CN104400171A - Reflow soldering system - Google Patents
Reflow soldering system Download PDFInfo
- Publication number
- CN104400171A CN104400171A CN201410572301.1A CN201410572301A CN104400171A CN 104400171 A CN104400171 A CN 104400171A CN 201410572301 A CN201410572301 A CN 201410572301A CN 104400171 A CN104400171 A CN 104400171A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- control centre
- brazier
- pcb
- reflow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Abstract
The invention discloses a reflow soldering system, comprising an intelligent reflow soldering system and a plate dividing device, wherein the plate dividing device is arranged at an outlet of a soldering furnace, and comprises two tracks, a PCB (printed circuit board) bracket and a direction adjuster; the two tracks are arranged in parallel; the PCB bracket is arranged between a transmission device and the two tracks; the direction adjuster is arranged below the PCB bracket, and is used for adjusting the direction of the PCB bracket; one track is used for conveying a faulted PCB; the other track is used for conveying a faultless PCB. According to the system disclosed by the invention, the detected faulted PCB can be independently distinguished, so as to facilitate maintenance of maintenance personnel; the faulted PCB can be taken out without data observation of special operation personnel; therefore, the working efficiency is improved, and manpower resources are saved.
Description
Technical field
The invention belongs to LED application, be specifically related to a kind of reflow soldering system.
Background technology
Reflow Soldering is each electronics firm or the requisite equipment of foundries as the nucleus equipment in electronics processing, the domestic design at solder reflow device and process technology have also been obtained significant progress, at present, there is dissimilar welding equipment in most of manufacturing enterprise, but mostly do desirable not enough in welding procedure, Key Points of Welding Technology can not be grasped completely, cannot Optimization Technology; This phenomenon is the technical development of impact China as world's machining center.
At SMT(surface mounting technology) in application, operational solder technology is mostly reflow soldering, and also has the technology such as such as infrared, hot blast, laser, incandescent light, hot pressing in reflow soldering.The assembling quality of PCBA, is not merely determined by welding procedure, even seem Welding Problems as soldered ball and so on, is also all synthesized by design, material, equipment and technique (comprising each technique process before welding); So Technology Integration application and management are only the basic way ensureing good assembling quality.
In real work, due to the defect of welding equipment itself, even if SMT staff to welding procedure grasp very skilled, also the welding quality ensureing all products is difficult to, this just needs to be equipped with testing staff at welding production line, by observing find problem, and some problem is difficult to just can find by observing, these problems are seldom fed back in time, be difficult to the qualification rate ensureing product, add cost, reduce operating efficiency simultaneously, therefore, types of applications and researcher also should learn and study the impact of other factors further, can better process all packing problems.
Application number is 201310143926.1, and the applying date is a kind of intelligent reflow soldering system disclosed on 04 24th, 2013, comprises control centre, temperature control equipment, warning device, checkout gear, transmission device, brazier, described temperature control equipment, checkout gear are placed in brazier, and mission part is placed in brazier, and warning device is placed in outside brazier, control centre controls actuator movement, transmission device drives the pcb board of paster to enter temperature control equipment by brazier entrance, the pcb board of described temperature control equipment to paster welds, then, the pcb board that detection module butt welding connects detects, after detection module detects, pcb board leaves brazier outlet, testing result is sent to control centre by checkout gear simultaneously, this system is used for electronic equipment factory, automatically detect after achieving PCB welding and feed back the function detecting data, improve accuracy of detection, add qualification rate and the operating efficiency of product, save human and material resources.
Above-mentioned patent, by adding checkout gear, automatically detects after achieving PCB welding and feeds back the function detecting data, improve accuracy of detection, add qualification rate and the operating efficiency of product, saved human and material resources.
But, after above-mentioned patent PCB detects, only send testing result signal to control centre, therefore, artificial Real Time Observation is just needed whether to have bad pcb board to occur, then, by manually being taken out by bad pcb board, if people does not observe, bad pcb board is mixed in non-defective unit by very large possibility, like this, in use, the problem of reprocessing may be there is, have impact on the duration of finished product.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of reflow soldering system, solves the fault PCB detected in prior art and may be mixed in non-defective unit and cause follow-up reprocessing, the problem of losing time.
