CN104669787A - Liquid ejection device and manufacturing method of liquid ejection device - Google Patents
Liquid ejection device and manufacturing method of liquid ejection device Download PDFInfo
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- CN104669787A CN104669787A CN201310625960.2A CN201310625960A CN104669787A CN 104669787 A CN104669787 A CN 104669787A CN 201310625960 A CN201310625960 A CN 201310625960A CN 104669787 A CN104669787 A CN 104669787A
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- layer
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- chamber
- liquid injection
- injection apparatus
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Abstract
The invention provides a liquid ejection device and a manufacturing method of the liquid ejection device. The method comprises the steps of forming a plurality of pressure generating components which are arranged at intervals on a base; and integrally forming a plurality of pressure chambers corresponding to the pressure generating components, orifices communicated with the pressure chambers and a public chamber communicated with the pressure chambers on the first surface of the base. According to the liquid ejection device and the manufacturing method of the liquid ejection device provided by the invention, the pressure chambers and the public chamber are integrally formed on the first surface of the base; when the number of the pressure chambers of the liquid ejection device needs to be increased, the pressure chambers are independently and integrally formed on the base according to the embodiment, so that the mechanical strength of the base is not reduced, and the base is prevented from being damaged during a manufacturing process; in such a way, the yield of the liquid ejection device is improved, and the manufacturing cost is reduced.
Description
Technical field
The present invention relates to printer technology, particularly relate to a kind of liquid injection apparatus and manufacture method thereof.
Background technology
The liquid injection apparatus of printer is the distortion by piezoelectric element and oscillating plate, the volume of pressure chamber is changed, thus is sprayed from spray orifice by the ink in pressure chamber.
The jet orifice plate that existing a kind of liquid injection apparatus comprises substrate, be arranged on oscillating plate on substrate first surface and piezoelectric element and be bonded in substrate second (one side relative with first surface).The manufacture method of existing liquid injection apparatus is: form oscillating plate and piezoelectric element at the first surface of substrate, second in substrate is passed through etch process, etch the pressure chamber of multiple storage of liquids corresponding with piezoelectric element position and the public chamber corresponding with ink supply aperture position on this substrate, finally, in second bonding jet orifice plate of matrix, the multiple spray orifices in jet orifice plate are communicated with respectively with each pressure chamber.Operationally, piezoelectric element produces distortion to this liquid injection apparatus under voltage driven, and passes to oscillating plate and cause pressure chamber's Volume Changes, makes the liquid in pressure chamber spray from spray orifice and complete printing.
But, in order to improve the print resolution of printer, need the quantity of the pressure chamber increasing high liquid injection apparatus, pressure chamber due to existing liquid injection apparatus is that etching is formed in substrate, increase the sidewall thickness that pressure chamber's number needs will reduce adjacent pressure chambers, thus the mechanical strength as the silicon chip of substrate will inevitably be caused to decline, and easily occur substrate breakage in the fabrication process and the yield rate of liquid injection apparatus is reduced, manufacturing cost is higher; On the other hand, because nozzle plate is bonded in the substrate of pressure chamber by adhesive, if adhesive flows in pressure chamber, also print quality can be had influence on.
Summary of the invention
The invention provides a kind of liquid injection apparatus and manufacture method thereof, for solving, the liquid injection apparatus yield rate that liquid injection apparatus manufacture method in prior art produces is low, manufacturing cost is higher and the technological deficiency that print quality is poor.
A kind of liquid injection apparatus manufacture method provided by the invention, comprising:
Substrate is formed multiple spaced pressure generating part;
Integrally formed and the pressure chamber that multiple described pressure generating part is corresponding, the spray orifice be communicated with described pressure chamber and the public chamber be communicated with multiple described pressure chamber on the first surface of substrate.
The present invention also provides a kind of liquid injection apparatus, and this liquid injection apparatus manufactures by above-mentioned liquid injection apparatus manufacture method.
Liquid injection apparatus provided by the invention and manufacture method thereof, integrally formed with pressure chamber and public chamber on the first surface of substrate, when needing the quantity of the pressure chamber increasing high liquid injection apparatus, because the present embodiment is independent integrally formed pressure chamber in substrate, thus the mechanical strength of substrate can not be reduced, substrate can be avoided in the fabrication process damaged, thus improve the yield rate of liquid injection apparatus, reduce manufacturing cost.
Accompanying drawing explanation
The flow chart of a kind of liquid injection apparatus manufacture method that Fig. 1 provides for the embodiment of the present invention;
Fig. 2 is the flow chart of a kind of detailed description of the invention of step 200 in Fig. 1;
Fig. 3 is the flow chart of a kind of detailed description of the invention of step 100 in Fig. 1;
The flow chart of the another kind of liquid injection apparatus manufacture method that Fig. 4 provides for the embodiment of the present invention;
Fig. 5 is the structural representation of the liquid injection apparatus that the embodiment of the present invention manufactures;
Fig. 6 A-Fig. 6 F is the manufacture course of products topology view of a kind of detailed description of the invention of step 200 in the embodiment of the present invention;
Fig. 7 A-Fig. 7 G is the manufacture course of products topology view of another embodiment of the present invention;
Fig. 8 A-Fig. 8 C is the manufacture course of products topology view of the another embodiment of the present invention;
Fig. 9 A-Fig. 9 B is the manufacture course of products topology view of the present invention's embodiment again.
Detailed description of the invention
The flow chart of a kind of liquid injection apparatus manufacture method that Fig. 1 provides for the embodiment of the present invention, as shown in Figure 1, the liquid injection apparatus manufacture method that the present embodiment provides, comprising:
Step 100, substrate is formed multiple spaced pressure generating part.
Step 200, integrally formed and the pressure chamber that multiple described pressure generating part is corresponding, the spray orifice be communicated with described pressure chamber and the public chamber be communicated with multiple described pressure chamber on the first surface of substrate.
Particularly, Fig. 2 is the flow chart of a kind of detailed description of the invention of step 200 in Fig. 1; As shown in Figure 2, step 200, integrally formed and the pressure chamber that multiple described pressure generating part is corresponding, the spray orifice be communicated with described pressure chamber and the public chamber be communicated with multiple described pressure chamber on the first surface of substrate, can comprise:
Step 201, substrate first surface arranges chamber layer and exposes, and limits shape and the position of pressure chamber and public chamber.
Particularly, Fig. 5 is the structural representation of the liquid injection apparatus that the embodiment of the present invention manufactures; Fig. 6 A-Fig. 6 F is the manufacture course of products topology view of a kind of detailed description of the invention of step 200 in the embodiment of the present invention, as shown in figs. 5 and 6, substrate 1 can be silicon base, the upper surface that substrate 1 first surface is substrate 1 shown in figure, chamber layer 5a can be coated with on substrate 1 first surface, the material of chamber layer 5a can for having the negative light-sensitive glue SU8 of good mechanical processing characteristics, chamber layer 5a can fill whole substrate 1 upper surface, and the height dimension of the thickness of chamber layer 5a and pressure chamber and public chamber matches.
As shown in figs. 5 and 6b, mask plate 12a can be adopted to expose chamber layer 5a, and limit shape and the position of pressure chamber 5 and public chamber 7 by the version of mask plate 12a and exposure technology, wherein, chamber wall 5b is cured, and can not be removed by the developer solution that subsequent technique adopts.
Step 202, described chamber layer is formed the shading layer covering described chamber layer.
As shown in Figure 6 C, particularly, at the upper surface deposition shading layer 13 of chamber layer 5a, shading layer 13 covers the upper surface of whole chamber layer 5a, and the material of shading layer 13 can be metallic aluminium or metallic titanium material.
Step 203, described shading layer forms ejection layer and exposes, and limits shape and the position of spray orifice;
As shown in Figure 6 D, particularly, ejection layer 6a is coated with at the upper surface of shading layer 13, ejection layer 6a can cover the upper surface of whole shading layer 13, the material of ejection layer 6a can for having the negative light-sensitive glue SU8 of good mechanical processing characteristics, and the thickness of ejection layer 6a will meet the requirement forming spray orifice height.
