CN1290102C - 光学器件、光拾取器与光盘装置 - Google Patents
光学器件、光拾取器与光盘装置 Download PDFInfo
- Publication number
- CN1290102C CN1290102C CNB200310118671XA CN200310118671A CN1290102C CN 1290102 C CN1290102 C CN 1290102C CN B200310118671X A CNB200310118671X A CN B200310118671XA CN 200310118671 A CN200310118671 A CN 200310118671A CN 1290102 C CN1290102 C CN 1290102C
- Authority
- CN
- China
- Prior art keywords
- light
- prism
- emitting component
- optical device
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/22—Apparatus or processes for the manufacture of optical heads, e.g. assembly
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
- G11B7/127—Lasers; Multiple laser arrays
- G11B7/1275—Two or more lasers having different wavelengths
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
- G11B7/1356—Double or multiple prisms, i.e. having two or more prisms in cooperation
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
- G11B7/1359—Single prisms
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B2007/0003—Recording, reproducing or erasing systems characterised by the structure or type of the carrier
- G11B2007/0006—Recording, reproducing or erasing systems characterised by the structure or type of the carrier adapted for scanning different types of carrier, e.g. CD & DVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002346669A JP2004178755A (ja) | 2002-11-29 | 2002-11-29 | 光学デバイス、光ピックアップおよび光ディスク装置 |
JP346669/2002 | 2002-11-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1505021A CN1505021A (zh) | 2004-06-16 |
CN1290102C true CN1290102C (zh) | 2006-12-13 |
Family
ID=32376068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200310118671XA Expired - Fee Related CN1290102C (zh) | 2002-11-29 | 2003-11-28 | 光学器件、光拾取器与光盘装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7400568B2 (zh) |
JP (1) | JP2004178755A (zh) |
CN (1) | CN1290102C (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4322058B2 (ja) * | 2003-07-23 | 2009-08-26 | 日本電産サンキョー株式会社 | 光学素子の固定構造、および光ヘッド装置 |
JP4253559B2 (ja) * | 2003-10-21 | 2009-04-15 | 株式会社日立製作所 | 光ピックアップ装置及び光ディスク装置 |
KR100612838B1 (ko) * | 2004-02-07 | 2006-08-18 | 삼성전자주식회사 | 광학벤치, 이를 사용한 박형광픽업 및 그 제조방법 |
KR100634522B1 (ko) * | 2004-11-03 | 2006-10-16 | 삼성전기주식회사 | 광픽업 장치 및 상기 광픽업 장치에 구비된 서브마운트와광학 벤치의 결합 방법 |
JP4356683B2 (ja) * | 2005-01-25 | 2009-11-04 | セイコーエプソン株式会社 | デバイス実装構造とデバイス実装方法、液滴吐出ヘッド及びコネクタ並びに半導体装置 |
JP4930322B2 (ja) | 2006-11-10 | 2012-05-16 | ソニー株式会社 | 半導体発光素子、光ピックアップ装置および情報記録再生装置 |
TW201032228A (en) * | 2009-02-27 | 2010-09-01 | Univ Nat Central | Optical pickup head |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3250496B2 (ja) * | 1997-09-19 | 2002-01-28 | 日本電気株式会社 | 光素子実装基板 |
JPS63118259U (zh) * | 1987-01-24 | 1988-07-30 | ||
JPH075545Y2 (ja) * | 1989-01-18 | 1995-02-08 | ティアツク株式会社 | 光学ヘッド |
JPH0774343A (ja) * | 1993-08-31 | 1995-03-17 | Fujitsu Ltd | 集積化光装置及びその製造方法 |
JPH1021577A (ja) * | 1996-07-03 | 1998-01-23 | Seiko Epson Corp | 複合光学素子および光学ヘッドおよび光メモリ装置 |
JPH1027374A (ja) * | 1996-07-08 | 1998-01-27 | Sankyo Seiki Mfg Co Ltd | 半導体レーザモジュール |
JP4087918B2 (ja) * | 1996-09-05 | 2008-05-21 | オリンパス株式会社 | 集積型光学ユニット |
JPH1092005A (ja) * | 1996-09-17 | 1998-04-10 | Sony Corp | 光学ピックアップ及び光ディスク装置 |
JPH10149559A (ja) * | 1996-11-19 | 1998-06-02 | Sankyo Seiki Mfg Co Ltd | レーザビーム出射装置 |
JPH10241189A (ja) * | 1997-02-24 | 1998-09-11 | Sanyo Electric Co Ltd | 光ピックアップ装置およびそれを備えた光学記録媒体駆動装置 |
KR100253810B1 (ko) * | 1997-07-10 | 2000-04-15 | 구자홍 | 이파장 광원모듈 및 그를 이용한 광픽업장치 |
JPH11134703A (ja) * | 1997-11-04 | 1999-05-21 | Toshiba Corp | 部品及びその製造方法 |
JPH11283269A (ja) | 1998-03-26 | 1999-10-15 | Sony Corp | 半導体集積受発光装置 |
CA2282612A1 (en) * | 1998-09-18 | 2000-03-18 | Sumitomo Electric Industries, Ltd. | Photodiode module |
WO2001011615A1 (fr) * | 1999-08-04 | 2001-02-15 | Hitachi, Ltd. | Module laser et tete optique |
WO2001011616A1 (fr) | 1999-08-04 | 2001-02-15 | Hitachi, Ltd. | Module laser, tete optique comprenant ledit module, et dispositif d'enregistrement/reproduction d'informations optiques |
KR100657252B1 (ko) * | 2000-01-20 | 2006-12-14 | 삼성전자주식회사 | 근접장 기록재생용 광헤드 및 그 제조방법 |
US6467972B2 (en) * | 2000-02-29 | 2002-10-22 | Kyocera Corporation | Optical interconnection module |
JP2002258115A (ja) * | 2001-02-28 | 2002-09-11 | Kyocera Corp | 光モジュール |
JP3854809B2 (ja) | 2001-03-15 | 2006-12-06 | 株式会社日立製作所 | 光ヘッド装置 |
-
2002
- 2002-11-29 JP JP2002346669A patent/JP2004178755A/ja active Pending
-
2003
- 2003-11-28 CN CNB200310118671XA patent/CN1290102C/zh not_active Expired - Fee Related
- 2003-11-28 US US10/722,482 patent/US7400568B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7400568B2 (en) | 2008-07-15 |
CN1505021A (zh) | 2004-06-16 |
US20040105378A1 (en) | 2004-06-03 |
JP2004178755A (ja) | 2004-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Co-patentee after: Hitachi Audio-visual Media Co., Ltd. Patentee after: Hitachi Manufacturing Co., Ltd. Address before: Tokyo, Japan Co-patentee before: Hitachi electronic audio-visual media Patentee before: Hitachi Manufacturing Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: HITACHI LTD. Free format text: FORMER OWNER: HITACHI,LTD. Effective date: 20130722 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130722 Address after: Tokyo, Japan Patentee after: Hitachi Consumer Electronics Co.,Ltd. Patentee after: Hitachi Audio-visual Media Co., Ltd. Address before: Tokyo, Japan Patentee before: Hitachi Manufacturing Co., Ltd. Patentee before: Hitachi Audio-visual Media Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061213 Termination date: 20141128 |
|
EXPY | Termination of patent right or utility model |