CN1351733A - Method for the production of a portable integrated circuit electronic device comprising a low-cost dielectric - Google Patents
Method for the production of a portable integrated circuit electronic device comprising a low-cost dielectric Download PDFInfo
- Publication number
- CN1351733A CN1351733A CN00807974A CN00807974A CN1351733A CN 1351733 A CN1351733 A CN 1351733A CN 00807974 A CN00807974 A CN 00807974A CN 00807974 A CN00807974 A CN 00807974A CN 1351733 A CN1351733 A CN 1351733A
- Authority
- CN
- China
- Prior art keywords
- chip
- grid
- manufacture method
- insulation strip
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention relates to a method for the production of a portable integrated circuit electronic device, whereby an integrated circuit chip (10) is transferred onto a dielectric support (60) and connected to a metal grid (18) comprising contact pads (19a) and connection pads (19b). The invention is characterized in that it comprises a step in which a housing (85) is created for the chip (10) on a metal grid (18) by arching (80) said grid. The dimensions of the housing (85) enable said housing to accommodate the thickness of the card (10) and the contact pads (11) thereof. The invention is also characterized in that the grid (18) is laminated on the dielectric support (60), whereby each contact pad (11) of the card (10) can be placed opposite to and in contact with said connection pads (19b) of the grid (18).
Description
The present invention relates to make a kind of portable electric appts, wherein comprise an integrated circuit (IC) chip at least, and chip is embedded in a kind of carrier and be electrically connected with conversion element that terminal block and/or antenna are formed.
This class portable electric appts for example, has constituted various contacts and/or contactless smart card or electronic tag.
Contact and/or contactless smart card are intended to finish various operations, the operation such as banking, telephonic communication, various identifying operation or automated teller.
Contact intelligent card has the metallization exposed part that is arranged on card face or the card body, according to common ISO 7816 standard definitions, places card more on one's body.These metallized parts will come in contact with the reading head of card reader, so that the electrical transmission data.
Contact type intelligent card is provided with a kind of antenna, by the electromagnetic coupled between the electron device in the smart card and receptacle or the card reader, with extraneous exchange message.This electromagnetic coupled can realize under reading mode or read/write mode, and data transmission is carried out with wireless communication frequency or microwave frequency.
Also have a kind of hybrid card or title " composite card (combicards) ", this card both was provided with the metallization exposed part on the card surface, was embedded in antenna equipment at the card body again.Therefore when this smart card and extraneous swap data, can also can under contactless pattern, carry out in the contact pattern.
Contact or the contactless smart card of producing all is standard-sized sheet type easily transported package at present.ISO 7810 standards are corresponding to the card body of the standard specification of long 85mm, wide 54mm, thick 0.76mm.
The manufacture process of most of smart cards, be based on integrated circuit (IC) chip is assembled among the parts that are referred to as micromodule, this module connects a communication interface and embeds in the card, among the dimple that uses the known technology of brainstrust to put it in other words to provide on the card body.
Fig. 1 illustrates a kind of traditional method for making.This method a kind of integrated circuit 10 that is to bond with its workplace and contact mat 11 thereof up, and is glued at its reverse side on the insulation support plate 15.Insulation support plate 15 is seated in itself to be used on the contact grid of making such as nickel plating copper coin and gold-plated copper coin 18.Make on the support plate 15 in insulation and to connect well 16, so that the contact mat 11 on the chip 10 is connected with contact regions on the grid 18 by wiring 17.
According to some diverse ways, can chip 10 workplaces are directly glued up on contact grid 18, connect with hardwired 17 then.
In this diverse ways, grid 18 is applied on insulation support plate 15 by heavy, and the bonding pad, contact on the grid is to determine with etching method or other known way.
Be the step of a protection or encapsulation then, in order to protection chip 10 and the line 17 that welds.Usually be called " dripping top (glob top) " method in the used technology English, chip is got up from top covering.This technology is at chip 10 and resin 20 of line 17 top castings thereof, and for example according to the thermoforming principle of epoxy resin, perhaps cross-coupled effect under the ultraviolet ray irradiation forms the tear drop that seals.
Fig. 2 illustrates a kind of different embodiment, and its chips 10 is connected on the metallic grid 18 according to a kind of " upside-down method of hull-section construction (flip chip) ", and this is a kind of known method, and its chips is that upset is placed.
