CN104460119A - Display panel and method for manufacturing the same - Google Patents
Display panel and method for manufacturing the same Download PDFInfo
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- CN104460119A CN104460119A CN201410690830.1A CN201410690830A CN104460119A CN 104460119 A CN104460119 A CN 104460119A CN 201410690830 A CN201410690830 A CN 201410690830A CN 104460119 A CN104460119 A CN 104460119A
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- Prior art keywords
- base plate
- filter sheet
- sheet base
- lateral margin
- display panel
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims description 29
- 239000003292 glue Substances 0.000 claims abstract description 101
- 210000000746 body region Anatomy 0.000 claims abstract description 44
- 239000010409 thin film Substances 0.000 claims abstract description 43
- 230000003287 optical effect Effects 0.000 claims abstract description 26
- 238000007789 sealing Methods 0.000 claims abstract description 12
- 238000003486 chemical etching Methods 0.000 claims description 23
- 230000001458 anti-acid effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 28
- 230000001681 protective effect Effects 0.000 abstract description 10
- 239000002585 base Substances 0.000 description 101
- 238000010276 construction Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 12
- 239000011159 matrix material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 241000278713 Theora Species 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000013467 fragmentation Methods 0.000 description 3
- 238000006062 fragmentation reaction Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A display panel and a manufacturing method thereof are provided, the manufacturing method comprises the following steps. The bonding filter substrate is arranged in the combined area of the thin film transistor substrate. And performing a first glue sealing step, namely arranging a first protective glue on the electric connection area connected with the combination area and contacting the side end of the optical filter substrate. A first thinning step is performed to thin the body region and the side edge region of the filter module, which are connected with each other. And performing a second glue sealing step, wherein a second protective glue is arranged on the side edge area, and the first protective glue is connected with the second protective glue. And performing a second thinning step to thin the filter substrate so that the thickness of the side edge region is greater than that of the main body region. And removing the first protective glue and the second protective glue. By means of the temporary sequential arrangement of the first protective glue and the second protective glue, the utilization rate of the substrate and the assembly quality can be improved.
Description
[technical field]
The invention relates to a kind of display panel and manufacture method thereof, particularly a kind of slim display panel and manufacture method thereof.
[background technology]
In general, thin-film transistor LCD device (Thin-film-transistor liquid crystal display) comprises a thin film transistor base plate (Thin-film-transistor substrate) and a colored filter substrate (Colorfilter substrate), colored filter substrate is stacked on the central surface of thin film transistor base plate, and Liquid crystal pour is between thin film transistor base plate and colored filter substrate.In addition, the marginal surface of thin film transistor base plate can arrange driving circuit, and driving circuit is adjacent to colored filter substrate and in order to drive liquid crystal, to change opticpath.
In a large amount of process manufactured, the thin film transistor (TFT) that many groups can be set on a sheet of substrate and the colored filter substrate be stacked on thin film transistor (TFT).In addition, in order to reduce the integral thickness of thin-film transistor LCD device, thinning program can be carried out to colored filter substrate and thin film transistor base plate, then substrate being cut, organize panel to be divided into more.
Specifically, colored filter substrate fits on the part surface of thin film transistor base plate, and each colored filter substrate can interval one distance.Protecting glue is now set on thin film transistor base plate, and protecting glue is contacted with at least one side of colored filter substrate.Next, can utilize that chemical etching mode is disposable carries out whole thinning to colored filter substrate, to reduce its thickness to 0.1 millimeter (mm) below.But, in time being coated with protecting glue, easily making Air infitration between the side of protecting glue and colored filter substrate, and produce minute bubbles.So, when carrying out chemical etching, chemical etching liquor infiltrates from the bubble between protecting glue and colored filter substrate side and then destroys internal circuit.
In order to solve the problem that above-mentioned chemical etching liquor infiltrates, ora terminalis and side on the surface that protecting glue also can be arranged at colored filter substrate simultaneously.So, on the surface of colored filter substrate, ora terminalis by thinning, can not infiltrate from the ora terminalis of colored filter substrate to avoid chemical etching liquor because protected glue covers.But, this colored filter substrate not excessive by the thickness of the ora terminalis of thinning, can and to produce excessive section poor in the stage casing of colored filter substrate.So, excessive section missionary society affects attaching and the successive process of follow-up polaroid, even easily causes the problem of colored filter substrate or thin film transistor base plate fragmentation.
