CN105472898A - Manufacturing method of circuit substrate with ultrafine metal line and structure thereof - Google Patents
Manufacturing method of circuit substrate with ultrafine metal line and structure thereof Download PDFInfo
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- CN105472898A CN105472898A CN201410458035.XA CN201410458035A CN105472898A CN 105472898 A CN105472898 A CN 105472898A CN 201410458035 A CN201410458035 A CN 201410458035A CN 105472898 A CN105472898 A CN 105472898A
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Abstract
The invention relates to a manufacturing method comprising the steps that a conductive motherboard is provided; a shielding layer on which line pattern holes are formed is arranged on the conductive motherboard; conductive electrodes are arranged in the holes so as to form a conductive layer together through arrangement; a substrate of which the surface is provided with an adhesive layer is provided, and the adhesive layer is adhered on the conductive layer and the shielding layer; and the substrate, the adhesive layer and the conductive layer are separated from the shielding layer and the conductive motherboard so that a circuit substrate. Electroforming of the completely designed metal line patterns is performed by using the reusable conductive motherboard, and the metal line patterns are transferred to be fixedly arranged on the substrate from the conductive motherboard in an adhesive manner so that the manufacturing process of the whole circuit substrate is enabled to be simplified and production is convenient, and percent of pass of manufacturing of ultrafine lines can be greatly enhanced.
Description
Technical field
The present invention relates to a kind of method of shop drawings patterning metallic circuit on circuit substrate, refer to especially a kind of on circuit substrate shaping live width be the very fine wire circuit manufacturing method of 0.5 μm ~ 20 μm.
Background technology
Refer to shown in Fig. 1, the flexible wire base board on traditional very fine wire road mainly adopts the method deducting making, and its step comprises: the metal providing a surface to have metal oxide layer 11 carries paper tinsel 10; Metal oxide layer 11 is electroplated a kind of sublayer 12; And form a soft organic insulating material layer 13 in Seed Layer 12, and on soft organic insulating material layer 13, attach the flexual back sheet 14 of a tool; Metal is carried paper tinsel 10 to tear off from Seed Layer 12 connecting interface; Finally in Seed Layer 12, form a patterned circuit 15.
Wherein the mode of patterned circuit 15 is: with Seed Layer 12 for seed electroplates a circuit metal level 16; Circuit metal level 16 is formed the photoresist 17 of a patterning; With the photoresist 17 of patterning for mask, circuit etching metal level 16 and Seed Layer 12 form patterned circuit 15; Remove the photoresist 17 of patterning again.
But, Wet-type etching is a kind of iso effect (Isotropic), the photoresist 17 of patterning belongs to a kind of etch resistant material again, it causes the etch-rate gap for etching liquid between photoresist 17 and circuit metal level 16 very large, therefore, when etching solution carry out longitudinal direction etch time, often cause circuit metal level 16 that serious side etching phenomenon occurs.
Very fine wire road is made owing to adopting etching mode, by causing, the etching total area ratio of circuit metal level 16 is excessive, and the uneven impedance value that will cause in etching local is too large, also can there is broken string situation in severe patient, cause qualification rate and the quality not easily management and control of the circuit substrate produced.
Summary of the invention
Main purpose of the present invention is to provide a kind of circuit substrate manufacturing method with very fine wire road, the electroforming of model mode is adopted to produce the metallic circuit pattern designed, and by metallic circuit pattern to be indirectly posted or directly adhesive means is fixedly arranged on substrate, make the processing procedure of whole circuit substrate simplify convenient production, and significantly can promote the qualification rate of superfine circuit making.
Secondary objective of the present invention is that the model conductive electrode on substrate is by direct pressing with a mucigel, cause the contact area of pasting between conductive electrode and mucigel to increase, avoid the circuit of conductive electrode in manufacturing process to peel off causing the problem of production qualification rate.
For reaching above-mentioned purpose, circuit substrate manufacturing method of the present invention is divided into the first kind of way that is directly molded on substrate and an indirect branch to the second way of substrate, and is mainly applied in electronic circuit board or touch control electrode design.