The present invention is for solving the problems of the technologies described above by the following technical solutions:
A kind of reflow soldering system, comprises control centre, temperature control equipment, warning device, checkout gear, transmission device, brazier, described control centre is connected with temperature control equipment, warning device, checkout gear, transmission device respectively, temperature control equipment, checkout gear are placed in brazier, and mission part is placed in brazier, and warning device is placed in outside brazier, described detection module is arranged on the port of export of brazier, control centre controls actuator movement, transmission device drives the pcb board of paster to enter temperature control equipment by brazier entrance, the pcb board of described temperature control equipment to paster welds, then, the pcb board that detection module butt welding connects detects, after detection module detects, pcb board leaves brazier outlet, testing result is sent to control centre by checkout gear simultaneously, described brazier exit arranges board separating device, described board separating device comprises two tracks be arranged in parallel, a pcb board support, a direction regulator, wherein, pcb board Bracket setting is between transmission device and two tracks, direction regulator is arranged at the below of pcb board support, for regulating the direction of pcb board support, a track is for transmitting fault pcb board, another track is for transmitting fault-free pcb board, described direction regulator is connected with control centre, when checkout gear detects that pcb board has a fault, control centre controls direction regulator by above pcb board bracket adjustment to the track of transmission fault pcb board, otherwise, above pcb board bracket adjustment to the track of transmission fault-free pcb board, pcb board is transmitted by corresponding track.
Described board separating device also comprises infrared sensor, and described infrared sensor is arranged on pcb board support, and whether arrive pcb board support for detecting pcb board, infrared sensor is sent to control centre after pcb board arriving signal being detected.
Described direction regulator comprises motor, pulley, described motorized driver pulley drives pcb board support motion, described control centre sends control signal according to the arriving signal of pcb board and the testing result of pcb board, controls motorized driver pulley and moves between two tracks.
Rosin joint detecting sensor is set in described checkout gear, connects tin detecting sensor, Pad off detecting sensor; The signal detected is sent to control centre by the sensor in checkout gear, and control centre sends testing result signal according to the signal received.
Described temperature control equipment arranges three warm areas, each warm area set temperature sensor; Temperature sensor detects the temperature of each warm area, and respective temperature is sent to control centre, and control centre, according to each warm area sensor signal received, controls the work of temperature control equipment in three warm areas respectively.
Described warning device comprises buzzer, LED.
Compared with prior art, the present invention has following beneficial effect:
1, brazier exit arranges board separating device, board separating device comprises two tracks be arranged in parallel, pcb board support, a direction regulator, an another parallel orbit one is for transmitting fault pcb board, another is for transmitting fault-free pcb board, the fault pcb board detected can be branched away single area, so that maintenance personal keeps in repair, do not need special operating personnel's observed data to take out fault pcb board, improve operating efficiency, save human resources.
2, board separating device also comprises infrared sensor, described infrared sensor is arranged on pcb board support, pcb board support whether is arrived for detecting pcb board, after infrared sensor detects pcb board arriving signal, be sent to control centre, pcb board is arrived on support, and control centre controls support action again, avoid misoperation, improve the reliability of equipment.
Accompanying drawing explanation
Fig. 1 is system architecture diagram of the present invention.
Fig. 2 is board separating device structured flowchart of the present invention.
Wherein, being designated in figure: 1-intelligence reflow soldering system; 2-board separating device; 3-first track; 4-second track; 5-PCB support; 6-infrared sensor.
Detailed description of the invention
Below in conjunction with accompanying drawing, the course of work of the present invention is described further.
As shown in Figure 1 and Figure 2, a kind of reflow soldering system, comprises intelligent reflow soldering system 1, and described intelligent reflow soldering system 1 comprises control centre, temperature control equipment, warning device, checkout gear, transmission device, brazier, described control centre is connected with temperature control equipment, warning device, checkout gear, transmission device respectively, temperature control equipment, checkout gear are placed in brazier, and mission part is placed in brazier, and warning device is placed in outside brazier, described detection module is arranged on the port of export of brazier, control centre controls actuator movement, transmission device drives the pcb board of paster to enter temperature control equipment by brazier entrance, the pcb board of described temperature control equipment to paster welds, then, the pcb board that detection module butt welding connects detects, after detection module detects, pcb board leaves brazier outlet, testing result is sent to control centre by checkout gear simultaneously, described brazier exit arranges board separating device 2, described board separating device 2 comprises two tracks be arranged in parallel, a pcb board support 5, a direction regulator, two parallel tracks are respectively the first track 3, second track 4, wherein, pcb board props up, 5 are arranged between transmission device and two tracks, direction regulator is arranged at the below of pcb board support 5, for regulating the direction of pcb board support 5, first track 3 is for transmitting fault pcb board, second track 4 is for transmitting fault-free pcb board, described direction regulator is connected with control centre, when checkout gear detects that pcb board has a fault, control centre controls direction regulator by above pcb board bracket adjustment to the track of transmission fault pcb board, otherwise, above pcb board bracket adjustment to the track of transmission fault-free pcb board, pcb board is transmitted by corresponding track.