Therefore be badly in need of a kind of display panel and manufacture method thereof at present, the problem producing chemical etching liquor infiltration and avoid fragmentation can be solved in the process of thinning.
[summary of the invention]
In view of above problem, the present invention discloses a kind of display panel and manufacture method thereof, and it is by the mode of carrying out secondary sealing and secondary thinning, and then avoids chemical etching liquor to infiltrate in wherein and produce the problem such as fragmentation.
One embodiment of the invention disclose a kind of manufacture method of display panel, and it comprises the following step.Laminating filter sheet base plate is in the combination region of thin film transistor base plate.Carry out the first sealing step, the first protecting glue to be arranged on the electrical bonding land that is connected with combination region and to contact the side of filter sheet base plate.Carry out the first thinning step, the body region be connected to each other of thinning filter sheet base plate and lateral margin district.Carry out the second sealing step, the second protecting glue is arranged in lateral margin district, and the first protecting glue connects the second protecting glue.Carry out the second thinning step, thinning filter sheet base plate, with the thickness making the thickness in lateral margin district be greater than body region.Remove the first protecting glue and the second protecting glue.
One embodiment of the invention disclose a kind of display panel, and it comprises thin film transistor base plate and filter sheet base plate.Thin film transistor base plate has the combination region and electrical bonding land that are connected to each other.Filter sheet base plate is arranged on combination region, to expose electrical bonding land.Filter sheet base plate has the body region and lateral margin district that are connected to each other, and lateral margin district is between body region and electrically between bonding land.Wherein, the thickness in lateral margin district is greater than the thickness of body region.
One embodiment of the invention disclose a kind of display panel, and it comprises a thin film transistor base plate, a filter sheet base plate and one first optical element.Thin film transistor base plate has the combination region and an electrical bonding land that are connected to each other.Filter sheet base plate to be arranged on combination region and to have a raised structures, and the position of raised structures is corresponding and be adjacent to electrical bonding land.First optical element is located on filter sheet base plate, and a side contact protrusion structure of the first optical element.
The display panel disclosed according to the present invention and manufacture method thereof, first arrange the first protecting glue on the electrical bonding land of thin film transistor base plate and the side contacting filter sheet base plate then carries out first time thinning.Then, the second protecting glue is set in lateral margin district, and the first protecting glue connects the second protecting glue, then carry out the second thinning step, thinning filter sheet base plate, be greater than the thickness of body region with the thickness in the lateral margin district making filter sheet base plate.So, by the step of sequentially carrying out twice sealing and thinning, can circuit between protective film transistor base and filter sheet base plate, to avoid damaging.Moreover due to also thinning lateral margin district in first time thinning step, therefore the section difference between body region and lateral margin district reduces, to make the surface of filter sheet base plate comparatively smooth, be conducive to the assembling of other elements following, and then promote assembling quality.
The above explanation about content of the present invention and the explanation of following embodiment are in order to demonstration and explanation principle of the present invention, and provide patent claim of the present invention further to explain.
[accompanying drawing explanation]
Fig. 1 is the schematic flow sheet of the manufacture method of panel construction according to an embodiment of the invention.
Fig. 2 to Fig. 6 is the manufacture schematic diagram of panel construction according to an embodiment of the invention.
Fig. 7 is the manufacture schematic diagram of panel construction according to another embodiment of the present invention.
Fig. 8 to Fig. 9 is the manufacture schematic diagram for panel construction according to an embodiment of the invention.
Figure 10 is the cut-away illustration of the panel construction according to further embodiment of this invention.
Figure 11 is the schematic perspective view of panel construction according to an embodiment of the invention.
Figure 12 is the cut-away illustration of panel construction according to an embodiment of the invention.
Figure 13 is the schematic perspective view of panel construction according to yet another embodiment of the invention.
Figure 14 is the schematic perspective view of panel construction according to yet another embodiment of the invention.
