CN1745453B - Method and apparatus for plasma treatment of surface in vacuum - Google Patents
Method and apparatus for plasma treatment of surface in vacuum Download PDFInfo
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- CN1745453B CN1745453B CN2003801093200A CN200380109320A CN1745453B CN 1745453 B CN1745453 B CN 1745453B CN 2003801093200 A CN2003801093200 A CN 2003801093200A CN 200380109320 A CN200380109320 A CN 200380109320A CN 1745453 B CN1745453 B CN 1745453B
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- 238000009832 plasma treatment Methods 0.000 title description 4
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- 238000009826 distribution Methods 0.000 claims abstract description 69
- 230000008569 process Effects 0.000 claims abstract description 24
- 238000009489 vacuum treatment Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 31
- 238000012545 processing Methods 0.000 claims description 23
- 230000008859 change Effects 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 15
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
Abstract
In order to produce substrate surfaces with a given two-dimensional surface distribution arising from a treatment using a vacuum treatment process, an inhomogeneous plasma (5) with a density distribution is generated and moved relative to the substrate (9) with a given movement.
Description
Technical field
The demand that the present invention has produced so that substrate is carried out the magnetron sputtering plated film is a starting point.But draw, usually the substrate surface that is used for according to the solution that the present invention obtained handling by the vacuum treatment process.
Background technology
In the application's scope, be interpreted as process the vacuum treatment process and to the respective action of substrate,
A) wherein material is removed from substrate surface with the support of plasma, for example in reaction or during non-reaction and plasma etching,
B) material of change substrate surface for example when the processing again of reacting, plasma is supported, for example reoxidizes the substrate surface material,
C) coating material on substrate surface, this is reaction or non-reactive or by means of plasma CVD.If here material is handled the atmosphere from solid-state being discharged into, and directly or with gas reaction after be applied to substrate surface, be interpreted as the process that will investigate when so only handle is from the solid-state release above-mentioned material of the solid-state material source that only has unique material.
If two or more sources have solid-state different materials, handle atmosphere to be used for being discharged into, regard each dispose procedure and each corresponding coating process each material or that utilize each material as a vacuum treatment process itself so.In this case, carry out two or more processing procedures simultaneously.
If this distribution of observation in the section vertical with substrate surface always on the substrate surface of magnetron sputtering plated film, has nowadays obtained good coating film thickness and has distributed so.If but relatively in above-mentioned tomography, obtain self from well distributing (promptly from the tomography to the tomography) to extraordinary coating film thickness, the lip-deep coating film thickness distribution of bidimensional ground observation so now will draw a kind of unfavorable distribution.If for example on the disc substrate of sputter coating along substrate outboard recording coating film thickness, draw so the complete undesirable distribution of many application purposes.
Summary of the invention
In principle, task of the present invention is, advises a kind of method that is used to make the substrate with the surface of handling by the vacuum treatment process, and wherein said surface has the predetermined two-dimensional surface of result and distributes.The solution that draws according to the present invention is:
-realize having the plasma discharge that local nonhomogeneous density distributes;
-make substrate be subjected to the plasma discharge that nonhomogeneous density distributes effect and
-by realize the distribution of result to get off
Predetermined the relatively moving of uneven density distribution of-realization and substrate;
-realization provides the scheduled time of other signals of telecommunication that make substrate bias electrical power and/or that set up in case of necessity of discharge to change;
Above-mentioned variation of-adjusting and above-mentioned moving.Particularly, according to the method that is used to make substrate of the present invention with the surface of handling by the vacuum treatment process, wherein the support by means of plasma comes the coated substrates surface with single material from the solid-state processing atmosphere that is discharged into from single source, or remove material from substrate surface by means of the support of plasma, or by means of the material on the support change substrate surface of plasma, wherein said surface has the predetermined surface distributed of result, wherein, realize plasma discharge with the uneven density distribution in part; Make described substrate be subjected to the effect of the plasma discharge of nonhomogeneous density distribution; And move with respect to the predetermined periodicity that substrate produces uneven density distribution, this substrate is arranged in evacuated receiver and static with respect to this evacuated receiver; The time that produces predetermined period in the electrical power of discharge is provided and/or in the signal of telecommunication of setting up that makes substrate bias changes; And described time changes moves synchronously with predetermined periodicity and by described move and the time changes and realizes the surface distributed of being scheduled to is set.
