CN104669787B - Liquid injection apparatus and its manufacture method - Google Patents
Liquid injection apparatus and its manufacture method Download PDFInfo
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- CN104669787B CN104669787B CN201310625960.2A CN201310625960A CN104669787B CN 104669787 B CN104669787 B CN 104669787B CN 201310625960 A CN201310625960 A CN 201310625960A CN 104669787 B CN104669787 B CN 104669787B
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Abstract
The present invention provides a kind of liquid injection apparatus and its manufacture method, wherein, method, which is included in substrate, forms multiple spaced pressure generating parts；Integrally formed pressure chamber corresponding with multiple pressure generating parts, the spray orifice connected with the pressure chamber and the public chamber connected with multiple pressure chamber on the first surface of substrate.Liquid injection apparatus and its manufacture method that the present invention is provided, it is integrally formed on the first surface of substrate and pressure chamber and public chamber, when needing to increase the quantity of pressure chamber of high liquid injection apparatus, because the present embodiment is the independent integrally formed pressure chamber in substrate, the mechanical strength of substrate thus will not be reduced, it can avoid substrate damaged in the fabrication process, so as to improve the yield rate of liquid injection apparatus, reduce manufacturing cost.
Description
Technical field
The present invention relates to printer technology, more particularly to a kind of liquid injection apparatus and its manufacture method.
Background technology
The liquid injection apparatus of printer is the deformation by piezoelectric element and oscillating plate, occurs the volume of pressure chamber
Change, so that the ink in pressure chamber be sprayed from spray orifice.
A kind of existing liquid injection apparatus include substrate, the oscillating plate that is arranged on the face of substrate first and piezoelectric element with
And it is bonded in the face of substrate second（The one side relative with the first face）On jet orifice plate.The manufacture method of existing liquid injection apparatus
It is：Oscillating plate and piezoelectric element are formed in the first face of substrate, in the second face of substrate by etch process, is lost on this substrate
Carve multiple corresponding with piezoelectric element position storage liquid pressure chamber and with corresponding public in ink supply hole site
Chamber, finally, jet orifice plate is bonded in the second face of matrix, multiple spray orifices in jet orifice plate is connected respectively with each pressure chamber
It is logical.Operationally, piezoelectric element is deformed the liquid injection apparatus under voltage driving, and is passed to oscillating plate and caused pressure
Chamber volume changes so that the liquid in pressure chamber sprays from spray orifice and completes printing.
But, in order to improve the print resolution of printer, it is necessary to increase the number of the pressure chamber of high liquid injection apparatus
Amount, because the pressure chamber of existing liquid injection apparatus is to etch to be formed in substrate, increase pressure chamber quantity needs to subtract
The sidewall thickness of small adjacent pressure chambers, thus the mechanical strength decline as the silicon chip of substrate is inevitably resulted in, manufacturing
Easily there is substrate breakage in journey and reduce the yield rate of liquid injection apparatus, manufacturing cost is higher；On the other hand, due to spray
Mouth plate is to be bonded in by adhesive in the substrate of pressure chamber, if adhesive is flowed into pressure chamber, also influences whether printing
Quality.
The content of the invention
The present invention provides a kind of liquid injection apparatus and its manufacture method, for solving liquid injection apparatus in the prior art
Liquid injection apparatus yield rate that manufacture method is produced is low, the technological deficiency that manufacturing cost is higher and print quality is poor.
A kind of liquid injection apparatus manufacture method that the present invention is provided, including：
Multiple spaced pressure generating parts are formed in substrate；
On the first surface of substrate integrally formed pressure chamber corresponding with multiple pressure generating parts, with it is described
The spray orifice of pressure chamber's connection and the public chamber connected with multiple pressure chamber.
The present invention also provides a kind of liquid injection apparatus, and the liquid injection apparatus is manufactured with above-mentioned liquid injection apparatus
Method manufacture.
Liquid injection apparatus and its manufacture method that the present invention is provided, are integrally formed with pressing on the first surface of substrate
Power chamber and public chamber, when needing to increase the quantity of pressure chamber of high liquid injection apparatus, due to the present embodiment be
Independent integrally formed pressure chamber in substrate, thus the mechanical strength of substrate will not be reduced, base can be avoided in the fabrication process
Bottom is damaged, so as to improve the yield rate of liquid injection apparatus, reduces manufacturing cost.
Brief description of the drawings
Fig. 1 is a kind of flow chart of liquid injection apparatus manufacture method provided in an embodiment of the present invention；
Fig. 2 is a kind of flow chart of embodiment of step 200 in Fig. 1；
Fig. 3 is a kind of flow chart of embodiment of step 100 in Fig. 1；
Fig. 4 is the flow chart of another liquid injection apparatus manufacture method provided in an embodiment of the present invention；
Fig. 5 is the structural representation for the liquid injection apparatus that the embodiment of the present invention is manufactured；
Fig. 6 A- Fig. 6 F are a kind of manufacture course of products structure of embodiment of step 200 in the embodiment of the present invention
View；
Fig. 7 A- Fig. 7 G are the manufacture course of products topology view of another embodiment of the invention；
Fig. 8 A- Fig. 8 C are the manufacture course of products topology view of a further embodiment of this invention；
Fig. 9 A- Fig. 9 B are the manufacture course of products topology view of a further embodiment of the present invention.
Embodiment
Fig. 1 is a kind of flow chart of liquid injection apparatus manufacture method provided in an embodiment of the present invention, as shown in figure 1, this
The liquid injection apparatus manufacture method that embodiment is provided, including：
Step 100, multiple spaced pressure generating parts are formed in substrate.
Step 200, the integrally formed pressure chamber corresponding with multiple pressure generating parts on the first surface of substrate
Room, the spray orifice connected with the pressure chamber and the public chamber connected with multiple pressure chamber.
Specifically, Fig. 2 is a kind of flow chart of embodiment of step 200 in Fig. 1；As shown in Fig. 2 step 200,
On the first surface of substrate integrally formed pressure chamber corresponding with multiple pressure generating parts, with the pressure chamber
The spray orifice of connection and the public chamber connected with multiple pressure chamber, can include：
Step 201, chamber layer is set on substrate first surface and exposed, the shape of pressure chamber and public chamber is limited
And position.
Specifically, Fig. 5 is the structural representation for the liquid injection apparatus that the embodiment of the present invention is manufactured；Fig. 6 A- Fig. 6 F are this
The manufacture course of products topology view of a kind of embodiment of step 200 in inventive embodiments, as shown in figs. 5 and 6, base
Bottom 1 can be silicon base, and the first surface of substrate 1 is the upper surface of substrate 1 shown in figure, can be hanged on the first surface of substrate 1
Chamber layer 5a is applied, chamber layer 5a material can be the negative light-sensitive glue SU8 with good mechanical processing characteristics, and chamber layer 5a can
To fill the whole upper surface of substrate 1, chamber layer 5a thickness and the height dimension of pressure chamber and public chamber match.
As shown in figs. 5 and 6b, chamber layer 5a can be exposed using mask plate 12a, and passes through mask plate 12a's
Structure type and exposure technology limit shape and the position of pressure chamber 5 and public chamber 7, wherein, chamber wall 5b is cured, no
The developer solution that can be used by subsequent technique is removed.
Step 202, the shading layer of the covering chamber layer is formed in the chamber layer.
As shown in Figure 6 C, specifically, shading layer 13 is deposited in chamber layer 5a upper surface, shading layer 13 covers whole chamber
Layer 5a upper surface, the material of shading layer 13 can be metallic aluminium or metallic titanium material.
Step 203, ejection layer is formed on the shading layer and is exposed, shape and the position of spray orifice is limited；
As shown in Figure 6 D, specifically, ejection layer 6a is coated with the upper surface of shading layer 13, ejection layer 6a can be covered entirely
The upper surface of shading layer 13, ejection layer 6a material can be the negative light-sensitive glue SU8 with good mechanical processing characteristics, spray orifice
Layer 6a thickness will meet the requirement to form spray orifice height.
As illustrated in fig. 6e, ejection layer 6a can be exposed using mask plate 12b, and passes through mask plate 12b knot
Configuration formula and exposure technology limit shape and the position of spray orifice, wherein, spray orifice wall 6b is cured, and will not be used by subsequent technique
Developer solution is removed.
Step 204, development forms pressure chamber, spray orifice and public chamber.
As fig 6 f illustrates, the propane diols formic acid esters of developer solution 1,2 can be used（PMEGA）Development chamber layer 5a and ejection layer
6a, the chamber wall 5b being cured and spray orifice wall 6b are retained, and remaining part forms pressure chamber 5, spray orifice 6 after being removed
With public chamber 7（Shown in Fig. 5）.
The liquid injection apparatus manufacture method that the present embodiment is provided, is integrally formed on the first surface of substrate and pressure
Chamber and public chamber, when needing to increase the quantity of pressure chamber of high liquid injection apparatus, because the present embodiment is in base
Independent integrally formed pressure chamber on bottom, thus the mechanical strength of substrate will not be reduced, substrate can be avoided in the fabrication process
Breakage, so as to improve the yield rate of liquid injection apparatus, reduces manufacturing cost.
In addition, in above-described embodiment, shading layer 13 can also be patterned using dry etching, specifically, can be by
The spray orifice wall 6b having been cured is as mask, in SiCl4Or SF6Atmosphere under pass through dry etching method pattern shading layer 13
Form the shape such as Fig. 6 F.In the present embodiment, shading layer 13 is set to prevent that light source penetrates spray orifice when exposing ejection layer 6a
Layer 6a has influence on unexposed region in chamber layer 5a, and it is possible to avoid the light-sensitive emulsion uncured when depositing ejection layer 6a
It can be mixed with unexposed region in chamber layer 5a, thus, set shading layer 13 to ensure ejection layer 6a flatness.
Fig. 3 is a kind of flow chart of embodiment of step 100 in Fig. 1, and Fig. 7 A- Fig. 7 G are implemented for the present invention is another
The manufacture course of products topology view of mode.As shown in figure 3, on the basis of above-described embodiment technical scheme, step 100,
Multiple spaced pressure generating parts are formed in substrate, can be included：
Step 101, etching substrate first surface formation groove.
As shown in Figure 7 A, specifically, substrate 1 first surface by dry etching or wet etching formation groove 2, should
Groove 2 is used to be installed with pressure generating part.
Step 102, piezoelectric element is formed in the groove, the upper surface of the piezoelectric element and the substrate first surface
Concordantly.
As shown in Figure 7 B, lower electrode layer 3c, piezoelectric body layer 3b and upper electricity can be sequentially formed in groove 2 by sputtering method
Pole layer 3a；Wherein, lower electrode layer 3c is titanium (Ti) layer, platinum (Pt) layer or multiple titanium layer superimposed layers；Piezoelectric body layer 3b is zirconium titanium
Lead plumbate (PZT) layer；Upper electrode layer 3a is platinum (Pt) layer or gold layer.
Step 103, oscillating plate is formed on substrate first surface, the oscillating plate lid is located at the outer of the piezoelectric element
Portion.
As seen in figure 7 c, Low Pressure Chemical Vapor Deposition or plasma enhanced chemical gas are passed through in the first surface of substrate 1
Phase sedimentation formation oscillating plate 4, the material of oscillating plate 4 can be SiO2Or Si3N4Or SiO2-Si3N4Lamination；The lid of oscillating plate 4 is set
Outside upper electrode layer 3a, and outer edge is covered in the first surface of substrate 1.
Then, as illustrated in fig. 7d, the manufacture method that can be provided using above-described embodiment forms pressure chamber 5, common cavity
Room 7 and spray orifice 6, above-mentioned chamber and spray orifice are formed using this method, can improve print resolution, and can realize that liquid sprays
The miniaturization of injection device.
Fig. 4 is the flow chart of another liquid injection apparatus manufacture method provided in an embodiment of the present invention；As shown in figure 4,
Further, in above-mentioned manufacture method after step 200, it can also include：
Step 300, the formation of etching substrate second surface and the ink supply aperture and and pressure generating part of public chamber
The cavity communicated.
As seen in figure 7e, the second surface of substrate 1 can be etched using dry etching（Illustrate substrate lower surface）, formed with
Ink supply aperture 8 that public chamber 7 is connected and the cavity 9 communicated with the lower electrode layer 3c in piezoelectric element 3, wherein, cavity 9 is can be with
Improve the Oscillation Amplitude of piezoelectric element 3.
In order to further improve the vibration performance of piezoelectric element 3, as shown in Figure 7 F, can the both sides of piezoelectric element 3 with
Gap 10 is formed between substrate 1, gap 10 can ensure that piezoelectric element 3, not by the constraint of substrate 1, improves vibration width in vibration
Degree.
Step 400, cover plate is set in substrate second surface, the cover plate lid sets on the cavity and keeps the ink supply aperture smooth
It is logical.
As shown in Figure 7 G, cover plate 11 is bonded in the second surface of substrate 1, completes the manufacturing process of liquid injection apparatus, cover plate
11 material can be PMA（PMMA）.
The step 200 in above-described embodiment technical scheme, it is described that multiple spaced pressure generations are formed in substrate
Part, can also be realized by other means, specifically, and step 200 can include：
Step 201 ', oscillating plate is formed on substrate first surface.
As shown in Figure 8 A, can be by Low Pressure Chemical Vapor Deposition or plasma enhanced chemical vapor deposition method in base
The first surface formation oscillating plate of bottom 1；Wherein, the material of the oscillating plate is SiO2Or Si3N4Or SiO2-Si3N4Lamination.
Step 202 ', form piezoelectric element on the oscillating plate.
As shown in Figure 8 B, by sputtering method formation lower electrode layer 3c, sol-gal process formation piezoelectric body layer 3b and it can splash
Penetrate method formation upper electrode layer 3a；Wherein, lower electrode layer 3c can be titanium (Ti) layer, platinum (Pt) layer or multiple titanium layer superimposed layers；
Piezoelectric body layer can be lead zirconate titanate (PZT) layer；Upper electrode layer can be platinum（Pt）Layer or gold layer.
As shown in Figure 8 C, it is then possible to which the manufacture method provided using above-described embodiment is pressed in the formation of the first surface of substrate 1
Power chamber 5, public chamber 7 and spray orifice 6.The second surface of substrate 1 etch to be formed the ink supply aperture 8 that is connected with public chamber 7 and
The cavity 9 communicated with the lower electrode layer 3c of pressure elements 3.Cover plate 11 is set in the second surface of substrate 1, the cover plate 11 lid sets cavity
On 9 and keep the hole of ink supply 9 unimpeded.
Fig. 9 A- Fig. 9 B are the manufacture course of products topology view of a further embodiment of the present invention.As shown in Figure 9 A, above-mentioned
On the basis of embodiment technical scheme, step 100, multiple spaced pressure generating parts are formed in substrate, specifically
For：
In the first surface deposition film resistive layer 3 ' of substrate 1, the material of the thin film resistive layer 3 ' is tantalum aluminium alloy or nickel chromium triangle
Alloy or tungsten silicon nitride or titanium nitride.
As shown in Figure 9 B, further, the ink supply aperture 8 that the formation of etching substrate 1 second surface is connected with public chamber 7.
The specific hydrojet process of liquid injection apparatus of embodiment manufacture is：Liquid reaches public by ink supply aperture 8
Chamber 7, meanwhile, apply pulse signal rear film resistive layer 3 ' and liquid is heated with 1000 DEG C/μ s speed, about to 340 DEG C of left sides
The right side makes volatile components gasification in liquid produce bubble, and ink droplet is extruded spray orifice 6 by bubble from original position；The formation of bubble is
Reversible, when releasing pulse signal, passive cooling can cause bubble moment to be vanished, at this moment, and ink droplet will be from spray orifice 6 thoroughly
Spray.
The present invention also provides a kind of liquid injection apparatus, and the liquid injection apparatus is the liquid spray provided with above-described embodiment
The manufacture of injection device manufacture method.The liquid injection apparatus that the present embodiment is provided, is integrally formed on the first surface of substrate
With pressure chamber and public chamber, when needing to increase the quantity of pressure chamber of high liquid injection apparatus, due to the present embodiment
The independent integrally formed pressure chamber in substrate, thus will not smaller substrate mechanical strength, can keep away in the fabrication process
Exempt from substrate damaged, so as to improve the yield rate of liquid injection apparatus, reduce manufacturing cost.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, or which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a kind of liquid injection apparatus manufacture method, it is characterised in that including：
Multiple spaced pressure generating parts are formed in substrate；
On the first surface of substrate integrally formed pressure chamber corresponding with multiple pressure generating parts, with the pressure
The spray orifice of chamber and the public chamber connected with multiple pressure chamber；
The pressure chamber corresponding with multiple pressure generating parts integrally formed on the first surface of substrate, with it is described
The spray orifice of pressure chamber's connection and the public chamber connected with multiple pressure chamber, also include afterwards：
The cavity that etching substrate second surface formation is communicated with the ink supply aperture of public chamber and with pressure generating part；
Cover plate is set in substrate second surface, the cover plate lid sets on the cavity and keeps the ink supply aperture unimpeded.
2. liquid injection apparatus manufacture method according to claim 1, it is characterised in that described one on the first surface of substrate
Body shape pressure chamber corresponding with multiple pressure generating parts, the spray orifice connected with the pressure chamber and with it is multiple
The public chamber of pressure chamber's connection, including：
Chamber layer is set on substrate first surface and exposed, shape and the position of pressure chamber and public chamber is limited；
The shading layer of the covering chamber layer is formed in the chamber layer；
Ejection layer is formed on the shading layer and is exposed, shape and the position of spray orifice is limited；
Development forms pressure chamber, spray orifice and public chamber.
3. liquid injection apparatus manufacture method according to claim 1, it is characterised in that described to form multiple in substrate
Spaced pressure generating part, including：
Etch substrate first surface formation groove；
Piezoelectric element is formed in the groove, the upper surface of the piezoelectric element is concordant with the substrate first surface；
Oscillating plate is formed on substrate first surface, the oscillating plate lid is located at the outside of the piezoelectric element.
4. liquid injection apparatus manufacture method according to claim 3, it is characterised in that described to be formed in the groove
Piezoelectric element, including：
Lower electrode layer, piezoelectric body layer and upper electrode layer are sequentially formed in the groove by sputtering method；Wherein, the bottom electrode
Layer is titanium layer, platinum layer or multiple titanium layer superimposed layers；The piezoelectric body layer is lead zirconate titanate layer；The upper electrode layer is platinum layer
Or gold layer.
5. liquid injection apparatus manufacture method according to claim 3, it is characterised in that the etching substrate second surface
The cavity communicated with the ink supply aperture of public chamber and with pressure generating part is formed, is also included afterwards：
Gap is formed between the both sides of the piezoelectric element and the substrate.
6. liquid injection apparatus manufacture method according to claim 1, it is characterised in that described to form multiple in substrate
Spaced pressure generating part, including：
Oscillating plate is formed on substrate first surface；
Piezoelectric element is formed on the oscillating plate.
7. the liquid injection apparatus manufacture method according to claim 3 or 4 or 6, it is characterised in that：
It is described to include in substrate first surface formation oscillating plate：Pass through Low Pressure Chemical Vapor Deposition or plasma enhanced chemical
Vapour deposition process formation oscillating plate；Wherein, the material of the oscillating plate is SiO2Or Si3N4Or SiO2-Si3N4Lamination.
8. liquid injection apparatus manufacture method according to claim 6, it is characterised in that the shape on the oscillating plate
Include into piezoelectric element：
Pass through sputtering method formation lower electrode layer, sol-gal process formation piezoelectric body layer and sputtering method formation upper electrode layer；Wherein, institute
Lower electrode layer is stated for titanium layer, platinum layer or multiple titanium layer superimposed layers；The piezoelectric body layer is lead zirconate titanate layer；The upper electrode layer
For platinum layer or gold layer.
9. liquid injection apparatus manufacture method according to claim 1, it is characterised in that described to form multiple in substrate
Spaced pressure generating part, including：
In substrate first surface deposition film resistive layer, the material of the thin film resistive layer is tantalum aluminium alloy or nichrome or tungsten silicon
Nitride or titanium nitride.
10. a kind of liquid injection apparatus, it is characterised in that the liquid injection apparatus is with any one of claim 1 to 9
Liquid injection apparatus manufacture method manufacture.
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| CN201310625960.2A CN104669787B (en) | 2013-11-28 | 2013-11-28 | Liquid injection apparatus and its manufacture method |
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| CN104669787B true CN104669787B (en) | 2017-11-03 |
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| CN101003206A (en) * | 2006-01-20 | 2007-07-25 | 三星电机株式会社 | Inkjet printer head and fabricating method thereof |
| CN101112817A (en) * | 2006-07-26 | 2008-01-30 | 国际联合科技股份有限公司 | Ink jet printing head and its producing method |
| CN101491973A (en) * | 2008-01-21 | 2009-07-29 | 精工爱普生株式会社 | Manufacturing mehtod of liquid spray head and liquid spraying device |
| CN103085479A (en) * | 2013-02-04 | 2013-05-08 | 珠海纳思达企业管理有限公司 | Ink nozzle and manufacturing method thereof |
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2013
- 2013-11-28 CN CN201310625960.2A patent/CN104669787B/en active Active
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| US6447102B1 (en) * | 1998-03-02 | 2002-09-10 | Hewlett-Packard Company | Direct imaging polymer fluid jet orifice |
| CN1839046A (en) * | 2003-09-17 | 2006-09-27 | 惠普开发有限公司 | Plurality of barrier layers |
| CN101003206A (en) * | 2006-01-20 | 2007-07-25 | 三星电机株式会社 | Inkjet printer head and fabricating method thereof |
| CN101112817A (en) * | 2006-07-26 | 2008-01-30 | 国际联合科技股份有限公司 | Ink jet printing head and its producing method |
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Also Published As
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| CN104669787A (en) | 2015-06-03 |
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