CN1323570C - Electric contact arrangement and method for preparing same - Google Patents
Electric contact arrangement and method for preparing same Download PDFInfo
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- CN1323570C CN1323570C CNB2004101003145A CN200410100314A CN1323570C CN 1323570 C CN1323570 C CN 1323570C CN B2004101003145 A CNB2004101003145 A CN B2004101003145A CN 200410100314 A CN200410100314 A CN 200410100314A CN 1323570 C CN1323570 C CN 1323570C
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Abstract
Provided is an electrical contact structure body capable of realizing smaller size and less number of parts especially as compared with the conventional one, and capable of being easily and surely electrically connected with among a connection part such as a printed-circuit board in a simple structure, and to provide its manufacturing method. The electrical contact structure body (24) is constituted of a spiral contactor (26), a holding body (25) holding the spiral contactor (26) and a conduction part (28) formed in a recessed part (27) leading from under the base part (26b) of the spiral contactor (26) to a rear surface of the holding body. Thereby, the electrical contact structure body having small size, excellent conductivity and a simple structure as compared with the conventional one can be obtained with low production cost.
Description
Technical field
The present invention relates to a kind ofly have and the electric contact arrangement that is touched the electrical contacts that body electrically contacts, be specifically related to electric contact arrangement as parts two uses of IC socket or connector etc., be particularly related to and compared the minimizing that can realize miniaturization and component count in the past, simultaneously, in that be connected between the portion with printed substrate etc. can be with the simple structure electric contact arrangement and the manufacture method thereof that are connected of conducting easily and reliably.
Background technology
Example as the device that is built-in with electric contact arrangement can list following semiconductor checking device.The semiconductor checking device of being put down in writing in patent documentation 1 is the device that temporarily semi-conductor electricity is connected on the circuit external substrate etc.Be provided with a plurality of spherical contacts in semi-conductive rear side, and these a plurality of spherical contacts are configured to clathrate or rectangular, with the insulated substrate of its subtend on be provided with a plurality of recesses, the spiral contact subtend is configured in this recess.
With above-mentioned semi-conductive rear side when above-mentioned insulated substrate is pushed, above-mentioned spiral contact is wound into helically and contacts with the outer surface of above-mentioned spherical contact, so can carry out being electrically connected between each spherical contact and each spiral contact reliably.
Patent documentation 1: the spy opens the 2002-175859 communique
The electric contact arrangement that has above-mentioned insulated substrate and spiral contact and constitute for example is a shape shown in Figure 17.
Above-mentioned electric contact arrangement 1 is that a plurality of spiral contacts 2 are installed in structure on the insulated substrate (below, be called base station) 3.On above-mentioned base station 3, be provided with from its surface a plurality of recesses (through hole) 3a that connects to the back side, be provided with above-mentioned spiral contact 2 at the upper surface of above-mentioned recess 3a.
Figure 18 is a local amplification rearview of observing a spiral contact 2 the spiral contact 2 shown in Figure 17 from the rear side of base station 3.
As shown in figure 18, in exposing of above-mentioned recess 3a the conducting portion 10 that is connected with above-mentioned spiral contact 2 conductings is arranged on every side.The back side of the back side of above-mentioned conducting portion 10 and above-mentioned base station 3 is same plane.
Above-mentioned electric contact arrangement 1 for example forms through each operation shown in Figure 19.
In the operation of Figure 19 A, on Cu substrate 4, form the resist layer 5 that is formed with the pattern 5a of spiral contact 2 by exposure imaging, in the pattern 5a of above-mentioned resist layer 5, form spiral contact 2.
In the operation shown in Figure 19 B, after removing above-mentioned resist layer 5, the guiding frame 6 that the location is made of resin etc., and the 6a of hole portion that is located on the above-mentioned guiding frame 6 is just in time faced mutually with each spiral contact 2, then, above-mentioned guiding frame 6 is sticked between the base portion 2a of each spiral contact 2 (also with reference to Figure 17).
Then, in the operation of Figure 19 C, for example remove above-mentioned Cu substrate 4 with the method for etching etc.Each spiral contact 2 links up by above-mentioned guiding frame 6.
Then, in the operation of Figure 19 D, utilize electroconductive binder 8 grades that above-mentioned spiral contact 2 is adhesively fixed on the base station 3, wherein, the position of just in time facing with spiral contact 2 of this base station 3 is formed with through hole 3a.
On the inner face 7b of the through hole 3a of above-mentioned base station 3, form conductive part 10 by sputtering method etc.
Then, in the operation of Figure 19 E, utilize above-mentioned outstanding adjustment component 9 solid forming spiral contacts 2.
In the operation of Figure 19 F, being situated between is provided with splicing ear 11 by electroconductive binder 14 in the rear side of above-mentioned base station 3.
And, the printed substrate 12 with a plurality of wiring patterns and other circuit block is set below above-mentioned base station 3, above-mentioned base station 3 is fixed on the above-mentioned printed substrate 12.
Be provided with and be located at the counter electrode 13 of splicing ear 11 subtends on the bottom surface of above-mentioned base station 3 on the surface of above-mentioned printed substrate 12, being situated between to be waited by conductive adhesive makes above-mentioned each splicing ear 11 be connected with each counter electrode 13 conducting.
But, in the electric contact arrangement 1 that the operation through Figure 19 A～Figure 19 F obtains, have following problem.
At first, first, above-mentioned electric structure 1 mainly has spiral contact 2, base station 3, guiding frame 6, conducting portion 10, and splicing ear 11, but form above-mentioned electric contact arrangement 1 like this, component count is many, and can cause production cost to increase.Especially, base station 3 is to be formed with the structure of the complexity of conducting portion 10 at the inner face of through hole 3a by sputtering method, and the cost height of above-mentioned base station 3 becomes one of production cost cause of increased that makes electric contact arrangement 1.
The second, be adhesively fixed by conductive adhesive 8,14 being situated between between above-mentioned spiral contact 2, splicing ear 11 and the above-mentioned conducting portion 10, in addition, also being situated between between the counter electrode 13 of above-mentioned splicing ear 11 and printed substrate 12 is adhesively fixed by conductive adhesive.
But, in the method that is adhesively fixed of using conductive adhesive, at this moment need carrying out thermo-compressed between the parts, if this thermo-compressed is between above-mentioned when inhomogeneous on the whole, the result can cause conduction variation, the reliability between two parts to reduce, therefore, consider, have to carry out superfine manufacturing for the necessity of carrying out thermo-compressed accurately.
Three, in the former electric contact arrangement 1, be the formation that does not fit into miniaturization.For example, when the further miniaturization of spiral contact 1 self, be complementary with it and also must reduce to be located at through hole 3a on the above-mentioned base station 3, but when above-mentioned through hole 3a is too small, can't in above-mentioned through hole 3a, form conducting portion 10, thereby become the electric contact arrangement 1 of electrical characteristics difference with suitable thickness.Therefore, above-mentioned through hole 3a can not be too little, its result, even can self form spiral contact 1 little, can not form above-mentioned base station 3 little, in addition, when the thickness of base station 3 too approaches, the intensity of base station 3 self reduces, thereby can't use conductive adhesive, by thermo-compressed, conduction connects spiral contact 2 and splicing ear 11 well on above-mentioned base station 3.Thereby, can not promote the miniaturization of electric contact arrangement 1 more.
