CN105611804A - Heat conducting pad, heat radiator and electronic product - Google Patents
Heat conducting pad, heat radiator and electronic product Download PDFInfo
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- CN105611804A CN105611804A CN201511025383.9A CN201511025383A CN105611804A CN 105611804 A CN105611804 A CN 105611804A CN 201511025383 A CN201511025383 A CN 201511025383A CN 105611804 A CN105611804 A CN 105611804A
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- Prior art keywords
- heat
- conducting plate
- conducting
- conductive pad
- plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Abstract
The invention discloses a heat conducting pad. The heat conducting pad comprises a first heat conducting plate, a second heat conducting plate and a plurality of heat conducting pieces, wherein the heat conducting pieces are clamped between the first heat conducting plate and the second heat conducting plate which are arranged opposite to each other in an overlapped manner; and the heat conducting pieces are arranged independently from one another and a plurality of parallel heat conducting paths are formed, so that the conduction of heat energy between the first heat conducting plate and the second heat conducting plate is realized. The invention also discloses a heat radiator and an electronic product comprising the heat conducting pad. The heat conducting pad disclosed by the invention is high in heat resistance and heat-conducting property, and can meet the heat radiating requirement of high-power chips.
Description
Technical field
The present invention relates to the heat dissipation technology field of electronic product, particularly heat conductive pad structure.
Background technology
In electronic radiation field, in the time that different chips use same radiator, due to the height of different chipsExist inconsistently, can cause the different chips can not be simultaneously and radiator plane contact. High in order to solve by chipSpend tolerance inconsistent and height that cause, often between chip and radiator, be added with certain elasticity and thickThe heat conductive pad (or thermally conductive gel) of degree absorbs tolerance.
The capacity of heat transmission of current common heat conductive pad or thermally conductive gel is limited, and common heat conductive pad is generally at low-power deviceOn part, use, for high power device, the temperature difference causing with common heat conductive pad is too large, is to satisfy the demands. Existing conventional heat conductive pad thermal conductivity factor is generally 2w/m DEG C of left and right, for 40mm*40mm*3mm'sCommon heat conductive pad, thermal resistance is probably: R=0.67 DEG C/w. The chip that is 100w for a power P, supposes100w heat is all by common heat conductive pad, and the temperature rise that heat conductive pad causes is probably: Δ T=67 DEG C. SoHigh temperature rise, for electronic radiation field, unacceptable often.
Summary of the invention
The invention provides heat conductive pad and radiator that a kind of capacity of heat transmission is high, can meet the loose of high-power chipHeat demand.
To achieve these goals, embodiment of the present invention provides following technical scheme:
First aspect, the invention provides a kind of heat conductive pad, and described heat conductive pad comprises that the first heat-conducting plate, second leadsHot plate and multiple conducting strip, described multiple conducting strips are located in described the first heat conduction that is laminated to each other and is oppositely arrangedBetween plate and described the second heat-conducting plate, and described multiple conducting strip is arranged independently of one another and forms multiple parallel connectionsThermally conductive pathways, conducts between described the first heat-conducting plate and described the second heat-conducting plate to realize heat energy.
In the possible embodiment of the first of first aspect, described the first heat-conducting plate, described the second heat conductionThe material of plate and described multiple conducting strips is metal or the non-metallic material with the capacity of heat transmission.
In conjunction with the possible embodiment of the first of first aspect, in the possible enforcement of the second of first aspectIn mode, each described conducting strip includes kink and is positioned at the first end and second at described kink two endsEnd, described first end is connected to described the first heat-conducting plate, and described the second end is connected to described the second heat-conducting plate,Described kink tool elastic deformability, to regulate between described the first heat-conducting plate and described the second heat-conducting plateVertical range.
In conjunction with the possible embodiment of the second of first aspect, in the third possible enforcement of first aspectIn mode, described kink is " C " shape or " < " shape or serpentine or " O shape " or " ZShape ".
In conjunction with the possible embodiment of the second of first aspect, in the 4th kind of possible enforcement of first aspectIn mode, described heat conduction is paid somebody's debt and expected repayment later and is comprised limited post, and one end of described limited post is connected to described the first heat-conducting plateIn the face of the surface of described the second heat-conducting plate, shape between the other end of described limited post and described the second heat-conducting plateAt interval.
In conjunction with the 4th kind of possible embodiment of first aspect, in the 5th kind of possible enforcement of first aspectIn mode, described the first heat-conducting plate is parallel to described the second heat-conducting plate, and described limited post is perpendicular to described firstHeat-conducting plate.
