CN1079169C - 半导体芯片封装件的制造方法 - Google Patents

半导体芯片封装件的制造方法 Download PDF

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CN1079169C
CN1079169C CN96111255A CN96111255A CN1079169C CN 1079169 C CN1079169 C CN 1079169C CN 96111255 A CN96111255 A CN 96111255A CN 96111255 A CN96111255 A CN 96111255A CN 1079169 C CN1079169 C CN 1079169C
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lead frame
lead
chip
wire
laying
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CN1150328A (zh
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沈成珉
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Samsung Electronics Co Ltd
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Abstract

半导体芯片封装件的制法，包括：制备好有相对设置的侧轨且其上有通孔的引线框，框中有安装芯片的模垫，一对引线排以及系条；将树脂化合物充填到引线之间固化成挡条；将芯片装于摸垫上并与引线电连；密封芯片、模垫、挡条、一部分引线以及一部分用来连接模垫与侧轨的系条，而形成一仍然装在引线框上的封装体；从引线框上除去系条，分离出各封装体；最后使从上述封装件上延伸出的引线具有适当的弯曲形状。

Description

半导体芯片封装件的制造方法
本发明一般地说涉及到半导体芯片封装件的制造方法，具体地说涉及到采用具有树脂挡条的引线框来制造半导体芯片封装件的方法。
图1是具有挡条的常规引线框的透视图；图2示明芯片接合到引线框上的情形。参看图1与图2，常规的引线框100包括：一对相对设置的侧轨60；上面将安装芯片(未示明)的模垫(diepad)20；用来使上述模垫相对上述侧轨作机械与整体连接的系条50；一对引线排30；每一引线排都布置成与模垫20的侧边分开一定距离；以及挡条40，它们沿垂直方向跨过这些引线排并同侧轨整体连接。
更详细地说，有一对相对设置的侧轨60，在各条侧轨的相对应的一些部位上有规则地形成一批通孔62。当引线框100在半导体芯片封装线中移动时，侧轨60则与具有一批突起的轨道(未示明)接触。也就是说，上述轨道的突起是配合到侧轨60的各相应通孔62之内。因而当所述轨道移动时，引线框100也移动。
模垫20形成于对峙的两条侧轨60之间，通过系条50与侧轨60整体连接。
有一对引线排30按平行的形式形成，在模垫20的各侧附近各设置一个引线排。引线30将同安装在模垫20上的芯片电连接。厚度与引线相同的挡条40沿垂直方向按跨过这些引线排30的形式形成。挡条40起到阻挡模制的树脂化合物在模制过程中的溢料的阻挡件作用。引线30是镀钯或镀镍的，保护其免受外部环境影响。
图3表明芯片对引线框的电连接；图4表明带有模制芯片的引线框。参看图3与4，芯片10用Ag-环氧树脂粘合剂粘合到模垫20上。芯片10通过将芯片10表面上的键合块12连接到各相应引线30上的键合线80而同引线30电连。
芯片10、模垫20、键合线80，以及系条50的和引线30的与模垫20相邻接的部分，都用模制化合物密封而形成封装体90。引线30包括在封装体90之内的内引线以及从封装体90延伸出的外引线34。
模制过程中，在各相邻外引线34间的空隙处，于封装体90的表面形成有溢料92。
图5表明图4中的引线框切除挡条后的情形；图6表明图4中的引线框除去溢料(修边工序)后的情形。参看图5与图6，载有模制封装体的引线框用挡条剥除器处理，除去各引线30间以及侧轨与其相邻线间形成的挡条40，使得引线30能与侧轨60分开。除去挡条40后，在原先与挡条40接触的引线30的表面区34a处会形成毛剌。在毛剌处，钯或镍的镀层剥离，引线暴露向外部环境，使最终的半导体芯片封装件受到侵蚀，降低了它的可靠性。为了避免出现这一问题，应进行镀层处理给引线镀金属(重镀工序)，结果将加大生产成本同时降低生产率。
