CN1083626A - 表面可安装的时钟振荡器组件以及制造该组件的方法 - Google Patents

表面可安装的时钟振荡器组件以及制造该组件的方法 Download PDF

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CN1083626A
CN1083626A CN93105339A CN93105339A CN1083626A CN 1083626 A CN1083626 A CN 1083626A CN 93105339 A CN93105339 A CN 93105339A CN 93105339 A CN93105339 A CN 93105339A CN 1083626 A CN1083626 A CN 1083626A
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leadframe
crystal oscillator
integrated circuit
resistor
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霍克莱·佩克
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Kyocera Avx Components Corp
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Abstract

一种用树脂封装在一个表面安装器件(SMD)封 装件内的晶体控制的时钟振荡器，它在一个引脚框上 装有晶体振荡器、集成电路、电源滤波电容器以及任 选的一个反馈电阻器。在该器件的制造过程中，注入 树脂时，相对于各元件的位置和方向，可使引脚框和 安装其上的元件的损伤减至最小。

Description

本发明一般涉及树脂封装的时钟振荡器组件，尤其涉及一种紧凑、表面可安装的时钟振荡器组件，该组件在树脂封装内包含有晶体振荡器、集成电路、电源滤波电容器及可以附加的电阻器。本发明还进一步涉及能以高成品率生产该组件的方法。
时钟振荡器是控制逻辑电路定时和操作的器件。这种器件在消费类和工业电子产品中得到了极其广泛的应用。例如，个人计算机可以在主处理单元中，在扩充电路板和视频图象适配器上，以及在诸如打印机、调制解调器和网络设备等各种外部设备中应用若干时钟振荡器。在电信工业中，时钟振荡器还应用于传真机、蜂窝式电话以及无线电发送和接收系统。
时钟振荡器目前是在一个封装件内装有频率控制器（例如石英晶体）以及包含电阻器、电容器和晶体管或集成电路的混合电路。这些元件安装在厚膜基片或印刷电路板上，用密封金属壳封装以使其免受环境影响，而金属壳还可以用来减少噪声，即通常由振荡器产生的不想要的电磁射频辐射。这些现有的封装件采纳DIP（双列直插式组件）标准，并典型地采用8或14根插脚。
随着对电子元件进一步小型化的不断要求，人们已经试图生产更为紧凑的时钟振荡器封装件。然而，这些器件却继续沿用DIP标准，并通常不把无源元件例如电源滤波电容器包括在内。因此，这些元件必须单独从外部附加到时钟振荡器封装件上。这类器件的例子可参看Nakayama等人申请的、于1990年4月10日公布的第4，916，413号美国专利。
现有树脂封装时钟振荡器件的另一个缺点在于，元件在引脚框架上相对于树脂注入座的位置和排布，在用树脂封装元件的连续自动送进模压操作中往往会使各元件和引脚框架的引脚受到影响，有时候达到造成精密胶合连接破坏的程度。更有甚者，由于典型采用的环氧树脂的快速凝固率，树脂并非总能填满整个空腔内，由此，通常会危及器件的机械牢固性，并最终使各被封装元件及其连接线路受到周围环境的影响。
本发明的目的在于克服现有时钟振荡器封装件的上述问题和缺陷。根据本发明的一个方面，提供了一种紧凑的、表面可安装的时钟振荡器组件，它包括一个引脚框架，该引脚框架具有两个底缘、与底缘相垂直的侧缘以及从每个侧缘伸出的一对J型引脚。该引线框架进一步设置有一个集成电路晶片衬垫、一对片状电容器衬垫、一对晶体振荡器衬垫、连接所述引脚和衬垫的导体、以及一个用以接受晶体振荡器的窗孔。晶体振荡器衬垫紧贴引脚框的一个底缘而设置，集成电路晶片衬垫和片状电容器衬垫设置在晶体振荡器窗孔与引脚框的一个侧缘之间。通常呈圆柱形的晶体振荡器被安置在引脚框窗孔内，该晶体振荡器具有底面，其中心纵轴通常沿引脚框侧缘平行延伸。晶体振荡器进一步包括一对从其底面延出并连接到设置在引脚框上的晶体振荡器衬垫上的引脚。集成电路安装在集成电路晶片垫上，它包括连接到选定的各引脚框导体上的若干引线，片状电容器安装在片状电容器衬垫上。除了J引脚外，上述所有元件都包含在一个整体树脂封装内。此外，与晶体振荡器并联连接的电阻器也可以装在封装件内。在含有电阻器的情况下，该电阻器与集成电路和电容器安装在晶体振荡器的同一侧。
在本发明中，晶体振荡器和其它元件的排布，使滤波器片状电容器以及任选的片状电阻器都可以装在一个符合表面安装器件（SMD）标准封装件尺寸的紧凑的组件内。
