CN1720608A - 复合引线框led封装及其制造方法 - Google Patents

复合引线框led封装及其制造方法 Download PDF

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CN1720608A
CN1720608A CNA2003801049369A CN200380104936A CN1720608A CN 1720608 A CN1720608 A CN 1720608A CN A2003801049369 A CNA2003801049369 A CN A2003801049369A CN 200380104936 A CN200380104936 A CN 200380104936A CN 1720608 A CN1720608 A CN 1720608A
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lead frame
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light emitting
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CN100385636C (zh
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班·P·罗
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Kerui Led Co
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Cree Inc
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    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract

本发明揭示一种发光模具封装(10)。所述模具封装(10)包括一引线框(20)、一底部散热片(30)、一顶部散热片(40)、一反射器(60)和一透镜(70)。所述顶部和底部散热片(40和30)与所述引线框(20)热耦合，但与所述引线框(20)电绝缘。所述引线框(20)包括复数个引线(22)并界定一用以安装LED(50)的安装衬垫(28)。所述顶部散热片(40)界定所述安装衬垫(28)上方的一开口(42)。所述反射器(60)在所述开口(42)处耦合到所述顶部散热片(40)。所述透镜(70)被放置于所述开口(42)上方而界定所述安装衬垫(28)上方的一封闭腔(44)。至少一个发光装置(LED)(50)被安装在所述腔(44)内的所述安装衬垫(28)上。密封剂将所述LED(50)光学耦合到其周围表面以最大化其光学性能。当通电时，所述LED(50)产生光和热。所述光被所述反射器(60)反射并通过所述透镜(70)对其进行作用。所述热通过所述顶部和底部散热片(40和30)耗散。

Description

复合引线框LED封装及其制造方法
优先权
本申请案主张美国专利与商标局批准的2002年12月6日申请的题为“Leadframe based LED or semiconductor package with improved heatspreading”的美国临时专利申请案第60/431,523号的权利。
技术领域
本发明涉及封装半导体装置的领域，且尤其涉及封装发光二极管。
背景技术
诸如发光二极管的发光装置(LED)通常封装于引线框封装内。引线框封装通常包括一连接到薄金属引线的LED，其中所述LED和大部分引线完全密封于一塑料体内。所述塑料体的一部分界定一透镜。连接到LED的引线的一部分延伸到所述塑料体的外部。所述引线框封装的金属引线充当导管以向LED提供电源，同时，其可用以将热量从所述LED中排出。当向LED施加功率以生成光时，所述LED产生热量。延伸到所述封装体外的引线的一部分连接到所述引线框封装外部的电路。
LED所产生的热量中的一些由塑料封装体耗散，然而，大部分热量被经由所述封装的金属组件而从LED排出。所述金属引线通常很薄且具有较小的横截面。因此，所述金属引线从LED中移除热量的能力受到限制。此限制了可发送到LED的功率的量。进而限制了可由LED产生的光的量。
为增加LED封装散热的能力，工业上使用各种设计；然而，这些设计中的每一个导致LED封装具有有限的热量耗散能力同时增加制造所述LED封装的复杂性和成本。例如，在一个方法中，LED封装被设计成将所述LED包括于一散热嵌片(heatsink slug)的腔内。然而，除其底表面外，所述散热嵌片被一塑料体所围绕。例如，Lumileds Lighting，LLC的一些LUXEONTM LED封装体现了此一设计。在此，所述散热嵌片增加了LED封装散热的能力；然而，此设计的LED封装制造起来相对较难且较昂贵。另外，因为其有限的暴露表面(仅为底表面)，所以其热量耗散受到限制。
在另一LED封装设计中，所述引线框的引线延伸(以各种形状和配置)超出所述LED封装体的紧接的边缘(immediate edge)外。这增加了暴露于周围空气的引线部分的表面积。所述延伸引线的增加的暴露表面积增加了LED封装散热的能力；然而，经延伸的引线增加了LED封装的大小，需要电路板上的相对更大的面积。在许多应用中，电路板面积是所稀有且昂贵的因素。
当前引线框封装设计的另一不需要的方面涉及与所述封装的热膨胀相关联的问题。当产生热量时，所述LED封装经历热膨胀。LED封装的每一部分具有不同的热膨胀系数(CTE)。例如，LED的CTE、所述封装体的CTE、所述引线的CTE和透镜的CTE都彼此不同。为此，当受热时，这些部分中的每一个部分经历不同程度的热膨胀，导致所述封装的部件之间的机械应力，因此不利地影响其可靠性。
因此，存在对一种克服或缓解现有技术封装的一个或多个缺点的经改良的LED封装的需要。
发明内容
本发明满足所述需要。在本发明的第一实施例中，一发光模具封装包括一引线框、一底部散热片和一顶部散热片。所述引线框具有一顶面和一底面，并包括复数个引线。所述引线框的一部分界定一安装衬垫。所述底部散热片耦合到所述引线框的底面。所述顶部散热片耦合到所述引线框的顶面。所述顶部散热片界定一通常围绕所述安装衬垫的开口。
在本发明的第二实施例中，一发光模具封装包括一引线框、一底部散热片和一顶部散热片。所述引线框具有一顶面和一底面，且包括复数个引线。所述底部散热片与所述安装衬垫下方的所述引线框的底面热耦合。所述底部散热片与所述引线框电绝缘。所述顶部散热片与所述引线框的顶面热耦合并界定一通常围绕所述安装衬垫的开口。所述顶部散热片与所述引线框电绝缘并耦合到一也围绕所述安装衬垫的反射器。至少一个发光装置(LED)安装于所述安装衬垫上，当通电时，所述LED适合产生光。一透镜与所述开口上方的所述顶部散热片耦合。所述透镜适合对LED所产生的光进行作用。所述透镜覆盖所述开口，借此界定一封闭腔。
在本发明的第三个实施例中，揭示了一种制造一发光模具封装的方法。首先，制作一引线框模具。所述引线框模具包括复数个引线和模具框(dieframe)，每一引线和所述模具框均具有一顶面和一底面。其次，一顶部散热片耦合到所述引线框模具之上，所述顶部散热片界定一开口。接着，一底部散热片耦合到所述引线框模具之下。最后，冲压所述引线框以切除所述模具框。
从以下详细描述并结合附图，通过对本发明的原理进行例示的方法说明，本发明的其它方面和优点将变得显而易见。
附图说明
图1A和1B为根据本发明的一个实施例的发光模具封装的透视图；
图1C为图1A的发光模具封装沿线A-A而切割的侧视剖面图；
图2为图1A的半导体封装的分解透视图；