First, in the first manufacture method, it comprises following steps: provide a conduction motherboard; On above-mentioned conduction motherboard, arrange a shielding layer, above-mentioned shielding layer has the pothole of a plurality of formation line pattern; Plural pothole in above-mentioned shielding layer forms a conductive electrode respectively, and forms a conductive layer by complex conduction electrode Common arrangements; There is provided a surface to have the substrate of mucigel, and above-mentioned mucigel is sticked in above-mentioned conductive layer and shielding layer; Aforesaid substrate, adhesive-layer and conductive layer three are formed a circuit substrate by above-mentioned shielding layer with conduction motherboard is separated.
Moreover in the second manufacture method, it comprises following steps: provide a conduction motherboard; On above-mentioned conduction motherboard, arrange a shielding layer, above-mentioned shielding layer has the pothole of a formation line pattern; Plural pothole in above-mentioned shielding layer forms a conductive electrode respectively, and forms a conductive layer by complex conduction electrode Common arrangements; One transfer film carrier is provided, and above-mentioned transfer film carrier is sticked in above-mentioned conductive layer and shielding layer; Above-mentioned transfer film carrier and conductive layer are peeled off jointly by above-mentioned shielding layer and conduction master surface; A surface is provided to have the substrate of mucigel, and by the cemented above-mentioned conductive layer of above-mentioned mucigel; Aforesaid substrate, adhesive-layer and conductive layer three are separated by above-mentioned transfer film carrier and form a circuit substrate.
In aforementioned two manufacture methods, the present invention is conducted electricity master surface and can be carried out Passivation Treatment and form an easy stripper surface, the then strength reducing above-mentioned conductive layer and conduct electricity between motherboard, facilitates follow-uply to carry out lift-off processing.
In the first possible embodiments, above-mentioned conductive electrode fills up above-mentioned pothole by a conductive part, and local exposes to above-mentioned pothole.
In the second possible embodiments, above-mentioned conductive electrode sequentially forms a function part, a conductive part and another function part in above-mentioned pothole.
In the 3rd possible embodiments, above-mentioned conduction motherboard is provided with a groove further in the above-mentioned pothole position of correspondence; Wherein, above-mentioned conductive electrode forms a function part prior to above-mentioned groove vicinity, and forms a conductive part in above-mentioned pothole and groove, forms another function part more subsequently in above-mentioned pothole; Above-mentioned two function parts can by weatherable materials, extinction material, help wlding material or half-light material to form.
In the 4th preferred embodiment, above-mentioned conductive electrode also can form a function part prior to above-mentioned groove vicinity, and forms a conductive part in above-mentioned inside grooves, forms another function part more subsequently in above-mentioned pothole.
In addition, circuit board structure of the present invention is mainly made up of a substrate, a mucigel and a conductive layer, above-mentioned mucigel is layed in aforesaid substrate surface, and above-mentioned conductive layer forms a line pattern by complex conduction electrode arrangement, above-mentioned line pattern is installed with in above-mentioned mucigel surface, make the local thickness of each conductive electrode inwardly concave cemented by above-mentioned mucigel surface, increase the contact area between above-mentioned conductive electrode and mucigel.
Wherein, above-mentioned mucigel is made up of the flexible material of an energy pressurized generation deformation, and above-mentioned flexible material will solidify to form a hard material after having pasted.And the conductive electrode width of above-mentioned conductive layer is between 0.5 μm ~ 20 μm.
In a preferred embodiment, above-mentioned conductive electrode has the Part II that a Part I and being positioned at above-mentioned mucigel inside protrudes from above-mentioned mucigel, and the width of above-mentioned first part is more than or equal to above-mentioned Part II.
In addition, above-mentioned conductive electrode comprises a conductive part and at least one function part being arranged at above-mentioned conductive part surface.Wherein, above-mentioned functions portion can be arranged at top, the two sides, the end of above-mentioned conductive part, also or be coated on the surrounded surface of above-mentioned conductive part.
Because tack strength is the extremely important factor that the superfine circuit of impact makes qualification rate, therefore, the present invention adopts the model mode of conduction motherboard, metallic circuit pattern is produced in the electroforming of conduction master surface, and conduction motherboard and metallic circuit pattern are directly attached on substrate, or be indirectly attached on substrate through a transfer film carrier, metallic circuit pattern again on substrate is directly pressed on mucigel, the contact area of pasting between conductive electrode and mucigel is caused to increase, avoid the circuit of conductive electrode in manufacturing process to peel off causing the problem of production qualification rate, in addition, the processing procedure of whole circuit substrate significantly simplifies convenient manufacturing, and significantly can promote the qualification rate of superfine circuit making.
Accompanying drawing explanation
Fig. 1 is the flow chart that known turning property circuit base plate manufactures;
Fig. 2 is the flow chart of circuit substrate manufacturing method first embodiment of the present invention;
Fig. 3 is the sectional schematic diagram of each flow process of Fig. 2 first manufacture method;
Fig. 4 is the flow chart of circuit substrate manufacturing method second embodiment of the present invention;
Fig. 5 is the sectional schematic diagram of each flow process of Fig. 4 second manufacture method;
Fig. 6 is the step schematic diagram that the present invention makes the first pattern conductive electrode;
Fig. 7 is the step schematic diagram that the present invention makes the second pattern conductive electrode;
Fig. 8 is the step schematic diagram that the present invention makes the 3rd pattern conductive electrode;
Fig. 9 is the cross-section structure of circuit substrate of the present invention;
Figure 10 A ~ 10D is that metallic circuit of the present invention adopts the different sectional schematic diagram implementing pattern;
Figure 11 A ~ 11C is the sectional schematic diagram being respectively equipped with different pattern function part outside metallic circuit of the present invention.
Description of reference numerals: 10-metal carries paper tinsel; 11-metal oxide layer; 12-Seed Layer; The soft organic insulating material layer of 13-; 14-back sheet; 15-patterned circuit; 16-circuit metal level; 17-photoresist; 20-conducts electricity motherboard; ; 21-shielding layer; 22-pothole; 23-conductive electrode; 23a-conductive part; 23b-function part; 23c-function part; 23d-Part I; 23e-Part II; 24-conductive layer; 25-substrate; 26-mucigel; 27-groove; 28-shifts film carrier.
Embodiment
Hereby for ease of the understanding that further has darker one deck clear and definite, full and accurate to structure of the present invention, use and feature thereof and understanding, preferred embodiment is enumerated in whence, coordinates graphic being described in detail as follows:
First, refer to the first manufacture method shown in Fig. 2 and Fig. 3, the conduction motherboard 20 that circuit substrate manufacture of the present invention mainly first be can be used repeatedly by conductor material, and a shielding layer be made up of insulating material 21 is set on the surface at above-mentioned conduction motherboard 20, above-mentioned shielding layer 21 itself has the pothole 22 of a plurality of formation one default line pattern; Pothole 22 afterwards in above-mentioned shielding layer 21 forms complex conduction electrode 23, and forms a conductive layer 24 by complex conduction electrode 23 Common arrangements.
Subsequently, selected material makes a substrate 25, and arranges a mucigel 26 on aforesaid substrate 25 surface, and above-mentioned mucigel 26 master is made up of the flexible material of an energy pressurized generation deformation, and above-mentioned flexible material will solidify to form a hard material after having pasted.Again the mucigel 26 on aforesaid substrate 25 surface is directly sticked in the shielding layer 21 above above-mentioned conduction motherboard 20 and conductive layer 24 afterwards; Finally, aforesaid substrate 25, mucigel 26 and conductive electrode 23 three by above-mentioned conduction motherboard 20 with shielding layer 21 is separated after, namely form the substrate 25 that has circuit.
