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Publication numberCN1658072 A
Publication typeApplication
Application numberCN 200510009073
Publication date24 Aug 2005
Filing date17 Feb 2005
Priority date18 Feb 2004
Also published asCN100498534C, EP1566698A1, US7133118, US7522266, US7911586, US20050179882, US20070046919, US20090213353
Publication number200510009073.8, CN 1658072 A, CN 1658072A, CN 200510009073, CN-A-1658072, CN1658072 A, CN1658072A, CN200510009073, CN200510009073.8
InventorsC-Q桂, AJ布里克, PWH德贾格
ApplicantAsml荷兰有限公司
Export CitationBiBTeX, EndNote, RefMan
External Links: SIPO, Espacenet
Lithographic apparatus and device manufacturing method
CN 1658072 A
Abstract  translated from Chinese
本发明提供一种方法和系统,用于方便利用多个单独可控元件以调整在聚焦元件阵列中每一个聚焦元件处接收到的辐射的强度,从而控制基底上的多个区域中的辐射的强度,其中聚焦元件将辐射引导至所述区域。 The present invention provides a method and system for facilitating to adjust the focusing elements in the array element at each of the received radiation intensity focused by a plurality of individually controllable elements, thereby controlling the plurality of regions on the substrate in the radiation intensity, wherein the focusing element to direct radiation to the region.
Claims(21)  translated from Chinese
1.一种光刻投影装置,包括:用于提供辐射投射光束的照射系统;用于在投射光束的横截面给投射光束赋予图案的单独可控元件的阵列;用于支撑基底的基底台;用于将带图案的光束投射到基底的目标部分上的投影系统;其中该投影系统包括聚焦元件的阵列,该阵列设置为使得每个聚焦元件引导来自多个单独可控元件的带图案光束中的辐射,由此曝光基底的区域。 A lithographic projection apparatus, comprising: projecting a beam of radiation system for providing illumination; for the array of individually controllable elements in the projection beam cross-section to the pattern imparted to the projection beam; a substrate table for supporting a substrate; for the patterned beam onto a target portion of the substrate on the projection system; wherein the projection system includes an array of focusing elements, the array of focusing elements arranged such that each guiding a plurality of the patterned beam from the individually controllable elements radiation, thereby exposing the substrate region.
2.根据权利要求1的装置,其中每个单独可控元件可以设置为两个状态之一:在第一状态中,第一强度的辐射传递到带图案的光束的对应部分;在第二状态中,第二、低强度的辐射优选基本上是零强度的辐射引导至带图案光束的对应部分。 2. The apparatus according to claim 1, wherein each of the individually controllable elements can be set to one of two states: in the first state, a first radiation intensity transmitted to the corresponding portion of the patterned beam; in the second state the second, low-intensity radiation preferably substantially zero intensity of direct radiation to a corresponding portion of the patterned beam.
3.根据权利要求2的装置,其中每个单独可控元件可以设置为一个或多个另外的状态,其中将强度在第一和第二状态之间且不同于其他状态的辐射引导至带图案光束的对应部分。 3. The apparatus according to claim 2, wherein each of the individually controllable elements can be set to one or more further state, wherein the strength between the first and second states and different from other states to the radiation guide Patterned the corresponding portion of the beam.
4.根据权利要求2的装置,其中至少一个单独可控元件设置为,在其每个状态中将入射到该单独可控元件上传递到相关聚焦元件的辐射的比例和在其任一种状态中与同一聚焦元件相关联的至少一个其他单独可控元件相比不同。 4. The apparatus according to claim 2, wherein the at least one individually controllable element is set to, in the state in which each is incident on the individually controllable elements passing radiation related to the proportion of the focusing element and a state in which either with the same focusing element associated with at least one other different individually controllable elements compared.
5.根据权利要求1的装置,进一步包括至少一个衰减器,用于相对于与同一个聚焦元件相关联的其他单独可控元件减少入射在一个单独可控元件上的辐射强度。 5. The apparatus according to claim 1, further comprising at least one attenuator for the same with respect to the other individually controllable elements associated with the focusing element is incident on a reduction of individually controllable elements the radiation intensity.
6.根据权利要求1的装置,进一步包括至少一个衰减器,用于衰减来自一个单独可控元件的辐射,使得从该单独可控元件传播到相关联的聚焦元件的一部分辐射比从至少一个其他单独可控元件传播到所述聚焦元件的另一部分辐射少。 6. The apparatus according to claim 1, further comprising at least one attenuator for attenuating an individually controllable element from the radiation, so as to propagate from the individually controllable element to the associated focusing element than that part of the radiation from the at least one other individually controllable elements spread to at least another part of the radiation of the focusing element.
7.根据权利要求1的装置,进一步包括:致动器,用于当曝光基底的预定部分时使基底以基本上恒定的速度相对于投影系统移动;以及控制器,用于提供控制信号以设置单独可控元件,其中控制器设置为当基底上一点位于由一个聚焦元件照射的区域中时改变单独可控元件的设置,从而改变在所述点接收到的辐射强度。 7. The apparatus according to claim 1, further comprising: actuator for a predetermined portion of the substrate when exposing the substrate to a substantially constant velocity relative to the projection system move; and a controller for providing a control signal to set individually controllable elements, wherein the controller is set to change when the area illuminated by one focusing element when it is located on the base set of individually controllable elements to change the point of the received radiation intensity.
8.根据权利要求1的装置,还包括:致动器,用于当曝光基底的预定部分时使基底以基本上恒定的速度相对于投影系统移动,从而使基底上的给定点经过由不同聚焦元件照射的多个区域中;以及控制器,用于提供控制信号以设置单独可控元件,其中控制器设置成能够向单独可控元件提供所需的设置,因此在所述曝光中,由聚焦元件照射的多个区域中的辐射强度使通过该区域的基底上的点接收所需的总辐射剂量。 8. The apparatus of claim 1, further comprising: a base actuator for a predetermined portion of the substrate when exposed to a substantially constant speed relative to the projection system, thereby moving on to the substrate through the different focal point elements irradiated in a plurality of regions; and a controller for providing control signals to set the individually controllable elements, wherein the controller is arranged to provide the required settings to the individually controllable elements, and therefore the exposure, the focus a plurality of regions elements are irradiated radiation intensity required to bring the total radiation dose received by a point on the substrate in the region.
9.一种用于制造器件的方法,包括:利用照射系统提供辐射的投射光束;利用单独可控元件的阵列在投射光束的横截面给投射光束赋予图案;以及利用作为投影系统一部分的聚焦元件阵列将带图案的光束投射到基底目标部分上,其中每个聚焦元件设置为将来自多个单独可控元件的带图案光束中的辐射引导至目标部分中的区域上,并且其中单独可控元件可以设置为多个不同的状态,在每个状态中,不同强度的辐射从单独可控元件传播到相关联的聚焦元件;以及将每个单独可控元件设置在基底上的所述区域产生所需的辐射强度。 9. A method for manufacturing a device, comprising: an illumination system for providing a projection beam of radiation; the use of an array of individually controllable elements in the projection beam cross-section to the pattern imparted to the projection beam; and the use of focusing elements as part of the projection system array patterned beam is projected onto a target portion of the substrate, wherein each focusing element is provided with a pattern of light beams from the plurality of individually controllable elements in the radiation to the target portion of the region, and wherein the individually controllable elements can be set to a plurality of different states, in each state, different intensities of radiation propagating from the individually controllable element to the associated focusing element; and the area of each individually controllable element disposed on the substrate to produce the required radiation intensity.
10.根据权利要求9的器件制造方法,其中每个单独可控元件可以设置为至少三个状态。 10. A device manufacturing method according to claim 9, wherein each of the individually controllable elements can be set to at least three states.
11.根据权利要求9的器件制造方法,该方法进一步包括在曝光基底的预定部分时使基底以基本上恒定的速度相对于投影系统移动,并且在基底上给定点位于由一个聚焦元件照射的区域中时改变单独可控元件的设置。 11. A device manufacturing method according to claim 9, which further comprises a substrate upon exposure to a predetermined portion of the substrate to a substantially constant velocity relative to the projection system is moved and located at a given point on the substrate by the irradiation area of a focusing element When changing the settings individually controllable elements.
12.根据权利要求9的器件制造方法,该方法进一步包括在曝光基底的预定部分时使基底以基本上恒定的速度相对于投影系统移动,并且将需要的设置应用于单独可控元件,因此在由多个聚焦元件照射的区域中的辐射强度使得通过这些区域的基底上的一点接收所需的总辐射剂量。 12. A device manufacturing method according to claim 9, which further comprises a substrate upon exposure to a predetermined portion of the substrate to a substantially constant velocity relative to the projection system moves, and will need to be applied to set the individually controllable elements, and therefore a plurality of irradiated areas of the focusing elements so that the required radiation intensity received by the substrate such that the total area of the radiation dose.
13.一种装置,包括:(i)用于提供辐射投射光束的辐射源;(ii)接收并对所述辐射投射光束构图的单独可控元件的阵列;以及(iii)聚焦元件阵列,所述聚焦元件阵列包括两个聚焦元件,其中所述两个聚焦元件中的每一个都与多个单独可控元件在光学上相关联。 13. An apparatus, comprising:; Array (ii) and receiving the projection beam of radiation patterned individually controllable elements; (i) for providing a projection beam of radiation a radiation source and (iii) the focusing element array, the said array of focusing elements comprising two focus elements, wherein said two focusing elements in each of the plurality of individual optical elements on the associated controllable.
14.根据权利要求13的装置,其中所述聚焦元件阵列包括多于两个聚焦元件。 14. The apparatus of claim 13, wherein said array of focusing elements comprises more than two focus elements.
15.根据权利要求14的装置,其中每个所述聚焦元件都与多个所述单独可控元件在光学上相关联。 15. The apparatus according to claim 14, wherein each of said plurality of focusing elements are associated with the individual elements in the associated optically controllable.
16.根据权利要求13的装置,其中多个所述单独可控元件以正方形布局排列。 16. The apparatus of claim 13, wherein a plurality of the individually controllable elements are arranged in a square layout.
17.根据权利要求13的装置,其中对所述辐射源设置成利用倾斜辐射来照射所述单独可控元件的阵列。 17. The apparatus according to claim 13, wherein said radiation source is arranged in an array of inclined radiation irradiating the use of individually controllable elements.
18.根据权利要求13的装置,其中所述单独可控元件的阵列是可编程反射镜阵列。 18. The apparatus according to claim 13, wherein said array of individually controllable elements is a programmable mirror array.
19.根据权利要求13的装置,其中所述装置是光刻装置。 19. The apparatus of claim 13, wherein said apparatus is a lithographic apparatus.
20.一种包括用权利要求13的装置将基底暴露于辐射中的方法。 20. An apparatus comprising the substrate 13 is exposed to radiation in the method claims.
21.一种用权利要求20的方法获得的平板显示器。 21. A method according to claim 20, obtained by the flat panel display.
Description  translated from Chinese
光刻装置和器件制造方法 Lithographic apparatus and device manufacturing method

