CN1717147A - Flexible wiring substrate and preparing method, flexible wiring substrate of distribution chip and electronic apparatus - Google Patents
Flexible wiring substrate and preparing method, flexible wiring substrate of distribution chip and electronic apparatus Download PDFInfo
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- CN1717147A CN1717147A CNA2005100811303A CN200510081130A CN1717147A CN 1717147 A CN1717147 A CN 1717147A CN A2005100811303 A CNA2005100811303 A CN A2005100811303A CN 200510081130 A CN200510081130 A CN 200510081130A CN 1717147 A CN1717147 A CN 1717147A
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- wiring
- circuit board
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- printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
In a flexible wire baseplate with corresponding terminals of different sizes forming a plurality of electrically conductive wires of different widths, the thicknesses of wires of the connecting parts of the terminals are uniform without needing a special processing method or a manufacturing method. The wire tracing parts (12B) of the electrically conductive wires (12) of the flexible wire baseplate (10) have different wire widths (W1, W2) based on the sizes of the input and output terminals of a semiconductor chip. The terminal connecting parts (12A) of the electrically conductive wires (12) and the wire tracing parts (12B) with different wire widths irrespectively form patterns which are as wide as the electrically conductive wires and are connected with at least one semiconductor chip.
Description
Technical field
The present invention relates to flexible printed circuit board and manufacture method thereof, be equipped with flexible printed circuit board, the electronic equipment of semiconductor chip.
Background technology
Mobile phone, PDA (Personal Digital Assistant: portable information terminal equipment) etc. want cube little, in light weight, in the electronic equipment of high performance, improve the packing density of the electronic unit on the printed circuit board, be desired always.The thin flat formula display device that particularly assembles in similar this electronic equipment, big as far as possible in order to make display frame, this just requires to improve the packing density of the driving wiring part that is installed in its periphery.In order to reach this purpose, COF (ChipOnFilm: cover brilliant film) is widely used in recent years, and it makes the wiring of flexible printed circuit board and the input and output terminal of semiconductor chip directly be connected assembling semiconductor chips on flexible printed circuit board.
In this COF, need make the corresponding postforming of pattern of wiring pattern and the input and output terminal (projection) of semiconductor chip on the flexible printed circuit board.The pattern-forming technology of flexible printed circuit board in such cases adopts the technology that is called as semi-additive process or complete additive process as putting down in writing in the following patent documentation 1 more.
Use Fig. 1 that this existing technology is described, at first as figure shown in (a) like that, form seed layer 101 as electroplating grid (platingbar) on the surface of flexible insulating substrate 100, then such as figure (b) shown in, in order to form desired wiring pattern, materials such as use photoresist form mask pattern 102 on the surface of seed layer 101.Then, as figure shown in (c) like that, utilize the expose zone of electrolytic plating method in seed layer 101, use electroconductive component materials such as nickel, copper to adhere to, form wiring pattern 103, in addition, look necessity, on the surface of above wiring pattern 103, utilize film build methods such as electrolytic plating method or sputtering method, vapour deposition method to use different metal formation surface conductance layers 104 such as gold.Again, as figure shown in (d) like that, by removing the seed layer 101 that is positioned at mask pattern 102 and bottom thereof, on insulating substrate 100, just formed the flexible printed circuit board of the conducting wiring that constitutes by seed layer part 101A, wiring pattern 103, surface conductance layer 104 with desirable pattern.
On the other hand, the Pareto diagram of the input and output terminal of semiconductor chip (projection) be by as constituting of the internal circuit unit of the arrangement of the terminal of the electronic equipment of driven object and semiconductor chip determine, but in general, not being the terminal pattern of arranging same pattern, is to arrange the different projection of size under the more susceptible condition.
" patent documentation 1 " spy opens the 2000-286536 communique
As described above, in the COF of the semiconductor chip that is equipped with projection with different size, having big electric current in general in big projection flows through, therefore with flexible printed circuit board that such projection is connected on wiring width should suitably enlarge according to the size of projection, form the conducting wiring pattern that corresponding bump size has the various wirings width.Particularly, as the pattern of conducting wiring of wiring width with corresponding bump size form, when the electronic equipment that the performance of equipment is had a significant impact with the size of drive current is object, just become very important design item.The organic EL display apparatus that is receiving much attention in recent years particularly---in the panel display of emissive type, the size of drive current can directly have influence on display performance, therefore in connected flexible printed circuit board, the design of wiring pattern as described above is indispensable.But, adopt the wiring pattern shown in the prior art to form technology, when forming the conducting wiring of this different live widths, can there be problem shown below.
