CN104515914A - Testing mechanism and testing method of alignment and conductivity of bed type optical components - Google Patents
Testing mechanism and testing method of alignment and conductivity of bed type optical components Download PDFInfo
- Publication number
- CN104515914A CN104515914A CN201310464493.XA CN201310464493A CN104515914A CN 104515914 A CN104515914 A CN 104515914A CN 201310464493 A CN201310464493 A CN 201310464493A CN 104515914 A CN104515914 A CN 104515914A
- Authority
- CN
- China
- Prior art keywords
- electrical measurement
- displacement
- electro
- conductive glass
- gearshift
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention relates to a testing mechanism of alignment and conductivity of bed type optical components. The testing mechanism mainly comprises a base, a fine-tuning device, a displacement device, an electrical logging platform and an electrical logging device. The fine-tuning device is arranged on the base and used for outputting power and finely displaces relative to the base along the X-axis direction and the Y-axis direction, the displacement device is arranged on the fine-tuning device and used for outputting power properly and displaces relative to the fine-tuning device along the X-axis direction and the Y-axis direction, the electrical logging platform is arranged on the displacement device so as to displace under linkage of the fine-tuning device and the displacement device and is used for arranging conductive glass, the electrical logging device is arranged on the base and used for electrically testing the conductive glass on the electrical logging platform in a contact manner.
Description
Technical field
The present invention is relevant with checkout equipment, in more detail refers to the testing agency of a kind of table formula optical element contraposition and electric conductivity.
Background technology
Press, along with electronic product is lightening and high performance requirement, not only allow integrated circuit (IC) design and manufacture go up technology day excelsior, also drives the progress of integrated antenna package technology simultaneously.With liquid crystal display industry, along with the specification of liquid crystal display rises to wide screen video image display (WXGA) from video image display (VGA), the circuit made on display panels is made and becomes complicated, if under not increasing the quantity situation of driving circuit, then the pin number of every driving circuit must be allowed to increase.Under such technological evolvement, driving circuit encapsulation technology has and automatically combines (Tape Automated Bonding from winding, TAB) gradually toward thin membrane flip chip encapsulation technology (Chip on Film, or chip on glass technique (Chip on Glass, COG) future development COF).The mode of chip on glass technique is the crystal grain of golden projection directly will grow, is directly welded in the circuit on electro-conductive glass panel, can saves winding automatically in conjunction with winding by the mode covering crystalline substance.Because the cost of winding automatically in conjunction with winding is very high, account for winding automatically in conjunction with packaging cost more than seventy percent, therefore chip on glass technique is quite beckoning in cost advantage.Though chip on glass technique has the advantage of low cost, but cannot replace from winding automatically in conjunction with encapsulation, reason is that driving circuit must be installed by chip on glass technique on glass panels just can the result lighted of inspection panel always.Also cannot heavy industry if cannot light, whole driving circuit must be pulled out, quite bother.Key component is the quality of the driving circuit that just can check out described electro-conductive glass how in a pre-installation, improves the yield installed and chip on glass technique technology could be allowed more extensively to be used.
Along with Wafer level packaging becomes main flow, the projection of driving circuit detects to be still and completes under wafer kenel.The detection demand of this respect, existing many manufacturers provide relevant board.Wafer cuts between final test afterwards, and product still has may be contaminated or have damage.QC way general is at present by statistical process control; Owing to cannot accomplish to detect completely, and then have influence on the yield backward assembled, also can bring bad impact to the development of such advanced technology.
Therefore, how can effectively promote the efficiency detected electro-conductive glass, be just the problem of at present relevant dealer institute urgency palpus solution.
Inventor in view of existing testing agency every shortcoming of deriving, be urgently think to be improved innovation, and after taking great pains to attain one's goal for many years and concentrating on studies, finally successfully researched and developed the testing agency of the optical element contraposition of this part table formula and electric conductivity.
Summary of the invention
Namely object of the present invention is the testing agency providing a kind of table formula optical element contraposition and electric conductivity, effectively can promote the efficiency of detection.
