CN1499623A - 引线框架、树脂密封型半导体装置及其制造方法 - Google Patents
引线框架、树脂密封型半导体装置及其制造方法 Download PDFInfo
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- CN1499623A CN1499623A CNA2003101025879A CN200310102587A CN1499623A CN 1499623 A CN1499623 A CN 1499623A CN A2003101025879 A CNA2003101025879 A CN A2003101025879A CN 200310102587 A CN200310102587 A CN 200310102587A CN 1499623 A CN1499623 A CN 1499623A
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002309324 | 2002-10-24 | ||
JP2002309320 | 2002-10-24 | ||
JP2002309320 | 2002-10-24 | ||
JP2002309324 | 2002-10-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1499623A true CN1499623A (zh) | 2004-05-26 |
CN100382296C CN100382296C (zh) | 2008-04-16 |
Family
ID=32109500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003101025879A Expired - Fee Related CN100382296C (zh) | 2002-10-24 | 2003-10-24 | 引线框架、树脂密封型半导体装置及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7042071B2 (zh) |
KR (1) | KR101019369B1 (zh) |
CN (1) | CN100382296C (zh) |
TW (1) | TWI311807B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100595912C (zh) * | 2006-02-28 | 2010-03-24 | 飞思卡尔半导体公司 | 多排引线框 |
CN101785101B (zh) * | 2007-07-12 | 2011-12-28 | 泰塞拉公司 | 微电子封装元件及其制备方法 |
CN107680913A (zh) * | 2011-10-10 | 2018-02-09 | 马克西姆综合产品公司 | 使用引线框架的晶圆级封装方法 |
CN113169150A (zh) * | 2021-03-10 | 2021-07-23 | 英诺赛科(苏州)半导体有限公司 | Iii族氮基半导体封装结构及其制造方法 |
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KR101070890B1 (ko) * | 2004-04-16 | 2011-10-06 | 삼성테크윈 주식회사 | 다열리드형 반도체 팩키지 제조 방법 |
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JP2006108306A (ja) * | 2004-10-04 | 2006-04-20 | Yamaha Corp | リードフレームおよびそれを用いた半導体パッケージ |
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US20060181861A1 (en) * | 2005-02-17 | 2006-08-17 | Walker Harold Y Jr | Etched leadframe for reducing metal gaps |
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JP5122172B2 (ja) | 2007-03-30 | 2013-01-16 | ローム株式会社 | 半導体発光装置 |
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2003
- 2003-10-22 US US10/689,642 patent/US7042071B2/en not_active Expired - Lifetime
- 2003-10-23 TW TW092129430A patent/TWI311807B/zh not_active IP Right Cessation
- 2003-10-24 KR KR1020030074484A patent/KR101019369B1/ko active IP Right Grant
- 2003-10-24 CN CNB2003101025879A patent/CN100382296C/zh not_active Expired - Fee Related
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2005
- 2005-06-17 US US11/154,541 patent/US7132315B2/en not_active Expired - Lifetime
Cited By (5)
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CN100595912C (zh) * | 2006-02-28 | 2010-03-24 | 飞思卡尔半导体公司 | 多排引线框 |
CN101785101B (zh) * | 2007-07-12 | 2011-12-28 | 泰塞拉公司 | 微电子封装元件及其制备方法 |
CN107680913A (zh) * | 2011-10-10 | 2018-02-09 | 马克西姆综合产品公司 | 使用引线框架的晶圆级封装方法 |
CN113169150A (zh) * | 2021-03-10 | 2021-07-23 | 英诺赛科(苏州)半导体有限公司 | Iii族氮基半导体封装结构及其制造方法 |
CN113169150B (zh) * | 2021-03-10 | 2022-06-14 | 英诺赛科(苏州)半导体有限公司 | Iii族氮基半导体封装结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100382296C (zh) | 2008-04-16 |
US20050236701A1 (en) | 2005-10-27 |
TWI311807B (en) | 2009-07-01 |
KR20040036643A (ko) | 2004-04-30 |
TW200425450A (en) | 2004-11-16 |
US7132315B2 (en) | 2006-11-07 |
US7042071B2 (en) | 2006-05-09 |
KR101019369B1 (ko) | 2011-03-07 |
US20040080026A1 (en) | 2004-04-29 |
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