CN104838308A - 在隐形眼镜上组装薄硅片 - Google Patents

在隐形眼镜上组装薄硅片 Download PDF

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Publication number
CN104838308A
CN104838308A CN201380061505.2A CN201380061505A CN104838308A CN 104838308 A CN104838308 A CN 104838308A CN 201380061505 A CN201380061505 A CN 201380061505A CN 104838308 A CN104838308 A CN 104838308A
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Prior art keywords
chip
substrate
contact lenses
contact
pad
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Granted
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CN201380061505.2A
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CN104838308B (zh
Inventor
J.艾茨科恩
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Verily Life Sciences LLC
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Google LLC
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/6813—Specially adapted to be attached to a specific body part
    • A61B5/6814—Head
    • A61B5/6821—Eye
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C11/00—Non-optical adjuncts; Attachment thereof
    • G02C11/10—Electronic devices other than hearing aids
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/04—Contact lenses for the eyes
    • G02C7/047—Contact lens fitting; Contact lenses for orthokeratology; Contact lenses for specially shaped corneae
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00038—Production of contact lenses
    • B29D11/00048—Production of contact lenses composed of parts with dissimilar composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00807—Producing lenses combined with electronics, e.g. chips
    • G—PHYSICS
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    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
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    • G—PHYSICS
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    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/04—Contact lenses for the eyes
    • G02C7/049—Contact lenses having special fitting or structural features achieved by special materials or material structures
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Abstract

提供了其中集成有薄硅片的隐形眼镜，以及用于将该硅片组装在该隐形眼镜内的方法。在一方面中，一种方法包括在镜片衬底上创建多个镜片接触垫并且在芯片上创建多个芯片接触垫。该方法还包括向多个镜片接触垫或芯片接触垫中的每一个施加组装接合材料，将多个镜片接触垫与多个芯片接触垫对齐，利用倒装芯片接合经由组装接合材料将芯片接合到镜片衬底，并且利用镜片衬底形成隐形眼镜。

Description

在隐形眼镜上组装薄硅片
相关申请的交叉引用
本申请要求2012年9月26日递交的美国专利申请13/627,574号的优先权，在此通过引用将该美国专利申请全部并入。
技术领域
本公开概括而言涉及其中集成有薄硅片(thin silicon chip)的隐形眼镜(contact lens)和用于在隐形眼镜内组装硅片的方法。
背景技术
硅片一般是利用倒装芯片接合(flip chip bonding)或引线接合(wirebonding)来组装的。倒装芯片接合是一种利用淀积到芯片垫(chip pad)上的焊接凸点来将半导体器件互连到外部电路(例如，电路板或另外的芯片或晶片)的方法。焊接凸点是在最终晶片处理步骤期间在晶片的顶侧淀积在芯片垫上的。为了将芯片安放到外部电路，其被翻转以使得其顶侧向下，并且被对齐以使得它的垫与外部电路上的匹配垫对齐。焊接凸点随后被熔化以完成互连。在引线接合中，芯片是在直立姿态中被安放到外部电路的，并且导线被用于将芯片垫互连到外部电路。然而，这些硅片组装方法不适合于将硅片组装在隐形眼镜上或隐形眼镜内。另外，标准的芯片太厚以至于不适合安装到隐形眼镜上。
