CN104219884A - Connection structure and connection method for substrate and copper bar - Google Patents
Connection structure and connection method for substrate and copper bar Download PDFInfo
- Publication number
- CN104219884A CN104219884A CN201310214996.1A CN201310214996A CN104219884A CN 104219884 A CN104219884 A CN 104219884A CN 201310214996 A CN201310214996 A CN 201310214996A CN 104219884 A CN104219884 A CN 104219884A
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- China
- Prior art keywords
- copper bar
- substrate
- tin
- perforation
- tin pad
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Abstract
The invention relates to a connection structure and a connection method for a substrate and a copper bar. The connection structure comprises a substrate, a plurality of tin gaskets, at least one copper bar and at least one locking element, wherein the substrate is provided with an upper surface and at least one first punching hole, the plurality of tin gaskets are arranged on the upper surface, a plurality of trenches are formed among the plurality of tin gasket, the at least one copper bar is stacked on the plurality of tin gaskets, the at least one copper bar is provided with at least one second punching hole corresponding to the at least one first punching hole, the at least one locking element passes through the at least one first punching hole and the at least one second punching hole, and the at least one copper bar is in close contact with the plurality of tin gaskets. The invention also provides a connection method for the substrate and the copper bar. The copper bar extrudes the plurality of tin gaskets to make the plurality of tin gaskets deformed, and the copper bar is made to be in close contact with the plurality of tin gaskets, so that favorable contact is achieved, a contact surface of the copper bar and the plurality of tin gaskets is not liable to oxidize, and the conductivity of the substrate and the copper bar is improved.
Description
Technical field
The present invention relates to connected structure and the joint method thereof of a kind of substrate and copper bar, particularly a kind of connected structure and joint method thereof increasing the contact area of tin pad and copper bar.
Background technology
Along with the development of science and technology, the technology of printed circuit board (PCB) (Printed circuit board, or abbreviation PCB) is also ripe day by day.Printed circuit board (PCB) is important electronic component, is used as the supporter of electronic component.In addition, printed circuit board (PCB) is also the supplier of electronic devices and components connection.Nearly all electronic equipment all needs the support of printed circuit board (PCB), and therefore printed circuit board (PCB) is the product that in global electronic component products, occupation rate of market is very high.It can thus be appreciated that printed circuit board (PCB) is the staple product of electronics market.
In order to promote the conductance (that is reducing the resistance value of printed circuit board (PCB)) of printed circuit board (PCB), copper bar is often arranged on printed circuit board (PCB).By this, the conductance of printed circuit board (PCB) can significantly promote.But due to the tolerance that copper bar manufactures, copper bar cannot fit in printed circuit board (PCB) completely, causes electrical efficiency to reduce.In addition, copper bar can cause its surface oxidation because of hot and humid environment, thus reduces the conducting power of electric current.Therefore, how making printed circuit board (PCB) and copper bar have good contact, and copper bar can also be avoided to be oxidized, is the important topic that industry must solve.
Summary of the invention
Technical problem to be solved by this invention is to provide connected structure and the joint method thereof of a kind of substrate and copper bar, cannot fit in improve copper bar in prior art printed circuit board (PCB) and copper bar can cause its surface oxidation problem because of hot and humid environment completely.
To achieve these goals, the invention provides the connected structure of a kind of substrate and copper bar, wherein, comprise:
One substrate, has a upper surface and at least one first perforation;
Multiple tin pad, is arranged at this upper surface, forms multiple groove between the plurality of tin pad;
At least one copper bar, is stacked and placed on the plurality of tin pad, this at least one copper bar have to should at least one first perforation at least one second perforation; And
At least one locking part, wears this at least one first perforation and this at least one second perforation, and makes this at least one copper bar fit tightly the plurality of tin pad.
Above-mentioned substrate and the connected structure of copper bar, wherein, the plurality of groove is multiple grid-like grooves.
Above-mentioned substrate and the connected structure of copper bar, wherein, the plurality of groove is respectively around the plurality of tin pad.
Above-mentioned substrate and the connected structure of copper bar, wherein, this at least one locking part is screw.
In order to realize above-mentioned purpose better, present invention also offers the joint method of a kind of substrate and copper bar, wherein, comprising the steps:
There is provided a substrate, this substrate has a upper surface and at least one first perforation;
Multiple tin is set and is padded on this upper surface, between the plurality of tin pad, form multiple groove;
Stacked at least one copper bar on the plurality of tin pad, wherein this at least one copper bar have to should at least one first perforation at least one second perforation;
Wear at least one locking part in this at least one first perforation and this at least one second perforation, to make this at least one copper bar extrude the plurality of tin pad, the plurality of tin pad is out of shape.
Above-mentioned substrate and the joint method of copper bar, wherein, the plurality of groove is multiple grid-like grooves.
Above-mentioned substrate and the connected structure of copper bar, wherein, the plurality of groove is respectively around the plurality of tin pad.
Above-mentioned substrate and the joint method of copper bar, wherein, the length and width of the plurality of grid-like groove are 0.5mm.
