CN104971908A - Test sorting machine, propelling device thereof, test tray, and interface board for test machine - Google Patents
Test sorting machine, propelling device thereof, test tray, and interface board for test machine Download PDFInfo
- Publication number
- CN104971908A CN104971908A CN201510144784.XA CN201510144784A CN104971908A CN 104971908 A CN104971908 A CN 104971908A CN 201510144784 A CN201510144784 A CN 201510144784A CN 104971908 A CN104971908 A CN 104971908A
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- China
- Prior art keywords
- test
- semiconductor element
- interface board
- pallet
- measurement terminal
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2644—Adaptations of individual semiconductor devices to facilitate the testing thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Abstract
The invention relates to a test sorting machine, a propelling device thereof, a test tray, and an interface board for a test machine. The test sorting machine is provided with a contact part which electrically contacts the surface of a semiconductor element for measuring the surface resistance of the semiconductor element; the interface board for a test machine is provided with a test terminal which can be electrically connected with the contact part and can test the signal of the surface resistance of the semiconductor element; and the contact part of the test sorting machine can also be arranged in the accessories, such as a propelling device or a test tray. The surface resistance on the semiconductor element can be tested so the reliability of the test can be improved.
Description
Technical field
The present invention relates to a kind of be used in the test of semiconductor element Test handler, as the propulsion plant of the accessory of Test handler and the interface board of test pallet and test machine.
Background technology
The semiconductor element of manufacture is electrically connected on test machine by Test handler.In addition, semiconductor element is classified according to test result by Test handler.Can with reference to No. 2012-0106320, KR published patent (hereinafter referred to as " the first citing document ") etc. about Test handler.
In order to semiconductor element is electrically connected on test machine, Test handler has test pallet and propulsion plant.
Test pallet can bearing semiconductor element.Semiconductor element is positioned in and is provided in the insert of test pallet.Described in No. 10-2011-0011462, KR published patent (hereinafter referred to as " the second citing document "), insert has the locking devicen of the semiconductor element for fixed in position.Locking devicen is made up of truck dead lever (in the second citing document called after " latch ") and elastomeric element (in the second citing document called after " return spring ").Truck dead lever is fixed semiconductor element or is removed fixing by forward and reverse rotation.Elastomeric element applies elastic force towards the positive direction making truck dead lever fix semiconductor element.Should illustrate, when truck dead lever is removed semiconductor element fixing, by means of special open system, reciprocal external force be applied to truck dead lever.
Propulsion plant promotion is carried on the semiconductor element of test pallet and makes semiconductor element be electrically connected on the interface board of test machine.Described in the first citing document, propulsion plant by propeller (in the first citing document called after " propulsion unit "), propeller arranges plate (in the first citing document, called after " arranges plate ") and moving source is formed.Propeller is used for the test jack subtend of interface board and support semiconductor element or pressurizes to semiconductor element.Propeller arranges plate and is provided with propeller.Moving source is used for making propeller arrange plate and moves to interface board, or makes propeller arrange plate to move in the opposite direction.
Interface board normally with the body portion of test machine from combinations of states in Test handler.Described in No. 2009-0002814, utility model as open in Korea S, interface board has the test jack that can be electrically connected with semiconductor element.Therefore, the semiconductor element obtaining angle of rake support or pressurization is electrically connected on test jack.
The relation of described test pallet, propulsion plant and interface board can with reference to the explanation carried out with reference to Fig. 2 of the first citing document.
In addition, semiconductor element is subject to extraneous electric effect and maloperation may occurs.Such problem may increase along with the closeness of electronic unit and frequently occur.Especially, recently owing to needing the various function realizing electronic product, therefore the closeness of electronic unit is higher.Therefore, shielding processing is carried out to the surface of semiconductor element.The screen layer protection semiconductor element carrying out on the surface of semiconductor element processing is from the adverse effect coming from extraneous electric effect.That is, extraneous electric effect is eliminated by the screen layer of ground connection.
A kind of method making screen layer is exactly the surface utilizing thinner metallic plate and cover semiconductor element.But, utilize the technique of metallic plate covering semiconductor component surfaces loaded down with trivial details, thus production efficiency is reduced.
The another kind of method making screen layer is then the surface utilizing conductive material coating semiconductor element.This method technique is simple and productivity is good.But coating is bad will run into the trouble being difficult to confirm if existed.
Apply bad can not having an impact to the electrology characteristic test of semiconductor element.Therefore, test passes but applies bad semiconductor element and may be applied to electronic product.In the case, apply and badly may expand as the bad of electronic product self.