The table formula optical element contraposition of foregoing invention object and the testing agency of electric conductivity can be reached, comprising: a pedestal, one micromatic setting, be arranged in described pedestal working range, described micromatic setting comprises a fine setting support plate, is somely arranged at the rotation translation assembly between described fine setting support plate and described pedestal and the fine setting support plate described in some drivings carries out X-direction, the meticulous displacement of Y direction and the fine setting power unit towards the meticulous rotation in θ direction along described rotation translation assembly, and described micromatic setting exports suitable power and carries out the meticulous displacement of relatively described gearshift along X-direction and Y direction, one gearshift, be arranged at the fine setting support plate of micromatic setting, described gearshift comprises a displacement support plate, is somely arranged at the displacement slide track component between described displacement support plate and described fine setting support plate and the displacement support plate described in some drivings carries out the displacement power unit of X-direction and Y direction displacement along described displacement slide track component, and the exportable suitable power of described gearshift and carry out the displacement of relatively described pedestal along X-direction and Y direction, one electrical measurement platform, be arranged on the displacement support plate of described gearshift, described electrical measurement platform is with the displacement by described gearshift and described micromatic setting institute's interlock, place with for an electro-conductive glass, and described electrical measurement platform has some with the vacuum absorption holes of preset space length arrangement, to produce pull of vacuum to the electro-conductive glass placed, one electric probe device, comprises a bracing frame, a Z axis power unit, an electrical measurement seat, at least one image bit cell and a contact electrical measurement plate, described bracing frame is arranged on described pedestal, described Z axis power unit is arranged on described bracing frame, in order to produce the power moved back and forth along Z-direction, described electrical measurement seat is connected on described Z axis power unit, to be subject to described Z axis power unit institute interlock, and reciprocal displacement can be carried out along Z-direction, described image bit cell is arranged on described electrical measurement seat, in order to carry out capture to the electro-conductive glass be positioned on described electrical measurement platform, and provide image signal whether correct for the driving circuit position on controller interpretation electro-conductive glass, described contact electrical measurement plate is arranged on described electrical measurement seat, and the upset of 90 degree can be carried out between vertical shift position, a horizontal electrical measurement position to, and provide engaged test signal for controller interpretation, and described electric probe device is in order to carry out the electrical detection of contact to the electro-conductive glass be positioned on described electrical measurement platform, one controller, described controller and described micromatic setting, gearshift, electrical measurement platform and described electric probe device are electrically connected, to control start and the stopping of described micromatic setting, gearshift, electrical measurement platform and described electric probe device, and the image signal (the driving circuit position namely on electro-conductive glass) that can carry out described image bit cell carries out interpretation, if position has error namely to carry out position correction through micromatic setting, and interpretation is carried out to the engaged test signal of described contact electrical measurement plate.
Therefore the testing agency of table formula optical element contraposition provided by the present invention and electric conductivity, can carry out detecting electro-conductive glass in more efficient mode, with the output value of improving product.
And the detection method that the present invention further provides the testing agency of a kind of table formula optical element contraposition and electric conductivity comprises: step 1: the displacement of the gearshift described in described controller controls, make electrical measurement platform to discharge position described in drive, and by operator, the electro-conductive glass for detecting is positioned on described electrical measurement platform, and adsorbed by the described pull of vacuum waiting vacuum absorption holes to produce; Step 2: the displacement of the gearshift then again described in controller controls, makes electrical measurement platform to the electrical measurement position described in drive; Step 3: and undertaken carrying out capture (i.e. image signal) to the driving circuit position of electro-conductive glass by the image bit cell of described electric probe device, if when having error, just the micromatic setting described in described controller controls critically adjusts the position of described electrical measurement platform, until be adjusted to tram; Step 4: turn to the horizontal electrical measurement position be the level of state by vertical shift position in vertical state by the contact electrical measurement plate of described electric probe device, described contact electrical measurement plate is contacted with the driving circuit of electro-conductive glass, and electrical detection can be carried out to described electro-conductive glass; Step 5: after to the one region electrical measurement of described electro-conductive glass, the contact electrical measurement plate of described electric probe device just turn to vertical shift position in vertical state by the horizontal electrical measurement position be the level of state, and the electrical measurement platform controlled again described in described gearshift drive by described controller carries out displacement, makes another region to be measured of described electro-conductive glass (i.e. next driving circuit position) and described electric probe device contraposition.