技术领域 Technical Field

本发明涉及一种光刻装置和一种器件制造方法。 The present invention relates to a lithographic apparatus and a device manufacturing method.

背景技术 Background

光刻装置是一种将所需图案应用于基底的目标部分上的机器。 A lithographic apparatus is a machine to the desired pattern is applied on the target portion of the substrate. 光刻装置可以用于例如集成电路(IC)的制造,平板显示器以及包括精细结构的其他器件。 A lithographic apparatus can be used, for example an integrated circuit (IC) fabrication, flat panel displays and other devices including fine structure. 在常规的光刻装置中,构图部件,可替换地称作掩模或中间掩模版,可用于产生对应于IC(或其他器件)一个单独层的电路图案。 In a conventional lithographic apparatus, a patterning device, alternatively referred to as a mask or a reticle, may be used to generate corresponding IC (or other device) of a single layer of the circuit pattern. 该图案可以成像到具有辐射敏感材料(抗蚀剂)层的基底(例如硅晶片或玻璃板)的目标部分(例如包括部分,一个或者多个管芯)上。 This pattern can be imaged onto a target portion of a substrate having a radiation-sensitive material (resist) layer (e.g., a silicon wafer or glass plate) (e.g. including part of, one, or several dies) on. 代替掩模,该构图部件可以包括用于产生电路图案的单独可控元件的阵列。 Instead of a mask, the patterning means may comprise an array of individually controllable elements used to generate a circuit pattern.

一般地,单一的基底将包含依次曝光的相邻目标部分的网格。 In general, a single substrate will contain a sequence of adjacent target portions exposed grid. 已知的光刻装置包括所谓的步进器,其中通过将全部图案一次曝光在目标部分上而辐射每一目标部分,还包括所谓的扫描器,其中通过投射光束沿给定方向(“扫描”方向)扫描图案、并同时沿与该方向平行或者反平行的方向同步扫描基底来辐射每一目标部分。 Known lithographic apparatus include so-called steppers, in which by exposing an entire pattern on each target portion is irradiated target portion, further comprising a so-called scanners, in which through the projection beam in a given direction (the "scanning" direction) of the scanning pattern, while synchronously scanning the substrate along a direction parallel or anti-parallel to the direction of each target portion is irradiated.

在平板显示器的制造中,例如,经常希望能够这样曝光基底从而使基底的不同区域接受不同的辐射总剂量。 In the manufacture of flat panel displays, for example, often hoping to such exposure substrate so that different regions of the substrate accept different total dose of radiation. 通过这样做,可以完全除去基底上一些区域中的抗蚀剂,在其他区域中留下全部的厚度,并且提供例如除去部分抗蚀剂的另外区域。 By doing so, the substrate can be completely removed in some areas of the resist, leaving the entire thickness of the other regions, and provide additional area for example, to remove portions of the resist.

这种性能经常称为半色调或灰度色调曝光。 This performance is often referred to as halftone or gray tone exposure. 这使得对于单一曝光步骤在随后制造过程中要执行的多个加工步骤能够实现。 This allows a plurality of processing steps for a single exposure step in a subsequent manufacturing process to be performed can be realized. 例如,可以对曝光之后完全暴露的基底的多个部分进行加工。 For example, a plurality of portions of the substrate after the exposure fully exposed for processing. 接着,从仍然由抗蚀剂覆盖的那些区域除去给定厚度的抗蚀剂。 Next, remove a given thickness of the resist from those regions are still covered by the resist. 这使得基底的另外区域暴露出来,但是没有暴露抗蚀剂最厚的那些区域;随后仅仅在暴露出来的那些区域上进行另外的加工步骤。 This allows the substrate to expose another area, but those areas resist the thickest is not exposed; then perform additional processing steps only on those areas exposed. 最后,在整个基底上进行加工步骤之前除去所有剩余的抗蚀剂。 Finally, all the remaining resist is removed before the processing steps performed on the entire substrate.

可以通过以给定强度并持续不同时间量曝光基底的各个部分,通过以不同的强度并持续相同时间量曝光各个部分,或者通过两者结合来产生灰度色调曝光(这种性能通常称作灰度级曝光(gray scale exposure))。 Can be given different intensity and duration exposure amount of time each part of the substrate through a different intensity and exposure duration for each part of the same amount of time, or to produce a gray-tone exposure through a combination of both (this capability is often referred to ash degree-level exposure (gray scale exposure)).

本发明提供一种用于将不同辐射剂量作用于基底的不同区域的方法和装置。 The present invention provides a different radiation doses applied to the base of the method and apparatus for different regions.

发明内容 DISCLOSURE

与具体化并在这里广义描述的本发明的原理一致,一种光刻投影装置,包括用于提供辐射投射光束的照射系统。 Consistent with the principles embodied and broadly described herein the present invention, a lithographic projection apparatus comprising means for providing radiation projection beam irradiation system. 还包括用于赋予投射光束带图案的横截面的单独可控元件的阵列,以及最初用于支撑基底的基底台,包括用于将带图案的光束投射到基底的目标部分上的投影系统,其中该投影系统包括聚焦元件的阵列,设置为每个聚焦元件将来自多个单独可控元件的带图案光束中的辐射引导至基底的一个区域上。 Further comprising means for imparting the projection beam with a patterned cross-section of the array of individually controllable elements, and a substrate table for supporting a substrate initially, a projection system including a target portion is used to patterned beam onto a substrate, wherein The projection system includes an array of focusing elements, each focusing element is set to a region from the plurality of individually controllable elements with the patterned beam of radiation directed to the substrate.

因此,如果将与一个给定聚焦元件相关联的所有单独可控元件都设置为向该聚焦元件提供高强度辐射,那么在基底上相关区域中的辐射强度将很高,并且在给定的曝光时间中所接收的辐射剂量也相对较高。 Therefore, if all individually controllable elements with a given focusing element associated with focusing elements are set to the high intensity radiation is provided, then the relevant area of the substrate radiation intensity will be high, and in a given exposure time radiation dose received is relatively high. 如果将与该聚焦元件相关联的所有单独可控元件都设置为将低强度辐射(或者优选的是没有辐射)引导至该聚焦元件,那么基底上该区域中的辐射强度(因此给定曝光时间的辐射剂量)将很低。 If all individually controllable elements associated with the focusing element are set to the low-intensity radiation (or preferably no radiation) guided to the focusing element, then the substrate in the area of radiation intensity (and therefore a given exposure time The radiation dose) will be low.