Summary of the invention
The object of the present invention is to provide a kind of can check semiconductor element electrology characteristic process in confirm whether the surface of semiconductor element forms the technology of screen layer rightly.
According to a kind of Test handler propulsion plant of the present invention, comprising: propeller, and be provided to the test jack subtend of interface board of test machine and support semiconductor element, thus semiconductor element is electrically connected on described test jack; Propeller arranges plate, for arranging described propeller; Moving source, arranges plate for making described propeller and moves to described interface board; Contact terminal, is contacted with the surface being electrically connected on the semiconductor element of described test jack by described propeller; And connecting circuit, for described contact terminal is electrically connected on measurement terminal, this measurement terminal exports the signal of the sheet resistance for measuring semiconductor element.
Described contact terminal and connecting circuit can be arranged at described propeller.
Described Test handler propulsion plant can also comprise: splicing ear, and for described contact terminal is electrically connected on test jack, wherein, described contact terminal is electrically connected with described splicing ear by described connecting circuit.
According to a kind of Test handler of the present invention, it is characterized in that, comprising: test pallet, can be used in settling semiconductor element, and be circulated in predetermined closed path by means of multiple transfer device; Loading attachment, for loading (loading) in described test pallet by semiconductor element; Propulsion plant, pushes the interface board of test machine to by described test pallet, be electrically connected on test machine to make the semiconductor element being loaded on described test pallet by means of described loading attachment; And discharge mechanism, from the test pallet be completed of loaded semiconductor element, unload (unloading) semiconductor element, wherein, described propulsion plant is the Test handler propulsion plant with described contact terminal and connecting circuit.
According to a kind of test machine interface board of the present invention, comprising: test jack, be electrically connected on semiconductor element; Socket arranges plate, for arranging described test jack; And measurement terminal, export the signal of the sheet resistance for measuring semiconductor element.
Described measurement terminal can be arranged at described test jack.
Described measurement terminal can also be arranged at described socket and arrange plate in the mode separate with described test jack.
The link being contacted with the surface of semiconductor element in described measurement terminal can bend by means of external force or rotate, and in the case, can also realize elastic recovery.
According to a kind of Test handler test pallet of the present invention, comprising: insert, there is the resettlement groove can settling semiconductor element; Arrange framework, for arranging described insert, described insert comprises: insert main body, is formed with described resettlement groove; Truck dead lever, for the semiconductor element being placed in described resettlement groove being fixed on described resettlement groove or removing fixing, and the surface electrical of semiconductor element is connected to measurement terminal, this measurement terminal exports the signal of the sheet resistance for measuring semiconductor element; And elastomeric element, to described truck dead lever, semiconductor element is fixed to the direction applying elastic force of described resettlement groove, described truck dead lever comprises: stiff end, the semiconductor element being placed in described resettlement groove is fixed on described resettlement groove or removes fixing, and be contacted with the surface of semiconductor element when semiconductor element is fixed; And contact jaw, be contacted with measurement terminal, this measurement terminal exports the signal of the sheet resistance for measuring semiconductor element.
According to a kind of Test handler of the present invention, it is characterized in that, comprising: test pallet, can semiconductor element be settled, and be circulated in predetermined closed path by means of multiple transfer device; Loading attachment, loads (loading) in described test pallet by semiconductor element; Propulsion plant, pushes the interface board of test machine to by described test pallet, be electrically connected on test machine to make the semiconductor element being loaded on described test pallet by means of described loading attachment; And discharge mechanism, for unloading (unloading) semiconductor element from the test pallet be completed of loaded semiconductor element, wherein, described test pallet is the Test handler test pallet with the truck dead lever comprising described contact jaw.
According to the present invention, can confirm whether the screen layer of semiconductor component surfaces is appropriately formed in the process of electrology characteristic checking semiconductor element.Therefore, there is following technique effect:
The first, the reliability of test can be improved.
The second, because the inspection of screen layer performs together with the inspection of electrology characteristic, therefore do not need through special checking process.
Accompanying drawing explanation
Fig. 1 is the general view about Test handler according to the present invention and interface board.
Fig. 2 is the general view of the test pallet about the Test handler being applied in Fig. 1.
Fig. 3 and Fig. 4 is the schematic diagram of the characteristic about the first embodiment of the present invention.
Fig. 5 and Fig. 6 is the schematic diagram of the characteristic about the second embodiment of the present invention.
Fig. 7 and Fig. 8 is the schematic diagram of the characteristic about the third embodiment of the present invention.