图3为在制造过程中的图1A的发光模具封装的透视图。
具体实施方式
现在将参考说明本发明不同实施例的图1到图3描述本发明。如图中所说明，为了说明的目的放大层或区域的大小，因此提供其以说明本发明的总体结构。此外，参考在其它结构、部分或两者上形成的结构或部分描述本发明的各种方面。所属领域的技术人员将明了参考在另一结构或部分“上”或“上方”形成的结构涵盖可插入的额外结构、部分或两者。参考在另一结构或部分“上”形成的不具有插入结构或部分的结构在本文中被描述为“直接”形成于所述结构或部分上。此外，本文使用诸如“上”或“上方”的相关术语来描述如在图中所说明的一个结构或部分与另一结构或部分的关系。应了解，除图中所描绘的定位外，诸如“上”或“上方”的相关术语欲涵盖所述装置的不同定位。例如，若将图中的装置翻转，则被描述为在其它结构或部分“上方”的结构或部分现在将被定位在另一结构或部分“下方”。同样，若将图中的装置沿一轴旋转，则被描述为在其它结构或部分“上方”的结构或部分现在将被定位于与其它结构或部分“相邻”或其“左方”。文中相同数字代表相同元件。
如为了说明的目的在图中所示，通过发光模具封装来例示本发明的实施例，所述发光模具封装包括一具有引线的引线框、一底部散热片和一具有一开口的顶部散热片。一诸如发光二极管的发光装置(LED)安装在所述开口内的引线框上。一透镜覆盖所述开口。实际上，根据本发明的一实施例的所述发光模具封装包含一夹入一引线框的两部分散热片。因为所述底部散热片和所述顶部散热片将热量从LED排出，所以可向LED输送更多功率，且所述LED可生成更多光。此外，为此，本发明的所述发光模具封装可无需延伸远离所述封装的单独的散热嵌片或引线。因此，本发明的LED模具封装可更紧密、更可靠且比制造现有技术的模具封装更省费用。
图1A和1B为根据本发明的一个实施例的发光模具封装10的透视图。图1C为图1A的发光模具封装10沿线A-A而切割的侧视剖面图。图2为图1A和1B的半导体封装10的分解透视图。参看图1A到图2，所述半导体封装10包括一引线框20、一底部散热片30和一顶部散热片40。
所述引线框20包括复数个引线。在图中，仅为说明的目的展示了引线22a、22b、22c、22d和22e。为了方便起见，本文中将引线22a、22b、22c、22d和22e共同称为引线22。所述引线22a、22b、22c、22d和22e彼此电绝缘。为避免混淆，并不以图中的参考数字说明引线22的所有情况。所述引线框20包括一顶面24和一底面26。此外，所述引线框20的一部分28界定一安装衬垫28。所述安装衬垫28为所述引线框20的一部分(包括所述第一引线22a的一部分)，此处安装有一LED组合50。通常，将所述安装衬垫28一般定位在邻近所述引线框20的顶面24中心。在本发明的替代实施例中，所述LED组合50可由其它半导体电路或芯片替代。所述引线框20由导电材料制成且一般较薄。在一个实施例中所述引线框20具有千分之一或百分之一英寸数量级(order)的厚度，且例如范围为从0.005英寸到0.010英寸。
将所述底部散热片30与至少位于所述安装衬垫28下方的所述引线框20的底面26耦合。所述底部散热片30由导热材料制成，并与所述引线框20的底面26热耦合，但与所述引线框20电分离。所述底部散热片30具有一与所述引线框20热耦合但与其电分离的顶表面32，所述电分离可通过使用在所述引线框20与所述底部散热片30之间的介电层(例如，以陶瓷粒子填充的粘合剂)来实现。所述底部散热片30具有一界定一所述发光模具封装10的底部平面的底表面34。如图1B所示，所述底部散热片30的底表面34可包括一金属化底部。如所说明，可将所述引线22弯向所述底部平面到邻近所述底部平面终止。
所述顶部散热片40耦合到所述引线框20的顶面24。所述顶部散热片40界定一开口42，所述开口42一般围绕所述安装衬垫28。所述顶部散热片40由导热材料制成，并与所述引线框20的顶面24热耦合，但与所述引线框20电分离，所述电分离可通过使用所述引线框20与所述底部散热片40之间的介电层来实现。所述底部散热片30和所述顶部散热片40一般具有相似的侧向尺寸或范围，并基本上彼此重叠将所述引线框20夹在中间。所述顶部散热片40和所述底部散热片30由诸如(仅举例)铜、铝或陶瓷材料的导热材料制成。
所述发光模具封装10包括LED组合50，所述LED组合50包括至少一个安装在所述安装衬垫上的发光装置(LED)。图2中例示所述LED组合50为具有四个发光二极管。当通电时，所述LED适合产生光。
所述发光模具封装10包括一耦合到所述顶部散热片40的反射器60，所述反射器60围绕所述安装衬垫28。在一个替代实施例中，所述反射器60不是一单独的组件，而是与顶部散热片40集成一体并成为其一部分。所述反射器60适合将来自LED组合50的光反射至透镜70。
所述发光模具封装10包括耦合到顶部散热片40的透镜70，所述透镜70一般耦合到开口42、安装衬垫28和反射器60上方。当将透镜70放置于所述开口42上方时，引线框20、顶部散热片40的开口42和透镜70界定一封闭腔44。所述透镜70通过(例如)反射、引导、聚焦和改变波长对LED组合50所产生的光起作用。例如，可用碳酸钙涂布所述透镜70的底表面72以散射光。或者，可用磷涂布所述透镜70的底表面72以改变来自LED组合50的光的波长。
使用诸如硅酮的透明密封剂填充封闭腔44。所述密封剂将LED组合50粘着到所述安装衬垫28上。无需以所述密封剂完全填充封闭腔44。事实上，用密封剂部分填充腔44同时在所述腔44内留出间隙可允许所述密封剂膨胀(当LED组合50产生热量时)，而不使所述透镜70与所述顶部散热片40相分离。
可使用图3来讨论制造图1A到图2的发光模具封装10的方法。图3说明制造前的图1A的发光模具封装10。为制造图中的发光模具封装10，制作一引线框模具80。为了说明的目的，在图2中制作所述引线框模具80以用于制造两个发光模具封装。事实上，可制作一引线框模具来同时制造多个发光模具封装。所述引线框模具80包括复数个引线，例如引线22a、22b、22c、22d和22e(共同为“引线22”)，和一围绕所述引线22的模具框82。所述引线框模具具有一顶面24(与图2引线框20的顶面24同面)和一底面26(与图2引线框20的底面26同面)。所述引线框模具80通过冲压诸如金属的一片模具材料来制作。取决于，所述模具材料的厚度可根据所所需的应用而极大地不同，例如所述厚度可以几分之一毫米(mm)数量级计，例如范围从0.13mm到0.25mm。或者，可使用蚀刻处理来制作所述引线框模具80。
参看图2和图3，将所述顶部散热片40耦合到所述引线框模具80。如已描述的，所述顶部散热片40界定所述开口42。所述底部散热片30耦合到所述引线框模具80的底面。所述底部散热片30具有一与引线框模具80热耦合但与其电分离的顶表面32。如图1B中所说明，底部散热片30具有一界定所述发光模具封装30的底部平面的金属化底表面34。图3的介电但导热的粘合层38可用于将所述底部散热片30与所述引线框20分离。
所述顶部散热片40与所述底部散热片30具有类似的侧向范围并基本上彼此重叠。例如，所述底部散热片30的侧向范围33和35可根据实施而极大地不同(仅举例)侧向范围33和35可以毫米(mm)或厘米(cm)数量级计，且范围可从(例如)7mm到20mm。所述底部散热片30和所述顶部散热片40可具有以mm或cm数量级计的厚度，且其范围可从(例如)1.5mm到3mm。这些测量结果可根据所需的特征和应用而极大地不同。
参看图2和图3，进一步讨论了制造发光模具封装10的方法。在开口42内将包括诸如一发光二极管的至少一个发光装置(LED)的LED组合50安装到至少一个引线上，诸如引线22a。接着，将反射器60和透镜70附着到顶部散热片40上，所述透镜70覆盖开口42。所述反射器60围绕所述开口42。所述反射器60可与顶部散热片40成一体，在此情况下不需要一个将反射器60与顶部散热片40耦合的单独步骤。
