CN105290650A - Scaling powder for water-soluble lead-free and halogen-free solder paste and preparing method - Google Patents

Scaling powder for water-soluble lead-free and halogen-free solder paste and preparing method Download PDF

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Publication number
CN105290650A
CN105290650A CN201510773496.0A CN201510773496A CN105290650A CN 105290650 A CN105290650 A CN 105290650A CN 201510773496 A CN201510773496 A CN 201510773496A CN 105290650 A CN105290650 A CN 105290650A
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China
Prior art keywords
scaling powder
free
stir
water
halogen
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CN201510773496.0A
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Chinese (zh)
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CN105290650B (en
Inventor
倪志强
胡智信
关智晓
穆振国
方亮
李超英
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MBO-Doublink Solders Co Ltd
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MBO-Doublink Solders Co Ltd
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes

Abstract

The invention relates to scaling powder for water-soluble lead-free and halogen-free solder paste and a preparing method. The scaling powder comprises, by weight, 10%-15% of anhydrous citric acid, 6%-10% of glutaric acid, 1%-3% of malic acid, 8%-12% of polyethylene glycol 1000, 60%-65% of glycerin, 1%-3% of triethanolamine and 1%-5% of polyoxyethylene-8-nonylphenyl ether. The technology requirement for the lead-free washing solder paste is met. After welding, residual scaling powder can be dissolved in water and does not contain halogen, and environment friendliness and safety are achieved. The prepared solder paste has good bonding performance, and is long in storage life, full in welding spot and moderate in brightness. The problems that traditional scaling powder contains halogen, and harmful substances can be generated in the heating process are solved. In addition, the problem that in the cleaning technology, water is used for replacing poisonous and harmful cleaning agents such as dichloromethane and methyl chloroform cleaning agents, and harm is done to people and the environment is solved.