For example the predetermined uniform outer surface that obtains result is distributed, not to expect as people, be devoted to as far as possible the plasma discharge of density distribution uniformly, but be devoted to local inhomogeneous, promptly obviously have a plasma discharge of the scope of the plasma density of comparing increase with other scopes.By regulating relatively moving and variable power of nonhomogeneous density distribution targetedly, with surface distributed in substrate surface adjusted result.
Therefore, above-mentioned move and the above-mentioned time changes the variable that these two amounts are used as the independent quantities that needs adjusting or relevant with it function " result-distribution ".
Known as follows from the applicant's identical EP 1245970 with the present invention:
From magnetic controlled tube sputtering apparatus, discharge various materials and regulate the flow of vital energy everywhere in the atmosphere.The target part that various materials are formed forms a source respectively, is released in this place, source respective material and handles in the atmosphere.Here, drive the single solid source that forms by target part from public magnetron device.In order to have the corresponding sputter proportionate relationship of adjustment on two sources of different materials respectively, with adjust by means of single magnetron device, on the one hand by predetermined target part, thereby also come the magnetic control field of mobile magnetron device with respect to substrate, and at the target part material, along with magnetic field moves through two sources, also change sputtering power in time.Therefore, can consider the different sputter features in two sources extremely simply from the magnetron device structure.
In preferred embodiments, finish the plasma discharge that at least one has the peaked scope of outstanding density.
In the first embodiment, by relatively moving of realizing with respect to the evacuated receiver mobile substrate of wherein finishing discharge being scheduled to.Here, the plasma discharge that will have the nonhomogeneous density distribution of its density maximum or density minimum position remains in the receiver still, perhaps it is moved in this receiver.
But, in preferred embodiments, preferably keeping under the static situation of substrate in addition, by move relatively moving that uneven density distribution realizes being scheduled to respect to evacuated receiver predeterminedly.
In another preferred embodiment of manufacture method of the present invention, produce described uneven density distribution at least together by means of magnetic field.
Therefore, now according to especially preferred embodiment, creating a kind of simple possibility, also is uneven Distribution of Magnetic Field by moving in the receiver of finishing discharge therein promptly, realizes relatively moving of uneven plasma density distribution.
Produce plasma discharge by means of the AC of DC, AC, DC and stack or by means of Hf.Also may make substrate bias similarly, so preferably in addition in order to make the change in electric that drives plasma discharge, predetermined ground changes this offset signal in time by means of the AC or the Hf of DC, AC, DC and stack.Change if in this relation, mention the time of AC signal, related to so it the angle or the variation of amplitude, also be its modulation.
In the especially preferred embodiment of the inventive method, make the vacuum treatment process become the magnetron sputtering process, and at least also by relatively moving of realizing with respect to field, target sputter face mobile predeterminedly magnetron tunnel being scheduled to.
Know, when carrying out magnetron sputtering, above the target sputter face, produce magnetic field, described magnetic field is made of magnetic line of force distribution map one or more tunnel-shaped, that have the magnetic line of force, the magnetic line of force that sends from sputter face moves during being arranged essentially parallel to the cross section of target surface, so that enter sputter face subsequently once more.If in being parallel to the magnetic line of force scope of sputter face, converge, produce the tubulose scope of the plasma density that increases so by known effect, electron trap effect.In the scope of the plasma density of described increase, the corrosion to sputter face in this scope strengthens, and this causes the known erosion grooves relevant with magnetron sputtering.Here in order to use target especially better, known especially by under target, setting up mobile magnetic device, when sputter face is carried out sputter coating, to move magnetic line of force distribution map.
Therefrom as can be seen, be particularly useful for carrying out magnetron sputtering, because the there has had instrument, to move uneven plasma density distribution with respect to substrate according to this method.
Therefore, in principle preferably by outside the evacuated receiver or within mechanically the shifting magnetic field generation device realize with respect to relatively moving that the local nonhomogeneous density of the plasma of substrate distributes.
For example by electromagnetism, realize this device such as coil devices such as Helmholtz coil, deflecting coils, have under target in the magnetron of magnetic device, this magnetic device and target are rotated or move on given x and y direction linearly and with mutual dependence.Yet replacing machinery to move also can become the ground hard-wired coil device of control and come electrically shifting magnetic field by controlled, time.The machinery of magnetic field producer can be moved and to here also can be additionally by machinery move that coil carried out was electric, the time control that becomes combine fully.
Now, from realizing that mobile substrate is liked very much.
In another preferred embodiment of the inventive method, finish predetermined relatively moving and the preset time variation respectively periodically, and by realizing their contact synchronously.Here note, do not need similarly to form the periodicity of finishing respectively usually.Above-mentioned time changes and the above-mentioned cycle that relatively moves is can be diverse, and one-period may be another integral multiple, and perhaps there is a kind of non-integral multiple relation each other in the cycle.
