CN105835359A - Printing module of rapid prototyping device - Google Patents

Printing module of rapid prototyping device Download PDF

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Publication number
CN105835359A
CN105835359A CN201510022740.XA CN201510022740A CN105835359A CN 105835359 A CN105835359 A CN 105835359A CN 201510022740 A CN201510022740 A CN 201510022740A CN 105835359 A CN105835359 A CN 105835359A
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CN
China
Prior art keywords
hydrojet
casket
chip
fluid reservoir
molding device
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Pending
Application number
CN201510022740.XA
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Chinese (zh)
Inventor
罗进添
黄启峰
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Microjet Technology Co Ltd
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Microjet Technology Co Ltd
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Publication date
Application filed by Microjet Technology Co Ltd filed Critical Microjet Technology Co Ltd
Priority to CN201510022740.XA priority Critical patent/CN105835359A/en
Publication of CN105835359A publication Critical patent/CN105835359A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a printing module of a rapid prototyping device. The device comprises: a spray printing platform, which has a frame body and a transmission shaft arranged on the frame body; a bearing seat, which passes through the transmission shaft; and at least two identical modular liquid spraying boxes disposed on the bearing seat correspondingly, wherein each liquid spraying box has a box body and is internally equipped with three liquid storage chambers for accommodating different jet printing liquids respectively, and the box bodies of the at least two identical modular liquid spraying boxes accommodate at least one identical jet printing liquid so as to realize rapid prototyping jet printing operation.

Description

The print module of rapid molding device
Technical field
The present invention is related to a kind of rapid molding device, and a kind of have the quick of multiple modular hydrojet casket The print module of shaped device.
Background technology
Rapid shaping technique (Rapid Prototyping is called for short RP technology) is for being similar to pyramid layer by layer according to construction Stacking the concept of molding to be developed and form, it is mainly technically characterized ny the agility of molding, can need not any cutter Tool, automatic in the case of mould and tool, quick is 3D's by the design rapid translating of arbitrarily complicated shape Physical model, substantially reduces the R&D cycle of new product and reduces R&D costs, it can be ensured that the listing of new product Time and the one-time success rate of new product development, rapid shaping technique is between technical staff, and technical staff with Corporate decision maker, product the non-technical personnel such as user between provide a more complete and convenient product design Media of communication, thus significantly improve product competitiveness and the enterprise quick-reaction capability to market commercially.
RP technology develops and utilizes Printing techniques to combine the mode of carrier precision positioning technology to produce 3D's at present Physical model, its mode of production is for be first layed in above carrier by one layer of powder and to utilize hydrojet printing technique in part The full-bodied adhesive of spray printing on powder, makes adhesive and powder be stained with glutinous and solidify, repeats above-mentioned processing procedure layer by layer always Pile up the physical model that can complete 3D.
It is technical that the known print module generally used with general Printing techniques is applied to RP, for example, its As it is shown in figure 1, the print module 1 that this general Printing techniques is used is arranged at a main body (the most graphic), to enter Row spatterwork.This print module 1 includes spray printing platform 10, load bearing seat 11 and at least one hydrojet casket 12, this spray Print platform 10 includes support body 101 and is located at the power transmission shaft 102 of this support body 101, and load bearing seat 11 is arranged in this On power transmission shaft 102, this at least one hydrojet casket 12 would generally arrange two hydrojet caskets, i.e. as it is shown in figure 1, be accommodating First hydrojet casket 121 of black ink and accommodating color inks (such as: cyan (C), yellow (Y), carmetta (M)) The second hydrojet casket 122, and hydrojet casket 12 is correspondingly arranged on this load bearing seat 11, therefore this load bearing seat 11 and setting Hydrojet casket 12 placed on it can be relative to this power transmission shaft 102 of this spray printing platform 10 to carry out the reciprocal of X-axis Formula start.
When this print module 1 carries out the spatterwork of RP technology, through this spray printing platform 10 with this carrying Seat 11 and the hydrojet casket 12 being arranged on carry out the reciprocating start of a Y direction, and again through this hydrojet Casket 12 can be along this power transmission shaft 102 to carry out the reciprocating work of X-direction moved left and right on this load bearing seat 11 Reciprocating start that is dynamic, that so carry out alternately through X-axis and Y direction, can be housed this hydrojet casket 12 Color inks is sprayed on the construction materials (not shown) that construction carrier (not shown) is laid, and repeats above-mentioned always The operation that processing procedure is built with implementation level layer stack, and then the physical model (not shown) of 3D object can be completed.
But when the rapid shaping spatterwork of this 3D object is implemented, except accommodating black and coloured silk in hydrojet casket 12 Outside chromatic ink, more need additionally to house full-bodied adhesive, so that construction materials is binded, and then can be layer by layer Piling up to constitute 3D object, the most traditional rapid molding device more needs to arrange extra carrier and hydrojet casket is used In accommodating full-bodied adhesive, consequently, it is possible to the overall volume of spray printing module 1 then can be caused to increase, the most more Increase carrier and the cost of hydrojet casket.
In view of this, the impression block of a kind of rapid molding device improving aforementioned known techniques disappearance how is developed Block, problem the most in the urgent need to address.
Summary of the invention
Present invention is primarily targeted at the print module providing a kind of rapid molding device, it possesses modular Hydrojet casket, and each hydrojet casket possesses three fluid reservoirs, and wherein two fluid reservoirs in order to the most homochromy accommodating ink, One fluid reservoir is in order to accommodating adhesive, herewith to implement the spatterwork of the rapid shaping of 3D object.
For reaching above-mentioned purpose, a broader enforcement aspect of the present invention is for providing the printing of a kind of rapid molding device Module, comprises: spray printing platform, has support body and power transmission shaft, and power transmission shaft is located on support body;Load bearing seat, wears On power transmission shaft;And the hydrojet casket of at least two identical molds massing, it is correspondingly arranged on load bearing seat, wherein hydrojet Casket has body, is provided with three fluid reservoirs in body, in order to house different spray printing liquid respectively, and at least two The accommodating at least identical spray printing liquid of the body of the hydrojet casket of identical molds massing, to implement the spray of rapid shaping Print operation.
Accompanying drawing explanation
Fig. 1 is the structural representation of the print module of the rapid shaping of the general Printing techniques of known employing.
Fig. 2 is the structural representation of the print module of the rapid molding device of the present invention the first preferred embodiment.
Fig. 3 A is the outward appearance of the hydrojet casket of the print module of the rapid molding device of the present invention the first preferred embodiment Schematic diagram.
Fig. 3 B be the hydrojet casket shown in Fig. 3 A look up structural representation.
Fig. 3 C is the horizontal section structural representation of the hydrojet casket shown in Fig. 3 A.
Fig. 4 A be the hydrojet casket of the print module of the rapid molding device of the present invention the first preferred embodiment on regard Cross-sectional view.
Fig. 4 B is the cross-sectional view of the A-A ' of the hydrojet casket shown in Fig. 4 A.
Fig. 5 A be the hydrojet casket of the print module of the rapid molding device of the present invention the first preferred embodiment on regard Cross-sectional view.
Fig. 5 B is the cross-sectional view of the B-B ' of the hydrojet casket shown in Fig. 5 A.
Fig. 6 is that the ink of the hydrojet casket of the print module of the rapid molding device of the present invention the first preferred embodiment is joined Put schematic diagram.
Fig. 7 A is the hydrojet of the hydrojet casket of the print module of the rapid molding device of the present invention the first preferred embodiment Chip part removes the structural upright schematic diagram of jet orifice plate.
Fig. 7 B is the hydrojet of the hydrojet casket of the print module of the rapid molding device of the present invention the first preferred embodiment Chip removes the structural representation of jet orifice plate.
Fig. 8 is the hydrojet core of the hydrojet casket of the print module of the rapid molding device of the present invention the first preferred embodiment The hydrojet control circuit structural representation of sheet.
Fig. 9 A is to regard at the end of the hydrojet casket of the print module of the rapid molding device of the present invention the second preferred embodiment Structural representation.
Fig. 9 B be the hydrojet casket shown in Fig. 9 A on regarding cross-sectional view.
Fig. 9 C is the cross-sectional view of the D-D ' of the hydrojet casket shown in Fig. 9 A.
Fig. 9 D is the cross-sectional view of the E-E ' of the hydrojet casket shown in Fig. 9 A.
Figure 10 is that the ink of the hydrojet casket of the print module of the rapid molding device of the present invention the second preferred embodiment is joined Put schematic diagram.
[symbol description]
1,2: print module
10,20: spray printing platform
101,201: support body
102,202: power transmission shaft
11,21: load bearing seat
12,22,22X, 22Y, 42,42X, 42Y: hydrojet casket
121: the first hydrojet caskets
122: the second hydrojet caskets
220: upper cover
221,221x, 221y, 421: body
221a: wall
222: flexible electric circuit board
222a: electrical contact point
223,223x, 223y, 423,423x, 423y: hydrojet chip
223a: spray nozzle sheet
224、224a、224b、224c、224d、224x、224ax、224bx、224cx、224dx、224y、 224ay、224by、224cy、224dy、424、424a、424b、424c、424x、424ax、424bx、 424cx, 424y, 424ay, 424by, 424cy: feed tank
225、226、227、225x、226x、227x、225y、226y、227y、425、426、427、 425x, 426x, 427x, 425y, 426y, 427y: fluid reservoir
228,37: droplet generator
228a: spray hole
229: identification chip
3: hydrojet control circuit
31: the first on-off circuits
32: second switch circuit
33: the three on-off circuits
34: the four on-off circuits
35: the five on-off circuits
36: the six on-off circuits
228b, 371: add thermal resistance
372: drive transistor
P: with distance between two adjacent droplet generators in row
P/2: the vertical dimension between adjacent two droplet generators of different rows
Wd2: the width of hydrojet chip
Ld2: the length of hydrojet chip
Ls2: the length of each feed tank
Lr2: the total length of each discharge opeing drop generator
Sd2: the width of each feed tank
The spacing of Cd: two adjacent feed tanks
M1: the first switch element
M2: second switch element
M3: the three switch element
M4: the four switch element
M5: the five switch element
M6: the six switch element
M7: the seven switch element
M8: the eight switch element
M9: the nine switch element
M10: the ten switch element
P: power supply end points
PD: print data signal
MF: thermal control signals
PF: warm-up control signal
H1: the first on-off circuit controls end points
H: computer heating control end points
PFD: warmable data signal
H2: second switch circuit controls end points
PF-N: reversely warm-up control signal
MF-N: reversely thermal control signals
Detailed description of the invention
Embodiment feature of present invention will describe with some exemplary embodiments of advantage in the explanation of back segment in detail.Ying Li Solve is that the present invention can have various changes in different aspects, and it neither departs from the scope of the present invention, and Explanation therein and be shown in and be substantially illustrated as being used, and nand architecture is in limiting the present invention.
Referring to Fig. 2, it is that the structure of print module of rapid molding device of the present invention the first preferred embodiment is shown It is intended to.As in figure 2 it is shown, print module 2 is be applicable to a rapid molding device (not shown), and include that spray printing is put down Platform 20, load bearing seat 21 and multiple modular hydrojet casket 22, spray printing platform 20 includes support body 201 and transmission Axle 202, and power transmission shaft 202 is located on support body 201, load bearing seat 21 is arranged on power transmission shaft 202, and in In the present embodiment, the plurality of modular hydrojet casket 22 is two identical hydrojet casket 22X, 22Y, this two hydrojet Casket 22X, 22Y are correspondingly arranged on this load bearing seat 21, therefore load bearing seat 21 and the two hydrojet caskets that are arranged on 22X, 22Y can be reciprocal with single direction (such as: the direction of X-axis) relative to the power transmission shaft 202 of spray printing platform 20 Formula displacement, and by multiple modular hydrojet caskets 22 import spray printing liquid, to implement the spray of rapid shaping Print operation.
When this print module 2 carries out the spatterwork of RP technology, through this spray printing platform 20 with this carrying Seat 21 and two hydrojet casket 22X, the 22Y being arranged on carry out the reciprocating start of a Y direction, and the most saturating Crossing this two hydrojet casket 22X, 22Y can be along this power transmission shaft 202 to carry out the X moved left and right on this load bearing seat 21 Axial reciprocating start, the reciprocating start so carried out alternately through X-axis and Y direction, can be by two The construction materials that the spray printing liquid spray housed in hydrojet casket 22X, 22Y is laid at construction carrier (not shown) On (not shown), and repeat the operation that above-mentioned processing procedure is built with implementation level layer stack always, and then 3D object can be completed Physical model (not shown).
In certain embodiments, this spray printing liquid can be adhesive and colorant ink, and this colorant ink can be face Material ink or dye ink etc., be not limited thereto.And in other embodiments, this spray printing liquid can be colourless Or the spray printing liquid of monochrome, the most transparent adhesive spray printing liquid, cyan (C) spray printing liquid, yellow (Y) spray printing liquid The spray printing liquid such as body, carmetta (M) spray printing liquid or other cyans of light color, shallow fuchsin, GTG color, and not with This is limited.
