CN105006515A - LED chip heat dissipation structure - Google Patents
LED chip heat dissipation structure Download PDFInfo
- Publication number
- CN105006515A CN105006515A CN201510305865.3A CN201510305865A CN105006515A CN 105006515 A CN105006515 A CN 105006515A CN 201510305865 A CN201510305865 A CN 201510305865A CN 105006515 A CN105006515 A CN 105006515A
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- Prior art keywords
- heat
- led chip
- heat dissipation
- cooling pad
- radiating substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
The invention relates to an LED chip heat dissipation structure. The structure includes an LED chip, a heat dissipation cushion and a heat dissipation substrate. The heat dissipation cushion is provided with a groove, and the LED chip is disposed in the groove. Part of the side surface and the bottom of the LED chip are in contact with the heat dissipation cushion. The structure is characterized in that the heat dissipation cushion is at least equipped with a heat dissipation pin, the heat dissipation substrate is equipped with a groove, and the heat dissipation pin is inserted into the groove. Through adoption of the pin and the groove, the heat dissipation cushion and the heat dissipation substrate can be combined together. The pin and the groove achieve fixing and combining effects. Moreover, thermal conduction is achieved when the pin and the groove are in contact, that is to say, heat dissipated from the bottom and the side of the chip is conducted to the heat dissipation substrate through the heat dissipation cushion. Therefore, a heat dissipation function is achieved.
Description
Technical field
The present invention relates to LED field, especially design a kind of LED chip radiator structure.
Background technology
Present LED lamp, has been widely used in daily life, has progressively instead of incandescent lamp especially at lighting field, meanwhile, LED at other field also in positive popularization.LED light source has high brightness and energy-conservation feature, therefore so environment-friendly type illumination.But LED also has certain defect as light source itself, one of them problem is exactly heat dissipation problem, and it has directly had influence on the life-span of LED light source itself.Therefore, if effectively heat dissipation problem can be solved, be all the target that achievement is pursued all the time.
Summary of the invention
For solving the problems of the technologies described above, a kind of LED chip radiator structure of the present invention, that includes LED chip, cooling pad and heat-radiating substrate, described cooling pad is provided with groove, and described LED chip is arranged in groove, and the surface of LED chip contacts with described cooling pad with bottom, it is characterized in that, described cooling pad is at least provided with a heat radiation pin, and described heat-radiating substrate is provided with fluting, and described heat radiation pin inserts in fluting.
Preferably, described cooling pad is provided with plural heat radiation pin, and described heat-radiating substrate is provided with the fluting of respective amount.
Preferably, the two ends of described cooling pad are respectively equipped with heat radiation pin, and described heat-radiating substrate is provided with corresponding fluting.
Preferably, between described cooling pad and heat-radiating substrate, be provided with heat-conducting layer, described heat-conducting layer can be silica gel.
Preferably, below described heat-radiating substrate, ventilation slot is provided with.
Preferably, above described cooling pad, heat radiation salient point or heat sink strip is provided with.
Preferably, the degree of depth of described heat radiation pin and described fluting is 1-2mm.
Preferably, described cooling pad is metal, and described heat-radiating substrate is ceramic substrate.
Beneficial effect of the present invention: by pin and fluting, cooling pad and heat-radiating substrate can be combined, the effect of pin and fluting, effect that is fixing and that combine can be played on the one hand, on the other hand, both contacts, heat transfer can be realized, by the heat that chip bottom and sidepiece are distributed, be transmitted to heat-radiating substrate by cooling pad, thus realize heat sinking function.
Accompanying drawing explanation
Below in conjunction with accompanying drawing the specific embodiment of the present invention done and illustrate further.
Fig. 1 is the first execution mode of the present invention;
Fig. 2 is the second execution mode of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
first execution mode
As shown in Figure 1, in first execution mode of the present invention, there is provided a kind of LED chip radiator structure, that includes LED chip 21, cooling pad 22 and heat-radiating substrate 24, cooling pad is provided with groove, LED chip is arranged in groove, the surface of LED chip contacts with cooling pad with bottom, and wherein, cooling pad is at least provided with a heat radiation pin 25, heat-radiating substrate is provided with fluting, and heat radiation pin inserts in fluting.The form of fluting is not limit, and can be rectangle, square or circular.