Shown in the example, couple together by the anisotropic glue 350 of a kind of electric conductivity between chip 10 and the metallic grid 18, this glue is well-known, usually is used for bonding from the teeth outwards passive component.Output pad 11 on the chip 10 is in the face of the bonding pad on the grid 18.In fact, contain in this glue 350 elastically-deformable conducting particles can take place, so when between the bonding pad of output pad 11 and grid 18, pressurizeing, can make it have electric conductivity along the z axle direction of thickness (promptly along), and other direction (x y) but presents the character of insulation.
In a kind of embodiment of variation, chip 10 is connected with conduction between the grid 18 and can be improved by the thrust that is made on the chip 10 output pads 11, and they are to make with the hot melt alloy of tin/plumbous class or with conducting polymer.
Under the situation of contact intelligent card, micromodule 100 embeds in advance within ready dimple on the card body.The process of embedding operation is that elder generation puts into glue in card body dimple, micromodule 100 is glued thereon again.
Fig. 3 illustrates another kind of embedded technology.Card body 110 is according to the conventional method, for example plastics is injected mould and produces.Obtain the way of dimple 120, or be, or use suitable mold to make the card body that has dimple with injection method by Milling Process on the card body.
With the heated lamination method with the active mucous membrane 23 of a kind of heat attached on the dielectric film 15, preferably before micromodule 100 cuts out, carry out.This module is imbedded among the dimple of smart card body 110, and the hot-pressing processing of the pressing element 24 by a kind of suitable dimple 120 shapes, activation heat reactive adhesive 23 carries out gluing again.
The above-mentioned technology that these make contact intelligent card exists many shortcomings.
In fact, these methods need many operations.When doing protection with resin, for being met the demands, shape and thickness needs usually resin is processed polishing, and constitute a kind of operation of complicated costliness, and applied a kind of stress to chip.
Especially, the technology of standard will be used expensive technology and high-quality insulating material.Used insulating material is normally with a kind of glass epoxy composite material or claim what Kapton made.
This is because selected insulating material must have good heat-insulating property, so that be fit to above-mentioned embedded technology.
In addition, delimit, generally be by the way of chemical etching the metallic grid of uniform deposition on the insulation support plate to be handled to obtain for how much of different contact regions and bonding pad.Yet chemical etching is the operation of a costliness.
Under the situation of contact type intelligent card or electronic tag, the example shown in the image pattern 4, micromodule 100 is connected with antenna 55.
Then, according to above-mentioned for example " top " technology, chip 10 and a kind of resin 20 of line 16 usefulness thereof are protected.
Connection between antenna 55 and the metallic grid 18 can connect by tin/lead welding, perhaps realizes by conductive adhesive or lamination.
In order to have the final thickness of determining, contact type intelligent card body heat laminating layer plastic sheeting, the way that adds the resin lining between two insulcretes 15 that perhaps separate at pillar and 52 is made.
Under the situation of electronic tag, the selection of the antenna of finalizing the design at last is by casting label body or realize by laminated plastic film or by inserting a plastic sheath around the electronic equipment.
These technology of making non-contact electronic have many shortcomings.
The shortcoming of the manufacturing contact intelligent card technology of quoting as proof is previously found also to be present in the making of contact type intelligent card.
In addition, the protection chip is complicated work, because if the module on the band 52 is dense, sealing usually is impossible, forces fabricator's excessively casting on micromodule.
Purpose of the present invention is exactly to reduce the various shortcomings of previous technology.
For this reason, the present invention proposes a kind of method of making electronic equipment, makes it to use cheap material, particularly can use inexpensive insulating material.
In addition, the present invention places contact mat on the chip and the contact regions on the grid face to face by producing a kind of grid of arch form, thereby has simplified the step that connects chip.
Purpose of the present invention is said so in more detail, proposes a kind of method of making integrated circuit electronic device, comprising an integrated circuit (IC) chip, invests on the insulation support plate and is connected with a metallic grid with contact regions and bonding pad.The method is characterized in that, comprise a production stage, metallic grid is made arch form, form a chip mask, its thickness just in time can hold chip and contact pins thereof; The feature of this method also is, described grid layer is pressed on the insulation support plate, thereby can make the contact regions on each contact mat and grid on the chip, face to face and connect.
According to a feature of the present invention, the insulation support plate is a strip, separates with the contact regions on the metallic grid.
According to another characteristics of the present invention, metallic grid also has one second arch form, can housing insulation props up the thickness of lath, make it with metallic grid on contact regions be in same plane.
In a kind of different embodiment, insulation strip is made up of polyester vinyl (PET).