Fig. 9 is the figure of another variation of the link of test jack about the interface board being applied in Fig. 7.
Figure 10 and Figure 11 is the schematic diagram of the characteristic about the fourth embodiment of the present invention.
Figure 12 is the schematic configuration diagram about Test handler according to the present invention, measuring machine and interface board.
Figure 13 represents that the contact terminal as contact portion is arranged at the example in other accessories of Test handler.
Symbol description
100: Test handler 110: test pallet
111: insert
111a: truck dead lever 111b: elastomeric element
111c: insert main body
S: resettlement groove HP: stiff end
CP: contact jaw 112: framework is set
120: loading attachment 150: propulsion plant
151: propeller 152: propeller arranges plate
153: moving source 170: discharge mechanism
CT: contact terminal CC: connecting circuit
200: interface board 210: test jack
220: socket arranges plate
MT: measurement terminal MTa: link
Detailed description of the invention
Illustrate according to a preferred embodiment of the invention with reference to accompanying drawing.Brevity in order to what illustrate, omit or reduction duplicate explanation as far as possible.
< is to the explanation > of the essential structure of Test handler and interface board
Fig. 1 is the general view to Test handler 100 according to the present invention and interface board 200.
Test handler 100 comprises test pallet 110, loading attachment 120, all hot cell (SOAKCHAMBER) 130, test cabinet (TEST CHAMBER) 140, propulsion plant 150, moves back equal hot cell (DESOAK CHAMBER) 160, discharge mechanism 170 etc.
Test pallet 110 circulates along the closed path C via " loaded " position (LOADING POSITION) LP, test position (TEST POSITION) TP, unloading position (UNLOADING POSITION) UP.Such test pallet 110 can be mounted with semiconductor element.As seen in the plan view of figure 2, test pallet 110 comprises multiple insert 111 and arranges framework 112.Multiple insert 111 is arranged at and arranges framework 112.Semiconductor element is placed in the resettlement groove S of insert 111.Certainly, can as recorded in background technology, insert 111 has truck dead lever and elastomeric element.
Loading attachment 120 is by client's pallet CT
1semiconductor element load (loading) in the test pallet 110 of " loaded " position LP.
Equal hot cell 130 is for carrying out preheating or precooling according to test condition to from the semiconductor element in the test pallet 110 of " loaded " position LP.
Test cabinet 140 is for through equal hot cell 130, the semiconductor element come in the test pallet 110 of test position TP is tested.
Propulsion plant 150 pushes the test pallet 110 being positioned at test cabinet 140 interface board 200 of test machine to.Accordingly, the semiconductor element being carried on test pallet 110 is electrically connected on interface board 200.Certainly, as recorded in background technology, propulsion plant 150 has propeller, propeller arranges plate and moving source 153.
Move back equal hot cell 160 and revert to normal temperature for making from the semiconductor element in the test pallet 110 of test cabinet 140.
Discharge mechanism 170 comes semiconductor element the test pallet 110 of unloading position UP for unloading (unloading) from moving back equal hot cell 160.Now, semiconductor element carries out classifying by test grade and is loaded into client's pallet CT by discharge mechanism 170 respectively
2, CT
3, CT
4.
Be formed at the whether bad of the screen layer on the surface of semiconductor element to be confirmed by measuring resistance.Or actually that is, the whether bad of screen layer can be confirmed according to below more than the sheet resistance standard value of semiconductor element standard value.
Therefore, Test handler 100 can also have the contact portion on the surface that can be in electrical contact with semiconductor element.Contact portion is for measuring the sheet resistance of semiconductor element.Such contact portion also can optionally be formed in the accessory of test pallet 110 or propulsion plant 150 and so on.
When Test handler 100 has the contact portion for measured surface resistance, the sort operation of discharge mechanism 170 can variation.Such as, in FIG, electrology characteristic test in be judged as bad semiconductor element can be classified in symbol be CT
3client's pallet, sheet resistance measure in be judged as bad semiconductor element can be classified in symbol be CT
4client's pallet, sheet resistance measure and electrology characteristic test in be all judged as bad semiconductor element can be classified in symbol be CT
5client's pallet.Certainly, the whether bad and sheet resistance also can not distinguished in electrology characteristic test measure in whether bad, but only to classify according to generally whether bad.
In addition, interface board 200 comprises test jack 210 and socket arranges plate 220.
Test jack 210 has multiple calibrating terminals of the leading-out terminal being electrically connected on semiconductor element.