由于模制过程会在封装体90的外表面上相邻外引线间空隙处遗留溢料92，封装体90就不会具有光滑或均匀的表面。因此，应该用例如化学处理除去封装本90上的溢料使其能通过目检。
图7示明图4中的引线框经重镀后的情形；图8是沿图7的8-8线截取的纵剖图；图9示明从图7的引线框上分离下各芯片封装件；而图10示明形成有外引线的各芯片封装件。参看图7至10，封装体在除去溢料92后接受镀层处理，由钯或镍的第二次镀层34c覆盖外引线34(重镀工序)。
外引线34更详细地说是由铜34a制成，表面上有第一次钯或镍镀层34b。但在除去挡条工序中，第一次镀层34b会在装附挡条的区域剥离(形成毛剌)，而应在这些区域上形成第二次镀层34c(重镀工序)。这道重镀工序可以但不限于用电镀方法进行，其中将待镀层的引线框浸入含钯或镍的镀浴中，然后通电。标号34’在图7至图11中指已重镀的引线。
第二次镀层34c还有助于将封装件便利地电连到例如印刷电路板(未示明)一类的外部电子设备上。
然后用切除装置(未示明)除去系条50，给出各个封装件200。再使各个封装件200经成形处理，将外引线34弯曲成可安装到外部电子零部件例如印刷电路板上的合适形状。在这一实施例中，引线框形成鸥翼形。
图11是沿图10中的11-11线截取的纵剖图。参看图11，在这种常规的半导体芯片200的结构中，芯片10是用Ag-环氧树脂粘合剂70粘附于模垫20的上表面上。芯片10通过连接着芯片10上各键合块12以及相应的内引线32的键合线80，在两端与内引线32电连。
芯片10、模垫20、键合线80以及系条50的和引线30的与模垫20相邻接的部分，都用模制化合物密封，形成封装体200。引线30包括嵌入封装体200中的内引线32和从封装体200延伸出的外引线34。
上述制造半导体封装芯片的方法存在以下缺点：
(1)要用化学方法或其它方法来除去溢料。半导体制造业已发展到要提供更紧的、更轻量和更薄的封装件。当前的环保趋势也已成为各种工业包括半导体工业中的一个重要因素。用化学方法来除去溢料可能引起环境污染问题。
此外，任何用来除去溢料的方法都将留下污染物质。
(2)由于在上述的除去挡条的工序中会使外引线在与挡条结合部分处剥露，外引线就应重镀以钯或镍。
为了解决与上述常规的无挡条引线框相关的种种问题，提出了另一种常规的无挡条引线框。图12是示明这另一种无挡条的常规引线框的透视图。参看图12，引线框300包括：一对相对设置的侧轨260；上面将安装芯片(未示明)的模垫220；一对引线排230，它们隔一定距离分设于模垫220的两侧；以及用来使上述模垫相对上述侧轨作机械与整体连接的系条250。
更细致地说，有一对相对设置的侧轨260，在它们的上表面上按规则的间隔形成有一批通孔262。当引线框300在半导体芯片封装线中移动时，侧轨260则与具有一批突起的轨道(未示明)接触。这就是说，上述轨道的突起是配合到侧轨260的各相应通孔262之内。因而当所述轨道运动时，引线框300也移动。
模垫220形成于对峙的两条侧轨之间，通过系条250与侧轨260整体连接。
形成有一对相平行的引线排230，而在模垫220的两侧分隔一定距离各设置一引线排。引线230将同安装于模垫220上的芯片电连接。引线230通过系条250以机械方式与侧轨260连成整体。引线230的一端面对模垫220而另一端与系条250作普通连接。引线230经钯或镍镀层，保护其不受外部影响。
图13表明将芯片结合到模垫上的情形；图14表明芯片对引线框的电连；图15表明带有模制芯片的引线框。参看图13至图15，芯片210是用Ag-环氧树脂粘合剂270粘合到模垫220之上。芯片210是通过将芯片210上的键合块212连接到各相应引线230上的键合线280而与引线230电连接的。
芯片210、模垫220、键合线280以及系条250的与引线230的同模垫220相邻接的部分，都由模制化合物密封而形成封装体290。引线230包括在封装体290内的内引线以及从封装体290延伸出的外引线234。
模制过程中，在各相邻外引线234间的空隙，于封装体290的表面上形成有溢料292。
图16示明图15的引线框在修边工序后的情形；图17示明从引线框上分离下各芯片封装件；图18示明形成有外引线的各芯片封装件。参看图16至图18，由于模制过程会在相邻外引线234间空隙处于封装体290的外表面上遗留大量的溢料292，封装体290就不会具有光滑或均匀的表面。因此，应该用例如化学处理来除去封装体290上的溢料292，使其能通过目检。