That is, if the conducting wiring of a plurality of different live widths is shaped by metallide, wiring material can takes place in the bigger wiring of width adhered to blocked uply, wiring material was adhered to thin phenomenon in the less wiring of width.This is because when carrying out metallide, the less wiring of the bigger wiring of width and width is compared, because causing current potential to descend, resistance diminishes, if because the pattern of conducting wiring causes the difference of this thickness, bad problem takes place to engage when the mediate hot press of anisotropic conductive film is connected in the conducting wiring of flexible printed circuit board and the projection of semiconductor chip easily around the part that forms height difference in the contiguous wiring.
This is carried out specific description more by example shown in Figure 2.In flexible printed circuit board 1, formed a kind of regional 1A of the 1st wiring of pattern by the wiring that has a same modality with the bigger wiring 1a of width; In addition, formed the regional 1B of the 2nd wiring of another pattern by the wiring that has a same modality with the less wiring 1b of width.On the other hand, in semiconductor chip 2, formed a kind of the 1st projection zone 2A of pattern by the projection that has a same modality with the bigger projection 2a of width; Simultaneously, formed the 2nd projection zone 2B of another pattern by the projection that has a same modality with the less projection 2b of width.Wiring 1a and projection 2a or wiring 1b and projection 2b have the identical width of being close to respectively, and have identical pattern.With anisotropic conductive film (AFC; Anisotropic conductive film) 3 is mediate mutually to the top, and the P that exerts pressure under heated condition carries out hot press.
At this moment,, produce difference as described above, cause forming just difference at the contact-making surface of wiring based on the wiring thickness of wiring width at the adjacent place of the regional 1A of the 1st wiring with the regional 1B of the 2nd wiring.If carry out hot press in this state, the peripheral part A in the part that forms height difference can not be exerted pressure by the influence of this height difference fully, causes engaging the bad generation that connects failure problems that causes in the generation of this peripheral part A place.
In order to address this problem, can make the wiring 1a of the regional 1A of the 1st wiring identical with the thickness of the wiring 1b of the regional 1B of the 2nd wiring, but for the thickness of the wiring that makes different in width like this identical, need special processed or make the particular method of manufacture that processing time of metallide changes by every kind of wiring width, because of the processing of needs complexity makes the cost up of flexible printed circuit board.In addition, it is quite difficult implementing this particular processing at the fine wiring pattern, and this also is a problem.
Summary of the invention
The present invention is exactly for to solve the example that such problem is a problem.In other words, in the flexible printed circuit board that the different terminal of correspondingly-sized is formed by the conducting wiring of a plurality of different live widths, do not adopt special processing or manufacture method, just can make the wiring thickness of coupling part of terminal identical without exception, and then make thus between the terminal of the conducting wiring of flexible printed circuit board and connecting object and do not come in contact bad problem, further, at semiconductor chip with the different input and output terminal of size, by forming wiring pattern correspondingly, can access more high-precision COF, in addition, can eliminate thus because the drive current that the deviation of cloth line resistance causes inequality, electronic equipment, particularly the size at drive current directly influences in the organic EL display apparatus of display performance, can guarantee the display performance that it is good, more than be purpose of the present invention.
In addition, here, but be not limited thereto, adopt non-conductive film (NCF so that intervenient terminal of anisotropic conductive film (ACF) and wiring are illustrated as an example; Non-Conductive File), anisotropy conductiving glue (APC; AnisotropicConductive Paste), non-conductive glue (NCP; Non-Conductive Paste) etc. joint method is replaced under the situation of anisotropic conductive film (ACF), also same problem can take place.
In order to reach such purpose, the flexible printed circuit board that the present invention relates to, it is on circuit board, possess a plurality of conducting wirings, this conducting wiring has the wiring cabling portion of different live widths and the terminal connecting portion that is electrically connected with the input and output terminal of semiconductor chip, it is characterized in that above-mentioned terminal connecting portion makes the live width of the conducting wiring that is connected with at least one semiconductor chip identical without exception at least in the place that is connected with above-mentioned input and output terminal.