Socket arranges plate 220 and is provided with test jack 210.
In addition, interface board 200 according to the present invention can also have measurement terminal.Measurement terminal exports the signal of the sheet resistance for measuring semiconductor element.Such measurement terminal can be that the form playing pin (pogo pin) is equipped with.
The specific embodiment of the Test handler 100 and interface board 200 with essential structure as above is described.
< first embodiment >
Fig. 3 is the schematic diagram of the characteristic to the first embodiment.
In the present embodiment, the propeller 151, measurement terminal MT that contact portion is arranged at propulsion plant 150 is arranged at the test jack 210 of interface board 200.
Propeller 151 is provided with contact terminal CT and connecting circuit CC.Wherein, contact terminal CT and connecting circuit CC is the contact portion being provided to Test handler 100.
Contact terminal CT is contacted with the surface of semiconductor element D.Contact terminal CT can be that the form playing pin is equipped with.
Connecting circuit CC is used for measurement terminal MT contact terminal CT being electrically connected on interface board 200.
Fig. 4 represents that semiconductor element D is electrically connected on the state of test jack 210.
The leading-out terminal OT being placed in the semiconductor element D of insert 111 is electrically connected on the calibrating terminal TT of test jack 210.In addition, the contact terminal CT being arranged at propeller 151 is contacted with the surface of semiconductor element D, and measurement terminal MT is contacted with connecting circuit CC.So, the test of electrology characteristic to semiconductor element and sheet resistance is realized in the lump by means of test machine.
< second embodiment >
Fig. 5 is the schematic diagram of the characteristic to the second embodiment.
In the present embodiment, the truck dead lever 111a of insert 111 is utilized as contact portion.At this, truck dead lever 111a is the contact portion being provided to Test handler 100.
Truck dead lever 111a is made up of the metal of conductive material.Such truck dead lever 111a has stiff end HP and contact jaw CP with point of rotation LP for benchmark in both sides.
Stiff end HP is used for fixed in position to be fixed in the semiconductor element D of the resettlement groove S of insert main body 111c or releasing.Certainly, elastomeric element 111b applies elastic force towards direction semiconductor element D being fixed on resettlement groove S to truck dead lever 111a.In addition, stiff end HP is contacted with the surface of semiconductor element.
Contact jaw CP is protruding outside to resettlement groove S's.Such contact jaw CP is used for contacting with measurement terminal MT.
Fig. 6 represents that semiconductor element D is electrically connected on the state of test jack 210.That is, the measurement terminal MT of interface board 200 is connected to the surface of semiconductor element D by truck dead lever 111a.
Should illustrate, also can realize truck dead lever 111a as follows: the part being only contacted with semiconductor element D and the part being contacted with measurement terminal MT are conductive material, and have the wiring for connecting both sides.That is, as long as truck dead lever 111a can be made to be electrically connected with measurement terminal MT on the surface of semiconductor element D.
< the 3rd embodiment >
Fig. 7 is the schematic diagram of the characteristic to the 3rd embodiment.
The feature of the present embodiment is the measurement terminal MT of interface board 200.
Measurement terminal MT has link MTa at end.Two link MTa maintain towards direction respect to one another the state of inclination.
Fig. 8 represents that semiconductor element D is electrically connected on the state of test jack 210.
In the present embodiment, insert 111 moves to test jack 210 side by means of propeller 151 and applies external force to link MTa.So link MTa is directly connected in the surface of semiconductor element D.
The situation of link MTa elastic recovery is after bending assume that in the present embodiment.But, also can as shown in Figure 9, the link MTa being configured to measurement terminal MT rotates by means of external force, then realizes elastic recovery by means of return spring RS.
< the 4th embodiment >
Figure 10 is the schematic diagram of the characteristic to the 4th embodiment.
In the present embodiment, also there is the splicing ear LT that the propeller being arranged at propulsion plant 150 arranges plate 152.Splicing ear LT is electrically connected with the contact terminal CT being arranged at propeller 151 by connecting circuit CC.In addition, the socket that measurement terminal MT is arranged at interface board 200 arranges plate 220.At this, splicing ear LT and measurement terminal MT are positioned at mutually corresponding position.So measurement terminal MT is set to separate with test jack 210.Certainly, preferably, multiple splicing ear LT or multiple measurement terminal MT is formed with a socket binding respectively.
Figure 11 represents that semiconductor element D is electrically connected on the state of test jack 210.