Summary of the invention
The present invention proposes in order to solve the above-mentioned problem that existed in the past, its purpose be to provide a kind of especially with compared the minimizing that can realize miniaturization and component count in the past, simultaneously, in that be connected between the portion with printed substrate etc. can be with the simple structure electric contact arrangement and the manufacture method thereof that are connected of conducting easily and reliably.
The present invention, in having the electric contact arrangement that constitutes with being touched body electrical contacts that electrically contacts and the maintenance body that keeps above-mentioned electrical contacts, it is characterized in that: above-mentioned electrical contacts is kept by the face side of above-mentioned maintenance body, on above-mentioned maintenance body, be provided with until the recess at the back side, in above-mentioned recess, be provided with conducting portion, above-mentioned conducting portion directly is connected with above-mentioned electrical contacts conducting, and, be connected with the portion conducting of being connected in the rear side of above-mentioned maintenance body.
Electric contact arrangement of the present invention by electrical contacts, keep body and conductive part to constitute, can reduce component count with comparing in the past, can access the electric contact arrangement of simple structure.
Especially, necessary base station before need not is provided with the maintenance body and replace.
In addition, above-mentioned conducting portion is connected with the direct conducting of above-mentioned electrical contacts, can provide to need not such conductive adhesive and superior structure of conductivity in the past.
In addition, in the present invention, preferred: above-mentioned maintenance body is formed by organic insulating material, in view of the above, the shaping of above-mentioned maintenance body, handling ease also can make above-mentioned maintenance body form thinly in the process that forms above-mentioned maintenance body, can realize the slimming of electric contact arrangement.
In addition, in the present invention, preferred: above-mentioned organic insulating material uses solder resist (solder resist).In the present invention, this solder resist is to the last all residual as keeping body.In the present invention, can utilize simple manufacturing method on the maintenance body that forms by solder resist, to form above-mentioned recess and conducting portion etc., can realize the reduction of production cost.
And, in the present invention, preferably on above-mentioned maintenance body, be provided with the through hole that leads to the back side from the surface, the end of above-mentioned electrical contacts is kept by the periphery of the above-mentioned through hole on the above-mentioned maintenance body, simultaneously, the part extension except above-mentioned end of above-mentioned electrical contacts is set to and the position of above-mentioned through hole along the film thickness direction subtend, above-mentioned recess, in position, lead to above-mentioned end from the back side of above-mentioned maintenance body and form than above-mentioned through hole biased outward.
In view of the above, can carry out the predetermined processing of solid forming etc. from through hole to above-mentioned electrical contacts.In addition, can utilize with being touched contacting of body by forming above-mentioned through hole above-mentioned electrical contacts bending is entered in the above-mentioned through hole, its result, above-mentioned electrical contacts can wrap in above-mentioned through hole and be touched body ground distortion, can make above-mentioned electrical contacts and the electrically contacting property that is touched between the body good.In addition, above-mentioned recess is arranged on the position of staggering from above-mentioned through hole, its result, be formed on the conducting portion in the above-mentioned recess, can not be affected in the forming process of above-mentioned through hole, above-mentioned electrical contacts and the good conduction and the superior electric contact arrangement of electrical characteristics that are touched body can be maintained.
In addition, in the present invention, preferably: above-mentioned electrical contacts by with the spiral-shaped spiral contact site that forms with link to each other with above-mentioned spiral contact site and around above-mentioned spiral contact site around base portion constitute, above-mentioned base portion is maintained on the above-mentioned maintenance body, simultaneously, above-mentioned spiral contact site be arranged on above-mentioned through hole along film thickness direction relative to the position.
As mentioned above, above-mentioned electrical contacts is to have the structure of spiral contact site as a concrete example.Have the spiral contact site electrical contacts can be touched body and suitably electrically contact.
And, under the situation of above-mentioned structure, preferably: above-mentioned recess, in position than above-mentioned through hole biased outward, leading to above-mentioned base portion peripherally from the back side of above-mentioned maintenance body around above-mentioned through hole forms, be formed on the conducting portion in the above-mentioned recess,, expose with shape around the periphery of above-mentioned through hole at the back side of above-mentioned maintenance body.
In the present invention, preferred: above-mentioned conducting portion is electroplated formation.
In addition, in the present invention, preferred: above-mentioned conducting portion has the back side from above-mentioned maintenance body to the above-mentioned side-prominent protuberance of portion that is connected, and the width dimensions of above-mentioned protuberance is wideer than the width dimensions that is formed on the conducting portion in the above-mentioned recess.In view of the above, can increase the above-mentioned portion that is connected and be connected area, conducting is well connected with conducting between the above-mentioned conducting portion.
In addition, in the present invention, also can: the surface of above-mentioned protuberance is the crooked planar of convex, and is preferred: above-mentioned conducting portion is connected and fixed with the above-mentioned portion of being connected by soft solder.In the present invention, the protuberance that give prominence at the back side from above-mentioned maintenance body in the above-mentioned conducting portion is made lug boss, can be connected and fixed by soft solder and above-mentioned being connected between the portion, compare, can make two conduction good with utilizing the situation of thermo-compressed such as conductive adhesive as before.
In addition, in the present invention, be formed on form on the printed substrate applicable to the above-mentioned portion of being connected.
In addition, the present invention in the manufacture method with the electric contact arrangement that constitutes with being touched body electrical contacts that electrically contacts and the maintenance body that keeps above-mentioned electrical contacts, is characterized in that having:
(a) on substrate, electroplate the operation that forms electrical contacts;
(b) coat the operation that reaches on the above-mentioned electrical contacts on the aforesaid substrate by becoming the organic insulating material layer that keeps body;
(c) in the operation that forms the recess on the predetermined position that leads to above-mentioned electrical contacts from the face side of above-mentioned organic material layer on the above-mentioned organic insulating material layer;
(d) in above-mentioned recess, electroplate to form conducting portion, make the direct conducting of above-mentioned conducting portion be connected operation on the above-mentioned electrical contacts;
(e) operation of removal aforesaid substrate.
In the present invention, by above-mentioned operation, can make the electric contact arrangement that has electrical contacts, keeps body and conducting portion.Can reduce the worker ordinal number with comparing in the past, and, before need not in the manufacturing of electric contact arrangement necessary base station, and replace the maintenance body that setting is made of the organic insulating material layer.As above-mentioned (c) operation and (d) shown in the operation, can on above-mentioned maintenance body, form recess, conducting portion simply, and compared the reduction that can realize production cost in the past.
In addition, in above-mentioned (b) operation in above-mentioned operation, because the maintenance body that will be formed by the organic insulating material layer in the stage that substrate also exists is formed on aforesaid substrate and the electrical contacts, so need not utilize method such as thermo-compressed as before base station monomer and the electrical contacts that takes off from substrate are installed, make the slimming of above-mentioned maintenance body like that according to desirable easily, can realize the miniaturization of electric contact arrangement.
And, in above-mentioned (d) operation, conducting portion is connected on the above-mentioned electrical contacts, so need not as before will be between the two while the loaded down with trivial details operation of utilizing the conducting adhesive to come thermo-compressed to be connected and fixed, in addition, the conduction between above-mentioned electrical contacts and the above-mentioned conducting portion also wants good with comparing in the past.