Wherein, above-mentioned conduction motherboard 20, and surface can select advanced row Passivation Treatment to form an easy stripper surface, the then strength reducing above-mentioned conductive layer 24 and conduct electricity between motherboard 20, facilitates and follow-uply carries out lift-off processing.In addition, above-mentioned conduction motherboard 20 optionally forms a groove 27 (ginseng Fig. 7 ~ 8) respectively in correspondence above-mentioned pothole 22 position, use the conductive electrode 23 of the different aspect that is shaped.
Above-mentioned shielding layer 21 prints or photoresistance exposure developing technique wherein a kind of or its compound mode formation; And above-mentioned conductive layer 24 adopts and carries out plating by the wherein one of the metals such as gold, copper, silver, zinc, nickel, tin or its alloy and make.
Above-mentioned base material 25 is optional to be made up of soft material, hard material, glass plate, macromolecular material or ceramic material, and above-mentioned soft material is by PETG, polymethyl methacrylate, Merlon, PPSU, polymine or pi wherein made by one.
In addition, there is the conduction motherboard 20 about being separated again can repeat another conductive layer 24 shaping with shielding layer 21, follow-uply to be sticked in conductive layer 24 by another substrate 25 repeatability again, and peel off in conduction motherboard 20 and shielding layer 21, the processing procedure of the whole circuit substrate made significantly simplifies convenient manufacturing.
Refer to the second manufacture method shown in Fig. 4 and Fig. 5, circuit substrate of the present invention is the conduction motherboard 20 that first be can be used repeatedly by conductor material equally, and a shielding layer be made up of insulating material 21 is set on the surface at above-mentioned conduction motherboard 20, above-mentioned shielding layer 21 itself has the pothole 22 of a plurality of formation one default line pattern; Subsequently, the pothole 22 in above-mentioned shielding layer 21 forms complex conduction electrode 23, and forms a conductive layer 24 by complex conduction electrode 23 Common arrangements.
But, the follow-up transfer film carrier 28 of transitional structure in a processing procedure that mainly adopts is to stick in above-mentioned conductive layer 24 and shielding layer 21, again above-mentioned transfer film carrier 28 and conductive layer 24 are peeled off jointly by above-mentioned shielding layer 21 and conduction motherboard 20 surface, the substrate 25 that one surface has mucigel 26 is then separately provided, and by after the cemented above-mentioned conductive layer 24 of above-mentioned mucigel 26; Aforesaid substrate 25, mucigel 26 and conductive layer 24 three are separated by above-mentioned transfer film carrier 28 and form a circuit substrate, make foregoing circuit substrate and non-immediate is obtained by stripping on above-mentioned conduction motherboard 20, and be through above-mentioned transfer film carrier 28 and be indirectly posted.
In aforementioned two kinds of different manufactures, above-mentioned conductive electrode 23, when shaping, can form different structure pattern according to different user demand respectively.First, shown in Fig. 5, in the first embodiment, conductive electrode 23 of the present invention fills up above-mentioned pothole 22 by single conductive part 23a, but, above-mentioned conductive part 23a, except can filling up above-mentioned pothole 22, also locally can give prominence to exposing to above-mentioned pothole 22 and form a round end shape pattern (please refer to the drawing 10D conductive electrode 23).
Refer to shown in Fig. 6, in the second embodiment, conductive electrode 23 of the present invention mainly carries out three procedures in above-mentioned pothole 22, and by sequentially upwards forming a function part 23b, a conductive part 23a and another function part 23c bottom above-mentioned pothole 22, above-mentioned two function part 23b, 23c present a horizontal pattern and are sandwiched by above-mentioned conductive part 23a in wherein; In addition, conductive electrode 23 also only can carry out secondary operations, sequentially upwards forms a conductive part 23a and a function part 23c (not shown) by above-mentioned recessed dynamic bottom.
Refer to shown in Fig. 7, in the 3rd embodiment, above-mentioned conduction motherboard 20 is in advance in the shaping groove 27 of correspondence above-mentioned pothole 22 position difference, and wherein, above-mentioned groove 27 is highly less than above-mentioned pothole 22 height.First, above-mentioned groove 27 circumferential surface will be carried out first time and will be processed to form a function part 23b, in above-mentioned groove 27 with pothole 22, carry out second time subsequently and be processed to form a conductive part 23a, last in above-mentioned pothole 22, carry out third time be again processed to form another function part 23c, jointly form a conductive electrode 23 by above-mentioned two function part 23b, 23c and conductive part 23a.As shown in the figure, form one bottom above-mentioned conductive electrode 23 and present U-shaped function part 23c, and the function part 23b that presents level is formed on top.
Refer to shown in Fig. 8, in the 4th preferred embodiment, above-mentioned conduction motherboard 20 is prior equally in the shaping groove 27 of correspondence above-mentioned pothole 22 position difference, but above-mentioned groove 27 height will be greater than above-mentioned pothole 22 height.First, above-mentioned groove 27 circumferential surface will carry out first time processing one function part 23b, carry out second time in subsequently bottom above-mentioned groove 27 with pothole 22 to be processed to form one and to be subject to the coated conductive part 23a of above-mentioned functions portion 23b on a large scale, last in above-mentioned pothole 22, carry out third time be again processed to form another function part 23c, jointly form a conductive electrode 23 by above-mentioned two function part 23b, 23c and conductive part 23a.As shown in the figure, the outer surface of above-mentioned conductive electrode 23 is subject to above-mentioned two function part 23b, 23c and surrounds, and only manifests conductive part 23a and the external contact of a small part.
In the embodiment of aforementioned the second to four, above-mentioned two function part 23b, 23c can according to user demand by weatherable materials, extinction material, help wlding material or half-light material to form, and above-mentioned functions portion 23b, 23c thickness is set to 1 nanometer (nm) ~ 1000 nanometer (nm).
Refer to shown in Fig. 9, circuit board structure of the present invention is mainly made up of substrate 25, mucigel 26 and a conductive layer 24, above-mentioned mucigel 26 is layed in aforesaid substrate 25 surface, and above-mentioned conductive layer 24 is arranged by complex conduction electrode 23 and forms a line pattern, above-mentioned line pattern is installed with in above-mentioned mucigel 26 surface, make the local thickness of each conductive electrode 23 inwardly concave cemented by above-mentioned mucigel 26 surface, increase the contact area between above-mentioned conductive electrode 23 and mucigel 26.
Wherein, above-mentioned mucigel 26 is made up of the flexible material of an energy pressurized generation deformation, and above-mentioned flexible material will solidify to form a hard material after having pasted.And conductive electrode 23 width of above-mentioned conductive layer 24 is between 0.5 micron (μm) ~ 20 micron (μm).Above-mentioned conductive electrode 23 has the Part II 23e that a Part I 23d and being positioned at above-mentioned mucigel 26 inside protrudes from above-mentioned mucigel 26 again, and the width of above-mentioned first part 23d is generally designed to be more than or equal to above-mentioned Part II 23e.
As shown in the figure, above-mentioned conductive electrode 23 is the conductive part 23a being made up of a rectangular rectangle single electric conducting material, but, this is only by the use illustrated for convenience, refer to shown in Figure 10 A to Figure 10 D, that is above-mentioned conductive part 23a also according to user demand, can be changed to the structure patterns such as bullet type, ladder type, circle, brachycephalic by above-mentioned conductive electrode 23.
In addition, above-mentioned conductive electrode 23 is except can adopting homogenous material formation, and above-mentioned conductive electrode 23 also can be made up of a conductive part 23a and at least one function part 23c being arranged at above-mentioned conductive part 23a surface.
As shown in Figure 11 A, above-mentioned two function part 23b, 23c can be horizontally placed on top, the two sides, the end of above-mentioned conductive part 23a respectively.As shown in Figure 11 B and Figure 11 C, above-mentioned two function part 23b, 23c also can be horizontally placed on the end face of above-mentioned conductive part 23a, and form a U-shaped pattern in the bottom surface of above-mentioned conductive part 23a, and the Main Differences of two graphic middle enforcement aspects is that the height of U-shaped pattern is different.
More than illustrate just illustrative for the purpose of the present invention; and nonrestrictive, those of ordinary skill in the art understand, when not departing from the spirit and scope that claim limits; make many amendments, change or equivalence, but all will fall within protection scope of the present invention.
Claims (19)
1. there is the circuit substrate manufacturing method on very fine wire road, it is characterized in that comprising:
One conduction motherboard is provided;
Above-mentioned conduction motherboard arranges a shielding layer, and above-mentioned shielding layer has the pothole of a plurality of formation line pattern;
Form a conductive electrode respectively at the plural pothole of above-mentioned shielding layer, and form a conductive layer by complex conduction electrode Common arrangements;
There is provided a surface to have the substrate of mucigel, and above-mentioned mucigel is sticked in above-mentioned conductive layer and shielding layer;
Aforesaid substrate, adhesive-layer and conductive layer three are formed a circuit substrate by above-mentioned shielding layer with conduction motherboard is separated.
2. there is the circuit substrate manufacturing method on very fine wire road according to claim 1, it is characterized in that: above-mentioned conduction master surface carries out Passivation Treatment and forms an easy stripper surface.
3. there is the circuit substrate manufacturing method on very fine wire road according to claim 1, it is characterized in that: above-mentioned conductive electrode fills up above-mentioned pothole by a conductive part, and local exposes to above-mentioned pothole.
4. there is the circuit substrate manufacturing method on very fine wire road according to claim 1, it is characterized in that: above-mentioned metallic circuit sequentially forms a function part, a conductive part and another function part in above-mentioned pothole.
5. there is the circuit substrate manufacturing method on very fine wire road according to claim 1, it is characterized in that: above-mentioned conduction motherboard is respectively equipped with a groove in the correspondence position of plural pothole.
6. there is the circuit substrate manufacturing method on very fine wire road according to claim 5, it is characterized in that: above-mentioned conductive electrode forms a function part prior to above-mentioned groove vicinity, and a conductive part is formed in above-mentioned pothole and groove, in above-mentioned pothole, form another function part more subsequently.
7. there is the circuit substrate manufacturing method on very fine wire road, it is characterized in that comprising:
One conduction motherboard is provided;
Above-mentioned conduction motherboard arranges a shielding layer, and above-mentioned shielding layer has the pothole of a plurality of formation line pattern;
Form a conductive electrode respectively at the plural pothole of above-mentioned shielding layer, and jointly form a conductive layer by complex conduction electrode;
One transfer film carrier is provided, and above-mentioned transfer film carrier is sticked in above-mentioned conductive layer and shielding layer;
Above-mentioned transfer film carrier and conductive layer are peeled off jointly by above-mentioned shielding layer and conduction master surface;
A surface is provided to have the substrate of mucigel, and by the cemented above-mentioned conductive layer of above-mentioned mucigel;
Aforesaid substrate, mucigel and conductive layer three are separated by above-mentioned transfer film carrier and form a circuit substrate.
8. there is the circuit substrate manufacturing method on very fine wire road according to claim 7, it is characterized in that: above-mentioned conduction master surface carries out Passivation Treatment and forms an easy stripper surface.
9. there is the circuit substrate manufacturing method on very fine wire road according to claim 7, it is characterized in that: above-mentioned conductive electrode fills up above-mentioned pothole by a conductive part, and local exposes to above-mentioned pothole.
10. there is the circuit substrate manufacturing method on very fine wire road according to claim 7, it is characterized in that: above-mentioned conductive electrode sequentially forms a function part, a conductive part and another function part in above-mentioned pothole.
11. circuit substrate manufacturing methods according to claim 7 with very fine wire road, is characterized in that: above-mentioned conduction motherboard is respectively equipped with a groove in the correspondence position of plural pothole.
12. according to the circuit substrate manufacturing method described in claim 11 with very fine wire road, it is characterized in that: above-mentioned conductive electrode first forms a function part at above-mentioned groove vicinity, and a conductive part is formed in above-mentioned pothole and groove, in above-mentioned pothole, form another function part more subsequently.
13. 1 kinds of circuit substrates with very fine wire road, is characterized in that comprising:
One substrate;
One mucigel, is layed in aforesaid substrate surface;
One conductive layer, a line pattern is formed by complex conduction electrode arrangement, above-mentioned line pattern is installed with in above-mentioned mucigel surface, makes the local thickness of each conductive electrode inwardly concave cemented by above-mentioned mucigel surface, increases the contact area between above-mentioned conductive electrode and mucigel.
14. according to the circuit substrate described in claim 13 with very fine wire road, it is characterized in that: above-mentioned conductive electrode has the Part II that a Part I and being positioned at above-mentioned mucigel inside protrudes from above-mentioned mucigel, and the width of above-mentioned first part is more than or equal to above-mentioned Part II.
15., according to the circuit substrate described in claim 13 with very fine wire road, is characterized in that: above-mentioned conductive electrode comprises a conductive part and at least one function part being arranged at above-mentioned conductive part surface.
16., according to the circuit substrate described in claim 15 with very fine wire road, is characterized in that: above-mentioned functions portion is arranged at top, the two sides, the end of above-mentioned conductive part.
17., according to the circuit substrate described in claim 15 with very fine wire road, is characterized in that: above-mentioned functions portion is coated on the surrounded surface of above-mentioned conductive part.
18., according to the circuit substrate described in claim 13 with very fine wire road, is characterized in that: above-mentioned mucigel is made up of the flexible material of an energy pressurized generation deformation, and above-mentioned flexible material will solidify to form a hard material after having pasted.
19., according to the circuit substrate described in claim 15 with very fine wire road, is characterized in that: the conductive electrode width of above-mentioned conductive layer is between 0.5 μm ~ 20 μm.
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|---|---|---|---|---|
| US5201268A (en) * | 1990-12-25 | 1993-04-13 | Matsushita Electric Industrial Co., Ltd. | Intaglio printing process and its application |
| JPH0685434A (en) * | 1992-09-01 | 1994-03-25 | Matsushita Electric Ind Co Ltd | Manufacturing method of ceramic circuit board |
| JPH06283842A (en) * | 1993-03-26 | 1994-10-07 | Kansai Paint Co Ltd | Pattern formation and viscous electrodeposition paint composition employed therein |
| CN101102645A (en) * | 2006-07-05 | 2008-01-09 | 株式会社日立制作所 | Circuit pattern formation device and method of forming circuit pattern to substrate |
-
2014
- 2014-09-10 CN CN201410458035.XA patent/CN105472898B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5201268A (en) * | 1990-12-25 | 1993-04-13 | Matsushita Electric Industrial Co., Ltd. | Intaglio printing process and its application |
| JPH0685434A (en) * | 1992-09-01 | 1994-03-25 | Matsushita Electric Ind Co Ltd | Manufacturing method of ceramic circuit board |
| JPH06283842A (en) * | 1993-03-26 | 1994-10-07 | Kansai Paint Co Ltd | Pattern formation and viscous electrodeposition paint composition employed therein |
| CN101102645A (en) * | 2006-07-05 | 2008-01-09 | 株式会社日立制作所 | Circuit pattern formation device and method of forming circuit pattern to substrate |
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Address after: 213000 No. 51-1 Dongfang East Road, Changzhou City, Jiangsu Province Patentee after: Changzhou Xinsheng Semiconductor Technology Co.,Ltd. Address before: 213000 No. 51-1 Dongfang East Road, Changzhou City, Jiangsu Province Patentee before: Changzhou Xinsheng Semiconductor Co.,Ltd. Address after: 213000 No. 51-1 Dongfang East Road, Changzhou City, Jiangsu Province Patentee after: Changzhou Xinsheng Semiconductor Co.,Ltd. Address before: 213000 No. 51-1 Dongfang East Road, Changzhou City, Jiangsu Province Patentee before: APLUS SEMICONDUCTOR TECHNOLOGIES Co.,Ltd. |
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