Brazier exit arranges board separating device, board separating device comprises two tracks be arranged in parallel, pcb board support, a direction regulator, an another parallel orbit one is for transmitting fault pcb board, another is for transmitting fault-free pcb board, the fault pcb board detected can be branched away single area, so that maintenance personal keeps in repair, do not need special operating personnel's observed data to take out fault pcb board, improve operating efficiency, save human resources.
Described board separating device also comprises infrared sensor 6, and described infrared sensor 6 is arranged on pcb board support 5, and whether arrive pcb board support 5 for detecting pcb board, infrared sensor 6 is sent to control centre after pcb board arriving signal being detected.
Described direction regulator comprises motor, pulley, described motorized driver pulley drives pcb board support 5 to move, described control centre sends control signal according to the arriving signal of pcb board and the testing result of pcb board, controls motorized driver pulley and moves between two tracks.
Board separating device also comprises infrared sensor, described infrared sensor is arranged on pcb board support, pcb board support whether is arrived for detecting pcb board, after infrared sensor detects pcb board arriving signal, be sent to control centre, pcb board is arrived on support, and control centre controls support action again, avoid misoperation, improve the reliability of equipment.
Rosin joint detecting sensor is set in described checkout gear, connects tin detecting sensor, Pad off detecting sensor; The signal detected is sent to control centre by the sensor in checkout gear, and control centre sends testing result signal according to the signal received.
Described temperature control equipment arranges three warm areas, each warm area set temperature sensor; Temperature sensor detects the temperature of each warm area, and respective temperature is sent to control centre, and control centre, according to each warm area sensor signal received, controls the work of temperature control equipment in three warm areas respectively.
Those skilled in the art of the present technique are understandable that, the step in the various operations discussed in the present invention, method, flow process, measure, scheme can be replaced, change, combine or delete.Further, there is various operations, method, other steps in flow process, measure, the scheme discussed in the present invention also can be replaced, change, reset, decompose, combine or delete.Further, of the prior art have also can be replaced with the step in operation various disclosed in the present invention, method, flow process, measure, scheme, changed, reset, decomposed, combined or deleted.
The above is only some embodiments of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (6)
1. a reflow soldering system, comprises control centre, temperature control equipment, warning device, checkout gear, transmission device, brazier, described control centre is connected with temperature control equipment, warning device, checkout gear, transmission device respectively, temperature control equipment, checkout gear are placed in brazier, and mission part is placed in brazier, and warning device is placed in outside brazier, described detection module is arranged on the port of export of brazier, control centre controls actuator movement, transmission device drives the pcb board of paster to enter temperature control equipment by brazier entrance, the pcb board of described temperature control equipment to paster welds, then, the pcb board that detection module butt welding connects detects, after detection module detects, pcb board leaves brazier outlet, testing result is sent to control centre by checkout gear simultaneously, it is characterized in that: described brazier exit arranges board separating device, described board separating device comprises two tracks be arranged in parallel, a pcb board support, a direction regulator, wherein, pcb board Bracket setting is between transmission device and two tracks, direction regulator is arranged at the below of pcb board support, for regulating the direction of pcb board support, a track is for transmitting fault pcb board, another track is for transmitting fault-free pcb board, described direction regulator is connected with control centre, when checkout gear detects that pcb board has a fault, control centre controls direction regulator by above pcb board bracket adjustment to the track of transmission fault pcb board, otherwise, above pcb board bracket adjustment to the track of transmission fault-free pcb board, pcb board is transmitted by corresponding track.
2. reflow soldering system according to claim 1, it is characterized in that: described board separating device also comprises infrared sensor, described infrared sensor is arranged on pcb board support, pcb board support whether is arrived for detecting pcb board, infrared sensor is sent to control centre after pcb board arriving signal being detected.
