到图4，所述发光模具封装20进一步包括一围绕所述邻近第一端面26的杆基底20的套管40。套管40在所述第一端面26处和其周围界定一开口42。所述套管包括一适合耦合透镜70的突出部分46，当将所述透镜70安装到突出部分46上时，所述套管将其与来自所述LED组合50的光对准。图4中也说明了所述突出部分46，例示如图3所说明的沿线A-A而切割的图1发光模具封装10的侧视剖面图。
透镜70适合诸如(仅例如)散射、聚焦和波长偏移的光学成像功能。所述透镜70通过(例如)反射、引导、聚焦和偏移波长而对由LED组合50所产生的光起作用。例如，可用碳酸钙涂布所述透镜70的底表面72以散射光。或者，可用磷涂布所述透镜70的底表面72以吸收具有一第一波长的光并重发射第二波长的光。事实上，可配置所述透镜70的底表面72以用于各种光学操作。例如，可将其开槽以反射或折射来自LED组合50的光。类似地，也可将圆顶表面用于对所述光起作用，从而产生所述模具封装10的预定辐射图案。所述透镜70可由高温塑料或玻璃制成。
当将透镜70置于所述开42之上的突出部分46上时，通过所述杆基底20的第一表面22、开口42和透镜70形成一封闭腔44。通过诸如硅酮的透明密封剂至少部分填充封闭腔44。无需用所述密封剂完全填充封闭腔44。事实上，在没有将所述透镜70与所述套管40分离的情况下，以密封剂部分填充腔44同时在所述腔44内留出间隙允许所述密封剂膨胀(当LED组合50产生热量时)。此外，将透镜70可稍微移动地耦合到套管40以允许所述密封剂比所述间隙所允许的膨胀膨胀得更大。在一个替代实施例中，以所述密封剂完全填充腔44使得在所述腔44内不存在间隙或气泡。在此情况下，随着由于所述LED组合50产生的热量而导致的密封剂膨胀，允许所述透镜稍微上下移动以减轻由膨胀所引起的压力。为预定的折射率和其它光学特性、物理特性或两者选择密封剂。
所述发光模具封装10包括一耦合到所述套管40的发射器60，所述反射器60围绕开口42，并通过具有一成角度的反射表面以使所述反射器60将来自LED组合50的光反射向透镜70而适合反射来自所述LED组合50的LED的光。操作套管40以相对于杆基底20对准反射器60和透镜70。反射器60可由任何反射材料或非反射但具有诸如镀银的高反射抛光面(finish)的材料制成。所述反射器60与杆基底20电分离。将所述反射碗安装于邻近所述LED组合50处以引导所有由LED向所述透镜发射的光。
图4中说明了样品发光模具封装10的测量。在所说明的实施例中，发光模具封装10具有一以毫米(mm)或数十毫米(mm)数量级计的高度28，例如13.25mm，和(例如)以毫米(mm)数量级计的宽度或直径29，例如5.6mm。
可将发光模具封装10组合以形成图5A到图5D所说明的发光模具阵列80，其中图5A到图5D分别说明所述发光模具阵列80的顶视图、侧视图、底视图和侧视剖面图。
参看图5A到图5D，所述发光模具阵列80包括一个包括一外部散热片82和反射碗84的阵列外壳，所述阵列外壳界定多个模具封装间隙或“孔”以接收发光模具封装10。图中，四个发光模具封装10填充这些接收孔。如图1-4所示配置这些发光模具封装10的每一个。
可将图1-4用于描述制造所述发光模具封装10的方法。又参看图1-4，为了制造图1-4的发光模具封装10，制作一段相对较长的杆基底棒(未说明)，所述杆基底棒界定至少一个凹槽。导线相对附着到所述杆基底棒的凹槽。接着，将包括诸如磁线的附着导线的杆基底棒切割成预定长度，借此形成一包括如图1-4中所说明的附着导线30的个别杆基底20，所述导线已附着到杆基底20。将包括所述附着导线30的个别杆基底平面化以形成第一端面22。
接着，将包括诸如一发光二极管的至少一个发光装置(LED)的LED组合50安装于所述第一端面22上，所述LED组合50与所述杆基底20电热接触，所述LED也经由接合线接合52连接到所述导线。如上所述，可用一密封剂密封所述LED。将所述套管40附着到邻近于所述第一端面22的所述杆基底20。所述套管在第一端面22处和其周围界定开口42。接着将反射器60耦合到套管40，所述反射器围绕开口42。最后，将透镜70耦合到所述套管40的开口42。可改变这些制造步骤的确切次序，且其仍在本发明的范围内。
从前述可见，本发明是新颖的并提供超出现有技术的优点。尽管以上描述并说明了本发明的特定实施例，但本发明并不限于所描述和说明的部件的特定形式或布置。例如，可将不同的配置、大小或材料用于实践本发明。本发明由上述权利要求书限制。

Claims (26)

1.一种发光模具封装(10)，其包含：
一具有一第一端面(22)和一第二端面(24)的杆基底(20)，所述杆基底(20)界定至少一个凹槽(26)；
一沿所述杆基底(20)的所述凹槽(26)布设(run)的导线(30)，所述导线(20)终止在所述第一端面(22)；和
一安装于所述第一端面(22)上的发光二极管(LED)(50)，所述LED(50)与所述杆基底(20)电热接触，所述LED(50)也连接到所述导线(30)。
2.根据权利要求1所述的发光模具封装(10)，其中所述杆基底(20)包含导电导热材料。
3.根据权利要求1所述的发光模具封装(10)，其中所述导线(30)安置在所述凹槽(26)内，但通过导线绝缘而与杆基底(20)电绝缘。
4.根据权利要求3所述的发光模具封装(10)，其中所述导线绝缘的一部分被剥开以暴露所述引线(30)的一部分(32)。
5.根据权利要求1所述的发光模具封装(10)，其进一步包含一围绕邻近于所述第一端面(22)的所述杆基底(20)的套管(40)，所述套管(40)在所述第一端面(22)处界定一开口(42)。
6.根据权利要求5所述的发光模具封装(10)，其中所述套管(40)界定一适合耦合一透镜(70)的突出部分(46)，当所述透镜(70)被安装于所述突出部分(46)上时，所述套管将所述透镜与来自所述LED组合(50)的光对准。
7.根据权利要求5所述的发光模具封装(10)，其进一步包含一耦合到所述套管(40)的透镜(70)，所述透镜(70)适用于光学成像功能。
8.根据权利要求7所述的发光模具封装(10)，其中所述透镜(70)包括一以用于对所述LED(50)所产生的光起作用的物质涂布的底表面(72)。
9.根据权利要求7所述的发光模具封装(10)，其中所述透镜(70)封闭所述开口(42)，借此形成一腔(44)，所述腔(44)由密封材料至少部分填充。
10.根据权利要求5所述的发光模具封装(10)，其中所述开口(42)填充有密封剂且被一以可移动方式耦合到所述密封剂上的所述套管(40)的透镜(70)所覆盖(capped)。
11.根据权利要求5所述的发光模具封装(10)，其中所述导线(30)安置在所述凹槽(26)内，但通过导线绝缘而与所述杆基底(20)电绝缘。
12.根据权利要求11所述的发光模具封装(10)，其中所述导线绝缘的一部分被剥开以暴露所述引线(30)的一部分(32)。
13.根据权利要求5所述的发光模具封装(10)，其进一步包含一耦合到所述套管(40)的反射器(60)，所述反射器(60)围绕所述开口(42)并适合反射来自所述LED(50)的光。
14.根据权利要求5所述的发光模具封装(10)，其中所述套管(40)包括一集成反射器表面。
15.根据权利要求1所述的发光模具封装(10)，其中使用一选自由接合线、焊料和球状栅格阵列连接组成的群组的连接将所述LED(50)连接到所述导线(30)。
16.一种发光模具封装阵列(80)，其包含：
一包括一外部散热片(82)和反射碗(84)(reflector bowl)的阵列外壳，所述阵列外壳界定多个模具封装间隙；
安装于所述模具封装间隙中的复数个发光模具封装(10)，每一发光模具(10)包含：
一具有一第一端面(22)和一第二端面(24)的杆基底(20)，所述杆基底(20)界定至少一个凹槽(26)；
一安装于所述杆基底(20)的所述凹槽(26)上的导线(30)，所述导线(30)终止在所述第一端面(22)；和
一安装于所述第一端面上与所述杆基底(20)电热接触的发光二极管(LED)(50)，所述LED(50)也连接到所述导线(30)。
17.根据权利要求16所述的发光模具封装阵列(80)，其中所述外部散热片(82)热连接到所述已安装的发光模具封装(10)。
18.根据权利要求16所述的发光模具封装阵列(80)，其中对于每一个发光模具封装(10)而言，所述导线(30)安置在所述凹槽(26)内，但通过导线绝缘与所述杆基底(20)电绝缘。
19.根据权利要求16所述的发光模具封装阵列(80)，其中每一个发光模具封装(10)进一步包含一围绕邻近于所述第一端面(22)的所述杆基底(20)的套管(40)，所述套管(40)在所述第一端面(22)处界定一开口(42)。
20.根据权利要求19所述的发光模具封装阵列(80)，其中每一个发光模具封装(10)进一步包含一耦合到所述套管(40)的反射器(60)，所述反射器(40)围绕所述第一端面(22)。
21.根据权利要求16所述的发光模具封装阵列(80)，其中每一个发光模具封装(10)进一步包含一耦合到所述套管(40)的透镜(70)，所述透镜(70)覆盖所述开口(42)。
22.一种制造一发光模具封装(10)的方法，所述方法包含：
制作一具有一预定长度的杆基底棒，所述杆基底棒界定至少一个凹槽(26)；
将导线(30)附着到所述杆基底棒的所述凹槽(26)上；
将包括所述附着导线的所述杆基底棒切割成一预定长度，借此形成一单个杆基底(20)；
将所述单个杆基底(20)的一第一端面(22)平面化；和
将一发光二极管(LED)(50)安装在所述第一端面(22)上，所述LED(50)与所述杆基底(20)电热接触，所述LED(50)也连接到所述导线(30)。
23.根据权利要求22所述的方法，其进一步包含密封所述LED(50)。
24.根据权利要求22所述的方法，其进一步包含附着一套管(40)围绕邻近所述第一端面(22)的所述杆基底(20)，所述套管(40)在所述第一端面(22)处界定一开口(42)。
25.根据权利要求24所述的方法，其进一步包含将一反射器(60)耦合到所述套管(40)上，所述反射器(60)围绕所述开口(42)。
26.根据权利要求24所述的方法，其进一步包含将一透镜(70)耦合到所述套管(40)，所述透镜(70)覆盖所述开口(42)。
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