In conjunction with above-mentioned any one the possible embodiment of first aspect, possible the 6th kind of first aspectIn embodiment, described conducting strip is laminar, and the thickness of described conducting strip is less than or equal to 0.2mm.
Second aspect, the invention provides a kind of radiator, and described radiator comprises the heat conduction described in first aspectPad and radiating fin, described radiating fin is connected in deviating from of described the second heat-conducting plate described the first heat-conducting plateOne side.
In the possible embodiment of the first of second aspect, described radiating fin and described the second heat-conducting plateThe structure being formed in one.
The third aspect, the invention provides a kind of electronic product, and described electronic product comprises circuit board, is located at instituteState the euthermic chip on circuit board and the radiator as described in second aspect, described first of described radiator is ledHot plate directly contacts with described euthermic chip, or described the first heat-conducting plate and the described heating of described radiatorBetween chip, fill heat-conducting medium.
Heat conductive pad provided by the invention, is located in the institute that is laminated to each other and is oppositely arranged by described multiple conducting stripsState between the first heat-conducting plate and described the second heat-conducting plate, form the thermally conductive pathways of multiple parallel connections, to realize heat energyBetween described the first heat-conducting plate and described the second heat-conducting plate, conduct. The thermally conductive pathways of multiple parallel connections is independent of one another,That is, the thermal dissipating path for being mutually independent between multiple conducting strips, such framework in parallel, has reduced wholeThe thermal resistance of body heat conductive pad, thus realize dynamical heat-conducting effect.
Brief description of the drawings
In order to be illustrated more clearly in technical scheme of the present invention, below by required use in embodimentAccompanying drawing is briefly described, and apparently, the accompanying drawing in the following describes is only enforcements more of the present inventionMode, for those of ordinary skill in the art, not paying under the prerequisite of creative work, all rightAs these accompanying drawings obtain other accompanying drawing.
The schematic diagram of the heat conductive pad that Fig. 1 provides for one embodiment of the present invention.
Fig. 2 is the local enlarged diagram of the heat conductive pad shown in Fig. 1.
The thermal resistance distribution schematic diagram of the heat conductive pad that Fig. 3 provides for one embodiment of the present invention.
Heat between heat conductive pad and the euthermic chip of electronic product that Fig. 4 provides for one embodiment of the present inventionConduction side schematic view.
Fig. 5 is the heat conduction elevational schematic view between the heat conductive pad shown in Fig. 4 and the euthermic chip of electronic product.
Heat conduction schematic diagram in the electronic product that Fig. 6 provides for one embodiment of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is enteredRow is described clearly and completely.
Refer to Fig. 1 and Fig. 2, the invention provides a kind of heat conductive pad, described heat conductive pad comprises the first heat-conducting plate12, the second heat-conducting plate 14 and multiple conducting strip 16, described multiple conducting strips 16 are located in and are laminated to each other relativelyBetween described the first heat-conducting plate 12 and described the second heat-conducting plate 14 arranging, and described multiple conducting strip 16 thatThis independently arranges and forms the thermally conductive pathways of multiple parallel connections, to realize heat energy in described the first heat-conducting plate 12 and instituteState conduction between the second heat-conducting plate 14.
The material of described the first heat-conducting plate 12, described the second heat-conducting plate 14 and described multiple conducting strip 16 is goldBelong to or have the non-metallic material (for example graphite) of the capacity of heat transmission. Described multiple conducting strip 16 can be by oneMetal or various metals, or the nonmetal of other high heat-conducting system combines.
Particularly, each described conducting strip 16 includes kink 166 and is positioned at 166 liang of described kinksFirst end 162 and second end 164 of end. Described first end 162 is connected to described the first heat-conducting plate 12, instituteState the second end 164 and be connected to described the second heat-conducting plate 14. Can between first end 162 and the first heat-conducting plate 12Fix by welding, bonding mode, also can on the first heat-conducting plate 12, jack be set, by first end 162Snap in jack to realize being fixedly connected with of first end 162 and the first heat-conducting plate 12, the second end 164 and secondConnected mode between heat-conducting plate 14 can be with reference to the fixing side between first end 162 and the first heat-conducting plate 12Formula. In a kind of embodiment, first end 162 can be fixedly attached to the first heat-conducting plate 12, the second ends 164Directly contact and be mounted in electronic product with the second heat-conducting plate 14, that is to say, the second end 164 and second is ledBetween hot plate 14 without fixed connection structure, further by heat conductive pad being arranged on to the circuit board in electronic productOn euthermic chip and radiator between, by being fixedly connected with of radiator and circuit board, realize the second end 164And the location between the second heat-conducting plate 14. Or, the second end 164 is fixedly attached to the second heat-conducting plate 14,And between first end 162 and the first heat-conducting plate 12 without fixed connection structure, concrete locate mode is the same.