3. reflow soldering system according to claim 2, it is characterized in that: described direction regulator comprises motor, pulley, described motorized driver pulley drives pcb board support motion, described control centre sends control signal according to the arriving signal of pcb board and the testing result of pcb board, controls motorized driver pulley and moves between two tracks.
4. reflow soldering system according to claim 1, is characterized in that: arrange rosin joint detecting sensor in described checkout gear, connect tin detecting sensor, Pad off detecting sensor; The signal detected is sent to control centre by the sensor in checkout gear, and control centre sends testing result signal according to the signal received.
5. reflow soldering system according to claim 1, is characterized in that: described temperature control equipment arranges three warm areas, each warm area set temperature sensor; Temperature sensor detects the temperature of each warm area, and respective temperature is sent to control centre, and control centre, according to each warm area sensor signal received, controls the work of temperature control equipment in three warm areas respectively.
6. reflow soldering system according to claim 1, is characterized in that: described warning device comprises buzzer, LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410572301.1A CN104400171A (en) | 2014-10-24 | 2014-10-24 | Reflow soldering system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410572301.1A CN104400171A (en) | 2014-10-24 | 2014-10-24 | Reflow soldering system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104400171A true CN104400171A (en) | 2015-03-11 |
Family
ID=52637871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410572301.1A Pending CN104400171A (en) | 2014-10-24 | 2014-10-24 | Reflow soldering system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104400171A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5810988A (en) * | 1994-09-19 | 1998-09-22 | Board Of Regents, University Of Texas System | Apparatus and method for generation of microspheres of metals and other materials |
| CN201895159U (en) * | 2010-11-26 | 2011-07-13 | 深圳市劲拓自动化设备股份有限公司 | Double-guide rail transmission structure for reflow soldering and double-guide rail reflow soldering machine |
| CN103157866A (en) * | 2011-12-11 | 2013-06-19 | 飞秒光电科技(西安)有限公司 | Welding process control system of selective crest welder |
| CN103231139A (en) * | 2013-04-24 | 2013-08-07 | 无锡市崇安区科技创业服务中心 | Intelligent reflow soldering system |
| CN103861818A (en) * | 2012-12-14 | 2014-06-18 | 天津承宝自动化设备有限公司 | Sorting machine for surface appearances of clamping plates |
| JP2014123660A (en) * | 2012-12-21 | 2014-07-03 | Senju Metal Ind Co Ltd | Conveyance processing system |
| CN203791227U (en) * | 2014-04-22 | 2014-08-27 | 宁波亚路轴业有限公司 | Automatic detecting and sorting device |
| CN203849371U (en) * | 2014-04-08 | 2014-09-24 | 深圳市得鑫自动化设备有限公司 | Printed circuit board testing device |
-
2014
- 2014-10-24 CN CN201410572301.1A patent/CN104400171A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5810988A (en) * | 1994-09-19 | 1998-09-22 | Board Of Regents, University Of Texas System | Apparatus and method for generation of microspheres of metals and other materials |
| CN201895159U (en) * | 2010-11-26 | 2011-07-13 | 深圳市劲拓自动化设备股份有限公司 | Double-guide rail transmission structure for reflow soldering and double-guide rail reflow soldering machine |
| CN103157866A (en) * | 2011-12-11 | 2013-06-19 | 飞秒光电科技(西安)有限公司 | Welding process control system of selective crest welder |
| CN103861818A (en) * | 2012-12-14 | 2014-06-18 | 天津承宝自动化设备有限公司 | Sorting machine for surface appearances of clamping plates |
| JP2014123660A (en) * | 2012-12-21 | 2014-07-03 | Senju Metal Ind Co Ltd | Conveyance processing system |
| CN103231139A (en) * | 2013-04-24 | 2013-08-07 | 无锡市崇安区科技创业服务中心 | Intelligent reflow soldering system |
| CN203849371U (en) * | 2014-04-08 | 2014-09-24 | 深圳市得鑫自动化设备有限公司 | Printed circuit board testing device |
| CN203791227U (en) * | 2014-04-22 | 2014-08-27 | 宁波亚路轴业有限公司 | Automatic detecting and sorting device |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150311 |
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| RJ01 | Rejection of invention patent application after publication |