CN1689376B - 基于led的组合灯 - Google Patents

基于led的组合灯 Download PDF

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CN1689376B
CN1689376B CN038237571A CN03823757A CN1689376B CN 1689376 B CN1689376 B CN 1689376B CN 038237571 A CN038237571 A CN 038237571A CN 03823757 A CN03823757 A CN 03823757A CN 1689376 B CN1689376 B CN 1689376B
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light
radiator
led
electronic building
building brick
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CN1689376A (zh
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托米斯拉夫·J·什蒂马茨
詹姆士·T·彼得罗斯基
罗伯特·J·申德勒
格雷格·E·伯克霍尔德
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Current Lighting Solutions LLC
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/65—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/357—Driver circuits specially adapted for retrofit LED light sources
    • H05B45/3574—Emulating the electrical or functional characteristics of incandescent lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
    • F21V14/06—Controlling the distribution of the light emitted by adjustment of elements by movement of refractors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/37—Converter circuits
    • H05B45/3725—Switched mode power supply [SMPS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

灯(10)包括光学组件(12)和电子组件(14、60、70)。光学组件(12)包括多个安装在印刷电路板(18)上并具有多个输入导线的LED(16)，和具有用于输入导线的导管(40)的散热器(22)。多个LED(16)与散热器(22)热导通。电子组件(14、60、70)适于通过输入导线为多个LED(16)提供动率。电子组件(14、60、70)具有适于与散热器(22)刚性连接的第一端(52)，和安装在第二端用于接收电功率的选定电连接器(50、62、72)。电子组件(14、60、70)进一步包括其内部用于与所接收的电功率(82)适配而驱动LED(16)的电路(80)。

Description

基于LED的组合灯
技术领域