In the different embodiment of another kind, insulation strip is made up of a kind of acrylonitrile-butadiene-styrene (ABS) (ABS).
In the different embodiment of another kind, insulation strip is made up of paper.
Change in the embodiment at another, insulation strip (60) is made up of a kind of Polyvinylchloride (PVC).
According to an one feature, insulation strip has the surface of a viscose glue, can be with the chip gluing on insulation strip.
According to an one feature, datum hole and/or target all are made on the insulation strip, thereby can be accurately glued on said insulation strip chip.
According to a kind of different embodiment, the contact mat on the chip connects together with laser bonding with contact regions on the grid.
According to the different embodiment of another kind, place on the contact mat of chip with the projection made of polymkeric substance of conduction, the bonding pad is that way with heat lamination links together on this contact mat and the grid.
According to first kind of application of the present invention, its method for making comprises a step that micromodule is sticked to card body dimple.
The adhesion micromodule is compressed on the lip-deep glued membrane of whole metallic grid in advance by activation and realizes.
This glued membrane also is a kind of insulator, provides a kind of protection to chip.
According to second kind of application of the present invention, its method for making comprises the step that micromodule is connected an antenna.
By with a kind of dielectric film of whole metallic grid surface compacting, thereby chip is protected.
Superiority is that insulation strip has solved the Insulation Problems between center of antenna coil sections circle and the circle easily.
The invention still further relates to a kind of integrated circuit electronic module, an integrated circuit (IC) chip invests on the insulation support plate and with a communication interface with contact regions and bonding pad and is connected.It is characterized in that communication interface is made up of an arch form metallic grid, form a chip mask, its size can be held the thickness of chip and contact mat thereof; Its feature also is, the bonding pad on the grid and the contact mat of chip and link together face to face.
According to a feature of the present invention, the insulation support plate is a strip, separates with contact regions.
According to another feature of the present invention, metallic grid has two different arch forms, and first arch form holds the thickness of chip and contact mat thereof, and the thickness of the second arch form housing insulation bar.
According to a feature of the present invention, on the surface of whole metallic grid, suppressed layer protecting film.
The present invention is applicable to any portable integrated circuit device, such as various smart cards or electronic tag etc., comprising an electronic module of the present invention.
The present invention makes us prepare a kind of sheet type electronics micromodule with moisture resistance performance with a kind of simple and economic method.
The particularly important is, this method of the present invention makes us might use the lower insulating material of a kind of quality, and this material does not require to have the traditional character compatible mutually with embedded technology commonly used.
This be because, and will more accurately display below, this insulator does not comprise the contact regions of metallic grid.But in telescopiny, these contact regions will be carried out compression process just, or carry out gluing with the viscose glue of cyanoacrylate one class.
The superiority of this method of the present invention is onlinely to construct, and need not interrupt.
In addition, the superiority of manufacture method of the present invention is to have simplified the manufacturing process that chip is connected to bonding pad on the grid greatly.
In addition, omitted the step of sealing and milling fully,, and suppressed thin film on the surface of whole grid because chip is by the grid protection.
Other feature and advantage please be read giving an example of following illustrative indefiniteness, and with reference to appended illustration, wherein:
-Fig. 1 had done explanation, and the cross-sectional view of micromodule classic method is produced in expression;
-Fig. 2 had done explanation, and the cross-sectional view of micromodule classic method is produced in expression, with a kind of variation embodiment that is connected chip;
-Fig. 3 had done explanation, and expression embeds the synoptic diagram of micromodule according to known method;
-Fig. 4 had done explanation, and expression is fixed on synoptic diagram on the antenna according to known method with micromodule;
-Fig. 5 is the cross-sectional view of first kind of embodiment of manufacture method of the present invention;
-Fig. 6 is the cross-sectional view of second kind of embodiment of manufacture method of the present invention;
-Fig. 7 represents that manufacture method of the present invention embeds the synoptic diagram of micromodule;
-Fig. 8 is the micromodule that method constructed in accordance obtains, under look, on one side the synoptic diagram of looking from assembling parts;
-Fig. 9 is the micromodule that method constructed in accordance obtains, from looking, on one side the synoptic diagram of looking from the contact;
-Figure 10 is the synoptic diagram that the present invention makes each step of micromodule;
-Figure 11 is the schematic plan view of the third embodiment of manufacture method of the present invention;
-Figure 12 is the cross-sectional view that micromodule of the present invention is connected to a serigraphy antenna.
Fig. 5 and Fig. 6 represent micromodule first and second embodiments of the present invention.
These preceding two kinds of embodiments are applicable to contact intelligent card.
Integrated circuit (IC) chip 10 gluings are on insulation strip 60, and the latter is laminated to metallic grid 18; Grid 18 is done one or two arch form bending, and first is curved to be in order to hold the thickness of chip 10 and contact mat 11 thereof, so that make bonding pad 19b on the grid 18 in the face of the contact mat 11 on the chip 10; And second curved be thickness for housing insulation bar 60 so that make the contact regions 19a on it and the grid 18 be in same plane.
Preferred scheme is to make thrust 12 in advance on each contact mat 11 of chip 10.These thrusts 12 are to improve contact mat 11 on the chip 10 and the electric conductivity between the bonding pad 19b on the grid 18.Therefore they must be made with a kind of conductive material, for example use gold, or make with the polymeric material that is rich in metallics.
On the surface of whole grid 18, cover the diaphragm 25 that one deck has the cross connection adhesive property.This diaphragm 25 is not a porous, not as the situation of front, makes chip 10 and its bonding pad separately.
Manufacture method of the present invention comprises following each step at least.
These steps are carried out illustrative with graphical method in Figure 10.
A kind of insulating material of cheapness is cut into the band shape.This insulation strip 60 can be PET (polyester vinyl), PEN (polyethylene nerephthalate), cardboard, ABS (acrylonitrile-butadiene-styrene (ABS)), PVC (Polyvinylchloride) or any other known inexpensive insulation material.
When insulating material is cut into the shape of insulation strip 60, make datum hole by certain spacing (for example 9.5 millimeters), so that accurately glued thereafter chip 10.
According to variant embodiment, can determine the position of datum hole by in advance bonding sign being printed on the insulation strip 60.
Then according to selected spacing pattern accurately with chip 10 gluings on insulation strip 60.
According to variant embodiment, the bonding agent of insulation strip 60 or be thermoactive carries out chip 10 hot sticky; Perhaps constituted, at room temperature chip 10 is carried out cold bonding by one " grume ".
Also may pass through deposition one deck viscose glue on insulation strip 60, and chip 10 is sticked on this deposition glue-line.
According to datum hole and/or the sign done on insulation strip 60 in advance, accurate gluing will be guaranteed.
Parallel with it, metallic grid 18 for example is that make on the basis with the aldary, covers one deck electrolytic deposition, for adapting to connection type, wishes to generate such as gold coated films or nickel plating film.
According to a feature of the present invention, the arch form bending method that these grid 18 usefulness are traditional for example uses the method for punch press, makes one or two arch form bending.
In the embodiment of variation shown in Figure 5, this grid carries out twice of arch form bending.
First arch form 80 is to contain chip 10 and thrust 12 thereof, so that the bonding pad 19b on the grid 11 and thrust 12 is relative and put.
Second arch form 81 is steps of wanting housing insulation bar 60, on one side be complete smooth micromodule 100 to obtain one at contact regions 19a.Like this, insulation strip 60 is concordant with the contact regions 19a on the grid 18, and making it freely outwards provides communication from circuit.
In the embodiment of variation shown in Figure 6, first arch form bending 80 is only arranged.
Second arch form 81 can make insulation strip 60 be laminated to easily on the grid 18, is that insulation strip 60 forms a kind of guide simultaneously.
According to the witness marker on the insulation strip 60 and/or according to second arch form 81 carried out laminated into type, make bonding pad 19b on the grid 18 in the face of the contact mat 11 on the chip 10, perhaps also provide thrust 12 on it.
Be noted that the chip 10 that is connected below the grid 18, the contact regions 19a on the grid 18 is by bonding pad 19b, directly interrelates with contact mat 11 on the chip 10.Therefore, will can not propose to resemble a kind of problem of connection mode of suitable complexity of in above-mentioned " upside-down mounting " method, being compelled to do.
At this moment the bonding pad 19b on contact mat on the chip 10 and the grid 18 must be linked together.
For this reason, available different known method, method of laser welding for example perhaps is coated with the method for a kind of anisotropic adhesive or hot pressing, perhaps, carry out this connection by activating the method be placed in the conductive polymer thrust on the contact mat 11 on the chip 10 in advance etc.
Comparatively advantageous method is, and is pointed with reference to former technology as us, covers layer of adhesive film 25 on grid 18, can make its activation by to whole useful surface heating or the method for exerting pressure, and carries out bonding processing.