Cooling pad is metal, and as copper, silver or aluminium, heat-radiating substrate is ceramic substrate, as aluminium oxide or aluminium nitride.
In the present invention, by pin and fluting, cooling pad and heat-radiating substrate can be combined, the effect of pin and fluting, can play effect that is fixing and that combine on the one hand, on the other hand, both contacts, can realize heat transfer, by the heat that chip bottom and sidepiece are distributed, be transmitted to heat-radiating substrate by cooling pad, thus realize heat sinking function.
In the present invention, chip is arranged in a groove, chip bottom and sidepiece can be made can effectively to carry out heat and distribute.
In the embodiment of the present invention, by the combination of pin and fluting, can be effectively fixing, without the need to additionally arranging adhesive linkage, heat-radiating substrate and ceramic substrate can be combined mechanically.But the present invention is not limited to this, also as shown in FIG., can be provided with heat-conducting layer 23 between cooling pad and heat-radiating substrate, heat-conducting layer 23 can be silica gel, plays bonding and function that is heat conduction.
Preferably, cooling pad is provided with plural heat radiation pin 25, and heat-radiating substrate is provided with the fluting of respective amount.
Also can be respectively equipped with heat radiation pin at the two ends of cooling pad, heat-radiating substrate is provided with corresponding fluting.
Preferably, the degree of depth of heat radiation pin and described fluting is 1-2mm.
Second execution mode
Fig. 2 illustrates the second execution mode of the present invention, LED chip radiator structure, that includes LED chip 31, cooling pad 32 and heat-radiating substrate 34, cooling pad is provided with groove, and LED chip 31 is arranged in groove, and the surface of LED chip 31 contacts with cooling pad 32 with bottom, wherein, cooling pad is at least provided with a heat radiation pin 35, and heat-radiating substrate is provided with fluting, and heat radiation pin 35 inserts in fluting.The form of fluting is not limit, and can be rectangle, square or circular.
Cooling pad is metal, and as copper, silver or aluminium, heat-radiating substrate is ceramic substrate, as aluminium oxide or aluminium nitride.
In this enforcement, below heat-radiating substrate, be provided with ventilation slot 37, the setting of ventilation slot 37, increase the surface area of heat-radiating substrate, more can effectively dispel the heat
Meanwhile, above cooling pad, heat radiation salient point or heat sink strip 36 is also provided with.The setting of heat radiation salient point or heat sink strip, can make heat just can obtain part release in cooling pad part, reduce the heat dissipation capacity of heat-radiating substrate, avoid heat build-up.
Preferably, the degree of depth of heat radiation pin and fluting is 1-2mm, and heat radiation pin size is slightly less than fluting.
It is pointed out that above embodiment only in order to explain the present invention, be not intended to limit the present invention.Based on the little variation that the present invention does, as material replacement etc. does not all depart from protection scope of the present invention.
Claims (8)
1. a LED chip radiator structure, that includes LED chip, cooling pad and heat-radiating substrate, described cooling pad is provided with groove, described LED chip is arranged in groove, the surface of LED chip contacts with described cooling pad with bottom, it is characterized in that, described cooling pad is at least provided with a heat radiation pin, described heat-radiating substrate is provided with fluting, and described heat radiation pin inserts in fluting.
2. LED chip radiator structure as claimed in claim 1, it is characterized in that, described cooling pad is provided with plural heat radiation pin, and described heat-radiating substrate is provided with the fluting of respective amount.
3. LED chip radiator structure as claimed in claim 1, it is characterized in that, the two ends of described cooling pad are respectively equipped with heat radiation pin, and described heat-radiating substrate is provided with corresponding fluting.
4. LED chip radiator structure as claimed in claim 1, it is characterized in that, between described cooling pad and heat-radiating substrate, be provided with heat-conducting layer, described heat-conducting layer can be silica gel.
5. LED chip radiator structure as claimed in claim 1, is characterized in that, below described heat-radiating substrate, be provided with ventilation slot.
6. LED chip radiator structure as claimed in claim 1, is characterized in that, is provided with heat radiation salient point or heat sink strip above described cooling pad.
7. LED chip radiator structure as claimed in claim 1, it is characterized in that, the degree of depth of described heat radiation pin and described fluting is 1-2mm.
8. LED chip radiator structure as claimed in claim 1, it is characterized in that, described cooling pad is metal, and described heat-radiating substrate is ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510305865.3A CN105006515B (en) | 2015-06-04 | 2015-06-04 | A kind of LED chip radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510305865.3A CN105006515B (en) | 2015-06-04 | 2015-06-04 | A kind of LED chip radiator structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105006515A true CN105006515A (en) | 2015-10-28 |
| CN105006515B CN105006515B (en) | 2018-01-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510305865.3A Active CN105006515B (en) | 2015-06-04 | 2015-06-04 | A kind of LED chip radiator structure |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949158A (en) * | 2017-12-22 | 2018-04-20 | 英迪迈智能驱动技术无锡股份有限公司 | A kind of cooling mechanism for wiring board |
| CN108075029A (en) * | 2017-12-27 | 2018-05-25 | 孙培清 | A kind of energy-saving illumination device |
| CN109742198A (en) * | 2018-12-28 | 2019-05-10 | 苏州工业园区客临和鑫电器有限公司 | A kind of high-powered LED lamp of perfect heat-dissipating |
| CN111853733A (en) * | 2020-06-17 | 2020-10-30 | 安徽一路明光电科技有限公司 | LED chip heat dissipation device |
| CN114551641A (en) * | 2022-02-10 | 2022-05-27 | 中国科学院上海技术物理研究所 | Focal plane detector thermal layer structure for physically isolating coupling stress |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949158A (en) * | 2017-12-22 | 2018-04-20 | 英迪迈智能驱动技术无锡股份有限公司 | A kind of cooling mechanism for wiring board |
| CN108075029A (en) * | 2017-12-27 | 2018-05-25 | 孙培清 | A kind of energy-saving illumination device |
| CN108075029B (en) * | 2017-12-27 | 2019-12-13 | 浙江绿创新拓建筑规划设计有限公司 | Energy-saving lighting device |
| CN109742198A (en) * | 2018-12-28 | 2019-05-10 | 苏州工业园区客临和鑫电器有限公司 | A kind of high-powered LED lamp of perfect heat-dissipating |
| CN111853733A (en) * | 2020-06-17 | 2020-10-30 | 安徽一路明光电科技有限公司 | LED chip heat dissipation device |
| CN111853733B (en) * | 2020-06-17 | 2023-03-07 | 安徽一路明光电科技有限公司 | LED chip heat dissipation device |
| CN114551641A (en) * | 2022-02-10 | 2022-05-27 | 中国科学院上海技术物理研究所 | Focal plane detector thermal layer structure for physically isolating coupling stress |
| CN114551641B (en) * | 2022-02-10 | 2023-09-12 | 中国科学院上海技术物理研究所 | Thermal layer structure of focal plane detector for physically isolating coupling stress |
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|---|---|
| CN105006515B (en) | 2018-01-19 |
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Effective date of registration: 20200717 Address after: 102299 2F, building 2, No. 27, Chuangxin Road, science and Technology Park, Changping District, Beijing (Changping demonstration area) Patentee after: Golden Scorpion Co.,Ltd. Address before: 528226, A8 building, Guangdong new light source base, Luo Cun, Nanhai District, Foshan, Guangdong Patentee before: FOSHAN CITY NANHAI DISTRICT GUANGDONG NEW LIGHT SOURCE INDUSTRY INNOVATION CENTER |
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