Accompanying drawing explanation
Fig. 1 is the three-dimensional combination figure of a preferred embodiment of the present invention.
Figure 1A is the partial enlarged drawing of the part A of Fig. 1.
Fig. 2 is that pedestal and micromatic setting solid combine schematic diagram.
Fig. 3 is the volume rendering schematic diagram of Fig. 2; Micromatic setting internal structure is described.
Fig. 4 is described micromatic setting and gearshift three-dimensional combination figure.
Fig. 5 is the three-dimensional exploded view of Fig. 4.
Fig. 6 is described gearshift solid combination schematic diagram.
Fig. 7 is described gearshift and electrical measurement platform three-dimensional combination figure.
Fig. 8 is gearshift, micromatic setting and electrical measurement platform solid combine schematic diagram.
Fig. 9 is start side view embodiment illustrated in fig. 1.
Figure 10 is Local Members illustrative view embodiment illustrated in fig. 1.
Figure 11 is Local Members start vertical view embodiment illustrated in fig. 1.
Figure 12 is the stereographic map at another visual angle embodiment illustrated in fig. 1.
Figure 13 is Local Members illustrative view embodiment illustrated in fig. 1.
Figure 14 is process block diagram of the present invention.
Description of reference numerals:
1 pedestal
2 micromatic settings
21 fine setting support plates
22 rotate translation assembly
23 fine setting power units
3 gearshifts
31 displacement support plates
32 displacement slide track components
33 displacement power units
4 electrical measurement platforms
41 vacuum absorption holes
5 electric probe devices
51 bracing frames
52 Z axis power units
53 electrical measurement seats
54 image bit cell
55 contact electrical measurement plates
6 controllers
91 electro-conductive glass
911 driving circuits
Embodiment
Below in conjunction with accompanying drawing, specific embodiments of the invention are described in detail.
Refer to Fig. 1 to Figure 13, the testing agency of table formula optical element contraposition provided by the present invention and electric conductivity, mainly comprises: pedestal 1, micromatic setting 2, gearshift 3, electrical measurement platform 4, electric probe device 5 and a controller 6 organize structure and form.
As shown in Figure 1 to Figure 3, pedestal 1, can firmly be placed in a plane.
As shown in Figure 2 to Figure 3, micromatic setting 2, is arranged in the working range of pedestal 1, exportable suitable power and carry out the precision thin micrometric displacement of relative displacement apparatus 3 along X-direction and Y direction.Micromatic setting 2 has a fine setting support plate 21, is somely arranged at rotation translation assembly 22 between fine setting support plate 21 and pedestal 1 and some driving is finely tuned support plate 21 and carried out X-direction, the meticulous displacement of Y direction and the fine setting power unit 23 towards the meticulous rotation in θ direction along rotating translation assembly 22.
As shown in Figures 4 to 7, gearshift 3, is arranged on gearshift 3, exportable suitable power and carry out the displacement of relative micromatic setting 2 along X-direction and Y direction; Gearshift 3 has a displacement support plate 31, some displacement support plates 31 and the displacement slide track component 32 of finely tuning between support plate 21 and some drive displacement support plates 31 of being arranged at carry out the displacement power unit 33 of X-direction and Y direction displacement along displacement slide track component 32.
As shown in Figure 7 to 9, electrical measurement platform 4, be arranged on the displacement support plate 31 of gearshift 3, with gearshift 3 interlocks by displacement support plate 31 and by micromatic setting 2 accurate displacement, on electrical measurement platform 4 and have some with preset space length arrangement vacuum absorption holes 41, with to place an electro-conductive glass 91 produce pull of vacuum.