然后用切除装置(未示明)除去系条250，给出各个封装件400。再使各个封装件400经成形处理，将外引线234弯曲成可安装到外部电子零部件例如印刷电路板上的合适形状。在这一实施例中，引线框形成鸥翼形。
图19是沿图18中19-19线截取的纵剖图。参看图19，在这种常规的半导体芯片封装件400的结构中，芯片210是用Ag-环氧树脂粘合剂270粘附于模垫220的上表面上。芯片210通过连接着芯片210上各键合块2 12以及各相应的内引线232的键合线280，在两端与内引线232电连。
芯片210、模垫220、键合线280、系条250的一部分以及内引线232，都由模制化合物密封，形成封装体290。引线230包括嵌入封装体290内的内引线232和由封装体290延伸出的外引线234。
上述的使用无挡条引线框来制造封装件的方法避免了前一方法的缺点。但是这种方法仍然存在模制过程中会形成大量溢料的问题。这就是说，要用化学方法或其它方法来除去溢料，结果就成了一个较重的污染环境的问题。
采用精心设计的模制装置可在某种程度上避免形成大量溢料。但这将加大生产成本。
为此，需要提供一种简便和价廉的方法来制造半导体芯片封装件而不污染环境。
这样，本发明的目的便在于提供这样一种制造半导体芯片封装件的方法，它包括下述各步骤：
(a)制备引线框，它包括一对相对设置的侧轨，各侧轨的上表面上有一批通孔；上面将安装芯片的模垫；一对引线排，各排依一定距离分设于模垫的两侧；以及用来使模垫与侧轨作机械与整体连接的系条；
(b)将树脂化合物充填到引线之间，固化此树脂化合物制成挡条，
(c)将所述芯片装附于所述模垫的上表面上，使所述芯片与引线电连；
(d)密封所述的芯片、模垫、挡条、一部分所述引线以及一部分所述系条，形成仍然装附在上述引线框上的封装体；
(e)从引线框上除去系条，分离出各封装件；以及
(f)使从上述封装件上延伸出的引线具有适当的弯曲形状。
参看下面结合附图所做的详细说明，将可迅速地理解本发明上述的和其它各方面的特点与优点，其中以相同的标号指相同的结构元件，在附图中：
图1是具有常规的挡条的引线框的透视图；
图2示明芯片到引线框上的结合；
图3示明芯片对引线框的电连；
图4示明带有模制芯片的引线框；
图5示明图4中的引线框经除去挡条后的情形；
图6示明图4中的引线框经修边工序后的情形；
图7示明图4中的引线框经重镀工序后的情形；
图8是沿图7中8-8线截取的纵剖图；
图9示明从图7中的引线框分离下各芯片；
图10示明形成有外引线的各芯片封装件；
图11示明沿图10中11-11线截取的纵剖图；
图12是常规的无挡条引线框的透视图；
图13示明芯片到引线框上的结合；
图14示明芯片对引线框的电连；
图15示明带有模制芯片的引线框；
图16示明图15中的引线框经修边工序后的情形；
图17示明从引线框上分离下各芯片封装件；
图18示明形成有外引线的各芯片封装件；
图19是沿图18中19-19线截取的纵剖图；
图20示明将引线框与型板叠置于定位架上；
图21示明形成用于无挡条引线框的一个液体挡条；
图22示明形成用于无挡条引线框的一些液体挡条；
图23示明从定位架上分离下带液体挡条的引线框；
图24示明形成用于引线框的树脂挡条；
图25示明芯片粘合到图24的引线框上；
图26示明芯片对图25中引线框的电连；
图27示明带有模制芯片的引线框；
图28示明从引线框上分离下各芯片封装件；
图29示明形成有外引线的各芯片封装件；
图30是沿图29中30-30线截取的纵剖图；而
图31是沿图29中31-31线截取的纵剖图。
下面对照附图更详细地阐述本发明。
图20示明引线框与型板在本发明方法中所用定位架上的叠置状态；图21示明在引线间形成液体挡体。参看图20与21，用来制造本发明的引线框的定位架包括一批用来安放引线框500的安放部720、用来使这批安放部720相互分开的隔墙740，以及形成于固定架700的四个边上的壁部760。
更详细地说，安放部720是用来安放引线框500的，每个安放部安置一个引线框且在可与引线框500的侧轨460中通孔462对准的各部位上有突起722。隔墙740使两个相邻的安放部720彼此分开。壁部760的上表面上有导销762而壁部本身则可用作定位架700的骨架。安放部720、隔墙740与壁部760结合成整体。安放部720的内表面涂覆有不含与液体树脂化合物粘合的材料。这种液体树脂化合物对引线框500会比对定位框700有更强的粘合力。