根据本发明的另一个方面，提供了制造上述紧凑的、表面可安装的时钟振荡器组件的一种方法。根据该方法的一个较佳实施例，提供一种具有沿纵向延伸的穿孔边条的扁平薄带，该薄带确定了多个沿薄带纵向隔开的引脚框，每个引脚框均按如上所述构成。上述晶体振荡器、集成电路、电容器以及任选的电阻器都连接于引脚框上相应的衬垫上，其中，集成电路、电容器和电阻器都设置在晶体振荡器与引脚框的一个侧缘之间。然后，所有上述电路元件都通过连续自动送进模压操作进行树脂封装，沿着上述薄带形成各个独立的时钟振荡器组件，树脂是通过位于与上述侧缘相对的另一侧缘上靠近所述一个底缘处的一个横向延伸的槽注入的。然而，将各个独立的时钟振荡器组件从薄带上分离出来，而每个引脚框的引脚则形成标准的J型引脚构造。
通过靠近引脚框的上述角落注入树脂，即采用这样一种方法，以垂直于并与晶体振荡器纵向延伸的固定引脚相交的方向，在引脚框上与支承有源和无源元件的一侧相对的一侧注入树脂，可以使注入过程中引线框、各元件及其相互连接所受的损伤减到最小程度。还发现，采用上述树脂注入槽位置以及注入方向，其结果是每个模压空腔内均全部被填满。由此即获得优良的成品率。
通过以下结合附图所作的详细描述，本发明的目的、优点以及特点将变得更为明显。
图1是用于本发明的一个晶体控制时钟振荡器电路的示意图;
图2是根据本发明的引线框薄带的一部分平面图，显示一个典型的引脚框构造、在引脚框上的元件排布以及树脂注入位置和方向;
图3是详细显示本发明引脚框结构以及安装在其上的元件的一个时钟振荡器组件的平面图，所述各元件按等比例表示;
图4A-4C是根据本发明制造的最终时钟振荡器组件的平面视图、侧视图和端部视图。
图1是用以在输出引脚或引线12产生数字逻辑电平信号的一个时钟振荡器电路10的示意图。电路10包括一个CMOS反相器14，该反相器14与包含石英晶体振荡器16和可任选的片状电阻器18在内的反馈元件并联。电源滤波片状电容器20跨接在电源引脚与接地引脚（即引线22与24）之间。输出CMOS反相器26具有一个通过启动引脚或引线28接收启动信号的连接端，它与反相器14串联耦合。反相器14和26采用集成电路器件30的形式。
以下将参照图2和图3详细描述装有图1所示电路的一种时钟振荡器SMD组件的制造。一连串时钟振荡器组件在一条引脚框薄带40上成型，该引脚框带40是从适当的导电材料平片上切断或冲压开来，并经化学蚀刻，沿薄带的长度形成多个（例如15个）邻接的、纵向隔开的相同引脚框（如引脚框42）。薄带40具有穿孔的纵向边条44和横向分跨两则的横条46，并用连接条48支承引脚框42。引脚框42设计成用以容纳时钟振荡器电路元件，由此形成的组件最终通过连续自动送进模压工序以树脂封装。最终树脂封装的封装件具有图2和图3中虚线50所示的轮廓。该封装件轮廓包括纵向延伸的侧边或边缘52和54，以及横向延伸的底缘56和58。模压后，边条44和连接条48被切断以形成单独的组件。
每个引脚框42都设置有：一个矩形的时钟振荡器接受窗60，窗60纵向延伸在引脚框的底缘56和58之间;一对靠近底缘56的时钟振荡器引脚衬垫62;集成电路连接衬垫64;一对电容器衬垫66以及一对电阻器衬垫68。衬垫64、66和68全部设置在晶体窗口60的一侧，即窗口60与引脚框底缘54之间。衬垫64、66和68按图1所示的电路示意图连接，并通过诸如导电路径70-77的导体耦合到四根引脚12、22、24和28。引脚12和22从引脚框的侧缘52伸出，引脚24和28则从侧缘54伸出。
如图2和图3所示，晶体振荡器16安装在引脚框的矩形窗口60内。晶体振荡器16典型地呈圆柱形状，其中心轴80沿纵向延伸，即与引脚框42的所述侧缘52和54相平行。晶体16进一步包括一对纵向的引脚82，它从晶体封装件的底面84伸出，并焊接到衬垫62上。因此晶体16以悬梁方式安装在引脚框衬垫62上。其余元件，包括集成电路器件30、片状电容器20和任选的电阻器18分别连接到其相应的衬垫64、66和68上。由图2和图3可见，这些元件被布置在晶体振荡器16与引脚框侧缘54之间，以形成一种紧凑的封装件，其尺寸可以符合SMD标准。这种设置的其它优点将在以下阐明。
引脚框内以虚线90（图2）为界的区域，该区域包括衬垫64、66和68，是用贵金属例如银涂覆的。涂覆在衬垫上的含银环氧树脂用以将集成电路、电容器和任选的反馈电阻器连接到引脚框上。
在将晶体16的引脚焊接到晶体振荡器衬垫62上，将电容器、电阻器和集成电路连接到其相应的衬垫上，以及将集成电路的连接端通过导线焊接到合适的导电线路（图3）上之后，引脚框带被放置在一个连续自动模压空腔平台系统（Plate    assembly）中，然后，时钟振荡器单元通过连续自动模压工序，进行树脂封装。如图2所示，树脂从纵向供料通道槽92经由模向延伸的通道94和由此延伸的槽96注入每个模压腔。重要的是，槽96设置在引脚框侧缘52上由侧缘52和底缘56所划定的引脚框的角落附近。这样，槽96即将树脂导向晶体的固定引脚，与这些引脚的方向相垂直，并且是在引脚框上安装了集成电路、电容器和电阻器的另一侧将树脂引入。通过如此相对于元件的位置而设置树脂槽，并按所示模向注入树脂，由树脂注入而导致的引脚框及安装在其上的元件的损伤可基本上避免，而且，为每个组件限定树脂封装区域的模压腔可以可靠地被树脂全部灌满。结果，利用本发明的制造工艺即可获得较高的产品率，而最终制成的封装元件则完全不受环境影响。
将各单个组件分开以后，引脚12、22、24和28被弯成如图4A-4C所示的J型引脚结构，图中描述了最终的SMD封装件的结构。
显然，本领域的熟练人员可在不脱离后列权利要求书所限定的、本发明的精神和范围内，对其中所述的结构和方法作出各种变换;上述以及附图中所示的结构和方法，其目的仅仅是为了进行解释。