Figure 15 is the cut-away illustration of panel construction according to yet another embodiment of the invention.
[symbol description]
1,2,3 display panels
10 thin film transistor base plates
10a combination region
The electrical bonding land of 10b
11 first support plates
12 tft layers
121 thin film transistor (TFT)s
122 liquid crystal
20 filter sheet base plates
20a body region
20b lateral margin district
20c can viewing area
21 second support plates
22 filter layers
221 black matrix"s
222 optical filters
23 sides
31 first protecting glue
311 outside surfaces
32 second protecting glue
40 first optical elements
40a side
50 second optical elements
60 driving circuits
70 thin film transistor base plates
70a combination region
The electrical bonding land of 70b, 70c
80 filter sheet base plates
80a body region
80b, 80c lateral margin district
90 bubbles
A1 center of curvature axle
A2 bearing of trend
D1 first distance
D2 second distance
T1 first thickness
T2 second thickness
T3 the 3rd thickness
T4 the 4th thickness
W1 first width
W2 second width
[embodiment]
Below detailed features of the present invention and advantage is described in embodiments in detail, its content is enough to make any relevant art of haveing the knack of understand technology contents of the present invention and implement according to this, and content disclosed by this instructions, claim and graphic, any relevant art of haveing the knack of can understand the object and advantage that the present invention is correlated with easily.Following embodiment further describes viewpoint of the present invention, but non-to limit category of the present invention anyways.
In the present invention, in literary composition describe " on ", D score, "left", "right", be diagram in relative position relation, its be not used to limit the present invention.For example, in a visual angle of an embodiment, A element is arranged on B element; In another visual angle, A element is under being arranged at B element.
The invention provides a kind of panel construction, for display frame for user's viewing.In the present invention, this panel construction is tft type liquid crystal display panel.
Below introduce the manufacture of panel construction, next please refer to " Fig. 1 " to " Fig. 6 " and " Fig. 8 " to " Fig. 9 ", wherein, " Fig. 1 " is the schematic flow sheet for the manufacture method of panel construction according to an embodiment of the invention." Fig. 2 " to " Fig. 6 " and " Fig. 8 " to " Fig. 9 " is respectively the manufacture schematic diagram of panel construction according to an embodiment of the invention.
Please refer to " Fig. 2 ", first, provide thin film transistor base plate 10 and filter sheet base plate 20 (S100).Specifically, thin film transistor base plate 10 comprises the first support plate 11 and tft layer 12, tft layer 12 is arranged on the first support plate 11, first support plate 11 is the plate of a light-permeable, tft layer 12 comprises the elements (not illustrating) such as multiple thin film transistor (TFT) (Thin-film-transistor is called for short TFT), spacer (Spacer).In addition, definition thin film transistor base plate 10 has the combination region 10a and electrical bonding land 10b that are connected to each other, and tft layer 12 is all positioned at combination region 10a.In the present embodiment, electrical bonding land 10b is the side being connected to combination region 10a.Moreover filter sheet base plate 20 comprises the second support plate 21 and filter layer 22, filter layer 22 is positioned on the second support plate 21.Specifically, after thin film transistor base plate 10 and filter sheet base plate 20 fit into panel, filter layer 22 and tft layer 12 are between the first support plate 11 and the second support plate 21.Definition filter sheet base plate 20 has the body region 20a and lateral margin district 20b that are connected to each other.Filter sheet base plate 20 has more side 23.In the present invention, side 23 refers to the ora terminalis on relative two surfaces being connected to the second support plate 21 and filter layer 22.In more detail, the filter layer 22 of filter sheet base plate 20 can comprise black matrix" (Black matrix) 221 and multiple optical filter (Colorfilter) 222, and optical filter 222 is arranged between each black matrix" 221 respectively.Wherein, the ring-like enclosing region had within optical filter 222 can be considered can viewing area (i.e. zone of action, ActiveArea) 20c, makes light change its display color, watched the picture of different color by be allowed user.
