CN1076253C - Chemical and mechanical grinding cushion - Google Patents
Chemical and mechanical grinding cushion Download PDFInfo
- Publication number
- CN1076253C CN1076253C CN98123446A CN98123446A CN1076253C CN 1076253 C CN1076253 C CN 1076253C CN 98123446 A CN98123446 A CN 98123446A CN 98123446 A CN98123446 A CN 98123446A CN 1076253 C CN1076253 C CN 1076253C
- Authority
- CN
- China
- Prior art keywords
- grinding pad
- grinding
- life
- main body
- span
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The present invention relates to a chemical mechanical grinding pad. The service life of the grinding pad can be displayed. The grinding pad has a grinding surface and a multilayer color indicating layer which is embedded in the grinding surface by dyeing or pressing. Colors of various layers are different. Depths of the layers to the surface are different. The abrasion degree of the grinding pad is indicated by color change of the layers. The color layer can be formed by means that the grinding pad is dyed, or the color layer is made of material with the similar nature. The size of the color layer is made to the degree that the color layer can be identified by naked eyes, and the number of the color layer is not limited. The color layers can be positioned on the same position or different top view positions. The multilayer color indicating layer can also be replaced by an indicator color strip which is made of an oxidizing / reducing indicator or an acid-base indicator.
Description
(grinding pad (Polishing pad) of Chemical Mechanical Polishing-CMP) particularly relates to and a kind ofly has a self-life-span and show the grinding pad of (lifetime self-indicated) ability to the present invention relates to a kind of cmp.
In semiconductor fabrication process, having an even surface is to handle an important technology of high density photoetching, because of the flat surfaces that does not have high low head just can be avoided the scattering that exposes, and reaches accurate design transfer (pattern transfer).Planarization mainly contains spin-on glasses method (two kinds of Spin-On Glass-SOG) and chemical mechanical milling methods (CMP) etc., but enter deep-sub-micrometer (sub-half-micron) afterwards in the semiconductor fabrication process technology, the spin-on glasses method can't satisfy required flatness, so after semiconductor fabrication process enters the deep-sub-micrometer field, the cmp technology is uniquely can provide super large-scale integration (Very-Large Scale Intergration-VLSI) now, even great scale integrated circuit (manufacture craft of Ultra-Large Scale Integration-ULSI), a kind of technology of " comprehensive planarization (globalplanarization) ".
But the shortcoming of existing work-table of chemicomechanical grinding mill is: grinding pad is a kind of main consumable material.Usually grinding pad is in that live through must replacing after grinding hundreds of times.But because the manufacture craft condition difference during each the grinding, add on the workmanship of grinding pad own also variant, so be difficult to judge the terminal point in service life of a grinding pad.And, existing at present the degree of wear and end of life and none cover objective assessment mode about grinding pad.Generally all be abrasive sheet number, or utilize the time length of grinding, determine whether to change grinding pad with accumulation.But this kind mode can not be grasped the degree of wear and the end of life of grinding pad really too in coarse, so to the quality control of product adverse influence will be arranged.Especially to the research institution of experimental nature, or the wafer foundries, the variation of manufacture craft condition is inevitable, and therefore objectively grasps the degree of wear and the end of life of grinding pad, and being needs the problem that solves at present.
The object of the present invention is to provide a kind of chemical and mechanical grinding cushion that can show in oneself's life-span, use the grinding pad structure of Improvement type, can be when grinding, demonstrate the degree of wear of grinding pad itself, and possesses the ability of the end of life of demonstration own, not only helpful for improving the manufacture craft quality, and can prolong the maximum life of grinding pad, to save cost.
The object of the present invention is achieved like this, and a kind of chemical and mechanical grinding cushion promptly is provided, and can oneself's life-span show that this structure comprises: a grinding pad main body, and this grinding pad main body is a disc-shaped structure, and this grinding pad main body has a surface; An and multilayered color-forming marker, be embedded in this surface of this grinding pad main body, this multilayered color-forming marker in this subsurface degree of depth greater than a fixed thickness, this fixed thickness is less than the thickness of this grinding pad main body, and this multilayered color-forming marker comprises a plurality of color layers, the color of this each color layers is all inequality, and also inequality apart from this surperficial degree of depth.
The present invention also provides a kind of chemical and mechanical grinding cushion, can oneself's life-span show that this structure comprises: a grinding pad main body, and this grinding pad main body is a disc-shaped structure, and this grinding pad main body has a surface; An and multilayer indicator vitta, be located in the surface that this oneself life-span shows grinding pad, this multilayer indicator vitta comprises a plurality of indicator vittas, the degree of depth of this each indicator vitta is all inequality, and can react when running into this lapping liquid and present different colors, one of them the degree of depth of this each indicator vitta is about this constant depth.