Please refer to Fig. 3 A, 3B, 3C, wherein Fig. 3 A is the rapid shaping of the present invention the first preferred embodiment The schematic appearance of the hydrojet casket of the print module of device, Fig. 3 B is that the structure of looking up of the hydrojet casket shown in figure v is shown Being intended to, Fig. 3 C is the horizontal section structural representation of the hydrojet casket shown in Fig. 3 A.As shown in Figure 3A, print The hydrojet casket 22 of module 2 is by upper cover 220, body 221, flexible electric circuit board 222 and 223 structures of hydrojet chip Becoming, wherein upper cover 220 is covered on body 221, and hydrojet chip 223 is then arranged at the lower section of body 221, And there is inside body 221 liquid storage space, to store spray printing liquid.Body 221 has wall 221a, and When hydrojet casket 22 installation settings is when rapid molding device (not shown) is upper, and this wall 221a can be with its load bearing seat 21 (as shown in Figure 2) are corresponding and arrange.And flexible electric circuit board 222 is i.e. arranged on wall 221a, and have Multiple electrical contact point 222a, when hydrojet casket 22 is arranged on the load bearing seat 21 of rapid molding device, thoroughly Cross the some 222a of the electrical contact on the flexible electric circuit board 222 of hydrojet casket 22 (not scheme with the junction on load bearing seat 21 Show) corresponding electrical connection.This hydrojet casket 22 another is further provided with an identification chip 229 and then to carry out status identification / control and/or monitor the communication of electric signal between the hydrojet chip 223 of rapid molding device and hydrojet casket 22.
As schemed shown in v, hydrojet chip 223 is the bottom of the body 221 being correspondingly arranged in hydrojet casket 22, and tool Having multiple feed tank 224, in the present embodiment, the quantity of the plurality of feed tank is 4, but is not limited, in In other embodiments, the quantity of the plurality of feed tank also can be 3, and the quantity of these feed tanks can be executed according to actual Make situation and appoint and execute change, be not limited thereto.And in the present embodiment, as shown in Figure 3 C, hydrojet casket 22 Body 221 internal there are 3 fluid reservoirs 225,226,227, in other words, liquid storage sky body 221 within Between to be separated be 3 fluid reservoirs 225,226,227, in order to the most homochromy or mutually homochromy accommodating spray printing liquid respectively. For example, in the present embodiment, fluid reservoir 225 in order to accommodating transparent adhesive (T), fluid reservoir 226 in order to House cyan (C) colorant ink, fluid reservoir 227 is in order to accommodating carmetta (M) colorant ink, but is not limited, And these 3 fluid reservoirs 225,226,227 respectively with the hydrojet chip more than 223 being arranged at bottom body 221 Individual feed tank 224 is connected.As a example by the present embodiment, fluid reservoir 225 and central authorities twice feed tank 224b, 224c It is connected, in order to adhesive to be delivered to feed tank 224b, 224c of central authorities' twice;Fluid reservoir 226 is then with one The feed tank 224a of side is connected, in order to be delivered in feed tank 224a by wherein accommodating cyan colorant ink; Then it is connected with the feed tank 224d of opposite side as fluid reservoir 227, in order to by wherein accommodating carmetta colorant Ink is delivered in feed tank 224d.
Referring to Fig. 4 A and Fig. 4 B, Fig. 4 A is the printing of the rapid molding device of the present invention the first preferred embodiment Regarding cross-sectional view on the hydrojet casket of module, Fig. 4 B is the section of the A-A ' of the hydrojet casket shown in Fig. 4 A Structural representation.As illustrated in figures 4 a and 4b, it is seen that within body 221 3 fluid reservoirs of hydrojet casket 22 225,226,227 respectively with multiple feed tanks 224 phase of the hydrojet chip 223 being arranged at bottom body 221 Connection, and by the structure within fluid reservoir 225 seen from the cross-sectional view shown in Fig. 4 B, arrange in pairs or groups Fig. 4 A Shown cross-sectional view, it is seen that the transparent adhesive that fluid reservoir 225 accommodated inside stores is by fluid reservoir 225 Internal two lateral flows, to flow at the hydrojet chip 223 bottom body 221, and flow to coupled logical Middle twice feed tank 224b, 224c at export, to carry out the feed flow operation of transparent adhesive.
Please continue refering to Fig. 5 A and Fig. 5 B, Fig. 5 A is beating of the rapid molding device of the present invention the first preferred embodiment Regarding cross-sectional view on the hydrojet casket of impression block, Fig. 5 B is cuing open of the B-B ' of the hydrojet casket shown in Fig. 5 A Face structural representation.As shown in Figure 5 B, it is seen that the structure within fluid reservoir 225 and 226, collocation Fig. 5 A institute The cross-sectional view shown, it is seen that the cyan colorant ink that fluid reservoir 226 accommodated inside stores is by fluid reservoir 226 To flows, to flow at the hydrojet chip 223 bottom body 221, and it flow to coupled logical feed tank Export at 224a, to carry out the feed flow operation of cyan colorant ink.As for the fluid reservoir 227 in the present embodiment Internal structure is similar with fluid reservoir 226 and is symmetrically set, thus the mode of its internal structure and ink flow all with Fluid reservoir 226 is similar, therefore repeats no more.So through earlier figures 3C, Fig. 4 A, Fig. 4 B, Fig. 5 A and Fig. 5 B I.e. it is understood that possess the hydrojet casket of 3 fluid reservoirs 225,226,227 through the present embodiment, collocation has 4 The hydrojet chip 223 of individual feed tank 224, can export the colorant ink of dichromatism and transparent adhesive simultaneously, in order to Spatterwork in the rapid shaping carrying out 3D object.
Referring to Fig. 6 the Fig. 2 that arranges in pairs or groups, Fig. 6 is the printing of the rapid molding device of the present invention the first preferred embodiment The ink configuration schematic diagram of the hydrojet casket of module, as it can be seen, at least one hydrojet casket 22 of the present invention can be but not Be limited to two hydrojet casket 22X, 22Y, and this hydrojet casket 22X, 22Y be respectively provided with 3 fluid reservoir 225x, 226x, 227x and 225y, 226y, 227y, in the present embodiment, wherein the fluid reservoir 225x of hydrojet casket 22X in order to House transparent adhesive (T), fluid reservoir 226x in order to accommodating cyan (C) colorant ink, fluid reservoir 227x in order to hold Put carmetta (M) colorant ink, and the fluid reservoir 225y of hydrojet casket 22Y in order to accommodating transparent adhesive (T), Fluid reservoir 226y is then black in order to accommodating black (K) colorant in order to accommodating yellow (Y) colorant ink, fluid reservoir 227y Water, but be not limited.And hydrojet chip 223x bottom body 221x of hydrojet casket 22X, 22Y, 221y, Fluid reservoir 225x, 226x, 227x that multiple feed tank 224x, 224y on 223y are the most corresponding and 225y, 226y, 227y are connected, as a example by the present embodiment, and the feed flow of the hydrojet chip 223x of hydrojet casket 22X Groove 224ax is connected with fluid reservoir 226x, exports its cyan colorant ink housed in order to correspondence, is arranged at Central twice feed tank 224bx and 224cx of hydrojet chip 223x is then connected with fluid reservoir 225x, in order to right Should export its transparent adhesive housed, the feed tank 224dx of hydrojet chip 223x is connected with fluid reservoir 227x Logical, export its carmetta colorant ink housed in order to correspondence;Hydrojet chip 223y as hydrojet casket 22Y Feed tank 224ay be then connected with fluid reservoir 226y, in order to correspondence export its yellow colorant ink housed, Central twice feed tank 224by and 224cy being arranged at hydrojet chip 223y is then connected with fluid reservoir 225y, Equally in order to correspondence export its transparent adhesive housed, hydrojet chip 223y feed tank 224dy then with storage Liquid chamber 227y is connected, and exports its black pigment ink housed in order to correspondence.Consequently, it is possible to through at this Accommodating different colours of color in inventing hydrojet casket 22X, 22Y that two modularitys are arranged, black pigment ink and transparent The spray printing liquid such as adhesive, then can implement the polychrome spatterwork of 3D object rapid shaping to rapid molding device.
Referring to Fig. 7 A and Fig. 7 B, it is the impression block of rapid molding device of the present invention the first preferred embodiment The structural representation of the hydrojet chip of the hydrojet casket of block.As shown in Fig. 7 A, 7B, hydrojet chip 223 is provided with many Individual feed tank 224, and in the present embodiment, the quantity of the plurality of feed tank 224 is 4, and i.e. it has feed flow Groove 224a, 224b, 224c, 224d, and, the major axis edge of each feed tank 224 both sides respectively The droplet generator 228 of one row is set, but is not limited.With staggered row between each discharge opeing drop generator 228 The mode of row is arranged at the dual-side of feed tank 224a, 224b, 224c, 224d, therefore the hydrojet core of the present embodiment There is on sheet 223 droplet generator 228 of 2 rows × 4=8 row, and this each droplet generator 228 is by a heating The spray hole 228a of resistance 228b and a correspondence is constituted, wherein droplet generator 228 add thermal resistance 228b It is arranged on hydrojet chip 223, is provided spray for the fluid reservoir 225,226,227 making feed tank 224 be connected Print fluid connection, and this adds thermal resistance 228b and is covered by jet orifice plate 223a, and set in this jet orifice plate 223a There is this spray hole 228a, be provided with adding thermal resistance 228b corresponding to this, so supply spray printing liquid heated resistance 228b After heating, then form thermal, and ejected drop to complete this droplet generator 228 by spray hole 228a Spray printing effect.
In the present embodiment, as shown in Figure 7 B, hydrojet chip 223 has the direction of four and axis of reference L Parallel feed tank 224, and vertical direction relative to axis of reference L separates side by side each other, each axis battle array Row can be but not be limited to the double thermal resistance 228b that adds and be arranged at feed tank 224 dual-side, and double add thermal resistance It is arranged at the dual-side of corresponding feed tank 224 in staggered mode between 228b, therefore the present embodiment Have 8 rows on hydrojet chip 223 adds thermoelectricity group row.Adding of each row can comprise 300 in thermal resistance 228b Individual or more add thermal resistance 228b, and add the sum of thermal resistance 228b up to 2400, but be not limited. And each row to add the two adjacent distances added between thermal resistance 228b in thermal resistance 228b be P, different rows' is adjacent Two to add the vertical dimension between thermal resistance 228b be P/2, and in certain embodiments, the distance of P can be between 1/600~1/1200 English, P/2 is then between 1/1200~1/2400 English;And in the present embodiment, the distance of P is 1/600 English, P/2 is then 1/1200 English, but is not limited.
Please continue refering to Fig. 7 B, in the present embodiment, hydrojet chip 223 can be a rectangular configuration, hydrojet chip 223 Width Wd2 be about 5~7 millimeters (mm), most preferably 6 millimeters (mm), length Ld2 is about 15.4 millimeters (mm), the gross area is 77~107.8 square millimeters of (mm2), length-width ratio (Ld2/Wd2) is 15.4/5=3.08~15.4/7=2.2, its length-width ratio is to be preferred with 15.4/6=2.56.Therefore the adding of each row of the present invention Thermal resistance 228b overall length Lr2 is about 1/2 English, and droplet generator 228 sum is about 2400, therefore this case Every square millimeter of (mm on hydrojet chip 2232) droplet generator 228 density be about 2400/ (15.4 × 7) =22.2~2400/ (15.4 × 5)=31.16, the density interval adding thermal resistance 228b is preferred with 2400/6=25.9.
It addition, width S d2 of each feed tank 224 of the present embodiment can be 0.15~0.3 millimeter (mm), long Degree Ls2 can be 12.8 millimeters (mm), and spacing Cd of adjacent two feed tanks 224 can be 1.27 millimeters (mm). Wherein, after the area of the gross area four feed tanks 224 of deduction of hydrojet chip 223, it is hydrojet chip 223 Can the area of wiring area, this is the region that can arrange internal circuit.
According to the conception of the present invention, hydrojet chip 223 can account for the ratio of hydrojet chip 223 gross area by layout area Value can be calculated by following equation:
((hydrojet chip 223 gross area)-(feed tank 224 not layout area))/(hydrojet chip 223 gross area)
Hydrojet chip 223 is adopted and is arranged with 4 feed tanks 224 in the present embodiment, and this ratio is ((hydrojet chip 223 length Ld2 × hydrojet chip 223 width Wd2)-(feed tank 224 length Ls2 × feed tank 224 is wide Degree Sd2 × 4 group feed tank 224))/(spray hydrojet chip 223 length Ld2 × hydrojet chip 223 width Wd2).
Owing to the width Wd2 of hydrojet chip 223 is about 5 millimeters (mm), length Ld2 is about 15.4 millimeters (mm), The gross area is 77 square millimeters of (mm2), and a length of 12.8 millimeters (mm) of feed tank 224, width Be 0.15 millimeter (mm), then the area of the wiring area of hydrojet chip 223 is 69.32 square millimeters of (77-12.8 × 0.15 × 4), therefore hydrojet chip 223 can layout area to account for the ratio of hydrojet chip 223 gross area be 69.32 Square millimeter/77 square millimeters=90.02%.
Owing to the width Wd2 of hydrojet chip 223 is about 5 millimeters (mm), length Ld2 is about 15.4 millimeters (mm), The gross area is 77 square millimeters of (mm2), and a length of 12.8 millimeters (mm) of feed tank 224, width Be 0.3 millimeter (mm), then the area of the wiring area of hydrojet chip 223 is 61.64 square millimeters of (77-12.8 × 0.3 × 4), therefore hydrojet chip 223 can layout area to account for the ratio of hydrojet chip 223 gross area be 61.64 flat Square millimeter/77 square millimeter=80.05%, this is minimum wiring area ratio.
Owing to the width Wd2 of hydrojet chip 223 is about 7 millimeters (mm), length Ld2 is about 15.4 millimeters (mm), The gross area is 107.8 square millimeters of (mm2), and a length of 12.8 millimeters (mm) of feed tank 224, wide Degree is 0.15 millimeter (mm), then the area of the wiring area of hydrojet chip 223 is 100.12 square millimeter (107.8 -12.8 × 0.15 × 4), therefore hydrojet chip 223 can account for the ratio of hydrojet chip 223 gross area and be by layout area 100.12 square millimeters/107.8 square millimeters=92.87%, this is maximum layout area ratio.
Owing to the width Wd2 of hydrojet chip 223 is about 7 millimeters (mm), length Ld2 is about 15.4 millimeters (mm), The gross area is 107.8 square millimeters of (mm2), and a length of 12.8 millimeters (mm) of feed tank 224, wide Degree is 0.3 millimeter (mm), then the area of the wiring area of hydrojet chip 223 is 92.44 square millimeters of (107.8- 12.8 × 0.3 × 4), therefore hydrojet chip 223 can layout area to account for the ratio of hydrojet chip 223 gross area be 92.44 Square millimeter/107.8 square millimeters=85.75%.
From the foregoing, the present embodiment hydrojet chip 223 can account for hydrojet core by layout area with 4 feed tanks 224 The optimum ratio of sheet 223 gross area is 80.05%~92.87%.
When on hydrojet chip 223 can not layout area, when i.e. the area of feed tank 224 is fixed, if can Decrease in area and land counts that the circuit on hydrojet chip 223 configures, i.e. reduce layout area, hydrojet chip The area of 223 can correspondence more reduce, and more can make the size relative decrease of hydrojet chip 223, and then reduce raw Produce the cost of hydrojet chip 223 structure.
Referring to Fig. 8, it is the hydrojet casket of print module of rapid molding device of the present invention the first preferred embodiment The hydrojet control circuit structural representation of hydrojet chip.As it was previously stated, hydrojet chip 223 has multiple spray hole 228a, and each corresponding droplet generator 37 of each spray hole 228a, each droplet generator 37 has one Individual hydrojet control circuit controls to go to control this droplet generator 37 whether hydrojet effect, this spray hole 228a spray Spray printing liquid, therefore possess multiple hydrojet control circuit on hydrojet chip 223 and control each droplet generator with correspondence 37, below will be illustrated as a example by single hydrojet control circuit, but be not limited thereto.
As shown in Figure 8, the hydrojet control circuit of the present invention is primarily adapted for use in the hydrojet chip 223 of hydrojet casket 22, And receive power supply signal, print data signal PD, warmable data signal PFD, warm-up control signal PF, reversely Warm-up control signal PF-N, thermal control signals MF, reverse thermal control signals MF-N and connect end points together COM is connected, and in order to preheat part spray printing liquid and hydrojet chip, or is added by part spray printing liquid Heat also produces bubble, and then spray printing liquid is pushed out the spray hole 228a of this hydrojet chip 223.Wherein, in advance Thermal control signal PF and reverse warm-up control signal PF-N inverse relationship each other, thermal control signals MF is with anti- To thermal control signals MF-N inverse relationship each other.In some embodiments, can respectively by two reversers (not Diagram) warm-up control signal PF and thermal control signals MF is reversed reverse warm-up control signal PF-N with And reverse thermal control signals MF-N.
The hydrojet control circuit 3 of the present invention is mainly opened by the first on-off circuit 31, second switch circuit the 32, the 3rd Close circuit the 33, the 4th on-off circuit the 34, the 5th on-off circuit the 35, the 6th on-off circuit 36 and drop produces Device 37 is formed, and wherein droplet generator 37 can comprise and add thermal resistance 371 and driving transistor 372, and this adds The input of thermal resistance 371 receives this power supply signal, and outfan couples the input of this driving transistor 372, and The outfan of this driving transistor 372 meets end points COM altogether and is connected with this, and the control of this driving transistor 372 End processed connects a computer heating control end points H, mainly controls whether droplet generator 37 adds by computer heating control end points H Heat or preheating, when computer heating control end points H is high potential, turns on control driving transistor 372, and heat Resistance 371 is by receiving the power supply signal of power supply end points P, to carry out heating or preheating.
Second switch circuit 32 may connect between power supply end points P and computer heating control end points H, and it is to be opened by second Close element M2 to be constituted, can be MOS transistor or BJT transistor, but be not limited, can be opened by multiple Pass element in parallel composition, and the control end of this second switch circuit connects a control end points H2, mainly by this Two on-off circuits control end points H2 and control whether this second switch circuit 32 turns on, when this second switch circuit control When end points H2 processed is electronegative potential, second switch circuit 32 turns on, and is conducted by the power supply signal of power supply end points P To computer heating control end points H (that is outfan).Second switch element M2 has grid, drain electrode and source electrode, source Pole (that is input) receives power supply signal, and drain electrode (that is outfan) is connected to computer heating control end points H, and grid is (also I.e. control end) it is connected to second switch circuit control end points H2.
First on-off circuit 31 may connect to power supply end points P and a second switch circuit controls between end points H2, It is made up of the first switch element M1, can be MOS transistor or BJT transistor, but be not limited, also Can be by multiple switch elements and be unified into, and the control end of this first on-off circuit connects and controls end points H1, and with this Computer heating control end points H connects, and mainly controls end points H1 by this first on-off circuit and controls this first on-off circuit Whether 31 turn on, and when the first on-off circuit control end points H1 is electronegative potential, the first on-off circuit 31 turns on, And the power supply signal of power supply end points P is transmitted to second switch circuit control end points H2 (that is outfan).First Switch element M1 has grid, drain electrode and source electrode, and the source electrode (that is input) of the first switch element M1 connects Receiving power supply signal, the drain electrode (that is outfan) of the first switch element M1 (is also connected to the grid of second switch element I.e. control end), the grid of the first switch element M1 is connected to computer heating control end points H.
3rd on-off circuit 33 may connect to second switch circuit control end points H2 and connects between end points COM together, It is composed in series by the 3rd switch element M3 and the 4th switch element M4 and two control ends connect reception respectively and are somebody's turn to do Thermal control signals MF and this print data signal PD, can by this print data signal PD and this add thermal control Signal MF processed controls whether the 3rd on-off circuit 33 turns on.When this print data signal PD and this computer heating control When signal MF is high potential, the 3rd on-off circuit 33 turns on.3rd switch element M3 and the 4th switch element M4 all has grid, drain electrode and source electrode, and the grid (that is controlling end) of the 3rd switch element M3 receives heating By thermal control signals MF, control signal MF, controls whether the 3rd switch element M3 turns on, the 4th switch The grid of element M4 (that is controlling end) receives print data signal PD, controls the by print data signal PD Whether four switch element M4 turn on, and the drain electrode (that is input) of the 3rd switch element M3 is connected to the first switch The drain electrode (that is outfan) of element M1, the source electrode (that is outfan) of the 3rd switch element M3 is connected to the 4th The drain electrode (that is input) of switch element M4, the source electrode (that is outfan) of the 4th switch element M4 is connected to Meet end points COM altogether.
4th on-off circuit 34 be similarly coupled to second switch circuit control end points H2 connect together end points COM it Between, its be composed in series by the 5th switch element M5 and the 6th switch element M6 and two control ends connect respectively Receive this warm-up control signal PF and this warmable data signal PFD, mainly by this warm-up control signal PF and This warmable data signal PFD controls whether the 4th on-off circuit 34 turns on.As this warmable data signal PFD and When this warm-up control signal PF is high potential, the 4th on-off circuit 34 turns on.5th switch element M5 and the 6th Switch element M6 all has grid, drain electrode and source electrode, the grid (that is controlling end) of the 5th switch element M5 Receive warm-up control signal PF, control whether the 5th switch element M5 turns on by this warm-up control signal PF, The grid (that is controlling end) of the 6th switch element M6 receives warmable data signal PFD, by warmable data signal PFD controls whether the 6th switch element M6 turns on, and the drain electrode (that is input) of the 5th switch element M5 connects In the drain electrode (that is outfan) of the first switch element M1, the source electrode (that is outfan) of the 5th switch element M5 It is connected to the drain electrode (that is input) of the 6th switch element M6, the source electrode of the 6th switch element M6 (that is output End) it is connected to meet end points COM altogether.
5th on-off circuit 35 is then connected to computer heating control end points H and connects between end points COM together, and it is by Seven switch element M7 and the 8th switch element M8 be composed in series and two control ends respectively connect reception this reversely add Thermal control signal MF-N and this print data signal PD, mainly by this reverse thermal control signals MF-N and should Print data signal PD controls whether the 5th on-off circuit 35 turns on.As this reverse thermal control signals MF-N And this print data signal PD is when being high potential, the 5th on-off circuit 35 turns on.7th switch element M7 and 8th switch element M8 all has grid, drain electrode and source electrode, the grid of the 7th switch element M7 (that is control End processed) receive this reverse thermal control signals MF-N, control the 7th by this reverse thermal control signals MF-N Whether switch element M7 turns on, and the grid (that is controlling end) of the 8th switch element M8 receives this printing material signal By this printing material signal PD, PD, controls whether the 8th switch element M8 turns on, the 7th switch element M7's Drain electrode (that is input) is connected to the drain electrode (that is outfan) of second switch element M2, the 7th switch element M7 Source electrode (that is outfan) be connected to the drain electrode (that is input) of the 8th switch element M8, the 8th switch element The source electrode (that is outfan) of M8 is connected to meet end points COM altogether.
6th on-off circuit 36 is similarly coupled to computer heating control end points H and connects between end points COM together, and it is by Nine switch element M9 and the tenth switch element M10 are composed in series and two control ends connect reception respectively and reversely should Warm-up control signal PF-N and this warmable data signal PFD, mainly by this reverse warm-up control signal PF-N And this warmable data signal PFD controls whether the 6th on-off circuit 34 turns on.As this warmable data signal PFD And this reverse warm-up control signal PF-N is when being high potential, the 6th on-off circuit 36 turns on.9th switch element M9 and the tenth switch element M10 all has grid, drain electrode and source electrode, and the grid of the 9th switch element M9 is (also I.e. control end) receive this reverse warm-up control signal PF-N, control the by this reverse warm-up control signal PF-N Whether nine switch element M9 turn on, and the grid (that is controlling end) of the tenth switch element M10 receives this warmable data By this warmable data signal PFD, signal PFD, controls whether the tenth switch element M10 turns on, the 9th switch The drain electrode (that is input) of element M9 is connected to the drain electrode (that is outfan) of second switch element M2, and the 9th The source electrode (that is outfan) of switch element M9 is connected to the drain electrode (that is input) of the tenth switch element M10, The source electrode (that is outfan) of the tenth switch element M10 is connected in and meets end points COM altogether.
As shown in the above description, when this warm-up control signal PF and this warmable data signal PFD be high potential letter Number time, this reverse warm-up control signal PF-N is low-potential signal simultaneously, and therefore the 6th on-off circuit 36 is not Start, and this first on-off circuit 31 outfan output signal controls this second switch circuit and the 4th switch is electric Road conducting running, is sent to this by this second switch circuit by this power supply signal and adds thermal resistance, make this add thermal resistance Part ink and this hydrojet chip are preheated.
When this print data signal and this thermal control signals are high potential signal, this reverse computer heating control simultaneously Signal MF-N is low-potential signal, therefore the 5th on-off circuit 35 not start, and this first on-off circuit 31 Outfan output signal controls this second switch circuit 32 and the conducting running of the 3rd on-off circuit 33, by this This power supply signal is sent to this and adds thermal resistance 371 by two on-off circuits 32, makes this add thermal resistance 371 to part ink Water heats and produces bubble, and then ink is pushed out this jet orifice 228a of this hydrojet chip 223.
Certainly, above-mentioned 3rd switch element M3 to the tenth switch element M10 can be MOS transistor or BJT Transistor, but be not limited, any electronic component that can reach identical mesh ground and effect is the present invention and is protected Scope.
When print module 2 spatterwork to be performed of rapid molding device (not shown), can be by transmitting electricity Source signal P, print data signal PD, thermal control signals MF and warm-up control signal PF are to hydrojet casket The hydrojet control circuit 3 of the hydrojet chip 233 of 22 controls droplet generator 37 and carries out heating or preheating, even if When not printing, it is possible to preheat, reach to keep the effect of hydrojet chip 233 temperature, and then guarantee printed product Matter, and preheating temperature control efficiency promote print speed can also be made to improve.
Please refer to Fig. 9 A, 9B, 9C and 9D, wherein Fig. 9 A is the fast of the present invention the second preferred embodiment The end TV structure schematic diagram of the hydrojet casket of the print module of speed shaped device, Fig. 9 B is the hydrojet casket shown in Fig. 9 A Regarding cross-sectional view on, Fig. 9 C is the cross-sectional view of the D-D ' of the hydrojet casket shown in Fig. 9 A, Fig. 9 D is the cross-sectional view of-E ' of the hydrojet casket shown in Fig. 9 A.As shown in Fig. 9 A and Fig. 9 B, this The structure of the hydrojet casket 42 inventing the print module of another embodiment is also the most similar with previous embodiment, and in The body 421 of hydrojet casket 42 is internal has 3 fluid reservoirs 425,426,427 equally, and in body 421 Bottom is also provided with hydrojet chip 423.But in the present embodiment, multiple feed tanks 424 of hydrojet chip 423 Quantity and previous embodiment slightly difference.In the present embodiment, the quantity of the plurality of feed tank is 3, but not with this It is limited.
And in the present embodiment, as shown in x Fig. 9 B and Figure 10, the wherein storage in the body 421 of hydrojet casket 42 Liquid chamber 425 is in order to house transparent adhesive (T), fluid reservoir 426 in order to accommodating cyan (C) colorant ink, liquid storage Room 427 is in order to accommodating carmetta (M) colorant ink or in order to accommodating black (K) colorant ink, but is not limited, And these three fluid reservoirs 425,426,427 respectively with the hydrojet chip more than 423 being arranged at bottom body 421 Individual feed tank 424 is connected.And from 9B figure collocation Fig. 9 C, fluid reservoir 425 accommodated inside stores Transparent adhesive is by the internal two lateral flows of fluid reservoir 425, to flow to the hydrojet chip bottom body 421 At 423, and it flow at coupled logical middle feed tank 424b export, to carry out the feed flow of transparent adhesive Operation.
As for another two fluid reservoirs 426,427 ink flow mode the most as shown in fig. 9d, it is seen that fluid reservoir 426 Accommodated inside store cyan colorant ink by fluid reservoir 426 to flows, to flow to the spray bottom body 421 At wick-containing sheet 423, and it flow at coupled logical feed tank 424a export, to carry out cyan colorant ink Feed flow operation.Internal structure as another fluid reservoir 427 is identical with fluid reservoir 426 and is symmetrically set, and The mode of its ink flow is all identical with fluid reservoir 426, therefore repeats no more.
Referring to Figure 10, it is the hydrojet of print module of rapid molding device of the present invention the second preferred embodiment The ink configuration schematic diagram of casket.As it can be seen, the hydrojet casket 42 of the present invention can be but be not limited to two hydrojet casket 42X, 42Y, and this hydrojet casket 42X, 42Y be respectively provided with 3 fluid reservoirs 425x, 426x, 427x and 425y, 426y, 427y, in the present embodiment, wherein the fluid reservoir 425x of hydrojet casket 42X is in order to accommodating transparent adhesive, liquid storage Room 426x in order to accommodating cyan (C) colorant ink, fluid reservoir 427x in order to accommodating carmetta (M) colorant ink, And the fluid reservoir 425y of hydrojet casket 42Y is in order to house transparent adhesive, fluid reservoir 426y in order to accommodating yellow (Y) Colorant ink, fluid reservoir 427y are then in order to accommodating black (K) colorant ink, but are not limited.And hydrojet casket Multiple feed tank 424x on hydrojet chip 423x, 423y bottom body 421x of 42X, 42Y, 421y, The most corresponding for 424y fluid reservoir 425x, 426x, 427x and 425y, 426y, 427y are connected, As a example by the present embodiment, the feed tank 424ax of the hydrojet chip 423x of hydrojet casket 42X and fluid reservoir 426x phase Connection, the central feed flow export its cyan colorant ink housed in order to correspondence, being arranged at hydrojet chip 423x Groove 224bx is then connected with fluid reservoir 425x, exports, in order to correspondence, transparent adhesive, the hydrojet core that it is housed The feed tank 424cx of sheet 423x is connected with fluid reservoir 427x, exports its carmetta color housed in order to correspondence Material ink;Feed tank 424ay as the hydrojet chip 423y of hydrojet casket 42Y is then connected with fluid reservoir 426y Logical, the central feed tank export its yellow colorant ink housed in order to correspondence, being arranged at hydrojet chip 423y 424by is then connected with fluid reservoir 425y, exports, in order to correspondence, transparent adhesive, the hydrojet that it is housed equally The feed tank 424cy of chip 423y is then connected with fluid reservoir 427y, exports its black housed in order to correspondence Colorant ink.Consequently, it is possible to house not through in hydrojet casket 42X, 42Y of the two modularitys settings of the present embodiment The spray printing liquid such as homochromy colour, black pigment ink and adhesive, then can implement 3D thing to rapid molding device The polychrome spatterwork of part rapid shaping.
In this second preferred embodiment, this hydrojet chip 223 can account for the total face of hydrojet chip 223 by layout area Long-pending ratio can be calculated by following equation:
((hydrojet chip 223 gross area)-(feed tank 224 not layout area))/(hydrojet chip 223 gross area)
In this second preferred embodiment, this hydrojet chip 223 is arranged with 3 feed tanks 224, and this ratio is i.e. For ((hydrojet chip 223 length Ld2 × hydrojet chip 223 width Wd2)-(feed tank 224 length Ls2 × confession Liquid bath 224 width S d2 × 3 group feed tank 224))/(spray hydrojet chip 223 length Ld2 × hydrojet chip 223 Width Wd2).
Owing to the width Wd2 of hydrojet chip 223 is about 5 millimeters (mm), length Ld2 is about 15.4 millimeters (mm), The gross area is 77 square millimeters of (mm2), and a length of 12.8 millimeters (mm) of feed tank 224, width Be 0.15 millimeter (mm), then the area of the wiring area of hydrojet chip 223 is 71.24 square millimeters of (77-12.8 × 0.15 × 3), therefore hydrojet chip 223 can layout area to account for the ratio of hydrojet chip 223 gross area be 71.24 Square millimeter/77 square millimeters=92.51%.
Owing to the width Wd2 of hydrojet chip 223 is about 5 millimeters (mm), length Ld2 is about 15.4 millimeters (mm), The gross area is 77 square millimeters of (mm2), and a length of 12.8 millimeters (mm) of feed tank 224, width Be 0.3 millimeter (mm), then the area of the wiring area of hydrojet chip 223 is 65.48 square millimeters of (77-12.8 × 0.3 × 3), therefore hydrojet chip 223 can layout area to account for the ratio of hydrojet chip 223 gross area be 65.48 flat Square millimeter/77 square millimeter=85.03%, this is minimum wiring area ratio.
Owing to the width Wd2 of hydrojet chip 223 is about 7 millimeters (mm), length Ld2 is about 15.4 millimeters (mm), The gross area is 107.8 square millimeters of (mm2), and a length of 12.8 millimeters (mm) of feed tank 224, wide Degree is 0.15 millimeter (mm), then the area of the wiring area of hydrojet chip 223 is 102.04 square millimeter (107.8 -12.8 × 0.15 × 3), therefore hydrojet chip 223 can account for the ratio of hydrojet chip 223 gross area and be by layout area 102.04 square millimeters/107.8 square millimeters=94.65%, this is maximum layout area ratio.
Owing to the width Wd2 of hydrojet chip 223 is about 7 millimeters (mm), length Ld2 is about 15.4 millimeters (mm), The gross area is 107.8 square millimeters of (mm2), and a length of 12.8 millimeters (mm) of feed tank 224, wide Degree is 0.3 millimeter (mm), then the area of the wiring area of hydrojet chip 223 is 96.28 square millimeters of (107.8- 12.8 × 0.3 × 3), therefore hydrojet chip 223 can layout area to account for the ratio of hydrojet chip 223 gross area be 96.28 Square millimeter/107.8 square millimeters=89.31%.
From the foregoing, the present embodiment hydrojet chip 223 can account for hydrojet core by layout area with three feed tanks 224 The optimum ratio of sheet 223 gross area is 85.03%~94.65%.
Certainly, in aforementioned all embodiments, the internal spray printing liquid stored of the plurality of hydrojet casket 22,42 is equal Can pass through an external pipeline (not shown) with the continuous liquid supply device (not shown) with the rapid molding device of the present invention It is connected, to constitute a continuous liquid supply system.
In sum, the rapid molding device of the present invention is by arranging modular hydrojet casket in print module, often One hydrojet casket possesses three fluid reservoirs, and wherein two fluid reservoirs in order to the most homochromy accommodating ink, a fluid reservoir in order to Accommodating adhesive, and match corresponding hydrojet chip and hydrojet control circuit thereof, and then rapid shaping can be implemented The operation of polychrome spray printing, and the design of original print module need not be changed, thereby to reach to beat without extra change The design of impression block, the volume of original print module can be maintained, more can reduce and print the effect of cost.
The present invention can by know this skilled worker appoint execute craftsman think and be all as modify, the most de-apply for a patent as the most attached Scope is intended to protect.

Claims (6)

1. a print module for rapid molding device, comprises:
One spray printing platform, has a support body and a power transmission shaft, and this power transmission shaft is located on this support body;
One load bearing seat, is arranged on this power transmission shaft;And
The hydrojet casket of at least two identical molds massing, is correspondingly arranged on this load bearing seat, and wherein this hydrojet casket has one Body, is provided with three fluid reservoirs in this body, in order to house different spray printing liquid respectively, and this at least two phase With the accommodating at least identical spray printing liquid of this body of modular hydrojet casket, to implement the spray of rapid shaping Print operation.
2. the print module of rapid molding device as claimed in claim 1, it is characterised in that this fluid reservoir holds This spray printing liquid put is an adhesive, and this difference spray printing liquid that this fluid reservoir of another two houses is colorant ink.
3. the print module of rapid molding device as claimed in claim 2, it is characterised in that this hydrojet casket is more It is further provided with an identification chip, electric with spray printing casket is carried out between status identification monitoring and rapid molding device Signal communication.
4. the print module of the rapid molding device described in claim 2, it is characterised in that the bottom of this body It is provided with a hydrojet chip, this hydrojet chip has multiple feed tank, and this feed tank each respectively should with corresponding Fluid reservoir is connected.
5. the print module of rapid molding device as claimed in claim 4, it is characterised in that the plurality of feed flow The quantity of groove is 4, and 2 these feed tanks share one fluid reservoir of connection, and other 2 these feed tanks are the most right Another fluid reservoir should be connected.
6. the print module of rapid molding device as claimed in claim 4, it is characterised in that the plurality of feed flow The quantity of groove is 3, respectively one fluid reservoir of correspondence connection.
CN201510022740.XA 2015-01-16 2015-01-16 Printing module of rapid prototyping device Pending CN105835359A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375874B1 (en) * 1996-12-20 2002-04-23 Z Corporation Method and apparatus for prototyping a three-dimensional object
CN201685457U (en) * 2010-06-02 2010-12-29 研能科技股份有限公司 Stereoscopic forming mechanism
EP1385704B1 (en) * 2001-05-08 2011-11-16 Z Corporation Method and computer-readable medium for rapid prototyping a three-dimensional object
CN102371776A (en) * 2010-08-16 2012-03-14 研能科技股份有限公司 Spray printing module suitable for three-dimensional forming mechanism

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375874B1 (en) * 1996-12-20 2002-04-23 Z Corporation Method and apparatus for prototyping a three-dimensional object
EP1385704B1 (en) * 2001-05-08 2011-11-16 Z Corporation Method and computer-readable medium for rapid prototyping a three-dimensional object
CN201685457U (en) * 2010-06-02 2010-12-29 研能科技股份有限公司 Stereoscopic forming mechanism
CN102371776A (en) * 2010-08-16 2012-03-14 研能科技股份有限公司 Spray printing module suitable for three-dimensional forming mechanism

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