最后，冲压所述引线框模具80以切除所述模具框82。在冲压期间，如图1A到图2所说明，将引线22弯向底部平面。
从前述可见，本发明是新颖的并提供超出现有技术的优点。尽管以上描述并说明了本发明的特定实施例，但本发明并不限于所描述和说明的部件的特定形式或布置。例如，可将不同的配置、大小或材料用于实践本发明。本发明由上述权利要求书限制。

Claims (20)

1.一种发光模具封装(10)，其包含：
一包括复数个引线(22)的引线框(20)，所述引线框(20)具有顶面(24)和底面(26)，且所述引线框的一部分界定一安装衬垫(28)；
一与所述引线框(20)的所述底面(26)耦合的底部散热片(30)；和
一与所述引线框(20)的所述顶面(24)耦合的顶部散热片(40)，所述顶部散热片(40)界定一开口(42)，所述开口(42)一般围绕所述安装衬垫(28)。
2.根据权利要求1所述的发光模具封装(10)，其中所述顶部散热片(40)与所述引线框(20)电分离。
3.根据权利要求1所述的发光模具封装(10)，其中所述顶部散热片(40)与所述底部散热片(30)具有类似的侧向范围，且基本上彼此重叠。
4.根据权利要求1所述的发光模具封装(10)，其中所述底部散热片(30)具有一与所述引线框(20)热耦合但与其电分离的顶表面(32)，且所述底部散热片(30)具有一界定一所述发光模具封装(10)的底部平面的金属化底表面(34)。
5.根据权利要求4所述的发光模具封装(10)，其中所述引线(22)弯向所述底部平面，且所述引线(22)终止于靠近所述底部平面处。
6.根据权利要求1所述的发光模具封装(10)，其进一步包含安装在所述安装衬垫(28)上的至少一个发光装置(LED)(50)。
7.根据权利要求1所述的发光模具封装(10)，其进一步包含一耦合到所述顶部散热片(40)的反射器(60)，所述反射器(60)围绕所述安装衬垫(28)。
8.根据权利要求1所述的发光模具封装(10)，其进一步包含一与所述安装衬垫(28)上方的所述顶部散热片(40)耦合的透镜(70)。
9.一种发光模具封装(10)，其包含：
一包括复数个引线(22)的引线框(20)，所述引线框(20)具有顶面(24)和一底面(26)，且所述引线框的一部分界定一安装衬垫(28)；
一与所述安装衬垫(28)下方的所述引线框(20)的所述底面(26)热耦合的底部散热片(30)，所述底部散热片(30)与所述引线框(20)电绝缘；
一与所述引线框(20)的所述顶面(24)热耦合的顶部散热片(40)，所述顶部散热片(40)界定一开口(42)，所述开口(42)一般围绕所述安装衬垫(28)，所述顶部散热片(40)与所述引线框(20)电绝缘，且所述顶部散热片(40)耦合到一也围绕所述安装衬垫(28)的反射器(60)；
至少一个安装在所述安装衬垫(28)上的发光装置(LED)(50)，当通电时，所述LED(50)适合产生光；和
一与所述开口(42)上方的所述顶部散热片(40)耦合的透镜(70)，所述透镜(70)适合对由所述LED(50)产生的光进行作用，所述透镜(70)覆盖所述开口(42)，借此界定一封闭腔(44)。
10.根据权利要求9所述的发光模具封装(10)，其中所述底部散热片(30)具有一界定一所述发光模具封装(10)的底部平面的金属化底表面(34)。
11.根据权利要求9所述的发光模具封装(10)，其中所述封闭腔(44)由密封剂至少部分填充。
12.一种制造一发光模具封装(10)的方法，所述方法包含：
制作一引线框模具(80)，所述引线框模具(80)包括复数个引线(22)和模具框(82)，每一引线(22)和所述模具框(82)具有一顶面(24)和一底面(26)；
将一顶部散热片(40)耦合到所述引线框模具(80)上方，所述顶部散热片(40)界定一开口(42)；
将一底部散热片(30)耦合到所述引线框模具(80)下方；和
冲压所述引线框模具(80)以切除所述模具框(82)。
13.根据权利要求12所述的方法，其中通过冲压一片模具材料来制作所述引线框模具(80)。
14.根据权利要求12所述的方法，其中通过蚀刻处理来制作所述引线框模具(80)。
15.根据权利要求12所述的方法，其进一步包含将至少一个发光装置(LED)(50)安装于至少一个引线(22)上，所述LED(50)安装于所述开口(42)中。
16.根据权利要求12所述的方法，其进一步包含将一透镜(70)附着于所述顶部散热片(40)上，所述透镜(70)覆盖所述开口(42)。
17.根据权利要求12所述的方法，其中所述底部散热片(30)具有一与所述引线框模具(80)热耦合但与其电分离的顶表面(32)，且所述底部散热片(30)具有一界定所述发光模具封装(10)的一底部平面的金属化底表面(34)。
18.根据权利要求17所述的方法，其进一步包含将所述引线(22)弯向所述底部平面。
19.根据权利要求14所述的方法，其进一步包含将一反射器(60)耦合于所述顶部散热片(40)上，所述反射器(60)围绕所述开口(42)。
20.根据权利要求14所述的方法，其中所述顶部散热片(40)包括一集成反射器。
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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
CN101833149A (zh) * 2009-03-10 2010-09-15 安华高科技光纤Ip（新加坡）私人有限公司 具有部件散热系统的并行光学收发器模块
CN101145592B (zh) * 2006-09-13 2010-09-29 佰鸿工业股份有限公司 高散热性发光二极管装置
CN102130266A (zh) * 2010-01-20 2011-07-20 旭丽电子(广州)有限公司 封装结构及发光二极管封装结构
CN102569273A (zh) * 2006-08-16 2012-07-11 惠州科锐光电有限公司 表面安装器件及其制造方法
CN102742039A (zh) * 2010-02-08 2012-10-17 骆万宝 Led发光模块
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
CN104025320A (zh) * 2011-10-27 2014-09-03 首尔半导体株式会社 发光二极管封装件和包括该发光二极管封装件的发光模块
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
CN110071196A (zh) * 2010-08-10 2019-07-30 科锐公司 具有高效、绝热路径的led封装
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
CN112514180A (zh) * 2018-07-31 2021-03-16 ams传感器亚洲私人有限公司 包括作为导电引线的引线框架的部分的封装
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

Families Citing this family (122)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004001862A1 (ja) * 2002-06-19 2003-12-31 Sanken Electric Co., Ltd. 半導体発光装置及びその製法並びに半導体発光装置用リフレクタ