The present invention also provides a kind of chemical and mechanical grinding cushion, can oneself's life-span show that this structure comprises: a grinding pad main body, and this grinding pad main body is a disc-shaped structure, and this grinding pad main body has a surface; And a plurality of indicator vittas, this each indicator vitta is all inequality in this subsurface degree of depth, and can react when running into a lapping liquid and present different colors, and this each indicator vitta is about a constant depth in this subsurface degree of depth.
The present invention also provides a kind of chemical and mechanical grinding cushion, can oneself's life-span show that this structure comprises: a grinding pad main body, this grinding pad main body are the belt composition of an annular, and this grinding pad main body has an outer surface; An and multilayered color-forming marker, be embedded in this outer surface of this grinding pad main body, the degree of depth of this multilayered color-forming marker under this outer surface is greater than a fixed thickness, this fixed thickness is less than the thickness of this grinding pad main body, and this multilayered color-forming marker comprises a plurality of color layers, the color of this each color layers is all inequality, and also inequality apart from this surperficial degree of depth.
The present invention also provides a kind of above-mentioned chemical mechanical grinder with multilayered color-forming marker grinding pad that adopts, and comprising: a grinding table, rotate with a fixed-direction; One oneself's life-span showed grinding pad, was located on this grinding table, in order to demonstrating the degree of wear of this grinding pad itself, and possessed the ability of the end of life of this grinding pad of demonstration own; One wafer places this oneself life-span to show on the grinding pad, and this wafer has a back side and a front, and the front of this wafer shows that with this oneself's life-span grinding pad contacts; And a pipe fitting, place this oneself life-span to show the grinding pad top, this pipe fitting shows on the grinding pad in order to carry a lapping liquid to this oneself's life-span.
The present invention also provides a kind of above-mentioned chemical mechanical grinder with multilayer indicator vitta grinding pad that adopts, and comprising: a grinding table, rotate with a fixed-direction; One oneself's life-span showed grinding pad, was located on this grinding table, in order to demonstrating the degree of wear of this grinding pad itself, and possessed the ability of the end of life of this grinding pad of demonstration own; One wafer places this oneself life-span to show on the grinding pad, and this wafer has a back side and a front, and the front of this wafer shows that with this oneself's life-span grinding pad contacts; And a pipe fitting, place this oneself life-span to show the grinding pad top, this pipe fitting shows on the grinding pad in order to carry a lapping liquid to this oneself's life-span.
Characteristics of the present invention are oneself's life-span demonstration grinding pad, and its structure comprises grinding pad main body and multilayered color-forming marker.Wherein, the grinding pad main body has a lapped face, and the multilayered color-forming marker then is to be embedded in this surface by dyeing or pressing.This multilayered color-forming marker has a fixed thickness, for example between 20-500 μ m, these color layers are the color difference not only, and the degree of depth apart from the surface is also inequality, when grinding, will reveal gradually, can be used to indicate the degree of wear and the end of life of grinding pad main body by these change color because of wearing and tearing make different colors.Its material can be got or the close material manufacturing of do as one likes matter by grinding pad material dyeing itself, so unlikely generation changes to manufacture craft.Its shape is not limited to circle, also can be one or more annulars.Its size is not limited to identical with the diameter or the width of grinding pad as long as can clearly distinguish with interior eye.When its size during much smaller than the grinding pad diameter, its number can be not limited to one, and its position can be arranged in the same head-down position of grinding pad main body, also can lay respectively at the different head-down positions in the grinding pad main body.Above-mentioned multilayered color-forming marker also can replace by the indicator vitta, and the indicator vitta is positioned on the surface of grinding pad main body, and its material can be oxidation/reduction indicator or acid-base indicator.