Claims (4)

1、一种紧凑的表面可安装的时钟振荡器组件，其特征在于包括：
一个引脚框，所述引脚框具有两个底缘、与所述底缘相垂直的侧缘以及从每个侧缘伸出的一对J型引脚，所述引线框进一步设置有一集成电路晶片衬垫、一对片状电容器衬垫、一对晶体振荡器衬垫、连接所述引脚和衬垫的导体以及一个用以容纳晶体振荡器的窗孔，所述晶体振荡器衬垫位于所述引脚框的一底缘附近，所述集成电路晶片衬垫和片状电容器衬垫位于晶体振荡器窗孔与引脚框的一侧缘之间；
安置在所述窗孔内的一个通常呈圆柱形的晶体振荡器，所述晶体振荡器具有底面和一个通常与引脚框侧缘平行延伸的中心纵向轴，所述晶体振荡器进一步包括从其一底面伸出并连接到设置在所述引脚框上的晶体振荡器衬垫上的一对引脚；
安装在所述集成电路晶片衬垫上的集成电路，所述集成电路包括连接到所述引脚框导体上的引线；
安装在所述片状电容器衬垫上的片状电容器，上述所有元件除J型引脚外均被包含在一个整体树脂封装内。
2、如权利要求1所述的时钟振荡器组件，其特征在于：
所述引脚框进一步设置有位于所述晶体振荡器窗孔与所述引脚框一侧缘之间的一对电阻器衬垫，所述电阻器衬垫与所述晶体振荡器的两引脚相耦合;
所述时钟振荡器进一步包括安装在所述电阻器衬垫上的电阻器，而所述电阻器包含在所述树脂封装内。
3、一种制造紧凑的、表面可安装的时钟振荡器组件的方法，其特征在于包括以下步骤：
提供一种具有纵向延伸的穿孔边条的扁平薄带，所述薄带设置有多个沿薄带纵向隔开的引脚框，每个所述引脚框具有纵向延伸的侧缘和横向延伸的底缘，每个所述引脚框进一步设置有一集成电路晶片衬垫、一对片状电容器衬垫、一对晶体振荡器衬垫、从每个侧缘横向延伸的一对引脚、连接所述引脚和衬垫的导体以及用以容纳晶体振荡器的窗孔，所述晶体振荡器衬垫位于所述引脚框的一底缘附近，所述集成电路晶片衬垫和片状电容器衬垫位于所述晶体振荡器窗孔与所述引脚框的一侧缘之间;
在每个所述引脚框的窗孔内大体上沿纵向放置一个通常呈圆柱形的晶体振荡器，每个所述晶体振荡器具有从其底面伸出的一对纵向延伸的引脚;
将每个所述晶体振荡器的引脚连接到相应引脚框上的晶体振荡器衬垫上;
将集成电路连接到每个引脚框的集成电路晶片衬垫上，每个所述集成电路均具有多个电引线;
将每个集成电路的引线连接到有关引脚框上的所述导体上;
将片状电容器连接到每个引脚框的片状电容器衬垫上;
通过连续自动模压工序对上述所有电路元件进行树脂封装，沿所述薄带形成各个独立的时钟振荡器组件，树脂是通过位于所述引脚框的另一侧缘上靠近所述一底缘的横向延伸的槽注入的;
从所述薄带上分离所述的各个单独的时钟振荡器组件;以及
将每个引脚框的各引脚成型为一种J型构造。
4、如权利要求3所述的方法，其特征在于，所述每个引脚框进一步包括连接到所述晶体振荡器每个引脚上的片状电阻器衬垫，所述电阻器衬垫设置在所述晶体振荡器窗孔与所述引脚框的一侧缘之间，所述方法进一步包括如下步骤：
将片状电阻器连接到每个引脚框的电阻器衬垫上;以及，
对所述电阻器连同以上所述电路元件进行树脂封装。
CN93105339A 1992-09-01 1993-04-30 表面可安装的时钟振荡器组件以及制造该组件的方法 Pending CN1083626A (zh)

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