附图说明
图1A和1B呈现了根据本文描述的方面的其中/其上集成有硅片的示例隐形眼镜的替换透视图。
图2A-2C呈现了根据本文描述的方面的其中集成有硅片的隐形眼镜的示例实施例的截面视图。
图3描绘了根据本文描述的方面的用于创建可被组装到隐形眼镜上的硅片的过程。
图4图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底上的过程的简要概览。
图5A-5E图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底上的示范性过程500。
图6A-6D图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底上的示范性过程500的另一替换透视图。
图7A-7D图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底上的另一示范性过程700。
图8A-8D图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底上的示范性过程800的另一替换透视图。
图9A-9D图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底上的另一示范性过程900。
图10A-10D图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底上的示范性过程900的另一替换透视图。
图11A-11C图示了根据本文描述的方面的用于采用其上接合了硅片的隐形眼镜衬底来形成隐形眼镜的过程。
图12A呈现了根据本文描述的方面的隐形眼镜形态的替换三维视图。
图12B描绘了根据本文描述的方面的对隐形眼镜形态进行最终处理以形成隐形眼镜。
图13呈现了根据本文描述的方面的将硅片组装到隐形眼镜上和/或隐形眼镜内的示范性方法。
图14呈现了根据本文描述的方面的将硅片组装到隐形眼镜上和/或隐形眼镜内的另一示范性方法。
图15呈现了根据本文描述的方面的将硅片组装到隐形眼镜上和/或隐形眼镜内的另一示范性方法。
具体实施方式
现在参考图描述各种方面，图中相似的参考标号始终用于指代相似的元素。在以下描述中，出于说明目的，记载了许多具体细节以便提供对一个或多个方面的更透彻理解。然而，很明显，没有这些具体细节也可实现这样的方面。在其它情况中，以框图形式示出结构和设备以便促进对一个或多个方面的描述。
在一个或多个方面中，公开的主题涉及用于制造其中或其上集成有集成电路的隐形眼镜的方法。在一方面中，该方法包括在镜片衬底上创建多个镜片接触垫并且在集成电路元件或者芯片——例如硅片——上创建多个芯片接触垫。组装接合材料随后被施加到多个镜片接触垫或多个芯片接触垫。芯片随后经由组装接合材料被接合到镜片衬底，由此镜片接触垫与芯片接触垫对齐。
在芯片被接合到镜片衬底之后，镜片衬底被形成为隐形眼镜。在一方面中，在将镜片衬底形成为隐形眼镜之前，芯片被密封到镜片衬底上。镜片衬底随后被切割成环形并且被模塑以匹配将佩戴该隐形眼镜的眼睛的曲率。模塑的镜片衬底随后被嵌入到水凝胶中以形成隐形眼镜。
在一些方面中，利用光刻法将多个芯片接触垫形成为芯片上的金属线。类似地，可利用光刻法将多个镜片接触垫形成为镜片衬底上的金属线。而在其它方面中，多个镜片接触垫被形成为具有约100微米或更小的长度的多个金属方形。
主题方法使得能够在不使用凸起垫和标准芯片的情况下将薄硅片组装在隐形眼镜内。在一些实施例中，公开的方法包括使硅片衬底薄化到小于约100微米的厚度(例如，在20-100微米厚的范围内)，然后将薄化的衬底切割成每边小于1mm的芯片。要明白，这些记述的范围/大小只是示范性的，而根据本文描述的实施例可以采用任何适当的厚度或大小。金属线被图案化到芯片和/或镜片衬底上以为芯片和/或镜片衬底创建接触垫。金属线也充当连接隐形眼镜的其它芯片和/或其它电组件(例如，天线、传感器、发光二极管(lightilluminating diode，LED)等等)的导线。
在各种实施例中，为了将芯片组装到镜片衬底，利用注射器将少量的低温组装接合材料放置到镜片衬底或芯片的接触垫上。然后将芯片的接触垫与镜片衬底的接触垫对齐并且利用焊接材料将芯片接合到镜片衬底。例如，镜片衬底可包括多个接触垫，这些接触垫可被分割成多个组装位点，用于将芯片组装到其上。一旦用焊接材料覆盖了镜片衬底上的特定组装位点的各接触垫，就将芯片的接触垫与该组装位点中的镜片衬底接触垫对齐并且利用倒装芯片接合器将芯片接合到该组装位点。倒装芯片接合器工具使芯片接触垫与镜片衬底接触垫对齐并且连同温度一起施加压力以在芯片与镜片衬底之间创建机械和电连接。
在将芯片接合到镜片衬底之后，可利用某种物质(例如，聚对二甲苯)将芯片密封到镜片衬底上以使得镜片衬底具有生物相容性并且将芯片保持在适当位置。镜片衬底随后可被形成为隐形眼镜。例如，在一方面中，镜片衬底被切割成环形。该环形在环的内边缘和/或外边缘可包括缺口以促进环的模塑并减少起皱。该环随后被模塑以匹配眼睛的曲率。该环进一步被嵌入到水凝胶中以完成隐形眼镜组装过程。
图1A和1B描绘了其中/其上集成有集成电路或芯片102的示例隐形眼镜100的各种角度。按照本文使用的，术语集成电路和芯片是可互换使用的。图1A图示了示例隐形眼镜100的三维图像，并且图1B呈现了被佩戴在眼睛104上的示例隐形眼镜100的截面视图。隐形眼镜100和本文公开的另外的隐形眼镜一般是以符合眼睛的形状的球形提供的。
参考图1B，隐形眼镜100包括两个主要表面，即内表面108和外表面106，两者都是球形的。内表面108是凹入的并且邻近眼睛104的表面/搁在眼睛104的表面上。外表面106是凸起的并且与内表面108相反。隐形眼镜100具有在水平方向上跨越内表面108与外表面106之间的厚度。芯片102位于隐形眼镜100的厚度内。在一般方面中，如图1B中所示，镜片的宽度在镜片的中心点处最厚(相对于在镜片的其它区域处镜片的宽度)，向外逐渐变细到镜片的周界处的刀状边缘。主题隐形眼镜的特定尺寸(包括可归因于厚度、直径、曲率等等的尺寸)不是关键的并且可变化。
如本文一般描述的，芯片102是可被隐形眼镜100用来促进隐形眼镜的电操作的硅片。具体地，芯片102可执行隐形眼镜100的各种计算和逻辑功能。另外，虽然在图中没有示出，但要明白本文公开的隐形眼镜可包括连接到硅片102的多个电组件。例如，本文公开的隐形眼镜可包括传感器、天线、LED、电源等等。此外，虽然隐形眼镜100(以及本文描述的另外的隐形眼镜)被描绘为具有单个硅片102，但应当明白隐形眼镜100(以及本文描述的另外的隐形眼镜)可被提供为其中集成有多个芯片102。
在一实施例中，硅片102是一片几乎纯粹的硅，具有小于标准计算设备中采用的标准硅片的尺寸。例如，虽然大多数计算设备采用一平方厘米并且具有约1毫米的厚度的硅片，但芯片102可具有约1平方毫米的大小和小于100微米的厚度。在一方面中，硅片102包含多个(多达数百万个)晶体管和其它小电子电路组件，它们被封装并互连在芯片的表面之下的层中。硅片的表面还可包括蚀刻在其上的金属线的网格，这些金属线用于形成到芯片102和/或隐形眼镜100的其它组件的电连接。
图2A-2C呈现了根据本文描述的方面的其中集成有硅片206的隐形眼镜的示例实施例的截面视图。图2A、2B和2C中描绘的隐形眼镜，即镜片200、202和204，分别具有两个或更多个层，其中硅片206被集成在这些层之一内。镜片200、202和204是通过首先将硅片206集成到镜片衬底层214中并随后在镜片衬底层214上和/或周围形成一个或多个额外的隐形眼镜层216来形成的。具体地，如下文详细描述的，芯片206首先被组装到镜片衬底214上。在一方面中，镜片衬底随后被模塑成镜片形状以配合眼睛208的轮廓并且被组合在隐形眼镜材料(例如水凝胶)内以形成隐形眼镜。
可按多种方式来组合具有硅片206的镜片衬底层214和隐形眼镜材料层216。在一方面中，为了组合镜片衬底层214和隐形眼镜材料层216，可将镜片衬底浸入液体隐形眼镜材料216中。在另一方面中，为了组合镜片衬底层214和隐形眼镜材料层216，可以用隐形眼镜材料216在镜片衬底的一面或两面包覆/覆盖镜片衬底214。在其它方面中，为了组合镜片衬底层214和隐形眼镜材料层216，可以将镜片衬底214压入一层或多层隐形眼镜材料216中和/或将镜片衬底214与隐形眼镜材料216中的一层或多层接合。
镜片衬底层214和(一个或多个)镜片材料层216可包括各种材料。在一方面中，镜片衬底层214和镜片材料层216包括相同材料。在另一方面中，镜片衬底层214和镜片材料层包括不同材料。镜片衬底层214可包括任何适当的如下材料：该材料使得能够将接触垫固定到该材料(例如，金属垫和/或金属线)并且能够将芯片206固定到接触垫。
可用作镜片衬底层材料214的一些示范性材料包括但不限于软聚合物材料，其中包括但不限于水凝胶、基于硅树脂的水凝胶、聚丙烯酰胺或者亲水聚合物。例如，在一方面中，隐形眼镜衬底层214是由包括以下各项中的至少一者的衬底材料形成的：包括亲水单体(例如，N-乙烯基吡咯烷酮、1-乙烯基-2-吡咯烷酮、N,N-二甲基丙烯酰胺，2-甲基丙烯酸羟乙酯、丙烯酸羟乙酯、甲基丙烯酸和丙烯酸)的交联水凝胶、补强剂、紫外线(UV)阻挡物或者染色剂(tint)。在另一方面中，隐形眼镜衬底层214是由包括以下各项中的至少一者的衬底材料形成的：硅水凝胶(silicone hydrogel)(例如，包含硅树脂大分子单体和单体以及吸水的亲水单体的交联水凝胶)。在另外一方面中，隐形眼镜衬底层214是由包括一个或多个刚性材料的衬底材料形成的，所述刚性材料包括但不限于硅树脂聚合物、聚甲基丙烯酸甲酯或者刚性透气材料。
镜片材料层216可包括为镜片衬底层214提供支撑、包含/嵌入镜片衬底层214和/或以其它方式形成隐形眼镜的结构和/或功能主体的任何适当的材料。可用作镜片材料层216的一些示范性材料可包括但不限于软聚合物材料，其中包括但不限于水凝胶、基于硅树脂的水凝胶、聚丙烯酰胺或者亲水聚合物。例如，在一方面中，镜片材料层216是由包括以下各项中的至少一者的衬底材料形成的：包括亲水单体(例如，N-乙烯基吡咯烷酮、1-乙烯基-2-吡咯烷酮、N,N-二甲基丙烯酰胺，2-甲基丙烯酸羟乙酯、丙烯酸羟乙酯、甲基丙烯酸和丙烯酸)的交联水凝胶、补强剂、紫外线(UV)阻挡物或者染色剂。在另一方面中，镜片材料层216是由包括以下各项中的至少一者的衬底材料形成的：硅水凝胶(例如，包含硅树脂大分子单体和单体以及吸水的亲水单体的交联水凝胶)。在另外一方面中，镜片材料层216是由包括一个或多个刚性材料的衬底材料形成的，所述刚性材料包括但不限于硅树脂聚合物、聚甲基丙烯酸甲酯或者刚性透气材料。
如图2A中所图示的，在一方面中，镜片衬底层214位于隐形眼镜200的外表面210处，并且镜片材料层216位于隐形眼镜200的内表面212处。根据此方面，隐形眼镜200可包括两层，即镜片衬底层214和镜片材料层216。镜片衬底层214包括硅片并且硅片可进一步位于隐形眼镜的外表面210处/外表面210上。在一个示例中，为了形成隐形眼镜200，硅片206首先被集成到镜片衬底层214上，然后镜片衬底层214在其凹面被包覆以隐形眼镜材料216。
如图2B中所示，在另一方面中，镜片衬底层214位于隐形眼镜202的内表面212处，并且镜片材料层216位于隐形眼镜202的外表面210处。根据此方面，隐形眼镜202也可包括两层，即镜片衬底层214和镜片材料层216。镜片衬底层214包括硅片206并且硅片可进一步位于隐形眼镜202的内表面212处/内表面212上。在一示例中，为了形成隐形眼镜202，硅片206首先被集成到镜片衬底层214上，然后镜片衬底层214在其凸面被包覆以隐形眼镜材料216。
如在图2C中所见，在另外一个方面中，隐形眼镜204包括位于镜片材料216的两层之间的镜片衬底层214。根据此方面，隐形眼镜204也可包括三层。镜片衬底层214包括硅片206，从而硅片的位置是悬浮在隐形眼镜204的内表面212和外表面210之间。在一示例中，为了形成隐形眼镜204，硅片206首先被集成到镜片衬底层214上，然后镜片衬底层214被浸入隐形眼镜材料216中或者以其它方式被完全包覆/嵌入在隐形眼镜材料216内。
现在参考图3，图示了根据本文描述的方面的用于创建可被组装到隐形眼镜上的硅片的过程300。硅片衬底301首先被薄化到小于100微米的厚度。在一方面中，硅片衬底301被薄化到小于75微米的厚度。在另一方面中，硅片衬底301被薄化到小于50微米的厚度。此外，在另外一方面中，硅片衬底301被薄化到小于35微米的厚度。薄化的硅片衬底302随后被切割成具有适合于集成到隐形眼镜中的大小的多个硅片304。具体地，芯片304的大小和形状受到其要被集成到的隐形眼镜的厚度和曲率的限制。芯片304可具有矩形形状或方形形状。在一方面中，芯片304可具有小于15mm的边长。在另一方面中，芯片304可具有小于10mm的边长。在另一方面中，芯片304可具有小于5.0mm的边长。在另外一方面中，芯片304可具有小于1.0mm的边长。
图4-图10D图示了根据本文描述的方面的将芯片304组装到隐形眼镜衬底418上的过程的示范性实施例。图4图示了将芯片304组装到隐形眼镜衬底418上的过程的简要概览，而图5A-图10D图示了将芯片304组装到隐形眼镜衬底418上的各种过程中的详细步骤。在一个或多个芯片被组装到了隐形眼镜衬底418上之后，隐形眼镜衬底可被修改成隐形眼镜。具体地，隐形眼镜衬底418可被模塑成隐形眼镜的形状以成为组装的隐形眼镜(例如，镜片200、202、204等等)中的隐形眼镜衬底层(例如，层214)。在各种方面中，隐形眼镜衬底418可包括隐形眼镜衬底层214的结构和/或功能中的一个或多个(反之亦然)。具体地，应当明白，隐形眼镜衬底418可包括参考隐形眼镜衬底层214描述的材料。
首先转到图4，描绘了大小被设置成适合于集成到隐形眼镜中的大小(例如，具有小于100微米的厚度和小于约1mm的边长)的硅片304，其上设有金属线402。具体地，在经由过程300创建硅片304之后，在集成到隐形眼镜衬底418上之前，可以处理硅片304以形成硅片的各种功能特征，其中至少包括芯片接触垫。芯片接触垫提供用于将芯片304电连接到衬底418和/或其它电组件的接触点。在一方面中，在芯片304的表面上可创建传统的金属芯片接触垫(未描绘)。例如，在芯片304的表面上可形成方形或矩形形状的小薄金属片形式的金属芯片垫以创建芯片接触垫。这种金属接触垫可具有小于100微米的边长。
然而，在另一方面中，如图4中描绘的，金属线402被图案化到芯片304的表面上。例如，可利用光刻法将金属线402图案化到芯片304的表面406上。这些金属线402充当芯片304的芯片接触垫并且也充当将芯片304连接到集成有芯片304的隐形眼镜的其它芯片和/或组件(例如天线、传感器、LED等等)的导线。例如，金属线402的交叉点404可充当芯片304的芯片接触垫。然而，应当明白，金属线402的任何点都可充当芯片接触垫。此外，虽然交叉的平行金属线402被示为在芯片304上形成网格图案，但这样的线配置只是为了示范而描绘的。具体地，线402可被形成为任何图案，包括具有非交叉线的图案和具有非平行线的图案。
在一方面中，芯片304的其上形成有金属线的表面，即表面406，是设在芯片304上的基本上平坦的聚合物层。根据此方面，利用光刻法将金属线402图案化到基本上平坦的聚合物层上。例如，聚合物层可包括但不限于聚对二甲苯、聚酰亚胺和聚对苯二甲酸乙二醇酯(PET)。
隐形眼镜衬底418也被呈现为有镜片接触垫位于其表面上。在一方面中，镜片接触垫提供接触点，用于将衬底418与芯片304电连接和/或物理连接和/或用于将设在集成有镜片衬底418的隐形眼镜内的其它电组件电连接到芯片304。在一方面中，在镜片衬底418的表面上可创建传统的金属芯片接触垫414。例如，在镜片衬底418的表面上可形成方形或矩形形状的小薄金属片形式的金属芯片垫以创建镜片接触垫。这种金属接触垫可具有小于100微米的边长。
然而，在另一方面中，按与图案化在芯片304上的金属线402相同或相似的方式，将金属线416图案化到隐形眼镜衬底418的表面上。例如，可利用光刻法将金属线416图案化到镜片衬底418的表面上。与金属线402一样，金属线416可充当镜片衬底418的镜片接触垫并且也充当将芯片304连接到集成有芯片304的隐形眼镜的其它芯片和/或组件(例如天线、传感器、LED等等)的导线。此外，虽然交叉的平行金属线416被示为在衬底418上形成网格图案，但这样的线配置只是为了示范而描绘的。具体地，线416可被形成为任何图案，包括具有非交叉线的图案和具有非平行线的图案。
在一方面中，镜片衬底和/或镜片衬底418的其上形成了金属线416的表面是基本上平坦的聚合物层。根据此方面，利用光刻法将金属线416图案化到基本上平坦的聚合物层上。例如，聚合物层可包括但不限于聚对二甲苯、聚酰亚胺和聚对苯二甲酸乙二醇酯(PET)。
应当明白，传统的金属接触垫414和金属线接触垫416都只是为了示范而设在镜片衬底418上的。另外，虽然镜片衬底418只有部分区域被呈现为其上有接触垫，但应当明白衬底418的任何部分都可设有接触垫。例如，衬底418的整个表面可被图案化以金属线或方形金属垫。根据此示例，金属线/金属垫的子集可被选择性地用作接触垫以用于在其上组装芯片。换言之，金属线/金属垫的子集可被选择性地用作用于将芯片组装在其上的组装位点，并且衬底可设有多个潜在的组装位点。按照本文使用的，术语组装位点指的是衬底418的如下区域：该区域具有可与芯片的接触垫对齐的镜片接触垫。
为了将硅片304附着到隐形眼镜衬底418，组装接合材料(未示出)被施加到芯片或者镜片衬底418。在一方面中，组装接合材料包括各向异性导电膜(anisotropic conductive film，ACF)或各向异性导电胶(anisotropicconductive paste，ACP)。ACF和ACP是当被压在两个金属垫——例如镜片接触垫和芯片接触垫——之间时建立导电路径的材料。根据此方面，ACF或ACP被施加在衬底418(和/或芯片)的其中有镜片(或芯片)接触垫的整个组装位点上以便覆盖接触垫以及接触垫之间和周围的区域。利用此方面，不需要单独向接触垫施加组装接合材料。
在施加ACF或ACP之后，硅片于是随着箭头408被翻转，使得硅片304的具有芯片接触垫的表面406(例如具有金属线402的表面)面对隐形眼镜衬底418的其上具有镜片接触垫的表面。翻转的芯片304上呈现的虚线402指示现在在芯片的下侧的金属线402。芯片304随后被降低到衬底418上并且芯片接触垫被与镜片接触垫对齐。随后经由将芯片304压到ACF或ACP上并且对芯片304/衬底418组装件加热以硫化(cure)或固化芯片304与衬底418的连接来将芯片304组装到镜片衬底上。具体地，ACP或ACF被活化以便通过加热来将芯片304部分地固定到衬底418。例如，ACP或ACF的活化可包括从ACP或ACF中沸腾出一股流量(flux)以在芯片接触垫和镜片接触垫之间创建导电路径并且创建将芯片304接合到衬底418的粘合剂(例如，底部填充胶)。在一方面中，执行对芯片304/衬底418组装件的加热，以使得导通在单个方向上产生，从而使得接触垫不会短路。
在另一方面中，组装接合材料包括焊料溶液(solder solution)或焊膏(solder paste)。根据此方面，焊料溶液或焊膏(未示出)在特定的组装位点中被施加到芯片接触垫或镜片接触垫。在一方面中，利用注射器将焊料溶液/焊膏施加到各个芯片接触垫或镜片接触垫。然后随着箭头408翻转硅片304，使得硅片304的具有芯片接触垫的表面406(例如具有金属线402的表面)面对隐形眼镜衬底418的其上具有镜片接触垫的表面。翻转的芯片304上呈现的虚线402指示现在在芯片的下侧的金属线402。芯片304随后被降低到衬底418上并且芯片接触垫被与镜片接触垫对齐。然后向芯片304或镜片衬底418中的至少一者施加热量和压力以使得焊料溶液流动并固化以便将芯片304接合到镜片衬底418。箭头410示出了芯片304被接合到衬底418上的包括金属方形作为接触垫的组装位点的示例。箭头412示出了芯片304被接合到衬底418上的包括金属线作为接触垫的组装位点的示例。
在一些方面中，底部填充胶被施加到镜片衬底/芯片复合体以便将芯片304保持到衬底418上。具体地，当使用焊料溶液/焊膏作为组装接合材料时，在芯片304和衬底418之间建立的连接可相对较弱。因此，在芯片304和衬底之间可施加底部填充胶材料以便在各个焊垫和固化的焊接材料周围流动来进一步促进将芯片304接合到衬底。底部填充胶可包括诸如环氧树脂或粘合剂之类的不导电或基本上不导电的材料。
在一方面中，翻转408、芯片304与镜片衬底418上的接触垫的对齐以及接合是利用倒装芯片接合器执行的。按照本文使用的，术语倒装芯片接合器指的是如下的工具：其执行传统的倒装芯片接合方法的功能和特征，其中至少包括芯片304的翻转、芯片304与衬底418的对齐以及向芯片304和衬底418施加热量和压力以使得芯片304和衬底418经由在其间提供的焊料溶液而接合。
在一方面中，施加到镜片衬底或芯片的组装接合材料是低活化温度材料。例如，在一些方面中，组装接合材料包括具有低活化温度——例如低于200°C——的ACF或ACP。在其它方面中，组装接合材料包括具有低熔点——例如低于200℃——的焊接材料。在另一方面中，组装接合材料可具有小于150°C的活化温度或沸点。在另一方面中，组装接合材料可具有小于100℃的活化温度或沸点。在另外一方面中，组装接合材料可具有小于85℃的活化温度或沸点。在另外的一方面中，组装接合材料可具有小于65℃的活化温度或沸点。
可用作组装接合材料的一些示范性的低温焊料溶液/焊膏可包括但不限于具有各种比率的铟、锡和/或铋的焊料溶液或焊膏。例如，来自Indium公司的铟合金19号可被用作示范性的焊料溶液并且具有51％In、32.5％Bi和16.5Sn的配比，具有约60℃的熔化温度。在一方面中，采用的焊料溶液/焊膏是无铅的以免破坏佩戴其中集成有芯片304的隐形眼镜的眼睛。在一些方面中，焊料溶液也可与助熔剂或酸溶液(例如HCL和水)混合以防止或减少焊料溶液的氧化。一些示范性助熔剂可包括但不限于来自Indium公司的020B和Indalloy Flux#4-OA。此外，市面上有的焊料溶液可被用作形成为悬浮在焊料溶液中的膏体的组装接合材料，例如来自Indium公司的90焊膏。
现在来看图5A-5E，图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底418上的示范性过程500。在图5A-5E中，应当明白，为了示范只呈现了隐形眼镜衬底418的一部分。过程500部分遵循图4的箭头410。具体地，过程500呈现了芯片304被接合到衬底418上的包括金属方形414作为接触垫的组装位点的实施例。
如在图5A中所见，提供了其上创建有多个金属方形接触垫414的隐形眼镜衬底418。根据图5B利用焊料溶液将芯片304组装到衬底418，或者根据图5C利用分别包括ACF或ACP的焊料膜或焊膏将芯片304组装到衬底418。因此，过程500可随着图5B或根据图5C的步骤进行。
在图5B中，焊料溶液502被施加到每个镜片接触垫414。(焊料溶液502由与图5A的镜片接触垫414相比的镜片接触垫414的变暗来表示)。在一方面中，利用注射器、移液器、针或其它精确敷抹器工具将焊料溶液502选择性地施加到每个镜片接触垫414。然后，具有金属线402形式的芯片接触垫的芯片304被翻转并与镜片衬底418对齐。具体地，芯片接触垫(例如金属线402的交叉点)与其上具有焊料溶液502的每个镜片接触垫414对齐。
在图5C中(作为图5B的替换)，ACF或ACP 506被施加到镜片衬底418以便覆盖镜片接触垫414和组装位点中各个镜片接触垫414周围的区域。然后，具有金属线402形式的芯片接触垫的芯片304被翻转并与镜片衬底418对齐。具体地，芯片接触垫(例如金属线402的交叉点)与其上具有ACF或ACP的每个镜片接触垫414对齐。
在图5D中，芯片304被降低到镜片衬底418上，并且响应于压力和/或热量的施加，芯片经由焊料溶液或ACF/ACP被接合到镜片衬底。例如，倒装芯片接合器可执行方法500的翻转、对齐和接合方面。在一方面中，在小于200℃的温度下基本上仅向衬底418的组装芯片304的区域(例如组装位点)施加热量以便不引起对衬底的其余区域的损坏或只引起有限的损坏。在图5E中，一旦将焊料溶液或ACF/ACP固化、硬化和/或硫化，在一方面中，就可利用密封剂504将芯片304密封到镜片衬底418上。密封剂504可覆盖和/或以其它方式包覆芯片304以将芯片304保持在镜片衬底418上的适当位置和/或使得镜片衬底/芯片复合体具有生物相容性。在一方面中(未示出)，整个衬底/芯片复合体可被包覆在密封剂504中。例如，整个衬底/芯片复合体可被密封剂504浸泡或冲洗。在一方面中，密封剂504是聚对二甲苯或聚酰亚胺。
图6A-6D图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底418上的示范性过程500的替换透视图。具体地，图6A-6D呈现了过程500期间芯片304和镜片418的截面视图。
如在图6A中所见，提供了其上创建有多个金属方形接触垫414的隐形眼镜衬底418。在图5B中，焊料溶液502被施加到每个镜片接触垫414。在一方面中，利用注射器、移液器、针或其它精确敷抹器工具将焊料溶液502选择性地施加到每个镜片接触垫414。然后，具有芯片接触垫402的芯片304与镜片衬底418对齐。具体地，芯片接触垫402与其上具有焊料溶液502的每个镜片接触垫414对齐。在一方面中，芯片接触垫402是如图4中的芯片304上呈现的金属线402的交叉点404。
在图6C中，芯片304被降低到镜片衬底418上，并且响应于压力和/或热量的施加，芯片经由焊料溶液被接合到镜片衬底。在一方面中，在小于200°C的温度下基本上仅向衬底418的组装芯片304的区域(例如组装位点)施加热量以便对衬底的其余区域引起有限的损坏。例如，倒装芯片接合器可执行方法500的翻转、对齐和接合方面。在一方面中，底部填充胶材料(未示出)可被施加在镜片衬底418与芯片304之间以便填充固化的焊接材料之间的间隙并且进一步将芯片304粘合到衬底418。在图6D中，一旦将焊料溶液固化、硬化和/或硫化，在一方面中，就可利用密封剂504将芯片304密封到镜片衬底418上。密封剂504可覆盖和/或以其它方式包覆芯片304以将芯片304保持在镜片衬底418上的适当位置和/或使得镜片衬底/芯片复合体具有生物相容性。在一方面中(未示出)，整个衬底/芯片复合体可被包覆在密封剂504中。例如，整个衬底/芯片复合体可被密封剂504浸泡或冲洗。
现在来看图7A-7D，图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底418上的另一示范性过程700。在图7A-7D中，应当明白，为了示范只呈现了隐形眼镜衬底418的一部分。过程700部分遵循图4的箭头412。具体地，过程700呈现了芯片304被接合到衬底418上的包括金属线416作为接触垫的组装位点的实施例。
如在图7A中所见，提供了其上创建有多条金属线416的隐形眼镜衬底418。金属线416充当镜片接触垫。在一方面中，具体地，金属线的交叉点充当镜片接触垫。根据此方面，焊料溶液502在每个金属线交叉点处被施加到镜片接触垫416。在一方面中，利用注射器、移液器、针或其它精确敷抹器工具将焊料溶液502选择性地施加到每个镜片接触垫416。在图7B中，具有金属线402形式的芯片接触垫的芯片304被翻转并与镜片衬底418对齐。具体地，芯片接触垫(例如金属线402的交叉点)与其上具有焊料溶液502的每个镜片接触垫416——即金属线416交叉点——对齐。
在图7C中，芯片304被降低到镜片衬底418上，并且响应于压力和/或热量的施加，芯片经由焊料溶液被接合到镜片衬底。在一方面中，在小于200°C的温度下基本上仅向衬底418的组装芯片304的区域(例如组装位点)施加热量以便不引起对衬底的其余区域的损坏或只引起有限的损坏。例如，倒装芯片接合器可执行方法700的翻转、对齐和接合方面。在一方面中，底部填充胶材料(未示出)可被施加在镜片衬底418与芯片304之间以便填充固化的焊接材料之间的间隙并且进一步将芯片304粘合到衬底418。在图7D中，一旦将焊料溶液固化、硬化和/或硫化，在一方面中，就可利用密封剂504将芯片304密封到镜片衬底418上。密封剂504可覆盖和/或以其它方式包覆芯片304以将芯片304保持在镜片衬底418上的适当位置和/或使得镜片衬底/芯片复合体具有生物相容性。在一方面中(未示出)，整个衬底/芯片复合体可被包覆在密封剂504中。例如，整个衬底/芯片复合体可被密封剂504浸泡或冲洗。
图8A-8D图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底418上的示范性过程700的替换透视图。具体地，图8A-8D呈现了过程700期间芯片304和镜片418的截面视图。
如在图8A中所见，提供了其上创建有多个接触垫416的隐形眼镜衬底418。接触垫416是由金属线形成的，例如经由光刻法图案化到镜片衬底418上的金属线416。在一方面中，接触垫416包括如图4中所描绘的金属线416的交叉点。接触垫416上还施加有焊料溶液502。在一方面中，利用注射器、移液器、针或其它精确敷抹器工具将焊料溶液502选择性地施加到每个镜片接触垫416。在图8A中，具有芯片接触垫402的芯片304与镜片衬底418对齐。具体地，芯片接触垫402与其上具有焊料溶液502的每个镜片接触垫416对齐。在一方面中，芯片接触垫402类似地是如图4中的芯片304上呈现的金属线402的交叉点404。
在图8C中，芯片304被降低到镜片衬底418上，并且响应于压力和/或热量的施加，芯片经由焊料溶液被接合到镜片衬底。在一方面中，在小于200°C的温度下基本上仅向衬底418的组装芯片304的区域(例如组装位点)施加热量以便不引起对衬底的其余区域的损坏或只引起有限的损坏。例如，倒装芯片接合器可执行方法700的翻转、对齐和接合方面。在一方面中，底部填充胶材料(未示出)可被施加在镜片衬底418与芯片304之间以便填充固化的焊接材料之间的间隙并且进一步将芯片304粘合到衬底418。在图8D中，一旦将焊料溶液固化、硬化和/或硫化，在一方面中，就可利用密封剂504将芯片304密封到镜片衬底418上。密封剂504可覆盖和/或以其它方式包覆芯片304以将芯片304保持在镜片衬底418上的适当位置和/或使得镜片衬底/芯片复合体具有生物相容性。在一方面中(未示出)，整个衬底/芯片复合体可被包覆在密封剂504中。例如，整个衬底/芯片复合体可被密封剂504浸泡或冲洗。
现在来看图9A-9D，图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底418上的另一示范性过程900。在图9A-9B中，应当明白，为了示范只呈现了隐形眼镜衬底418的一部分。过程900呈现了一个实施例，其中芯片304被接合到衬底418上的包括金属方形414作为接触垫的组装位点并且接合溶液被施加到芯片接触垫。
如在图9A中所见，提供了其上创建有多条金属线402的硅片304。金属线402充当芯片接触垫。在一方面中，具体地，金属线的交叉点充当芯片接触垫。根据此方面，焊料溶液502在每个金属线交叉点处被施加到芯片接触垫402。在一方面中，利用注射器、移液器、针或其它精确敷抹器工具将焊料溶液502选择性地施加到每个芯片接触垫402。芯片304还被随着箭头408翻转以使得施加有焊料溶液的芯片接触垫可面对镜片衬底418的其上具有接触垫414的表面。翻转的芯片304上的虚线指示现在在芯片的下侧406的芯片接触垫。
在图9B中，具有施加了焊料的芯片接触垫的翻转的芯片304与镜片衬底418对齐。具体地，芯片接触垫(例如金属线402的交叉点)与每个镜片接触垫414对齐。提供了有接触垫414位于其上的镜片衬底418。虽然镜片接触垫414被呈现为金属方形，但应当明白镜片接触垫可以是金属线形式的。
在图9C中，芯片304被降低到镜片衬底418上，并且响应于压力和/或热量的施加，芯片经由焊料溶液被接合到镜片衬底。在一方面中，在小于200°C的温度下基本上仅向衬底418的组装芯片304的区域(例如组装位点)施加热量以便不引起对衬底的其余区域的损坏或只引起有限的损坏。例如，倒装芯片接合器可执行方法900的翻转、对齐和接合方面。在一方面中，底部填充胶材料(未示出)可被施加在镜片衬底418与芯片304之间以便填充固化的焊接材料之间的间隙并且进一步将芯片304粘合到衬底418。在图9D中，一旦将焊料溶液固化、硬化和/或硫化，在一方面中，就可利用密封剂504将芯片304密封到镜片衬底418上。密封剂504可覆盖和/或以其它方式包覆芯片304以将芯片304保持在镜片衬底418上的适当位置和/或使得镜片衬底/芯片复合体具有生物相容性。在一方面中(未示出)，整个衬底/芯片复合体可被包覆在密封剂504中。例如，整个衬底/芯片复合体可被密封剂504浸泡或冲洗。
图10A-10D图示了根据本文描述的方面的将硅片组装到隐形眼镜衬底418上的示范性过程900的替换透视图。具体地，图10A-10D呈现了过程900期间芯片304和镜片418的截面视图。
如在图10A中所见，提供了其上创建有多条金属线402的硅片304。金属线402充当芯片接触垫。在一方面中，接触垫402是如图4中呈现的金属线402的交叉点(点404)。根据此方面，焊料溶液502在每个金属线交叉点处被施加到芯片接触垫402。在一方面中，利用注射器、移液器、针或其它精确敷抹器工具将焊料溶液502选择性地施加到每个芯片接触垫402。芯片304还被随着箭头408翻转以使得施加有焊料溶液的芯片接触垫可面对镜片衬底418的其上具有接触垫414的表面。
在图10B中，具有施加了焊料的芯片接触垫的翻转的芯片304与镜片衬底418对齐。具体地，芯片接触垫(例如金属线402的交叉点)与每个镜片接触垫414对齐。提供了有接触垫414位于其上的镜片衬底418。虽然镜片接触垫414被呈现为金属方形，但应当明白镜片接触垫可以是金属线形式的。
在图10C中，芯片304被降低到镜片衬底418上，并且响应于压力和/或热量的施加，芯片经由焊料溶液被接合到镜片衬底。在一方面中，在小于200℃的温度下基本上仅向衬底418的组装芯片304的区域(例如组装位点)施加热量以便不引起对衬底的其余区域的损坏或只引起有限的损坏。例如，倒装芯片接合器可执行方法900的翻转、对齐和接合方面。在一方面中，底部填充胶材料(未示出)可被施加在镜片衬底418与芯片304之间以便填充固化的焊接材料之间的间隙并且进一步将芯片304粘合到衬底418。在图10D中，一旦将焊料溶液固化、硬化和/或硫化，在一方面中，就可利用密封剂504将芯片304密封到镜片衬底418上。密封剂504可覆盖和/或以其它方式包覆芯片304以将芯片304保持在镜片衬底418上的适当位置和/或使得镜片衬底/芯片复合体具有生物相容性。在一方面中(未示出)，整个衬底/芯片复合体可被包覆在密封剂504中。例如，整个衬底/芯片复合体可被密封剂504浸泡或冲洗。
现在参考图11A-11C，图示了根据本文描述的方面的用于采用其上接合有硅片的隐形眼镜衬底来形成隐形眼镜的过程。如在图11A中所见，提供了其上接合有硅片1104的隐形眼镜衬底1102。在各种方面中，隐形眼镜衬底1102和芯片1104可包括隐形眼镜衬底层214和芯片206和/或隐形眼镜衬底418和芯片304的结构和/或功能中的一个或多个(反之亦然)。在一方面中，芯片1104经由密封剂(例如，聚对二甲苯)被密封到隐形眼镜衬底1102。
隐形眼镜衬底1102用于形成隐形眼镜形态1112。在一方面中，隐形眼镜衬底1102被模塑成隐形眼镜形态1112的形状(例如圆且弯曲的形状)。具体地，隐形眼镜衬底1102被模塑以匹配将佩戴隐形眼镜的眼睛的曲率。在一些方面中，为了促进对隐形眼镜衬底1102的模塑，隐形眼镜衬底1102被切割成能够形成为隐形眼镜的形状的形状。例如，如在图11B中所见，隐形眼镜衬底1102可被切割成圆形或环形1110。图11B中所示的切割的衬底1110是沿着虚线图案1106从隐形眼镜衬底1102切出的。切割的衬底1110在环的内边缘和/或外边缘上可包括切缝或切口以促进将切割的衬底1110形成为隐形眼镜形状。切割的衬底1110被从隐形眼镜衬底1102切出以便包括附着的芯片1104。
图11C示出了从隐形眼镜衬底1102形成的隐形眼镜形态1112的二维视图。隐形眼镜形态1112包括芯片1104。在一方面中，隐形眼镜形态1112是通过封闭切割的衬底1110的切口1108来形成的。例如，切割的衬底1110的开放边缘可被弯曲并放在一起(例如，随着图11B的虚线箭头)以形成图11C的隐形眼镜形态1112。
图12A呈现了隐形眼镜形态1112的替换三维视图。在一方面中，隐形眼镜形态1112可被用作完成的、可佩戴/可工作(functional)的隐形眼镜。隐形眼镜形态匹配隐形眼镜的形状并且符合将佩戴它的眼睛的曲率。隐形眼镜形态还包括集成在其上的芯片1104。然而，在另一方面中，隐形眼镜形态被进一步处理以形成完成的、可佩戴/可工作的隐形眼镜。
图12B描绘了最终处理隐形眼镜形态1112以形成隐形眼镜1202。隐形眼镜1202包括在一面或多面被隐形眼镜材料1204嵌入和/或包覆的隐形眼镜形态1112。在各种方面中，隐形眼镜材料1204可包括镜片材料216的结构和/或功能中的一个或多个(反之亦然)。例如，在一方面中，隐形眼镜材料1204是水凝胶，例如硅水凝胶。隐形眼镜1202也可包括隐形眼镜100、200、202、204的结构和/或功能中的一个或多个(反之亦然)。例如，隐形眼镜1202可包括完全嵌入在隐形眼镜材料1204中和/或部分被隐形眼镜材料1204覆盖的隐形眼镜形态1112。在一方面中，为了形成隐形眼镜1202，隐形眼镜形态1102被浸入液体隐形眼镜材料中，然后隐形眼镜材料被允许固化。
图13-15图示了根据本公开的某些方面的方法或流程图。虽然为了说明的简单，这些方法被示出和描述为一系列动作，但公开的主题不受动作的顺序所限，因为一些动作可按与本文示出和描述的顺序不同的顺序发生和/或与其它动作同时发生。例如，本领域技术人员将会理解并明白，方法可替换地被表示为一系列相关的状态或事件，例如表示在状态图中。另外，实现根据公开的主题的方法可能并不需要所有图示的动作。此外，要明白，本公开中公开的方法能够被存储在制品上以促进向计算机或其它计算设备传输和传送这种方法。
现在参考图13，呈现了根据一实施例的在本说明书中公开的系统和装置的示例应用的流程图。在一方面中，在示范性方法1300中，形成其中集成有硅片的隐形眼镜。在1310，通过在芯片的表面上形成多条金属线(例如利用光刻法)来在芯片上形成多个芯片接触垫。在1320，向在镜片衬底上形成的多个镜片接触垫中的每一个施加焊料溶液(例如，利用注射器)。在1330，经由焊料溶液将多个芯片接触垫接合到多个镜片接触垫以将芯片接合到镜片衬底(例如，利用倒装芯片接合器)。然后，在1340，将镜片衬底嵌入到水凝胶中以形成隐形眼镜。
现在参考图14，呈现了根据一实施例的在本说明书中公开的系统和装置的另一示例应用的流程图。在一方面中，在示范性方法1400中，形成其中集成有硅片的隐形眼镜。在1410，通过在芯片的表面上形成多条金属线(例如利用光刻法)来在芯片上形成多个芯片接触垫。在1420，向在镜片衬底上形成的多个镜片接触垫中的每一个施加焊料溶液(例如，利用注射器)。在1430，经由焊料溶液将多个芯片接触垫接合到多个镜片接触垫以将芯片接合到镜片衬底(例如，利用倒装芯片接合器)。在1450，将镜片衬底密封到芯片上(例如，利用密封剂1504)。在1460，镜片衬底被切割成环形并且被模塑以匹配将佩戴隐形眼镜的眼睛的曲率。然后，在1470，将镜片衬底嵌入到水凝胶中以形成隐形眼镜。
现在参考图15，呈现了根据一实施例的在本说明书中公开的系统和装置的示例应用的流程图。在一方面中，在示范性方法1500中，形成其中集成有硅片的隐形眼镜。在1510，通过在芯片的表面上形成多条金属线(例如利用光刻法)来在芯片上形成多个芯片接触垫。在1520，向多个芯片接触垫中的每一个施加焊料溶液(例如，利用注射器)。在1530，经由焊料溶液将多个芯片接触垫接合到多个镜片接触垫以将芯片接合到镜片衬底(例如，利用倒装芯片接合器)。然后，在1540，将镜片衬底嵌入到水凝胶中以形成隐形眼镜。

Claims (25)

1.一种用于制造具有集成电路的隐形眼镜的方法，包括：
通过在芯片的表面上形成多条金属线来在所述芯片上创建多个芯片接触垫；
向在镜片衬底上形成的多个镜片接触垫中的每一个施加组装接合材料；
经由所述组装接合材料将所述多个芯片接触垫接合到所述多个镜片接触垫以将所述芯片接合到所述镜片衬底；以及
将所述镜片衬底和接合在其上的所述芯片嵌入到隐形眼镜材料中以形成所述隐形眼镜。
2.如权利要求1所述的方法，其中，形成多条金属线包括利用光刻法来形成所述多条金属线。
3.如权利要求1所述的方法，还包括：在所述嵌入之前，将所述芯片密封在所述镜片衬底上。
4.如权利要求1所述的方法，还包括：在所述嵌入之前，将所述镜片衬底切割成环形并且模塑所述镜片衬底以匹配将佩戴所述隐形眼镜的眼睛的曲率。
5.如权利要求1所述的方法，其中，所述芯片具有约100微米或更小的厚度和约1.0毫米或更小的长度。
6.如权利要求1所述的方法，其中，所述隐形眼镜材料包括水凝胶、硅水凝胶或硅弹性体中的至少一者。
7.如权利要求1所述的方法，其中，所述接合是采用倒装芯片接合器来执行的。
8.一种其上或其中布置有集成电路的隐形眼镜，由包括如下步骤的过程形成：
通过在芯片的表面上形成多条金属线来在所述芯片上创建多个芯片接触垫；
向所述多个芯片接触垫中的每一个施加组装接合材料；
经由所述组装接合材料将所述多个芯片接触垫接合到在镜片衬底上形成的多个镜片接触垫以将所述芯片接合到所述镜片衬底；以及
将其上接合有所述芯片的所述镜片衬底嵌入到隐形眼镜材料中以形成所述隐形眼镜。
9.如权利要求8所述的隐形眼镜，其中，形成多条金属线的步骤包括利用光刻法来形成所述多条金属线。
10.如权利要求8所述的隐形眼镜，其中，所述过程还包括如下步骤：在所述嵌入之前，将所述芯片密封在所述镜片衬底上。
11.如权利要求8所述的隐形眼镜，其中，所述过程还包括以下步骤：在所述嵌入之前，将所述镜片衬底切割成环形并且模塑所述镜片衬底以匹配将佩戴所述隐形眼镜的眼睛的曲率。
12.如权利要求8所述的隐形眼镜，其中，所述芯片具有约100微米或更小的厚度和约1.0毫米或更小的长度。
13.如权利要求8所述的隐形眼镜，其中，所述接合是采用倒装芯片接合器来执行的。
14.如权利要求8所述的隐形眼镜，其中，所述隐形眼镜材料包括水凝胶、硅水凝胶或硅弹性体中的至少一者。
15.一种用于制造具有集成电路的隐形眼镜的方法，包括：
在镜片衬底上创建多个镜片接触垫；
在芯片上创建多个芯片接触垫；
向所述多个镜片接触垫或芯片接触垫中的每一个施加组装接合材料；
将所述多个镜片接触垫与所述多个芯片接触垫对齐；
利用倒装芯片接合经由所述组装接合材料将所述芯片接合到所述镜片衬底；以及
利用所述镜片衬底形成隐形眼镜。
16.如权利要求15所述的方法，其中，创建多个镜片接触垫包括利用光刻法在所述镜片衬底上形成多条金属线。
17.如权利要求15所述的方法，其中，创建多个镜片接触垫包括形成具有约100微米或更小的长度的多个金属方形。
18.如权利要求15所述的方法，其中，创建多个芯片接触垫包括利用光刻法在所述芯片上形成多条金属线。
19.如权利要求15所述的方法，其中，形成隐形眼镜包括：
将所述芯片密封在所述镜片衬底上；
将所述镜片衬底切割成环形并且模塑所述镜片衬底以匹配将佩戴所述隐形眼镜的眼睛的曲率；以及
将所述镜片衬底嵌入到水凝胶中。
20.如权利要求15所述的方法，其中，所述芯片具有约100微米或更小的厚度和约1.0毫米或更小的长度。
21.如权利要求15所述的方法，其中，经由所述组装接合材料将所述芯片接合到所述镜片衬底包括在200℃或更低的温度下使用压力和热量。
22.一种隐形眼镜，包括：
衬底；以及
嵌入在所述衬底内的硅片，所述硅片具有约100微米或更小的厚度和约1.0毫米或更小的长度。
23.如权利要求22所述的隐形眼镜，其中，所述硅片具有约50微米或更小的厚度和约1.0毫米或更小的长度。
24.如权利要求22所述的隐形眼镜，其中，所述衬底包括水凝胶、硅水凝胶或硅弹性体中的至少一者。
25.如权利要求22所述的隐形眼镜，其中，所述芯片被接合到嵌入在所述衬底内的聚合物材料并且所述芯片被利用聚对二甲苯密封在所述聚合物材料上。
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