Described kink 166 tool elastic deformabilities, to regulate described the first heat-conducting plate 12 and described second to leadVertical range between hot plate 14. When heat conductive pad is arranged in electronic product, the first heat-conducting plate 12 andBetween two heat-conducting plates 14, be stressed mutually close, make the kink 166 of conducting strip 16 that strain occur.Such design, can adjust the size of heat conductive pad, that is to say the first heat-conducting plate 12 and the second heat conductionBetween plate 14, distance is variable, is arranged in electronic product, can be adjustable by the size of heat conductive pad, noBut can absorb location tolerance, can also improve heat conductive pad applicability, can be used in multiple different electronic productIn, can make heat conductive pad be applicable to the situation of high tolerance by larger-size conducting strip 16.
Particularly, described kink 166 is " C " shape or " < " shape or serpentine or " OShape " or " Z-shaped ", or other irregular shape.
Described heat conduction is paid somebody's debt and expected repayment later and is comprised that limited post 18, one end of described limited post 18 are connected to described the first heat-conducting plate12 surface, the other end of described limited post 18 and described the second heat conduction in the face of described the second heat-conducting plate 14Between plate 14, form interval. In a kind of embodiment, described the first heat-conducting plate 12 is parallel to described second leadsHot plate 14, described limited post 18 is perpendicular to described the first heat-conducting plate 12. Limited post 18 is rigidity, for anti-Stop in the stressed larger situation of heat conductive pad, to such an extent as to the pressure that heat conductive pad bears exceedes the bullet of conducting strip 16Property deformation limit, causes conducting strip 16 cannot add bullet or damaged. In present embodiment, conducting strip 16 isThe structure of metal spring leaf, described conducting strip 16 is laminar, and the thickness of described conducting strip 16 is less than or equal to0.2mm。
Heat conductive pad provided by the invention, is located in to be laminated to each other by described multiple conducting strips 16 and is oppositely arrangedBetween described the first heat-conducting plate 12 and described the second heat-conducting plate 14, form the thermally conductive pathways of multiple parallel connections, withRealize heat energy conducts between described the first heat-conducting plate 12 and described the second heat-conducting plate 14. Leading of multiple parallel connectionsHot path is independent of one another, that is, the thermal dissipating path for being mutually independent between multiple conducting strips 16, suchFramework in parallel, has reduced the thermal resistance of overall heat conductive pad, thereby has realized dynamical heat-conducting effect.
Refer to Fig. 3, be depicted as the thermal resistance distribution map of heat conductive pad of the present invention, RupBe the heat of the second heat-conducting plate 14Resistance, RbotBe the thermal resistance of the first heat-conducting plate 12, R1、R2、…RnFor the thermal resistance of conducting strip 16. VisibleBetween one heat-conducting plate 12 and the second heat-conducting plate 14, are the relations of connecting with the thermal resistance of conducting strip 16, all leadsThe thermal resistance of backing 16 is relations in parallel. The first heat-conducting plate 12 and the second heat-conducting plate 14 are metallic plate, thermal resistanceLittle. The entire thermal resistance of heat conductive pad is mainly made up of the thermal resistance of conducting strip 16.
Refer to Fig. 4 to Fig. 6, the direction of arrow in figure all represents the direction that heat energy distributes. The invention provides onePlant radiator, radiator comprises described heat conductive pad and radiating fin 19, and described radiating fin 19 is connected in instituteState a side of described the first heat-conducting plate 12 of deviating from of the second heat-conducting plate 14. That is to say the first heat-conducting plate 12For contacting with euthermic chip. Described radiating fin 19 is formed in one with described the second heat-conducting plate 14Structure, in other words, the second heat-conducting plate 14 can be used as the base plate of radiating fin 19, integrated structureElectronic product is more prone in the process of assembling.
Figure 6 shows that heat conductive pad is in electronic product under use state, heat conduction path. Described electronicsProduct comprises circuit board P, is located at euthermic chip C and radiator on described circuit board P, and radiator comprisesHeat conductive pad and radiating fin 19. The first heat-conducting plate 12 directly contacts with described euthermic chip C, or described looseBetween described first heat-conducting plate 12 of hot device and described euthermic chip C, fill heat-conducting medium. The second heat-conducting plate 14In the situation of radiating fin 19 structure that is separate type, between the two, also can fill heat-conducting medium. Heat conductionMedium can be the Heat Conduction Materials such as heat-conducting silicone grease, and being filled with of heat-conducting medium is beneficial to and between element, is in contact with one another shapeThe thermal resistance becoming.
As shown in Figure 4 and Figure 5, the first heat-conducting plate 12 is than in the large situation of euthermic chip C area, and first leadsHot plate 12 can be by the heat energy horizontal proliferation of euthermic chip C. As shown in Figure 6, the heat generating core on circuit board PThe heat energy that sheet C dispels the heat is passed to the conducting strip 16, second of described the first heat-conducting plate 12, multiple parallel connections successivelyHeat-conducting plate 14 and radiating fin 19. Final heat energy is dispelled the heat by radiating fin 19.
Taking the typical structure of 40mm*40mm*3mm as example. The first heat-conducting plate 12 and the second heat-conducting plate 14For the thick copper coin of 0.5mm, intermediate thermal conductivity sheet 16 is the thick copper sheet of 0.1mm, conducting strip 16 number 40PCS. LogicalCross calculating, the thermal resistance of the first heat-conducting plate 12 and the second heat-conducting plate 14 is Rup＝Rbot=0.0008 DEG C/w. Middle 1The thermal resistance of individual conducting strip 16 is R1=2.63 DEG C/w, after 40 conducting strips 16 are in parallel, thermal resistance is: Rt＝0.066℃/ w. Heat conductive pad entire thermal resistance is so: R=0.07 DEG C/W. The euthermic chip that is 100w for a power P,Suppose that 100w heat is all by heat conductive pad, the temperature rise that heat conductive pad causes is: Δ T=7 DEG C. Visible, thisThe temperature rise of invention heat conductive pad is starkly lower than the temperature rise of the heat conductive pad of prior art.
The above is the preferred embodiment of the present invention, it should be pointed out that the common skill for the artArt personnel, under the premise without departing from the principles of the invention, can also make some improvements and modifications, thisA little improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a heat conductive pad, is characterized in that, described heat conductive pad comprise the first heat-conducting plate, the second heat-conducting plate andMultiple conducting strips, described multiple conducting strips are located in described the first heat-conducting plate and the institute that are laminated to each other and are oppositely arrangedState between the second heat-conducting plate, and described multiple conducting strip is arranged independently of one another and forms the heat conduction road of multiple parallel connectionsFootpath, conducts between described the first heat-conducting plate and described the second heat-conducting plate to realize heat energy.
2. heat conductive pad as claimed in claim 1, is characterized in that, described the first heat-conducting plate, described secondThe material of heat-conducting plate and described multiple conducting strips is metal or the non-metallic material with the capacity of heat transmission.
3. heat conductive pad as claimed in claim 2, is characterized in that, each described conducting strip includes bendingPortion and be positioned at first end and second end at described kink two ends, described first end is connected to described the first heat conductionPlate, described the second end is connected to described the second heat-conducting plate, and described kink tool elastic deformability, to regulateVertical range between described the first heat-conducting plate and described the second heat-conducting plate.
4. heat conductive pad as claimed in claim 3, is characterized in that, described kink is " C " shape or " < "Shape or serpentine or " O shape " or " Z-shaped ".
5. heat conductive pad as claimed in claim 3, is characterized in that, described heat conduction is paid somebody's debt and expected repayment later and comprised limited post,One end of described limited post is connected to the surface in the face of described the second heat-conducting plate of described the first heat-conducting plate, described inBetween the other end of limited post and described the second heat-conducting plate, form interval.
6. heat conductive pad as claimed in claim 5, is characterized in that, described in described the first heat-conducting plate is parallel toThe second heat-conducting plate, described limited post is perpendicular to described the first heat-conducting plate.
7. the heat conductive pad as described in claim 1-6 any one, is characterized in that, described conducting strip is thin sliceShape, and the thickness of described conducting strip is less than or equal to 0.2mm.
8. a radiator, is characterized in that, described radiator comprises as described in claim 1-7 any oneHeat conductive pad and radiating fin, described radiating fin is connected in deviating from of described the second heat-conducting plate described first and leadsOne side of hot plate.
9. radiator as claimed in claim 8, is characterized in that, described radiating fin and described second is ledThe structure that hot plate is formed in one.
10. an electronic product, is characterized in that, described electronic product comprises circuit board, is located at described electricityEuthermic chip on the plate of road and the radiator as described in claim 8-9 any one, described in described radiatorThe first heat-conducting plate directly contacts with described euthermic chip, or described the first heat-conducting plate and the institute of described radiatorState and between euthermic chip, fill heat-conducting medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025383.9A CN105611804B (en) | 2015-12-30 | 2015-12-30 | Heat conductive pad, radiator and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025383.9A CN105611804B (en) | 2015-12-30 | 2015-12-30 | Heat conductive pad, radiator and electronic product |
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| Publication Number | Publication Date |
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| CN105611804A true CN105611804A (en) | 2016-05-25 |
| CN105611804B CN105611804B (en) | 2019-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201511025383.9A Expired - Fee Related CN105611804B (en) | 2015-12-30 | 2015-12-30 | Heat conductive pad, radiator and electronic product |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107191816A (en) * | 2017-05-17 | 2017-09-22 | 华为技术有限公司 | A kind of optical module radiator structure and wireless telecommunications system |
| CN107263041A (en) * | 2017-08-23 | 2017-10-20 | 柳州市二和汽车零部件有限公司 | The processing method of vehicle radiating fin |
| CN108521753A (en) * | 2018-07-13 | 2018-09-11 | 安徽皖通邮电股份有限公司 | A kind of conductive structure for realizing high-efficiency heat conduction function |
| CN111373850A (en) * | 2017-11-21 | 2020-07-03 | 赛峰电子与防务公司 | Power module |
| CN113453418A (en) * | 2021-06-28 | 2021-09-28 | 浙江挚领科技有限公司 | Heat conduction device and manufacturing method thereof |
| WO2022222642A1 (en) * | 2021-04-19 | 2022-10-27 | 中兴通讯股份有限公司 | Thermal bridge and electronic device |
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| JPH0864731A (en) * | 1994-08-19 | 1996-03-08 | Hitachi Ltd | Heat conducting member and cooler and electronic apparatus employing the same |
| US20020159236A1 (en) * | 2000-06-02 | 2002-10-31 | Kabushiki Kaisha Toshiba | Structure and method for constructing circuit module suitable for hand-held electronic equipment |
| CN101331818A (en) * | 2006-04-24 | 2008-12-24 | 住友电气工业株式会社 | Heat transfer member, protruding structural member, electronic device, and electric product |
| CN101989584A (en) * | 2009-07-31 | 2011-03-23 | 国际商业机器公司 | Method for increasing the thermal coupling heat radiation and reliability of a cooling module |
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2015
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Patent Citations (5)
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| US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
| JPH0864731A (en) * | 1994-08-19 | 1996-03-08 | Hitachi Ltd | Heat conducting member and cooler and electronic apparatus employing the same |
| US20020159236A1 (en) * | 2000-06-02 | 2002-10-31 | Kabushiki Kaisha Toshiba | Structure and method for constructing circuit module suitable for hand-held electronic equipment |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107191816A (en) * | 2017-05-17 | 2017-09-22 | 华为技术有限公司 | A kind of optical module radiator structure and wireless telecommunications system |
| CN107191816B (en) * | 2017-05-17 | 2019-02-19 | 华为技术有限公司 | A kind of optical module radiator structure and wireless telecommunications system |
| CN107263041A (en) * | 2017-08-23 | 2017-10-20 | 柳州市二和汽车零部件有限公司 | The processing method of vehicle radiating fin |
| CN111373850A (en) * | 2017-11-21 | 2020-07-03 | 赛峰电子与防务公司 | Power module |
| CN108521753A (en) * | 2018-07-13 | 2018-09-11 | 安徽皖通邮电股份有限公司 | A kind of conductive structure for realizing high-efficiency heat conduction function |
| WO2022222642A1 (en) * | 2021-04-19 | 2022-10-27 | 中兴通讯股份有限公司 | Thermal bridge and electronic device |
| CN113453418A (en) * | 2021-06-28 | 2021-09-28 | 浙江挚领科技有限公司 | Heat conduction device and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN105611804B (en) | 2019-02-26 |
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