CN1695229A - 用于减少衬底处理室中的杂散光的设备和方法 - Google Patents
用于减少衬底处理室中的杂散光的设备和方法 Download PDFInfo
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- CN1695229A CN1695229A CNA038248980A CN03824898A CN1695229A CN 1695229 A CN1695229 A CN 1695229A CN A038248980 A CNA038248980 A CN A038248980A CN 03824898 A CN03824898 A CN 03824898A CN 1695229 A CN1695229 A CN 1695229A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
- F27B5/04—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Abstract
Description
Claims (47)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/288,271 | 2002-11-05 | ||
US10/288,271 US6835914B2 (en) | 2002-11-05 | 2002-11-05 | Apparatus and method for reducing stray light in substrate processing chambers |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1695229A true CN1695229A (zh) | 2005-11-09 |
CN100364038C CN100364038C (zh) | 2008-01-23 |
Family
ID=32175878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038248980A Expired - Lifetime CN100364038C (zh) | 2002-11-05 | 2003-07-22 | 用于减少衬底处理室中的杂散光的设备和方法 |
Country Status (8)
Country | Link |
---|---|
US (3) | US6835914B2 (zh) |
JP (1) | JP4937513B2 (zh) |
KR (1) | KR101057841B1 (zh) |
CN (1) | CN100364038C (zh) |
AU (1) | AU2003265297A1 (zh) |
DE (1) | DE10393617B4 (zh) |
TW (1) | TWI226941B (zh) |
WO (1) | WO2004044961A1 (zh) |
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CN102576676A (zh) * | 2009-10-09 | 2012-07-11 | 应用材料公司 | 用于改善控制加热和冷却基板的设备与方法 |
CN102820208A (zh) * | 2011-06-08 | 2012-12-12 | 无锡华润上华半导体有限公司 | 快速热处理中控制晶片温度的方法及其快速热处理方法 |
CN106158622A (zh) * | 2014-11-12 | 2016-11-23 | 台湾积体电路制造股份有限公司 | 用于热映射和热工艺控制的方法和装置 |
CN110230098A (zh) * | 2018-03-06 | 2019-09-13 | 哈尔滨理工大学 | 镱铕双掺杂铌酸锂晶体及其制备方法 |
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CN102077335A (zh) * | 2008-07-01 | 2011-05-25 | 应用材料股份有限公司 | 在热处理期间用于测量辐射能的设备和方法 |
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CN102077335B (zh) * | 2008-07-01 | 2014-04-16 | 应用材料公司 | 在热处理期间用于测量辐射能的设备和方法 |
CN102576676A (zh) * | 2009-10-09 | 2012-07-11 | 应用材料公司 | 用于改善控制加热和冷却基板的设备与方法 |
CN108615674A (zh) * | 2009-10-09 | 2018-10-02 | 应用材料公司 | 用于改善控制加热和冷却基板的设备与方法 |
CN102820208A (zh) * | 2011-06-08 | 2012-12-12 | 无锡华润上华半导体有限公司 | 快速热处理中控制晶片温度的方法及其快速热处理方法 |
CN102820208B (zh) * | 2011-06-08 | 2015-04-22 | 无锡华润上华科技有限公司 | 快速热处理中控制晶片温度的方法及其快速热处理方法 |
CN106158622A (zh) * | 2014-11-12 | 2016-11-23 | 台湾积体电路制造股份有限公司 | 用于热映射和热工艺控制的方法和装置 |
CN110230098A (zh) * | 2018-03-06 | 2019-09-13 | 哈尔滨理工大学 | 镱铕双掺杂铌酸锂晶体及其制备方法 |
Also Published As
Publication number | Publication date |
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AU2003265297A1 (en) | 2004-06-03 |
US20040084437A1 (en) | 2004-05-06 |
DE10393617T5 (de) | 2005-08-25 |
WO2004044961A1 (en) | 2004-05-27 |
JP2006505946A (ja) | 2006-02-16 |
JP4937513B2 (ja) | 2012-05-23 |
CN100364038C (zh) | 2008-01-23 |
DE10393617B4 (de) | 2015-10-22 |
US7358462B2 (en) | 2008-04-15 |
KR101057841B1 (ko) | 2011-08-19 |
US6835914B2 (en) | 2004-12-28 |
TWI226941B (en) | 2005-01-21 |
US7135656B2 (en) | 2006-11-14 |
US20060289434A1 (en) | 2006-12-28 |
US20050098552A1 (en) | 2005-05-12 |
KR20050073605A (ko) | 2005-07-14 |
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