As shown in Fig. 1, Fig. 7 to Fig. 9, electric probe device 5, is arranged on pedestal 1, in order to carry out the electrical detection of contact to the electro-conductive glass 91 be positioned on electrical measurement platform 4.Electric probe device 5 has bracing frame 51, Z axis power unit 52, electrical measurement seat 53, image bit cell 54 and a contact electrical measurement plate 55, bracing frame 51 is arranged on pedestal 1, and there is a predetermined altitude, Z axis power unit 52 is arranged on bracing frame 51, in order to produce the power moved back and forth along Z-direction, electrical measurement seat 53 is connected on Z axis power unit 52, to be subject to Z axis power unit 52 interlocks, and reciprocal displacement can be carried out along Z-direction, a camera is respectively Deng image bit cell 54, be arranged on electrical measurement seat 53, in order to carry out capture to the electro-conductive glass 91 be positioned on electrical measurement platform 4, contact electrical measurement plate 55 is arranged on electrical measurement seat 53, and can the upset of degree of carrying out between vertical shift position, a horizontal electrical measurement position to.
Controller 6, be arranged at pedestal 1 side, and be electrically connected with micromatic setting 2, gearshift 3, electrical measurement platform 4 and electric probe device 5, to control start and the stopping of micromatic setting 2, gearshift 3, electrical measurement platform 4 and electric probe device 5, and the image signal (driving circuit 911 position namely on electro-conductive glass 91) that can carry out image bit cell 54 carries out interpretation, if position has error namely to carry out position correction through micromatic setting 3, interpretation is carried out to the engaged test signal of contact electrical measurement plate 55.
And electro-conductive glass 91 has a plurality of driving circuit 911 with arranged in arrays, the model of the image bit cell 54 interpretation electro-conductive glass 91 of electric probe device 5 is provided and detects position.
Be the introduction of the table formula optical element contraposition of a preferred embodiment provided by the present invention and testing agency's each portion component of electric conductivity and assembling mode thereof therefore above-mentioned, then with reference to all graphic, its use-pattern be described below:
Step 1: first, by the displacement of controller 6 command displacement device 3, make drive electrical measurement platform 4 to discharge position, and by operator, the electro-conductive glass 91 for detecting is positioned on electrical measurement platform 4, and adsorbed by the pull of vacuum waiting vacuum absorption holes 41 to produce;
Step 2: then again by the displacement of controller 6 command displacement device 3, make drive electrical measurement platform 4 to electrical measurement position;
Step 3: and undertaken carrying out capture (i.e. image signal) to driving circuit 911 position of electro-conductive glass 91 by the image bit cell 54 of electric probe device 5, if when having error, just the position that micromatic setting 2 critically adjusts electrical measurement platform 4 is controlled, until be adjusted to tram by controller 6;
Step 4: turn to the horizontal electrical measurement position (as Suo Shi Figure 10 ~ 11) be the level of state by vertical shift position in vertical state by the contact electrical measurement plate 55 of electric probe device 5, contact electrical measurement plate 55 is contacted with the driving circuit 911 of electro-conductive glass 91, and electrical detection can be carried out to electro-conductive glass 91;
Step 5: after to the one region electrical measurement of electro-conductive glass 91, the contact electrical measurement plate 55 of electric probe device 5 just turn to vertical shift position in vertical state by the horizontal electrical measurement position be the level of state, and by controller 6 again command displacement device 3 drive electrical measurement platform 4 to carry out displacement (as shown in figure 12), make another region to be measured of electro-conductive glass 91 (i.e. next driving circuit 911 position) and electric probe device 5 contraposition.
Be with, repeat the flow process of above step 3 ~ 5, undertaken driving circuit 911 position of electro-conductive glass 91 is carried out to capture, critically adjusted the position of electrical measurement platform 4 and contact electrical measurement plate 55 is turn to the horizontal electrical measurement position be the level of state by vertical shift position in vertical state by micromatic setting 2 by image bit cell 54, contact electrical measurement plate 55 is contacted with the driving circuit 911 of electro-conductive glass 91, so that electrical detection can be carried out to electro-conductive glass 91, just electrical detection can be carried out to each region driving circuit 911 of electro-conductive glass 91 constantly by this.
In addition, the controlled device 6 of Z axis power unit 52 of electric probe device 5 controlled, automatically to adjust the height (as shown in figure 11) of its Z axis in response to electro-conductive glass 91 thickness carrying out detecting.
Therefore the testing agency of table formula optical element contraposition provided by the present invention and electric conductivity, can carry out detecting electro-conductive glass 91, with the output value of improving product in more efficient mode.
Therefore the present invention not only its structure be different from skill known now, and can reach multi-direction stable transport, for the related industry in field belonging to the present invention, be the innovation skill of a very high practicability in fact.