In addition, in the present invention, preferred: as between above-mentioned (d) operation and above-mentioned (e) operation, to have following (f) operation.
(f) in the position of departing from above-mentioned conducting portion and at least with the part of above-mentioned electrical contacts position along the film thickness direction subtend, form through hole from the surface of above-mentioned organic insulating material layer to the back side, the operation that the part of above-mentioned electrical contacts is exposed in above-mentioned through hole.
And, preferred: as between above-mentioned (f) operation and above-mentioned (e) operation, to have following (g) operation.
(g) solid forming is exposed to the operation of the electrical contacts in the above-mentioned through hole.
In addition, in the present invention, preferred: in above-mentioned (a) operation, by forming above-mentioned electrical contacts with the spiral-shaped spiral contact site that forms with the integrally formed base portion around above-mentioned spiral contact site of above-mentioned spiral contact site,
In above-mentioned (c) operation, at the recess that forms on the above-mentioned organic insulating material layer on the base portion that leads to above-mentioned electrical contacts from the face side of above-mentioned organic material layer,
In above-mentioned (f) operation, by forming above-mentioned through hole, and the part of the spiral contact site that constitutes above-mentioned electrical contacts is exposed in above-mentioned through hole.
In addition, in the present invention, preferred: organic insulating material layer used in above-mentioned (b) operation uses solder resist.
At this moment, preferred: above-mentioned solder resist uses positive corrosion-resisting agent, removes the solder resist that is exposed part and forms recess by utilizing mask layer to carry out exposure imaging in above-mentioned (c) operation.And, preferred: as, to form through hole and remove the solder resist that is exposed part by in above-mentioned (f) operation, utilizing mask layer to carry out exposure imaging.
As mentioned above, by using the positivity solder resist, can be easily and suitably on above-mentioned maintenance body, form recess and through hole.In the present invention, can the organic insulating material layer that be formed by above-mentioned solder resist is to the end residual and as keeping body to play a role.
In the past, need to prepare in addition the base station of the above-mentioned electrical contacts of installation, but in the present invention, in a series of manufacture process, also can form becomes the maintenance of base station body, this is one of feature of the present invention.Formerly be provided with in addition under the situation of base station like that, bad phenomenon such as exist production cost to increase, manufacturing process is elongated, and in the present invention, can make electrical contacts continuously and keep body with a series of process, can make electric contact arrangement with simple method, and also can make the structure of above-mentioned electric contact arrangement become simple.
In addition, in the present invention, preferred: as in above-mentioned (d) operation, to convex to form above-mentioned conducting portion in mode from the rat of above-mentioned organic insulating material layer.In view of the above, can increase the area that is connected between the portion that is connected that is located on the printed substrate and the above-mentioned conducting portion, in addition, above-mentioned conducting portion is side-prominent to being connected portion, therefore, make above-mentioned conducting portion when being connected portion's subtend, in the back side of above-mentioned maintenance body and the above-mentioned easily formation space that is connected between the portion, this space can be set as the spatial portion that is used for solder, can be connected and fixed above-mentioned conducting portion and above-mentioned being connected between the portion by solder easily.
Electric contact arrangement of the present invention by electrical contacts, keep body and conductive part to constitute, can reduce above-mentioned component count with comparing in the past, can access the electric contact arrangement of simple structure.Especially, necessary base station before need not is provided with the maintenance body and replace.
In addition, above-mentioned conducting portion is connected with the direct conducting of above-mentioned electrical contacts, can provide to need not such conductive adhesive and superior structure of conductivity in the past.
In addition, manufacturing method according to the invention can reduce the worker ordinal number with comparing in the past, and, before need not in the manufacturing of electric contact arrangement necessary base station, and replace the maintenance body that setting is made of the organic insulating material layer.In the present invention, can on above-mentioned maintenance body, form recess, conducting portion simply, and compare the reduction that can realize production cost in the past.
In addition, in above-mentioned operation, because the maintenance body that will be formed by the organic insulating material layer in the stage that substrate also exists is formed on aforesaid substrate and the electrical contacts, so need not utilize method such as thermo-compressed as before base station monomer and the electrical contacts that takes off from substrate are installed, make the slimming of above-mentioned maintenance body like that according to desirable easily, can realize the miniaturization of electric contact arrangement.
And, conducting portion is connected on the above-mentioned electrical contacts, so need not as before will be between the two while the loaded down with trivial details operation of utilizing the conducting adhesive to come thermo-compressed to be connected and fixed, in addition, the conduction between above-mentioned electrical contacts and the above-mentioned conducting portion also wants good with comparing in the past.
Description of drawings
Fig. 1 is the oblique view that is illustrated in the employed testing fixture of test of the action that is used for confirming electronic unit.
Fig. 2 is the vertical view of electric contact arrangement of the present invention.
Fig. 3 is the local amplification plan view of electric contact arrangement of the a-quadrant of enlarged drawing 2.
Fig. 4 is a local amplification rearview of observing the electric contact arrangement of Fig. 3 from dorsal part.
Fig. 5 is local amplification view, and and the electronic unit of the top subtend of above-mentioned electric contact arrangement and be connected the local amplification view of printed substrate of the downside of above-mentioned electric contact arrangement of electric contact arrangement of the a-quadrant of enlarged drawing 2.
Fig. 6 is the exploded perspective view of the above-mentioned connector during as the internal part of connector with electric contact arrangement of the present invention.
Fig. 7 is the figure of an operation of the manufacture method of expression electric contact arrangement of the present invention.
Fig. 8 is the figure of the operation of carrying out after Fig. 7.
Fig. 9 is the figure of the operation of carrying out after Fig. 8.
Figure 10 is the figure of the operation of carrying out after Fig. 9.
Figure 11 is the figure of the operation of carrying out after Figure 10.
Figure 12 is the figure of the operation of carrying out after Figure 11.
Figure 13 is the figure of the operation of carrying out after Figure 12.
Figure 14 is the figure of the operation of carrying out after Figure 13.
Figure 15 is the figure of the operation of carrying out after Figure 14.
Figure 16 is the figure of the operation of carrying out after Figure 15.
Figure 17 is the local amplification oblique drawing of former electric contact arrangement.
Figure 18 is the local amplification rearview that further amplifies the part of electric contact arrangement shown in Figure 17.
Figure 19 A is the figure of an operation of the expression manufacturing process that is used to make former electric contact arrangement.
Figure 19 B is the figure of the operation of carrying out after Figure 19 A.
Figure 19 C is the figure of the operation of carrying out after the I9B at figure.
Figure 19 D is the figure of the operation of carrying out after Figure 19 C.
Figure 19 E is the figure of the operation of carrying out after Figure 19 D.
Figure 19 F is the figure of the operation of carrying out after Figure 19 E.
Among the figure: 24,41-electric contact arrangement, 25,44-keeps body, 25a, 61-through hole, 26,43-spiral contact, 27-recess, 28, the 55-conducting portion, 28a, 55a-protuberance, 30,46-printed substrate, 45-connector, 50-Cu substrate, the 51-resist layer, 52-organic insulating material layer, 53, the 60-mask layer, 62-gives prominence to adjustment component.
Embodiment
Fig. 1 is the oblique view that is illustrated in the employed testing fixture of test of the action that is used for confirming electronic unit.
As shown in Figure 1, testing fixture 20 have recess shapes seat 21, be situated between and rotate supported freely lid 22 by the hinge 23 that is located at this edge part of 21.Above-mentioned seat 21 and lid 22 are formed by the resin material of insulating properties etc., are formed with filling zone 21A to diagram Z2 direction falls at the central part of above-mentioned seat 21.And, in above-mentioned filling zone 21A, be provided with the electric contact arrangement 24 that the following describes, electronic units 29 such as semiconductor can be installed on above-mentioned electric contact arrangement 24.In addition, the opposing party of present 21 edge part is formed with locked 26.
As shown in Figure 1, at the middle position of the inner face of the lid 22 of above-mentioned testing fixture 20, the relative press section 22a that pushes the convex form of electronic unit 29 to the diagram below that is provided with to ground with above-mentioned filling zone 21A.In addition, be formed with sticking department 34 in the position of a side opposite with above-mentioned hinge 23.
Between the inner face of above-mentioned lid 22 and press section 22a, be provided with to direction and promote the push mechanism (not shown) that the disc spring etc. of above-mentioned press section 22a constitutes away from the inner face of lid 22.Thereby, in above-mentioned installation region 21A that electronic unit 29 is packed into, close after lid 22 locks, can flexibly push away electronic unit 29 to direction (Z2 direction) near the surface of loading regional 21A.
Fig. 2 is the vertical view of electric contact arrangement 24, Fig. 3 is the local amplification plan view that amplifies the zone of A shown in Figure 2, Fig. 4 is a local amplification rearview of observing the a-quadrant from the rear side of above-mentioned electric contact arrangement 24, and Fig. 5 is the local amplification view of the above-mentioned electric contact arrangement 24 when respectively cutting off a-quadrant shown in Figure 2 from thickness side and from the electronic unit 29 of the upper side abuts of above-mentioned electric contact arrangement 24 and be fastened on the local amplification view of printed substrate 30 of the downside of above-mentioned electric contact arrangement 24.
Have the body 25 of maintenance and a plurality of spiral contact (electrical contacts) 26 on electric contact arrangement 24 structures shown in Figure 2.Above-mentioned spiral contact 26 is in Fig. 2, with the frame shape formal rule ground arrangements around 2 row of the periphery on above-mentioned maintenance body 25 surfaces, but the form of the arrangement of above-mentioned spiral contact 26 can change according to the formation position of the contact 35 (being touched body) of the rear side that is located at above-mentioned electronic unit 29.
As Fig. 3 and shown in Figure 5, on above-mentioned maintenance body 25, be provided with the through hole 25a that penetrates into back side 25c from surperficial 25b.In Fig. 3, the section to face direction (with the parallel direction of diagram X-Y plane) of above-mentioned through hole 25a is the circular shape.The shape of above-mentioned through hole 25a also can be other shape, but because the contact 26 that is located on the above-mentioned through hole 25a is spiral-shaped, so make above-mentioned spiral contact 26 suitably with above-mentioned through hole 25a on relative to, when the contact 35 of above-mentioned spiral contact 26 and electronic unit 29 is electrically contacted, in order successfully to enter in the above-mentioned through hole 25a, the section parallel with the face direction of above-mentioned through hole 25a is preferably the circular shape.In Fig. 3, illustrate the spiral contact 26 that is positioned on this through hole 25a with oblique line.
As Fig. 3 and shown in Figure 5, above-mentioned spiral contact 26 is by exposing on above-mentioned through hole 25a, forming helical form and the contact site 26a that electrically contacts with the contact of above-mentioned electronic unit 29 and form as one with above-mentioned contact site 26a and base portion 26b around above-mentioned contact site 26a constitutes.As shown in Figure 5, above-mentioned contact site 26a with upward in the shape of a spiral the outstanding mode of shape by solid forming.In view of the above, can with the contact 35 at the back side of being located at above-mentioned electronic unit 29 between obtain good being electrically connected.
As shown in Figure 5, above-mentioned base portion 26b is kept by the surperficial 25b of above-mentioned maintenance body 25.The surperficial 25b of above-mentioned maintenance body 25, be formed with above-mentioned through hole 25a around form low surperficial 25b1, also be formed with high surperficial 25b2 on away from the direction of above-mentioned through hole 25a than high one deck in outer edge of low surperficial 25b1.Form above-mentioned base portion 26b in the notch between surperficial 25b2 of above-mentioned height and low surperficial 25b1, the surperficial 26b1 of above-mentioned base portion 26b and the surperficial 25b2 of above-mentioned height are same plane.
Do not accompany other materials such as conductive adhesive between above-mentioned base portion 26b and above-mentioned maintenance body 25, above-mentioned base portion 26b is directly engaged with above-mentioned maintenance body 25.Manufacture method is illustrated as described later, above-mentioned maintenance body 25 is formed by organic insulating material, at first, apply in the mode that covers on the above-mentioned spiral contact 26, the base portion 26b of above-mentioned spiral contact 26 and above-mentioned maintenance body 25 are connected and fixed by anchoring effect etc.
As shown in Figure 5, on above-mentioned maintenance body 25, be formed with below above-mentioned base portion 26b 26b2 until the recess 27 of back side 25c.In above-mentioned recess 27, form conducting portion 28 by for example electroplating to wait.
Above-mentioned recess 27, than the position that is formed at the through hole 25a biased outward on the above-mentioned maintenance body 25, around forming on every side of above-mentioned through hole 25a, as shown in Figure 4, be formed on the conducting portion 28 in the above-mentioned recess 27,25c exposes at the back side of above-mentioned maintenance body 25, becomes the fringing shape of the circular of the periphery that surrounds above-mentioned through hole 25a.
Above-mentioned conducting portion 28 is formed in the above-mentioned maintenance body 25, except the back side 25c from above-mentioned maintenance body 25 exposes, does not expose from other the position that keeps body 25.That is, above-mentioned conductive part 28 does not expose in above-mentioned through hole 25a yet.Above-mentioned conducting portion 28 also can form the mode that is exposed in the above-mentioned through hole 25a, but, if form like that, then might cause the reduction of electrical characteristics etc., therefore, above-mentioned conductive part 28 is exposed in the above-mentioned through hole 25a.
Thereby in the present invention, for above-mentioned conductive part 28 is formed at the inside of above-mentioned maintenance body 25, and the recess 27 that will be used to form above-mentioned conductive part 28 is located at the position than above-mentioned through hole 25a biased outward.
As shown in Figure 5, above-mentioned recess 27 26b2 below the base portion 26b of above-mentioned spiral contact 26 forms with rectilinear form to the back side 25c of above-mentioned maintenance body 25, but also can be the shape beyond the rectilinear form.But rectilinear form is the easiest to be made, and the conduction of above-mentioned in addition base portion 26b and above-mentioned conducting portion 28 also can be good, so preferred.
As shown in Figure 5, above-mentioned conducting portion 28 has the outstanding protuberance 28a from the back side 25c of above-mentioned maintenance body 25, and above-mentioned protuberance 28a forms with the width dimensions wideer than the width dimensions that is formed on the above-mentioned conducting portion 28 in the above-mentioned recess 27.