通过设置与该聚焦元件相关联的一些单独可控元件以便将高强度辐射引导至该聚焦元件,并且设置一些单独可控元件以便将低强度辐射引导至该聚焦元件,基底上相关区域中的辐射强度将位于中间值,由此为与前面两种设置中相同的曝光时间提供中间剂量的辐射。 By setting some of the individually controllable elements associated with the focusing element to high intensity radiation to the focusing element and some of the individually controllable elements in order to set the low-intensity radiation to the focusing element, the base area of the radiation associated The intensity value in the middle, thereby providing an intermediate dose of radiation for the previous two settings in the same exposure time. 因此,通过提供灰度级控制,可以提供所需的灰度色调控制。 Accordingly, by providing gray scale control of gray tones can provide the desired control. 应该理解,与每个聚焦元件相关联的单独可控元件越多,则在基底上每个区域中提供的与每个聚焦元件相关联的辐射强度可能的中间级或灰度级水平(gray scale level)的数量就越多。 It should be understood, each of the more individually controllable elements associated with the focusing element is in each region on the substrate provided with each of the radiation intensity of the focusing element associated with the intermediate level potential level or gray level (gray scale the more level) number.

优选的是,每个单独可控元件可以设置为三个或多个状态。 Preferably, each of the individually controllable elements can be set to three or more states. 例如,提供第一状态,其中将引导至单独可控元件的最大比例的强度引导至相关联的聚焦元件。 For example, a first state, wherein the individually controllable elements will be guided to the ratio of the maximum intensity directed to the associated focusing element. 提供第二状态,其中,入射到单独可控元件上的最小比例优选基本上是零的辐射引导至对应的聚焦元件。 Providing a second state in which incident on the individually controllable elements the minimum ratio is preferably substantially focusing the radiation guiding element corresponding to zero. 提供其他状态,其中将入射到单独可控元件上的辐射引导至对应聚焦元件的辐射比例在第一状态和第二状态之间,并且不同于任何其他状态。 Additional state, wherein the guiding the radiation incident on the individually controllable elements the radiation proportional to the corresponding focusing element is between a first state and a second state, and different from any other state. 用这种方法,可以提供另外的灰度级水平。 In this way, it can provide additional grayscale levels.

根据本发明的另一个优选实施方案,每个单独可控元件可以配置为使得在每种状态下入射在该单独可控元件上并且引导至相关联的聚焦元件的辐射比例和与该聚焦元件相关联的其他单独可控元件中的每一个都不同。 According to another preferred embodiment of the present invention, each of the individually controllable elements may be configured such that each state is incident on the individually controllable elements and guided to the focusing element associated with the ratio of the radiation associated with the focusing element and Other individually controllable elements associated with each are different. 例如,考虑三个单独可控元件与一个聚焦元件相关联的布置。 For example, consider the three individually controllable elements associated with one focusing element is disposed. 如果所有这些元件在其最大强度状态下将相同比例的入射辐射引导至聚焦元件,那么既便任一个单独可控元件设置为最大状态而其他两个设置为将零辐射引导至该聚焦元件的状态,由聚焦元件照射的基底区域中的强度也相同。 If all of these elements in its state of maximum intensity of the incident radiation in the same proportion to guide focusing element, then both individually controllable elements will either be set to the maximum state and the other two will be set to zero radiation to the focusing element state , illuminated by the focusing element substrate strength in the same region. 通过将每个元件的最大状态设置为彼此不同,这三种设置也在由聚焦元件照射的基底区域上提供了三个不同的辐射强度,由此提供用于给定曝光时间的不同辐射剂量或灰度色调。 By setting the maximum state of each element is different from each other, these three settings are provided by the three different radiation intensity is irradiated on the focusing element substrate region, thereby providing different radiation dose for a given exposure time or shades of gray.

通过使每个单独可控元件具有相同的状态(即,在每个对应的状态中,所有单独可控元件将相同比例的入射辐射引导至聚焦元件上)可以提供类似的效果。 By making each individually controllable elements with the same state (i.e., corresponding in each state, all of the individually controllable elements will be the same proportion of the incident radiation to the focusing element) can provide a similar effect. 但是,同时,入射到每个单独可控元件上的辐射衰减为使入射到与给定聚焦元件相关联的每个元件上的辐射不同。 However, at the same time, the radiation incident on each individually controllable element is attenuated radiation incident on each element with a given focusing element associated different. 可替换的是,从每个单独可控元件传播的辐射衰减,因此从与给定聚焦元件相关联的每个单独可控元件引导的不同比例的辐射都到达该聚焦元件。 Alternatively, the radiation propagating from each of individually controllable attenuation element, and therefore the focus from a given element of each individually controllable element associated guide have different proportions of radiation reaches the focusing element. 也可以使用上述方法的某种组合。 You can also use some combination of the above methods.

优选的是,将装置配置为将与单个聚焦元件相关联的基底上的每个点全部设置为辐射强度的256,512或1024个灰度级水平中的任一个。 Preferably, the device is configured to be associated with each point on the base member with a single focus is set to all or any one of 256, 512 1024 gray levels in the level of radiation intensity.

该装置可进一步包括一致动器,用于在曝光预定部分的基底时,使基底以基本上恒定的速度相对于投影系统移动。 The apparatus may further comprise an actuator for a predetermined portion of the substrate during exposure of the substrate to a substantially constant velocity relative to the projection system move. 当基底在投影系统下面扫描时,改变用于单独可控元件的设置以提供所需的图案。 When the substrate under the projection system scanning, change settings for individually controllable elements to provide the desired pattern. 在优选的布置中,装置可进一步包括一控制器,用于为单独可控元件提供多个设置,该控制器设置为在基底上一点位于一个聚焦元件照射的区域中时能够改变单独可控元件的设置。 In a preferred arrangement, the apparatus may further comprise a controller for providing a plurality of individually controllable elements is set, the controller is set to the region on a substrate that is located in a focusing element when irradiated can be changed individually controllable elements settings. 因此,在基底上的一点由每个聚焦元件曝光的时间中,可以将两个不同的设置应用于单独可控元件。 Thus, at one point by the focusing element on each substrate exposure time may be two different settings are applied individually controllable elements. 这提供了对基底上这样一个点所接收的曝光剂量的附加控制。 This provides additional control over a point on the base of the received exposure dose.

例如,如果在该点的曝光时间的中间改变这些设置,那么该点接收到的辐射剂量是已经接收到的在全部曝光时间内保持第一设置的剂量和已经接收到的使第二次曝光的强度级保持全部时间的剂量的平均值。 For example, if you change these settings in the middle of the point of exposure time, then the point of the radiation dose received is kept dose has been received and has received the first set to the second exposure in the entire exposure time intensity level to maintain the average all-time dose. 因此,如果一个单独可控元件从全部强度变为没有强度,那么结果是提供相当于单独可控元件以半强度在全部曝光中的辐射剂量。 Thus, if an individual becomes controllable elements from all the strength there is no strength, then the result is individually controllable elements to provide the equivalent of half intensity in all the exposure dose of radiation. 这样,即使不可能向单独可控元件提供这种设置,也可以再次产生具有中间设置的单独可控元件的作用。 Thus, even if such an arrangement is not possible to provide individually controllable elements to be produced has the effect of setting the individually controllable elements in the middle again. 类似地,如果能够将单独可控元件设置为中间状态,那么可以产生另外的中间状态的作用。 Similarly, if we can individually controllable elements are arranged in an intermediate state, it can have an effect additional intermediate state.

在类似的方式中,可以提供对辐射剂量的进一步控制,其中基底上的每一点都通过由不同聚焦元件照射的两个区域。 In a similar manner, it is possible to provide further control of the radiation dose, in which every point by the two regions by different focusing elements are irradiated on the substrate. 在这种情况下,对于用于该点的两次子曝光(sub-exposure)(即,从每一个聚焦元件接受的曝光)中的每一次,控制器都向单独可控元件提供不同的设置,总剂量是两次子曝光之和。 In this case, the point for the two sub-exposure (sub-exposure) (ie, one from each focusing element acceptable exposure) each time, controllers provide different settings to individually controllable elements The total dose is the sum of the two sub-exposure. 因此,与上面描述的情况类似,总的辐射剂量相当于从两次子曝光时间(即,该点通过两个照射区域的时间)内以第一设置的曝光接收到的辐射剂量和从两次子曝光时间内以第二设置的曝光接收到的辐射剂量的平均值。 Therefore, similar to the case described above, the total radiation dose equivalent to twice the exposure time from child (that is, the time between two points by irradiation area) in the first set with the exposure dose of radiation received and from two the exposure time to the exposure of the second sub-set of the received radiation dose average. 应该理解,这种技术可以与用于控制总曝光剂量例如用于控制曝光的灰度级辐射强度的任一种前述方法结合。 It should be appreciated, this technique can be for example any of the aforementioned method for controlling a gray level of the exposure intensity of radiation in combination for controlling the total exposure dose.

根据本发明的另一方面,提供一种器件制造方法,包括以下步骤:提供一基底,利用单独可控元件的阵列赋予投射光束带图案的界面。 According to another aspect of the present invention, there is provided a device manufacturing method, comprising the steps of: providing a substrate using an array of individually controllable elements impart the projection beam with a pattern interface. 还包括利用作为投影系统一部分的聚焦元件阵列将带图案的光束投射到基底目标部分上的步骤。 Further comprising using a projection system as part of the array of focusing elements patterned beam onto a target portion of the substrate step. 每个聚焦元件设置为将来自多个单独可控元件的带图案光束中的辐射引导至目标部分中的一个区域上。 Each focusing element set from a plurality of individually controllable elements in the patterned beam of radiation directed onto the target portion in a region. 单独可控元件可以设置为多个不同的状态,在每个状态中,不同强度的辐射从单独可控元件传播到相关联的聚焦元件。 Individually controllable elements can be set to a plurality of different states, in each state, different intensities of radiation propagating from the individually controllable element to the associated focusing element. 该方法进一步包括将每个单独可控元件设置为所需状态,以在基底上所述区域产生所需的辐射强度。 The method further comprises for each individually controllable element is set to the desired state, the area on the substrate to produce the desired radiation intensity.

光刻装置也可以是这样一种类型,其中基底浸入具有相对较高折射率的液体中,如水,从而填充投影系统的最后一个元件与基底之间的空间。 The lithographic apparatus may also be of a type wherein the substrate is immersed in a liquid having a relatively high refractive index, such as water, so that the space between the final element of the projection system and the substrate is filled between. 浸液也可以应用于光刻装置中的其他空间,例如,掩模与投影系统的第一个元件之间。 Immersion liquid may also be applied to other spaces in the lithographic apparatus, e.g., a mask and the first element of the projection system between. 湿浸法在本领域是公知的,用于增大投影系统的数值孔径。 Immersion method is well known in the art for increasing the numerical aperture of projection systems.

本发明的其他实施方案,特征和优点,以及本发明各个实施方案的结构和操作将在下面参考附图进行详细描述。 Other embodiments of the invention, features and advantages, as well as the structure and operation of various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

附图说明 Brief Description

现在仅仅以例子的方式参考附图描述本发明的各个实施方案,图中对应的附图标记表示对应的部件,其中:图1表示根据本发明一个实施方案的光刻投影装置; Now by way of example only with reference to the accompanying drawings of various embodiments of the present invention, FIG. Corresponding reference numerals indicate corresponding parts throughout, wherein: Figure 1 shows a lithographic projection apparatus according to the present invention, an embodiment of the program;

图2表示根据本发明的装置的一部分的图示;图3表示曝光之后的基底;图4a表示与图3不同的曝光方式之后的基底;以及图4b表示在随后的加工工序之后图4a的基底。 Figure 2 shows a diagram of a portion of the apparatus of the present invention; Figure 3 shows the substrate after the exposure; Figure 4a shows the substrate of Fig. 3 after different exposure mode; and Figure 4b shows the subsequent processing step after Figure 4a substrate .

具体实施方式 DETAILED DESCRIPTION

本发明下面的详细描述参考用于图解说明与本发明一致的各个实施方案的附图。 The invention is described in detail below with reference to the accompanying drawings illustrate the present invention is consistent with various embodiments. 其他实施方案也是可能的,可以在本发明的精神和范围内对这些实施方案进行修改。 Other embodiments are possible, and may be in the spirit and scope of the invention to these embodiments be modified. 因此,下面的详细描述不意味着限制本发明。 Therefore, the following detailed description is not meant to limit the invention. 相反,本发明的范围由随附的权利要求书来限定。 Rather, the scope of the present invention is defined by the claims appended hereto.

本领域的普通技术人员显而易见,如下面所述的本发明能够以软件,硬件,固件和/或图中所示的实体的许多不同实施方案来实施。 Of ordinary skill in the art is obvious, according to the present invention as described below can be implemented in software, hardware, firmware, and / entity many different embodiments shown in the figures, or be implemented. 用于实施本发明的任何实际的软件代码和硬件的专门控制不是本发明的限制。 For any actual software code and hardware implementation of the present invention specifically control is not to limit the invention. 这样,下面对本发明操作性能进行描述时,应知道在这里给出的细节的基础上,存在所述实施例的改进和变形。 Thus, when following the operating performance of the present invention will be described here should know the basics of the details given on the existence of modifications and variations of the embodiment.

作为背景,如这里使用的术语“单独可控元件的阵列”应广义地解释为能够用于给入射的辐射光束赋予带图案的截面从而将所需图案形成在基底的目标部分上的任何装置。 As a background, such as the term used herein "array of individually controllable elements" should be broadly interpreted as a cross-sectional incident can be used to impart a radiation beam with a pattern in order to create a pattern in a target portion of the substrate will be required. 本文中也使用术语“光阀”和“空间光调制器”(SLM)。 It is also used herein the term "light valve" and "Spatial Light Modulator" (SLM). 下面给出这种构图部件的示例。 The following examples are given of such patterning device.

可编程反射镜阵列可以包括具有一粘弹性控制层和一反射表面的矩阵可寻址表面。 Programmable mirror array may comprise a matrix addressable surface having a viscoelastic control layer and a reflective surface. 这种装置的基本原理是(例如)反射表面的寻址区域将入射光反射为衍射光,而非寻址区域将入射光反射为非衍射光。 The basic principle of this device is that (for example) addressed areas of the reflective surface reflect incident light as diffracted light, rather than addressing area reflect incident light as diffracted light. 用一个适当的空间滤光器,从反射的光束中滤除所述非衍射光,只保留衍射光到达基底。 Using an appropriate spatial filter, to filter out the non-diffracted light from the reflected beam, leaving only the diffracted light to reach the substrate. 按照这种方式,光束根据矩阵可寻址表面的定址图案而产生图案。 In this manner, according to the addressing pattern of the light beam matrix-addressable surface pattern is generated. 应该理解,可选地,滤光器可以滤除衍射光,保留非衍射光到达基底。 It should be understood, alternatively, the filter can filter out the diffracted light, diffracted light to reach the substrate to retain non.

衍射光学微机电(MEMS)器件阵列也可以按照相应的方式使用。 Diffractive optical micro-electromechanical (MEMS) devices can also use an array corresponding manner. 每个衍射光学MEMS器件由多个反射带组成,这些反射带可以相对于彼此发生变形,以形成将入射光反射为衍射光的光栅。 Each diffractive optical MEMS device is composed of a plurality of reflective tape, reflective tape which can occur with respect to each other deformed to form gratings reflect incident light as diffracted light. 可编程反射镜阵列的另一实施例利用微小反射镜的矩阵排列,通过使用适当的局部电场,或者通过使用压电致动器装置,使得每个反射镜能够独立地关于一轴倾斜。 A programmable mirror array of a further embodiment utilizes a matrix arrangement of tiny mirrors, by using an appropriate local electric field, or by using a piezoelectric actuator device, such that each mirror can be individually tilted about an axis. 再者,反射镜是矩阵可寻址的,由此已寻址反射镜以与未寻址反射镜不同的方向将入射的辐射光束反射。 Moreover, mirrors are matrix-addressable, whereby the radiation beam reflected by the addressed and non-addressed mirror to mirror a different direction to the incident. 按照这种方式,根据矩阵可寻址反射镜的定址图案对反射光束进行构图。 In this manner, according to the matrix-addressable mirrors addressing pattern of the reflected beam is patterned.

可以用适当的电子装置进行该所需的矩阵定址。 You can use a suitable electronic device matrix addressing this need. 在上述两种情况中,单独可控元件的阵列可包括一个或者多个可编程反射镜阵列。 In both cases, the array of individually controllable elements can comprise one or more programmable mirror arrays. 关于如这里提到的反射镜阵列的更多信息可以从例如美国专利US5,296,891,US5,523,193、PCT专利申请WO 98/38597和WO 98/33096中获得,这些文献在这里引入作为参照。 More information on mirror arrays as here referred to can be obtained from, for example, U.S. Patent US5,296,891, US5,523,193, PCT patent applications WO 98/38597 and WO 98/33096 are obtained, which are incorporated herein incorporated by reference.

可编程LCD阵列。 Programmable LCD array. 例如由美国专利US 5,229,872给出的这种结构,它在这里引入作为参照。 E.g., by such a structure given in U.S. Patent No. US 5,229,872, which is incorporated herein by reference.

应该理解,例如在使用预偏置特性,光学接近修正特性,位相变化技术以及多次曝光技术的地方,单独可控元件的阵列上“显示”的图案可以基本上不同于最终传递到基底的一层或基底上的图案。 It should be understood, for example in the use of pre-bias feature, optical proximity correction features, phase variation techniques and multiple exposure techniques place, on the array of individually controllable elements "Display" pattern may be substantially different from the final delivery to the base of a layer or a pattern on the substrate. 类似地,最终在基底上产生的图案可以不与单独可控元件的阵列上任何一个瞬间所形成的图案一致。 Similarly, the pattern eventually generated on the substrate may not be consistent with any pattern formed an instant on the array of individually controllable elements. 这可能是在这样一种布置下出现的情况,即,其中基底每一部分上形成的最终图案在给定的时间段或者给定次数的曝光中形成,在这一过程中单独可控元件的阵列上的图案和/或基底的相对位置会发生变化。 This may be the case under such an arrangement it appeared that a final pattern which is formed on each part of the substrate in a given period of time or a given number of exposures is formed in this process array of individually controllable elements patterns and relative position / or substrate on the change.

