CN1174248A - Immersing spray method - Google Patents
Immersing spray method Download PDFInfo
- Publication number
- CN1174248A CN1174248A CN 96109445 CN96109445A CN1174248A CN 1174248 A CN1174248 A CN 1174248A CN 96109445 CN96109445 CN 96109445 CN 96109445 A CN96109445 A CN 96109445A CN 1174248 A CN1174248 A CN 1174248A
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- plate body
- liquid medicine
- jet pipe
- printed circuit
- immersing
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Abstract
Immersing spray method for etching printed circuit board and deveopment is that in the transfer path of continuous printed circuit board conveyer, several chemical liquid spraying nozzles are provided. Chemical liquid immerses the said conveyer, printed circuit board and nozzle and jet efflux of the nozzles scours the surface of printed circuit boards to produce chemical replacement reaction and increased and homogenized etching effect. The present invention can prevent side etching of printed circuit.
Description
The present invention relates to a kind of immersing spray method, particularly relate to a kind of method that is used for the etching and the development of printed circuit board (PCB).
As shown in Figure 1, the etching of printed circuit board (PCB) and development in the past is that printed circuit board (PCB) 11 (PC plate) is carried with continuous pairs roller arranged side by side 12, etched liquid medicine 13 then is sprayed directly on these printed circuit board (PCB) 11 surfaces from the nozzle 14 that sprays and carries out etching, washing out the circuit of printed circuit board (PCB) 11, yet previous methods has following shortcoming:
One, the zone of the sprinkling of each nozzle 14 is the distribution of border circular areas, therefore the uneven phenomenon of adjacent area is arranged, and causes between the adjacent sprinkling zone gapped.
Two, carry the roller 12 of usefulness can cover the liquid medicine 13 of sprinkling, the efficient that liquid medicine is sprayed reduces.
Three, Pen Chu liquid medicine 13 is directly to impact PC plate 11 plate faces, so pressure is big, makes circuit produce lateral erosion (undercut) phenomenon easily.
Four, the pressure of Pen Saing is excessive and inhomogeneous, the phenomenon that makes thin plate be easy to generate sinking, kick up or swing when spraying, and the path that the skew thin plate is carried.
Five, the spray pressure can cause anti-etching cuticula breakage, and whole this PC plate 11 is damaged.
Main purpose of the present invention provides a kind of method that is used for the etching and the development of printed circuit board (PCB), this method be a kind ofly enlarge etched zone, make etching evenly, increase etching efficiency and avoid circuit to produce the immersing spray method of side etching phenomenon.
Principal character of the present invention is transfer mechanism, plate body and the jet pipe that respectively sprays liquid medicine to be dived fully be immersed in the liquid medicine, allow the linear water column of jet pipe ejection in the liquid medicine immersion liquid, produce jet action, printed circuit board surface is produced souring, to carry out the chemical replacement reaction, can reach enlarge etched zone, make etching evenly, increase the effect of etching efficiency, and can avoid circuit to produce side etching phenomenon.
Method of the present invention mainly provides a kind of transfer mechanism and most individual jet pipe that can spray liquid medicine on the plate body transport path that is located at of continuous conveying plate body, it is characterized in that, make the liquid medicine submergence cross transfer mechanism, plate body and each jet pipe, allow the linear water column of jet pipe ejection in the liquid medicine immersion liquid, produce jet action, printed circuit board surface is produced souring, to carry out the chemical replacement reaction.
The present invention is described in detail below in conjunction with drawings and Examples:
Fig. 1 is a printed circuit board (PCB) engraving method synoptic diagram in the past.
Fig. 2 is the synoptic diagram of preferred embodiment of the present invention.
Fig. 3 is the sedimentation exhalation synoptic diagram of the above-mentioned preferred embodiment of the present invention.
As Fig. 2, shown in 3, method of the present invention provides a transfer mechanism 2 of carrying plate body 3 continuously, and provide most to be located at the jet pipe 4 that can spray liquid medicine 5 on these plate body 3 transport paths, it is characterized in that: this transfer mechanism 2 is crossed in liquid medicine 5 submergences, plate body 3 and each jet pipe 4, allow this jet pipe 4 in liquid medicine 5 immersion liquid, produce jet action by the linear water column of nozzle 41 ejections, these plate body 3 surfaces are produced souring, react and carry out chemical replacement, can reach and enlarge etched zone, make etching even, increase the effect of etching efficiency, and can avoid circuit to produce the phenomenon of lateral erosion.
So, method of the present invention provides a transfer mechanism 2, this transfer mechanism 2 can be carried plate body 3 continuously, this transfer mechanism 2 comprises that most consecutive intervals conveying rollers 21 that each jet pipe 4 is arranged in pairs, and be used for carrying the PC plate of plate body 3, and provide most the jet pipes 4 that are located on PC plate 3 transport paths, this jet pipe 4 can be used to spray liquid medicine 5, when the two-sided PC plate 3 of etching, each jet pipe 4 is top and the belows that are located at this PC plate 3 up and down in couples, with simultaneously to the two-sided generation effect of PC plate 3.Feature of the present invention is to use these liquid medicine 5 submergences to cross transfer mechanism 2, plate body 3 and each jet pipe 4, for example will charge into liquid medicine 5 in the tank 6 that be located on this transfer mechanism 2, make this liquid medicine 5 can fully flood transfer mechanism 2, plate body 3 and each jet pipe 4, allow this jet pipe 4 in the immersion liquid of this liquid medicine 5, produce jet action by this by the linear water column of nozzle 41 ejection liquid medicine, can produce souring and carry out the chemical replacement reaction carry PC plate 3 surfaces of moving via this transfer mechanism 2, enlarge etched zone and reach, make etching even, increase the effect of etching efficiency, and avoid circuit to produce side etching phenomenon.
In sum, the present invention's effect that can reach is as the back:
One, this plate body 3 is whole being immersed in the liquid medicine, and the water column of this jet pipe 4 ejections produces jet action in immersion liquid, therefore can produce whole plate body 3 surfaces and wash away and chemical reaction, does not have the interregional gapped and uneven phenomenon of adjacent in the past sprinkling.
Two, whole plate body 3 is immersed in the liquid medicine 5, can significantly reduce the shortcoming that the roller of carrying usefulness can cover the liquid medicine 5 of sprinkling, and efficient is improved.
Two, the 5 pairs of plate faces of Pen Chu liquid medicine produce the effusive effect of face, make the pressure action temperature and and active area big, therefore not have the ballistic big pressure of point of the PC of direct drug injection water slug in the past plate face, can avoid circuit generation side etching phenomenon.
Four, the effusive effect of 5 pairs of these plate body 3 surperficial generation faces of Pen Chu liquid medicine, make the pressure action temperature and and active area big, therefore do not have directly to impact the big pressure of the some surging force of PC plate face in the past, thereby therefore can avoid making thin plate in course of conveying, produce sinking, kick up or swing the phenomenon of skew transport path with liquid medicine.
Five, the jet action of 5 pairs of PC plates of this liquid medicine, 3 generation faces can reduce pressure, the increase active area of ejection, and avoid causing anti-etching cuticula breakage, improves the qualification rate and the output of this PC plate 3.
Claims (3)
1, a kind of immersing spray method, it provides one in order to the transfer mechanism of continuous conveying plate body and be located at the jet pipe of the sprayed liquid medicine on the plate body transport path more than two, it is characterized in that:
Make the liquid medicine submergence cross transfer mechanism, plate body and each jet pipe, allow the linear water column of jet pipe ejection in the liquid medicine immersion liquid, produce jet action, and described plate body surface is washed away, and carry out the chemical replacement reaction.
2, immersing spray method as claimed in claim 1 is characterized in that:
Described transfer mechanism comprises that two above consecutive intervals the conveying roller that each jet pipe is arranged in pairs.
3, immersing spray method as claimed in claim 1 or 2 is characterized in that:
Described jet pipe is top and the below that is located at described plate body up and down in couples.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN96109445A CN1056423C (en) | 1996-08-16 | 1996-08-16 | Immersing spray method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN96109445A CN1056423C (en) | 1996-08-16 | 1996-08-16 | Immersing spray method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1174248A true CN1174248A (en) | 1998-02-25 |
| CN1056423C CN1056423C (en) | 2000-09-13 |
Family
ID=5120361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN96109445A Expired - Fee Related CN1056423C (en) | 1996-08-16 | 1996-08-16 | Immersing spray method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1056423C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6174417B1 (en) | 1998-05-20 | 2001-01-16 | Process Automation International Ltd. | Electroplating machine |
| US6261425B1 (en) | 1998-08-28 | 2001-07-17 | Process Automation International, Ltd. | Electroplating machine |
| CN102560494A (en) * | 2010-12-30 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | Etching device and etching method |
| WO2017097206A1 (en) * | 2015-12-08 | 2017-06-15 | 金英花 | Surging type electrode manufacturing system |
| CN107434363A (en) * | 2016-05-25 | 2017-12-05 | 东莞市腾明智能设备有限公司 | Circuit board glass is roughened device |
| CN110894606A (en) * | 2019-10-21 | 2020-03-20 | 长沙锂安能电子科技有限公司 | Crawler-type double-gravure synchronous etching system and etching method |
| CN111556661A (en) * | 2020-05-22 | 2020-08-18 | 广州冰钫商贸有限公司 | PCB etching machine |
| CN114143975A (en) * | 2021-12-06 | 2022-03-04 | 江西华兴四海机械设备有限公司 | Circuit board compensation etching device and compensation etching method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0823164A (en) * | 1994-07-05 | 1996-01-23 | Ebara Densan:Kk | Plating method for printed board |
-
1996
- 1996-08-16 CN CN96109445A patent/CN1056423C/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6174417B1 (en) | 1998-05-20 | 2001-01-16 | Process Automation International Ltd. | Electroplating machine |
| US6241860B1 (en) | 1998-05-20 | 2001-06-05 | Process Automation International, Ltd. | Electroplating machine |
| US6251234B1 (en) | 1998-05-20 | 2001-06-26 | Process Automation International, Ltd. | Electroplating machine |
| US6261425B1 (en) | 1998-08-28 | 2001-07-17 | Process Automation International, Ltd. | Electroplating machine |
| CN102560494A (en) * | 2010-12-30 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | Etching device and etching method |
| WO2017097206A1 (en) * | 2015-12-08 | 2017-06-15 | 金英花 | Surging type electrode manufacturing system |
| CN107434363A (en) * | 2016-05-25 | 2017-12-05 | 东莞市腾明智能设备有限公司 | Circuit board glass is roughened device |
| CN110894606A (en) * | 2019-10-21 | 2020-03-20 | 长沙锂安能电子科技有限公司 | Crawler-type double-gravure synchronous etching system and etching method |
| CN111556661A (en) * | 2020-05-22 | 2020-08-18 | 广州冰钫商贸有限公司 | PCB etching machine |
| CN111556661B (en) * | 2020-05-22 | 2021-04-23 | 广州冰钫商贸有限公司 | PCB etching machine |
| CN114143975A (en) * | 2021-12-06 | 2022-03-04 | 江西华兴四海机械设备有限公司 | Circuit board compensation etching device and compensation etching method |
| CN114143975B (en) * | 2021-12-06 | 2024-02-23 | 江西华兴四海机械设备有限公司 | Circuit board compensation etching device and compensation etching method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1056423C (en) | 2000-09-13 |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |