CN104409396A - Wet etching method and device for solar cells - Google Patents
Wet etching method and device for solar cells Download PDFInfo
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- CN104409396A CN104409396A CN201410699196.8A CN201410699196A CN104409396A CN 104409396 A CN104409396 A CN 104409396A CN 201410699196 A CN201410699196 A CN 201410699196A CN 104409396 A CN104409396 A CN 104409396A
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- rinse bath
- solar battery
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- 238000001039 wet etching Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 134
- 239000007788 liquid Substances 0.000 claims abstract description 87
- 238000005530 etching Methods 0.000 claims abstract description 59
- 241000628997 Flos Species 0.000 claims description 20
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 16
- 230000003020 moisturizing effect Effects 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 13
- 239000008367 deionised water Substances 0.000 claims description 9
- 229910021641 deionized water Inorganic materials 0.000 claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 235000021110 pickles Nutrition 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 abstract description 26
- 239000002351 wastewater Substances 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000005406 washing Methods 0.000 abstract 10
- 238000005554 pickling Methods 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 18
- 238000004140 cleaning Methods 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 11
- 210000004027 cell Anatomy 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 230000009131 signaling function Effects 0.000 description 4
- 210000005056 cell body Anatomy 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 241000084978 Rena Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a wet etching method and device for solar cells. The wet etching device comprises an etching tank, a first washing tank, an alkaline washing tank, a second washing tank, a pickling tank and a third washing tank. An inlet and an outlet of the first washing tank are provided with a first water jet cutter and a second water jet cutter respectively. The wet etching device further comprises a first liquid storage tank and a second liquid storage tank which are connected with the third washing tank and the second water jet cutter through connecting pipelines, respectively.as liquid in the third washing tank reaches a preset water level, redundant liquid is discharged into the second liquid storage tank which supplies the liquid for the second water jet cutter. The first liquid storage tank is connected with the first washing tank and the etching tank respectively through the connecting pipelines. The first washing tank supplies the liquid for the first water jet cutter. As the liquid in the first washing tank reaches the preset water level, the redundant liquid is discharged into the first liquid storage tank used for supplying water and distributing liquid for the etching tank. By the use of the wet etching method and device, nitrogenous waste water discharge is reduced, and production cost is lowered.
Description
Technical field
The invention belongs to area of solar cell, relate to a kind of wet etch process and device of solar battery sheet.
Background technology
The part such as the P-type layer that common crystal silicon solar energy battery is made up of backplate, semi-conducting material, N-type layer, P-N junction, antireflection film, positive gate electrode forms.When solar irradiation is mapped to solar cell surface, antireflection film and suede structure effectively can reduce the light reflection loss of battery surface.After semiconductor structure in solar cell absorbs solar energy.Excite and produce electronics, hole pair, electronics, hole separate by the inner P-N junction built-in field of semiconductor, and electron stream enters N district, hole flows into P district, form photoproduction electric field, if can the positive and negative electrode of battery be connected with external circuit very much by crystalline silicon, in external circuit, just have photogenerated current to pass through.
The manufacturing process of solar cell comprises making herbs into wool, diffusion, etching, plated film, silk screen printing and the sorting of IV efficiency.Fig. 1 is shown as the structural representation of the wet etching apparatus of the solar battery sheet of prior art, in the wet-method etching and etching of solar battery sheet, shown in silicon chip direction of travel arrow, silicon chip can pass through etching bath 101, first rinse bath 102, alkaline bath 103, second rinse bath 104, descaling bath 105 and the 3rd rinse bath 106 successively.Wherein etching bath 101 solution used is nitric acid and hydrofluoric acid, and its effect is the mechanical damage layer of removal silicon chip surface and forms matte.First rinse bath 102 can make it nitrogenous when utilizing the first water cutter 107 and the second water cutter 108 pairs of silicon chips to clean, and this process can produce a large amount of nitrogenous effluent.And descaling bath 105 is made up of hydrofluoric acid and hydrochloric acid, silicon chip surface silicon dioxide and metal ion are removed in its effect.3rd rinse bath 106 can not be nitrogenous when cleaning silicon chip.If the process that nitrogenous effluent does not obtain, will polluted water resources.Because the processing cost of nitrogenous effluent is relatively high, the production cost of cell piece can be improve.In existing wet etching equipment (RENA), outside deionized water is first supplemented to the 3rd rinse bath the 106, three rinse bath 106 and exceedes after predetermined fluid level all flow to the first rinse bath 102 and discharge, and the nitrogenous effluent of generation is more.