The character that adhesive films 25 has insulation is very favourable, and chip 10 is played the additional protection effect.This is because different with in the past common technology, does not punch on the adhesive films 25 and digs a hole.
Therefore, in this a kind of manufacture method, can get rid of the technology of brushing one deck protection resin on chip 10 fully.
Cut out micromodule 100 with punch press or laser beam then, activated adhesive film 25 or be coated with a cyanoacrylate adhesive again is installed to module in the dimple on the smart card body.
Fig. 7 illustrates the technology activated adhesive film 25 with hot pressing, and micromodule 100 is embedded the step among the dimple 120 on the card body 100.
This figure clearly illustrates that, not to insulation strip 60 but only metallic grid 18 is carried out hot pressing, punch press 24 has a groove corresponding to insulation strip 60.
Equally,, so only between the metallic grid 18 of the dimple 120 of card body 100 and not essential adhesive films 25, use glue if selected for use a kind of cyanoacrylate adhesive that uses to carry out glued method, and on the insulation strip 60 without glue.
Fig. 8 and Fig. 9 represent respectively below micromodule and above the synoptic diagram of looking, this module obtains according to the manufacture method that the present invention is used for contact intelligent card.
Fig. 5 and Fig. 6 are the A-A sections in the presentation graphs 8.
Fig. 8 clearly illustrates that the arch form 80 and 81 on the metallic grid 18, first between contact regions 19a and bonding pad 19b boundary, and second may the demarcating of insulation strip 60 zones of living in.
Fig. 9 represents the outside of micromodule, the ISO surface of contact.
According to the disclosed a kind of different embodiment in front, insulation strip 60 is concordant with metallic grid 18 upper contact district 19a.The lateral surface of the smart card that therefore, obtains like this is fully straight.
In the another kind of different embodiment, insulation strip 60 will form a little step at the top of contact regions 19a.
In addition, chip connecting terminal piece 18 has a center corresponding to insulation strip 60 on the card, can stamp sign or pattern (preferably printing at once when insulating material is cut into stripe shape) on it.The serial number that this one side of insulation strip 60 may have different colors and/or have fastener.
Figure 11 and Figure 12 illustrate the third embodiment of micromodule of the present invention, are applicable to contactless fastener or electronic tag.
Figure 11 and Figure 12 represent the plan view and the viewgraph of cross-section of the third embodiment manufacture method according to the present invention respectively.
Here be to repeat the method that the front is introduced contact intelligent card, the operation that arch form grid 18 is laminated on the insulation strip 60 is more prone to.Because the number of the contact mat 18 on the chip 10 only is two, have or not thrust 12 all can, be connected to bonding pad 19b.
And a kind of solid film 26 of lamination can play a protective role to chip 10 on the whole surface of micromodule 100.Therefore resin of relevant casting in the prior art with the problem that encapsulates or the excess casting is protected, has all been omitted.
In addition, represented as Figure 11, interrelate with this application, may suppress insulation strip 60 as much as possible, in order to optimize the number of micromodule on the grid 18.
Figure 12 represents being connected of micromodule 100 and antenna 50, uses standard technique to finish.
Favourable place is that under the situation of serigraphy antenna, insulation strip 60 can play the effect that other coil on contact 55 and the antenna 50 is kept apart.This just may be avoided removing a kind of insulating material of serigraphy again in the centering coil part.
Claims (22)
1. method of making portable integrated circuit electronic device, integrated circuit (IC) chip (10) places insulating carrier (60) upward and with the metallic grid (18) with contact regions (19a) and bonding pad (19b) to be connected, this manufacture method is characterised in that, comprising a step is by metallic grid (18) is done arch form bending (80), make a mask (85) for the chip on the grid (10), its size dimension can be accepted the thickness of chip and contact mat (11) thereof; And grid (18) is laminated on the insulating carrier (60), with activation each contact mat (11) on the chip (10) in the face of the bonding pad (19b) on the grid (18), and interconnect.
2. according to the manufacture method of claim 1, it is characterized in that insulating carrier (60) is made up of a band, it has separated the contact regions (19a) on the metallic grid (18).
3. according to the manufacture method of claim 2, it is characterized in that metallic grid (18) also has second arch form (81), thickness that can housing insulation bar (60), after the latter put into, concordant with the contact regions (19a) on the metallic grid (18).
4. according to the manufacture method of 1 to 3 any claim, it is characterized in that insulation strip (60) is made up of a kind of polyester vinyl (PET).