The contact terminal CT being arranged at propeller 151 is contacted with the surface of semiconductor element D, and measurement terminal MT is connected to splicing ear LT.Certainly, contact terminal CT is connected by connecting circuit CC with splicing ear LT.
In the present embodiment, contact terminal CT, connecting circuit CC and splicing ear LT become the contact portion being provided to Test handler 100.
In each described embodiment, in order to prevent contact fault, contact terminal CT and measurement terminal MT such as can adopt Kelvin probe (Kelvin probe) structure.
In addition, the first described embodiment, the second embodiment and the 4th embodiment are optionally applied to Test handler 100.
Should illustrate, in the embodiment shown the situation that the sheet resistance of the electrology characteristic test and semiconductor element that perform semiconductor element is in the lump measured is illustrated.But, according to the utilization of equipment, the sheet resistance measurement of semiconductor element and the electrology characteristic test of semiconductor element also optionally can be performed.That is, both can adopt parallel semiconductor element electrology characteristic test and sheet resistance measure operational mode, also can adopt only select semiconductor element electrology characteristic test and sheet resistance measurement in a kind of and execution operational mode.
In addition, each described embodiment assumes that test machine exports the situation of electrology characteristic test signal and sheet resistance measurement signal in the lump.
But, according to performance, the measuring machine (RTA) being different from test machine (TESTER) also can be equipped with as illustrated in fig. 12.Measuring machine exports the signal of the sheet resistance for measuring semiconductor element.In such an example, be disclosed in the first embodiment, the second embodiment, the 4th embodiment the contact portion of Test handler 100 relevant to measuring machine (RTA).Therefore, interface board 200 does not have measurement terminal.
Further, each described embodiment is only illustrated the example that contact portion is formed in test pallet 110 or propulsion plant 150.But according to performance, contact portion also can be arranged in other accessories of Test handler 100.Certainly, contact portion also can be made to form separately independent of the existing parts of Test handler 100.Such as, as shown in figure 13, the pick-up P being provided to loading attachment or discharge mechanism can be made to have contact terminal CT.Wherein, pick-up P grasps by vacuum pick the element that semiconductor element D or releasing grasp.In the embodiment shown in fig. 13, the electrology characteristic test of semiconductor element D and sheet resistance are measured do not perform simultaneously, but perform independently across the time interval.
As mentioned above, embodiment in conjunction with the drawings completes and illustrates of the present invention.But described embodiment is the preferred embodiments of the present invention.Therefore, can not think that the present invention is confined to described embodiment.
Claims (10)
1. a Test handler propulsion plant, is characterized in that, comprising:
Propeller, and is provided to the test jack subtend of interface board of test machine and support semiconductor element, thus semiconductor element is electrically connected on described test jack;
Propeller arranges plate, for arranging described propeller;
Moving source, arranges plate for making described propeller and moves to described interface board;
Contact terminal, is contacted with the surface being electrically connected on the semiconductor element of described test jack by described propeller; And
Connecting circuit, for described contact terminal is electrically connected on measurement terminal, this measurement terminal exports the signal of the sheet resistance for measuring semiconductor element.
2. Test handler propulsion plant as claimed in claim 1, it is characterized in that, described contact terminal and connecting circuit are arranged at described propeller.
3. Test handler propulsion plant as claimed in claim 1, is characterized in that, also comprise:
Splicing ear, for described contact terminal is electrically connected on test jack,
Wherein, described contact terminal is electrically connected with described splicing ear by described connecting circuit.
4. a Test handler, is characterized in that, comprising:
Test pallet, can be used in settling semiconductor element, and is circulated in predetermined closed path by means of multiple transfer device;
Loading attachment, for being loaded into described test pallet by semiconductor element;
Propulsion plant, pushes the interface board of test machine to by described test pallet, be electrically connected on test machine to make the semiconductor element being loaded on described test pallet by means of described loading attachment; And
Discharge mechanism, unloads semiconductor element from the test pallet be completed of loaded semiconductor element,
Wherein, described propulsion plant is the Test handler propulsion plant as described in any one in claims 1 to 3.
5. a test machine interface board, is characterized in that, comprising:
Test jack, is electrically connected on semiconductor element;
Socket arranges plate, for arranging described test jack; And
Measurement terminal, exports the signal of the sheet resistance for measuring semiconductor element.
6. test machine interface board as claimed in claim 5, it is characterized in that, described measurement terminal is arranged at described test jack.
7. test machine interface board as claimed in claim 5, it is characterized in that, described measurement terminal is arranged at described socket in the mode separate with described test jack and arranges plate.