Therefore, provide a kind of wet etch process and device of new solar battery sheet, produce to reduce nitrogenous effluent, reduce production cost, become the major issue that those skilled in the art are urgently to be resolved hurrily.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of wet etch process and device of solar battery sheet, wet etch process and device for solving solar battery sheet of the prior art produce a large amount of nitrogenous effluent, make processing cost relatively high, improve the problem of the production cost of solar battery sheet.
For achieving the above object and other relevant objects, the invention provides a kind of wet etching apparatus of solar battery sheet, comprise place successively etching bath, the first rinse bath, alkaline bath, the second rinse bath, descaling bath and the 3rd rinse bath; The entrance of described first rinse bath and exit are equiped with the first water cutter and the second water cutter respectively; Wherein:
Described wet etching apparatus also comprises the first reservoir and the second reservoir;
Described second reservoir is connected with described 3rd rinse bath and described second water cutter respectively by connecting tube, when the liquid in described 3rd rinse bath reaches preset water level, discharge unnecessary liquid to described second reservoir, described second reservoir is described second water cutter feed flow;
Described first reservoir is connected with described first rinse bath and described etching bath respectively by connecting tube, described first rinse bath is described first water cutter feed flow, when the liquid in described first rinse bath reaches preset water level, discharge unnecessary liquid to described first reservoir, liquid in described first reservoir is used for for described etching bath moisturizing, and for the etching solution dosing of described etching bath.
Alternatively, described second reservoir comprises a floss hole, and when the liquid in described second reservoir arrives preset water level, unnecessary liquid is directly drained.
Alternatively, described first reservoir comprises a floss hole, and when the liquid in described first reservoir arrives preset water level, unnecessary liquid is directly drained.
Alternatively, the connecting tube between described first reservoir and described etching bath is provided with the pump housing and flow valve.
Alternatively, the connecting tube between described second reservoir and described second water cutter is provided with the pump housing and flow valve.
Alternatively, the liquid in described 3rd rinse bath is deionized water.
Alternatively, the etching solution in described etching bath is the mixed liquor of nitric acid and hydrofluoric acid; Pickle in described descaling bath is the mixed liquor of hydrofluoric acid and hydrochloric acid.
The present invention also provides a kind of wet etch process of solar battery sheet, comprises the following steps:
One solar battery sheet is provided, by conveyer, described solar battery sheet is passed through etching bath, the first rinse bath, alkaline bath, the second rinse bath, descaling bath and the 3rd rinse bath successively;
Wherein:
The entrance of described first rinse bath and exit are equiped with the first water cutter and the second water cutter respectively; When described solar battery sheet arrives described first rinse bath, described first water cutter and the second water cutter carry out hydro-peening to the front of described solar battery sheet and the back side respectively;
Described 3rd rinse bath is connected to the second reservoir by connecting tube, constantly deionized water is supplemented in described 3rd rinse bath, when the liquid in described 3rd rinse bath reaches preset water level, discharge unnecessary liquid to described second reservoir by connecting tube, described second reservoir is described second water cutter feed flow by connecting tube; When the liquid in described second reservoir arrives preset water level, unnecessary liquid is directly drained by the floss hole be arranged on described second reservoir;
Described first rinse bath is connected to the first reservoir by connecting tube, when the liquid in described first rinse bath reaches preset water level, discharges unnecessary liquid to described first reservoir; When the liquid in described first reservoir arrives preset water level, the floss hole that unnecessary liquid is arranged on described first reservoir is directly drained;
Described etching bath is connected to described first reservoir by connecting tube, and the liquid in described first reservoir is described etching bath moisturizing by this connecting tube, and for the etching solution dosing of described etching bath.
Alternatively, by being installed in the pump housing on the connecting tube between described first reservoir and described etching bath and flow valve controls the moisturizing speed that described first reservoir is described etching bath.
Alternatively, by being installed in the pump housing on the connecting tube between described second reservoir and described second water cutter and flow valve controls the liquid supply speed that described second reservoir is described second water cutter.
As mentioned above, the wet etch process of solar battery sheet of the present invention and device, there is following beneficial effect: the wet etching apparatus of solar battery sheet of the present invention is on the basis of original trough body structure, first rinse bath and the connecting tube of the 3rd rinse bath and the discharge unit of the first rinse bath are improved, reduce the generation of the first rinse bath nitrogenous effluent, and the waste water of the first rinse bath is utilized again.In the engraving method of solar battery sheet of the present invention, the water of the 3rd rinse bath is first disposed to the second reservoir and deposits, and the water entering the second reservoir is directly drained more than the second reservoir scheduled volume, and this part waste water is nonnitrogenous.Owing to being provided with two water cutter cleaning silicon chips above the first rinse bath, wherein the second reservoir is connected to the second water cutter, and the first water cutter uses the water in the first rinse bath.Nitrogenous in the water of the first rinse bath ejection, be not fine to Wafer Cleaning effect, and the second water cutter is the nonnitrogenous water cleaning utilizing the 3rd rinse bath to provide, such Integral cleaning effect is better, and decrease the water yield that the 3rd rinse bath flows into the first rinse bath, reduce nitrogenous effluent and produce.And the waste water that the first rinse bath exceedes predetermined fluid level discharge drains into the first reservoir again and collects, for etching bath moisturizing and when changing cell body dosing, thus nitrogenous effluent can be utilized again, further the discharge of minimizing nitrogenous effluent.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of the wet etching apparatus of the solar battery sheet of prior art.
Fig. 2 is shown as the structural representation of the wet etching apparatus of solar battery sheet of the present invention.
Element numbers explanation
101,201 etching baths
102,202 first rinse baths
103,203 alkaline baths
104,204 second rinse baths
105,205 descaling baths
106,206 the 3rd rinse baths
107,207 first water cuttves
108,208 second water cuttves
209 first reservoirs
210 second reservoirs
Embodiment
Below by way of specific instantiation, embodiments of the present invention are described, those skilled in the art the content disclosed by this specification can understand other advantages of the present invention and effect easily.The present invention can also be implemented or be applied by embodiments different in addition, and the every details in this specification also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present invention.
Refer to Fig. 2.It should be noted that, the diagram provided in the present embodiment only illustrates basic conception of the present invention in a schematic way, then only the assembly relevant with the present invention is shown in graphic but not component count, shape and size when implementing according to reality is drawn, it is actual when implementing, and the kenel of each assembly, quantity and ratio can be a kind of change arbitrarily, and its assembly layout kenel also may be more complicated.
Embodiment one
The invention provides a kind of wet etching apparatus of solar battery sheet, refer to Fig. 2, be shown as the structural representation of this device, comprise etching bath 201, first rinse bath 202, alkaline bath 203, second rinse bath 204, descaling bath 205 and the 3rd rinse bath 206 placed successively; The entrance of described first rinse bath 202 and exit are equiped with the first water cutter 207 and the second water cutter 208 respectively; Wherein:
Described wet etching apparatus also comprises the first reservoir 209 and the second reservoir 210.
Concrete, described second reservoir 210 is connected with described 3rd rinse bath 206 and described second water cutter 208 respectively by connecting tube, when the liquid in described 3rd rinse bath 206 reaches preset water level, discharge unnecessary liquid to described second reservoir 210, described second reservoir 210 is described second water cutter 208 feed flow;
Described first reservoir 209 is connected with described first rinse bath 202 and described etching bath 201 respectively by connecting tube, described first rinse bath 202 is described first water cutter 207 feed flow, when the liquid in described first rinse bath 202 reaches preset water level, discharge unnecessary liquid to described first reservoir 209, liquid in described first reservoir 209 is used for for described etching bath 201 moisturizing, and for the etching solution dosing of described etching bath 201.
Concrete, described second reservoir 210 comprises a floss hole, and when the liquid in described second reservoir 210 arrives preset water level, unnecessary liquid is directly drained.Described floss hole can be located at this preset water level place height, and when the liquid in described second reservoir 210 arrives preset water level, unnecessary liquid overflows discharge automatically by described floss hole.Described floss hole also can be located at other height of described second reservoir, and described floss hole is provided with a valve, and this valve is connected with a level sensor, and opens under the control of described level sensor or close.When the liquid in described second reservoir 210 arrives preset water level, described valve is opened under the signal function of described level sensor, drain unnecessary liquid, when the liquid in described second reservoir 210 drops to certain water level, described valve is closed under the signal function of described level sensor, makes the liquid possessing predetermined amount in described second reservoir 210.
Described first reservoir 209 also comprises a floss hole, and when the liquid in described first reservoir 210 arrives preset water level, unnecessary liquid is directly drained.Described floss hole can be located at this preset water level place height, and when the liquid in described first reservoir 209 arrives preset water level, unnecessary liquid overflows discharge automatically by described floss hole.Described floss hole also can be located at other height of described first reservoir, and described floss hole is provided with a valve, and this valve is connected with a level sensor, and opens under the control of described level sensor or close.When the liquid in described first reservoir 209 arrives preset water level, described valve is opened under the signal function of described level sensor, drain unnecessary liquid, when the liquid in described first reservoir 209 drops to certain water level, described valve is closed under the signal function of described level sensor, makes the liquid possessing predetermined amount in described first reservoir 209.
Concrete, the connecting tube between described first reservoir 209 and described etching bath 201 is provided with the pump housing and flow valve, for controlling the moisturizing speed that described first reservoir 209 is described etching bath 201.
Connecting tube between described second reservoir 210 and described second water cutter 208 is also provided with the pump housing and flow valve, for controlling the liquid supply speed that described second reservoir 210 is described second water cutter 208.
Concrete, liquid in described 3rd rinse bath 206 is deionized water, by outside feeding mechanism (as deionized water pipeline), the deionized water that continuous supply is new, when the liquid in described 3rd rinse bath 206 reaches preset water level, discharge unnecessary liquid to described second reservoir 210, described second reservoir 210 is described second water cutter 208 feed flow, thus the water making described second water cutter 208 spray is nonnitrogenous, make the cleaning performance of silicon chip better, meanwhile, flow into the discharge reduction of described first rinse bath 202, decrease the generation of nitrogenous effluent.
Concrete, the etching solution in described etching bath 201 is the mixed liquor of nitric acid and hydrofluoric acid, and silicon chip is soaked in described etching bath 201, can remove the mechanical damage layer of silicon chip surface and form matte.Described first water cutter 207 and the second water cutter 208 are installed on entrance and the exit of described first rinse bath 202 respectively, when silicon chip arrives described first rinse bath 202 place by transmission device, described first water cutter 207 and the second water cutter 208 utilize the water in described first rinse bath 202 and the second reservoir 210 to clean the front of silicon chip and the back side respectively.Pickle in described descaling bath 205 is the mixed liquor of hydrofluoric acid and hydrochloric acid, and silicon chip surface silicon dioxide and metal ion are removed in effect.
The wet etching apparatus of solar battery sheet of the present invention is on the basis of original trough body structure, first rinse bath and the connecting tube of the 3rd rinse bath and the discharge unit of the first rinse bath are improved, the water of described 3rd rinse bath only has part to be utilized by described first rinse bath, thus decrease the generation of the first rinse bath nitrogenous effluent, and improve the cleaning performance of silicon chip, simultaneously, again can utilize the waste water of the first rinse bath, the generation of further minimizing nitrogenous effluent, thus the production cost reducing solar battery sheet.
Embodiment two
The present invention also provides a kind of wet etch process of solar battery sheet, comprises the following steps:
First provide a solar battery sheet, in the present embodiment, described solar battery sheet is for silicon chip.
Then by conveyer, described solar battery sheet is passed through etching bath 201, first rinse bath 202, alkaline bath 203, second rinse bath 204, descaling bath 205 and the 3rd rinse bath 206 successively;
Wherein:
The entrance of described first rinse bath 202 and exit are equiped with the first water cutter 207 and the second water cutter 208 respectively; When described solar battery sheet arrives described first rinse bath 202, described first water cutter and the second water cutter carry out hydro-peening to the front of described solar battery sheet and the back side respectively;
Described 3rd rinse bath 206 is connected to the second reservoir 210 by connecting tube, constantly deionized water is supplemented in described 3rd rinse bath 206, when the liquid in described 3rd rinse bath 206 reaches preset water level, discharge unnecessary liquid to described second reservoir 210 by connecting tube, described second reservoir 210 is described second water cutter 208 feed flow by connecting tube; When the liquid in described second reservoir 210 arrives preset water level, unnecessary liquid is directly drained by the floss hole be arranged on described second reservoir 210;
Described first rinse bath 202 is connected to the first reservoir 209 by connecting tube, when the liquid in described first rinse bath 202 reaches preset water level, discharges unnecessary liquid to described first reservoir 209; When the liquid in described first reservoir 209 arrives preset water level, the floss hole that unnecessary liquid is arranged on described first reservoir 209 is directly drained.
Described etching bath 201 is connected to described first reservoir 209 by connecting tube, and the liquid in described first reservoir 209 is described etching bath 201 moisturizing by this connecting tube, and for the etching solution dosing of described etching bath.
Concrete, described conveyer can be existing roller type or hanging connecting gear.
Concrete, by being installed in the pump housing on the connecting tube between described first reservoir 209 and described etching bath 201 and flow valve controls the moisturizing speed that described first reservoir is described etching bath.
By being installed in the pump housing on the connecting tube between described second reservoir 210 and described second water cutter 208 and flow valve controls the liquid supply speed that described second reservoir 210 is described second water cutter 208.
In the engraving method of solar battery sheet of the present invention, the water of the 3rd rinse bath is first disposed to the second reservoir and deposits, and the water entering the second reservoir is directly drained more than the second reservoir scheduled volume, and this part waste water is nonnitrogenous.Owing to being provided with two water cutter cleaning silicon chips above the first rinse bath, wherein the second reservoir is connected to the second water cutter, and the first water cutter uses the water in the first rinse bath.Nitrogenous in the water of the first rinse bath ejection, be not fine to Wafer Cleaning effect, and the second water cutter is the nonnitrogenous water cleaning utilizing the 3rd rinse bath to provide, such Integral cleaning effect is better, and decrease the water yield that the 3rd rinse bath flows into the first rinse bath, reduce nitrogenous effluent and produce.And the waste water that the first rinse bath exceedes predetermined fluid level discharge drains into the first reservoir again and collects, for etching bath moisturizing and when changing cell body dosing, thus nitrogenous effluent can be utilized again, further the discharge of minimizing nitrogenous effluent.
In sum, the wet etching apparatus of solar battery sheet of the present invention is on the basis of original trough body structure, first rinse bath and the connecting tube of the 3rd rinse bath and the discharge unit of the first rinse bath are improved, reduce the generation of the first rinse bath nitrogenous effluent, and the waste water of the first rinse bath is utilized again.In the engraving method of solar battery sheet of the present invention, the water of the 3rd rinse bath is first disposed to the second reservoir and deposits, and the water entering the second reservoir is directly drained more than the second reservoir scheduled volume, and this part waste water is nonnitrogenous.Owing to being provided with two water cutter cleaning silicon chips above the first rinse bath, wherein the second reservoir is connected to the second water cutter, and the first water cutter uses the water in the first rinse bath.Nitrogenous in the water of the first rinse bath ejection, be not fine to Wafer Cleaning effect, and the second water cutter is the nonnitrogenous water cleaning utilizing the 3rd rinse bath to provide, such Integral cleaning effect is better, and decrease the water yield that the 3rd rinse bath flows into the first rinse bath, reduce nitrogenous effluent and produce.And the waste water that the first rinse bath exceedes predetermined fluid level discharge drains into the first reservoir again and collects, for etching bath moisturizing and when changing cell body dosing, thus nitrogenous effluent can be utilized again, further the discharge of minimizing nitrogenous effluent.So the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (10)
1. a wet etching apparatus for solar battery sheet, comprise place successively etching bath, the first rinse bath, alkaline bath, the second rinse bath, descaling bath and the 3rd rinse bath; The entrance of described first rinse bath and exit are equiped with the first water cutter and the second water cutter respectively; It is characterized in that:
Described wet etching apparatus also comprises the first reservoir and the second reservoir;
Described second reservoir is connected with described 3rd rinse bath and described second water cutter respectively by connecting tube, when the liquid in described 3rd rinse bath reaches preset water level, discharge unnecessary liquid to described second reservoir, described second reservoir is described second water cutter feed flow;
Described first reservoir is connected with described first rinse bath and described etching bath respectively by connecting tube, described first rinse bath is described first water cutter feed flow, when the liquid in described first rinse bath reaches preset water level, discharge unnecessary liquid to described first reservoir, liquid in described first reservoir is used for for described etching bath moisturizing, and for the etching solution dosing of described etching bath.
2. the wet etching apparatus of solar battery sheet according to claim 1, is characterized in that: described second reservoir comprises a floss hole, and when the liquid in described second reservoir arrives preset water level, unnecessary liquid is directly drained.
3. the wet etching apparatus of solar battery sheet according to claim 1, is characterized in that: described first reservoir comprises a floss hole, and when the liquid in described first reservoir arrives preset water level, unnecessary liquid is directly drained.
4. the wet etching apparatus of solar battery sheet according to claim 1, is characterized in that: the connecting tube between described first reservoir and described etching bath is provided with the pump housing and flow valve.
5. the wet etching apparatus of solar battery sheet according to claim 1, is characterized in that: the connecting tube between described second reservoir and described second water cutter is provided with the pump housing and flow valve.
6. the wet etching apparatus of solar battery sheet according to claim 1, is characterized in that: the liquid in described 3rd rinse bath is deionized water.
7. the wet etching apparatus of solar battery sheet according to claim 1, is characterized in that: the etching solution in described etching bath is the mixed liquor of nitric acid and hydrofluoric acid; Pickle in described descaling bath is the mixed liquor of hydrofluoric acid and hydrochloric acid.
8. a wet etch process for solar battery sheet, is characterized in that, comprises the following steps:
One solar battery sheet is provided, by conveyer, described solar battery sheet is passed through etching bath, the first rinse bath, alkaline bath, the second rinse bath, descaling bath and the 3rd rinse bath successively;
Wherein:
The entrance of described first rinse bath and exit are equiped with the first water cutter and the second water cutter respectively; When described solar battery sheet arrives described first rinse bath, described first water cutter and the second water cutter carry out hydro-peening to the front of described solar battery sheet and the back side respectively;
Described 3rd rinse bath is connected to the second reservoir by connecting tube, constantly deionized water is supplemented in described 3rd rinse bath, when the liquid in described 3rd rinse bath reaches preset water level, discharge unnecessary liquid to described second reservoir by connecting tube, described second reservoir is described second water cutter feed flow by connecting tube; When the liquid in described second reservoir arrives preset water level, unnecessary liquid is directly drained by the floss hole be arranged on described second reservoir;
Described first rinse bath is connected to the first reservoir by connecting tube, when the liquid in described first rinse bath reaches preset water level, discharges unnecessary liquid to described first reservoir; When the liquid in described first reservoir arrives preset water level, the floss hole that unnecessary liquid is arranged on described first reservoir is directly drained;
Described etching bath is connected to described first reservoir by connecting tube, and the liquid in described first reservoir is described etching bath moisturizing by this connecting tube, and for the etching solution dosing of described etching bath.
9. the wet etch process of solar battery sheet according to claim 8, is characterized in that: by being installed in the pump housing on the connecting tube between described first reservoir and described etching bath and flow valve controls the moisturizing speed that described first reservoir is described etching bath.
10. the wet etch process of solar battery sheet according to claim 8, is characterized in that: by being installed in the pump housing on the connecting tube between described second reservoir and described second water cutter and flow valve controls the liquid supply speed that described second reservoir is described second water cutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410699196.8A CN104409396B (en) | 2014-11-26 | 2014-11-26 | The wet etch process and device of a kind of solar battery sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410699196.8A CN104409396B (en) | 2014-11-26 | 2014-11-26 | The wet etch process and device of a kind of solar battery sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104409396A true CN104409396A (en) | 2015-03-11 |
| CN104409396B CN104409396B (en) | 2017-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410699196.8A Expired - Fee Related CN104409396B (en) | 2014-11-26 | 2014-11-26 | The wet etch process and device of a kind of solar battery sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104409396B (en) |
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| CN105932108A (en) * | 2016-06-13 | 2016-09-07 | 中国科学院物理研究所 | Chain crystalline silicon texturing equipment and preparation method |
| CN107607494A (en) * | 2017-07-19 | 2018-01-19 | 晶科能源有限公司 | A kind of crystalline state silicon chip metals content impurity detection method |
| CN107597687A (en) * | 2017-10-26 | 2018-01-19 | 武汉华星光电技术有限公司 | The water knife cleaning device and method of a kind of wet etcher |
| CN107815687A (en) * | 2017-10-17 | 2018-03-20 | 江苏沪运制版有限公司 | Copper chloride corrosive liquid regenerating unit |
| CN107946216A (en) * | 2017-11-29 | 2018-04-20 | 乐山新天源太阳能科技有限公司 | Silicon chip wet-etching technique |
| CN107958858A (en) * | 2017-11-29 | 2018-04-24 | 乐山新天源太阳能科技有限公司 | Silicon chip wet etching device |
| CN108470693A (en) * | 2018-03-15 | 2018-08-31 | 福建省福联集成电路有限公司 | A kind of Etaching device control method and system |
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| CN105932108A (en) * | 2016-06-13 | 2016-09-07 | 中国科学院物理研究所 | Chain crystalline silicon texturing equipment and preparation method |
| CN107607494A (en) * | 2017-07-19 | 2018-01-19 | 晶科能源有限公司 | A kind of crystalline state silicon chip metals content impurity detection method |
| CN107815687A (en) * | 2017-10-17 | 2018-03-20 | 江苏沪运制版有限公司 | Copper chloride corrosive liquid regenerating unit |
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| CN107958858A (en) * | 2017-11-29 | 2018-04-24 | 乐山新天源太阳能科技有限公司 | Silicon chip wet etching device |
| CN108470693A (en) * | 2018-03-15 | 2018-08-31 | 福建省福联集成电路有限公司 | A kind of Etaching device control method and system |
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