Above-mentioned protuberance 28a forms by forming protuberance when conducting portion 28 is electroplated, and the surperficial 28a1 of above-mentioned protuberance 28a is with the crooked planar formation of convex.By constituting above-mentioned protuberance 28a by forming projection like this, can increase and be located at the conducting contact area between the counter electrode 31 (being connected portion) on the printed substrate 30 of downside of above-mentioned electric contact arrangement 24, and when cooperating above-mentioned counter electrode 31 and above-mentioned protuberance 28a, between above-mentioned maintenance body 25 and above-mentioned counter electrode 31, form spatial portion 32, therefore, the soft solder formation portion that this spatial portion 32 can be used as when connecting between above-mentioned counter electrode 31 and the above-mentioned protuberance 28a by soft solder 33 utilizes, suitably between above-mentioned counter electrode 31 of solder and the above-mentioned protuberance 28a, can guarantee the good conducting connectivity between above-mentioned counter electrode 31 and the conducting portion 28.In addition, in the present invention, because can the above-mentioned counter electrode 31 of solder and above-mentioned protuberance 28a between, so the thermo-compressed operations when need not to use conductive adhesive as before etc. can make simple and reliablely that conducting is connected between above-mentioned counter electrode 31 and the above-mentioned protuberance 28a.
Material of each parts etc. is described.Above-mentioned spiral contact 26 is by electroplating or formation such as Copper Foil, and electroplate can the above-mentioned spiral contact 26 of microfabrication but form, so preferably.Electroplate the structure that the spiral contact 26 that constitutes is preferably stacked coating by forming, the one example is from descending the formation by the sequential cascade of Au/Ni/Au.
Above-mentioned maintenance body 25 is preferably formed by organic insulating material.By form above-mentioned maintenance body 25 by organic insulating material, on above-mentioned maintenance body 25, suitably and easily form recess 27 and through hole 25a and can not can damage above-mentioned spiral contact 26 ground, and can form above-mentioned recess 27 and through hole 25a accurately.
Especially, preferred above-mentioned maintenance body 25 uses solder resists to form.Manufacture method is illustrated as described later, by maintenance body 25 exposure imagings to forming by solder resist, and can be easily and form recess 27 accurately and connect also 25a.
Above-mentioned conducting portion 28 preferably forms by electroplating.Above-mentioned conductive part 28 preferably uses by superior metal materials of conductivity such as Cu, Au, platinum group type elements.In the present invention, form above-mentioned conducting portion 28 by electroplating, and can below the base portion 26b of same metal spiral contact 26, electroplate the above-mentioned conducting portion 28 of growing up, can not use conductive adhesive etc. between above-mentioned conducting portion 28 and above-mentioned base portion 26b, suitably and reliably conducting connects both.
Above-mentioned soft solder 33 for example uses the paste soft solder.
On the electric contact arrangement 24 that forms as described above, from the direction of arrow shown in Figure 5 configuration electronic unit 29, will lid shown in Figure 1 22 sticking department 34 lockings when being present on 21 locked 26, owing to push electronic unit 29 to the diagram below by above-mentioned press section 22a, so the contact 35 that is located at the back side of above-mentioned electronic unit 29 is pressed each spiral contact 26 to the internal direction that is formed on the through hole 25a on the above-mentioned maintenance body 25 (diagram below).Simultaneously, the profile expansion deformation of spiral contact 26 is embraced the outer surface ground of above-mentioned contact 35 and is reeled, and is electrically connected each contact 35 and each spiral contact 26 well.
Fig. 6 is the exploded perspective view with connector 45 of electric contact arrangement 41 of the present invention.
Above-mentioned electric contact arrangement 41 structurally has a plurality of spiral contacts 43 as shown in Figure 6 and keeps body 44, and concrete internal structure etc. constitute as Fig. 2～shown in Figure 5.
Above-mentioned electric contact arrangement 41 is housed in the notch 40a that is formed on the pedestal 40, and the conducting portion of above-mentioned electric contact arrangement 41 (formation identical with conducting portion shown in Figure 5 28) is fastened between the splicing ear on the surface that is located at this notch 40a by solder.
Symbol 46 is printed substrates 46, is provided with a plurality of electrode part (not shown) at the back side of above-mentioned printed substrate 46.Be provided with the lid 42 that resin etc. forms on above-mentioned printed substrate 46, above-mentioned lid 42 is embedded in the notch 40a of said base 40.In the time of in the notch 40a that above-mentioned lid 42 is embedded said base 43, the spiral contact 43 of above-mentioned electric contact arrangement 41 is connected with the electrode part conducting of above-mentioned printed substrate 46.
Connector 45 shown in Figure 6 can be contained in the interior uses of electronic equipment such as portable phone.
Below, the characteristic of electric contact arrangement 24 of the present invention is described.
In the present invention, above-mentioned electric contact arrangement 24 has spiral contact 26, maintenance body 25 and the conducting portion 28 as electrical contacts, can only be made of these parts basically.Thereby, compared with former electric contact arrangement and can reduce component count, can make the electric contact arrangement 24 of simple structure.
In the present invention, spiral contact 26 can be directly installed on the above-mentioned maintenance body 25, in addition, at the recess 27 that is formed on the above-mentioned maintenance body 25, form above-mentioned conducting portion 28 by electroplating to wait, and above-mentioned conducting portion 28 directly is connected with above-mentioned spiral contact 26 conductings.In the past, use conductive adhesive spiral contact 26 to be installed on the base station of buying in addition, make it be located at above-mentioned base station on the conducting portion conducting be connected, but, under described situation, need thermo-compressed, can not get good conduction sometimes according to installation accuracy, and in the present invention, need not to use conductive adhesive, can directly spiral contact 26 be installed on the maintenance body 25, make it to be connected with above-mentioned conducting portion 28 conductings, installation is simple and can access good conduction.
In addition, especially in the present invention, form above-mentioned maintenance body 25, can not damage above-mentioned spiral contact 26, can on above-mentioned maintenance body 25, simply and accurately form recess 27 and through hole 25a by organic insulating material etc.In the present invention, in above-mentioned recess 27, form conducting portion 28, but form above-mentioned through hole 25a and recess 27 respectively, need not as former base station, form conducting portion at the inner face of being located at the through hole on the base station by sputtering method by methods such as plating.In the internal structure of former base station, necessity from thickness of the above-mentioned conducting portion of guaranteeing preliminary dimension etc., the through hole of above-mentioned base station can not be too little, can't suitably promote the miniaturization of electric contact arrangement integral body, and in the present invention, outside the recess 27 that is used to form conducting portion 28, form through hole 25a in addition, especially, owing to form above-mentioned maintenance body 25 by easy precision machined materials such as organic insulating materials, so can cooperate the size of spiral contact 26, and on above-mentioned maintenance body 25, form trickle through hole 25a, become and the structure of comparing the miniaturization that can promote above-mentioned electric contact arrangement 25 in the past.
In addition, in the present invention, can be by forming above-mentioned conducting portion 28 from the outstanding convex shape of the back side 25c of above-mentioned maintenance body 25, between the counter electrode 33 on above-mentioned conducting portion 28 and the printed substrate 30, can be connected and fixed by soft solder 33, can carry out fixing between above-mentioned electric contact arrangement 24 and the printed substrate 30 simple and reliablely.
Fig. 7～Figure 16 is the process chart of the manufacture method of expression electric contact arrangement 24 of the present invention.Each process chart is the partial sectional view that cuts off the electric contact arrangement 24 the manufacturing process from film thickness direction.
