CN1300633C - 背光模块及其散热结构 - Google Patents

背光模块及其散热结构 Download PDF

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CN1300633C
CN1300633C CNB2004100597057A CN200410059705A CN1300633C CN 1300633 C CN1300633 C CN 1300633C CN B2004100597057 A CNB2004100597057 A CN B2004100597057A CN 200410059705 A CN200410059705 A CN 200410059705A CN 1300633 C CN1300633 C CN 1300633C
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蔡宜轩
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AU Optronics Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Abstract

一种背光模块及其散热结构，该背光模块包括：一电路板，具有一通孔；以及一发光二极管，对应于该通孔而设于该电路板上；该散热结构包括：一热传导部，连接于该发光二极管，并位于该通孔中；一导热体，介于该热传导部与该发光二极管之间；一散热部，连接于该热传导部。

Description

背光模块及其散热结构
技术领域
本发明涉及一种背光模块所使用的散热结构，特别是涉及一种容易制造且散热效率高的背光模块的散热结构。
背景技术
在液晶显示器的背光模块中，往往使用发光二极管作为光源，由于发光二极管在发光时会产生热量，因此，发光二极管通常需要具备散热的机构。如图1所示，发光二极管20设置在液晶显示器中的一电路板10上，电路板10具有一通孔12，散热柱30设置在通孔12中，并连接于发光二极管20的背面，以有效地将发光二极管20的热量散去。
在如此的结构中，散热柱30通常通过焊接的方式与发光二极管20连接，但是以焊接的方式连接，会有组装不易的问题，且会使发光二极管的合格率降低。
另外，美国专利5,857,767号揭露一种如图2所示的散热构造，除了图2中所使用的散热柱30外，又在散热柱30下方连接一散热鰭片40，以增加其散热效率。但在如此的构造中，组装不易的问题会更加严重。
发明内容
有鉴于此，本发明的目的在于改善现有背光模块的发光二极管的散热机构组装不易以及其造成发光二极管合格率不佳的问题。
为达成上述目的，本发明提供一种散热结构，用于一背光模块中，该背光模块包括：一电路板，具有一通孔；以及一发光二极管，对应于该通孔而设于该电路板上；该散热结构包括：一热传导部，热传导性地连接于该发光二极管，并位于该通孔中；一导热体，设于该热传导部与该发光二极管之间；一散热部，热传导性地连接于该热传导部，并与该发光二极管位于该电路板的相反侧，且该热传导部与该散热部为一体成型。
在本发明的散热结构中，该导热体分别与该发光二极管与该热传导部紧密接触，由此使热传导部与发光二极管之间的热阻减小，增进热传效率。
在本发明的散热结构中，该导热体可为固态导热垫或是液态的导热膏。不论导热垫或导热膏均可密接于热传导部以及发光二极管，使热传导部以及发光二极管间无空隙存在，又不易造成发光二极管的合格率降低。
在本发明的散热结构中，该热传导部与该散热部为一体成型。如此可克服组装繁杂的问题。
在本发明的散热结构中，该热传导部包括一柱形的导热元件，而该散热部包括一片状的散热元件。
在本发明的散热结构中，该热传导部与该散热部的材质可为铜、铝等金属或为导热系数高的工程塑料。
本发明还提供一种背光模块，包括：一框板；一电路板，具有多个通孔，并设于该框板上；多个发光二极管，对应于该各通孔而设置于该电路板上，并与该电路板做电连接；多个热传导部，热传导性地连接于该各发光二极管，并位于该各通孔中；多个导热体，介于该各发光二极管与该各热传导部之间；至少一散热部，热传导性地连接于该各热传导部，并位于该各电路板与该框板之间，且该热传导部与该散热部为一体成型，散热部可接触于该框板。通过散热部与框板的接触，发光二极管所产生的热，经由热传导部、散热部，最后由框板发散至大气中。
本发明的散热结构通过导热体使热传导柱与发光二极管做导热连接，可解决组装的问题，并增进发光二极管的合格率，同时使散热片与热传导柱一体成形以解决组装繁杂的问题，并增进散热效率。
为了让本发明的上述和其它目的、特征、和优点能更明显易懂，下文特举一较佳实施例，并配合附图作详细说明如下。
附图说明
图1为现有背光模块的发光二极管所使用的散热机构的剖视图；
图2为另一种现有背光模块的发光二极管所使用的散热机构的剖视图；
图3为本发明的背光模块的发光二极管所使用的散热机构的剖视图；
图4为本发明的直下式背光模块的剖视图；
图5为本发明的侧光式背光模块的剖视图。
具体实施方式
如图3所示，发光二极管20设置在一印刷电路板10上，并与该印刷电路板10做电气连接。本发明的散热构造中包括一热传导部(在本实施例中为热传导柱300)以及一散热部(在本实施例中为散热片400)，热传导柱300通过导热体500连接于发光二极管20的背面，印刷电路板10设有一通孔12，以容纳热传导柱300通过印刷电路板10，而散热片400则连接于热传导柱300的末端，并位于印刷电路板10的背面(发光二极管20的相反侧)，为组装方便以及增大散热面积，散热片400可与热传导柱300一体成型并形成T字形；由此，发光二极管20所产生的热经由导热体500、热传导柱300传导至散热片400。
热传导柱300可用导热性佳的金属如铜、铝等或导热系数高的工程塑料制成。导热体500可为固态软质的导热垫或为液态的导热膏，由此可与热传导柱300以及发光二极管20紧密接触，因而减少热传导柱300以及发光二极管20间的热阻，增进热传效率。
图4为将此散热结构应用至直下式背光模块的剖面图。如图4所示，背光模块具有7个发光二极管20作为其光源，发光二极管20设置于一电路板10上，热传导柱300经由导热体500分别连接于对应的发光二极管20的背面，同时在电路板10中设置有通孔101供热传导柱300通过电路板10，散热片400连接于热传导柱300的末端。如图4所示，仅使用一个散热片400连接7个热传导柱300，但每个热传导柱300个别连接一散热片400也可，或者是为了组装方便，数个热传导柱300连接同一散热片400也可，均属于本发明所请求保护的范围内。
此外，散热片400可接触于背光模块的背框板50，由此可将发光二极管的热经由背框板50发散至大气中。
图5为本发明的散热结构应用至侧光式背光模块的剖面图。如图5所示，电路板1000设置在背光模块的侧框板80上，发光二极管2000设置在印刷电路板1000上，热传导柱3000通过导热体5000连接于发光二极管2000，散热片4000连接于热传导柱3000的末端，并接触于侧框板80。
本发明的散热结构通过导热体使热传导柱与发光二极管做导热连接，可解决组装的问题，并增进发光二极管的合格率，同时使散热片与热传导柱一体成形以解决组装繁杂的问题，并增进散热效率。
虽然结合以上较佳实施例揭露了本发明，然而其并非用以限定本发明，任何熟悉此技术者，在不脱离本发明的精神和范围内，可作一些的更动与润饰，因此本发明的保护范围应以权利要求所界定的为准。