Above-mentioned substrate and the joint method of copper bar, wherein, this at least one locking part is screw.
Technique effect of the present invention is:
The connected structure of substrate of the present invention and copper bar and associated methods thereof, because copper bar extrudes multiple tin pad, cause multiple tin pad to produce deformation, copper bar and multiple tin pad fitted tightly, thus has good contact.Thus, the contact-making surface of copper bar and multiple tin pad is more not oxidizable, and can also solve because the tolerance in copper bar manufacture makes copper bar cannot fit in the problem of substrate completely in prior art, and then promotes the conductivity of substrate and copper bar.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is the explosive view of the connected structure of substrate and copper bar according to an embodiment of the invention;
Fig. 2 is the front view of Fig. 1;
Fig. 3 is the front view of the connected structure of substrate and copper bar according to an embodiment of the invention;
Fig. 4 is the schematic diagram of the joint method of substrate and copper bar according to another embodiment of the present invention.
The connected structure of 10 substrates and copper bar
12 substrates
121 upper surfaces
1212 grooves
123 first perforation
14 tin pads
16 copper bars
163 second perforation
18 locking parts
Embodiment
Below in conjunction with accompanying drawing, structural principle of the present invention and operation principle are described in detail:
Please refer to Fig. 1, Fig. 2 and Fig. 3, Fig. 1 is the explosive view of the connected structure of substrate and copper bar according to an embodiment of the invention.Fig. 2 is the front view of Fig. 1.Fig. 3 is the front view of the connected structure of substrate and copper bar according to an embodiment of the invention.
The connected structure 10 of substrate and copper bar comprises a substrate 12, multiple tin pad 14, copper bar 16 and five locking parts 18.
Substrate 12 has upper surface 121 and 5 first perforation 123.In the present embodiment, substrate 12 is such as printed circuit board (PCB), so non-ly limits the present invention with this.In the present embodiment, the quantity of the first perforation 123 is five, but not as limit.In other embodiments, the quantity of the first perforation 123 also can be one, two, three, four or be more than or equal to six.
Multiple tin pad 14 is arranged at upper surface 121, and forms multiple groove 1212 between these tin pads 14.It is noted that in the present embodiment, multiple groove 1212 is grid-like groove, but does not limit the present invention with this.In other embodiments, multiple grooves 1212 that multiple tin pad 14 is formed can be the groove of arbitrary shape, such as, be triangular groove or circular groove.In the present embodiment, the length and width of grid-like groove are 0.5mm, and that is, the region that each party's trellised groove surrounds is a square, but not as limit.
Copper bar 16 is stacked and placed on multiple tin pad 14.Copper bar 16 has 5 second perforation 163, and 5 second perforation 163 corresponding 5 first perforation 123 respectively.
Five locking parts 18 wear 5 second perforation 163 and 5 first perforation 123 respectively.Because five locking parts 18 lock copper bar 16 and substrate 12, copper bar 16 is made to extrude the multiple tin pads 14 be positioned on upper surface 121.The hardness of the multiple tin pad 14 of the hardness ratio due to copper bar 16 is large, causes multiple tin pad 14 to produce deformation, and copper bar 16 and multiple tin pad 14 are fitted tightly (as shown in Figure 3).Thus, copper bar 16 increases with the contact area of multiple tin pad 14.
In the present embodiment, because copper bar 16 extrudes multiple tin pad 14, cause multiple tin pad 14 to produce deformation, copper bar 16 and multiple tin pad 14 are fitted tightly, thus has good contact.Thus, copper bar 16 is more not oxidizable with the contact-making surface of multiple tin pad 14, and can also solve because the tolerance in copper bar 16 manufacture makes copper bar 16 cannot fit in the problem of substrate 12 completely in prior art, and then promotes the conductivity of substrate 12 and copper bar 16.
In addition, in the present embodiment, between multiple tin pad 14, form multiple groove 1212, that is multiple groove 1212 is respectively around multiple tin pad 14.That is, multiple tin pad 14 respectively separate by multiple groove 1212.Because the cohesive force that large-area tin produces easily causes the situation of surface irregularity, by this kind of set-up mode, multiple tin pad 14 is not more vulnerable to the impact of cohesive force and forms rough surface, and then makes multiple tin pad 14 can have good contact with copper bar 16.
The present invention separately provides the joint method of a kind of substrate and copper bar.Please refer to Fig. 4, Fig. 4 is the schematic diagram of the joint method of substrate and copper bar according to another embodiment of the present invention.
The joint method of substrate and copper bar comprises following steps:
S1: provide a substrate, substrate has a upper surface and at least one first perforation.In the present embodiment, substrate is such as a printed circuit board (PCB), but not as limit;
S2: arrange multiple tin and be padded on upper surface, forms multiple groove between multiple tin pad.Specifically, in the present embodiment, these grooves are multiple grid-like grooves, and so this is not used to limit the present invention.In the present embodiment, the spacing between the groove of multiple grid-like groove is 0.5mm, but not as limit.In the present embodiment, the one of multiple grid-like groove around one of them multiple tin pad, but not as limit;
S3: stacked at least one copper bar is on multiple tin pad, and wherein at least one copper bar has at least one second perforation of corresponding at least one first perforation;
S4: wear at least one locking part at least one first perforation and at least one second perforation, to make at least one copper bar extrude multiple tin pad, multiple tin pad is out of shape, increases the contact area of at least one copper bar and multiple tin pad by this.