In another preferred embodiment of the inventive method,, solid is discharged in the processing atmosphere by means of discharge.Then reacting gas is injected described atmosphere.The distribution of the chemical combination component ratio between described lip-deep solid and reacting gas constituent is adjusted to result.
If for example metal is released to the processing atmosphere with reacting gas as solid, on the meaning of the result that will obtain, adjusts the stoichiometry that is deposited on lip-deep chemical combination composition material so and distribute.
In the especially preferred embodiment of the inventive method, result is the plated film on described surface.But result described here also can be the etching of treatment surface, plated film or etching both, reaction or non-reactive.
In another preferred embodiment of the inventive method, before processing finishes, measure and handle intermediate object program, compare with specified processing intermediate object program, and adjust described predetermined relatively moving and/or the time variation once more by the function of comparative result.
Here, especially preferredly under the condition of not cutting off vacuum, carry out described measurement.Substrate is sent to another vacuum from a kind of vacuum probably, for example from handling atmosphere to measuring the atmosphere, perhaps as especially preferred, when carrying out the substrate processing in position, in processing procedure atmosphere, carry out above-mentioned measurement.So, in addition preferably with measurement result as measuring the controlled quentity controlled variable input control circuit, described control circuit provides described predetermined relatively move and/or the time changes regulated quantity as result control.
The method of suggestion is particularly useful for being manufactured on surface acoustic wave (SAW) or " bulk acoustic wave (Bulkacoustic waves) " (BAW) goes up the assembly of work in the basis.
Description of drawings
Next, for example present invention is described by means of accompanying drawing.
Fig. 1 illustrates intuitively and is used to carry out the employed process chamber of the present invention of manufacture method of the present invention, also is used for the present invention is carried out principles illustrated;
Fig. 2 also illustrates the vertical view of the substrate that moves according to the present invention intuitively in the plasma that nonhomogeneous density distributes;
Fig. 3 illustrates for example mobile change curve between the nonhomogeneous density of substrate and plasma distributes, and the time changing curve of for example supplying with the electrical power of plasma;
Fig. 4 illustrates the sectional side elevation of process chamber of the present invention simply, wherein realizes the inventive method by means of magnetron sputter source;
Fig. 5 is illustrated in the in site measurement of the result that produces when substrate is handled and the method that the inventive method usefulness is adjusted intuitively;
Fig. 6 illustrates the vertical view of the magnetron magnetic device situation of the test that for example is used to illustrate subsequently on the equipment according to Fig. 4;
The result that Fig. 7 to 13 is illustrated in the coating film thickness distribution form that obtains when the adjustment amount that the present invention is used carries out different the adjustment distributes;
Figure 14 illustrates the plated film inclination schematic diagram that obtains according to the present invention.
Embodiment
According to Fig. 1, should introduce the basic principle of manufacture method of the present invention and process chamber of the present invention.In evacuated receiver 1, set the plasma discharge section 5 for example utilize electrode 5a and electrode 5b intuitively to illustrate, wherein for example utilize selector switch 3a to illustrate intuitively, with described evacuated receiver ground connection or may meet other reference potentials φ electrically
1Drive plasma discharge section 5 by means of generator 7, described generator can relate to DC, AC, DC+AC or HF generator.Certainly, also form electrode 5a, 5b according to predetermined plasma discharge type, as what the professional was familiar with.
For example graphic extension selector switch 3b once more according to application target, can or place other reference potentials φ with generator 7 electrical activity ground ground potentials
2On, described reference potential can certainly select to equal φ
1
So structure plasma discharge section 5 makes it produce the plasma that nonhomogeneous density distributes.Bidimensional inhomogeneous plasmas density distribution in Fig. 1 by the ρ that for example has density maximum M
PLIllustrate.Can move mobile plasma density distribution ρ with predetermined with respect to substrate 9
PLAs being entirely known other the measure of professional, the part increases plasma density (for example plasma ray of Yi Donging) thereby also finishes and mobile inhomogeneous plasmas density distribution, following possibility shown in Figure 1, promptly this realizes by means of magnetic field.To this, in plasma, for example produce magnetic field H by moving coil device part, control ground.By such as utilize the motor driven 13 shown in Fig. 1 mechanically moving coil device L the Distribution of Magnetic Field in discharge section 5 is moved.At the control input 13S that drives 13
X, 13
SYPlace's (respectively in the x and y direction) has stipulated by moving that the driving 13 of coil device L is responsible for.Within the scope of the present invention, importantly,, make the nonhomogeneous density distribution ρ of predetermined mobile decision plasma with respect to substrate carrier or substrate 9
PL, according to Fig. 1, this corresponding predetermined moving by the Distribution of Magnetic Field in the plasma section 5 realizes.