本发明涉及照明技术。本发明特别适用于MR/PAR型灯和照明系统，将具体参照这二者描述本发明。另一方面，本发明也可应用于组合式照明设备、诸如闪光灯的便携照明应用、利用基于LED的灯改装白炽灯和其他类型的灯、计算机控制的舞台或摄影棚的照明应用等等。
背景技术
MR/PAR型灯通常指具有集成的定向反射镜和可选择集成的覆盖透镜的白炽灯，用于产生具有选定光束范围的定向光束，例如点光束或泛光束。所集成的反射器通常为使用双色玻璃反射材料制成的镜面反射器类型，或抛物线型铝制反射器类型。反射器的选择可影响热分布、光斑尺寸、灯效率、和其他性能。MR/PAR灯可适用于很大的反射器尺寸范围，通常用1/8英寸的倍数表示。例如，PAR-16型灯具有直径为2英寸的抛物线型反射器。在本技术领域中，术语MR灯、PAR灯、MR/PAR灯等等通常指的是具有标准尺寸、形状、和电连接器的定向灯。商业MR/PAR灯作为整体装置进行生产和销售，包括白炽灯光源、与光源结合来产生诸如点光束或泛光束的具有选定光束范围的光束的反射器、以及带有集成的标准电连接器并且通常还能在相关的照明器材中为灯提供机械支持的标准化底座。许多商业MR/PAR灯还包括安装用来接收从反射器射出的光线的透镜或玻璃罩、防水外壳(可选地，可由防破碎材料制造)、或其他部件。防水“密封”MR/PAR灯特别适合户外应用或在其他恶劣环境条件下使用。
现有的商业MR/PAR灯可以与大范围的电输入标准兼容。其中一些设定为接受交流线路电源总线电压，美国通常为110V或欧洲为220V。低电压灯被设定接收较低的电压，通常为12V，但在商业上也可以使用其他诸如6V或24V的电压。低电压通常由110V或220V电源总线通过低压变压器或其他的MR/PAR灯外部的功率调节装置提供。
电功率通常通过标准电底座提供给灯。然而，现有多种这样的标准底座，包括螺纹(螺旋型)连接底座、双管脚(双针)连接底座、卡口型连接底座等。很多这样的标准底座适用于多种尺寸或复杂的结构。例如，本技术所周知的GU型连接器具有多种尺寸和结构，通常用GU-x表示，此处，x为尺寸参数。
在欧洲，最通用的电输入标准采用接收220V交流输入的GU-10连接器。在美国，最通用的电输入标准采用螺纹型连接器，该连接器就是众所周知的配置用来接收110V交流输入的螺口连接器。有时称为“MR”标准的通用低电压电输入标准使用的是用来接收12V直流的GU-5.3连接器。然而，除了这些标准配置以外，大量的其他连接器/电源结构也可用于更为特定的用途中，具体来说可用于诸如建筑或剧院灯光的特殊应用中。
带有集成电子控制器的MR/PAR灯也越来越多地被制造出来，特别是用于诸如摄影棚或舞台灯光的高端应用。在一个周知的实施方式中，12V直流MR灯接收叠加在12V功率输入上的DMX-512控制信号。由安装在内部并与MR灯集成的微型处理器所组成的DMX控制器接收该控制信号，并响应于接收的控制指令可选择地更改灯的操作，例如，改变灯的亮度和色彩。仅仅包括单个发光灯丝的白炽MR/PAR灯不能单独地实现颜色控制。因此，通过几个不同颜色的MR灯的结合实现DMX颜色控制，例如，使用红色、绿色、和蓝色的聚光灯。其他的诸如PDA或CAN的控制器接口协议也为人所周知。与使用叠加在功率输入上的交流输入信号不同的是，在其他的实施例中，在MR/PAR灯内部结合了射频(rf)接收器，用来接收rf控制信号。
MR/PAR灯使用多种发光机构。除了白炽灯外，卤化钨MR/PAR灯也非常流行。在这些灯中，卤素气体环境和钨灯丝之间的化学反应持续地将从灯丝飞溅出的钨反射回灯丝。这样，与普通白炽灯相比，减少了光亮度和颜色特性随时间的降低。使用其他类型的诸如气体放电管的发光元件的MR/PAR灯已经为人们所熟知，但获得的商业认可较少。
特别是，基于发光二极管(LED)的MR/PAR型灯已经为人们所知。LED是响应于电输入而发光的固态光电器件。LED，特别是基于氮化镓(GaN)和铟镓铝磷(InGaAlP)的LED，由于其耐久性、安全的低电压操作、以及长操作寿命，正越来越多地在照明应用中使用。当前的LED产生的光输出功率相对较低，因此基于LED的MR/PAR灯通常包括共同作用而作为单光源使用的LED阵列。因为大多数LED产生基本上为定向的光输出，所以基于LED的MR/PAR灯可选择不使用反射器，或者使用与在白炽灯或卤素MR/PAR灯中使用的反射器完全不同的反射器。