Although the present invention is described in conjunction with above embodiment, but the present invention is not limited to above-described embodiment, and only by the restriction of claims, those of ordinary skill in the art can easily modify to it and change, but do not leave essential idea of the present invention and scope.
Claims (3)
1. a testing agency for the contraposition of table formula optical element and electric conductivity, is characterized in that, comprising:
One pedestal;
One micromatic setting, be arranged in described pedestal working range, described micromatic setting comprises a fine setting support plate, is somely arranged at the rotation translation assembly between described fine setting support plate and described pedestal and the fine setting support plate described in some drivings carries out X-direction, the meticulous displacement of Y direction and the fine setting power unit towards the meticulous rotation in θ direction along described rotation translation assembly, and described micromatic setting exports suitable power and carries out the meticulous displacement of relatively described gearshift along X-direction and Y direction;
One gearshift, be arranged at the fine setting support plate of micromatic setting, described gearshift comprises a displacement support plate, is somely arranged at the displacement slide track component between described displacement support plate and described fine setting support plate and the displacement support plate described in some drivings carries out the displacement power unit of X-direction and Y direction displacement along described displacement slide track component, and the exportable suitable power of described gearshift and carry out the displacement of relatively described pedestal along X-direction and Y direction;
One electrical measurement platform, be arranged on the displacement support plate of described gearshift, described electrical measurement platform is with the displacement by described gearshift and described micromatic setting institute's interlock, place with for an electro-conductive glass, and described electrical measurement platform has some with the vacuum absorption holes of preset space length arrangement, to produce pull of vacuum to the electro-conductive glass placed;
One electric probe device, comprises a bracing frame, a Z axis power unit, an electrical measurement seat, at least one image bit cell and a contact electrical measurement plate, described bracing frame is arranged on described pedestal, described Z axis power unit is arranged on described bracing frame, in order to produce the power moved back and forth along Z-direction, described electrical measurement seat is connected on described Z axis power unit, to be subject to described Z axis power unit institute interlock, and reciprocal displacement can be carried out along Z-direction, described image bit cell is arranged on described electrical measurement seat, in order to carry out capture to the electro-conductive glass be positioned on described electrical measurement platform, and provide image signal whether correct for the driving circuit position on controller interpretation electro-conductive glass, described contact electrical measurement plate is arranged on described electrical measurement seat, and the upset of 90 degree can be carried out between vertical shift position, a horizontal electrical measurement position to, and provide engaged test signal for controller interpretation, and described electric probe device is in order to carry out the electrical detection of contact to the electro-conductive glass be positioned on described electrical measurement platform,
One controller, described controller and described micromatic setting, gearshift, electrical measurement platform and described electric probe device are electrically connected, to control start and the stopping of described micromatic setting, gearshift, electrical measurement platform and described electric probe device, and can carry out carrying out interpretation to the image signal of described image bit cell to the driving circuit position on electro-conductive glass, if position has error namely to carry out position correction through micromatic setting, interpretation is carried out to the engaged test signal of described contact electrical measurement plate.
2. the testing agency of table formula optical element contraposition as claimed in claim 1 and electric conductivity, it is characterized in that, described image bit cell is a camera.