In addition, in order to reach such purpose, the manufacture method of the flexible printed circuit board that the present invention relates to, on circuit board, form a plurality of conducting wirings, this conducting wiring has the wiring cabling portion of different live widths and the terminal connecting portion that is electrically connected with the input and output terminal of semiconductor chip, it is characterized in that, form above-mentioned conducting wiring by additive process, above-mentioned terminal connecting portion makes the live width of the conducting wiring that is connected with at least one semiconductor chip identical without exception at least in the place that is connected with above-mentioned input and output terminal.
Further, in order to reach such purpose, the flexible printed circuit board that is equipped with semiconductor chip that the present invention relates to, it is the flexible printed circuit board that is equipped with semiconductor chip that makes conducting wiring and the input and output terminal of semiconductor chip on the circuit board carry out being connected, it is characterized in that, above-mentioned semiconductor chip has the different input and output terminal of size, above-mentioned conducting wiring has the wiring cabling portion of the live width of corresponding above-mentioned input and output terminal size, has the terminal connecting portion that is electrically connected with above-mentioned input and output terminal simultaneously, above-mentioned terminal connecting portion makes the live width of the conducting wiring that is connected with at least one semiconductor chip identical without exception at least in the place that is electrically connected with above-mentioned input and output terminal.
Description of drawings
Fig. 1 is the key diagram of prior art (pattern formation technology of flexible printed circuit board).
Fig. 2 is the key diagram of the problem of explanation prior art.
Fig. 3 is the key diagram of the expression flexible printed circuit board relevant with embodiments of the present invention.
Fig. 4 is the key diagram of the another one example of the expression flexible printed circuit board relevant with embodiments of the present invention.
Fig. 5 is the key diagram of the assembly method of the expression flexible printed circuit board that be equipped with semiconductor chip relevant with embodiments of the present invention and semiconductor chip.
Fig. 6 is the key diagram of the assembly method of the expression flexible printed circuit board that be equipped with semiconductor chip relevant with embodiments of the present invention and semiconductor chip.
Fig. 7 is the plane graph of expression display device, and this equipment is the example that the electronic equipment of the flexible printed circuit board that be equipped with semiconductor chip relevant with embodiments of the present invention is installed.
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described.Fig. 3 is the key diagram of the explanation flexible printed circuit board relevant with one embodiment of the present invention.
In figure (a), flexible printed circuit board 10 is to possess a plurality of conducting wirings 12 are arranged on the circuit board 11 that is made of insulating trip etc.; Conducting wiring 12 has the wiring cabling 12B of portion that does not have the terminal connecting portion of supplementary insulation film (insulating protective layer) 13 12A and covered dielectric film 13; The terminal connecting portion 12A by making conducting wiring 12 and the input and output terminal (bump, projection) of semiconductor chip are connected, and form the flexible printed circuit board (COF:Chip On Film) that is equipped with semiconductor chip thus.
When assembling semiconductor chips, generally speaking, (ACF) is mediate with anisotropic conductive film, the input and output terminal of flexible printed circuit board 10 and semiconductor chip is carried out hot press, this input and output terminal is electrically connected with conducting wiring 12, at this moment, at the hot press zone H that shows with dotted line, anisotropic conductive film is solidified and is adhered to.Below being that example is illustrated with mediate joint of anisotropic conductive film (ACF), but, be not limited thereto as embodiments of the present invention, can also adopt non-conductive film (NCF as using anisotropic conductive film (ACF); Non-Conductive Film), anisotropy conductiving glue (ACP; Anisotropic Conductive Paste), non-conductive glue (NCP; Non-Conductive Paste) joint method such as.
In the wiring pattern of the conducting wiring 12 of this flexible printed circuit board 10, the wiring cabling 12B of portion of conducting wiring 12 has the different live width (as 2 kinds of live widths of the W1 in the legend, W2) of size of the input and output terminal of based semiconductor chip, makes it possible to flow through bigger electric current at bigger input and output terminal with low resistance.
And the terminal connecting portion 12A of conducting wiring 12 is irrelevant with the different live widths of the wiring cabling 12B of portion, forms pattern, and the live width of the feasible conducting wiring that is connected with at least one semiconductor chip is identical without exception in comprising the scope of foozle.In other words, in the illustrated embodiment, have following wiring pattern, on circuit board 11, form the conducting wiring 121 of the wiring cabling 12B of portion with live width W1 and two kinds of conducting wirings 12 of the conducting wiring 122 of the wiring cabling 12B of portion with live width W2; In a kind of conducting wiring 121 of mode,, form the terminal connecting portion 12A that compares the less live width W1a of width with this live width W1 at the wiring cabling 12B of portion of the live width W1 with big width; In the conducting wiring 122 of another mode, the terminal connecting portion 12A of the live width W2 that formation is identical with the live width W1a of the terminal connecting portion 12A of conducting wiring 122 and the wiring cabling 12B of portion.
The shape of above-mentioned conducting wiring 121, it not only can be the shape (shape after making terminal connecting portion 12A and the center of the wiring cabling 12B of portion being consistent) of Fig. 3 (a), also can be as figure shown in (b) like that, terminal connecting portion 12A and shape after depart from mutually at the center of the cabling 12B of portion that connects up; But be necessary to form such pattern in terminal connecting portion 12A, the live width of the feasible conducting wiring that is connected with at least one semiconductor chip is identical without exception in comprising the scope of foozle.
In addition, in illustrated example, in a kind of conducting wiring 12 (121,122), terminal connecting portion 12A live width (W1a, W2) on the whole is the same, but in embodiments of the present invention, the live width of terminal connecting portion 12A is close in the place that is connected with the input and output terminal of semiconductor chip at least and equates just passable, for example can be only to make live width be close to the shape of the conducting wiring 12 that equates in above-mentioned hot press zone H.
Based on such execution mode, by semi-additive process (semi-additive method) or complete additive process (full-additive method) (below be referred to as additive process), even when forming the wiring pattern of conducting wiring 12, also can make the thickness of conducting wiring 12 identical without exception at least in the place that is connected with the input and output terminal of semiconductor chip in the terminal connecting portion 12A of conducting wiring 12 or terminal connecting portion 12A.In other words, forming conducting wiring 121,122 o'clock, making that in conducting wiring 121 thickness of the wiring cabling 12B of portion is different with the thickness of terminal connecting portion 12A, making that in terminal connecting portion 12A the thickness of conducting wiring 121,122 is identical by additive process.Thus, the conducting wiring 12 of flexible printed circuit board 10 and the input and output terminal of semiconductor chip are when being connected the mediate mode of carrying out hot press of anisotropic conductive film, formation can not cause the height difference of fault on the conducting wiring 12 that can be close in terminal connecting portion 12, and can not take place because the joint that height difference causes is bad yet.
In addition, the length L of the effective range by making terminal connecting portion 12A (effective range that in the scope that does not have supplementary insulation film 13, connects the input/output terminal period of the day from 11 p.m. to 1 a.m of semiconductor chip), the width LH that closes regional H than thermo-compressed is longer, more than needed to leaving the edge of dielectric film 13 from hot press zone H, the thickness of cabling 12B of portion and terminal connecting portion 12A is not simultaneously even if connect up in conducting wiring 121 thus, this thickness difference can not influence hot press zone H yet, is at least can make the thickness of conducting wiring 12 identical without exception in the H of hot press zone.
When making the related flexible printed circuit board 10 of embodiments of the present invention, same as the prior art, can on circuit board 11, form conducting wiring 12 by additive process.In other words, for example in the operation of each shown in Fig. 1, when forming the wiring pattern of conducting wirings 12 by the mask pattern 102 that has used photo resistance material etc., form such wiring pattern, make in terminal connecting portion 12A at least in the place that is connected with the input and output terminal of semiconductor chip, except that intimate equal this point of the live width of the conducting wiring 12 that is connected with at least one semiconductor chip was different, other operations all can same as the prior artly be made.
Thus, in the place that live width is equally formed, can make that to be adhered to the thickness of conducting wiring 12 of formation by electrolytic plating method identical without exception.As mentioned above, can obtain can not taking place with the input and output terminal of semiconductor chip engage bad flexible printed circuit board 10.
Fig. 4 is the figure of the another one example of the expression flexible printed circuit board 10 relevant with embodiments of the present invention.In this example, possess the wiring cabling 12B of portion in the conducting wiring 12, it has 3 kinds of live width W1, W2, W3.In this example, the same live width (W1a=W3a=W2) that in terminal connecting portion 12A, equally forms the conducting wiring 12 that is connected with at least one semiconductor chip, identical with the example among Fig. 3, even if when forming the wiring pattern of conducting wiring 12 by additive process, also can make the thickness of conducting wiring 12 among the terminal connecting portion 12A identical without exception, when being connected, can not engage bad connection with semiconductor chip.
Fig. 5 and Fig. 6 be explanation in flexible printed circuit board shown in Figure 3 10, assembled the flexible printed circuit board that is equipped with semiconductor chip (COF) of semiconductor chip and when making the key diagram of the assembly method of semiconductor chip (Fig. 5 is the sectional view of the X1-X2 during assembling semiconductor chips in Fig. 3 (a); Fig. 6 is the sectional view of the Y1-Y2 during assembling semiconductor chips in Fig. 3 (a) equally).In illustrated example, input and output terminal 21a, the 21b of semiconductor chip 20 is connected by mode anisotropic conductive film (ACP) 30 is mediate and that the terminal connecting portion 12A of conducting wiring 12 carries out hot press.
As shown in Figure 5, be provided with size (width) different input and output terminal 2a, 21b in the semiconductor chip 20.In illustrated example, be provided with width and be the input and output terminal 21a of B1 and width and be B2 (two kinds of input and output terminals of input and output terminal 21b of B1＞B2).To this, the input and output terminal 21a correspondence that width is bigger has the conducting wiring 121 of the wiring cabling 12B of portion of the bigger live width W1 of width, the less input and output terminal 21b correspondence of width is than the conducting wiring 122 of the wiring cabling 12B of portion of narrow linewidth W2, and conducting wiring 12 (121,122) is electrically connected with input and output terminal 21a, the 21b of semiconductor chip 20.
In addition, as shown in Figure 6, during to flexible printed circuit board 11 assembling semiconductor chips 20, as mentioned above, make the edge of zone that anisotropic conductive film 30 solidifies by hot press and dielectric film 13 leave the distance of nargin M, thus, the thickness of conducting wiring 121 Zi the thickness t A of the 12A of cabling portion that connects up in the transition region of the variation of the thickness t B of terminal connecting portion 12B, H does not overlap with the hot press zone.And by terminal connecting portion 12A to such conducting wiring 12, be connected with input and output terminal 21a, the 21b of semiconductor chip 20 anisotropic conductive film 30 is mediate, make at the same identical terminal connecting portion 12A of the thickness that does not have height difference, the hot press that input and output terminal 21a, 21b is connected and has applied pressure P becomes possibility, can realize can not engaging bad connection.
In addition, the example that is electrically connected that carries out conducting wiring 12 and input and output terminal 21a, the 21b of semiconductor chip 20 by betwixt hot press that anisotropic conductive film 30 is situated between has been described in the above-described embodiment, but embodiments of the present invention are not limited thereto, and for example also can engage other junctures such as (eutectic-junction epoxydie bonding), metal bond by eutectic adapter ring epoxy resins tube core and implement.
Fig. 7 is the plane graph of expression display device, and this equipment is the example that the electronic equipment of the flexible printed circuit board that be equipped with semiconductor chip relevant with above-mentioned execution mode is installed.What here introduced is the example that the flexible printed circuit board that is equipped with semiconductor chip (COF) that will be equipped with semiconductor chip 20 on the flexible printed circuit board 10 is connected with organic EL display apparatus, liquid crystal display (LCD), field emission display device (FED), plasma display panel device flat display devices 40 such as (PDP).The extraction electrode 40A that this flexible printed circuit board that is equipped with semiconductor chip can form with the one side at display device 40 is connected, and can also wait other electric parts to be connected with PWB (hard substrate) 50.
Display device based on the flexible printed circuit board that is equipped with semiconductor chip that this execution mode has been installed, by adopting the conducting wiring 12 in COF, have with the flexible printed circuit board of the corresponding to wiring cabling 12B of portion of size of the input and output terminal of semiconductor chip, each input and output terminal can carry out high-precision the connection with conducting wiring 12, therefore can provide the drive current that does not have deviation that sets to display device.Thus, particularly can directly have influence on the organic EL display apparatus of display performance, can obtain good display performance for the size of drive current.
As mentioned above, based on embodiments of the present invention, have in the flexible printed circuit board that the conducting wiring of the wiring cabling portion of suitable live width forms by having the different input and output terminal of corresponding semiconductor chip size, do not adopt special processing and manufacture method, only be to change the conducting wiring pattern, just can make the thickness of conducting wiring of terminal connecting portion identical without exception, solve the problem of the loose contact that takes place between the input and output terminal of the conducting wiring of flexible printed circuit board and connecting object thus.
In other words, at semiconductor chip, when forming the wiring pattern of the conducting wiring of fitting mutually with it, also can obtain contactless bad high-precision COF with the different input and output terminal of size.In addition, guaranteed rational cloth line resistance thus and made the rationalization of drive current become possibility, made, particularly in drive current can directly have influence on the organic EL display apparatus of display performance, can guarantee the display performance that it is good at electronic equipment.
Claims (8)
1. flexible printed circuit board, it possesses a plurality of conducting wirings on circuit board, this conducting wiring has the wiring cabling portion of different live widths and the terminal connecting portion that is electrically connected with the input and output terminal of semiconductor chip, this flexible printed circuit board is characterised in that
Above-mentioned terminal connecting portion makes the live width of the conducting wiring that is connected with at least one semiconductor chip identical without exception at least in the place that is connected with above-mentioned input and output terminal.
2. flexible printed circuit board as claimed in claim 1 is characterized in that, above-mentioned conducting wiring comprises the thickness of above-mentioned wiring cabling portion and the thickness different situations of above-mentioned terminal connecting portion.
3. flexible printed circuit board as claimed in claim 1 is characterized in that, the width of the effective range of above-mentioned terminal connecting portion is wideer with the mediate width by the hot press zone of hot press of anisotropic conductive film than above-mentioned input and output terminal.
4. as any described flexible printed circuit board among the claim 1-3, it is characterized in that above-mentioned conducting wiring forms by additive process.
5. the manufacture method of a flexible printed circuit board, it forms a plurality of conducting wirings on circuit board, this conducting wiring has the wiring cabling portion of different live widths and the terminal connecting portion that is electrically connected with the input and output terminal of semiconductor chip, the manufacture method of this flexible printed circuit board is characterised in that
Form above-mentioned conducting wiring by additive process, above-mentioned terminal connecting portion makes the live width of the conducting wiring that is connected with at least one semiconductor chip identical without exception at least in the place that is connected with above-mentioned input and output terminal.
6. flexible printed circuit board that is equipped with semiconductor chip, the input and output terminal of semiconductor chip is connected with conducting wiring on the circuit board, it is characterized in that, above-mentioned semiconductor chip has the different input and output terminal of size, above-mentioned conducting wiring has the wiring cabling portion of the live width of corresponding above-mentioned input and output terminal size, has the terminal connecting portion that is electrically connected with above-mentioned input and output terminal simultaneously, above-mentioned terminal connecting portion makes the live width of the conducting wiring that is connected with at least one semiconductor chip identical without exception at least in the place that is electrically connected with above-mentioned input and output terminal.
7. the flexible printed circuit board that is equipped with semiconductor chip as claimed in claim 6, it is characterized in that, above-mentioned input and output terminal and above-mentioned terminal connecting portion be by being electrically connected the mediate mode of carrying out hot press of anisotropic conductive film, do not have the width of scope of supplementary insulation film wideer than the width of the consolidation zone of above-mentioned anisotropic conductive film in above-mentioned terminal connecting portion.