在本申请中,本发明的光刻装置具体用于制造IC,但是应该理解,这里描述的光刻装置可能具有其它应用,例如,它可用于制造集成光学系统、用于磁畴存储器的引导和检测图案、平板显示器、薄膜磁头等等。 In the present application, the present invention is particularly lithographic apparatus for manufacturing IC, it should be understood that the lithographic apparatus described herein may have other applications, for example, which can be used in the manufacture of integrated optical systems, guidance and for magnetic domain memories detection patterns, flat panel displays, thin-film magnetic heads, etc. 本领域的技术人员将理解,在这种可替换的用途范围中,任何术语“晶片”或者“管芯”的使用应认为分别可以与更普通的术语“基底”或者“目标部分”同义。 Those skilled in the art will appreciate that the scope of such alternative applications, any of the terms "wafer" or "die" herein may be considered with the more general terms "substrate" or "target portion" are synonymous.

在曝光之前或之后,可以利用例如轨迹器(track)(一种通常将抗蚀剂层涂敷于基底并将已曝光的抗蚀剂显影的工具)或者计量工具或检验工具对这里提到的基底进行处理。 Before or after exposure, can be used for example a track (track) (a typically resist layer is applied to a substrate and exposed resist development tools) or measurement tools or test tools mentioned here treated substrate. 在可应用的地方,这里公开的内容可应用于这种和其他基底处理工具。 Where applicable, the disclosure herein may be applied to such and other substrate processing tools. 另外,例如为了形成多层IC,可以对基底进行多次处理,因此这里所用的术语基底也可以指的是已经包含多个已处理层的基底。 Further, for example, in order to form a multi-layer IC, the substrate may be processed multiple times, so that the term substrate used herein may also refer to a substrate that already contains multiple processed layers.

这里使用的术语“辐射”和“光束”包含所有类型的电磁辐射,包括紫外(UV)辐射(例如具有365,248,193,157或者126nm的波长)和远紫外(EUV)辐射(例如具有5-20nm的波长范围)以及粒子束,如离子束或者电子束。 As used herein, the term "radiation" and "beam" encompass all types of electromagnetic radiation, including ultraviolet (UV) radiation (for example, a 193, 157 or 126nm wavelength) and the far-ultraviolet (EUV) radiation (eg having 5 -20nm wavelength range) as well as particle beams, such as ion beams or electron beams.

这里使用的术语“投影系统”应广义地解释为包含各种类型的投影系统,包括折射光学系统,反射光学系统,和反折射光学系统,如适合于所用的曝光辐射,或者适合于其他方面,如使用浸液或使用真空。 The term used herein "projection system" should be broadly interpreted as encompassing various types of projection system, including refractive optical systems, reflective optical systems, and catadioptric optical systems, as appropriate for the exposure radiation being used, or for other factors, such as the use of immersion or use of a vacuum. 这里任何术语“透镜”的使用可以认为与更普通的术语“投影系统”同义。 Any use of the term "lens" herein may be considered with the more general term "projection system" are synonymous.

照射系统还可以包括各种类型的光学部件,包括用于引导、整形或者控制辐射投射光束的折射,反射和反折射光学部件,这些部件在下文还可共同地或者单独地称作“透镜”。 The illumination system may also include various types of optical components, including for directing, shaping or controlling the projection beam of radiation refraction, reflection and catadioptric optical components, these components may hereinafter be collectively or individually referred to as "lens."

光刻装置可以具有两个(二级)或者多个基底台(和/或两个或多个掩模台)。 The lithographic apparatus may have two (two) or more substrate tables (and / or two or more mask tables). 在这种“多级式”器件中,可以并行使用这些附加台,或者可以在一个或者多个台上进行准备步骤,而一个或者多个其它台用于曝光。 In such "multiple stage" devices the additional tables may be used in parallel, or preparatory steps may be carried out in one or more tables while one or more other tables are being used for exposure.

图1示意性地表示了本发明一具体实施方案的一光刻投影装置。 Figure 1 schematically shows a lithographic projection apparatus of the present invention, a specific embodiment. 该装置包括:用于提供辐射(例如UV辐射)的投射光束PB的照射系统(照射器)IL和用于将图案作用于投射光束的单独可控元件的阵列PPM(例如可编程反射镜阵列)。 The apparatus comprising: providing a radiation (e.g., UV radiation) projection beam PB illumination system (illuminator) IL and a pattern for acting on the projection beam array PPM of individually controllable elements (e.g., a programmable mirror array) . 一般来说,单独可控元件的阵列的位置相对于物体PL固定;但是取而代之的是,它也可以连接到用于使其相对于物体PL精确定位的定位装置上。 In general, the position of the array of individually controllable elements is fixed relative to the object PL; but instead, it can also be connected to a positioning device for accurate positioning of an object PL with respect to it.

光刻投影装置还包括基底台(例如晶片台)WT,用于支撑基底(例如涂敷抗蚀剂的晶片)W,并与用于将基底相对于物体PL精确定位的定位装置PW连接。 Lithographic projection apparatus further comprises a substrate table (e.g. a wafer table) WT, for supporting a substrate (e.g. a resist-coated wafer) W, and the substrate used for precise positioning relative to the object PL positioning means PW connection. 提供一投影系统(“透镜”)PL,用于将通过单独可控元件的阵列PPM赋予投射光束PB的图案成像在基底W的目标部分C(例如包括一个或多个管芯)上。 Providing a projection system ("lens") PL, for imparting the projection beam PB by patterning array PPM of individually controllable imaging element substrate W in a target portion C (e.g. comprising one or more dies) on. 投影系统可以将单独可控元件的阵列成像到基底上。 The projection system may image the array of individually controllable elements onto the substrate. 另外,投影系统可以使二次光源成像,单独可控元件的阵列的多个元件为二次光源充当快门。 Further, the projection system can image secondary sources, the plurality of elements of the array of individually controllable elements act as a shutter for the secondary light source. 投影系统还可以包括微透镜阵列(称为MLA),例如用以形成二次光源并将微光点(microspot)成像到基底上。 The projection system may also include a microlens array (referred MLA), e.g., to form a secondary light source and LLL point (microspot) imaged onto the substrate.

如这里指出的,该装置属于反射型(即具有单独可控元件的反射阵列)。 As noted herein, the apparatus belonging to a reflection type (i.e. has a reflective array of individually controllable elements). 可是,一般来说,它还可以是例如透射型(即具有单独可控元件的透射阵列)。 However, in general, it may be for example a transmission type (i.e. has a transmissive array of individually controllable elements).

照射器IL接收来自辐射源SO的辐射光束。 The illuminator IL receives a radiation beam from a radiation source SO. 辐射源和光刻装置可以是独立的机构,例如当辐射源是准分子激光器时。 Source and the lithographic apparatus may be separate entities, for example when the source is an excimer laser. 在这种情况下,不认为辐射源是构成光刻装置的一部分,辐射光束借助于光束输送系统BD从源SO传输到照射器IL,所述输送系统包括例如合适的定向反射镜和/或扩束器。 In this case, the source is not considered part of the lithographic apparatus and the radiation beam by means of a beam delivery system BD transmitted from the source SO to the illuminator IL, the delivery system comprising for example, suitable directing mirrors and / or expansion a beam splitter. 在其它情况下,辐射源可以是装置的组成部分,例如当源是汞灯时。 In other cases the source may be an integral part of the apparatus, for example when the source is a mercury lamp. 源SO和照射器IL,如果需要连同光束输送系统BD一起可被称作辐射系统。 The source SO and the illuminator IL, if desired together with the beam delivery system BD may be referred to as a radiation system.

照射器IL包括调节装置AM,用于调整光束的角强度分布。 The illuminator IL comprises adjusting means AM, for adjusting the angular intensity distribution of the beam. 通常至少可以调整照射器光瞳面内强度分布的外和/或内径向量(通常分别称为σ-外和σ-内)。 Usually at least you can adjust the illumination pupil outer and / or inner radial inner surface of the intensity distribution (commonly referred to as σ- outer and σ- inner). 另外,照射器IL一般包括各种其它部件,如积分器IN和聚光器CO。 In addition, the illuminator IL generally comprises various other components, such as an integrator IN and a condenser CO. 照射器提供辐射的调节光束,称为投射光束PB,该光束在其横截面具有所需的均匀度和强度分布。 The illuminator provides adjustment of the radiation beam, referred to as the projection beam PB, the beam in its cross section having a desired uniformity and intensity distribution.