5. according to the manufacture method of 1 to 3 any claim, it is characterized in that insulation strip (60) is made up of a kind of acrylonitrile-butadiene-styrene (ABS) (ABS).
6. according to the manufacture method of 1 to 3 any claim, it is characterized in that insulation strip (60) is made up of paper.
7. according to the manufacture method of 1 to 3 any claim, it is characterized in that insulation strip (60) is made up of a kind of Polyvinylchloride (PVC).
8. according to the manufacture method of above any claim, it is characterized in that insulation strip (60) has a gluing surface chip (10) can be bonded on the insulation strip (60).
9. according to the manufacture method of above any claim, it is characterized in that insulation strip is made benchmark and/or control hole on (60), so that accurately chip (10) is bonded on the insulation strip (60).
10. according to the manufacture method of 1 to 9 any claim, it is characterized in that, the contact mat (11) on the chip (10) is connected to bonding pad (19b) on the grid (18) with method of laser welding.
11. manufacture method according to 1 to 9 any claim, the thrust made from conducting polymer places on the contact mat on the chip (10), it is characterized in that the contact mat (11) on the chip (10) is that the technology with heat lamination is bonded in grid (18) and goes up on the bonding pad (19b).
12. the manufacture method according to 1 to 11 any claim is characterized in that, comprising the step among the dimple that micromodule (100) is pasted on the smart card body.
13. the manufacture method according to claim 12 is characterized in that, stickup micromodule (100) is laminated to the lip-deep layer of adhesive film of whole metallic grid (18) (25) in advance by activation and realizes.
14. the manufacture method according to claim 13 is characterized in that, adhesive films (25) also is a kind of insulator, for chip (10) provides protective effect.
15. the manufacture method according to 1 to 11 any claim is characterized in that, is that micromodule (100) is connected on the antenna (50) comprising a procedure.
16. the manufacture method according to claim 15 is characterized in that, the surface laminated of whole metallic grid (18) one deck insulation film (26), make chip (10) be protected.
17. the manufacture method according to claim 15 is characterized in that, the insulation between each circle circle of antenna (50) core is provided by insulation strip (60).
18. integrated circuit electronic module, integrated circuit (IC) chip (10) is bonded in insulating carrier (60) and upward and with the communication interface (18) with contact regions (19a) and bonding pad (19b) is connected, it is characterized in that, communication interface (18) is made up of the metallic grid (18) of an arch form, arch form (802) has been determined a mask (85) for chip (10), and its size dimension can hold the thickness of chip (10) and contact mat (11) thereof; And the contact mat (11) on the chip (10) is faced in the bonding pad (19b) on the grid (18), and interconnects.
19. the electronic module according to claim 18 is characterized in that, insulating carrier (60) is made up of a band that contact regions (19a) is separated.
20. electronic module according to claim 19, it is characterized in that, metallic grid (18) has two arch forms that separate, and first arch form (80) holds the thickness of chip (10) and contact mat (11) thereof, and the thickness of second arch form (81) housing insulation bar (60).
21., it is characterized in that a kind of protective film (25) places the surface of whole metallic grid (18) according to one of them electronic module of claim 18 to 20.