Below in conjunction with accompanying drawing, describe embodiments of the invention in detail, wherein:
Figure 1A is the existing integrally-built vertical view of a kind of work-table of chemicomechanical grinding mill;
Figure 1B is the existing integrally-built side view of a kind of work-table of chemicomechanical grinding mill;
Fig. 2 A is first preferred embodiment of the present invention, a kind of stereogram that can show chemical and mechanical grinding cushion oneself's life-span;
Fig. 2 B a kind ofly can show the local structure for amplifying schematic diagram of chemical and mechanical grinding cushion oneself's life-span for illustrating according to Fig. 2 A;
Fig. 2 C is for illustrating the stereogram that another kind can show chemical and mechanical grinding cushion oneself's life-span according to Fig. 2 A;
Fig. 3 A is second preferred embodiment of the present invention, a kind of stereogram that can show chemical and mechanical grinding cushion oneself's life-span;
Fig. 3 B a kind ofly can show the local structure for amplifying schematic diagram of chemical and mechanical grinding cushion oneself's life-span for illustrating according to Fig. 3 A;
Fig. 4 is the 3rd preferred embodiment of the present invention, a kind of stereogram that can show chemical and mechanical grinding cushion oneself's life-span;
Fig. 5 is the 4th preferred embodiment of the present invention, a kind of stereogram that can show chemical and mechanical grinding cushion oneself's life-span;
Fig. 6 is the 5th preferred embodiment of the present invention, a kind of stereogram that can show chemical and mechanical grinding cushion oneself's life-span;
Fig. 7 A and Fig. 7 B, it illustrates overlooking and stereogram of another kind of existing work-table of chemicomechanical grinding mill respectively;
Fig. 8 A is the 6th preferred embodiment of the present invention, a kind of stereogram that can show chemical and mechanical grinding cushion oneself's life-span that is used for Fig. 7 board;
Fig. 8 B a kind ofly can show the local structure for amplifying schematic diagram of chemical and mechanical grinding cushion oneself's life-span for illustrating according to Fig. 8 A;
Fig. 9 A is the 7th preferred embodiment of the present invention, a kind of stereogram that can show chemical and mechanical grinding cushion oneself's life-span that is used for Fig. 7 board;
Fig. 9 B can show the local structure for amplifying schematic diagram of chemical and mechanical grinding cushion oneself's life-span for one kind for illustrating according to Fig. 9 A.
Please be simultaneously with reference to Figure 1A and Figure 1B, it illustrates overlooking of a kind of existing work-table of chemicomechanical grinding mill and side view respectively.Comprising: a grinding table 10 (polishing table); One lever 11 (holder) is in order to catch polished wafer 12; One grinding pad 13 (polishing pad) is layered on the grinding table 10; One pipe fitting 14 (tube) is in order to carry lapping liquid 15 (slurry) to grinding pad 13; And a liquid pump 16, in order to lapping liquid 15 is pumped in the pipe fitting 14.When carrying out cmp, grinding table 10 and lever 11 be respectively along certain direction rotation, and shown in arrow 17a and 17b among the figure, and lever 11 catches the back side 18 of wafer 12, and the front 19 of wafer 12 is pressed on the grinding pad 13.The lapping liquid 15 that pipe fitting 14 is called in liquid pump 16 is fed on the grinding pad 13 continuously.So, the cmp program is exactly the chemical reagent that utilizes in the lapping liquid 15, on the front 19 of wafer 12, produce chemical reaction, make it to form an easy grinding layer, cooperate again wafer 12 on grinding pad 13 by the auxiliary mechanical lapping of the abrasive grains in the lapping liquid 15 (abrasive particles), the projection of easy grinding layer is ground, and above-mentioned chemical reaction of repetitiousness and mechanical lapping can form smooth surface.Basically, the cmp technology is to utilize the principle of machine glazed finish, cooperates suitable chemical reagent (reagent) and abrasive grains, the profile that the surface is is just risen and fallen and differs, the planarization that in addition " polishes " in the lump.
Please refer to Fig. 2 A, it illustrates first preferred embodiment of the present invention, the stereogram of grinding pad in a kind of work-table of chemicomechanical grinding mill.Again simultaneously with reference to Fig. 2 B, it illustrates is stereogram according to the local structure for amplifying 24 of Fig. 2 A.Wherein, oneself's life-span shows grinding pad 20, and it comprises grinding pad main body 21 and multilayered color-forming marker 22.Grinding pad main body 21 preferably is discoid structure, and it has surface 23.As for multilayered color-forming marker 22, then be embedded in the surface 23 of grinding pad main body 21 by pressing, its material is identical with grinding pad 20, the degree of depth " L " of multilayered color-forming marker 22 under surface 23 is about a fixed thickness usually, this fixed thickness is less than the thickness of grinding pad main body 21, it forms the degree of general existing grinding pad loss, and this thickness is between 20-500 μ m usually.Multilayered color-forming marker 22 comprises color layers 22a, 22b, 22c and 22d, and shown in Fig. 2 B, the color of these color layers is all inequality, and the degree of depth is also inequality.The shape of multilayered color-forming marker 22 is not limited to disc, also can be one or more annulars, shown in Fig. 2 C.And this multilayered color-forming layer also can change the solid color layer into, under the surface between the 20-500 μ m.
Please refer to Fig. 3 A, it is second preferred embodiment of the present invention, the stereogram of grinding pad in a kind of work-table of chemicomechanical grinding mill.Simultaneously with reference to Fig. 3 B, it illustrates the stereogram according to the local structure for amplifying 34 of Fig. 3 A again.Wherein, oneself's life-span shows grinding pad 30, and it comprises grinding pad main body 31 and a plurality of multilayered color-forming marker 32.Grinding pad main body 31 preferably is discoid structure, and it has a surface 33.
When this multilayered color-forming marker size during also less than the grinding pad diameter, its shape is near strip, and as shown in Figure 3A, its number can be not limited to one.As for multilayer vitta 32; then be embedded in the surface 33 of grinding pad main body 31 by pressing; its material is identical or close with grinding pad 30; the thickness of multilayer vitta 32 usually can be greater than a fixed thickness; this fixed thickness is less than the thickness of grinding pad main body 31; it is the extent of deterioration of general existing grinding pad terminal life, and thickness is between 20-500 μ m.Multilayer vitta 32 comprises color layers 32a, 32b, 32c and 32d, shown in Fig. 3 B, and the color difference of these color layers, and also inequality apart from the degree of depth on surface.Wherein, multilayered color-forming marker 32 lays respectively at the different head-down positions in the grinding pad main body 31.In addition, the color layers of each multilayer vitta 32, for example 32a, 32b, 32c and 32d all are arranged in the same head-down position of grinding pad main body 31, as shown in Figure 3A.Its purpose is to show the degree of wear of grinding pad diverse location, thus, and can more accurate measurement and the end of life of judging grinding pad.
Please refer to Fig. 4, its illustrate is the 3rd preferred embodiment of the present invention, the stereogram of grinding pad in a kind of work-table of chemicomechanical grinding mill.Wherein, oneself's life-span shows grinding pad 40, and it comprises grinding pad main body 40 and indicator vitta 42.Grinding pad main body 40 preferably is a disc-shaped structure, and it has a surface 41.Indicator vitta 42, be located in the surface 41 of grinding pad main body 40, the degree of depth of indicator vitta 42 under grinding pad surface 41 is about a constant depth L usually, and it is the extent of deterioration of general existing grinding pad terminal life, and this constant depth L is between 20-500 μ m.And the material of indicator vitta 42 for example can be oxidation/reduction indicator or acid-base indicator.On the other hand, this is on the surface 44 of grinding pad main body 41 also can be provided with not only indicator vitta 42, places constant depth L but can be provided with a plurality of indicator vittas 42 (with reference to figure 6).These indicator vittas 42 lay respectively at the different head-down positions in the grinding pad main body 41.
Please refer to Fig. 5, it is the 4th preferred embodiment of the present invention, the stereogram of grinding pad in a kind of work-table of chemicomechanical grinding mill.Wherein, oneself's life-span shows grinding pad 50, and it comprises grinding pad main body 55 and multilayer indicator vitta, for example 51 or 52.Grinding pad main body 55 preferably is discoid structure, and it has a surface 54.Multilayer indicator vitta 51 is located in the surface 54 of grinding pad main body 55, and multilayer indicator vitta 51 comprises a plurality of indicator vittas, 51a for example, and 51b and 51c, multilayer indicator vitta 52 comprise a plurality of indicator vitta 52a, 52b and 52c.These indicator vittas 51a, can react when 51b or 51c etc. run into lapping liquid and present different colors each other, and the degree of depth is also different, for example the degree of depth of indicator vitta 51a is L1, the degree of depth of indicator vitta 51b is L2, and the degree of depth of indicator vitta 51c is L3.The Zui Da degree of depth is less than the thickness of grinding pad main body 55, for example between 20-500 μ m herein.Wherein, indicator vitta 51a, the material of 51b or 51c can be oxidation/reduction indicator, or be acid-base indicator.And the indicator vitta 51a of multilayer indicator vitta 51,51b can be arranged in grinding pad main body 55 identical head-down positions (as shown in Figure 5) with 51c, or also can lay respectively at the different head-down position (not shown)s in the grinding pad main body 55.The number of indicator vitta is not only one herein, also can form one or several annulars, shown in Fig. 5 B, multilayer indicator vitta 51 and 52 for example, its purpose is to show the degree of wear of grinding pad diverse location, thus, and can more accurate measurement and the end of life of judging grinding pad.