光束PB然后与单独可控元件的阵列PPM相交。 Beam PB is then intersects the array of individually controllable elements PPM. 由单独可控元件的阵列PPM反射后,光束PB通过投影系统PL,该系统将光束PB聚焦在基底W的目标部分C上。 After reflected by the array of individually controllable elements PPM, the beam PB passes through the projection system PL, which focuses the beam PB system target portion C of the substrate W on. 在定位装置PW(和干涉测量装置IF)的辅助下,基底台WT可以精确地移动,例如在光束PB的光路中定位不同的目标部分C。 In the positioning device PW (and interferometric measuring means IF) in aid of the substrate table WT can be moved accurately, such as to position different target portions in the optical path of the beam PB C. 在使用时,单独可控元件的阵列的定位装置可用于精确校正例如在扫描期间单独可控元件的阵列PPM相对于光束PB的光路的位置。 In use, the positioning means for the array of individually controllable elements can be used to accurately correct for example during scanning the array of individually controllable elements PPM with respect to the position of the optical path of the beam PB.

一般地,借助于图1中未明确显示的长行程模块(粗略定位)和短行程模块(精确定位),可以实现目标台WT的移动。 In general, long-stroke module by means not explicitly shown in Figure 1 (coarse positioning) and a short stroke module (fine positioning), which can achieve a moving target table WT. 类似的系统也可以用于定位单独可控元件的阵列。 Similar systems may also be used to locate the array of individually controllable elements. 应该理解,可替换地/另外地,投射光束可以是可移动的,而目标台和/或单独可控元件的阵列可以具有固定的位置,从而提供所需的相对移动。 It should be understood, alternatively / additionally, the projection beam may be movable, the target station and / or the array of individually controllable elements can have a fixed position to provide the required relative movement.

作为进一步的替换,该系统特别适用于平板显示器的制造中,基底台和投影系统的位置可以是固定的,基底可以设置为相对基底台移动。 As a further alternative, the system is particularly suitable for the manufacture of flat panel displays, the position of the substrate table and the projection system may be fixed and the substrate may be set to a relatively moving substrate table. 例如,基底台可以设有以基本上恒定速度扫描基底的系统。 For example, the substrate table may be provided with a substantially constant scanning speed of the substrate system.

尽管根据这里描述的本发明的光刻装置用于曝光基底上的抗蚀剂,但是应该理解,本发明不限于这种用途,该装置也可以用于投射在无抗蚀剂光刻中所用的带图案的投射光束。 Although the lithography apparatus according to the present invention is described herein for exposing a resist on a substrate, it is to be understood that the present invention is not limited to such use, the apparatus may also be used without projecting resist used in lithography patterned projection beam.

所示的装置可以在四种优选模式中使用。 The apparatus shown can be used in four preferred modes. 在步进模式中,单独可控元件的阵列将整个图案赋予投射光束,该图案被一次投射到目标部分C上(即单次静态曝光)。 In step mode, the array of individually controllable elements will be an entire pattern imparted to the projection beam, the pattern is projected onto a target portion C (i.e. a single static exposure). 然后基底台WT沿X和/或Y方向移动,从而曝光不同的目标部分C。 Then the substrate table WT along X and / or Y direction so that a different target portion C. exposure 在步进模式中,曝光场的最大尺寸限制了在单次静态曝光中成像的目标部分C的尺寸。 In step mode, the maximum size of the exposure field limits in a single static exposure target portion C imaged in size.

在扫描模式中,单独可控元件的阵列沿给定的方向(所谓的“扫描方向”,例如Y方向)以速度v移动,以使投射光束PB扫描单独可控元件的阵列;同时,基底台WT沿相同或者相反的方向以速度V=Mv同时移动,其中M是透镜PL的放大率。 In scan mode, the array of individually controllable elements in a given direction (the so-called "scan direction", e.g. the Y direction) with a speed v, so that the projection beam PB scanning array of individually controllable elements; the same time, the base station WT in the same or opposite direction at a speed V = Mv move simultaneously, where M is the magnification of the lens PL. 在扫描方式中,曝光场的最大尺寸限制了在单次动态曝光中目标部分的宽度(沿非扫描方向),而扫描移动的长度确定目标部分的高度(沿扫描方向)。 In scan mode, the maximum size of the exposure field limits the width (in the non-scanning direction) of the target portion in a single dynamic exposure, whereas the length of the scanning motion determines the height of the target portion (the scanning direction).

在脉冲模式中,单独可控元件的阵列基本保持不动,利用脉冲辐射源将整个图案投射到基底的目标部分C上。 In pulse mode, the array of individually controllable elements is kept essentially using a pulsed radiation source to the entire pattern is projected onto a target portion C of the substrate. 基底台WT以基本上恒定的速度移动,以使投射光束PB横跨基底W扫描一条线。 Substrate table WT at a substantially constant moving speed, so that the projection beam PB scan a line across substrate W. 根据需要在辐射系统的脉冲之间更新单独可控元件的阵列上的图案,设定脉冲的时间,从而在基底的所需位置曝光连续的目标部分C。 As required between pulses of radiation system update pattern array of individually controllable elements on a set pulse time, thus exposing successive target portion of the substrate at a desired position C. 因此,投射光束可以扫描基底W,从而为基底的一条曝光全部图案。 Thus, the projection beam can scan the substrate W, thereby exposing an entire pattern to the substrate. 重复该过程,直到一条线一条线地曝光全部基底。 Repeat this process until a line by line exposure all substrates.

提供连续扫描模式,该连续扫描模式与脉冲模式基本相同。 Provide continuous scan mode, the continuous scan mode and pulse mode is basically the same. 除了在这种连续扫描模式中使用基本上不变的辐射源,并且当投射光束扫描基底并使其曝光时改变单独可控元件的阵列上的图案。 In addition to using a substantially constant radiation pattern in this continuous scan mode, and changing the individually controllable elements when the projection beam scanning exposure base and make it on the array. 可以使用上述模式的组合和/或变化,也可以使用与上述模式完全不同的模式。 Combinations and / or variations may be using the model can also be used with the above model is completely different patterns.

图2表示根据本发明的装置的一部分。 Figure 2 shows a portion of the apparatus of the present invention. 特别是,该图示出单独可控元件的阵列10,投影元件的系统11和用于将辐射引导至基底13上的聚焦元件的阵列12。 In particular, there is shown an array of individually controllable elements 10, system 11 and the projection member for guiding the radiation to the array 12 of focusing elements 13 on the substrate. 应该理解,也可以使用将来自单独可控元件的阵列10的辐射投射到聚焦元件阵列12上的可替换布置。 It should be understood, you can use individually controllable elements from radiation projection array 10 to the focusing element array 12 disposed on an alternative. 还应该理解,可借助于分束器(设置在投影元件的集合中,从而将辐射投射光束远心地转到单独可控元件的反射阵列上,然后如公知的,所述阵列的反射径直穿过分束器,进入投影系统的其余部分)照射单独可控元件的阵列,通过倾斜辐射(如图2中所示)照射单独可控元件的阵列,或者如果是透射结构还可直接照射单独可控元件的阵列。 It should also be understood that, by means of a beam splitter (provided in the projection element in the collection, which will be telecentric projection beam of radiation to the reflective array of individually controllable elements, then known as the reflection of the array straight through the points beam splitter array into the rest of the projection system) is irradiated individually controllable elements, by tilting the array of radiation (shown in Figure 2) irradiation of individually controllable elements, or if the transmission structure may also be directly irradiated individually controllable elements The arrays.

如图所示,单独可控元件的阵列10包括单独可控的元件21至26。 As shown, the array of individually controllable elements 10 comprises individually controllable elements 21 to 26. 聚焦元件阵列12包括两个聚焦元件31,32。 Array of focusing elements 12 comprises two focusing elements 31, 32. 将来自三个单独可控元件21,22,23的辐射引向一个聚焦元件32,将来自其余单独可控元件24,25,26的辐射引向另一个聚焦元件31。 The radiation from the three individually controllable elements 21, 22 toward a focusing element 32, the individually controllable elements 24, 25 from the remaining radiation towards the other focusing element 31. 应该理解,实际上,聚焦元件阵列具有更多的聚焦元件。 It should be understood, in fact, the focusing element array having many more focusing elements. 例如,聚焦元件阵列可以具有在该阵列中的1025968个聚焦元件。 For example, the focusing elements in the array may have an array of 1025 968 focus elements. 而且,应该理解,单独可控元件的阵列同样明显较大。 Moreover, it should be understood that the same array of individually controllable elements significantly larger. 而且,如下面所解释的,可以使任意数量的单独可控元件与每个聚焦元件相关联。 Moreover, as explained below, allows any number of individually controllable elements associated with each focusing element.

每个聚焦元件31,32将引导至其上的辐射聚焦到基底13的相关区域33,34。 Each focusing elements 31 and 32 will lead to the radiation focused on the relevant area of the substrate 13, 33, 34. 每个区域中的辐射强度取决于来自每个单独可控元件的已构图光束的多个部分的强度总和,所述每个单独可控元件与该聚焦元件相关联。 Each region depends on the sum of the intensity of the radiation intensity of the patterned beam from each of a plurality of portions of individually controllable elements, each of the individually controllable elements associated with the focusing element. 因此,与聚焦元件32相关联的基底13上的区域34处的辐射取决于从单独可控元件21,22,23中每一个传播的辐射的强度。 Therefore, the radiation area 34 of the focusing element 32 associated with the base 13 depends on the intensity of the individually controllable elements 21, 22 in each of the propagating radiation. 可以将单独可控元件21至26中的每一个设置为多个状态。 It may be individually controllable elements 21 to 26 is set to each of a plurality of states. 在一种简单的情况下,可以将这些元件设置为引导辐射到达相关联的聚焦元件20上或者不引导到该聚焦元件上。 In a simple case, these elements can be set to guide the radiation from reaching the focusing element associated with the 20 or not directed onto the focusing element. 因此,具有两个状态,即,全部强度和零强度。 Thus, with two conditions, namely, all the strength and zero intensity.