8. be equipped with as claim 6 or the 7 described electronic equipments that are equipped with the flexible printed circuit board of semiconductor chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP189980/04 | 2004-06-28 | ||
| JP2004189980A JP4443324B2 (en) | 2004-06-28 | 2004-06-28 | Flexible wiring board and manufacturing method thereof, semiconductor chip mounting flexible wiring board, electronic device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101659890A Division CN101674705B (en) | 2004-06-28 | 2005-06-28 | Flexible wiring substrate and preparing method, flexible wiring substrate of distribution chip and electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1717147A true CN1717147A (en) | 2006-01-04 |
| CN1717147B CN1717147B (en) | 2010-05-05 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005100811303A Active CN1717147B (en) | 2004-06-28 | 2005-06-28 | Flexible wiring substrate and preparing method, flexible wiring substrate of distribution chip and electronic apparatus |
| CN2009101659890A Active CN101674705B (en) | 2004-06-28 | 2005-06-28 | Flexible wiring substrate and preparing method, flexible wiring substrate of distribution chip and electronic apparatus |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101659890A Active CN101674705B (en) | 2004-06-28 | 2005-06-28 | Flexible wiring substrate and preparing method, flexible wiring substrate of distribution chip and electronic apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4443324B2 (en) |
| KR (1) | KR20060048605A (en) |
| CN (2) | CN1717147B (en) |
| TW (1) | TW200601915A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026923B (en) * | 2006-02-17 | 2010-06-30 | 株式会社藤仓 | Printed wiring board and connection configuration of the same |
| CN101206681B (en) * | 2006-12-21 | 2011-05-18 | 英业达股份有限公司 | Signal wire regulation means and system |
| CN102131344B (en) * | 2009-11-19 | 2013-01-09 | 友达光电股份有限公司 | Layout method and circuit board |
| CN103928415A (en) * | 2013-03-01 | 2014-07-16 | 厦门天马微电子有限公司 | Structure of pin region |
| WO2018214653A1 (en) * | 2017-05-22 | 2018-11-29 | 京东方科技集团股份有限公司 | Touch display panel and liquid crystal display device |
| WO2023087210A1 (en) * | 2021-11-18 | 2023-05-25 | Boe Technology Group Co., Ltd. | Driving apparatus, display apparatus, and method of fabricating driving apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201007989Y (en) * | 2007-02-06 | 2008-01-16 | 北京京东方光电科技有限公司 | Left-and-right pendulum type wiring structure |
| JP5528906B2 (en) * | 2010-05-28 | 2014-06-25 | 株式会社ジャパンディスプレイ | Display device |
| JP7006062B2 (en) * | 2016-11-18 | 2022-02-10 | 株式会社リコー | Wiring board, wiring member, liquid discharge head, liquid discharge unit, liquid discharge device |
| US10149382B2 (en) | 2016-11-18 | 2018-12-04 | Ricoh Company, Ltd. | Wiring substrate, wiring member, liquid discharge head, liquid discharge device, and liquid discharge apparatus |
| JP7306337B2 (en) * | 2020-06-25 | 2023-07-11 | トヨタ自動車株式会社 | Wiring board manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204067A (en) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Ind Co Ltd | Method of manufacturing circuit board module |
-
2004
- 2004-06-28 JP JP2004189980A patent/JP4443324B2/en active Active
-
2005
- 2005-06-03 TW TW094118442A patent/TW200601915A/en unknown
- 2005-06-28 CN CN2005100811303A patent/CN1717147B/en active Active
- 2005-06-28 CN CN2009101659890A patent/CN101674705B/en active Active
- 2005-06-28 KR KR1020050056207A patent/KR20060048605A/en not_active Application Discontinuation
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026923B (en) * | 2006-02-17 | 2010-06-30 | 株式会社藤仓 | Printed wiring board and connection configuration of the same |
| US7974104B2 (en) | 2006-02-17 | 2011-07-05 | Fujikura Ltd. | Printed wiring board and connection configuration of the same |
| US8345436B2 (en) | 2006-02-17 | 2013-01-01 | Fujikura Ltd. | Printed wiring board and connection configuration of the same |
| CN101206681B (en) * | 2006-12-21 | 2011-05-18 | 英业达股份有限公司 | Signal wire regulation means and system |
| CN102131344B (en) * | 2009-11-19 | 2013-01-09 | 友达光电股份有限公司 | Layout method and circuit board |
| CN103928415A (en) * | 2013-03-01 | 2014-07-16 | 厦门天马微电子有限公司 | Structure of pin region |
| WO2018214653A1 (en) * | 2017-05-22 | 2018-11-29 | 京东方科技集团股份有限公司 | Touch display panel and liquid crystal display device |
| US11163386B2 (en) | 2017-05-22 | 2021-11-02 | Boe Technology Group Co., Ltd. | Touch display panel and liquid crystal display device |
| WO2023087210A1 (en) * | 2021-11-18 | 2023-05-25 | Boe Technology Group Co., Ltd. | Driving apparatus, display apparatus, and method of fabricating driving apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101674705B (en) | 2011-12-28 |
| CN101674705A (en) | 2010-03-17 |
| KR20060048605A (en) | 2006-05-18 |
| JP4443324B2 (en) | 2010-03-31 |
| TWI347155B (en) | 2011-08-11 |
| CN1717147B (en) | 2010-05-05 |
| TW200601915A (en) | 2006-01-01 |
| JP2006013230A (en) | 2006-01-12 |
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