Replace or be additional to the electric feed signal E5 of modulating plasma discharge section 5, can place once more on DC, AC, AC+DC or the Hf in principle by means of signal generator 15 with substrate carrier or substrate 9 biasings.This for example utilizes shown in another selector switch 3c with reference to ground potential or with reference to another reference potential φ
3
If set this biasing of substrate carrier 9, generator 15 preferably also has modulation input 15 so
MOD, in described modulation input, modulation at present or change offset signal, described as being used to drive plasma discharge section 5 with regard to signal E5.
E
5The electric feed signal (electric current and/or voltage) of expression plasma discharge;
B (x (t), y (t)) expression is with respect to the distribution ρ of substrate
PLX/y move, also be abbreviated as B;
E
9Expression substrate bias signal.
If E
5, B or E
9, B is a periodic signal, so 7
MOD, 13
SPerhaps 5
MOD, 13
SThe place adjusts, and comprises respective magnitudes, time signal change curve (pulse, sawtooth, triangle, sine etc.), also adjusts signal period or signal frequency in addition.
As according to shown in Figure 1, by passing or mobile plasma distribution ρ with respect to receiver 1
PLCan realize inhomogeneous plasmas distribution ρ based on substrate surface to be processed
PLRelatively move.Certainly, perhaps possibility adds, also with respect to receiver 1 mobile substrate carrier or substrate 9 fully.Importantly, through the observation in processing time, and according to utilizing the above-mentioned adjustable template that moves, with inhomogeneous plasmas density distribution ρ
PLSequentially smear substrate surface.As described in,, change simultaneously at the discharge voltage at substrate place or discharging current and/or bias voltage (if setting) through after a while.
Just move inhomogeneous plasmas density distribution ρ with respect to substrate
PL, must indicate, this move be bidimensional (x, y).
In addition, Fig. 2 illustrates the vertical view of the disc substrate 19 on the substrate carrier 21 extremely intuitively.Do not illustrate in the figure according to Fig. 11 shown in process chamber.The plasma discharge section place of here also not indicating finishes the inhomogeneous plasmas density distribution ρ of the bidimensional basically that has as shown in Figure 2 statically in evacuated receiver
PLPlasma discharge PL.By means of driving 13
xWith 13
y, together with substrate carrier 21, with respect to density distribution ρ chamber static state, uneven
PLMobile substrate 19.Utilize control signal 13
SxThe x direction of control substrate carrier moves, and utilizes control signal 13
SyControl y direction moves.
Fig. 3 for example illustrate elapsed time t move B (x, y) and E
5Perhaps E
9Change curve.Mobile B shown in Figure 3
xAnd B
yHave identical period T, and signal E
5Perhaps E
9Have period T '-=
1/
2T.In periodic signal, adjust mutual phase place, for example the x direction moves and the phase delta ψ of y direction between moving
XyAnd at E
5B for example
xBetween phase delta ψ
EBHere, can differ integer or non-integer rational divisor between the cycle of two or three signals.If they are cycles, so preferably adjust phase shift Δ ψ
Xy, Δ ψ
EB, and on the phase locking meaning, make signal Synchronization.In addition, preferably to B
x, minimum and maximum value B
Maxx, B
MinxPerhaps shift motion B
HxCarry out with as shown in Figure 3 to y-mobile component and E
5Perhaps E
9Identical adjustment.In addition, preferably adjust the time changing curve of each signal, locate B at (a) as shown in Figure 3
xChange curve.
By the especially above-mentioned amount of corresponding selection and make it tuning mutually, adjust according to the present invention's surface distributed to processing result on the substrate surface of plasma treatment.
Utilization is as according to the execution mode shown in Fig. 1 and 2, and non-reaction or reaction caustic solution can be adjusted into processing result with the corrosion profile of substrate surface.In plasma enhanced chemical vapor deposition (PECVD) method, the execution mode shown in can utilizing is adjusted the surface topography of the plated film that applies on the substrate surface of observing.If at reaction method or in the PECVD method, adjust the reacting gas dividing potential drop of substrate surface top, so shown in mode can be in the surface distributed that draws that designs coated plated film aspect thickness or the stoichiometric relationship targetedly.