目前，基于LED的MR/PAR灯不是商业主流。一部分原因是由于，使用LED阵列进行的电输入与传统白炽型MR/PAR灯相关的输入相比有非常大的差别，这些显著的差别可能导致LED改型的开发和生产成本的大部分将转移到功率调节电子器件和相关的电连接器上。为了商业竞争，基于LED的MR/PAR灯应方便地与设计用来操作白炽灯或卤素MR/PAR灯的现有灯架进行可互换电连接。
实现电连接互换性的困难由于在MR/PAR灯工业中使用的大量的电功率输入标准而增加，包括电压输入范围从大约6伏到220伏以上，电压输入为交流或者直流型，以及大量不同的标准化电源连接底座。倾向于包括使用不同通信路径(例如，无线电频率与叠加的交流线对比)和不同通信协议(例如，DMX、PDA、或CAN)的遥控接口的趋势进一步分割了基于LED的MR/PAR灯的市场。MR/PAR灯工业的电源和通信标准的多样性影响了基于LED的灯的生产商生产并维持非常宽的包括大量不同的灯样式的灯存货、很难证明是否正确的所给出的基于LED的MR/PAR灯的当前市场份额的计划、以及通常情况下MR/PAR灯市场的分割情况。
本发明考虑提供一种经过改进的装置和方法，来克服上述的限制和其他不利条件。
发明内容
根据本发明的一个实施例，披露了一种包括光学组件和电子组件的灯。光学组件包括多个用于发光的LED、和与LED热连接的散热器。散热器具有用于将经过调节的电功率传输给LED的电导管。电子组件包括适于接收输入电功率的输入电接口，和与光学组件刚性连接的用于将经过调节的电功率输送给电导管的输出耦合器。电子组件进一步包括用于将输入电接口电连接到输出耦合器上的电调节电路。
根据本发明的另一个实施例，披露了一种用于连接相关灯到相关电源的装置。该相关灯具有一个或多个发光二极管(LED)和用于将经过调节的电功率传送给LED的第一耦合元件。该装置包括适于有效地连接到相关电源上用来接收输入电功率的输入电接口、和适于与第一耦合元件结合用来选择性可拆卸地将光学组件与该装置连接到一起的第二耦合元件。第二耦合元件适于与第一耦合元件电连接，用来将经过调节的电功率传输到第一耦合元件。该装置还包括将输入电接口与第二耦合元件相连接的电调节电路。电调节电路将输入电接口处的输入电功率转换成第二耦合元件处的经过调节的电功率。
根据本发明的另一实施例，披露了一种发光装置。散热器具有第一侧、第二侧、和连接第一侧和第二侧的导管。第二侧适于与相关的多个电适配器中的任何一个相连，其中每一个适配器适于将选定的电输入功率转换成经过调节的输出电功率。该发光装置还包括多个安装在散热器的第一侧的发光二极管，并与其热导通。发光二极管通过导管接收来自选定适配器的经过调节的电功率。
根据本发明的再一个实施例，提供了一种利用基于LED的灯改装用来在电插座中接收MR型或PAR型灯的灯架的方法。选择基于LED的灯，使其至少符合MR型或PAR型灯的直径。选择连接器组件，使其与灯架的电插座相配。所选择的基于LED的灯和所选择的连接器组件机械地连接组成基于LED的改型装置，机械连接实现了两者之间的电连接。
根据本发明的又一个实施例，披露了一种包括光学组件和电子组件的灯。光学组件包括设置在印刷电路板上的多个LED，和具有用于通过散热器传送电功率的导管的散热器。多个LED与散热器热导通。电子组件适于通过散热器的电导管传送功率给多个LED。电子组件具有适于与散热器刚性连接的第一端，以及安装在第二端上用于接收电功率的选定的电连接器。电子组件进一步包括设置在内部用来适配所接收的电功率而驱动LED的电路。
本发明的一个优势在于它的模块化设计，这种设计使得单个基于LED的光学组件能够与多个不同的电源连接。这使得制造商只需要生产并贮备单一类型的可与多种不同电源兼容的光学组件。