型板600包括：壁件660，它上面设有一批与定位架700的壁部760上形成的各个导销762分别对应的导孔662；印刷部620，它在要于安放部720中引线框500的引线430之间形成树脂挡条处有很多孔622。下面说明形成挡条处的位置。壁件660具有较印刷部620高的高度。对于安放部720、隔墙740以及安放部720的突起722，它们的高度等于将放到安放部720中的引线框500的引线高度(厚度)。定位架700的突起722的高度小于引线框500中引线的高度(厚度)，使得引线框500的上表面能同型板600的下表面完全接触，这样便确保能形成稳定的固体树脂挡条440。
下面将从底部开始依次说明叠置的定位架700、引线框500与型板600。首先备好定位架700。将引线框500放置到各相应的安放部720中，这时的引线框500上的通孔462要同安放部720上各相应突起722对准。
然后将型板600放到配合在安放部720中的引线框500上，并使它的导孔662与定位架700上的各相应导销762对准。这样，型板600上的孔622便会自动地与引线框上要形成树脂挡条的部位对准。
图21示明引线框的液体树脂挡条的形成过程。参看图21，液体树脂化合物640放置于印刷部620上且覆盖住它的上表面。这种液体树脂化合物640可以包括但不限于聚酰亚胺化合物。然后用加压装置例如辊或板对印刷部620加压，使树脂化合物640能通过孔622进入到将形成挡条440处的各引线之间的空隙内。型板600的壁件660阻止了树脂化合物640会填到导孔662内。树脂化合物640充填着置于安放部720中引线框内引线间的空隙，这种空隙与型板600的孔622相对应。
图22示明具有液体挡条的引线框，此引线框放在用来形成液体挡条的定位架上；图23示明从定位架上分离下引线框；图24示明带有液体挡条的引线框。参看图22至图24，在树脂挡条440业已形成在引线框500a中引线间的空隙内后，将型板600从定位框700上卸下。然后将引线框500a与定位框700一起转送到热固设备(未示明)中，使树脂挡条440固化。固化后从定位架700上卸下各引线框500a。
带有树脂挡条440的引线框500a取下述结构：设有一对相对峙的侧轨460；在这对侧轨460之间设有上面将安装芯片的模垫420；在模垫420的两侧隔一定距离各设一排的一对引线排430；使模垫420与侧轨460作机械与整体连接的系条；以及在各引线430间空隙处设置的挡条440。
上述这对侧轨460的两条轨相对设置，上面按规则的间隔形成有一批通孔462。侧轨460当引线框500在半导体芯片封装线内移送时同具有许多突起的轨道(未示明)作机械接触。这就是说，上述轨道的突起是配合到侧轨460的各相应通孔462之内。这样，当轨道运动时，引线框500也因此移动。
对于本发明的引线框500a，它与图1所示的常规引线框100不同，在侧轨460及其相邻引线430间没有形成树脂挡条，这是因为树脂挡条440并未从引线框500a上除去而是保留在最终的半导体封装件中。
模垫420形成于相对设置的侧轨460之间并通过系条450与侧轨460作机械与整体连接。
在模垫420的两侧，隔一定距离平行地形成有一对引线排430。引线排430中的引线将同安装于模垫420上的芯片电连，同时通过系条450与侧轨460作机械的、普通的整体连接。引线430以其一端面向模垫的一侧而以其另一端与系条450作一般连接。
图26表明芯片对引线框的电连。现来参看图26，芯片410是用银-环氧树脂粘合剂(未示明)粘附到模垫420之上。芯片410通过使键合块412连接到各相应引线430上的键合线480与引线430电连。
图27示明带有模制芯片的引线框；图28示明从引线框上分离下的各封装件。参看图27和28，芯片410、模垫420、键合线480、挡条440以及与模垫420邻接一部分系条450和一部分引线430，都用模制化合物密封而形成封装体490。引线430包括在封装体490内的内引线(未示明)和从封装体490延伸出的外引线434。
在模制过程中，由于挡条存在于封装体490之内，而其一端又共面地暴露于封装体490之外，故不会有溢料形成于封装体490之外的各相邻引线434之间的空隙处。为此目的，设置挡条时是使它的一端在模制过程中与模制设备夹持住的引线上的部位(模制线)重合。
然后由切除装置(未示明)除去系条450，给出各封装体490。再使各封装体接受成形处理，使最终的半导体芯片封装件900的外引线434弯曲成能安装到外部的电子零部件例如印刷线路板上。在此实施例中，引线框呈鸥翼形。
图30与31分别是沿图29中30-30线与31-31线截取的纵剖图。参看图30与31，在本发明的半导体芯片封装件900的结构中，芯片410是用Ag-环氧树脂粘合剂470粘附到模垫420的上表面上。芯片410通过连接到各键合块412与各相应的内引线432在两端与内引线432电连。
芯片410、模垫420、键合线480、挡条440以及系条250的一部分与内引线432，都用模制化合物密封而给出一封装体490(图29)。引线430包括嵌入封装体490内的内引线432以及从封装体490延伸出的外引线。此外，挡条440有一端露在与封装体490表面共面的平面内。
根据本发明的上述方法，可以获得以下优点：
(1)不需要除去溢料的工序(修边工序)。这是因为挡条是存在于封装体内，而它有一端以与封装体表面共面形成暴露于封装体外，故在模制过程中不会形成溢料。相反，在图1至图11中所示常规的封装件中，模制线存在于模垫与挡条之间，以致在封装体的外表面上引线间空隙处会形成溢料。至于图12至图22所示其它的常规封装件，由于没有形成挡条，故会有相当大量的溢料形成在封装体的外表面上引线间空隙处。
(2)不需对外引线进行重镀。由于挡条是在封装体内，不需除去挡条。
至此已然说明了采用型板在引线间制备树脂挡条的本发明的具体实施例，但应认识到，任何装置或方法只要能把液体树脂化合物注入到将要形成挡条的部位上都是可以采用的。
依据本发明，是把挡条形成在将被嵌入封装体内并同模制设备中模制线重合的部位上，这样就可省除修边、除去挡条与重镀等工序。于是可以简化制备过程、节省生产费用和防止因修边和/或重镀致环境污染。
此外，利用液体树脂化合物与型板来形成挡条可以减少生产时间与费用。
上面虽已详述了本发明的最佳实施例，但应清楚地认识到，这里给出的有创造性的基本思想，是可以使内行的人对此提出多种变更形式和/或改进形式的，而这些仍应属于后附权利要求书所规定的本发明的精神与管辖范围内。

Claims (8)

1.制造半导体芯片封装件的方法，它包括下述步骤：
(a)制备引线框，它包括：一对相对设置的侧轨，各侧轨的上表面上有一批通孔；上面将安装芯片的模垫；一对引线排，各排依一定距离分设于模垫的两侧；以及用来使所述模垫与所述侧轨作机械与整体连接的系条；
(b)将树脂化合物充填到所述引线之间，固化此树脂化合物制成档条；
(c)将所述芯片装附于所述模垫的上表面上，使所述芯片与引线电连；
(d)密封所述的芯片、模垫、挡条、一部分所述引线以及一部分所述系条，形成仍然装附在上述引线框上的封装体；
(e)从所述引线框上除去系条，分离出各封装件；以及
(f)使从上述封装件上延伸出的上述引线具有适当的弯曲形状，
其中，前述步骤(b)又包括下述步骤：
(b-1)准备好一种定位架，它包括：多个用来安放所述引线的安放部，用来使这些安放部相互分开的隔墙，以及形成在此定位架的四个边上的壁部；同时准备好一种型板，它包括：若干壁件，壁件上设有多个与上述定位架的壁部上形成的各导销相对应的导孔，以及若干印刷部，它有多个孔，位于要在所述安放部中放置的前述引线框的引线间形成树脂挡条的部位上；
(b-2)通过将所述引线框上的所述通孔配合到安放部上设置的突起上，将所述引线框放置到相应安放部中；
(b-3)将所述型板放到前述引线框上，通过使此型板的所述导孔配合到定位架的所述导销上，将型板固定到所述定位架上；
(b-4)将液体树脂化合物充填到上述型板的印刷部上，用加压装置对型板加压，使树脂化合物能穿过所述印刷部上的一批孔而进入所述引线框的引线之间；
(b-5)卸下所述型板与加压装置；
(b-6)使所述树脂化合物固化形成档条；与
(b-7)从所述引线框上卸下所述定位架。
2.如权利要求1所述方法，特征在于：所述安放部的上表面同所述引线框的下表面接触。
3.如权利要求1所述方法，特征在于：置放在各相应安放部中的引线框的上表面同所述型板的下表面接触。
4.如权利要求1所述方法，特征在于：所述液体树脂化合物是充填到所述安放部的底部上，充填到引线框的空隙内、充填到所述印刷部的下表面上的。
5.如权利要求2所述方法，特征在于：所述液体树脂化合物是充填到所述安放部的底部上，充填到引线框的空隙内、充填到所述印刷部的下表面上的。
6.如权利要求3所述方法，特征在于：所述液体树脂化合物是充填到所述安放部的底部上，充填到引线框的空隙内、充填到所述印刷部的下表面上的。
7.如权利要求1所述方法，特征在于：所述挡条是嵌入到所述封装体内并以其一端暴露在所述封装体外且与此封装体表面在同一平面之内。
8.如权利要求1所述方法，特征在于：所述挡条形成的厚度与所述引线框中的引线厚度相同。
CN96111255A 1995-08-30 1996-08-30 半导体芯片封装件的制造方法 Expired - Fee Related CN1079169C (zh)

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