As described in, utilize knowledge of the present invention, move uneven plasma density distribution ρ with respect to substrate surface to be processed
PL
By above the target sputtering surface, producing the zone of higher ion volume density there along the magnetic field loop of tunnel-shaped, thereby when magnetron sputtering, use described uneven plasma density distribution.As previously mentioned, when magnetron sputtering,, thereby for example come territory, place, mobile tunnel and move uneven plasma density distribution usually by under target, setting the magnetic device that moves especially for the reason that improves the target material utilance.Therefore, there is magnetron sputtering fully ideally, so that may be utilized according to mode of the present invention.At this, can utilize the AC+DC of DC, AC, stack or utilize Hf to drive magnetron discharge.In addition, also relate to reactive magnetron sputter or non-reactive magnetron sputter.
As previously mentioned, also made the present invention at following demand, being described demand produces from the magnetron sputtering coating technology, and as described in according to Fig. 1-3, and described demand expands to the effect of adjusting plasma treatment along substrate surface fully in principle and distributes or distribution of results.
Form with the magnetron sputtering coating chamber in Fig. 4 shows vacuum processing chamber of the present invention, wherein carries out manufacture method of the present invention.Vacuum chamber 30 can be pumped into vacuum by pump unit 32.The target of being made up of the material of need sputter 33 is installed on target backboard 44.In the back of target backboard 44, outside vacuum chamber 30, also has magnetic system 35.It for example comprises the magnetic carrier disk 36 around central shaft A rotation, this disk have with respect to axle A be dissymmetrical structure, be reniform (consulting Fig. 6), permanent magnet 40 devices in for example vertical view.Perhaps the magnet 40 of this magnetic device can be driven, and as shown in the R, except around axle A rotatablely moves ω, also can radial drive moving.By means of magnetic device 40, shown in the H place was simple, described non-uniform magnetic field moved with respect to the substrate on the substrate carrier 43 45.Sample by having control input 37 by means of sniffer 37
sMotor produce, the rotatablely moving of magnetic device 35.The sampling pulse I of probe unit 37 in the unit 41 places adjustably by the time-delay τ; The delay pulse I (τ) of outlet side triggers or sinusoidal signal E for example synchronously
5Therefore, look back Fig. 3, utilize τ regulation Δ ψ
EBAnother control input 38 at generator 38 places
sThe place adjusts E
5The skew of sinusoidal signal part.
Shown in 42, the gas tunnel of working gas, preferred argon gas leads to process chamber 30, wherein may be by identical gas supply, but especially by means of the air jet system of 50 places shown in intuitively, reacting gas is input to process chamber, with the magnetron sputtering plated film that is used to react.
If form the dividing potential drop of the approximate at least same distribution of reacting gas in the surface of substrate 45, so by adjust along substrate surface magnetron plasma that nonhomogeneous density distributes move and by controlling plasma discharge power E in time
5, can adjust the distribution of plated film component, perhaps coating film thickness distributes.
According to Fig. 5, when by means of measurement mechanism 51, for example measure, when realizing the inventive method in to the profile measurement on surface etc. in position, utilize chaining pin static or that move to obtain the distribution of the result on substrate 54 surfaces by means of the optical reflection method by means of ellipsometer, electrical resistance.At difference unit 56 places, measurement result x and the distribution of results W that is scheduled to are compared.Here, by measuring definite distribution of results and a specified distribution compares, this specified distribution is for the processing time of process has the decision meaning of bidimensional with temporarily.Deviation between actual (x) and specified (W) distributed as calculated unit R as adjustment signal 58
8Feed generator unit 58 being used for plasma discharge, and/or the control unit 60 of feeding is to be used for moving inhomogeneous plasmas density distribution ρ with respect to substrate surface
PLThis in-situ control of the relevant treatment effect that replacement is producing, fully may be after processing time interval predetermined or that can be scheduled to, under the situation that keeps vacuum condition, the substrate in the process chamber is transported in the measuring chamber, result or its distribution that acquisition just obtains so far as intermediate object program there, substrate is sent back to process chamber, and utilize there with regard to inhomogeneous plasmas density distribution and plasma discharge power E
5The amount of mobile and corresponding coupling proceed this process.
Next introduce, how by means of as Fig. 5 principle the equipment utilization magnetron sputtering plated film that illustrates resulting result when carrying out manufacture method according to the present invention.