3. a detection method for the testing agency of the contraposition of table formula optical element and electric conductivity, is characterized in that, comprises:
Step 1: the displacement of the gearshift described in described controller controls, make electrical measurement platform to discharge position described in drive, and by operator, the electro-conductive glass for detecting is positioned on described electrical measurement platform, and adsorbed by the described pull of vacuum waiting vacuum absorption holes to produce;
Step 2: the displacement of the gearshift then again described in controller controls, makes electrical measurement platform to the electrical measurement position described in drive;
Step 3: and undertaken carrying out capture to the driving circuit position of electro-conductive glass by the image bit cell of described electric probe device, if when having error, just the micromatic setting described in described controller controls critically adjusts the position of described electrical measurement platform, until be adjusted to tram;
Step 4: turn to the horizontal electrical measurement position be the level of state by vertical shift position in vertical state by the contact electrical measurement plate of described electric probe device, described contact electrical measurement plate is contacted with the driving circuit of electro-conductive glass, and electrical detection can be carried out to described electro-conductive glass;
Step 5: after to the one region electrical measurement of described electro-conductive glass, the contact electrical measurement plate of described electric probe device just turn to vertical shift position in vertical state by the horizontal electrical measurement position be the level of state, and the electrical measurement platform controlled again described in described gearshift drive by described controller carries out displacement, makes another region to be measured of described electro-conductive glass and described electric probe device contraposition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310464493.XA CN104515914A (en) | 2013-10-08 | 2013-10-08 | Testing mechanism and testing method of alignment and conductivity of bed type optical components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310464493.XA CN104515914A (en) | 2013-10-08 | 2013-10-08 | Testing mechanism and testing method of alignment and conductivity of bed type optical components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104515914A true CN104515914A (en) | 2015-04-15 |
Family
ID=52791523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310464493.XA Pending CN104515914A (en) | 2013-10-08 | 2013-10-08 | Testing mechanism and testing method of alignment and conductivity of bed type optical components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104515914A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105158609A (en) * | 2015-09-11 | 2015-12-16 | 京东方科技集团股份有限公司 | Lighting module detection apparatus, detection lighting module and display panel method |
| CN105242415A (en) * | 2015-09-16 | 2016-01-13 | 武汉精测电子技术股份有限公司 | Probe substrate and display panel detection device |
| CN105929321A (en) * | 2016-06-12 | 2016-09-07 | 深圳市斯纳达科技有限公司 | Integrated circuit tester |
| CN106019041A (en) * | 2016-05-06 | 2016-10-12 | 京东方科技集团股份有限公司 | Pressing apparatus and touch control panel surface inductor detection apparatus |
| CN106289014A (en) * | 2015-05-15 | 2017-01-04 | 威光自动化科技股份有限公司 | Method and device for detecting horizontal height between a plurality of parallel plates |
| CN108008580A (en) * | 2018-01-05 | 2018-05-08 | 惠科股份有限公司 | Substrate power-up device and its equipment |
| CN110412430A (en) * | 2019-07-23 | 2019-11-05 | 杭州申昊科技股份有限公司 | The detection adjustment structure of partial discharge detection instrument |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5804983A (en) * | 1993-12-22 | 1998-09-08 | Tokyo Electron Limited | Probe apparatus with tilt correction mechanisms |
| CN1580800A (en) * | 2003-08-05 | 2005-02-16 | 奇美电子股份有限公司 | Multifunctional detecting platform for liquid crystal display panel and its detecting method |
| CN101308193A (en) * | 2007-05-15 | 2008-11-19 | 东京毅力科创株式会社 | Probe apparatus |
| CN101493424A (en) * | 2008-01-23 | 2009-07-29 | 政美仪器有限公司 | Small chip surface detecting system in bearing disk and method thereof |
| CN201909918U (en) * | 2010-12-30 | 2011-07-27 | 京东方科技集团股份有限公司 | Liquid crystal panel detecting device |
-
2013
- 2013-10-08 CN CN201310464493.XA patent/CN104515914A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5804983A (en) * | 1993-12-22 | 1998-09-08 | Tokyo Electron Limited | Probe apparatus with tilt correction mechanisms |