Claims (8)

1.一种散热结构，用于一背光模块中，该背光模块包括：一电路板，具有一通孔；以及一发光二极管，对应于该通孔而设于该电路板上；该散热结构包括：
一热传导部，热传导性地连接于该发光二极管，并位于该通孔中；
一导热体，设于该热传导部与该发光二极管之间；
一散热部，热传导性地连接于该热传导部，且该热传导部与该散热部为一体成型。
2.如权利要求1所述的散热结构，其中该导热体分别与该发光二极管与该热传导部紧密接触。
3.如权利要求1所述的散热结构，其中该热传导部包括一柱形的导热元件。
4.如权利要求1所述的散热结构，其中该散热部包括一片状的散热元件。
5.一种背光模块，包括：
一框板；
一电路板，具有多个通孔，并设于该框板上；
多个发光二极管，对应于该各通孔而设置在该电路板上，并与该电路板做电连接；
多个热传导部，热传导性连接于该各发光二极管，并位于该各通孔中；
多个导热体，介于该各发光二极管与该各热传导部之间；
至少一散热部，热传导性地连接于该各热传导部，并位于该各电路板与该框板之间，且该各热传导部与该散热部为一体成型。
6.如权利要求5所述的背光模块，其中该散热部接触于该框板。
7.如权利要求5所述的背光模块，其中该热传导部包括一柱形的导热元件。
8.如权利要求5所述的背光模块，其中该散热部包括一片状的散热元件。
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US10/780,821 US6966674B2 (en) 2004-02-17 2004-02-17 Backlight module and heat dissipation structure thereof

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