Test structure:
● process chamber: CLC 200 BB281100 x
● vacuum pump: Cryo CTI Cryogenics PJ9744445
● magnetron magnetic system: MB 300DK ALN02
● DC power supply: Pinnnacle (the Advanced Energy of company)
Replenish with ad cup 10kW M/N 3152436-100A
● coating film thickness LD device: spectroscopic ellipsometers WVASE M-2000F, 3.333 versions
● substrate: 6 " silicon wafers
● the magnetron sputtering plated film that utilizes ALN in comprising the atmosphere of nitrogen, to begin from the aluminium target
● the mean value of discharge power:
● power modulation form: sine
● power modulation frequency: 5.95Hz
● utilize E according to Fig. 4
5Power modulation carry out the rotatablely move adjustable phase locking of ω of magnetic device
● E
5Adjustable modulation deviation
Fig. 6 shows the vertical view of the magnetic system that drives with constant rotary speed ω of magnetron device.
As the reference example of discharge power E5 not being modulated, Fig. 7 shows 6, and " surface distributed of result on the substrate promptly has the reactive magnetron sputter coating of ALN layer.
Nowadays at locking phase Δ ψ
EBModulated plasma power E5 with 5.6% modulation deviation at=0 o'clock.
Fig. 8 illustrates the result.
In addition, be 5.6% at the modulation deviation of discharge power E5, locking phase Δ ψ
EBThe coating film thickness that draws when being 90 ° according to Fig. 9 distributes.
In addition, keeping 5.6% modulation deviation and continuing rotatable phase to Δ ψ
EBIn the time of=180 °, drawn distribution according to Figure 10.Continuing to increase phase difference ψ
EBDuring to 270 °, distribute as shown in figure 11.In addition, utilize identical modulation deviation the most at last phase optimization at Δ ψ
EB=195 °.This draws distribution as shown in figure 12.
In order to obtain distribution, nowadays in the phase place that remains unchanged according to Figure 12 according to Figure 13
Δ ψ
EBIn the time of=195 °, modulation deviation is brought up to 8.7% from 5.6%.
From phase optimization at first, the modulation deviation optimized order as can be seen then, adjust the plasma of nonhomogeneous density distribution and the motion between the substrate as the present invention by one side, change by adjusting feed time of signal of plasma discharge on the other hand, the plane effect that can obtain to expect distributes (being that coating film thickness distributes here), thus for example according to the azimuth of the described expectation of Figure 13 with radially consistent as far as possible, be identical shaped plated film density distribution.
Figure 14 shows main application of the present invention so far intuitively from another angle.As described in, one of distribution that obtain according to the present invention, result is that coating film thickness distributes.According to Figure 14, on the surperficial T of planar substrates,, apply plated film by surperficial S and thickness distribution d along this surface T according to the inventive method.If coordinate system x
T/ y
TAnd z
TBe arranged in the plane surface T of substrate, so at x
o/ y
oPosition, z axle have at the plane of above-mentioned position vertical line N
TDirection.At coated surface S place, now according to the present invention at same position x
o/ y
oThe place makes plane vertical line N
sSpatially with respect to plane vertical line N
TDirection tilt position x among the corresponding surperficial S
o/ y
oThe coordinate system at place.With respect to the substrate surface T on plane basically or be known as plated film with respect to this inclination of the coated surface S of nonplanar surperficial T more at large.The basic applicable cases of the present invention is to tilt according to predetermined relationship design plated film on the space, and may be different along substrate surface T part.The plated film that obtains according to the present invention tilts, and may be zero here at least in the scope of surperficial T, so direction N
SWith direction N
TConsistent.
Claims (12)
1. be used to make the method for substrate with the surface of handling by the vacuum treatment process, wherein the support by means of plasma comes the coated substrates surface with single material from the solid-state processing atmosphere that is discharged into from single source, or remove material from substrate surface by means of the support of plasma, or by means of the material on the support change substrate surface of plasma, wherein said surface has the predetermined surface distributed of result, wherein
Realize plasma discharge with the uneven density distribution in part;
Make described substrate be subjected to the effect of the plasma discharge of nonhomogeneous density distribution; And
The predetermined periodicity that produces uneven density distribution with respect to substrate moves, and this substrate is arranged in evacuated receiver and static with respect to this evacuated receiver;
The time that produces predetermined period in the electrical power of discharge is provided and/or in the signal of telecommunication of setting up that makes substrate bias changes; And
Described time changes moves synchronously with predetermined periodicity and by described move and the time changes and realizes the surface distributed of being scheduled to is set.
2. in accordance with the method for claim 1, it is characterized in that, finish and have the plasma discharge that at least one has the peaked scope of density.
3. according to claim 1 or 2 described methods, it is characterized in that, produce described uneven density distribution together by means of magnetic field.