本发明的另一个优势在于它的模块化设计，这种设计使得终端用户能够通过选择性地安装合适的电子组件，将灯用在使用不同的电源插座和/或提供不同类型电功率的不同灯架中。
本发明的另一个优势在于它的模块化设计，这种设计使得制造商或终端用户能够通过选择性地安装结合了选定控制协议的合适的电路接口，而从诸如DMX、CAN、或PDA等用于控制灯的控制协议中进行选择。
本发明的再一个优势在于散热器的安装，该散热器的一端连接到LED照明组件上，同时相对端连接到电子组件上，来组成能够对LED照明组件和电子组件都进行散热的组合灯。
在阅读并理解了随后的详细描述的技术之后，本发明的众多优势和好处对于本领域普通技术人员将更加明显。
附图说明
本发明可以用不同的部件及部件设置、以及不同的步骤及其排列进行实施。附图仅仅用于解释说明优选实施例，并不是用于限制本发明。
图1示出了根据本发明的实施例所形成的组合灯的分解图。
图2A示出了图1中的灯的电子组件，该组件包括GU型双针连接器。
图2B示出了与图1中的灯的光学组件兼容的另一个电子组件，其中，图2B中的电子组件包括一个不同的GU型双针连接器。
图2C示出了与图1中的灯的光学组件兼容的又一个电子组件，其中，图2C中的电子组件包括一个爱迪生型螺纹连接器。
图3示出了典型电子组件的功率调节电路的示意图。
具体实施方式
参照图1，典型的组合灯10包括光学组件12和配套的电子组件14。光学组件12包括多个发光二极管(LED)16，在图中所示的实施例中有6个设置在印刷电路(pc)板18上的LED 16。在单个LED能够提供足够的光亮度的应用情况下，同样可以考虑仅仅使用单个高亮度LED来代替多个LED 16。pc板18提供良好的电绝缘性和良好的热导性，可包括排列在pc板上用于连接pc板上的LED 16的导电迹线(没有示出)。排列在pc板18上的LED 16将共同作为LED组件20在本文中提及。
在一个适当的实施例中，LED 16是白色LED，每一个都由与包含一种或多种磷光体的涂层连接的基于氮化镓(GaN)的发光半导体器件组成。基于GaN的半导体器件发出蓝光和/或紫外波段的光，并且激发磷光体涂层产生更长波长的光。经过合成的光输出近似为白色的输出光。例如，产生蓝光的基于GaN的半导体器件能够与黄色荧光体结合生成白光。另外，产生紫外光的基于GaN的半导体器件可以与红色、绿色、以及蓝色磷光体以一定比率和配置来进行组合，产生白色光。在另一个适当的实施例中，使用的是有色的LED，例如发出红色或绿色光的基于磷化物的半导体器件，在这种情况下，灯10产生相应颜色的光。在再一个适当的实施例中，LED组件20包括以经过选择的图案分布在pc板18上的红色、绿色、和蓝色LED，以利用红-绿-蓝(RGB)颜色组合排列产生选定颜色的光。在这个后一典型实施例中，通过具有选定光亮度的红色、绿色、和蓝色LED的选择性操作，可以设定LED组件20发出可选择的颜色。
LED组件20设置在散热器22上，该散热器提供用来将由LED16操作产生的热量从LED组件20除去。典型的散热器22包括多个用于除去热量的热辐射散热片23。当然，也可以用其他类型的热辐射结构代替。在适当的配置中，LED组件20通过热胶带25粘结在散热器22的接收表面24上，该热胶带在LED组件20和散热器22之间提供了高效导热界面。在一个适当的实施例中，使用由Chomerics(Parker Hannifin有限公司的一个部门)提供的TherattachTMT404热胶带，并且在25℃环境中，散热器足以将光学组件12的接触温度维持在70℃。
可选择地，光学组件12包括另外的光学部件，用于定形光分布、执行光谱过滤、光极化等。在所示的灯10中，可滑动的变焦透镜系统26接收由LED组件20产生的光，并提供可调整的点光束聚焦。变焦透镜系统26包括具有与六个LED 16相对应的六个独立的透镜30的透镜组件28，和固定到透镜组件28上并通过LED组件20中的凹槽34将透镜组件28与LED组件20对准的对准框32。透镜系统26可滑动调节，以改变透镜30和LED 16之间的距离，来实现可变点光束变焦。该滑动机构通过夹片36紧固到散热器22的凹槽38内而限定。夹片36进一步用来将变焦透镜系统26固定在散热器22上。
