CN105280791A

CN105280791A - Led filament

Info

Publication number: CN105280791A
Application number: CN201410239957.1A
Authority: CN
Inventors: 廖秋荣; 马文波
Original assignee: Huarui Photoelectric (huizhou) Co Ltd; HUIZHOU HUARUI LIGHT SOURCE SCIENCE & TECHNOLOGY Co Ltd
Current assignee: Huarui photoelectric (Huizhou) Co. Ltd.; TCL Very Lighting Technology Huizhou Co Ltd
Priority date: 2014-05-30
Filing date: 2014-05-30
Publication date: 2016-01-27
Anticipated expiration: 2034-05-30
Also published as: CN105280791B

Abstract

The invention provides an LED filament comprising a substrate and two electrode pins which are respectively arranged at the two ends of the substrate. At least the first electrode pin of the two electrode pins is connected with the substrate in an insulating way via a plastic packaging connector. The first electrode pin and the substrate are provided with a mutually matching concave-convex structure. The plastic packaging connector wraps the external part of the concave-convex structures. According to the LED filament, the convex-concave structure is arranged so that contact area of the substrate and the first electrode pin and the plastic packaging connector is increased, and the substrate and the first electrode pin plastically packaged in the insulating plastic packaging connector are enabled to be clamped with the plastic packaging connector. Therefore, binding force of the plastic packaging connector and the substrate and the first electrode pin is increased, the plastic packaging connector is not liable to fall off when temperature is relatively high, and thus stability of the LED filament is increased.

Description

LED silk

Technical field

The present invention relates to LED field, particularly relate to a kind of LED silk.

Background technology

LED, as a kind of new light source, because of its advantage such as good energy-conserving effect, long-life, has been widely used in various lighting installation.White light LEDs is described as the forth generation lighting source of alternative fluorescent lamp and incandescent lamp.LED changes the luminous principle with the luminescence of fluorescent lamp tricolor powder of incandescent lamp tungsten filament, utilizes electroluminescence, has that light efficiency is high, radiationless, the life-span long, an advantage of low-power consumption and environmental protection.

Have the packaged LED filament of a lot of filament at present, in use, owing to dispelling the heat not, LED silk in use temperature is higher, and then makes the junction between electrode pin and substrate soften, and easily comes off, makes the less stable of LED silk.

Summary of the invention

Based on this, be necessary the LED silk providing a kind of stability higher.

A kind of LED silk, comprises substrate and lays respectively at two electrode pins at substrate two ends, and in two described electrode pins, at least the first electrode pin and described substrate are insulated by plastic packaging connector and be connected;

Described first electrode pin and described substrate have the concaveconvex structure cooperatively interacted, and it is outside that described plastic packaging connector is wrapped in described concaveconvex structure.

In one of them embodiment, described concaveconvex structure comprises the recess being arranged on described base ends, the opening direction of described recess is vertical with the length direction of described substrate, and described concaveconvex structure also comprises the protuberance be arranged on described first electrode pin, and described protuberance is positioned at described recess.

In one of them embodiment, described recess is multiple and triangular in shape, and multiple described recess forms zigzag fashion on the substrate, and it is multiple and triangular in shape that what described protuberance was corresponding is, multiple described protuberance forms zigzag fashion on described first electrode pin.

In one of them embodiment, described recess is rectangle, and what described protuberance was corresponding is rectangle.

In one of them embodiment, described concaveconvex structure comprises the recess being arranged on described base ends, the opening of described recess is towards the bearing of trend of described first electrode pin, the width of the opening of described recess is less than the inner width of recess, described concaveconvex structure also comprises the protuberance be arranged on described first electrode pin, described protuberance is positioned at described recess, and the width being positioned at the part of described recess of described protuberance is greater than the width that described protuberance is positioned at the part of the opening part of described recess.

In one of them embodiment, the inside of described recess is rectangle or circle.

In one of them embodiment, described substrate is provided with multiple LED luminescence unit, described plastic packaging connector has the window for being welded on by conductive lead wire on described first electrode pin, described conductive lead wire is electrically connected with described LED luminescence unit, and described window is just arranged described first electrode pin.

In one of them embodiment, in two described electrode pins, the second electrode pin is one-body molded with described substrate or be connected by plastic packaging connector.

In one of them embodiment, described substrate is transparency carrier.

In one of them embodiment, the described LED luminescence unit on described substrate and described substrate is wrapped in fluorescent glue.

Above-mentioned LED silk, the setting of convex-concave structure, increase the contact area of substrate and the first electrode pin and plastic packaging connector, and make plastic packaging insulation plastic packaging connector in substrate and the first electrode pin all with the clamping of plastic packaging connector, thus add the adhesion of plastic packaging connector and substrate and the first electrode pin, when temperature is higher, plastic packaging connector difficult drop-off, and then add the stability of LED silk.Substrate can be printing opacity or light tight material, makes the lighting angle selectivity of LED silk higher, and then increases the application space of LED silk and LED bulb.In addition, when fluorescent glue only covered substrate side time, can accelerate heat radiation.

Accompanying drawing explanation

Fig. 1 is the structural representation of the LED silk of a preferred embodiment of the present invention;

Fig. 2 is the enlarged drawing at the LED silk A place shown in Fig. 1;

Fig. 3 is the cutaway view of the LED silk shown in Fig. 1;

Fig. 4 is the cutaway view of another embodiment of substrate and connecting portion;

Fig. 5 is the partial enlarged drawing of another embodiment of substrate and connecting portion;

Fig. 6 is the partial enlarged drawing of another embodiment of substrate and connecting portion;

Fig. 7 is the partial enlarged drawing of another embodiment of substrate and connecting portion.

Embodiment

As shown in Figure 1, it is the structural representation of the LED silk 10 of a preferred embodiment of the present invention.

LED silk 10, comprising: the substrate 100 of strip, two electrode pins 200 laying respectively at substrate 100 two ends, plastic packaging connector 300, multiple fluorescent glue 500 being arranged at the LED luminescence unit 400 on substrate 100 and being attached on substrate 100.In two electrode pins 200, at least the first electrode pin 210 and substrate 100 are insulated by plastic packaging connector 300 and are connected.First electrode pin 210 has with substrate 100 concaveconvex structure 600 cooperatively interacted, and it is outside that plastic packaging connector 300 is wrapped in concaveconvex structure 600.Fluorescent glue 500 covers LED luminescence unit 400 and substrate 100.Multiple LED luminescence unit 400 is at least arranged in a row and is arranged on substrate 100, and the orientation of LED luminescence unit 400 is identical with the bearing of trend of substrate 100.In other embodiments, LED luminescence unit 400 can be arranged in two rows and be arranged on substrate 100.

According to actual conditions, the length of substrate 100 can be 10 ~ 200mm, is preferably 15 ~ 60mm.The width of substrate 100 can be 0.2 ~ 4mm, is preferably 0.3 ~ 2mm.The thickness of substrate 100 can be 0.15 ~ 1.5mm, is preferably 0.2 ~ 1mm.In addition, substrate 100 also can be other specifications, also can for other shapes except strip.The width of two electrode pins 200 is 0.2 ~ 1.5 times of substrate 100 width, is preferably 0.3 ~ 1 times.The length of electrode pin 200 can be 1 ~ 20mm, is preferably 2 ~ 6mm.According to actual conditions, electrode pin 200 also can be other multiples of substrate 100 width, also can be other length.It is pointed out that substrate 100 and two electrode pins 200 are metal material and make, as copper, iron, aluminium etc.Substrate 100 and two electrode pins 200 are all pasted with protective layer.Protective layer can be silver coating, nickel coating, tin coating and composite deposite thereof etc.

See also Fig. 2, it is the enlarged drawing at A place in the LED silk 10 shown in Fig. 1.

Concaveconvex structure 600 comprises the recess 610 being arranged on substrate 100 end and the protuberance 620 be arranged on the first electrode pin 210.The opening direction of recess 610 is vertical with the length direction of substrate 100, and protuberance 620 is positioned at recess 610.Recess 610 is rectangle, protuberance 620 correspondence be rectangle.According to actual conditions, protuberance 620 and recess 610 can be also other shapes of mutually mating, as wavy or odontoid etc.

Plastic packaging connector 300 has the window 310 for being welded on by conductive lead wire on the first electrode pin 210.Conductive lead wire is electrically connected with LED luminescence unit 400, and window 310 is just arranged the first electrode pin 210.Plastic packaging connector 300 is made, as resin, rubber etc. for organic insulating material.Plastic packaging connector 300 is formed in one structure, the first electrode pin 210 and substrate 100 interval is placed time shaping, and with plastic packaging connector 300 together injection mo(u)lding.It is pointed out that according to actual conditions, substrate 100 also can be connected with the second electrode pin 200 by plastic packaging connector 300.Now, the structure of the second electrode pin 200 is identical with the structure of the first electrode pin 210, and the second electrode pin 200 is identical with the connected mode of substrate 100 and the first electrode pin 210 with the connected mode of substrate 100.In addition, the second electrode pin 200 and substrate 100 also can be formed in one structure, and both the second electrode pin 200 was directly connected with substrate 100.

See also Fig. 3 and Fig. 4, it is for distinguishing the cutaway view of the cutaway view of LED silk 10 shown in Fig. 1 and the LED silk 10 of another embodiment.

Substrate 100 for light tight material make time, the side of fluorescent glue 500 covered substrate 100.Substrate 100 for light-transmitting materials make time, when both substrate 100 is transparency carrier, the LED luminescence unit 400 on substrate 100 and substrate 100 is all wrapped in fluorescent glue 500.Fluorescent glue 500 is that transparent medium and luminescent substance are formed.According to actual conditions, when substrate 100 is made for light-transmitting materials, fluorescent glue 500 also can the side of only covered substrate 100.

See also Fig. 5, it is the partial enlarged drawing of another embodiment of substrate 100 and the first electrode pin 210.

Distinguish with the structure shown in Fig. 2 and be, recess 610 is multiple, and triangular in shape.Multiple recess 610 forms zigzag fashion on the substrate 100.Protuberance 620 correspondence be multiple, and triangular in shape.Multiple protuberance 620 forms zigzag fashion on the first electrode pin 210.

See also Fig. 6 and Fig. 7, it is the partial enlarged drawing of two other embodiment of substrate 100 and the first electrode pin 210.

Distinguish with the structure shown in Fig. 2 and be, the opening of recess 610 is towards the bearing of trend of the first electrode pin 210, and the width of the opening of recess 610 is less than the inner width of recess 610.Protuberance 620 is positioned at recess 610, and the width being positioned at the part of recess 610 of protuberance 620 is greater than the width that protuberance 620 is positioned at the part of the opening part of recess 610.The inside of recess 610 is rectangle or circle.Accordingly, protuberance 620 is the rectangle that matches or circle.According to actual conditions, recess 610 can be also other shapes, as triangle etc.

Above-mentioned LED silk 10, second electrode pin 200 is connected with substrate 100 and can conducts, and the first electrode pin 210 is connected by plastic packaging connector 300 with substrate 100, can not conduct.During encapsulation, LED luminescence unit 400 is spilt window 310 part with the first electrode pin 210 respectively and the second electrode pin 200 is electrically connected.

Above-mentioned LED silk 10, the setting of convex-concave structure, increase the contact area of substrate 100 and the first electrode pin 210 and plastic packaging connector 300, and make plastic packaging insulation plastic packaging connector 300 in substrate 100 and the first electrode pin 210 all with plastic packaging connector 300 clamping, thus add the adhesion of plastic packaging connector 300 and substrate 100 and the first electrode pin 210, when temperature is higher, plastic packaging connector 300 difficult drop-off, and then add the stability of LED silk 10.Substrate 100 can be printing opacity or light tight material, makes the lighting angle selectivity of LED silk 10 higher, and then increases the application space of LED silk 10 and LED bulb.In addition, when fluorescent glue 500 only covered substrate 100 side time, can accelerate heat radiation.

The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.

Claims

1. a LED silk, is characterized in that, comprises substrate and lays respectively at two electrode pins at substrate two ends, and in two described electrode pins, at least the first electrode pin and described substrate are insulated by plastic packaging connector and be connected;

2. LED silk according to claim 1, it is characterized in that, described concaveconvex structure comprises the recess being arranged on described base ends, the opening direction of described recess is vertical with the length direction of described substrate, described concaveconvex structure also comprises the protuberance be arranged on described first electrode pin, and described protuberance is positioned at described recess.

3. LED silk according to claim 2, it is characterized in that, described recess is multiple and triangular in shape, and multiple described recess forms zigzag fashion on the substrate, it is multiple and triangular in shape that what described protuberance was corresponding is, multiple described protuberance forms zigzag fashion on described first electrode pin.

4. LED silk according to claim 2, is characterized in that, described recess is rectangle, and what described protuberance was corresponding is rectangle.

5. LED silk according to claim 1, it is characterized in that, described concaveconvex structure comprises the recess being arranged on described base ends, the opening of described recess is towards the bearing of trend of described first electrode pin, the width of the opening of described recess is less than the inner width of recess, described concaveconvex structure also comprises the protuberance be arranged on described first electrode pin, described protuberance is positioned at described recess, and the width being positioned at the part of described recess of described protuberance is greater than the width that described protuberance is positioned at the part of the opening part of described recess.

6. LED silk according to claim 5, is characterized in that, the inside of described recess is rectangle or circle.

7. the LED silk according to any one of claim 1 to 6, it is characterized in that, described substrate is provided with multiple LED luminescence unit, described plastic packaging connector has the window for being welded on by conductive lead wire on described first electrode pin, described conductive lead wire is electrically connected with described LED luminescence unit, and described window is just arranged described first electrode pin.

8. the LED silk according to any one of claim 1 to 6, is characterized in that, in two described electrode pins, the second electrode pin is one-body molded with described substrate or be connected by plastic packaging connector.

9. LED silk according to claim 7, is characterized in that, described substrate is transparency carrier.

10. LED silk according to claim 7, is characterized in that, the described LED luminescence unit on described substrate and described substrate is wrapped in fluorescent glue.