4. in accordance with the method for claim 3, it is characterized in that, finish therein in the evacuated receiver of discharge that the shifting magnetic field distributes on the position.
5. in accordance with the method for claim 1, it is characterized in that, produce described plasma discharge and/or biasing by means of exchanging of direct current, interchange or direct current and stack.
6. in accordance with the method for claim 1, it is characterized in that described vacuum treatment process is the magnetron sputtering process, and described predetermined periodicity moves and comprises predetermined move of magnetron tunnel magnetic field with respect to the target sputtering surface.
7. in accordance with the method for claim 1, it is characterized in that, by means of described discharge, material is handled the atmosphere from solid-state being discharged into, reacting gas is injected described atmosphere, and the distribution of the chemical combination component ratio between the reactive gas species on solid-state material and the substrate surface is set to result.
8. in accordance with the method for claim 1, it is characterized in that, before processing finishes, measure and handle intermediate object program, and compare, adjust once more according to comparative result thus that described predetermined periodicity moves and/or the time changes with specified processing intermediate object program.
9. in accordance with the method for claim 8, it is characterized in that, under the situation of not cutting off vacuum, measure described processing intermediate object program.
10. in accordance with the method for claim 9, it is characterized in that, when carrying out the substrate processing, in processing procedure atmosphere, carry out described measurement, and measurement result is input in the control circuit as measured controlled quentity controlled variable, and described control circuit provides predetermined periodicity to move and/or the time changes the regulated quantity of controlling as result.
Make the method for the workpiece of plated film 11. be used to utilize inclination on the predetermined space of film, wherein the support by means of plasma applies surface of the work with single material from the solid-state processing atmosphere that is discharged into from single source, or remove material from surface of the work by means of the support of plasma, or by means of the material on the support change surface of the work of plasma, wherein said surface has the predetermined surface distributed of result, wherein
Realize plasma discharge with the uneven density distribution in part;
Make described workpiece be subjected to the effect of the plasma discharge of nonhomogeneous density distribution; And
The predetermined periodicity that produces uneven density distribution with respect to workpiece moves, and this workpiece is arranged in evacuated receiver and static with respect to this evacuated receiver;
The time of generation predetermined period changes in the electrical power of discharge is provided and/or in the signal of telecommunication of setting up that makes the workpiece biasing; And
Described time changes moves synchronously with predetermined periodicity and by described move and the time changes and realizes the surface distributed of being scheduled to is set.
12. be used to be manufactured on the method for the assembly of working on surface acoustic wave or the bulk acoustic wave basis, wherein the support by means of plasma comes the coating assembly surface with single material from the solid-state processing atmosphere that is discharged into from single source, or remove material from assembly surface by means of the support of plasma, or by means of the material on the support change assembly surface of plasma, wherein said surface has the predetermined surface distributed of result, wherein
Realize plasma discharge with the uneven density distribution in part;
Make described assembly be subjected to the effect of the plasma discharge of nonhomogeneous density distribution; And
The predetermined periodicity that produces uneven density distribution with respect to assembly moves, and this assembly is arranged in evacuated receiver and static with respect to this evacuated receiver;
The time of generation predetermined period changes in the electrical power of discharge is provided and/or in the signal of telecommunication of setting up that makes the assembly biasing; And
Described time changes moves synchronously with predetermined periodicity and by described move and the time changes and realizes the surface distributed of being scheduled to is set.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH2019/02 | 2002-11-29 | ||
| CH20192002 | 2002-11-29 | ||