Then, please refer to " Fig. 3 ", fit and establish filter sheet base plate 20 (S200) on the combination region 10a of thin film transistor base plate 10 with folded.That is, filter sheet base plate 20 covered combination region 10a, and exposed electrical bonding land 10b.Further, the filter layer of filter sheet base plate 20 22 in the face of and fit on the tft layer 12 of thin film transistor base plate 10, and lateral margin district 20b is between the electrical bonding land 10b of body region 20a and thin film transistor base plate 10.In the present embodiment, liquid crystal 122 can separately be injected between tft layer 121 and filter layer 22.
Please refer to " Fig. 4 ".Then, carry out the first sealing step, the electrical bonding land 10b the first protecting glue 31 being arranged at thin film transistor base plate 10 contacts the side 23 (S300) of filter sheet base plate 20.First protecting glue 31, in order to protect the side 23 of filter sheet base plate 20, is directly exposed to the external world to avoid side 23.It should be noted that on the body region 20a that the first protecting glue 31 is not arranged at filter sheet base plate 20 and lateral margin district 20b.In other words; first protecting glue 31 is covered in electrical bonding land 10b; and with side 23 close contact of filter sheet base plate 20, the side 23 making circuit, metal gasket or chip on electrical bonding land 10b and the second support plate 20 neither with contacting external air, avoid sustaining damage in successive process.In addition, in the present embodiment, have the bubble 90 produced because of gluing processing procedure between the first protecting glue 31 and side 23 and infiltrate wherein, but the volume size of bubble 90 can by processing environment or operation different and affect to some extent, also may have the situation that bubble-free 90 is formed.
Please refer to " Fig. 5 ".Then, carry out the first thinning step, the body region 20a be connected to each other of thinning filter sheet base plate 20 and lateral margin district 20b (S400).In the present embodiment, simultaneously the first thinning step carries out thinning to the body region 20a of filter sheet base plate 20 and lateral margin district 20b in chemical etching mode, if dotted portion oblique in " Fig. 5 " is then the part of thinning etching.In the present embodiment; first protecting glue 31 is antiacid glue or alkali resistant glue; be used for preventing chemical etching liquor from can destroy the circuit of electrical bonding land 10b, metal gasket or chip, avoid at the side 23 of filter sheet base plate 20, lateral etch occurring and injuring the inner structure of panel simultaneously.Refer to " Fig. 4 " and " Fig. 5 ", when first time sealing, side 23 close contact of the first protecting glue 31 and filter sheet base plate 20, but be not covered on filter sheet base plate 20.In detail; first protecting glue 31 not has overlapping region with filter sheet base plate 20 in vertical projection direction (direction as shown); therefore, when carrying out primary thinning process, the outside surface of filter sheet base plate 20 can carry out chemical etching comprehensively and reduce thickness.Moreover in the present embodiment and section Example, the first thickness T1 being positioned at side 23 due to the first protecting glue 31 is the second thickness T2 being greater than filter sheet base plate 20, so also helps avoid side 23 and exposes, and then avoid sustaining damage in successive process.Specifically, the first thickness T1 refers to the height that the first protecting glue 31 upwards extends in side 23 from the first support plate 11, and the second thickness T2 refers to filter sheet base plate 20 after the first thinning step from the height that the first support plate 11 upwards extends.When the first thickness T1 is more than or equal to the second thickness T2, namely represents that the first protecting glue 31 envelopes the side 23 of filter sheet base plate 20, expose to avoid side 23.When side 23 exposes, may successive process be made, destroy side 23, and make bubble enter filter sheet base plate 20.Only, above-mentioned first thinning step utilizes chemical etching mode to be not used to limit the present invention.In other embodiments, simultaneously the first thinning step carries out thinning to the body region 20a of filter sheet base plate 20 and lateral margin district 20b in physical grinding mode.In this embodiment, the first protecting glue 31 protects the circuit of electrical bonding land 10b, metal gasket or chip, to avoid when physical grinding, produce dust or particle contamination and cause the phenomenons such as short circuit, and the first protecting glue 31 can be colloid or adhesive tape.In addition, in the first thinning step, except carrying out except the thinning of thickness to filter sheet base plate 20, be can carry out thinning to the first support plate 11 of thin film transistor base plate 10, if dotted portion oblique in " Fig. 5 " is then the part of thinning etching, and then reduction integral thickness.When the first thinning process, filter sheet base plate 20 does not reach the thinning thickness (namely not reaching final thickness) of expection, thus, can guarantee that the bubble formed in gluing process can not be connected with outside air, and then in thinning process, avoid chemical etching liquor to infiltrate through bubble from substrate side and destroy internal circuit.