US7775685B2 (en) * 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
JP4274935B2 (ja) * 2003-12-26 2009-06-10 トキコーポレーション株式会社 発光ユニット用ケースおよび発光ユニット製造方法
TWM258416U (en) * 2004-06-04 2005-03-01 Lite On Technology Corp Power LED package module
US7280288B2 (en) 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
DE102004045947A1 (de) * 2004-06-30 2006-01-19 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung
KR20060018453A (ko) * 2004-08-24 2006-03-02 삼성전자주식회사 히트 싱크를 갖는 반도체 소자
WO2006059828A1 (en) * 2004-09-10 2006-06-08 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins
CN100347869C (zh) * 2004-09-14 2007-11-07 宏齐科技股份有限公司 发光芯片的封装结构
US7748873B2 (en) * 2004-10-07 2010-07-06 Seoul Semiconductor Co., Ltd. Side illumination lens and luminescent device using the same
US20060087866A1 (en) * 2004-10-22 2006-04-27 Ng Kee Y LED backlight
WO2006065007A1 (en) * 2004-12-16 2006-06-22 Seoul Semiconductor Co., Ltd. Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US7777247B2 (en) * 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
US7939842B2 (en) * 2005-01-27 2011-05-10 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
US8076680B2 (en) * 2005-03-11 2011-12-13 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
KR100609784B1 (ko) * 2005-05-20 2006-08-09 럭스피아 주식회사 일체형 방열판을 가지는 발광다이오드 패키지 및 멀티패키지 모듈
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
US20060292747A1 (en) * 2005-06-27 2006-12-28 Loh Ban P Top-surface-mount power light emitter with integral heat sink
KR100629496B1 (ko) * 2005-08-08 2006-09-28 삼성전자주식회사 Ｌｅｄ 패키지 및 그 제조방법
US20070126020A1 (en) * 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof
KR100765714B1 (ko) * 2005-12-15 2007-10-11 엘지전자 주식회사 리드프레임, 그를 이용한 발광 소자 패키지 및 그의 제조방법
US7772604B2 (en) 2006-01-05 2010-08-10 Illumitex Separate optical device for directing light from an LED
KR101283182B1 (ko) * 2006-01-26 2013-07-05 엘지이노텍 주식회사 발광 다이오드 패키지 및 그 제조 방법
US20070181897A1 (en) * 2006-02-03 2007-08-09 Been-Yu Liaw High heat dissipating package baseplate for a high brightness LED
KR100729439B1 (ko) * 2006-03-23 2007-06-15 (주)싸이럭스 발광소자 패키지 구조체와 그 제조방법 및 이를 적용한발광소자의 제조방법
US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
US7635915B2 (en) 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US7655957B2 (en) * 2006-04-27 2010-02-02 Cree, Inc. Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
JP4830768B2 (ja) * 2006-05-10 2011-12-07 日亜化学工業株式会社 半導体発光装置及び半導体発光装置の製造方法
JP2009538531A (ja) * 2006-05-23 2009-11-05 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド 照明装置、および、製造方法
KR100904152B1 (ko) * 2006-06-30 2009-06-25 서울반도체 주식회사 히트싱크 지지부를 갖는 리드프레임, 그것을 사용한 발광다이오드 패키지 제조방법 및 그것에 의해 제조된 발광다이오드 패키지
US8044418B2 (en) * 2006-07-13 2011-10-25 Cree, Inc. Leadframe-based packages for solid state light emitting devices
US7960819B2 (en) * 2006-07-13 2011-06-14 Cree, Inc. Leadframe-based packages for solid state emitting devices
KR101241528B1 (ko) 2006-09-25 2013-03-08 엘지이노텍 주식회사 발광 장치
US8087960B2 (en) 2006-10-02 2012-01-03 Illumitex, Inc. LED system and method
US20080089072A1 (en) * 2006-10-11 2008-04-17 Alti-Electronics Co., Ltd. High Power Light Emitting Diode Package
KR100851183B1 (ko) * 2006-12-27 2008-08-08 엘지이노텍 주식회사 반도체 발광소자 패키지
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US7922360B2 (en) * 2007-02-14 2011-04-12 Cree, Inc. Thermal transfer in solid state light emitting apparatus and methods of manufacturing
US7964888B2 (en) 2007-04-18 2011-06-21 Cree, Inc. Semiconductor light emitting device packages and methods
KR101380385B1 (ko) * 2007-06-29 2014-04-10 서울반도체 주식회사 일괄 봉지 기술을 이용하는 ｌｅｄ 패키지 제조방법
CN101388161A (zh) * 2007-09-14 2009-03-18 科锐香港有限公司 Led表面安装装置和并入有此装置的led显示器
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
KR200447448Y1 (ko) * 2007-11-29 2010-01-25 (주)솔라루체 Ｌｅｄ 소자용 리드프레임 패키지 및 이를 이용한 ｌｅｄ패키지
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
DE102008013898A1 (de) * 2007-12-14 2009-06-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, Anordnung und Verfahren zur Herstellung eines optoelektronischen Bauelements
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
JP2011512037A (ja) 2008-02-08 2011-04-14 イルミテックス， インコーポレイテッド エミッタ層成形のためのシステムおよび方法
DE102008011862A1 (de) * 2008-02-29 2009-09-03 Osram Opto Semiconductors Gmbh Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung
TWI360239B (en) * 2008-03-19 2012-03-11 E Pin Optical Industry Co Ltd Package structure for light emitting diode
DE102008021435A1 (de) 2008-04-29 2009-11-19 Schott Ag Gehäuse für LEDs mit hoher Leistung
KR100997198B1 (ko) * 2008-05-06 2010-11-29 김민공 프레스 단조 방식의 발광다이오드 금속제 하우징 및 금속제하우징을 이용한 발광다이오드 금속제 패키지
KR100951779B1 (ko) 2008-05-09 2010-04-08 주식회사 디에스엘시디 발광다이오드 패키지 및 그 제조방법
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
KR101324077B1 (ko) * 2008-08-26 2013-10-31 딩구오 판 발광 다이오드 멀티 칩 실장 및 실장 탑재로 만들어진 스트립 라이트
JP5217800B2 (ja) 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
DE102008045925A1 (de) * 2008-09-04 2010-03-11 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
KR100888236B1 (ko) 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8598602B2 (en) * 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
JP2010182486A (ja) * 2009-02-04 2010-08-19 Koito Mfg Co Ltd 車両用灯具
US8314433B2 (en) * 2009-03-19 2012-11-20 Cid Technologies Llc Flexible thermal energy dissipating and light emitting diode mounting arrangement
US20100270580A1 (en) * 2009-04-22 2010-10-28 Jason Loomis Posselt Substrate based light source package with electrical leads
US8957435B2 (en) * 2009-04-28 2015-02-17 Cree, Inc. Lighting device
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8860043B2 (en) * 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US7875970B2 (en) * 2009-06-10 2011-01-25 Green Arrow Asia Limited Integrated circuit package having a castellated heatspreader
CN101936500A (zh) * 2009-06-30 2011-01-05 富准精密工业(深圳)有限公司 发光二极管模组
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
US8679865B2 (en) * 2009-08-28 2014-03-25 Samsung Electronics Co., Ltd. Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package
US8410371B2 (en) 2009-09-08 2013-04-02 Cree, Inc. Electronic device submounts with thermally conductive vias and light emitting devices including the same
CN102597618A (zh) * 2009-09-10 2012-07-18 哈米什·麦克伦南 改进型发光二极管(led)组件及其制造方法
CN102024882A (zh) * 2009-09-14 2011-04-20 展晶科技(深圳)有限公司 发光二极管装置及其制造方法
US8120056B2 (en) * 2009-10-19 2012-02-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting diode assembly
US7893445B2 (en) * 2009-11-09 2011-02-22 Cree, Inc. Solid state emitter package including red and blue emitters
WO2011060319A1 (en) * 2009-11-13 2011-05-19 Uni-Light Llc Led thermal management