As illustrated in fig. 6e, mask plate 12b can be adopted to expose ejection layer 6a, and limit shape and the position of spray orifice by the version of mask plate 12b and exposure technology, wherein, spray orifice wall 6b is cured, and can not be removed by the developer solution that subsequent technique adopts.
Step 204, development mineralization pressure chamber, spray orifice and public chamber.
As fig 6 f illustrates, developer solution 1 can be adopted, develop chamber layer 5a and ejection layer 6a, the chamber wall 5b be cured and spray orifice wall 6b of 2 propane diols formic acid esters (PMEGA) is retained, and remaining part is removed shown in rear mineralization pressure chamber 5, spray orifice 6 and public chamber 7(Fig. 5).
The liquid injection apparatus manufacture method that the present embodiment provides, integrally formed with pressure chamber and public chamber on the first surface of substrate, when needing the quantity of the pressure chamber increasing high liquid injection apparatus, because the present embodiment is independent integrally formed pressure chamber in substrate, thus the mechanical strength of substrate can not be reduced, substrate can be avoided in the fabrication process damaged, thus improve the yield rate of liquid injection apparatus, reduce manufacturing cost.
In addition, in above-described embodiment, shading layer 13 also can adopt dry etching to carry out patterning, concrete, the spray orifice wall 6b had cured can be used as mask, at SiCl
4or SF
6atmosphere under formed as the shape of Fig. 6 E by dry etching method patterning shading layer 13.In the present embodiment, arranging shading layer 13 can prevent when exposing ejection layer 6a, light source penetrates ejection layer 6a and has influence on unexposed region in chamber layer 5a, and, the uncured light-sensitive emulsion when depositing ejection layer 6a can be avoided to mix with region unexposed in chamber layer 5a, thus, the flatness that shading layer 13 can ensure ejection layer 6a is set.
Fig. 3 is the flow chart of a kind of detailed description of the invention of step 100 in Fig. 1, and Fig. 7 A-Fig. 7 G is the manufacture course of products topology view of another embodiment of the present invention.As shown in Figure 3, on the basis of above-described embodiment technical scheme, step 100, substrate is formed multiple spaced pressure generating part, can comprise:
Step 101, etching substrate first surface forms groove.
As shown in Figure 7 A, particularly, form groove 2 at the first surface of substrate 1 by dry etching or wet etching, this groove 2 is for being installed with pressure generating part.
Step 102, forms piezoelectric element in described groove, and the upper surface of this piezoelectric element is concordant with described substrate first surface.
As shown in Figure 7 B, lower electrode layer 3c, piezoelectric body layer 3b and upper electrode layer 3a can be formed successively by sputtering method in groove 2; Wherein, lower electrode layer 3c is titanium (Ti) layer, platinum (Pt) layer or multiple titanium layer superimposed layer; Piezoelectric body layer 3b is lead zirconate titanate (PZT) layer; Upper electrode layer 3a is platinum (Pt) layer or gold layer.
Step 103, substrate first surface forms oscillating plate, and described oscillating plate lid is located at the outside of described piezoelectric element.
As seen in figure 7 c, form oscillating plate 4 at substrate 1 first surface by Low Pressure Chemical Vapor Deposition or plasma enhanced chemical vapor deposition method, the material of oscillating plate 4 can be SiO
2or Si
3n
4or SiO
2-Si
3n
4lamination; It is outside that oscillating plate 4 lid is located at upper electrode layer 3a, and outer edge is covered in the first surface of substrate 1.
Then, as illustrated in fig. 7d, manufacture method mineralization pressure chamber 5, public chamber 7 and the spray orifice 6 that above-described embodiment can be adopted to provide, adopt the method to form above-mentioned chamber and spray orifice, can print resolution be improved, and the miniaturization of liquid injection apparatus can be realized.
The flow chart of the another kind of liquid injection apparatus manufacture method that Fig. 4 provides for the embodiment of the present invention; As shown in Figure 4, further, in above-mentioned manufacture method after step 200, can also comprise:
Step 300, etching substrate second surface is formed and the ink supply aperture of public chamber and the cavity that communicates with pressure generating part.
As seen in figure 7e, dry etching can be adopted to etch substrate 1 second surface (diagram substrate lower surface), form the ink supply aperture 8 be communicated with public chamber 7 and the cavity 9 communicated with the lower electrode layer 3c in piezoelectric element 3, wherein, cavity 9 is the Oscillation Amplitudes that can improve piezoelectric element 3.
In order to improve the vibration performance of piezoelectric element 3 further, as shown in Figure 7 F, can form gap 10 between the both sides of piezoelectric element 3 and substrate 1, gap 10 can ensure the constraint of piezoelectric element 3 when vibrating not by substrate 1, improves Oscillation Amplitude.
Step 400, arranges cover plate at substrate second surface, and this cover plate lid to be established on described cavity and kept described ink supply aperture unimpeded.
As shown in Figure 7 G, at substrate 1 second surface bonding cover plate 11, complete the manufacturing process of liquid injection apparatus, the material of cover plate 11 can be PMA (PMMA).
Step 200 in above-described embodiment technical scheme, describedly forms multiple spaced pressure generating part in substrate, and can also realize by other means, particularly, step 200 can comprise:
Step 201 ', substrate first surface forms oscillating plate.
As shown in Figure 8 A, oscillating plate can be formed by Low Pressure Chemical Vapor Deposition or plasma enhanced chemical vapor deposition method at substrate 1 first surface; Wherein, the material of described oscillating plate is SiO
2or Si
3n
4or SiO
2-Si
3n
4lamination.
Step 202 ', described oscillating plate forms piezoelectric element.
As shown in Figure 8 B, lower electrode layer 3c can be formed by sputtering method, sol-gal process forms piezoelectric body layer 3b and sputtering method forms upper electrode layer 3a; Wherein, lower electrode layer 3c can be titanium (Ti) layer, platinum (Pt) layer or multiple titanium layer superimposed layer; Piezoelectric body layer can be lead zirconate titanate (PZT) layer; Upper electrode layer can be platinum (Pt) layer or gold layer.
As shown in Figure 8 C, then, the manufacture method that above-described embodiment can be adopted to provide is at substrate 1 first surface mineralization pressure chamber 5, public chamber 7 and spray orifice 6.The ink supply aperture 8 be communicated with public chamber 7 and the cavity 9 communicated with the lower electrode layer 3c of pressure elements 3 is formed in the etching of substrate 1 second surface.Arrange cover plate 11 at substrate 1 second surface, this cover plate 11 covers to be established on cavity 9 and keeps ink supply 9 hole unimpeded.
Fig. 9 A-Fig. 9 B is the manufacture course of products topology view of the present invention's embodiment again.As shown in Figure 9 A, on the basis of above-described embodiment technical scheme, step 100, substrate is formed multiple spaced pressure generating part, is in particular:
At substrate 1 first surface deposit film resistive layer 3 ', the material of this thin film resistive layer 3 ' is tantalum aluminium alloy or nichrome or tungsten silicon nitride or titanium nitride.
As shown in Figure 9 B, further, etch substrate 1 second surface and form the ink supply aperture 8 be communicated with public chamber 7.
The concrete hydrojet process of the liquid injection apparatus of this embodiment manufacture is: liquid arrives public chamber 7 by ink supply aperture 8, simultaneously, apply pulse signal rear film resistive layer 3 ' with the heating rate liquid of 1000 DEG C/μ s, approximately make volatile components gasification in liquid produce bubble to about 340 DEG C, bubble extrudes spray orifice 6 ink droplet from original position; The formation of bubble is reversible, and when removing pulse signal, passive cooling can cause bubble to be vanished instantaneously, and at this moment, ink droplet thoroughly will spray from spray orifice 6.
The present invention also provides a kind of liquid injection apparatus, and this liquid injection apparatus manufactures by the liquid injection apparatus manufacture method that above-described embodiment provides.The liquid injection apparatus that the present embodiment provides, integrally formed with pressure chamber and public chamber on the first surface of substrate, when needing the quantity of the pressure chamber increasing high liquid injection apparatus, because the present embodiment is independent integrally formed pressure chamber in substrate, thus can not the mechanical strength of less substrate, substrate can be avoided in the fabrication process damaged, thus improve the yield rate of liquid injection apparatus, reduce manufacturing cost.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (13)
1. a liquid injection apparatus manufacture method, is characterized in that, comprising:
Substrate is formed multiple spaced pressure generating part;
Integrally formed and the pressure chamber that multiple described pressure generating part is corresponding, the spray orifice be communicated with described pressure chamber and the public chamber be communicated with multiple described pressure chamber on the first surface of substrate.
2. liquid injection apparatus manufacture method according to claim 1, it is characterized in that, described on the first surface of substrate integrally formed and the pressure chamber that multiple described pressure generating part is corresponding, the spray orifice be communicated with described pressure chamber and the public chamber be communicated with multiple described pressure chamber, comprising:
Substrate first surface arrange chamber layer and exposes, limiting shape and the position of pressure chamber and public chamber;
Described chamber layer is formed the shading layer covering described chamber layer;
Described shading layer form ejection layer and exposes, limiting shape and the position of spray orifice;
Development mineralization pressure chamber, spray orifice and public chamber.
3. liquid injection apparatus manufacture method according to claim 1, is characterized in that, describedly in substrate, forms multiple spaced pressure generating part, comprising:
Etching substrate first surface forms groove;
In described groove, form piezoelectric element, the upper surface of this piezoelectric element is concordant with described substrate first surface;
Substrate first surface forms oscillating plate, and described oscillating plate lid is located at the outside of described piezoelectric element.
4. liquid injection apparatus manufacture method according to claim 3, is characterized in that, describedly in described groove, forms piezoelectric element, comprising:
In described groove, lower electrode layer, piezoelectric body layer and upper electrode layer is formed successively by sputtering method; Wherein, described lower electrode layer is titanium layer, platinum layer or multiple titanium layer superimposed layer; Described piezoelectric body layer is lead zirconate titanate layer; Described upper electrode layer is platinum layer or gold layer.
5. the liquid injection apparatus manufacture method according to claim 3 or 4, it is characterized in that, described on the first surface of substrate integrally formed and the pressure chamber that multiple described pressure generating part is corresponding, the spray orifice be communicated with described pressure chamber and the public chamber be communicated with multiple described pressure chamber, also comprise afterwards:
Etching substrate second surface is formed and the ink supply aperture of public chamber and the cavity that communicates with pressure generating part;
Arrange cover plate at substrate second surface, this cover plate lid to be established on described cavity and is kept described ink supply aperture unimpeded.
6. liquid injection apparatus manufacture method according to claim 5, is characterized in that, described etching substrate second surface is formed and the ink supply aperture of public chamber and the cavity that communicates with pressure generating part, also comprises afterwards:
Gap is formed between the both sides of described piezoelectric element and described substrate.
7. liquid injection apparatus manufacture method according to claim 1, is characterized in that, describedly in substrate, forms multiple spaced pressure generating part, comprising:
Substrate first surface forms oscillating plate;
Described oscillating plate forms piezoelectric element.
8. the liquid injection apparatus manufacture method according to claim 3 or 4 or 7, is characterized in that:
Describedly form oscillating plate at substrate first surface and comprise: form oscillating plate by Low Pressure Chemical Vapor Deposition or plasma enhanced chemical vapor deposition method; Wherein, the material of described oscillating plate is SiO
2or Si
3n
4or SiO
2-Si
3n
4lamination.
9. liquid injection apparatus manufacture method according to claim 7, is characterized in that, describedly on described oscillating plate, forms piezoelectric element comprise:
Form lower electrode layer by sputtering method, sol-gal process forms piezoelectric body layer and sputtering method forms upper electrode layer; Wherein, described lower electrode layer is titanium layer, platinum layer or multiple titanium layer superimposed layer; Described piezoelectric body layer is lead zirconate titanate layer; Described upper electrode layer is platinum layer or gold layer.
10. the liquid injection apparatus manufacture method according to claim 7 or 9, it is characterized in that, described on the first surface of substrate integrally formed and the pressure chamber that multiple described pressure generating part is corresponding, the spray orifice be communicated with described pressure chamber and the public chamber be communicated with multiple described pressure chamber, also comprise afterwards:
Formed and the ink supply aperture of public chamber and the cavity that communicates with pressure generating part in substrate second surface etching;
Arrange cover plate at substrate second surface, this cover plate lid to be established on described cavity and is kept described ink supply aperture unimpeded.
11. liquid injection apparatus manufacture methods according to claim 1, is characterized in that, describedly in substrate, form multiple spaced pressure generating part, comprising:
At substrate first surface deposit film resistive layer, the material of this thin film resistive layer is tantalum aluminium alloy or nichrome or tungsten silicon nitride or titanium nitride.
12. liquid injection apparatus manufacture methods according to claim 11, it is characterized in that, described on the first surface of substrate integrally formed and the pressure chamber that multiple described pressure generating part is corresponding, the spray orifice be communicated with described pressure chamber and the public chamber be communicated with multiple described pressure chamber, also comprise afterwards:
Etching substrate second surface forms the ink supply aperture with public chamber.
13. 1 kinds of liquid injection apparatus, is characterized in that, this liquid injection apparatus manufactures by the liquid injection apparatus manufacture method according to any one of claim 1 to 12.
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|---|---|---|---|
| CN201310625960.2A CN104669787B (en) | 2013-11-28 | 2013-11-28 | Liquid injection apparatus and its manufacture method |
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| CN104669787B CN104669787B (en) | 2017-11-03 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6447102B1 (en) * | 1998-03-02 | 2002-09-10 | Hewlett-Packard Company | Direct imaging polymer fluid jet orifice |
| CN1839046A (en) * | 2003-09-17 | 2006-09-27 | 惠普开发有限公司 | Plurality of barrier layers |
| CN101003206A (en) * | 2006-01-20 | 2007-07-25 | 三星电机株式会社 | Inkjet printer head and fabricating method thereof |
| CN101112817A (en) * | 2006-07-26 | 2008-01-30 | 国际联合科技股份有限公司 | Ink jet printing head and its producing method |
| CN101491973A (en) * | 2008-01-21 | 2009-07-29 | 精工爱普生株式会社 | Manufacturing mehtod of liquid spray head and liquid spraying device |
| CN103085479A (en) * | 2013-02-04 | 2013-05-08 | 珠海纳思达企业管理有限公司 | Ink nozzle and manufacturing method thereof |
-
2013
- 2013-11-28 CN CN201310625960.2A patent/CN104669787B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6447102B1 (en) * | 1998-03-02 | 2002-09-10 | Hewlett-Packard Company | Direct imaging polymer fluid jet orifice |
| CN1839046A (en) * | 2003-09-17 | 2006-09-27 | 惠普开发有限公司 | Plurality of barrier layers |
| CN101003206A (en) * | 2006-01-20 | 2007-07-25 | 三星电机株式会社 | Inkjet printer head and fabricating method thereof |
| CN101112817A (en) * | 2006-07-26 | 2008-01-30 | 国际联合科技股份有限公司 | Ink jet printing head and its producing method |
| CN101491973A (en) * | 2008-01-21 | 2009-07-29 | 精工爱普生株式会社 | Manufacturing mehtod of liquid spray head and liquid spraying device |
| CN103085479A (en) * | 2013-02-04 | 2013-05-08 | 珠海纳思达企业管理有限公司 | Ink nozzle and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104669787B (en) | 2017-11-03 |
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