Description

Water-soluble lead-free and halogen-free element tin cream scaling powder and preparation method
Technical field
The present invention relates to a kind of water-soluble lead-free and halogen-free element tin cream scaling powder, belong to electronic welding Material Field.
The invention still further relates to the preparation method of this scaling powder.
Background technology
Along with the maturation of surface mounting technology, the welding material in the past based on tin-lead solder progressively again substitute by lead-free solder.As everyone knows, plumbous and compound is harmful substance, and long-term use all has a certain impact with the nervous system contacted people, hematological system etc.Though heat employs lead-free tin cream to replace and has Pb-Sn paste, the halogenic ingredient in scaling powder, producing harmful substance or even carcinogen after heating, has very important impact to the healthy of people.The welding assisted agent residuals also having meeting butt welding in some electron trade production processes to take over rear generation cleans, the cleaning efficiency near simple ethanol or isopropyl alcohol equal solvent of traditional colophony type scaling powder is very slow, so there is dichloroethanes, the cleaning agent that chloroform etc. are powerful, these cleaning agents inherently have certain murder by poisoning to human body, and Long Term Contact certainly will will damage user healthy and also be pessimistic on the impact of environment.Under background based on this reality, a kind of generation of water-soluble lead-free and halogen-free element tin cream can solve heating generation harmful substance and the cleaning problem of scaling powder.This scaling powder only needs just can clean up with water after welding, not only protects human and environment, but also can reduce production cost.
Summary of the invention
Object of the present invention is just for electron trade provides a kind of water-soluble lead-free and halogen-free element tin cream scaling powder, adding heat welding process does not have the scaling powder of halogen to produce harmful substance, welding assisted agent residuals after having welded only needs the object that just can reach cleaning through washing, ensure that the reliability of welding greatly, without the need to chemical ion in residual to the corrosion phenomenon regeneration misgivings of the welding space of a whole page, thus i.e. environmental protection but also meet the welding quality requirement of surface mount industry.
The object of the invention is to be realized by following technical proposal:
A kind of water-soluble lead-free and halogen-free element tin cream scaling powder, it is made up of the raw material of following weight percentage:
Anhydrous citric acid 10-15%, glutaric acid 6-10%, malic acid 1-3%, cetomacrogol 1000 8-12%, glycerine 60-65%, triethanolamine 1-3%, polyoxyethylene-8-octyl phenyl ether 1-5%.
A preparation method for water-soluble lead-free and halogen-free element tin cream scaling powder, it carries out in the steps below:
A () 60-65% glycerine and 8-12% cetomacrogol 1000 join in glass reaction still, after being heated to 150 DEG C, start and stir, rotating speed is 200r/min;
B (), after cetomacrogol 1000 dissolves completely, adds 10-15% anhydrous citric acid and 1-3% malic acid, continue to stir, and rotating speed is 200r/min;
C (), after anhydrous citric acid and malic acid dissolve completely, is lowered the temperature 120 DEG C, continue to stir, and rotating speed is 200r/min;
D () temperature reaches 120 DEG C, add 6-10% glutaric acid until it dissolves rear cooling 110 DEG C completely, continues to stir, and rotating speed is 200r/min;
E () temperature reaches 110 DEG C after, add 1-3% triethanolamine and 1-5% polyoxyethylene-8-octyl phenyl ether, continue to stir, rotating speed is 200r/min, stirs 15-20 minute, carries out sealing scaling powder product after having prepared.
Scaling powder of the present invention is made up of anhydrous citric acid, glutaric acid, malic acid, cetomacrogol 1000, glycerine, triethanolamine, polyoxyethylene-8-octyl phenyl ether, the equal water soluble of all raw materials selected, the glycerine selected can prevent tin cream from subsiding as flux vehicle, can extend the shelf life of tin cream as NMF; Cetomacrogol 1000 is thickener, and its Main Function gives tin cream certain lotion form; Triethanolamine is tackifier, and its Main Function is the viscosity increasing tin cream, is convenient to the attachment of components and parts; Anhydrous citric acid, glutaric acid, malic acid all belong to activating agent, and its Main Function is the oxide removing pad, welding device and solder surface in welding process, thus improves wetability, improves welding performance; Polyoxyethylene-8-octyl phenyl ether is surfactant, and its Main Function reduces solder flux surface tension, increases the wetability of welding.
Scaling powder of the present invention can be mixed with lead-free tin cream with unleaded glass putty.
Tool of the present invention has the following advantages and effect:
A) be applicable to the technological requirement of unleaded washing tin cream, weld rear welding assisted agent residuals water soluble and do not contain halogen, Environmental Safety;
B) it is good that the tin cream adopting above-mentioned formula to prepare has viscosity, storage life limit for length, and solder joint is full, and brightness is moderate, Environmental Safety; The problem solved be in traditional scaling powder containing halogen, can harmful substance be produced in heating process; On the other hand, solve cleaning water to replace such as the poisonous and harmful such as carrene, trichloroethanes cleaning agent to the harm of human and environment.
Detailed description of the invention
Embodiment 1
Get 60g glycerine and 10g cetomacrogol 1000 joins in glass reaction still, after being heated to 150 DEG C, start and stir, rotating speed is 200r/min, after cetomacrogol 1000 dissolves completely, add 15g anhydrous citric acid and 1g malic acid, continue to stir, rotating speed is 200r/min, after anhydrous citric acid and malic acid dissolve completely, lower the temperature 120 DEG C, continue to stir, rotating speed is 200r/min, temperature reaches 120 DEG C, add 8g glutaric acid until it dissolves rear cooling 110 DEG C completely, continue to stir, rotating speed is 200r/min, after temperature reaches 110 DEG C, add 1g triethanolamine and 5g polyoxyethylene-8-octyl phenyl ether, continue to stir, rotating speed is 200r/min, stir 15 minutes, sealing scaling powder product is carried out after having prepared.
Embodiment 2
Get 62g glycerine and 8g cetomacrogol 1000 joins in glass reaction still, after being heated to 150 DEG C, start and stir, rotating speed is 200r/min, after cetomacrogol 1000 dissolves completely, add 14g anhydrous citric acid and 2g malic acid, continue to stir, rotating speed is 200r/min, after anhydrous citric acid and malic acid dissolve completely, lower the temperature 120 DEG C, continue to stir, rotating speed is 200r/min, temperature reaches 120 DEG C, add 10g glutaric acid until it dissolves rear cooling 110 DEG C completely, continue to stir, rotating speed is 200r/min, after temperature reaches 110 DEG C, add 2g triethanolamine and 2g polyoxyethylene-8-octyl phenyl ether, continue to stir, rotating speed is 200r/min, stir 15 minutes, sealing scaling powder product is carried out after having prepared.
Embodiment 3
Get 65g glycerine and 12g cetomacrogol 1000 joins in glass reaction still, after being heated to 150 DEG C, start and stir, rotating speed is 200r/min, after cetomacrogol 1000 dissolves completely, add 10g anhydrous citric acid and 3g malic acid, continue to stir, rotating speed is 200r/min, after anhydrous citric acid and malic acid dissolve completely, lower the temperature 120 DEG C, continue to stir, rotating speed is 200r/min, temperature reaches 120 DEG C, add 6g glutaric acid until it dissolves rear cooling 110 DEG C completely, continue to stir, rotating speed is 200r/min, after temperature reaches 110 DEG C, add 3g triethanolamine and 1g polyoxyethylene-8-octyl phenyl ether, continue to stir, rotating speed is 200r/min, stir 15 minutes, sealing scaling powder product is carried out after having prepared.

Claims (2)

1. a water-soluble lead-free and halogen-free element tin cream scaling powder, is characterized in that it is made up of the raw material of following weight percentage:
Anhydrous citric acid 10-15%, glutaric acid 6-10%, malic acid 1-3%, cetomacrogol 1000 8-12%, glycerine 60-65%, triethanolamine 1-3%, polyoxyethylene-8-octyl phenyl ether 2-5%.
2. the preparation method of a kind of water-soluble lead-free and halogen-free element tin cream scaling powder according to claim 1, is characterized in that it carries out in the steps below:
A () 60-65% glycerine and 8-12% cetomacrogol 1000 join in glass reaction still, after being heated to 150 DEG C, start and stir, rotating speed is 200r/min;
B (), after cetomacrogol 1000 dissolves completely, adds 10-15% anhydrous citric acid and 1-3% malic acid, continue to stir, and rotating speed is 200r/min;
C (), after anhydrous citric acid and malic acid dissolve completely, is lowered the temperature 120 DEG C, continue to stir, and rotating speed is 200r/min;
D () temperature reaches 120 DEG C, add 6-10% glutaric acid until it dissolves rear cooling 110 DEG C completely, continues to stir, and rotating speed is 200r/min;
E () temperature reaches 110 DEG C after, add 1-3% triethanolamine and 1-5% polyoxyethylene-8-octyl phenyl ether, continue to stir, rotating speed is 200r/min, stirs 15-20 minute, carries out sealing scaling powder product after having prepared.
CN201510773496.0A 2015-11-13 2015-11-13 The plain tin cream scaling powder of water-soluble lead-free and halogen-free and preparation method Active CN105290650B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112643249A (en) * 2020-12-29 2021-04-13 深圳市福英达工业技术有限公司 Halogen-free water-washing soldering flux, lead-free halogen-free water-washing tin paste and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010008310A1 (en) * 1999-12-27 2001-07-19 Fujitsu Limited Method for forming bumps, semiconductor device, and solder paste
CN101327552A (en) * 2008-07-31 2008-12-24 东莞永安科技有限公司 Low solid content halogenide-free water-based type cleaning-free scaling powder
CN102166689A (en) * 2011-03-30 2011-08-31 浙江强力焊锡材料有限公司 Halogen-free lead-free soldering paste and soldering flux used by same
CN102357749A (en) * 2011-10-18 2012-02-22 苏州之侨新材料科技有限公司 Water-based halogen-free soldering flux used for lead-free soldering tin
CN102825398A (en) * 2012-08-08 2012-12-19 北京工业大学 Soldering flux matched with lead-free solder
CN104874940A (en) * 2015-06-18 2015-09-02 重庆理工大学 Non-cleaning flux for low-silver lead-free brazing filler metal and preparation method of non-cleaning flux

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010008310A1 (en) * 1999-12-27 2001-07-19 Fujitsu Limited Method for forming bumps, semiconductor device, and solder paste
CN101327552A (en) * 2008-07-31 2008-12-24 东莞永安科技有限公司 Low solid content halogenide-free water-based type cleaning-free scaling powder
CN102166689A (en) * 2011-03-30 2011-08-31 浙江强力焊锡材料有限公司 Halogen-free lead-free soldering paste and soldering flux used by same
CN102357749A (en) * 2011-10-18 2012-02-22 苏州之侨新材料科技有限公司 Water-based halogen-free soldering flux used for lead-free soldering tin
CN102825398A (en) * 2012-08-08 2012-12-19 北京工业大学 Soldering flux matched with lead-free solder
CN104874940A (en) * 2015-06-18 2015-09-02 重庆理工大学 Non-cleaning flux for low-silver lead-free brazing filler metal and preparation method of non-cleaning flux

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112643249A (en) * 2020-12-29 2021-04-13 深圳市福英达工业技术有限公司 Halogen-free water-washing soldering flux, lead-free halogen-free water-washing tin paste and preparation method thereof
CN112643249B (en) * 2020-12-29 2022-07-22 深圳市福英达工业技术有限公司 Halogen-free water-washing soldering flux, lead-free halogen-free water-washing tin paste and preparation method thereof

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