Please refer to " Fig. 6 ".Next, carry out the second sealing step, the second protecting glue 32 is arranged on the lateral margin district 20b of filter sheet base plate 20, and the first protecting glue 31 connects the second protecting glue 32 (S500).Specifically, the second protecting glue 32 and the first protecting glue 31 close contact, and be covered in the partial outer face of filter sheet base plate 20, that is the second protecting glue 32 has overlapping region with filter sheet base plate 20 in vertical projection direction.First protecting glue 31, also in order to protect lateral margin district 20b, is directly exposed to the external world to avoid lateral margin district 20b.In the present embodiment, the second protecting glue 32 and the first protecting glue 31 are for being close to and contacting with each other, but the present invention is not as limit.Please refer to " Fig. 7 ", it is the manufacture schematic diagram for panel construction according to another embodiment of the present invention, and in another embodiment, the second protecting glue 32 can extend from filter sheet base plate 20 outside surface and be covered in above the first protecting glue 31.For increasing protected effect, the second protecting glue 32 also may extend to the outside surface 311 of the first protecting glue 31, makes the first protecting glue 31 can be completely coated by the second protecting glue 32.
Please refer to " Fig. 8 ", carry out the second thinning step, thinning filter sheet base plate 20.Due to lateral margin district 20b cover by the second protecting glue 32, therefore in the second thinning step, the lateral margin district 20b of filter sheet base plate 20 can not by thinning, and only the body region 20a of filter sheet base plate 20 is by thinning.So, the body region 20a of filter sheet base plate 20 has the 3rd thickness T3 after thinning, and is not had the 4th thickness T4 by the lateral margin district 20b of thinning, and the 4th thickness T4 of lateral margin district 20b is greater than the 3rd thickness T3 of body region 20a.In the present embodiment, the 3rd thickness T3 can be below 0.1mm in fact, and the 4th thickness T4 can be below 0.3mm in fact.Now, the section difference (T4-T3) of lateral margin district 20b and body region 20a can be less than or equal to 0.25mm in fact.Because the 4th thickness T4 of lateral margin district 20b is only slightly larger than the 3rd thickness T3 of body region 20a, the flatness of filter sheet base plate 20 can be promoted, be conducive to follow-up manufacturing process.But above-mentioned thickness and section difference are not used to limit the present invention, its thickness and section difference can adjust according to the actual requirements.
Further, this second thinning step carries out thinning in chemical etching mode to filter sheet base plate 20, and the second protecting glue is antiacid glue or alkali resistant glue.That is, when the first thinning step and the second thinning step are all chemical etching mode, then the first protecting glue 31 and the second protecting glue 32 are all antiacid glue or alkali resistant glue.When so can avoid carrying out chemical etching, the first protecting glue 31 and the second protecting glue 32 are corroded, and chemical etching liquor is infiltrated via bubble 90 and destroy the first protecting glue 31 and the second protecting glue 32 protect under filter sheet base plate 20.In addition, if lateral margin district 20b and body region 20a all uses same way to carry out thinning process (such as chemical etching mode), then the surfaceness of lateral margin district 20b is the surfaceness equaling body region 20a.In other embodiments; if lateral margin district 20b carries out thinning in physical grinding mode when the first thinning step; and body region 20a when using chemical etching mode to carry out thinning process when the second thinning step; then the surfaceness of lateral margin district 20b is the surfaceness being different from body region 2; and the second protecting glue 32 may extend to the outside surface 311 of the first protecting glue 31; make the first protecting glue 31 can be completely coated by the second protecting glue 32; to avoid when the second thinning step, the first protecting glue 31 is chemically etched liquid and corrodes.Moreover, in the second thinning step, be also can carry out thinning to the first support plate 11 of thin film transistor base plate 10, and then reduction integral thickness, if dotted portion oblique in " Fig. 8 " is then the part of thinning etching.Generally speaking, the present invention can according to the kind of the lapping mode of twice thinning step, and make the first protecting glue 31 can be identical or different with the material of the second protecting glue 32.That is, when the lapping mode of twice thinning step is all chemical etching mode, the material of the first protecting glue 31 can be same as the corrosion-resistant material of the second protecting glue 32; When the lapping mode of twice thinning step is different, (such as the first thinning step is physical grinding mode; second thinning step is chemical etching mode); the material of the first protecting glue 31 can be abrasive resistant material, and the second protecting glue 32 can be corrosion-resistant material.