Then, in operation shown in Figure 8, in above-mentioned pierced pattern 51a, electroplate and form spiral contact 26, as shown in Figure 9, utilize the above-mentioned resist layers 51 of dissolving removal such as aqueous slkali again.In Fig. 9, the only remaining spiral contact 26 that is formed on the above-mentioned Cu substrate 50 of electroplating.
In the operation of Figure 10, by organic insulating material cover on the above-mentioned Cu substrate 50 and spiral contact 26 on, and forming organic insulation material layer 52 on the above-mentioned Cu substrate 50 and on the spiral contact 26.
Preferred above-mentioned organic insulating material uses solder resist.By using above-mentioned solder resist, and can be easily and carry out the formation of recess 54 of back operation and the formation of through hole 61 accurately.In addition, preferred above-mentioned solder resist is a positivity.That is, use the liquefiable resist of rayed part.This is because use exposure imaging to handle and carry out the formation of above-mentioned recess 54 and the formation of through hole 61, and form operation by using the positivity solder resist can suitably carry out these 2.In addition, above-mentioned organic insulating material layer 52 is as keeping the residual always layer to the end of body 25.
Then, in worker shown in Figure 11, configuration mask layer 53 above above-mentioned organic insulating material layer 52.On aforementioned mask layer 53, form pierced pattern 53a.
This pierced pattern 53a just in time is positioned at the top of the base portion 26b of above-mentioned spiral contact 26.For example, above-mentioned base portion 26b, because the spiral-shaped contact site 26a in the above-mentioned spiral contact 26 forms (with reference to Fig. 3) with the fringing shape of circle peripherally, so preferred above-mentioned pierced pattern 53a also is the form along the fringing shape of the circle on the above-mentioned base portion 26b.
From this pierced pattern 53a irradiates light, carry out exposure imaging to being in, at the recess 54 that forms on the above-mentioned organic insulating material layer 52 on the base portion 26b that leads to above-mentioned spiral contact 26 from the surperficial 52a of above-mentioned organic insulating material layer 52 with above-mentioned pierced pattern 53a relative organic insulating material layer 52 on film thickness direction to the position.Above-mentioned recess 54 is vertically formed on the base portion 26b of above-mentioned spiral contact 26 from the surperficial 52a of above-mentioned organic insulating material layer 52, in addition, from directly over when observing, above-mentioned recess 54 is rendered as along the form of the fringing shape of the circular on the above-mentioned base portion 26b.
The formation position of above-mentioned recess 54 can be determined arbitrarily, but be preferably formed on the end of above-mentioned spiral contact 26 electrical contacts such as grade.Electrical contacts beyond the above-mentioned end becomes and exposes in the through hole 61 that operation forms afterwards and be pressed when being electrically connected with the contact 35 of electronic unit 29 and strain enters the part in the above-mentioned through hole 61.Thereby preferred above-mentioned recess 54 is formed on the end of above-mentioned electrical contacts as far as possible.Under the situation of spiral contact 26, the part of spiral-shaped contact site 26a becomes in perforation 61 to be exposed and the part of elastically deformable, therefore, above-mentioned recess 54 is located on the above-mentioned base portion 26b.
In operation shown in Figure 12, in above-mentioned recess 54, electroplate and form conducting portion 55.Expose above-mentioned base portion 26b in above-mentioned recess 54, the above-mentioned base portion 26b that is formed by metal is because the electrode when plate as electrolysis plays a role, so above-mentioned conducting portion 55 is suitably electroplated growth on above-mentioned base portion 26b.
In the present invention, as shown in figure 12, have more than and in above-mentioned recess 54, form above-mentioned conducting portion 55, also electroplate formation (what is called convexes to form) continuously from the outstanding protuberance 55a of the surperficial 52a of above-mentioned organic insulating material layer 52 with the above-mentioned conducting portion 55 that is formed in the recess 54.Above-mentioned protuberance 55a is not only on the above-mentioned recess 54, also extend to form on the surperficial 52a at above-mentioned organic insulating material layer 52.But, in the part of the surperficial 52a that extends to above-mentioned organic insulating material layer 52,,, passivation grows up so electroplating because bottom is the layer of insulating properties, as shown in figure 13, and the table of above-mentioned protuberance 55a and with the flexure plane formation of convex.Like this, on above-mentioned conducting portion 55, form, thereby make above-mentioned protuberance 55a as playing a role effectively with the installed surface that is located at the counter electrode on the printed substrate from the protuberance 55a of the outstanding convex shape of the surperficial 52a of above-mentioned organic insulating material layer 52.
In the operation of Figure 14, make the top subtend of mask layer 60 and above-mentioned organic insulating material layer 52.Be formed with pierced pattern 60a on aforementioned mask layer 60, the flat shape of above-mentioned pierced pattern 60a for example is and the identical toroidal of through hole 25a that keeps on the body 25 that is formed on shown in Figure 3.Here, above-mentioned pierced pattern 60a is formed on above-mentioned spiral contact 26 in spiral-shaped contact site 26a part along the position of film thickness direction subtend.In other words, above-mentioned pierced pattern 60a is positioned at than the recess 54 that is formed on the above-mentioned organic insulating material layer 52 locates more in the inner part, above-mentioned pierced pattern 60a not along film thickness direction and above-mentioned recess 54 relative to.Be in relative with above-mentioned pierced pattern 60a to the organic insulating material layer 52 of position in ensuing operation, remove by exposure imaging, if have above-mentioned recess 54 with above-mentioned pierced pattern 60a along the position of film thickness direction subtend, then in ensuing operation, exposing in the formed through hole and electroplate the conducting portion 55 that is formed in the above-mentioned recess 54.Therefore, above-mentioned pierced pattern 60a being positioned at than the recess 54 that is formed on the above-mentioned organic insulating material layer 52 locates more in the inner part.
In the operation of Figure 14, from above-mentioned pierced pattern 60a towards above-mentioned organic insulating material layer 52 irradiates light.Such as already described, above-mentioned organic insulating material layer 52 is formed by the positivity solder resist.In the operation of Figure 11,, and only carry out rayed at the above-mentioned organic insulating material layer 52 that will utilize aforementioned mask layer 53 to form the position of recesses 54 for formation recess 54 on above-mentioned organic insulating material layer 52.Thereby,, on remaining organic insulating material layer 52, do not carry out rayed in the moment of the operation of Figure 14.
Thereby, in the operation of Figure 14, utilize mask layer 60, to the organic insulating material layer 52 of the position that will form through hole 61 rayed and can suitably carry out exposure imaging partly.If be negative resist, then do not carry out light-struck place and taken out, but when using negative resist to form organic insulation material layer 52, remaining organic insulating material layer 52 all became the part of irradiates light the moment of Figure 14.Thereby generation can not suitably form the problem of through hole 61.Thereby, when utilization operation separately forms recess 54 with through hole 61 on above-mentioned organic insulating material layer 52, preferably on above-mentioned organic insulating material layer 52, use the positivity solder resist.
As shown in figure 15, utilizing 60 pairs of mask layers to be in along the organic insulating material layer 52 of the position of the pierced pattern 60a subtend of film thickness direction and aforementioned mask layer 60 carries out exposure imaging and forms through hole shown in Figure 15 61.As shown in figure 15, above-mentioned through hole 61 is formed into back side 52c from the surperficial 52a of above-mentioned organic insulating material layer 52, and the spiral-shaped contact site 26a of above-mentioned spiral contact 26 exposes from above-mentioned through hole 61.