典型的光学组件12包括发光元件16、配套的光学元件26、以及散热器22。然而，光学组件12仅仅包括限制在pc板18上非常有限的电子元件和安装在电导管40内穿过散热器22的电导线(没有示出)。在一个适当的实施例中，LED 16都是相同类型的，并且彼此以串联、并联、或串并联电组合的连接方式在pc板18上互相连接，该pc板进而与正负输入导线连接。在另一个适当的实施例中，LED 16包括红色、绿色、和蓝色LED，每一个都连接组成单独的电路，并且共有六根输入导线(红色LED的正负导线；绿色LED的正负导线；以及蓝色LED的正负导线)。当然，本领域技术人员也可以选择其他电子配置。
光学组件12的电源要求实质上是由LED 16的电特性和由pc板18的导电迹线组成的电路决定的。典型的LED最好在几百个毫安或更小的电流下以及例如4个伏特的几个电压的情况下操作。因此，光学组件12最好在几伏特到几十伏特下，并且在几百毫安到几安培下驱动，这取决于pc板18上排列的电连接方式，例如串连、并联、或串并联。
电子组件14在散热器22上LED组件20的相对端处与光学组件12机械连接和电连接。电子组件14包括合适的电输入连接器和输出耦合器52，其中，电输入连接器为在图1的实施例中本领域周知的GU型双针连接器50，而输出耦合器适于与散热器22机械连接，并且与LED组件20的导线(没有示出)电连接。电连接器50适于与选定的电源连接，例如通常在欧洲使用的标准电压240V交流、50Hz的电源。
继续参照图1，并进一步参照图2，灯10是组合式的。通过选择合适的电子组件，利用包括不同类型电连接器的各种类型的电输入端可以运转光学组件12。例如，图1和图2A中所示的GU型连接器14可以选择性地由另一种在图2B中所示具有不同的粗针62的GU连接器60来代替。在适当的实施例中，第一电子组件包括用于连接240V交流50Hz电源的GU-10型电连接器，同时，第二电子组件包括用于连接12V直流电源的GU-5.3型电连接器。如图2C中所示，选择性使用具有爱迪生型螺纹连接器72的连接器70。电子组件14、60、70仅仅是示例性的。本领域技术人员可以选择其他适当的用于使用其他电输入端向光学组件12供电的连接器。
进一步来讲，尽管各种类型的电连接器50、62、72在各种电子组件14、60、70中实施，但是这些电子组件包括同样的输出耦合器52，在所示出的实施例中，该输出耦合器通过搭扣配合而连接到散热器22上，同时实现电子组件14、60、70和光学组件12之间的电连接。各种电子组件14、60、70上的输出耦合器52除了具有普通的机械连接外，该输出耦合器52还提供同样的经过调节的电功率给光学组件12。这样，光学组件12就不受具体电源的限制。由于在电子组件14、60、70与光学组件12之间的连接与电源没有直接联系，所以该连接可以使用各种机械形式。该连接应该是一种刚性连接，使得灯10组成一个整体的刚性体。除了所示出的搭扣配合以外，还可以考虑使用其他的机械结构来实现电子组件和光学组件之间的电连接和机械连接，例如，扭转锁、弹簧加载连接、螺钉或其他辅助固定件等等。
以上的连接方式最好可进行选择性的拆卸，以使终端用户可以为应用来选择并安装合适的电子组件。另外，也可以使用诸如焊接或铆接的永久连接。尽管这样的永久连接没有为终端用户提供电输入模块化，但由于生产商可以生产并贮备单一类型的光学组件，所以方便了生产商。当接到灯的订单时，选择合适的电子组件，并将其永久地连接到光学组件上。永久连接还有利于使灯更加可靠并且更加不受天气影响，包括例如在连接处使用粘结密封胶，并且这样更适于户外应用。