8. test machine interface board as claimed in claim 5, it is characterized in that, the link being contacted with the surface of semiconductor element in described measurement terminal can bend by means of external force or rotate, and can realize elastic recovery.
9. a Test handler test pallet, is characterized in that, comprising:
Insert, has the resettlement groove can settling semiconductor element;
Framework is set, for arranging described insert,
Described insert comprises:
Insert main body, is formed with described resettlement groove;
Truck dead lever, for the semiconductor element being placed in described resettlement groove being fixed on described resettlement groove or removing fixing, and the surface electrical of semiconductor element is connected to measurement terminal, this measurement terminal exports the signal of the sheet resistance for measuring semiconductor element; And
Elastomeric element, is fixed to the direction applying elastic force of described resettlement groove by semiconductor element to described truck dead lever,
Described truck dead lever comprises:
Stiff end, is fixed on described resettlement groove or removes fixing, and be contacted with the surface of semiconductor element when semiconductor element is fixed by the semiconductor element being placed in described resettlement groove; And
Contact jaw, is contacted with measurement terminal, and this measurement terminal exports the signal of the sheet resistance for measuring semiconductor element.
10. a Test handler, is characterized in that, comprising:
Test pallet, can settle semiconductor element, and is circulated in predetermined closed path by means of multiple transfer device;
Loading attachment, is loaded into described test pallet by semiconductor element;
Propulsion plant, pushes the interface board of test machine to by described test pallet, be electrically connected on test machine to make the semiconductor element being loaded on described test pallet by means of described loading attachment; And
Discharge mechanism, for unloading semiconductor element from the test pallet be completed of loaded semiconductor element,
Wherein, described test pallet is Test handler test pallet as claimed in claim 9.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140042815A KR102102830B1 (en) | 2014-04-10 | 2014-04-10 | Test handler, pushing device and test tray for testhandler, interface board for tester |
| KR10-2014-0042815 | 2014-04-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104971908A true CN104971908A (en) | 2015-10-14 |
| CN104971908B CN104971908B (en) | 2019-04-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510144784.XA Active CN104971908B (en) | 2014-04-10 | 2015-03-30 | Testing, sorting machine and its propulsion device, test pallet and test machine interface board |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102102830B1 (en) |
| CN (1) | CN104971908B (en) |
| TW (1) | TWI549219B (en) |
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| KR102473315B1 (en) * | 2016-02-19 | 2022-12-02 | (주)테크윙 | Pushing apparatus of handler for testing electronic devices |
| KR20180028882A (en) * | 2016-09-09 | 2018-03-19 | (주)테크윙 | Handler for testing electronic devices |
| TWI631066B (en) * | 2016-12-23 | 2018-08-01 | 典泰科技股份有限公司 | Bundling mechanism for strapping Tray disc fixing strap |
| KR102642193B1 (en) | 2018-10-24 | 2024-03-05 | 삼성전자주식회사 | Device and method for testing semiconductor device and test handler |
| KR102144806B1 (en) * | 2020-04-24 | 2020-08-14 | 티씨에스 주식회사 | Socket for electronic component testing apparatus |
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| CN107024605A (en) * | 2016-01-29 | 2017-08-08 | 泰克元有限公司 | Testing, sorting machine plug connector |
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| CN108325863A (en) * | 2018-01-19 | 2018-07-27 | 温州职业技术学院 | The sorting equipment of semiconductor chilling plate integral test system |
| CN108325863B (en) * | 2018-01-19 | 2019-10-18 | 温州职业技术学院 | The sorting equipment of semiconductor chilling plate integral test system |
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| JP2021063676A (en) * | 2019-10-11 | 2021-04-22 | ハイソル株式会社 | Prober device and measurement tool |
| CN113798215A (en) * | 2020-06-17 | 2021-12-17 | 泰克元有限公司 | Sorting system for electronic component test and adapter for placing electronic component |
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| CN116273994A (en) * | 2023-05-26 | 2023-06-23 | 北京京瀚禹电子工程技术有限公司 | Electrical equipment aging test equipment with intelligent feeding and sorting functions |
| CN116273994B (en) * | 2023-05-26 | 2023-07-21 | 北京京瀚禹电子工程技术有限公司 | Electrical equipment aging test equipment with intelligent feeding and sorting functions |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI549219B (en) | 2016-09-11 |
| TW201539637A (en) | 2015-10-16 |
| KR20150117732A (en) | 2015-10-21 |
| KR102102830B1 (en) | 2020-04-23 |
| CN104971908B (en) | 2019-04-19 |
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