| CN1580800A (en) * | 2003-08-05 | 2005-02-16 | 奇美电子股份有限公司 | Multifunctional detecting platform for liquid crystal display panel and its detecting method |
| CN101308193A (en) * | 2007-05-15 | 2008-11-19 | 东京毅力科创株式会社 | Probe apparatus |
| CN101493424A (en) * | 2008-01-23 | 2009-07-29 | 政美仪器有限公司 | Small chip surface detecting system in bearing disk and method thereof |
| CN201909918U (en) * | 2010-12-30 | 2011-07-27 | 京东方科技集团股份有限公司 | Liquid crystal panel detecting device |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106289014B (en) * | 2015-05-15 | 2019-10-11 | 威光自动化科技股份有限公司 | Method and device for detecting horizontal height between a plurality of parallel plates |
| CN106289014A (en) * | 2015-05-15 | 2017-01-04 | 威光自动化科技股份有限公司 | Method and device for detecting horizontal height between a plurality of parallel plates |
| US20170074940A1 (en) * | 2015-09-11 | 2017-03-16 | Boe Technology Group Co., Ltd. | Light-on module testing device, method for testing light-on module and method for testing display panel |
| CN105158609A (en) * | 2015-09-11 | 2015-12-16 | 京东方科技集团股份有限公司 | Lighting module detection apparatus, detection lighting module and display panel method |
| CN105158609B (en) * | 2015-09-11 | 2018-12-28 | 京东方科技集团股份有限公司 | The method of lighting module detecting device, test point lamp module and display panel |
| US10255833B2 (en) | 2015-09-11 | 2019-04-09 | Boe Technology Group Co., Ltd. | Light-on module testing device, method for testing light-on module and method for testing display panel |
| CN105242415A (en) * | 2015-09-16 | 2016-01-13 | 武汉精测电子技术股份有限公司 | Probe substrate and display panel detection device |
| CN106019041A (en) * | 2016-05-06 | 2016-10-12 | 京东方科技集团股份有限公司 | Pressing apparatus and touch control panel surface inductor detection apparatus |
| CN105929321A (en) * | 2016-06-12 | 2016-09-07 | 深圳市斯纳达科技有限公司 | Integrated circuit tester |
| CN105929321B (en) * | 2016-06-12 | 2023-03-03 | 深圳市斯纳达科技有限公司 | Integrated circuit test equipment |
| CN108008580A (en) * | 2018-01-05 | 2018-05-08 | 惠科股份有限公司 | Substrate power-up device and its equipment |
| CN108008580B (en) * | 2018-01-05 | 2020-06-16 | 惠科股份有限公司 | Substrate power-up device and equipment thereof |
| US10948748B2 (en) | 2018-01-05 | 2021-03-16 | HKC Corporation Limited | Apparatus and device for applying voltage to substrate |
| WO2019134195A1 (en) * | 2018-01-05 | 2019-07-11 | 惠科股份有限公司 | Substrate power-on apparatus and device thereof |
| CN110412430A (en) * | 2019-07-23 | 2019-11-05 | 杭州申昊科技股份有限公司 | The detection adjustment structure of partial discharge detection instrument |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104515914A (en) | Testing mechanism and testing method of alignment and conductivity of bed type optical components | |
| JP7085042B2 (en) | Probe system | |
| US8836940B2 (en) | Test apparatus for liquid crystal display | |
| CN101571452B (en) | Supporting device for multi-specs panels of worktable of display panel detection device | |
| KR101313531B1 (en) | Testing apparatus and testing method | |
| CN201203583Y (en) | Optical detector for printed circuit board | |
| CN102472711B (en) | Substrate inspecting apparatus | |
| CN104637427B (en) | Detection jig | |
| CN105445972A (en) | Probe movement device | |
| CN107632424B (en) | COF (chip on film) self-pressing semi-automatic equipment for liquid crystal display and pressing process thereof | |
| CN108663836B (en) | Liquid crystal display panel detection and positioning device | |
| CN105445971A (en) | Check device of liquid crystal display panel and control method thereof | |
| TW201302641A (en) | Apparatus for transporting glass panel | |
| JP2010276541A (en) | Thin-film probe sheet, method of manufacturing the same, probe card, and semiconductor chip inspecting apparatus | |
| CN111299086A (en) | Dispensing mechanism and display screen production line | |
| KR101286250B1 (en) | Array test apparatus having multiple head unit | |
| CN216083003U (en) | Double-station VCSEL semi-automatic testing machine | |
| KR101278131B1 (en) | Wiring board unit and testing apparatus | |
| CN113640652A (en) | Double-station VCSEL semi-automatic testing machine | |
| KR101902966B1 (en) | Fixing apparatus for substrate | |
| CN103201675A (en) | Jig for adjusting film pitch, apparatus for joining film having the same, and method of adjusting film pitch using the apparatus | |
| CN105445574B (en) | Probe | |
| CN210037150U (en) | Alignment system of display module | |
| KR101219285B1 (en) | Inspection method and apparatus of substrate | |
| KR100553816B1 (en) | Cog bonder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150415 |
|
| WD01 | Invention patent application deemed withdrawn after publication |