继续参照图1和图2A～2C，并进一步参照图3，各个电子组件14、60、70也包含适当的电子部件80，用于将输入电源功率82(由连接器50、62、70中的一个所接收)转换成传送给输出耦合器52并适于驱动光学组件12的经过调节的输出电功率。在步骤84中调节所接收的输入功率82。由于LED最好由直流电流驱动，所以在交流输入情况下的调节步骤84最好还包括整流。在一个适当的实施例中，使用了一种本技术周知类型的开关电源，用于交流输入功率82的功率调节和整流84，并且可选地进行EM/RFI滤波。当然，用来执行调节步骤84的详细电路依赖于输入电源的类型和光学组件12所需的功率输出。本领域的技术人员可以选择出合适的电子设备和元件参数，来执行功率调节步骤84。
在一个实施例中(没有示出)，直接将调节步骤84的输出提供给输出耦合器52，来驱动光学组件12。然而，在图3所示的实施例中，使用网络协议选择性地控制灯10，即图3中的DMX-512协议。如照明领域的技术人员所知，适当的实施例中的DMX-512协议包括叠加在所接收的功率82上的低振幅、高频率控制信号。因此，在步骤86中，通过高阻抗滤波电路将DMX控制信号从输入功率中分离出来，并且在步骤88中，通过微型处理器、DMX-512微型控制器、或特定用途集成电路(ASIC)进行解码。
DMX-512协议用来至少控制光的亮度和颜色。在白炽灯中，光颜色的控制通常通过协作控制多个这样的灯，例如，协作控制红色、绿色、和蓝色舞台聚光灯，来获得选定的亮度和颜色。因为LED组件可以包括多个不同颜色的LED，例如，红色、绿色、和蓝色LED，所以，在相同组件中，通过单独控制提供给红色、绿色、和蓝色LED的电功率，可利用DMX-512控制器对单独LED组件进行颜色控制。
继续参照图3，在步骤90中，通过解码步骤88提供的解码DMX信号被用来调整LED的功率，并且在步骤92中，也选择性地用来调整灯的颜色，后者可应用于LED组件20包括多个不同颜色的LED的实施例中。例如，LED功率调节步骤90可以实现调光开关操作。在RGB实施例中，步骤92的输出是分别相应于红色、绿色、和蓝色LED电源线的三个输出功率调节信号94R、94G、和94B。当然，对于单色灯来说，可以忽略颜色调节步骤92，并且只有单一的经过调节的输出功率(可选地，由步骤90调节的功率)被提供给输出耦合器52，用来驱动光学组件12。
尽管在图3中示出了使用DMX-512网络协议进行的灯控制，但是本领域技术人员将意识到，其他控制协议可以结合或代替DMX-512控制协议来使用。例如，可以在电子组件14、60、70中结合CAN或PDA的网络能力。此外，由于控制包含在电子组件的内部，并且对于光学组件12来说是独立且显而易见的，所以每个电子组件可以具有不同的控制器或可以根本没有控制器。因此，将灯10从DMX-512控制转换为CAN网络协议仅仅涉及电子组件的替换。
在适当的实施例中，电子部件80设置在电子组件14、60、70的内部一个或多个印刷电路板(没有示出)上和/或设置为一个或多个集成电路。电子组件14、60、70最好灌注有热灌注混合物，来提高抗振和防震能力，改进电子设备的散热性能，并且除去水气和其他的污染物。
如果电子组件14、60、70和散热器22之间的连接是热导性的，则散热器22除了为LED组件20提供散热功能以外，也能为电子组件14、60、70提供散热功能。在电子组件14、60、70与散热器22的永久的、不可拆卸的连接中，可以通过例如将元件与热导焊料焊接在一起，来提高导热性。对于可拆卸安装，可以将热导盘或其他元件(没有示出)插入其间，来提高导热性。
本领域的技术人员将认识到，所描述的灯10克服了LED灯生产商先前想方设法想要解决的问题。例如，具有或没有光学变焦特性26的灯10适于在包括多种类型的电插座中的一种的灯架中代替传统的MR型或PAR型灯。选择符合机械连接和插座电特性的电子连接器组件14、60、70，并由工厂或终端用户连接到光学组件12上，从而组成以通常方式(例如，当使用爱迪生型螺纹连接器时，将基于LED的灯旋入)安装到灯架的电插座中的基于LED的改型灯。选择光学组件12，来提供期望的光学输出，例如，期望的亮度和光斑尺寸。进一步选择光学组件12，使其基本上至少符合MR型或PAR型灯的直径。这样，例如，PAR-20灯可由具有2.5英寸直径或稍小直径的光学组件12代替。当然，如果期望该改型灯与诸如DMX、CAN、或PDA的选定控制协议兼容，则要选择带有合适控制器的控制组件，并与光学组件12连接组成灯。