22. a portable integrated circuit device such as smart card, electronic tag, has comprised one of them electronic module of claim 18 to 21.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR99/06585 | 1999-05-25 | ||
| FR9906585A FR2794266B1 (en) | 1999-05-25 | 1999-05-25 | METHOD FOR MANUFACTURING PORTABLE ELECTRONIC DEVICE WITH INTEGRATED CIRCUIT HAVING LOW COST DIELECTRIC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1351733A true CN1351733A (en) | 2002-05-29 |
Family
ID=9545963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN00807974A Pending CN1351733A (en) | 1999-05-25 | 2000-05-11 | Method for the production of a portable integrated circuit electronic device comprising a low-cost dielectric |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6521985B1 (en) |
| EP (1) | EP1190377B1 (en) |
| CN (1) | CN1351733A (en) |
| AT (1) | ATE236436T1 (en) |
| AU (1) | AU4415800A (en) |
| DE (1) | DE60001943D1 (en) |
| FR (1) | FR2794266B1 (en) |
| WO (1) | WO2000072254A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102663474A (en) * | 2010-12-06 | 2012-09-12 | 欧贝特科技公司 | Method for manufacturing microcircuit device |
| US9594999B2 (en) | 2012-04-03 | 2017-03-14 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
| US9688850B2 (en) | 2012-04-03 | 2017-06-27 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| CN111129272A (en) * | 2018-10-31 | 2020-05-08 | 台湾爱司帝科技股份有限公司 | Method and device for fixedly connecting light-emitting diode chip |
| US10906287B2 (en) | 2013-03-15 | 2021-02-02 | X-Card Holdings, Llc | Methods of making a core layer for an information carrying card, and resulting products |
| US11361204B2 (en) | 2018-03-07 | 2022-06-14 | X-Card Holdings, Llc | Metal card |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5817207A (en) | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
| US6791172B2 (en) * | 2001-04-25 | 2004-09-14 | General Semiconductor Of Taiwan, Ltd. | Power semiconductor device manufactured using a chip-size package |
| US20050266611A1 (en) * | 2004-06-01 | 2005-12-01 | Jack Tu | Flip chip packaging method and flip chip assembly thereof |
| EP1739596A1 (en) * | 2005-06-21 | 2007-01-03 | VisionCard PersonalisierungsgmbH | Chipcard and method of manufacturing the same |
| US7777317B2 (en) * | 2005-12-20 | 2010-08-17 | Assa Abloy Identification Technologies Austria GmbH (Austria) | Card and manufacturing method |
| US10043541B1 (en) * | 2015-12-12 | 2018-08-07 | Magnecomp Corporation | Disk drive head stack assembly having height-controlled suspension circuit tail tack |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH074995B2 (en) * | 1986-05-20 | 1995-01-25 | 株式会社東芝 | IC card and method of manufacturing the same |
| JPH01108095A (en) * | 1987-10-20 | 1989-04-25 | Ryoden Kasei Co Ltd | Ic card |
| JP3061954B2 (en) * | 1991-08-20 | 2000-07-10 | 株式会社東芝 | Semiconductor device |
| EP0689241A2 (en) * | 1991-10-17 | 1995-12-27 | Fujitsu Limited | Carrier for carrying semiconductor device |
| TW258829B (en) * | 1994-01-28 | 1995-10-01 | Ibm | |
| EP0688050A1 (en) * | 1994-06-15 | 1995-12-20 | Philips Cartes Et Systemes | Assembly method for integrated circuit card and such obtained card |
| FR2733553B1 (en) * | 1995-04-25 | 1997-07-11 | Pem Sa Protection Electrolytiq | LAMINATION DEVICE FOR SOLIDARIZING A METAL STRIP AND A STRIP OF INSULATING MATERIAL |
| US5710695A (en) * | 1995-11-07 | 1998-01-20 | Vlsi Technology, Inc. | Leadframe ball grid array package |
| FR2741191B1 (en) * | 1995-11-14 | 1998-01-09 | Sgs Thomson Microelectronics | PROCESS FOR MANUFACTURING A MICROMODULE, PARTICULARLY FOR CHIP CARDS |
| DE19621044A1 (en) * | 1996-05-24 | 1997-11-27 | Giesecke & Devrient Gmbh | Method for producing a card-shaped data carrier |
| JPH09327990A (en) * | 1996-06-11 | 1997-12-22 | Toshiba Corp | Card type storing device |
-
1999
- 1999-05-25 FR FR9906585A patent/FR2794266B1/en not_active Expired - Fee Related
-
2000
- 2000-05-11 DE DE60001943T patent/DE60001943D1/en not_active Expired - Lifetime
- 2000-05-11 AT AT00925432T patent/ATE236436T1/en not_active IP Right Cessation
- 2000-05-11 CN CN00807974A patent/CN1351733A/en active Pending
- 2000-05-11 AU AU44158/00A patent/AU4415800A/en not_active Abandoned
- 2000-05-11 US US09/979,601 patent/US6521985B1/en not_active Expired - Fee Related
- 2000-05-11 EP EP00925432A patent/EP1190377B1/en not_active Expired - Lifetime
- 2000-05-11 WO PCT/FR2000/001268 patent/WO2000072254A1/en active IP Right Grant
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102663474B (en) * | 2010-12-06 | 2017-08-22 | 欧贝特科技公司 | The method for manufacturing microcircuit devices |
| CN102663474A (en) * | 2010-12-06 | 2012-09-12 | 欧贝特科技公司 | Method for manufacturing microcircuit device |