在图2中所示的实施例中,能够设置与每个聚焦元件相关联的三个单独可控元件中的每一个,从而能够在将来自一个聚焦元件的辐射引导至基底上的区域处提供四个不同的辐射强度级。 In the embodiment shown in FIG. 2, it can be provided with each of the three individually controllable elements associated with the focusing element each, which can direct radiation from the focusing element to a region of the substrate is provided four different radiation intensity levels. 特别是,可以将所有元件都设置为零辐射,导致由该聚焦元件照射的基底上的该区域是零辐射。 In particular, all components can be set to zero radiation, leading to the focusing element in the region irradiated by the substrate is zero radiation. 仅仅将一个单独可控元件设置为全部强度,可在由该聚焦元件照射的基底上的该区域处提供等于三分之一最大强度的强度级。 Only one set of individually controllable elements of all strength, the focus on the base elements are irradiated at an area equal to one-third of the maximum intensity of the provider intensity level. 或者将两个单独可控元件设置为全部强度,可在由该聚焦元件照射的基底上的该区域处提供三分之二最大强度的强度级。 Or two of individually controllable elements is set to all intensity, providing two-thirds of the maximum intensity in the region of the intensity level by the irradiation of the focusing element on a substrate.

应该理解,因为不同数量的单独可控元件与每个聚焦元件相关联,因此可在基底上的该区域处提供不同数量的强度级或灰度级(grayscale)。 It should be understood, because of the different number of individually controllable elements associated with each focusing element, thus providing a different number of intensity levels or gray level (grayscale) in the region of the substrate. 由于每个聚焦元件对应一个单独可控元件,因此例如可提供两个强度级。 Since each corresponding to a focusing element individually controllable elements, for example, thus providing two intensity levels. 由于每个聚焦元件对应两个单独可控元件,因此可提供三个强度级。 As each focusing element corresponding to two individually controllable elements, thereby providing three intensity levels. 如上面所述具有三个单独可控元件,因此可提供四个强度级,等等。 As described above having three individually controllable elements, thereby providing four intensity levels, and the like. 在图2中所示的图中,为了清楚起见,示出与每个聚焦元件相关联的成排排列的三个单独可控元件。 Shown in FIG. 2, for clarity, showing the three individually controllable elements associated with each focusing element rows arranged. 然而,应该理解,实际上单独可控元件可以按照不同的布局排列。 However, it should be understood that, in fact, the individually controllable elements may be arranged in a different layout. 例如,如果每个聚焦元件使用四个单独可控元件,那么这四个单独可控元件可以按照正方形布局排列。 For example, if each focusing element with four individually controllable elements, then four individually controllable elements may be arranged in a square layout.

前面的描述是关于利用能够将辐射传到聚焦元件或者不传到聚焦元件的单独可控元件。 The foregoing description relates to the use of radiation can be transmitted or not transmitted to the focusing element focusing elements individually controllable elements. 应该理解,实际上,甚至可以在单独可控元件的低强度状态下将一些辐射引导至聚焦元件。 It should be understood, in fact, even individually controllable elements in the state of some of the low-intensity radiation to the focusing element. 换句话说,单独可控元件的两个状态是相对较高的强度状态和相对较低的强度状态。 In other words, the individually controllable elements of the two states is relatively high strength and relatively low intensity of state status.

本发明还可以与设置为另外状态的单独可控元件一起使用。 The present invention may also be set to another state with individually controllable elements together. 例如,可以将这些元件设置为一个或多个中间状态,其中将强度在高强度级和低强度级之间的辐射引导至聚焦元件。 For example, these elements can be set to one or more intermediate state, in which the intensity of the radiation intensity between the high-level and low-level intensity directed to the focusing element. 例如,每个单独可控元件能够提供强度级在较高强度级和较低强度级中间的辐射。 For example, each individually controllable element can provide a higher intensity level of radiation intensity in the middle stage and a lower intensity level.

在这种情况下,如图2所示的布置将能够在由聚焦元件照射的基底上的该区域处提供三个另外的辐射强度级,即在最小强度级和三分之一强度级(如上面提到的)之间的强度级,在三分之一强度级和三分之二强度级之间的强度级,以及三分之二强度级和最大强度级之间的强度级。 In this case, the arrangement shown in Figure 2 will be able to provide three additional radiation intensity level from the region of the focusing element is irradiated on the substrate, i.e., the minimum intensity level and the third intensity level (e.g. intensity level) between the above-mentioned, between one third and two thirds of the intensity levels of intensity level intensity levels, and two-thirds intensity level and a maximum intensity level between the intensity level.

应该理解,这一优点还适用于与每个聚焦元件相关联的任意数量的单独可控元件的使用。 It should be understood that this advantage also applies to the use of any number of elements each associated individually controllable element focusing. 而且,显而易见,为每个单独可控元件提供另外的控制状态进一步增加了能够在基底上的照射区域处所产生的强度级的数量。 Moreover, it is apparent, to provide additional control states for each individually controllable element further increases the number of possible intensity levels of the premises in the irradiation area on the substrate produced. 实际上,每个单独可控元件例如能够产生高达256个不同的强度级。 In fact, for example, each individually controllable element capable of generating up to 256 different intensity levels.

在如上所述的系统中,存在一些冗余。 In the system as described above, there is some redundancy. 例如,如果将第一个单独可控元件设置为第一状态并将其余两个设置为第二状态,与将第二个单独可控元件设置为第一状态并将其余两个设置为第二状态相比,基底上的照射区域处的辐射强度相等。 For example, if a first individually controllable element is set to a first state and a second state to the other two, and the second individually controllable elements set to the first state and the other two to the second state compared to the radiation intensity at the irradiation area on the substrate equal.

因此,可将与一个聚焦元件相关联的每个单独可控元件配置为在它们的每个状态下,这些单独可控元件都将入射到其上的不同比例的辐射强度引导至相关联的聚焦元件。 Thus, you can focus on each one individually controllable elements associated components configured to operate in each of their state, individually controllable elements will be the intensity of the radiation incident on the different proportions of its associated directed to focus element. 在这种情况下,例如如果将第一单独可控元件设置为其最大强度并将其余单独可控元件设置为最小强度,那么在将第二单独可控元件设置为其最大强度而将其他元件设置为最小强度时,在基底上的照射区域处所接收的辐射的强度不同。 In this case, for example, if a first individually controllable element is set to its maximum intensity and the remaining individually controllable elements is set to the minimum strength, the individually controllable elements in the second set to its maximum intensity and the other elements When set to the minimum intensity of the radiation received at different intensities in the irradiation area on the substrate. 因此,如果与该实施例一样,每个聚焦元件使用三个单独可控元件,并且每个单独可控元件都能够设置为三个不同的状态,那么在基底的照射区域中可产生九个不同的强度级。 Therefore, if as with the present embodiment, each focusing element with three individually controllable elements, and each of the individually controllable elements can be set to three different states, it can be produced in nine different shot areas of a substrate The intensity level.

如上所述,可将与每个聚焦元件相关联的单独可控元件配置为在其每个对应的状态下将入射到所述单独可控元件上的不同比例的辐射透射到该聚焦元件上。 As described above, can be configured with each of the individually controllable elements associated focusing element in each of which corresponds to a state incident to the individually controllable elements in different proportions of the radiation transmitted onto the focusing element. 但是,可替换的是,可将该装置配置为使入射到与一个聚焦元件相关联的每个单独可控元件上的辐射具有不同的强度级。 However, the alternative is that the device can be configured such that the radiation incident on each individually controllable element associated with one focusing element has a different intensity level. 这例如可通过提供与单独可控元件阵列相关联的衰减器阵列来实现。 This may be achieved, for example by providing an array of attenuators associated with the array elements individually controllable.

引导至第一单独可控元件的入射辐射例如可以一点都不衰减,而引导至与同一个聚焦元件相关联的其他每个单独可控元件的辐射衰减不同的量。 Directed to a first individually controllable element that is not possible, for example the incident radiation attenuation, and guided to the same and different amounts of radiation attenuation of each of the other individually controllable elements associated focusing element. 因此,即使在每个相应的状态中,每个单独可控元件将入射到其上的相同比例的辐射引导至该聚焦元件,该聚焦元件接收到的来自每个单独可控元件的辐射也不同。 Therefore, even in each respective state, each individually controllable element is incident on the same proportion of the radiation to the focusing elements, the focusing elements received radiation from each of individually controllable elements is different .

因此,如前所述,在由聚焦元件照射的基底的区域处形成另外的强度级。 Thus, as described above, in the region of the substrate illuminated by the focusing element is formed another intensity level. 应该理解,可替换地或者另外地,代替使入射到单独可控元件上的辐射衰减,可以使来自每个单独可控元件的辐射在该单独可控元件和相关联的聚焦元件之间衰减。 It should be understood, alternatively or additionally, instead of individually controllable radiation incident to the attenuation element, allows radiation from each individually controllable element between the focusing elements of the individually controllable elements and associated attenuation.

上述布置提供了控制在每个聚焦元件照射的基底区域中的辐射强度的方法。 Above arrangement provides control of radiation intensity in each zone focusing element substrate is irradiated in the approach. 因此,当对基底上的每个这些区域照射给定的曝光时间时,这些区域所接收的辐射剂量改变。 Thus, when each of these areas on the substrate is irradiated given exposure time, the radiation dose received by a change in these areas.

通过安排基底上的每个区域接受两次曝光,每一次对应两个强度中的一个,则可以提供对辐射的进一步控制。 By arranging each region on the substrate to accept double exposure, each corresponding to one of the two intensities, it is possible to provide further control of the radiation. 如果例如两次曝光中的每一次都是相等的时间量,那么该区域接收的剂量是已经接收到的在全部曝光时间保持第一次曝光的强度级的剂量和已经接收到的在全部时间保持第二次曝光的强度级的剂量的平均值。 If for example, every time an amount of time equal to twice the exposure, then the area receives a dose of the dose has been received intensity level at all times to keep the exposure of the first exposure has been received and is maintained at all times second exposure dose intensity level of average. 因此,可以提供另外的中间辐射剂量。 Accordingly, to provide additional radiation dose intermediate. 应该理解,通过提供更多的曝光(即,多于两次),可以提供更多的中间剂量级。 It should be understood that by providing more exposure (i.e., more than twice), can provide more intermediate dose level.

实际上,可以通过致动器使基底以恒定的速度相对于投影系统移动。 In fact, at a constant velocity relative to the projection system by an actuator to move the substrate. 在这种情况下,可以通过改变作用于单独可控元件的设置为基底上一点提供附加的剂量控制,同时该点通过由相关联的聚焦元件照射的区域。 In this case, it can change the effect of individually controllable elements disposed on a substrate to provide a little extra dose control, while the point region by the focusing element by irradiation associated. 例如,可以通过使该点通过照射区域在中途使之改变。 For example, you can change to make it by passing the halfway point through the irradiation area.

可替换地或另外地,当基底在投影系统下面扫描时,基底上的每个点都可以通过由两个或多个不同的聚焦元件照射的区域。 Alternatively or additionally, when the substrate is scanned beneath the projection system, each point on the substrate can be by two or more different focusing elements are irradiated areas. 在这种情况下,当所述点通过每个照射区域时,可以安排用于设置单独可控元件的控制器,用以在不同聚焦元件照射的不同区域中提供两个不同的辐射强度级。 In this case, when the point through each irradiation area can be arranged to set the individually controllable control element, for focusing different in different regions of the illumination elements providing two different radiation intensity levels.

因此,所述点将在必须的强度级由每个聚焦元件照射给定的时间量,产生所需的全部辐射剂量级。 Thus, the point will be illuminated by the intensity level of each focusing element given amount of time, resulting in all the required radiation dose level. 实际上,例如基底上的单一点可以通过由不同聚焦元件照射的几十个不同区域。 In fact, for example, by a single point dozens of different areas illuminated by different focusing elements on a substrate. 因此,每个点可能接受几十次独立的曝光,产生大量的灰度色调级(gray tone level)。 Thus, each point likely to accept dozens of independent exposure, generate a lot of shades of gray level (gray tone level).

应该理解,可以同时使用上述讨论的用于控制辐射剂量或灰度色调级的技术的任意组合。 Any combination is used to control the radiation dose level of technology or gray tones should be understood, it can be used simultaneously as discussed above. 例如,可以为基底上每个点的多次子曝光中的每一次提供许多强度级或灰度级。 For example, it can provide a lot of intensity levels or gray scale of several child for each point on the substrate exposure every time.

图3,4a和4b图解说明灰度色调曝光控制的优点。 Figure 3,4a and 4b illustrate the advantages of gray tones exposure control. 图3示出在没有灰度色调的曝光之后的基底40。 Figure 3 shows the substrate 40 after exposure of no shades of gray. 在区域44,45中,已经完全除去了抗蚀剂42,露出器件层41的对应部分,然后所述器件层的对应部分经历随后的加工操作。 44, 45 in the region, it has been completely removed the resist 42 to expose a corresponding portion of the device layer 41, then the corresponding portion of the device layer through subsequent processing operations. 在区域43,46中,在原地保留全部的抗蚀剂层,因此在该抗蚀剂下面的器件层的对应部分不受随后的加工操作的影响。 In the region 43, 46, in place of the resist layer to retain all, so the impact on the resist is not below the corresponding portion of a subsequent layer of the processing operation of the device.

图4a示出在利用灰度色调的曝光之后的基底40。 Figure 4a shows the substrate 40 after the exposure of the use of gray tones. 除了没有除去抗蚀剂的区域47,50和除去全部抗蚀剂的区域49之外,还有一个通过灰度色调曝光而部分除去抗蚀剂的区域48(即,该区域接收了在最小和最大剂量之间的辐射剂量)。 In addition to not have to remove and remove all resist regional areas where the resist 47, 50 49, there is a gray-tone exposure by partially removing the resist region 48 (ie, the area receives a minimum and The maximum radiation dose between doses). 因此,在随后而来的加工步骤中,只有器件层41的区域49暴露出来,并且受该加工步骤的影响。 Thus, from the subsequent processing steps, only the device region 49 of layer 41 is exposed and affected by the processing steps.

但是,随后,如图4b中所示,除去给定厚度的抗蚀剂42。 However, then, as shown in FIG. 4b, remove a given thickness of resist 42. 这使得已经接受了部分曝光的区域48中的器件层41暴露出来(以及已经曝光的区域49),但是没有暴露接受最小曝光的区域47,50中的器件层。 This makes it has accepted part of the exposed region 48 of the device layer 41 is exposed (and region 49 has been exposed), but not exposed receiving area 47, 50 in the minimum exposure device layer. 因此,在随后的加工步骤中,对区域48,49有影响,而对区域47,50没有影响。 Thus, in the subsequent processing steps, 48 and 49 of regional impact, but no impact on regional 47,50.

因此,第一组加工步骤可用于第一组区域,在只有一个辐射曝光步骤之后,第二组加工步骤可用于第二组区域。 Thus, the first set of processing steps can be used for the first set of regions, after only one radiation exposure step, a second set of processing steps can be used in a second set of regions. 这样,提供灰度色调控制可用于减少对辐射曝光步骤的要求。 Thus, the gray scale color tone control can be used to reduce radiation exposure step requirements. 应该理解,通过利用更多数量的灰度色调级,并且在一系列加工步骤之间重复地从器件除去给定均匀程度的抗蚀剂,能够进一步减少辐射曝光步骤的数量。 It should be appreciated, through the use of a greater number of gray tone levels and repeatedly removing a given device from the uniformity of the resist can be further exposed to radiation to reduce the number of steps between a series of processing steps.

上面已经借助于说明指定功能特性及其关系的功能构件块对本发明进行了说明。 As already described by means of specified features and functional building blocks relation to the invention has been described. 为了便于说明,在这里任意规定这些功能构件块的界限。 For convenience of explanation, a predetermined limit where any member of these functions blocks. 也能够固定可替换的界限,只要能够适当地执行其指定功能及其关系。 It can also be replaced by fixed boundaries, as long as they properly perform their designated functions and relationships.

因此,任何这种可替换的界限都在要求的本发明的范围和精神内。 Accordingly, the scope and spirit of the present invention to any limit in such alternative requirements within. 本领域的普通技术人员将认识到,这些功能构件块可以通过模拟和/或数字电路,分立元件,专用集成电路,固件,执行适当软件的处理器等或其组合来实现。 Processor of ordinary skill in the art will recognize that these functional building blocks can be analog and / or digital circuits, discrete components, application specific integrated circuits, firmware, executing appropriate software and the like or combinations thereof. 这样,本发明的广度和范围不应当受任何上述示范性实施方案的限制,而是应当仅仅依照下面的权利要求书及其等效范围的限制。 Thus, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments, but should be only in accordance with the book and its limits and equivalency range of the following claims.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
CN105319856A *27 Jun 201410 Feb 2016东捷科技股份有限公司Exposure system being adjustable in exposure intensity
Classifications
International ClassificationG03F7/20, H01L21/027
Cooperative ClassificationG03F7/70275, G03F7/70291, G03F7/70308, G03F7/70283
European ClassificationG03F7/70F18, G03F7/70F14, G03F7/70F12, G03F7/70F14B
Legal Events
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