本发明已经参照优选实施例进行了描述。显然，在阅读并理解了先前描述的说明书的基础上，可以进行修改和替换。符合本发明的权利要求范围或其等同物范围以内的所有修改和替换都将为本发明所涵盖。

Claims (14)

1.一种发光装置，包括：
散热器，具有第一外侧、与所述第一外侧相对的第二外侧、以及连接所述第一外侧和所述第二外侧的导管；
多个发光二极管，设置在所述散热器的所述第一外侧，并且与所述散热器热导通，以使所述散热器对所述发光二极管进行散热；以及
电子组件，设置在所述散热器的所述第二外侧，并且与所述散热器热导通，以使所述散热器对所述电子组件进行散热，所述电子组件将电输入功率转换为经过调节的电功率，所述发光二极管通过所述导管从所述电子组件接收所述经过调节的电功率。
2.根据权利要求1所述的发光装置，进一步包括：
pc板，其上安装有所述多个发光二极管，所述pc板设置在所述散热器的所述第一外侧上，并且与其热导通。
3.根据权利要求2所述的发光装置，进一步包括：
热胶带，用于将所述pc板粘结到所述第一外侧。
4.根据权利要求1所述的发光装置，其中，所述散热器的所述第二外侧适于与多个相关的电子组件中的任何一个可拆卸地连接。
5.根据权利要求1所述的发光装置，其中，所述电子组件包括爱迪生型底座和GU型底座中的一种。
6.根据权利要求1所述的发光装置，其中，所述电子组件包括：电子控制器，用于至少控制LED的亮度。
7.根据权利要求1所述的发光装置，其中，所述发光装置进一步包括：
光学系统，用于与所述发光二极管协作，以产生具有选定光束范围的光束。
8.根据权利要求7所述的发光装置，其中，所述光学系统包括对应于所述多个发光二极管的多个透镜。
9.根据权利要求1所述的发光装置，其中，所述散热器包括设置于所述第一外侧和所述第二外侧之间的辐射面，用于将热量从所述散热器辐射掉。
10.一种组合式灯系统，包括：
光学组件，具有：
多个LED，安装在印刷电路板上；以及
散热器，具有通过所述散热器传送电功率的电导管，所述多个LED与所述散热器热导通；以及
多个电子组件，每个组件均包括：位于第一端的输出耦合器，适于与所述散热器配合，通过所述散热器的所述电导管传送功率给所述多个LED，每个电子组件均具有适于与所述散热器连接的所述第一端；和电连接器，安装在第二端用于接收电功率；所述电子组件具有相同的输出耦合器和不同的电连接器，所述电子组件包括安装在其内部用来将在其电连接器上接收的电功率转换成传送给所述输出耦合器的共通输出功率从而驱动所述多个LED的电路。
11.根据权利要求10所述的组合式灯系统，其中，所述光学组件进一步包括：
透镜系统，包括：至少一个透镜，用于接收由所述多个LED产生的光，从而改变所述光的特性。
12.根据权利要求11所述的组合式灯系统，其中，所述透镜系统进一步包括：
调节器，用于选择性调节所述至少一个透镜和所述多个LED的间距。
13.根据权利要求10所述的组合式灯系统，其中，所述光学组件进一步包括：
热胶带，置于所述印刷电路板和所述散热器之间，用来在其间提供热接触。
14.根据权利要求10所述的组合式灯系统，其中，所述散热器与所述多个电子组件中所安装的一个热连接，从而对所安装的电子组件进行散热。
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CN1689376A (zh) 2005-10-26
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