Then, in operation shown in Figure 16, the above-mentioned through hole 61 of the electric contact arrangement that utilization makes up to the operation of Figure 15, the outstanding adjustment component 62 of downside butt joint from above-mentioned through hole 61, boost above-mentioned outstanding adjustment component 62 to the direction of arrow, thus the spiral-shaped contact site 26a that will be exposed to above-mentioned through hole 61 up solid forming be helical form.In view of the above, as shown in Figure 5, can the above-mentioned contact site 26a of solid forming.
In addition, in the operation of Figure 16, electric contact arrangement in Figure 15 operation is turned, make above-mentioned contact site 26a be positioned at the upside that keeps body 52, make the protuberance 55a of conducting portion 55 be positioned at downside, under this state, boost above-mentioned outstanding adjustment component 62 up from above-mentioned through hole 61, but the state that keeps Figure 15 makes above-mentioned outstanding adjustment component 62 be positioned under the above-mentioned through hole 61, also upwards boost above-mentioned outstanding adjustment component 62, and the formation that the above-mentioned contact site 26a of solid forming enters in above-mentioned through hole 61 also is fine certainly.
Utilize in the electric contact arrangement that each operation of Fig. 7～shown in Figure 16 is shaped, basically the maintenance body that only constitutes by spiral contact 26, by organic insulating material layer 52, and conducting portion 55 constitute.Like this, can utilize the very simple electric contact arrangement of a series of operation shaped structure.
To buy base station etc. in addition owing to especially former, so need utilize guiding frame to link between each spiral contact so that the operation that a plurality of spiral contact does not disperse respectively (Figure 19 B) and above-mentioned spiral contact sticked on operation (Figure 19 D) on the above-mentioned base station, but the present invention need not such operation and has realized the simplification of manufacturing process.Especially such base station before need not, above-mentioned base station forms through complicated processing, price is very high, but according to the present invention, forms the organic insulating material layer 52 that keeps a plurality of spiral contacts 26 with very simple method in a series of manufacturing process, in addition, can above-mentioned organic insulating material layer 52 is final as the maintenance body and residual, therefore, and compared in the past, the manufacturing process that keeps body to be shaped is easy, can realize the reduction of production cost.
Especially, can form recess 54 and through hole 61 in the optional position of above-mentioned maintenance body easily and accurately, in addition, above-mentioned organic insulating material layer 52 can be formed on the substrate 50 that forms above-mentioned spiral contact 26, so do not exist as before with separately operation and form base station and spiral contact 26, and the situation of in the operation of back, pasting two parts, its result, can make the electric contact arrangement miniaturization more further with comparing in the past, that is, can cooperate the shape of spiral contact 26 and on above-mentioned maintenance body 54, form trickle through hole 61 and than in the past arbitrarily unfertile land form thickness etc.
In addition, in the present invention, utilize solder resist etc. as the organic insulating material layer 52 that constitutes above-mentioned maintenance body, in the forming process of above-mentioned solder resist, can directly above-mentioned spiral contact 26 be installed on the above-mentioned organic insulating material layer 52, in addition, on above-mentioned organic insulating material layer 52, form recess 54, electroplate therein again and form conducting portion 55, the base portion 26b of above-mentioned spiral contact 26 is connected with above-mentioned conducting portion 55 direct conductings etc., thereby, the essential installation procedure that is undertaken by conductive adhesive before need not, installation procedure is become simply, simultaneously, necessary thermo-compressed operation when also need not to utilize conductive adhesive, with compared in the past, can make the conduction of 26 of above-mentioned conducting portion 55 and above-mentioned spiral contacts good.
In addition, in the present invention, list an example of solder resist as above-mentioned organic insulating material layer 52, but also can form above-mentioned organic insulating material layer 52 by resins such as polyimides.Under described situation, preferably utilize methods such as laser processing to form above-mentioned recess 54 and through hole 61.
In addition, in the present invention, can shown in the operation of Figure 16, utilize the through hole 61 that is formed on the organic insulating material layer 52 to come the contact site 26a of the above-mentioned spiral contact 26 of solid forming like that, in addition, when the protuberance 55a conducting that makes conducting portion shown in Figure 16 55 is connected on the counter electrode of printed substrate of the downside of being located at above-mentioned electric contact arrangement, because as described in Figure 5, between two parts, form spatial portion 32, so can utilize these spatial portion 32 solders to engage 31 of above-mentioned protuberance 55a and above-mentioned counter electrodes.Especially, above-mentioned protuberance 55a convexes to form, and to be connected area big with the conducting of above-mentioned counter electrode 31, therefore, can the above-mentioned protuberance 55a of simple and reliable ground solder and above-mentioned counter electrode 31 between.
In addition, in each operation of Fig. 7～shown in Figure 16, as the electrical contacts illustration spiral contact 26, but above-mentioned electrical contacts also can be the form beyond spiral-shaped, this is self-evident.
Claims (16)
1. an electric contact arrangement has and is touched body electrical contacts that electrically contacts and the maintenance body that keeps above-mentioned electrical contacts, it is characterized in that:
Above-mentioned electrical contacts is kept by the face side of above-mentioned maintenance body, on above-mentioned maintenance body, is provided with until the recess at the back side is provided with conducting portion in above-mentioned recess,
Above-mentioned conducting portion directly is connected with above-mentioned electrical contacts conducting, and, be connected with the portion conducting of being connected in the rear side of above-mentioned maintenance body,
On above-mentioned maintenance body, be provided with the through hole that leads to the back side from the surface, the end of above-mentioned electrical contacts is kept by the periphery of the above-mentioned through hole on the above-mentioned maintenance body, and the part except above-mentioned end of above-mentioned electrical contacts extends to the position on the above-mentioned through hole
Above-mentioned recess in the position than above-mentioned through hole biased outward, leads to above-mentioned end from the back side of above-mentioned maintenance body and forms,
Above-mentioned electrical contacts by with the spiral-shaped spiral contact site that forms with link to each other with above-mentioned spiral contact site and around above-mentioned spiral contact site around base portion constitute, above-mentioned base portion is maintained on the above-mentioned maintenance body, and above-mentioned spiral contact site is arranged on the position on the above-mentioned through hole
Above-mentioned conducting portion has the back side from above-mentioned maintenance body to the above-mentioned side-prominent protuberance of portion that is connected, and the width dimensions of above-mentioned protuberance is wideer than the width dimensions that is formed on the conducting portion in the above-mentioned recess.
2. electric contact arrangement according to claim 1 is characterized in that: above-mentioned maintenance body is formed by organic insulating material.
3. electric contact arrangement according to claim 2 is characterized in that: above-mentioned organic insulating material uses solder resist.
4. electric contact arrangement according to claim 1, it is characterized in that: above-mentioned recess, in position than above-mentioned through hole biased outward, lead to above-mentioned base portion from the back side of above-mentioned maintenance body peripherally and form around above-mentioned through hole, be formed on the conducting portion in the above-mentioned recess, at the back side of above-mentioned maintenance body, expose with shape around the periphery of above-mentioned through hole.
5. electric contact arrangement according to claim 1 is characterized in that: above-mentioned conducting portion is electroplated formation.
6. electric contact arrangement according to claim 1 is characterized in that: the surface of above-mentioned protuberance is the crooked planar of convex.
7. electric contact arrangement according to claim 1 is characterized in that: above-mentioned conducting portion is connected and fixed with the above-mentioned portion of being connected by soft solder.
8. electric contact arrangement according to claim 1 is characterized in that: the above-mentioned portion of being connected is formed on the printed substrate.
9. the manufacture method of an electric contact arrangement is the manufacture method with the electric contact arrangement that constitutes with being touched body electrical contacts that electrically contacts and the maintenance body that keeps above-mentioned electrical contacts, it is characterized in that having:
(a) on substrate, electroplate the operation that forms electrical contacts;
(b) coat the operation that reaches on the above-mentioned electrical contacts on the aforesaid substrate by becoming the organic insulating material layer that keeps body;
(c) in the operation that forms the recess on the predetermined position that leads to above-mentioned electrical contacts from the face side of above-mentioned organic insulating material layer on the above-mentioned organic insulating material layer;
(d) in above-mentioned recess, electroplate to form conducting portion, make the direct conducting of above-mentioned conducting portion be connected operation on the above-mentioned electrical contacts;
(e) operation of removal aforesaid substrate.
10. the manufacture method of electric contact arrangement according to claim 9 is characterized in that: have following operation between above-mentioned (d) operation and above-mentioned (e) operation, promptly
(f) in the position of departing from above-mentioned conducting portion and at least with the part of above-mentioned electrical contacts along the film thickness direction position overlapped, form through hole from the surface of above-mentioned organic insulating material layer to the back side, the operation that the part of above-mentioned electrical contacts is exposed in above-mentioned through hole.
11. the manufacture method of electric contact arrangement according to claim 10 is characterized in that: between above-mentioned (f) operation and above-mentioned (e) operation, have following operation, promptly
(g) solid forming is exposed to the operation of the electrical contacts in the above-mentioned through hole.
12. manufacture method according to claim 10 or 11 described electric contact arrangements, it is characterized in that: in above-mentioned (a) operation, by forming above-mentioned electrical contacts with spiral-shaped spiral contact site that forms and base portion integrally formed with above-mentioned spiral contact site and around above-mentioned spiral contact site
In above-mentioned (c) operation, at the recess that forms on the above-mentioned organic insulating material layer on the base portion that leads to above-mentioned electrical contacts from the face side of above-mentioned organic insulating material layer,
In above-mentioned (f) operation, by forming above-mentioned through hole, and the part of the spiral contact site that constitutes above-mentioned electrical contacts is exposed in above-mentioned through hole.
13. the manufacture method of electric contact arrangement according to claim 9 is characterized in that: organic insulating material layer used in above-mentioned (b) operation uses solder resist.
14. the manufacture method of electric contact arrangement according to claim 13, it is characterized in that: above-mentioned solder resist uses positive corrosion-resisting agent, remove the solder resist that is exposed part by in above-mentioned (c) operation, utilizing mask layer to carry out exposure imaging, form recess.
15. the manufacture method of electric contact arrangement according to claim 14 is characterized in that:, form through hole and remove the solder resist that is exposed part by in above-mentioned (f) operation, utilizing mask layer to carry out exposure imaging.
16. the manufacture method of electric contact arrangement according to claim 9 is characterized in that: in above-mentioned (d) operation, convex to form above-mentioned conducting portion in mode from the rat of above-mentioned organic insulating material layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003421529A JP4383843B2 (en) | 2003-12-18 | 2003-12-18 | Electrical contact structure and manufacturing method thereof |
| JP2003421529 | 2003-12-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1630456A CN1630456A (en) | 2005-06-22 |
| CN1323570C true CN1323570C (en) | 2007-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004101003145A Expired - Fee Related CN1323570C (en) | 2003-12-18 | 2004-12-09 | Electric contact arrangement and method for preparing same |
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| JP (1) | JP4383843B2 (en) |
| CN (1) | CN1323570C (en) |
| TW (1) | TWI272044B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007128787A (en) * | 2005-11-04 | 2007-05-24 | Matsushita Electric Works Ltd | Connector for connecting substrate |
| US11882878B2 (en) * | 2015-04-23 | 2024-01-30 | Altria Client Services Llc | Heating element and heater assemblies, cartridges, and e-vapor devices including a heating element |
| MY189691A (en) | 2015-04-23 | 2022-02-26 | Altria Client Services Llc | Unitary heating element and heater assemblies, cartridges, and e-vapor devices including a unitary heating element |
| US11464081B2 (en) | 2015-04-23 | 2022-10-04 | Altria Client Services Llc | Unitary heating element and heater assemblies, cartridges, and E-vapor devices including a unitary heating element |
| WO2020097815A1 (en) * | 2018-11-14 | 2020-05-22 | Applied Materials, Inc. | Tilted magnetron in a pvd sputtering deposition chamber |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4893172A (en) * | 1987-01-19 | 1990-01-09 | Hitachi, Ltd. | Connecting structure for electronic part and method of manufacturing the same |
| US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
| US6286205B1 (en) * | 1995-08-28 | 2001-09-11 | Tessera, Inc. | Method for making connections to a microelectronic device having bump leads |
| CN1347143A (en) * | 2000-09-26 | 2002-05-01 | 平井幸广 | Spiral contactor and mfg. method thereof, semiconductor detection apparatus using same and electronic element |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04297050A (en) * | 1991-03-12 | 1992-10-21 | Mitsubishi Electric Corp | Semiconductor inspection apparatus and preparation of its plane substrate |
| JP3681457B2 (en) * | 1996-01-11 | 2005-08-10 | 日本テキサス・インスツルメンツ株式会社 | socket |
| JP4323055B2 (en) * | 2000-03-22 | 2009-09-02 | 富士通マイクロエレクトロニクス株式会社 | Semiconductor device testing contactor and method of manufacturing the same |
| JP3878041B2 (en) * | 2002-03-22 | 2007-02-07 | 株式会社日本マイクロニクス | Contact and electrical connection device using the same |
| JP2004259467A (en) * | 2003-02-24 | 2004-09-16 | Micronics Japan Co Ltd | Contact and electrical connection device |
-
2003
- 2003-12-18 JP JP2003421529A patent/JP4383843B2/en not_active Expired - Fee Related
-
2004
- 2004-11-16 TW TW93135010A patent/TWI272044B/en not_active IP Right Cessation
- 2004-12-09 CN CNB2004101003145A patent/CN1323570C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4893172A (en) * | 1987-01-19 | 1990-01-09 | Hitachi, Ltd. | Connecting structure for electronic part and method of manufacturing the same |
| US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
| US6286205B1 (en) * | 1995-08-28 | 2001-09-11 | Tessera, Inc. | Method for making connections to a microelectronic device having bump leads |
| CN1347143A (en) * | 2000-09-26 | 2002-05-01 | 平井幸广 | Spiral contactor and mfg. method thereof, semiconductor detection apparatus using same and electronic element |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1630456A (en) | 2005-06-22 |
| JP4383843B2 (en) | 2009-12-16 |
| JP2005183143A (en) | 2005-07-07 |
| TW200527997A (en) | 2005-08-16 |
| TWI272044B (en) | 2007-01-21 |
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