Substrate disclosed by the invention described above one embodiment and the connected structure of copper bar and joint method thereof, because copper bar extrudes multiple tin pad, cause multiple tin pad to produce deformation, copper bar and multiple tin pad fitted tightly, thus has good contact.Thus, the contact-making surface of copper bar and multiple tin pad is more not oxidizable, and can also solve because the tolerance in copper bar manufacture makes copper bar cannot fit in the problem of substrate completely in prior art, and then promotes the conductivity of substrate and copper bar.
In addition, in the present embodiment and other embodiments of part, due to multiple tin pad respectively separate by multiple groove, and then the cohesive force avoiding large-area tin to produce causes the situation of surface irregularity.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection range that all should belong to the claim appended by the present invention.
Claims (10)
1. a connected structure for substrate and copper bar, is characterized in that, comprises:
One substrate, has a upper surface and at least one first perforation;
Multiple tin pad, is arranged at this upper surface, forms multiple groove between the plurality of tin pad;
At least one copper bar, is stacked and placed on the plurality of tin pad, this at least one copper bar have to should at least one first perforation at least one second perforation; And
At least one locking part, wears this at least one first perforation and this at least one second perforation, and makes this at least one copper bar fit tightly the plurality of tin pad.
2. the connected structure of substrate as claimed in claim 1 and copper bar, it is characterized in that, the plurality of groove is multiple grid-like grooves.
3. the connected structure of substrate as claimed in claim 3 and copper bar, it is characterized in that, the plurality of groove is respectively around the plurality of tin pad.
4. the connected structure of substrate as claimed in claim 3 and copper bar, it is characterized in that, the length and width of the plurality of grid-like groove are 0.5mm.
5. the connected structure of substrate as claimed in claim 1 and copper bar, it is characterized in that, this at least one locking part is screw.
6. a joint method for substrate and copper bar, is characterized in that, comprises the steps:
There is provided a substrate, this substrate has a upper surface and at least one first perforation;
Multiple tin is set and is padded on this upper surface, between the plurality of tin pad, form multiple groove;
Stacked at least one copper bar on the plurality of tin pad, wherein this at least one copper bar have to should at least one first perforation at least one second perforation;
Wear at least one locking part in this at least one first perforation and this at least one second perforation, to make this at least one copper bar extrude the plurality of tin pad, the plurality of tin pad is out of shape.
7. the joint method of substrate as claimed in claim 6 and copper bar, it is characterized in that, the plurality of groove is multiple grid-like grooves.
8. the connected structure of substrate as claimed in claim 7 and copper bar, it is characterized in that, the plurality of groove is respectively around the plurality of tin pad.
9. the joint method of substrate as claimed in claim 7 and copper bar, it is characterized in that, the length and width of the plurality of grid-like groove are 0.5mm.
10. the joint method of substrate as claimed in claim 6 and copper bar, it is characterized in that, this at least one locking part is screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310214996.1A CN104219884A (en) | 2013-05-31 | 2013-05-31 | Connection structure and connection method for substrate and copper bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310214996.1A CN104219884A (en) | 2013-05-31 | 2013-05-31 | Connection structure and connection method for substrate and copper bar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104219884A true CN104219884A (en) | 2014-12-17 |
Family
ID=52100899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310214996.1A Pending CN104219884A (en) | 2013-05-31 | 2013-05-31 | Connection structure and connection method for substrate and copper bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104219884A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248462A (en) * | 2019-05-08 | 2019-09-17 | 天津大学 | A kind of modular high-power linear transfer line based on stacked structure is from package platforms |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4689442A (en) * | 1985-02-18 | 1987-08-25 | O. Key Printed Wiring Co., Ltd. | Printed circuit board and method of manufacturing same |
| JPH0286187A (en) * | 1988-09-22 | 1990-03-27 | Ngk Insulators Ltd | Method of baking ceramic substrate |
| CN201424054Y (en) * | 2009-06-02 | 2010-03-17 | 朝泽实业股份有限公司 | Honeycomb board provided with fixing device |
-
2013
- 2013-05-31 CN CN201310214996.1A patent/CN104219884A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4689442A (en) * | 1985-02-18 | 1987-08-25 | O. Key Printed Wiring Co., Ltd. | Printed circuit board and method of manufacturing same |
| JPH0286187A (en) * | 1988-09-22 | 1990-03-27 | Ngk Insulators Ltd | Method of baking ceramic substrate |
| CN201424054Y (en) * | 2009-06-02 | 2010-03-17 | 朝泽实业股份有限公司 | Honeycomb board provided with fixing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248462A (en) * | 2019-05-08 | 2019-09-17 | 天津大学 | A kind of modular high-power linear transfer line based on stacked structure is from package platforms |
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