US8350370B2 (en) 2010-01-29 2013-01-08 Cree Huizhou Opto Limited Wide angle oval light emitting diode package
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US9240526B2 (en) 2010-04-23 2016-01-19 Cree, Inc. Solid state light emitting diode packages with leadframes and ceramic material
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
USD643819S1 (en) 2010-07-16 2011-08-23 Cree, Inc. Package for light emitting diode (LED) lighting
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
TW201251140A (en) * 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US9246052B2 (en) 2011-07-15 2016-01-26 Institute Of Semiconductors, Chinese Academy Of Sciences Packaging structure of light emitting diode and method of manufacturing the same
WO2013036481A2 (en) 2011-09-06 2013-03-14 Cree, Inc. Light emitter packages and devices having improved wire bonding and related methods
DE102011113653B4 (de) * 2011-09-19 2016-02-18 Rüdiger Lanz LED-Hochleistungsspot
CN202523753U (zh) * 2011-10-27 2012-11-07 深圳市灏天光电有限公司 一种隐脚式大功率led支架及封装结构
US8823041B2 (en) 2011-10-27 2014-09-02 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting module comprising the same
US9046241B2 (en) 2011-11-12 2015-06-02 Jingqun Xi High efficiency directional light source using lens optics
US9194556B1 (en) 2012-02-22 2015-11-24 Theodore G. Nelson Method of producing LED lighting apparatus and apparatus produced thereby
KR101281532B1 (ko) * 2013-01-11 2013-07-03 (주)뉴티스 파워 엘이디 패키지용 히트싱크 일체형 리드 프레임의 제조방법
DE202013101190U1 (de) * 2013-03-20 2014-06-24 Zumtobel Lighting Gmbh Anordnung zur Lichtabgabe mit einer LED, einer Platine und einem optischen Element
USD735683S1 (en) 2013-05-03 2015-08-04 Cree, Inc. LED package
TWI559053B (zh) * 2013-05-28 2016-11-21 潘宇翔 適用於直下式背光模組之光源裝置及其顯示器
US9105825B2 (en) 2013-06-03 2015-08-11 Avago Technologies General Ip (Singapore) Pte. Ltd. Light source package and method of manufacturing the same
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
US11431146B2 (en) * 2015-03-27 2022-08-30 Jabil Inc. Chip on submount module
USD912303S1 (en) * 2015-04-07 2021-03-02 Flos S.P.A. Table lamp
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
WO2018087027A1 (en) * 2016-11-11 2018-05-17 Lumileds Holding B.V. Method of manufacturing a lead frame
US11677059B2 (en) 2017-04-26 2023-06-13 Samsung Electronics Co., Ltd. Light-emitting device package including a lead frame
KR102335216B1 (ko) 2017-04-26 2021-12-03 삼성전자 주식회사 발광소자 패키지
WO2019151826A1 (ko) * 2018-02-05 2019-08-08 엘지이노텍 주식회사 반도체 소자 패키지 및 이를 포함하는 발광장치
US20220037250A1 (en) * 2018-09-27 2022-02-03 Kyocera Corporation Wiring board and electric device

Family Cites Families (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4267559A (en) * 1979-09-24 1981-05-12 Bell Telephone Laboratories, Incorporated Low thermal impedance light-emitting diode package
JPS5812961U (ja) * 1981-07-16 1983-01-27 株式会社東芝 ハ−メチツクシ−ル型光半導体装置
US4514750A (en) * 1982-01-11 1985-04-30 Texas Instruments Incorporated Integrated circuit package having interconnected leads adjacent the package ends
JPS60262476A (ja) * 1984-06-08 1985-12-25 Matsushita Electric Ind Co Ltd 発光素子
USRE37707E1 (en) * 1990-02-22 2002-05-21 Stmicroelectronics S.R.L. Leadframe with heat dissipator connected to S-shaped fingers
US5173839A (en) * 1990-12-10 1992-12-22 Grumman Aerospace Corporation Heat-dissipating method and device for led display
JP2966591B2 (ja) 1991-08-02 1999-10-25 三洋電機株式会社 光半導体装置
US5441918A (en) * 1993-01-29 1995-08-15 Lsi Logic Corporation Method of making integrated circuit die package
JP3420612B2 (ja) * 1993-06-25 2003-06-30 株式会社東芝 Ｌｅｄランプ
US5789772A (en) 1994-07-15 1998-08-04 The Whitaker Corporation Semi-insulating surface light emitting devices
DE4446566A1 (de) * 1994-12-24 1996-06-27 Telefunken Microelectron Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement
US5874838A (en) 1996-06-13 1999-02-23 Cypress Semiconductor Corporation High voltage-tolerant low voltage input/output cell
US5785418A (en) * 1996-06-27 1998-07-28 Hochstein; Peter A. Thermally protected LED array
JP3699783B2 (ja) * 1996-07-23 2005-09-28 株式会社シチズン電子 チップ型半導体及びその製造方法
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JPH10144965A (ja) 1996-11-11 1998-05-29 Hamamatsu Photonics Kk 光半導体装置及びその製造方法
US6238599B1 (en) * 1997-06-18 2001-05-29 International Business Machines Corporation High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
EP1004145B1 (de) 1997-07-29 2005-06-01 Osram Opto Semiconductors GmbH Optoelektronisches bauelement
JP3472450B2 (ja) 1997-09-04 2003-12-02 シャープ株式会社 発光装置
US5869883A (en) * 1997-09-26 1999-02-09 Stanley Wang, President Pantronix Corp. Packaging of semiconductor circuit in pre-molded plastic package
JPH11163412A (ja) 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置
TW408497B (en) 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
DE19755734A1 (de) * 1997-12-15 1999-06-24 Siemens Ag Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes
DE19803936A1 (de) 1998-01-30 1999-08-05 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Ausdehnungskompensiertes optoelektronisches Halbleiter-Bauelement, insbesondere UV-emittierende Leuchtdiode und Verfahren zu seiner Herstellung
JPH11298048A (ja) 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP2000049184A (ja) * 1998-05-27 2000-02-18 Hitachi Ltd 半導体装置およびその製造方法
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6335548B1 (en) 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US6274924B1 (en) * 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
JP2000183407A (ja) * 1998-12-16 2000-06-30 Rohm Co Ltd 光半導体装置
JP2000208822A (ja) * 1999-01-11 2000-07-28 Matsushita Electronics Industry Corp 半導体発光装置
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
US6457645B1 (en) * 1999-04-13 2002-10-01 Hewlett-Packard Company Optical assembly having lens offset from optical axis
DE19918370B4 (de) 1999-04-22 2006-06-08 Osram Opto Semiconductors Gmbh LED-Weißlichtquelle mit Linse
KR100335480B1 (ko) * 1999-08-24 2002-05-04 김덕중 칩 패드가 방열 통로로 사용되는 리드프레임 및 이를 포함하는반도체 패키지
JP2001144333A (ja) 1999-11-10 2001-05-25 Sharp Corp 発光装置とその製造方法
JP2001148514A (ja) 1999-11-18 2001-05-29 Matsushita Electric Works Ltd 照明光源
JP4125848B2 (ja) * 1999-12-17 2008-07-30 ローム株式会社 ケース付チップ型発光装置
US6559525B2 (en) * 2000-01-13 2003-05-06 Siliconware Precision Industries Co., Ltd. Semiconductor package having heat sink at the outer surface
JP4944301B2 (ja) * 2000-02-01 2012-05-30 パナソニック株式会社 光電子装置およびその製造方法
US6456766B1 (en) * 2000-02-01 2002-09-24 Cornell Research Foundation Inc. Optoelectronic packaging
US6492725B1 (en) * 2000-02-04 2002-12-10 Lumileds Lighting, U.S., Llc Concentrically leaded power semiconductor device package
JP2002093206A (ja) 2000-09-18 2002-03-29 Stanley Electric Co Ltd Ｌｅｄ信号灯具
JP2002103977A (ja) 2000-09-29 2002-04-09 Johnan Seisakusho Co Ltd 車両のサンルーフ装置
DE10051159C2 (de) * 2000-10-16 2002-09-19 Osram Opto Semiconductors Gmbh LED-Modul, z.B. Weißlichtquelle
US6940704B2 (en) * 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
US6541800B2 (en) * 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED
JP2002299698A (ja) * 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd 発光装置
DE10117889A1 (de) 2001-04-10 2002-10-24 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung
DE10118630A1 (de) * 2001-04-12 2002-10-17 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Herstellung eines optoelektronischen Halbleiter-Bauelements
US6429513B1 (en) * 2001-05-25 2002-08-06 Amkor Technology, Inc. Active heat sink for cooling a semiconductor chip
USD465207S1 (en) * 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
US6670648B2 (en) * 2001-07-19 2003-12-30 Rohm Co., Ltd. Semiconductor light-emitting device having a reflective case
TW498516B (en) * 2001-08-08 2002-08-11 Siliconware Precision Industries Co Ltd Manufacturing method for semiconductor package with heat sink
JP2003100986A (ja) * 2001-09-26 2003-04-04 Toshiba Corp 半導体装置
JP2003152227A (ja) * 2001-11-14 2003-05-23 Citizen Electronics Co Ltd Ｌｅｄの色補正手段および色補正方法
KR100439402B1 (ko) * 2001-12-24 2004-07-09 삼성전기주식회사 발광다이오드 패키지
US20030148670A1 (en) * 2002-02-06 2003-08-07 Henry Maxwell Electrical wedge connector
JP4211359B2 (ja) 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
JP4172196B2 (ja) 2002-04-05 2008-10-29 豊田合成株式会社 発光ダイオード
US7122884B2 (en) * 2002-04-16 2006-10-17 Fairchild Semiconductor Corporation Robust leaded molded packages and methods for forming the same
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
TW560813U (en) 2003-03-06 2003-11-01 Shang-Hua You Improved LED seat

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
CN102569273B (zh) * 2006-08-16 2015-09-30 惠州科锐光电有限公司 表面安装器件及其制造方法
CN102569273A (zh) * 2006-08-16 2012-07-11 惠州科锐光电有限公司 表面安装器件及其制造方法
CN101145592B (zh) * 2006-09-13 2010-09-29 佰鸿工业股份有限公司 高散热性发光二极管装置
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US10892383B2 (en) 2007-10-31 2021-01-12 Cree, Inc. Light emitting diode package and method for fabricating same
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
CN101833149B (zh) * 2009-03-10 2014-06-25 安华高科技通用Ip(新加坡)公司 具有部件散热系统的并行光学收发器模块
CN101833149A (zh) * 2009-03-10 2010-09-15 安华高科技光纤Ip（新加坡）私人有限公司 具有部件散热系统的并行光学收发器模块
CN102130266A (zh) * 2010-01-20 2011-07-20 旭丽电子(广州)有限公司 封装结构及发光二极管封装结构
CN102742039A (zh) * 2010-02-08 2012-10-17 骆万宝 Led发光模块
CN110071196A (zh) * 2010-08-10 2019-07-30 科锐公司 具有高效、绝热路径的led封装
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
CN104025320A (zh) * 2011-10-27 2014-09-03 首尔半导体株式会社 发光二极管封装件和包括该发光二极管封装件的发光模块
CN104025320B (zh) * 2011-10-27 2016-10-12 首尔半导体株式会社 发光二极管封装件和包括该发光二极管封装件的发光模块
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
CN112514180A (zh) * 2018-07-31 2021-03-16 ams传感器亚洲私人有限公司 包括作为导电引线的引线框架的部分的封装

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US20040126913A1 (en) 2004-07-01
KR101141492B1 (ko) 2012-05-03
WO2004053933A2 (en) 2004-06-24
EP1568076B1 (en) 2011-01-26

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