| PCT/CH2003/000744 WO2004050943A2 (en) | 2002-11-29 | 2003-11-13 | Method for the treatment of surfaces with plasma in a vacuum and unit for the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1745453A CN1745453A (en) | 2006-03-08 |
| CN1745453B true CN1745453B (en) | 2011-08-31 |
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ID=32399969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2003801093200A Expired - Fee Related CN1745453B (en) | 2002-11-29 | 2003-11-13 | Method and apparatus for plasma treatment of surface in vacuum |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US7138343B2 (en) |
| EP (1) | EP1565929B1 (en) |
| JP (1) | JP4741241B2 (en) |
| KR (1) | KR101177127B1 (en) |
| CN (1) | CN1745453B (en) |
| AT (1) | ATE375600T1 (en) |
| AU (1) | AU2003277791A1 (en) |
| DE (1) | DE50308371D1 (en) |
| TW (1) | TWI325149B (en) |
| WO (1) | WO2004050943A2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7264850B1 (en) * | 1992-12-28 | 2007-09-04 | Semiconductor Energy Laboratory Co., Ltd. | Process for treating a substrate with a plasma |
| US7138343B2 (en) * | 2002-11-29 | 2006-11-21 | Oc Oerlikon Balzers Ag | Method of producing a substrate with a surface treated by a vacuum treatment process, use of said method for the production of coated workpieces and plasma treatment chamber |
| DE102006036403B4 (en) * | 2006-08-02 | 2009-11-19 | Von Ardenne Anlagentechnik Gmbh | Process for coating a substrate with a defined layer thickness distribution |
| US20090078199A1 (en) * | 2007-09-21 | 2009-03-26 | Innovation Vacuum Technology Co., Ltd. | Plasma enhanced chemical vapor deposition apparatus |
| US8246794B2 (en) * | 2007-12-07 | 2012-08-21 | Oc Oerlikon Blazers Ag | Method of magnetron sputtering and a method for determining a power modulation compensation function for a power supply applied to a magnetron sputtering source |
| CN103094048B (en) * | 2011-11-01 | 2015-08-19 | 凌嘉科技股份有限公司 | The device of movable adjustment magnetron |
| US20170040140A1 (en) * | 2015-08-06 | 2017-02-09 | Seagate Technology Llc | Magnet array for plasma-enhanced chemical vapor deposition |
| DE102018213534A1 (en) * | 2018-08-10 | 2020-02-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device and method for producing layers with improved uniformity in coating systems with horizontally rotating substrate guidance |
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| US6290825B1 (en) * | 1999-02-12 | 2001-09-18 | Applied Materials, Inc. | High-density plasma source for ionized metal deposition |
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| US7138343B2 (en) * | 2002-11-29 | 2006-11-21 | Oc Oerlikon Balzers Ag | Method of producing a substrate with a surface treated by a vacuum treatment process, use of said method for the production of coated workpieces and plasma treatment chamber |
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- 2003-11-13 US US10/536,204 patent/US7138343B2/en not_active Expired - Lifetime
- 2003-11-13 EP EP03769144A patent/EP1565929B1/en not_active Expired - Lifetime
- 2003-11-13 WO PCT/CH2003/000744 patent/WO2004050943A2/en active IP Right Grant
- 2003-11-13 KR KR1020057009745A patent/KR101177127B1/en active IP Right Grant
- 2003-11-13 JP JP2004555942A patent/JP4741241B2/en not_active Expired - Fee Related
- 2003-11-13 AU AU2003277791A patent/AU2003277791A1/en not_active Abandoned
- 2003-11-13 CN CN2003801093200A patent/CN1745453B/en not_active Expired - Fee Related
- 2003-11-13 DE DE50308371T patent/DE50308371D1/en not_active Expired - Lifetime
- 2003-11-13 AT AT03769144T patent/ATE375600T1/en not_active IP Right Cessation
- 2003-11-27 TW TW092133325A patent/TWI325149B/en not_active IP Right Cessation
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| US6290825B1 (en) * | 1999-02-12 | 2001-09-18 | Applied Materials, Inc. | High-density plasma source for ionized metal deposition |
| CN1341159A (en) * | 1999-02-19 | 2002-03-20 | 东京电子有限公司 | Plasma deposition method and apparatus with magnetic bucket and concentric plasma and material source |
| US6413382B1 (en) * | 2000-11-03 | 2002-07-02 | Applied Materials, Inc. | Pulsed sputtering with a small rotating magnetron |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4741241B2 (en) | 2011-08-03 |
| TWI325149B (en) | 2010-05-21 |
| ATE375600T1 (en) | 2007-10-15 |
| EP1565929A2 (en) | 2005-08-24 |
| WO2004050943A3 (en) | 2004-08-26 |
| JP2006508242A (en) | 2006-03-09 |
| KR101177127B1 (en) | 2012-08-24 |
| DE50308371D1 (en) | 2007-11-22 |
| AU2003277791A1 (en) | 2004-06-23 |
| KR20050085214A (en) | 2005-08-29 |
| AU2003277791A8 (en) | 2004-06-23 |
| CN1745453A (en) | 2006-03-08 |
| US7429543B2 (en) | 2008-09-30 |
| US20060054493A1 (en) | 2006-03-16 |
| EP1565929B1 (en) | 2007-10-10 |
| WO2004050943A2 (en) | 2004-06-17 |
| US20070084715A1 (en) | 2007-04-19 |
| US7138343B2 (en) | 2006-11-21 |
| TW200415687A (en) | 2004-08-16 |
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