| US11359084B2 (en) | 2012-04-03 | 2022-06-14 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US10836894B2 (en) | 2012-04-03 | 2020-11-17 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| CN104487988B (en) * | 2012-04-03 | 2017-12-01 | X卡控股有限公司 | Information-carrying card and its manufacture method comprising crosslinking polymer composition |
| US10127489B2 (en) | 2012-04-03 | 2018-11-13 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
| US10255539B2 (en) | 2012-04-03 | 2019-04-09 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
| US10392502B2 (en) | 2012-04-03 | 2019-08-27 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US10570281B2 (en) | 2012-04-03 | 2020-02-25 | X-Card Holdings, Llc. | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US10611907B2 (en) | 2012-04-03 | 2020-04-07 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US11560474B2 (en) | 2012-04-03 | 2023-01-24 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US9688850B2 (en) | 2012-04-03 | 2017-06-27 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US11555108B2 (en) | 2012-04-03 | 2023-01-17 | Idemia America Corp. | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US11390737B2 (en) | 2012-04-03 | 2022-07-19 | X-Card Holdings, Llc | Method of making an information carrying card comprising a cross-linked polymer composition |
| US11359085B2 (en) | 2012-04-03 | 2022-06-14 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US9594999B2 (en) | 2012-04-03 | 2017-03-14 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
| US10906287B2 (en) | 2013-03-15 | 2021-02-02 | X-Card Holdings, Llc | Methods of making a core layer for an information carrying card, and resulting products |
| US11884051B2 (en) | 2013-03-15 | 2024-01-30 | X-Card Holdings, Llc | Methods of making a core layer for an information carrying card, and resulting products |
| US11361204B2 (en) | 2018-03-07 | 2022-06-14 | X-Card Holdings, Llc | Metal card |
| US11853824B2 (en) | 2018-03-07 | 2023-12-26 | X-Card Holdings, Llc | Metal card |
| CN111129272B (en) * | 2018-10-31 | 2021-03-16 | 台湾爱司帝科技股份有限公司 | Method and device for fixedly connecting light-emitting diode chip |
| CN111129272A (en) * | 2018-10-31 | 2020-05-08 | 台湾爱司帝科技股份有限公司 | Method and device for fixedly connecting light-emitting diode chip |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2794266A1 (en) | 2000-12-01 |
| WO2000072254A1 (en) | 2000-11-30 |
| FR2794266B1 (en) | 2002-01-25 |
| AU4415800A (en) | 2000-12-12 |
| EP1190377B1 (en) | 2003-04-02 |
| ATE236436T1 (en) | 2003-04-15 |
| US6521985B1 (en) | 2003-02-18 |
| EP1190377A1 (en) | 2002-03-27 |
| DE60001943D1 (en) | 2003-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8819918B2 (en) | Manufacturing method for a dual interface card | |
| CN1131563C (en) | Semiconductor assembly | |
| CN101385402B (en) | Circuit board and process for producing the same | |
| US11222861B2 (en) | Dual-interface IC card module | |
| CN1969287A (en) | Combi-card and method for making the same | |
| KR101145535B1 (en) | Method for applying an electronic assembly to a substrate and a device for applying said assembly | |
| JP2004521429A (en) | Contactless smart card having antenna support and chip support made of fibrous material | |
| CN102663474B (en) | The method for manufacturing microcircuit devices | |
| CN1050681C (en) | Non-contact type IC card and method and apparatus for manufacturing the same | |
| JP2006252390A (en) | Ic card manufacturing method and ic card | |
| CN1351733A (en) | Method for the production of a portable integrated circuit electronic device comprising a low-cost dielectric | |
| CN1214346C (en) | Method for making contactless chip card | |
| JP2000182017A (en) | Ic card used as contacing/noncontacting type and its manufacture | |
| CN1324470A (en) | Method for making a contactless chip card | |
| JP5042627B2 (en) | Mounting electronic components on a board | |
| CN106991466A (en) | Double-interface smart card and its manufacture method | |
| JP2000148949A (en) | Non-contact ic card and its manufacture | |
| CN1309796A (en) | Method for making portable electronic device comprising at least one integrated circuit chip | |
| CN1351732A (en) | Method for producing contact chip cards with low-cost dielectric | |
| JP6040732B2 (en) | IC card manufacturing method | |
| CN1384979A (en) | Method for production of chip-card type portable storage medium | |
| JP2005070915A (en) | Composite ic card and its manufacturing method | |
| JP2004334639A (en) | Ic card and manufacturing method thereof | |
| JP2000322547A (en) | Contactless ic card and its production | |
| CN1303521A (en) | Method for making micromodule and storage medium comprising such micromodule |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |