CN104616859A - Miniature inductor and manufacturing method thereof - Google Patents
Miniature inductor and manufacturing method thereof Download PDFInfo
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- CN104616859A CN104616859A CN201310537504.2A CN201310537504A CN104616859A CN 104616859 A CN104616859 A CN 104616859A CN 201310537504 A CN201310537504 A CN 201310537504A CN 104616859 A CN104616859 A CN 104616859A
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Abstract
The invention provides a miniature inductor. The miniature inductor comprises a magnetic core and a coil, wherein the coil comprises a supporting body and a distribution line, the supporting body is of a barrel-shaped structure, the distribution line is spirally arranged on the supporting body, and the magnetic core is arranged on the inner side of the supporting body. The miniature inductor is excellent in comprehensive performance, easy to manufacture and low in cost. The invention further provides a manufacturing method of the miniature inductor.
Description
Technical field
The present invention relates to a kind of inductance, be specifically related to a kind of miniature inductance and preparation method thereof.
Background technology
Inductance is widely used in electric equipment.In order to adapt to the electric equipment such as portable phone, palmtop PC to development that is miniaturized and slimming, inductance is gradually to microminiaturized and slimming development.
Because the volume of miniature inductance is little, especially thinner thickness (thickness is below grade), cannot obtain this miniature inductance for the conventional fabrication method (directly on magnetic core around the home coil) making the larger inductance of volume.At present, miniature inductance is obtained by depositing operation, and namely magnetic core and coil are all made by depositing operation.But the cost of manufacture of depositing operation is higher, especially for the cost of manufacture of magnetic core.Because the thickness of magnetic core directly affects the combination property of miniature inductance, the thickness of magnetic core is thinner, and the combination property of miniature inductance is poorer; But increase the thickness of magnetic core, the cost of miniature inductance can be increased again.That is, depositing operation making miniature inductance is adopted cannot to take into account combination property and the processing cost of miniature inductance.
Summary of the invention
The technical problem to be solved in the present invention is exactly the above-mentioned defect for existing in miniature inductance, provides a kind of miniature inductance and preparation method thereof, its high comprehensive performance, and processing cost is low.
For this reason, the invention provides a kind of miniature inductance, comprise magnetic core and coil, described coil comprises supporter and wiring, and described supporter is located in described wiring in a spiral manner, and described magnetic core is embedded in the inner side of described supporter.
Wherein, described supporter is the flexible supporter adopting flexible material to support, and described wiring is located at described flexible supporter with depositional mode, and described supporter is bent to form hollow column structure.
Wherein, described supporter is the rigid support body of the open column shape structure that hard material is made, described rigid support body is provided with recess and spiral groove, described recess is located at the end of described groove, described wiring is located in described spiral groove, pad is set at described recess, and makes that described pad is corresponding with the end of described wiring to be electrically connected.
Wherein, described supporter comprises the first supporter and the second supporter, described first supporter and described second supporter are equipped with wire segment, the wire segment being located at described first supporter and the wire segment being located at described second supporter are electrically connected by electric connecting part correspondence, so that described wire segment head and the tail are connected to form wiring.
Wherein, described magnetic core adopts Ferrite Material to make, and passes through sintering processing or use panel machine machine-shaping.
Wherein, the thickness of described magnetic core is more than or equal to 30 microns, and is less than 2.0 millimeters.
Wherein, the thickness of described magnetic core is more than or equal to 70 microns, and is less than 0.7 millimeter.
Wherein, described magnetic core adopts the Ferrite Material of 5MHz ~ 3GHz to make.
Wherein, described magnetic core adopts the Ferrite Material of 9MHz ~ 20MHz to make.
Wherein, also comprise pad, for the electrical connection of described coil and external devices.
Wherein, also comprise encapsulated layer, for encapsulating described coil and described magnetic core.
Wherein, described miniature inductance is as the antenna of communication field.
The present invention also provides a kind of manufacture method of miniature inductance, comprising:
Magnetic core is provided;
There is provided coil, described coil comprises supporter and the wiring of tubular, and described supporter is located in described wiring in a spiral manner;
Described magnetic core be located at the inner side of the described supporter of tubular and fix.
Wherein, described coil obtains in the following manner:
The described supporter of tabular is provided;
Described supporter makes multistage wiring;
Two opposite ends of described supporter are connected, and makes the staggered corresponding electrical connection of described each section of wiring, to form the continuous described wiring of spirality.
Wherein, the shape of described supporter is square tubular structure, rounded cylindrical structure or triangle tubular structure.
Wherein, described supporter is flexible supporter, and described wiring is located at described flexible supporter with depositional mode.
Wherein, described supporter is the rigid support body that hard material is made, described rigid support body arranges spiral groove and recess, and described recess is located at the end of described groove, described wiring is located in described spiral groove, pad is set at described recess, and described pad is electrically connected with described wiring.
Wherein, described magnetic core adopts Ferrite Material to make, and described magnetic core is by sintering processing or obtain with panel machine machine-shaping.
Wherein, also comprise encapsulation step, namely utilize insulating material by described coil and the encapsulation of described magnetic core.
The present invention has following beneficial effect:
Miniature inductance provided by the invention, supporter is utilized to form coil with the wiring being located at supporter, be arranged to tubular by supporter, wiring is located at supporter in a spiral manner, thus obtains coil, by modular coil, when making inductance, magnetic core and coil are directly assembled together, not only convenient making, reduce the cost of miniature inductance, and the combination property of miniature inductance can be guaranteed.
As an advantage of the present invention, supporter adopts flexible supporter, and flexible supporter toughness is comparatively strong, can bend to difformity according to actual needs; And the thickness of flexible supporter can reach micron order, can reduce the thickness of miniature inductance; Connect up with depositional mode acquisition, this wiring not only toughness is comparatively strong, can adapt to the bending of flexible supporter; And very thin thickness, make the thickness connected up substantially not affect the thickness of coil, the thickness of coil equals the thickness of supporter substantially.In addition, obtain with depositional mode the cost connected up lower.
As another advantage of the present invention, magnetic core adopt sintering processing or by the cost of manufacture of panel machine machine-shaping mode far below depositional mode, and, the cost of manufacture impact of thickness on magnetic core of magnetic core is little, therefore, can regulate the thickness of magnetic core according to actual needs, thus namely can obtain the superior miniature inductance of combination property, and processing cost is low.
When the volume of inductance is larger, existing method can be adopted to make inductance.But the manufacture method of existing large volume inductance cannot adapt to make thickness below 3 millimeters, miniature inductance time especially below 2 millimeters.Meanwhile, depositional mode mainly makes the inductance of several microns or tens microns, and when inductance thickness reaches tens microns, the cost of manufacture of depositional mode rises at double.Therefore, as an advantage of the present invention, the thickness of magnetic core is more than or equal to 30 microns, and is less than 2.0 millimeters.Miniature inductance between this caliper zones both can ensure the combination property such as inductance value, quality factor of miniature inductance, can reduce again the cost of manufacture of miniature inductance.
As an advantage of the present invention, in order to reduce the volume of miniature inductance and improve combination property and the rate of finished products of miniature inductance, the thickness of magnetic core is more than or equal to 70 microns, and is less than 0.7 millimeter.
As another advantage of the present invention, magnetic core adopts the Ferrite Material of 5MHz ~ 3GHz to make.The miniature inductance that antenna as communication field can adopt the Ferrite Material of 9MHz ~ 20MHz to make.
The present invention also provides a kind of manufacture method of miniature inductance, coil comprises supporter and the wiring of tubular, described supporter is located in described wiring in a spiral manner, thus acquisition coil, by modular coil, magnetic core is obtained by machine work, can the relatively thick magnetic core (mode relative to deposition) of the acquisition thickness of low cost.When making inductance, magnetic core and coil are assembled together, thus reduce the cost of manufacture of miniature inductance.
Accompanying drawing explanation
Fig. 1 is longitudinal direction (axis perpendicular to the coil) sectional view of the present embodiment miniature inductance;
Fig. 2 a is transverse direction (being parallel to the axis of the coil) sectional view of embodiment of the present invention miniature inductance;
Fig. 2 b is the part-structure schematic diagram of another embodiment of the present invention miniature inductance;
Fig. 3 a is the schematic perspective view of the part-structure of yet another embodiment of the invention miniature inductance;
Fig. 3 b is the end view of the part-structure of yet another embodiment of the invention miniature inductance;
Fig. 4 is the structural representation of another embodiment of the present invention supporter;
Fig. 5 a is the structural representation of embodiment of the present invention supporter and wiring;
Fig. 5 b is the structural representation of another embodiment of the present invention supporter and wiring;
Fig. 6 is the flow chart of the making of embodiment of the present invention miniature inductance;
Fig. 7 is the Making programme figure of embodiment of the present invention coil.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, miniature inductance provided by the invention and preparation method thereof is described in detail.
As shown in Fig. 1 and Fig. 2 a, miniature inductance comprises magnetic core 1, coil 2, encapsulated layer 3 and pad 4, and the outside of magnetic core 1 is located at by coil 2.Encapsulated layer 3, for encapsulating magnetic core 1 and coil 2, arranges a pad 4 respectively in two ends of wiring 22, for the electrical connection of coil 2 with other external devices.
As shown in Figure 2 a, coil 2 comprises supporter 21 and wiring 22.Wherein, supporter 21 is open column shape structure, and as square tubular structure, certainly, supporter 21 also can be rounded cylindrical structure or triangle tubular structure, or adopts the tubular structure of other shape.The shape of supporter 21 is determined according to the profile of magnetic core 1, and namely the shape of supporter 21 and the profile of magnetic core 1 match, as long as magnetic core 1 can be embedded the inner side of supporter 21, and makes supporter closely wrap up magnetic core 1.Wiring 22 is located at the surface of supporter 21 in a spiral manner or is embedded in the inside of supporter 21.Supporter 21 provides support to wiring 22 or locates, and contributes to depositing, transport and assembling of coil 2.The present embodiment, by coil 2 modularization, during use, as long as magnetic core 1 to be inserted the inner side of supporter 2, namely inserts in cylinder.
In the present embodiment, the wiring 22 being located at supporter 21 can arbitrary shape.But when supporter 21 is bent to form tubular, wiring 22 will connect into a complete wire, and forms spirality on the supporter 21 of tubular.In Fig. 5 a, wiring 22 is obliquely installed.In Fig. 5 b, wiring 22 comprises the part and horizontally disposed part that are obliquely installed.Certainly, the set-up mode of wiring 22 is not limited in Fig. 5 a and the set-up mode shown in Fig. 5 b.As long as wiring 22 can be made to form spiral complete wire.
In the present embodiment, supporter 21 is the flexible supporter (or claiming flexible board) adopting soft material to make, and wiring 22 is located at flexible supporter by depositional mode.Flexible supporter is easy to flexural deformation, can obtain difform open column shape structure, thus is conducive to producing difform coil 2, and makes coil 2 can closely wrap up magnetic core 1.And the thickness of flexible supporter, usually at micron order, can reduce the thickness of miniature inductance; Wiring 22 obtains with depositional mode, and the wiring 22 that this mode obtains not only toughness is comparatively strong, can adapt to the bending deformation of flexible supporter, with the shape and size making coil 2 reach required; And thickness is thin.
In another embodiment, as shown in Figure 3 a and Figure 3 b shows, supporter 21 comprises the first supporter 21a and the second supporter 21b, and the first supporter 21a and the second supporter 21b is arranged face-to-face.First supporter 21a and the second supporter 21b are equipped with many wire segment 22 ', and multiple electrical connection section 5 is set between the first supporter 21a and the second supporter 21b, for the wire segment 22 ' of the wire segment 22 ' of the first supporter 21a and the second supporter 21b correspondence is electrically connected, so that many wire segment 22 ' head and the tail are connected into wiring 22, thus form coil 2.Electrical connection section 5 simultaneously also for fixing the first supporter 21a and the second supporter 21b, and makes the distance needed for the first supporter 21a and the second supporter 21b maintenance, to form the cavity arranging magnetic core 1 between the first supporter 21a and the second supporter 21b.In the present embodiment, electrical connection section 5 can adopt conductive pole or conducting sphere.For the ease of electrical connection section and wire segment 22 ' are electrically connected, preferably arrange in the end of wire segment 22 ' and connect pad 23.Connect the electrical connection that pad 23 is not only conducive to electrical connection section 5 and wire segment 22 ', and the manufacturing cost of coil 2 can be reduced.Also be provided with pad 4 on the surface of the first supporter 21a or the second supporter 21b, namely pad 4 is arranged on the both ends of wiring 22.Shown in construction drawing 3 during coil, be oppositely arranged by the first supporter 21a or the second supporter 21b, the wire segment 22 ' being then located at the first supporter 21a with electrical connection section 5 and the wire segment 22 ' being located at the second supporter 21b are electrically connected.
In another embodiment, supporter 21 makes for adopting hard material, obtains rigid support body.As shown in Figure 4, supporter 21 is provided with groove 211 and recess 212, and groove 211 is formed at the surface of supporter 21 in a spiral manner, and recess 212 is located at the end of groove 211, and namely two ends of groove 211 respectively arrange a recess 212.Wiring 22 is located in groove 211, arranges a pad (not shown) in each recess 212, and make pad with connect up 22 end to be correspondingly electrically connected.Width and the spacing of wiring is controlled, with the miniature inductance of excellent by groove 211.It should be noted that, wiring 211 here should make broad understanding, and it can be obtained by depositional mode, is also wrapped in groove 211 by wire and obtains wiring.
It should be noted that, supporter 21 can adopt non-conducting material to make, and electric conducting material also can be adopted to make.When supporter 21 adopts electric conducting material to make, the surface of wiring needs insulating barrier.
The miniature inductance of the present embodiment, the thickness of magnetic core is more than or equal to 30 microns, and is less than 2.0 millimeters.Miniature inductance between this caliper zones both can ensure the combination property such as inductance value, quality factor of miniature inductance, can obtain magnetic core 1 again, to reduce the cost of manufacture of miniature inductance with sintering processing or by panel machine machine-shaping mode.Preferably, the thickness of magnetic core is less than 0.7 millimeter, is more than or equal to 70 microns, to reduce the volume of miniature inductance and to improve combination property and the rate of finished products of miniature inductance.
Magnetic core 1 is by sintering processing or use panel machine machine-shaping.For existing large volume inductance, the cost of manufacture of sintering processing and panel machine machine-shaping mode is far below depositional mode, and the thickness of magnetic core is little on this cost of manufacture impact.Therefore, the thickness of magnetic core can be regulated according to actual needs, thus namely can obtain the superior miniature inductance of combination property, cut down finished cost again.
Magnetic core 1 adopts Ferrite Material to make.Ferrite Material can select the Ferrite Material of 5MHz ~ 3GHz.As, at the miniature inductance that the antenna of some communication field can adopt the Ferrite Material of 9MHz ~ 20MHz to make.
Miniature inductance also comprises pad and encapsulated layer.Wherein, pad is located at coil 2(and is specially wiring 22) end, for the electrical connection of miniature inductance and other electronic devices and components.Encapsulated layer is used for magnetic core 1 and coil 2 to encapsulate.Encapsulated layer adopts insulating material to make, and makes as adopted pottery or resin material.
It should be noted that, as shown in Figure 2 a, pad 4 is located at the end of coil 3, and namely pad 4 is positioned at the end of miniature inductance.But, the present invention is not limited thereto, pad 4 also can be arranged on the upper surface of miniature inductance, lower surface or arrange a pad 4 respectively at upper surface, lower surface (upper surface and lower surface are relative concepts, are modes of emplacement according to miniature inductance and determine).As shown in Figure 2 b, pad 4 is located at the upper surface of miniature inductance.But it should be noted that, when miniature inductance is used to the antenna of communication field, pad 4 can not be located at the end of inductance, and namely pad 4 can not be located on the axis of coil 2, with the transmitting and receiving avoiding pad 4 to affect antenna.
The miniature inductance that the present embodiment provides, utilize supporter to form coil with the wiring being located at supporter, be arranged to tubular by supporter, wiring is located at supporter in a spiral manner, thus obtains coil.By modular coil, when making inductance, magnetic core and coil are assembled together, thus reduce the cost of manufacture of miniature inductance.
Fig. 6 is the flow chart of the manufacture method of embodiment of the present invention miniature inductance.As shown in Figure 6, the manufacture method of miniature inductance comprises:
Step S1, provides magnetic core.
Magnetic core is by sintering processing or obtain with panel machine machine-shaping.
Magnetic core adopts Ferrite Material to make, and Ferrite Material can select the ferrite of 5MHz ~ 3GHz.To the miniature inductance that the antenna of some communication field can adopt the Ferrite Material of 9MHz ~ 20MHz to make.
The thickness of magnetic core is more than or equal to 30 microns, and is less than 2.0 millimeters.Miniature inductance between this caliper zones both can ensure the combination property such as inductance value, quality factor of miniature inductance, can obtain magnetic core again, to reduce the cost of manufacture of miniature inductance with sintering processing or by panel machine machine-shaping mode.Preferably, the thickness of magnetic core is more than or equal to 70 microns, is less than 0.7 millimeter, to reduce the volume of miniature inductance and to improve combination property and the rate of finished products of miniature inductance.
Step S2, provides coil.
Coil comprises supporter and the wiring of tubular, and described wiring is located at supporter in a spiral manner.As shown in Figure 7, the concrete manufacturing process of coil comprises:
Step S21, provides the supporter of tabular (sheet).
Supporter adopts hard material or soft material to make.The present embodiment adopts soft material to make, and obtains flexible supporter.
Step S22, supporter makes multistage wiring.
On supporter, making multistage wiring by depositional mode, as adopted the depositional modes such as plating, or adopting the physical vapour deposition (PVD) modes such as magnetron sputtering to make wiring on supporter.Wiring can make on the surface of supporter, also can embed the inside of supporter.In addition, wiring also can be located at supporter by canoe.
Two opposite ends of supporter are connected by step S23, and make each section of staggered corresponding electrical connection of connecting up, and connect up continuously to form spirality.
Supporter bent and two opposite ends are connected, meanwhile, making each section of staggered corresponding electrical connection of connecting up, connect up continuously to form spirality.As required, supporter is bent to different shapes, as circular, square, triangle or other shape.
By step S21 to step S23, the coil of acquisition becomes coil module, and this coil is convenient to store, assemble and transport.
Step S3, is located at the inner side of the supporter of tubular and fixes by magnetic core.
Magnetic core is inserted the inner side of supporter, and by the such as mode such as gluing, magnetic core and supporter are fixed.
The present embodiment can also comprise:
Step S4, arranges pad at the both ends of coil.
Pad is set at the both ends of coil, for the electrical connection of miniature inductance and other electronic devices and components.
Step S5, encapsulation.
By magnetic core and coil encapsulation, utilize insulating material by coil and magnetic core encapsulation.Insulating material can be pottery or resin etc.
The manufacture method of the miniature inductance that the present embodiment provides, coil comprises supporter and the wiring of tubular, and described supporter is located in described wiring in a spiral manner, thus obtains coil.By modular coil, when making inductance, magnetic core and coil are assembled together, thus reduce the cost of manufacture of miniature inductance.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (19)
1. a miniature inductance, comprises magnetic core and coil, it is characterized in that, described coil comprises supporter and wiring, and described supporter is located in described wiring in a spiral manner, and described magnetic core is embedded in the inner side of described supporter.
2. miniature inductance according to claim 1, is characterized in that, described supporter is the flexible supporter adopting flexible material to support, and described wiring is located at described flexible supporter with depositional mode, and described supporter is bent to form hollow column structure.
3. miniature inductance according to claim 1, it is characterized in that, described supporter is the rigid support body of the open column shape structure that hard material is made, described rigid support body is provided with recess and spiral groove, described recess is located at the end of described groove, described wiring is located in described spiral groove, arranges pad at described recess, and makes that described pad is corresponding with the end of described wiring to be electrically connected.
4. miniature inductance according to claim 1, it is characterized in that, described supporter comprises the first supporter and the second supporter, described first supporter and described second supporter are equipped with wire segment, the wire segment being located at described first supporter and the wire segment being located at described second supporter are electrically connected by electric connecting part correspondence, so that described wire segment head and the tail are connected to form wiring.
5. miniature inductance according to claim 1, is characterized in that, described magnetic core adopts Ferrite Material to make, and passes through sintering processing or use panel machine machine-shaping.
6. miniature inductance according to claim 5, is characterized in that, the thickness of described magnetic core is more than or equal to 30 microns, and is less than 2.0 millimeters.
7. miniature inductance according to claim 5, is characterized in that, the thickness of described magnetic core is more than or equal to 70 microns, and is less than 0.7 millimeter.
8. miniature inductance according to claim 5, is characterized in that, described magnetic core adopts the Ferrite Material of 5MHz ~ 3GHz to make.
9. miniature inductance according to claim 5, is characterized in that, described magnetic core adopts the Ferrite Material of 9MHz ~ 20MHz to make.
10. miniature inductance according to claim 1, is characterized in that, also comprises pad, for the electrical connection of described coil and external devices.
11. miniature inductances according to claim 1, is characterized in that, also comprise encapsulated layer, for encapsulating described coil and described magnetic core.
12. miniature inductances according to claim 1, is characterized in that, described miniature inductance is as the antenna of communication field.
The manufacture method of 13. 1 kinds of miniature inductances, is characterized in that, comprising:
Magnetic core is provided;
There is provided coil, described coil comprises supporter and the wiring of tubular, and described supporter is located in described wiring in a spiral manner;
Described magnetic core be located at the inner side of the described supporter of tubular and fix.
The manufacture method of 14. miniature inductances according to claim 13, is characterized in that, described coil obtains in the following manner:
The described supporter of tabular is provided;
Described supporter makes multistage wiring;
Two opposite ends of described supporter are connected, and makes the staggered corresponding electrical connection of described each section of wiring, to form the continuous described wiring of spirality.
The manufacture method of 15. miniature inductances according to claim 13, is characterized in that, the shape of described supporter is square tubular structure, rounded cylindrical structure or triangle tubular structure.
The manufacture method of 16. miniature inductances according to claim 13, is characterized in that, described supporter is flexible supporter, and described wiring is located at described flexible supporter with depositional mode.
The manufacture method of 17. miniature inductances according to claim 13, it is characterized in that, described supporter is the rigid support body that hard material is made, described rigid support body arranges spiral groove and recess, and described recess is located at the end of described groove, described wiring is located in described spiral groove, arranges pad at described recess, and described pad is electrically connected with described wiring.
The manufacture method of 18. miniature inductances according to claim 13, is characterized in that, described magnetic core adopts Ferrite Material to make, and described magnetic core is by sintering processing or obtain with panel machine machine-shaping.
The manufacture method of 19. miniature inductances according to claim 13, is characterized in that, also comprise encapsulation step, namely utilizes insulating material by described coil and the encapsulation of described magnetic core.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310537504.2A CN104616859B (en) | 2013-11-04 | 2013-11-04 | Miniature inductance and preparation method thereof |
| PCT/CN2014/000134 WO2015062155A1 (en) | 2013-11-04 | 2014-01-29 | Micro-inductor and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310537504.2A CN104616859B (en) | 2013-11-04 | 2013-11-04 | Miniature inductance and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN104616859A true CN104616859A (en) | 2015-05-13 |
| CN104616859B CN104616859B (en) | 2019-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310537504.2A Expired - Fee Related CN104616859B (en) | 2013-11-04 | 2013-11-04 | Miniature inductance and preparation method thereof |
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| CN (1) | CN104616859B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108879083A (en) * | 2017-05-09 | 2018-11-23 | 昌泽科技有限公司 | The production method of chip signal element |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19707177A1 (en) * | 1997-02-22 | 1998-09-03 | Inotech Kunststofftechnik Gmbh | Choke coil inductance for electric circuit |
| CN2435824Y (en) * | 2000-07-20 | 2001-06-20 | 佳叶科技有限公司 | Packed chip inductance |
| US20020013005A1 (en) * | 1996-11-19 | 2002-01-31 | Samsung Electronics Co., Ltd. | Inductor for semiconductor device and method of making the same |
| US6531945B1 (en) * | 2000-03-10 | 2003-03-11 | Micron Technology, Inc. | Integrated circuit inductor with a magnetic core |
| CN2598113Y (en) * | 2003-01-17 | 2004-01-07 | 黄克方 | Flexible transformer |
| CN101322201A (en) * | 2005-10-05 | 2008-12-10 | Nxp股份有限公司 | Multi-layer inductive element for integrated circuit |
| CN101356688A (en) * | 2006-02-08 | 2009-01-28 | 胜美达集团株式会社 | Coil for antenna |
| CN202601367U (en) * | 2012-05-30 | 2012-12-12 | 天津信达宇通电器有限公司 | Inductance device of bidirectional adjustable magnetic core |
| CN103000537A (en) * | 2011-09-15 | 2013-03-27 | 万国半导体股份有限公司 | Wafer-level package structure and production method thereof |
-
2013
- 2013-11-04 CN CN201310537504.2A patent/CN104616859B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020013005A1 (en) * | 1996-11-19 | 2002-01-31 | Samsung Electronics Co., Ltd. | Inductor for semiconductor device and method of making the same |
| DE19707177A1 (en) * | 1997-02-22 | 1998-09-03 | Inotech Kunststofftechnik Gmbh | Choke coil inductance for electric circuit |
| US6531945B1 (en) * | 2000-03-10 | 2003-03-11 | Micron Technology, Inc. | Integrated circuit inductor with a magnetic core |
| CN2435824Y (en) * | 2000-07-20 | 2001-06-20 | 佳叶科技有限公司 | Packed chip inductance |
| CN2598113Y (en) * | 2003-01-17 | 2004-01-07 | 黄克方 | Flexible transformer |
| CN101322201A (en) * | 2005-10-05 | 2008-12-10 | Nxp股份有限公司 | Multi-layer inductive element for integrated circuit |
| CN101356688A (en) * | 2006-02-08 | 2009-01-28 | 胜美达集团株式会社 | Coil for antenna |
| CN103000537A (en) * | 2011-09-15 | 2013-03-27 | 万国半导体股份有限公司 | Wafer-level package structure and production method thereof |
| CN202601367U (en) * | 2012-05-30 | 2012-12-12 | 天津信达宇通电器有限公司 | Inductance device of bidirectional adjustable magnetic core |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108879083A (en) * | 2017-05-09 | 2018-11-23 | 昌泽科技有限公司 | The production method of chip signal element |
| CN108879083B (en) * | 2017-05-09 | 2020-05-26 | 昌泽科技有限公司 | Method for manufacturing chip signal element |
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|---|---|
| CN104616859B (en) | 2019-10-25 |
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