Please refer to " Fig. 9 " and " Figure 11 ", " Figure 11 " is the schematic perspective view for panel construction according to an embodiment of the invention.Then, the first protecting glue and the second protecting glue is removed.So, the thinning step of display panel 1 is namely completed.In the present embodiment, lateral margin district 20b is to being more than or equal to first width W 1 of lateral margin district 20b by the first distance D1 between the 20c of viewing area, so, the lateral margin district 20b of the present embodiment does not affect can the transmittancy of viewing area 20c, can be applicable to the display device machine of narrow frame.Specifically, first distance D1 is from the side ora terminalis of display panel 1 to can the distance of viewing area 20c outer rim (label 20c indication dotted line), is also the width that display panel 1 is arranged at the width of the black matrix" 221 of outermost or the non-display area of display panel 1 periphery.First width W 1 is the width of the lateral margin district 20b raised structures 24 of the second support plate 21.In the present invention, raised structures 24 refers to the projection higher than body region 20a on lateral margin district 20b, and the position of raised structures 24 is close to and corresponds to electrical bonding land 10b.
Refer to " Figure 10 ", it is the cut-away illustration of the panel construction according to further embodiment of this invention.In other embodiments, lateral margin district 20b is to also can being greater than second width W 2 of lateral margin district 20b by the second distance D2 between the 20c of viewing area.Specifically, second distance D2 is from the side ora terminalis of display panel 1 to can the distance of viewing area 20c outer rim, is also the width that display panel 1 is arranged at the width of the black matrix" 221 of outermost or the non-display area of display panel 1 periphery.Second width W 2 is the width of the lateral margin district 20b raised structures 24 of the second support plate 21.In the present embodiment, the raised structures 24 of the lateral margin district 20b of the second support plate 21 can have overlapping region in the vertical direction with colored filter 222, and this structure can avoid display panel 1 to need wider neighboring area, and be better than the display device machine being applied in Wide frame.Although the width of lateral margin district 20b increases, the thickness of lateral margin district 20b also identical with " Fig. 9 " (being less than or equal to 0.25mm).So, effect that this case avoids side 23 to damage can also be reached.
Please refer to " Figure 12 ", it is the cut-away illustration for panel construction according to an embodiment of the invention.In the present embodiment and other embodiments partly, after completing above-mentioned steps, first optical element 40 can be separately set on the body region 20a of filter sheet base plate 20, second optical element 50 is set in first support plate 11 times of thin film transistor base plate 10, and driving circuit 60 is set on electrical bonding land 10b.In the present embodiment, one side 40a of the first optical element 40 can be contacted with the second support plate 21 in the raised structures 24 of lateral margin district 20b, but the present invention is not as limit, in other embodiments, the first optical element 40 and the second support plate 21 to be separated by a distance in the raised structures 24 of lateral margin district 20b.Due to lateral margin district 20b in the second thinning step also by thinning, so it is poor to reduce the section of body region 20a and lateral margin district 20b, and then is conducive to the first optical element 40 and is assembled on the body region 20a of filter sheet base plate 20, avoid crooked attaching.In the present embodiment, the first optical element 40 and the second optical element 50 are all Polarizer (Polarizer), but the setting that the first optical element 40 and the second optical element 50 are Polarizer is not used to limit the present invention.Moreover, driving circuit 60 can be arranged on electrical bonding land 10b, in order to drive the electronic component of thin film transistor base plate 10 and filter sheet base plate 20.
In addition, as " Fig. 9 " and " Figure 10 ", the width of raised structures 24 can adjust according to practical situation.For example, the width of raised structures 24 can reduce, to be less than the width of the black matrix" 221 of outermost, that is, can viewing area 20c to correspond to the vertical direction of the first optical element 40 be overlapping with raised structures 24, or optical filter 222 formed the outer rim dotted line of indication (on the label 20c) of viewing area 20c can coincide with raised structures 24.So may correspond to the machine in narrow frame.
In other embodiments, the width of raised structures 24 can increase, be greater than the width of the black matrix" 221 of outermost, with in the vertical direction making the optical filter 222 of a part of outermost of raised structures 24 (not illustrating), that is, optical filter 222 formed can viewing area 20c to correspond to the vertical direction of the first optical element 40 be not overlapping with raised structures 24.So may correspond to the machine in Wide frame.
In the above embodiments, thin film transistor base plate 10 only comprises an electrical bonding land 10b, and filter sheet base plate 20 only comprises a lateral margin district 20b.But electrically the number of bonding land 10b and lateral margin district 20b is not used to limit the present invention.Please refer to " Figure 13 ", is the schematic perspective view for panel construction according to yet another embodiment of the invention.In other embodiments, the thin film transistor base plate 70 of display panel 2 comprises combination region 70a and two electrically bonding land 70b, 70c, and the filter sheet base plate 20 of display panel 2 comprises body region 80a and two lateral margin district 80b, 80c.Electrical bonding land 70b, 70c are connected to the two ends of combination region 70a, and lateral margin district 80b, 80c are also connected to the two ends of body region 80a.Lateral margin district 80b is between electrical bonding land 70b and body region 80a, and lateral margin district 80c is also between electrical bonding land 70c and body region 80a.It should be noted that the thickness of lateral margin district 80b, 80c is all greater than the thickness of body region 80a.Structure so, also attainable cost case is avoided chemical etching liquor to infiltrate the gap between thin film transistor base plate 10 and filter sheet base plate 20 and is reached effect of leveling.In the embodiment of " Figure 13 ", two electrical bonding land 70b, 70c are the relative dual-side being positioned at display panel 2, and in another embodiment, two electrical bonding lands also can be positioned at the adjacent and connected dual-side of display panel.
In some embodiments, display panel can be applicable to flexible displays, and referring to " Figure 14 " and " Figure 15 ", " Figure 14 " is the schematic perspective view for panel construction according to yet another embodiment of the invention." Figure 15 " is the cut-away illustration for panel construction according to yet another embodiment of the invention.Display panel 3 is a curved surface panel, and it bends along center of curvature axle A1.Lateral margin district 20b can be considered elongated fin, to be arranged on thin film transistor base plate 10 and to have a bearing of trend A2.Wherein, the center of curvature axle A1 of display panel 3 is the bearing of trend A2 being parallel to fin (i.e. lateral margin district 20b).Further, display panel 3 can be considered a curved surface, and lateral margin district 20b is the end points being positioned at this curved surface, as shown in " Figure 15 ".So, avoided lateral margin district 20b to distort and caused brokenly the problem of plate.
Comprehensively above-mentioned, the display panel disclosed according to the present invention and manufacture method thereof, first arrange the first protecting glue on the electrical bonding land of thin film transistor base plate and the side contacting filter sheet base plate then carries out first time thinning.Then, the second protecting glue is set in lateral margin district, and the first protecting glue connects the second protecting glue, then carry out the second thinning step, thinning filter sheet base plate, be greater than the thickness of body region with the thickness in the lateral margin district making filter sheet base plate.So, by the step of sealing thinning of sequentially carrying out twice, can circuit between protective film transistor base and filter sheet base plate, to avoid damaging, and also can reach thinning effect.Moreover due to also thinning lateral margin district in first time thinning step, the section difference between body region and lateral margin district is less, to make the surface of filter sheet base plate comparatively smooth, be conducive to the assembling of other elements following, and then promote assembling quality.
Although the present invention discloses as above with aforesaid preferred embodiment; so itself and be not used to limit the present invention; anyly have the knack of alike those skilled in the art; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore scope of patent protection of the present invention must be as the criterion depending on the claim person of defining appended by this instructions.
Claims (10)
1. a manufacture method for display panel, it comprises:
Fit a filter sheet base plate in a combination region of a thin film transistor base plate;
Carry out one first sealing step, one first protecting glue to be arranged on the electrical bonding land that is connected with this combination region and to contact the side of this filter sheet base plate;
Carry out one first thinning step, the body region that this filter sheet base plate of thinning is connected to each other and a lateral margin district;
Carry out one second sealing step, one second protecting glue is arranged in this lateral margin district, and this first protecting glue connects this second protecting glue;
Carry out one second thinning step, this filter sheet base plate of thinning, with the thickness making the thickness in this lateral margin district be greater than this body region; And
Remove this first protecting glue and this second protecting glue.
2. the manufacture method of display panel as claimed in claim 1, it is characterized in that, this second thinning step carries out thinning in a chemical etching mode to this filter sheet base plate, and this second protecting glue is antiacid glue.
3. the manufacture method of display panel as claimed in claim 1, it is characterized in that, this first thinning step carries out thinning in a chemical etching mode to this filter sheet base plate, and this first protecting glue is antiacid glue.
4. the manufacture method of display panel as claimed in claim 1, it is characterized in that, in this first thinning step, the thickness of this first protecting glue is greater than the thickness of this filter sheet base plate.
5. the manufacture method of display panel as claimed in claim 1, is characterized in that, this second protecting glue this first protecting glue coated.
6. a display panel, it comprises:
One thin film transistor base plate, has the combination region and an electrical bonding land that are connected to each other; And
One filter sheet base plate, be arranged on this combination region, to expose this electrical bonding land, this filter sheet base plate has the body region and a lateral margin district that are connected to each other, and this lateral margin district between this body region and this electrical bonding land wherein the thickness in this lateral margin district be greater than the thickness of this body region.
7. display panel as claimed in claim 6, it is characterized in that, the surfaceness in this lateral margin district is the surfaceness equaling this body region.
8. display panel as claimed in claim 6, it is characterized in that, the surfaceness in this lateral margin district is the surfaceness being less than this body region.
9. display panel as claimed in claim 6, it is characterized in that, this display panel is a curved surface panel, and its center of curvature axle is the bearing of trend being parallel to this lateral margin district.
10. a display panel, it comprises:
One thin film transistor base plate, has the combination region and an electrical bonding land that are connected to each other;
One filter sheet base plate, to be arranged on this combination region and to have a raised structures, and the position of this raised structures is corresponding and be adjacent to this electrical bonding land; And
One first optical element, is located on this filter sheet base plate, and this raised structures of a contact aside of this first optical element.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103129943A TWI544252B (en) | 2014-08-29 | 2014-08-29 | Display panel and method of manufacturing the same |
| TW103129943 | 2014-08-29 |
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| Publication Number | Publication Date |
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| CN104460119A true CN104460119A (en) | 2015-03-25 |
| CN104460119B CN104460119B (en) | 2017-08-15 |
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| CN201410690830.1A Expired - Fee Related CN104460119B (en) | 2014-08-29 | 2014-11-26 | Display panel and method for manufacturing the same |
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| Country | Link |
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| CN (1) | CN104460119B (en) |
| TW (1) | TWI544252B (en) |
Cited By (3)
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| WO2018188314A1 (en) * | 2017-04-14 | 2018-10-18 | 京东方科技集团股份有限公司 | Thinning method for substrate and thinning method for display panel |
| EP3438731A4 (en) * | 2016-04-01 | 2019-11-13 | Tovis Co. Ltd. | Method for manufacturing curved display panel, and curved display panel manufactured by same manufacturing method |
| CN113689792A (en) * | 2017-07-19 | 2021-11-23 | 群创光电股份有限公司 | Display device and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107731102A (en) | 2017-10-31 | 2018-02-23 | 云谷（固安）科技有限公司 | The method for assembling and camber display screen of a kind of camber display screen |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201608304A (en) | 2016-03-01 |
| TWI544252B (en) | 2016-08-01 |
| CN104460119B (en) | 2017-08-15 |
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