Please refer to Fig. 6, it illustrates the 5th preferred embodiment of the present invention, the stereogram of grinding pad in a kind of work-table of chemicomechanical grinding mill.Wherein, oneself's life-span shows grinding pad 60, and it comprises grinding pad main body 61 and a plurality of indicator vitta, for example 62a and 62b.Grinding pad main body 61 preferably is the figure disk-like structure, and it has a surface 64.Indicator vitta 62a and 62b, be located in the surface 64 of grinding pad main body 61, indicator vitta 62a can react when running into lapping liquid with 62b and present different colors each other, and the degree of depth is also different, for example the degree of depth of indicator vitta 62a is D1, and the degree of depth of indicator vitta 62b is D2.Indicator vitta 62a and 62b need only the degree of depth of one of them about a constant depth, and this constant depth is less than the thickness of grinding pad main body 61, for example between 20-500 μ m.And the material of indicator vitta 62a and 62b for example can be oxidation/reduction indicator or acid-base indicator.These indicator vittas 62a and 62b lay respectively at the different head-down positions in the grinding pad main body 61.The number of indicator vitta is not only one herein, and its purpose is to show the degree of wear of grinding pad diverse location, so can more accurate measurement and the end of life of judging grinding pad.
Please be simultaneously with reference to Fig. 7 A and Fig. 7 B, it illustrates overlooking and side view of another kind of existing work-table of chemicomechanical grinding mill respectively.Comprising: one grinds track 70 (polishing platen); One lever 71 is in order to catch by grinding wafers 72; One belt-type grinding pad 73 is layered on the track 70; One pipe fitting 74 is in order to carry lapping liquid 75 to grinding pad 73; And a liquid pump 76, in order to lapping liquid 75 is pumped in the pipe fitting 74.When carrying out cmp, grind track 70 and rotate along certain direction respectively with lever 71, shown in arrow 77a and 77b among the figure, and lever 71 is in order to be pressed in wafer 72 on the grinding pad 73.The lapping liquid 75 that pipe fitting 74 is called in liquid pump 76 is fed on the grinding pad 73 continuously.So, the cmp program is exactly the chemical reagent that utilizes in the lapping liquid 75, on wafer 72, produce chemical reaction, make it to form an easy grinding layer, the mechanical lapping that cooperates wafer 72 on grinding pad 73, to assist again by abrasive grains in the lapping liquid 75, the projection of easy grinding layer is ground, and above-mentioned chemical reaction of repetitiousness and mechanical lapping can form smooth surface.Basically, the cmp technology is to utilize the principle of machine glazed finish, cooperates suitable chemical reagent and abrasive grains, the profile that the surface is is just risen and fallen and differs, the planarization that in addition " polishes " in the lump.
Please refer to Fig. 8 A the 6th preferred embodiment of the present invention is shown, the stereogram of grinding pad in a kind of work-table of chemicomechanical grinding mill.Simultaneously with reference to Fig. 8 B, it illustrates the stereogram according to the local structure for amplifying 84 of Fig. 8 A again.Wherein, oneself's life-span shows grinding pad 80, and it comprises grinding pad surface 81 and multilayered color-forming marker 82.Grinding pad main body 81 preferably is the belt composition of annular.As for multilayered color-forming marker 82; then be to be embedded in the outer surface 81 of grinding pad main body 80 by dyeing or pressing; its material is identical or close with grinding pad 80; the degree of depth " L " of multilayered color-forming marker 82 under grinding pad outer surface 81 usually can be greater than a fixed thickness; this fixed thickness is less than the thickness of grinding pad main body 80; it is the degree of general existing grinding pad loss, and its thickness is between 20-500 μ m.Multilayered color-forming marker 82 comprises color layers 82a, 82b and 82c, shown in Fig. 8 B, and the color difference of these color layers, and also inequality apart from the degree of depth on surface.
Please refer to Fig. 9 A, it illustrates the 7th preferred embodiment of the present invention, the stereogram of grinding pad in a kind of work-table of chemicomechanical grinding mill.Simultaneously with reference to Fig. 9 B, it illustrates the stereogram according to the local structure for amplifying 94 of Fig. 9 A again.Wherein, oneself's life-span shows grinding pad 90, and it comprises grinding pad surface 91 and a plurality of multilayered color-forming marker 92.Grinding pad main body 90 preferably is discoid structure.
When this multilayered color-forming marker length during much smaller than grinding pad length, its shape is near strip, and shown in Fig. 9 A, its number can be not limited to one.As for multilayer vitta 92; then be embedded on the surface 93 of grinding pad main body 91 by pressing; its material is identical or close with grinding pad 90; multilayer vitta 92 usually can be greater than a fixed thickness at the thickness of " L "; this fixed thickness is less than the thickness of grinding pad main body 91; it is the extent of deterioration of general existing grinding pad terminal life, and thickness is between 20-500 μ m.Multilayer vitta 92 comprises color layers 92a, 92b, 92c and 92d, shown in Fig. 9 B, and the color difference of these color layers, and also inequality apart from the degree of depth on surface.Wherein, multilayer vitta 92 lays respectively at the different head-down positions in the grinding pad main body 91.In addition, the color layers of each multilayer vitta 92, for example 92a, 92b, 92c and 92d are shown in Fig. 9 A.Its purpose is to show the degree of wear of grinding pad diverse location, thus, and can more accurate measurement and the end of life of judging grinding pad.
In sum, the chemical and mechanical grinding cushion that can show in oneself's life-span proposed by the invention has following advantage and characteristics:
(1) the Improvement type grinding pad structure of the present invention's proposition can demonstrate the degree of wear of grinding pad itself when grinding, and possesses the ability of the end of life of demonstration own, not only helpful for improving the manufacture craft quality, and can bring into play the maximum life of grinding pad, to save cost.
(2) the Improvement type grinding pad structure of the present invention's proposition, have multiple combination and arrangement mode, and material is also unrestricted, for example can be multilayered color-forming indicator (with the grinding pad identical materials) or indicator vitta (comprise oxidation/reduction indicator or be acid-base indicator), and elasticity is very big.
(3) no matter the present invention utilizes multilayered color-forming marker or indicator vitta, its number is not limited to one, and can lay respectively at the different head-down positions in the grinding pad main body.
In sum; though disclosed the present invention in conjunction with above seven preferred embodiments; yet it is not in order to limit the present invention; any present technique personnel without departing from the spirit and scope of the present invention; can be used for a variety of modifications and variations, so protection scope of the present invention should be considered as appended being as the criterion that claim defined.
Claims (26)
1. a chemical and mechanical grinding cushion can show in oneself's life-span, it is characterized in that this grinding pad comprises:
One grinding pad main body, this grinding pad main body is a disc-shaped structure, and this grinding pad main body has a surface; And
One multilayered color-forming marker, be embedded in this surface of this grinding pad main body, this multilayered color-forming marker in this subsurface degree of depth greater than a fixed thickness, this fixed thickness is less than the thickness of this grinding pad main body, and this multilayered color-forming marker comprises a plurality of color layers, the color of this each color layers is all inequality, and also inequality apart from this surperficial degree of depth.
2. grinding pad as claimed in claim 1 is characterized in that, this fixed thickness is between 20-500 μ m.
3. grinding pad as claimed in claim 1 is characterized in that being shaped as of this multilayered color-forming marker is discoid.
4. grinding pad as claimed in claim 1 is characterized in that, this multilayered color-forming marker be shaped as annular.
5. grinding pad as claimed in claim 1 is characterized in that, this each color layers lays respectively at this oneself life-span and shows different head-down positions in the grinding pad.
6. grinding pad as claimed in claim 1 is characterized in that, also comprises a plurality of multilayered color-forming markers, be embedded in this surface, this each multilayered color-forming marker in this subsurface degree of depth all greater than this fixed thickness.
7. grinding pad as claimed in claim 6 is characterized in that, this multilayered color-forming marker be shaped as strip.
8. grinding pad as claimed in claim 6 is characterized in that, this each multilayered color-forming marker lays respectively at this oneself life-span and shows different head-down positions in the grinding pad.
9. a chemical and mechanical grinding cushion can show in oneself's life-span, it is characterized in that this grinding pad comprises:
One grinding pad main body, this grinding pad main body is a disc-shaped structure, and this grinding pad main body has a surface; And
One multilayer indicator vitta, be located in the surface that this oneself life-span shows grinding pad, this multilayer indicator vitta comprises a plurality of indicator vittas, the degree of depth of this each indicator vitta is all inequality, and can react when running into this lapping liquid and present different colors, one of them the degree of depth of this each indicator vitta is about a constant depth.
10. grinding pad as claimed in claim 9 is characterized in that, this constant depth is between 20-500 μ m.
11. grinding pad as claimed in claim 9 is characterized in that, this indicator vitta comprises oxidation/reduction indicator.
12. grinding pad as claimed in claim 9 is characterized in that, this indicator vitta comprises acid-base indicator.
13. grinding pad as claimed in claim 9 is characterized in that, this each indicator vitta layer lays respectively at this oneself life-span and shows different head-down positions in the grinding pad.
14. grinding pad as claimed in claim 9 is characterized in that, also comprises a plurality of multilayer indicator vittas, this each multilayer indicator vitta lays respectively at this oneself life-span and shows different head-down positions in the grinding pad.
15. a chemical and mechanical grinding cushion can show in oneself's life-span, it is characterized in that this grinding pad comprises:
One grinding pad main body, this grinding pad main body is a disc-shaped structure, and this grinding pad main body has a surface; And
A plurality of indicator vittas, this each indicator vitta is all inequality in this subsurface degree of depth, and can react when running into a lapping liquid and present different colors, and this each indicator vitta is about a constant depth in this subsurface degree of depth.
16. a chemical and mechanical grinding cushion can show in oneself's life-span, it is characterized in that this grinding pad comprises:
One grinding pad main body, this grinding pad main body are the belt composition of an annular, and this grinding pad main body has an outer surface; And
One multilayered color-forming marker, be embedded in this outer surface of this grinding pad main body, the degree of depth of this multilayered color-forming marker under this outer surface is greater than a fixed thickness, this fixed thickness is less than the thickness of this grinding pad main body, and this multilayered color-forming marker comprises a plurality of color layers, the color of this each color layers is all inequality, and also inequality apart from this surperficial degree of depth.
17. grinding pad as claimed in claim 16 is characterized in that, this fixed thickness is between 20-500 μ m.
18. grinding pad as claimed in claim 16 is characterized in that, this multilayered color-forming marker be shaped as annular.
19. grinding pad as claimed in claim 16 is characterized in that, also comprises a plurality of multilayered color-forming markers, is embedded in this surface, this each multilayered color-forming marker is about this fixed thickness in this subsurface degree of depth.
20. grinding pad as claimed in claim 16 is characterized in that, this multilayered color-forming marker be shaped as strip.
21. a chemical mechanical grinder that adopts the described grinding pad of claim 1 is characterized in that, comprising:
One grinding table rotates with a fixed-direction;
One oneself's life-span showed grinding pad, was located on this grinding table, in order to demonstrating the degree of wear of this grinding pad itself, and possessed the ability of the end of life of this grinding pad of demonstration own;
One wafer places this oneself life-span to show on the grinding pad, and this wafer has a back side and a front, and the front of this wafer shows that with this oneself's life-span grinding pad contacts; And
One pipe fitting places this oneself life-span to show the grinding pad top, and this pipe fitting shows on the grinding pad in order to carry a lapping liquid to this oneself's life-span.
22. grinder as claimed in claim 21 is characterized in that, also comprises a lever, in order to catching the back side of this wafer, the front of this wafer is pressed in this oneself life-span shows on the grinding pad.
23. grinder as claimed in claim 21 is characterized in that, each color layers of this of each this multilayered color-forming marker lays respectively at the different head-down positions in this grinding pad main body.
24. a chemical mechanical grinder that adopts the described grinding pad of claim 9 is characterized in that, comprising:
One grinding table rotates with a fixed-direction;
One oneself's life-span showed grinding pad, was located on this grinding table, in order to demonstrating the degree of wear of this grinding pad itself, and possessed the ability of the end of life of this grinding pad of demonstration own;
One wafer places this oneself life-span to show on the grinding pad, and this wafer has a back side and a front, and the front of this wafer shows that with this oneself's life-span grinding pad contacts; And
One pipe fitting places this oneself life-span to show the grinding pad top, and this pipe fitting shows on the grinding pad in order to carry a lapping liquid to this oneself's life-span.
25. grinder as claimed in claim 21 is characterized in that, this constant depth is less than the thickness of this grinding pad main body.
26. grinder as claimed in claim 25 is characterized in that, this each indicator vitta is arranged in the identical head-down position of this grinding pad main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98123446A CN1076253C (en) | 1998-10-23 | 1998-10-23 | Chemical and mechanical grinding cushion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98123446A CN1076253C (en) | 1998-10-23 | 1998-10-23 | Chemical and mechanical grinding cushion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1252336A CN1252336A (en) | 2000-05-10 |
| CN1076253C true CN1076253C (en) | 2001-12-19 |
Family
ID=5228196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98123446A Expired - Fee Related CN1076253C (en) | 1998-10-23 | 1998-10-23 | Chemical and mechanical grinding cushion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1076253C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100390016C (en) * | 2003-07-29 | 2008-05-28 | 株式会社岛野 | Bicycle crank arm |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004023009A (en) * | 2002-06-20 | 2004-01-22 | Nikon Corp | Polishing body, polishing device, semiconductor device, and method of manufacturing the same |
| CN100551623C (en) * | 2003-01-10 | 2009-10-21 | 3M创新有限公司 | Be applied to the mat structure of chemical-mechanical planarization |
| CN101426618B (en) * | 2006-04-19 | 2013-05-15 | 东洋橡胶工业株式会社 | Manufacturing method of polishing pad |
| US8118644B2 (en) * | 2008-10-16 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having integral identification feature |
| DE202009003795U1 (en) | 2009-03-25 | 2009-06-04 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Tool component and machine tool |
| CN103249526A (en) * | 2010-12-16 | 2013-08-14 | 圣戈班磨料磨具有限公司 | Slot wear indicators for grinding tools |
| CN103100969A (en) * | 2013-02-27 | 2013-05-15 | 上海华力微电子有限公司 | Polishing pad for chemical machinery polishing |
| US9915338B2 (en) * | 2015-09-14 | 2018-03-13 | Deere & Company | Belt wear indication |
| CN107042469A (en) * | 2016-02-05 | 2017-08-15 | 三芳化学工业股份有限公司 | The absorption layer and its manufacture method of the service life that can develop the color terminal |
| US11260495B2 (en) | 2018-07-27 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and methods for chemical mechanical polishing |
| CN112605883A (en) * | 2020-12-10 | 2021-04-06 | 上海新昇半导体科技有限公司 | Polishing pad monitoring device and monitoring method |
| CN113916800B (en) * | 2021-10-08 | 2022-09-27 | 南京航空航天大学 | Detection method for visually judging abrasion of high polymer plastic abrasive |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5579717A (en) * | 1994-10-13 | 1996-12-03 | International Business Machines Corporation | Method of grinding thin-film magnetic heads using optical grinding markers |
| US5733176A (en) * | 1996-05-24 | 1998-03-31 | Micron Technology, Inc. | Polishing pad and method of use |
| US5736427A (en) * | 1996-10-08 | 1998-04-07 | Micron Technology, Inc. | Polishing pad contour indicator for mechanical or chemical-mechanical planarization |
-
1998
- 1998-10-23 CN CN98123446A patent/CN1076253C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5579717A (en) * | 1994-10-13 | 1996-12-03 | International Business Machines Corporation | Method of grinding thin-film magnetic heads using optical grinding markers |
| US5733176A (en) * | 1996-05-24 | 1998-03-31 | Micron Technology, Inc. | Polishing pad and method of use |
| US5736427A (en) * | 1996-10-08 | 1998-04-07 | Micron Technology, Inc. | Polishing pad contour indicator for mechanical or chemical-mechanical planarization |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100390016C (en) * | 2003-07-29 | 2008-05-28 | 株式会社岛野 | Bicycle crank arm |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1252336A (en) | 2000-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1076253C (en) | Chemical and mechanical grinding cushion | |
| US6929530B1 (en) | Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same | |
| US7300335B2 (en) | Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method | |
| US5736427A (en) | Polishing pad contour indicator for mechanical or chemical-mechanical planarization | |
| KR101256310B1 (en) | Method and apparatus for trimming the working layers of a double-side grinding apparatus | |
| CN101249623B (en) | Grinding method and grinding device of circular disk shape substrate | |
| US20150004888A1 (en) | Polishing pad with two-section window having recess | |
| US20010039163A1 (en) | Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization | |
| US20080220700A1 (en) | Glass Substrate for Information Recording Medium and Method for Producing the Same | |
| EP1178872A1 (en) | Chemical mechanical planarization or polishing pad with sections having varied groove patterns | |
| Doi et al. | Advances in CMP polishing technologies | |
| KR20030019144A (en) | Semiconductor wafer with improved local flatness, and process for its production | |
| EP1905542B1 (en) | Method of determining the number of active abrasive grains on a conditioning disk | |
| JP2012156505A (en) | Method for providing respective flat working layer on each of two working disks of double-side processing apparatus | |
| US11633830B2 (en) | CMP polishing pad with uniform window | |
| EP1283090B1 (en) | Method for polishing angular substrates | |
| CN103137144A (en) | Substrate for magnetic recording medium, magnetic recording medium, method of manufacturing magnetic recording medium, and method of inspecting surface | |
| CN109093538A (en) | A kind of CMP pad treatment process | |
| KR20190093574A (en) | Carrier for double side polishing device, double side polishing device and double side polishing method | |
| US20070023395A1 (en) | Production method for semiconductor wafer | |
| CN1313216C (en) | Modular controlled platen preparation system and method | |
| KR102600819B1 (en) | Polishing pad with multipurpose composite window | |
| US20060121835A1 (en) | Polishing method | |
| Ball et al. | Electrolytically assisted ductile-mode diamond grinding of BK7 and SF10 optical glasses | |
| KR100806949B1 (en) | Linearly advancing polishing method and apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |