CN104165538A - Heat dissipating device - Google Patents
Heat dissipating device Download PDFInfo
- Publication number
- CN104165538A CN104165538A CN201410406702.XA CN201410406702A CN104165538A CN 104165538 A CN104165538 A CN 104165538A CN 201410406702 A CN201410406702 A CN 201410406702A CN 104165538 A CN104165538 A CN 104165538A
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- heat
- unit
- heat dissipating
- sink unit
- radiating subassembly
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Abstract
The invention provides a heat dissipating device. The heat dissipating device comprises at least one heat dissipating unit used for heat dissipation, a medium inlet unit and a medium outlet unit, wherein the medium inlet unit and the medium outlet unit are installed on the left side and the right side of the heat dissipating unit, and a refrigerant flows into and flows out of the heat dissipating unit through the medium inlet unit and the medium outlet unit. The heat dissipating unit comprises a first heat dissipating assembly and a second heat dissipating assembly which are stacked. The first heat dissipating assembly comprises a plurality of first partition plates. The second heat dissipating assembly comprises multiple second partition plates. A flow channel where the refrigerant flows is formed between every two adjacent first partition plates or every two adjacent second partition plates. The first partition plates and the second partition plates intersect in a certain shape, so that cavities where the refrigerant passes are formed. According to the heat dissipating device, due to the fact that the partition plates of the multiple heat dissipating assemblies are connected in an intersecting mode, the structure of the heat dissipating device is compact, and the heat dissipating effect of the heat dissipating device is better than that of a single-layer microchannel heat dissipating device and a multiple-layer microchannel heat dissipating device with layers not communicated.
Description
Technical field
The invention belongs to electronic radiation field, be specifically related to a kind of heat abstractor.
Background technology
The heat radiation of refrigeration system and electronic device all be unable to do without heat exchanger, along with the integrated level of electronic device and refrigeration system equipment is more and more higher and all kinds of electronic component volumes are more and more less, also more and more higher for the requirement of heat exchanger.Especially in high-frequency microwave circuit, the physical dimension that comprises unit interval, inter-module distance etc. is very little, be subject to strict restriction, for the design of heat abstractor brings very large difficulty, simultaneously, be subject to the impact of its operating frequency, high-frequency microwave assembly is more responsive compared with other assembly to temperature, so also need more high efficiency heat exchanger.
In prior art, the microchannel heat sink of individual layer can not meet the radiating requirements day by day increasing, multilayer microchannel heat sink just mechanically welds together a plurality of individual layer microchannel heat sinks, between every layer of microchannel heat sink, be not communicated with, effectively heat exchange efficiency increases very limited.
Application number is that the patent of 201410157782.X has proposed a kind of idle call micro-channel parallel flow evaporator, comprising upper and lower header and the microchannel that is connected two headers, operation principle is the input and output passage that two headers are respectively refrigeration working medium, and refrigeration working medium carries out heat exchange in microchannel.In use there is following shortcoming in the heat exchanger in this technology: 1. two thicker microchannel cold plates of header are very thin, only configures a microchannel cold plates and can cause undoubtedly the utilization on volume incomplete; 2. although this patent has been used double row flat tubular construction, can extend the flowing time of refrigeration working medium in runner, single time expand, can not be improved the heat exchange efficiency of refrigeration working medium well.
Application number is that 201310734806.9 patent has proposed a kind of multilayer micro-channel condenser, comprise header, solid plate, fin and microchannel, the centre of every two micro-channel tubes is welded with aluminium fin and forms a heat-sink unit, is processed with the rear formation of the docking port welding condenser being connected with a plurality of heat-sink units on total header.In use there is following shortcoming in the heat exchanger in this technology: although 1. this patent has been used multilayer microchannel cold plates structure, two micro-channel tubes and a fin are as a heat-sink unit, but not contact between adjacent heat-sink unit, this can cause the degree of heat radiation of each heat-sink unit differ and cause the heat radiation of element inhomogeneous; 2. the refrigeration working medium in this patent condenser vertically stays along its microchannel cold plates, causes the flowing time of refrigeration working medium in runner too short, and working medium is fully heat exchange in runner, directly causes heat exchange efficiency to decline.
Summary of the invention
The present invention carries out for addressing the above problem, and object is, by a kind of multilayer cross-current heat abstractor is provided, further to improve the efficiency of existing electronic device radiating device.
The present invention has adopted following technical scheme:
The invention provides a kind of heat abstractor, it is characterized in that, comprise: at least one heat-sink unit for dispelling the heat, heat-sink unit is used for filling refrigeration working medium, heat-sink unit comprises the first stacked radiating subassembly and the second radiating subassembly, the first radiating subassembly comprises many first dividing plates, the second radiating subassembly comprises many second partitions, article two, between adjacent the first dividing plate or second partition, be formed for allowing refrigeration working medium mobile runner therein, the intersection that is definite shape between the first dividing plate and second partition, forms the cavity that allows refrigeration working medium therefrom pass through; And be installed on the heat-sink unit left and right sides, for refrigeration working medium flow into and flow out heat-sink unit enter matter unit and pledge unit.
Heat abstractor provided by the invention, can also there is such feature: wherein, the first radiating subassembly and the second radiating subassembly also comprise: be positioned at runner both sides for refrigeration working medium, enter and flow out runner a plurality ofly enter matter mouth and a plurality of pledge mouth, enter matter mouth and pledge mouth respectively and enter matter unit and pledge unit is connected.
Heat abstractor provided by the invention, can also have such feature, also comprises: cover plate, covers the both sides up and down of heat-sink unit.
Heat abstractor provided by the invention, can also have such feature: the runner of radiating subassembly is herringbone.
Heat abstractor provided by the invention, can also have such feature: wherein, all adopt diffusion to merge solder technology and connect between the dividing plate of heat-sink unit and between heat-sink unit and cover plate.
Heat abstractor provided by the invention, can also have such feature: the hydraulic diameter scope of the runner in heat-sink unit is any one in grade and micron order.
Invention effect and effect
Heat abstractor provided by the invention, comprise the heat-sink unit that at least one is comprised of the first radiating subassembly and the second radiating subassembly, for refrigeration working medium flow into and flow out heat-sink unit enter matter unit and pledge unit, according to heat abstractor provided by the invention, in heat-sink unit, the first dividing plate of the first radiating subassembly and the second partition in the second radiating subassembly are the intersection of definite shape, the cavity that formation allows refrigeration working medium therefrom pass through, by cavity refrigeration working medium, can longitudinally in the first radiating subassembly and the second radiating subassembly, flow, the crosspoint of the first dividing plate and second partition is refrigeration working medium mobilely provides disturbance, increased heat exchange efficiency, intersection makes sinuous the spiraling of runner of heat abstractor in the present invention simultaneously, increased the length of heat transfer process, improved heat transfer effect, in addition, in heat abstractor provided by the invention, the runner of each radiating subassembly is herringbone, enter matter mouth place's runner and vertical direction angled, the runner that enters matter mouth of adjacent two radiating subassemblies is also angled, make the refrigeration working medium that enters two radiating subassemblies form convection current to a certain degree, further improve heat transfer effect.
Accompanying drawing explanation
Fig. 1 is the surface structure schematic diagram of heat abstractor in embodiments of the invention;
Fig. 2 is the explosive view of heat abstractor in embodiments of the invention;
Fig. 3 is the explosive view of heat-sink unit group in embodiments of the invention;
Fig. 4 is the plan structure schematic diagram of heat-sink unit in embodiments of the invention;
Fig. 5 is the structure enlarged drawing of heat-sink unit in Fig. 4 in embodiments of the invention;
Fig. 6 is the structural representation of the heat-sink unit group of observing along A direction in Fig. 3.
The specific embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described.
Fig. 1 is the surface structure schematic diagram of heat abstractor in the present embodiment.
As shown in Figure 1, heat abstractor 100 comprises: cover plate 1, by cover plate 1, covered the heat-sink unit group 2 of upper and lower surface, for refrigeration working medium flow into and flow out heat-sink unit enter matter unit 3 and pledge unit 4, on the cover plate 1 of heat-sink unit group 2 both sides, all can place electronic device.
Fig. 2 is the explosive view of heat abstractor in the present embodiment.
Fig. 3 is the explosive view of heat-sink unit in the present embodiment.
As shown in Figures 2 and 3, heat-sink unit group 2 in heat abstractor 100 comprises three heat-sink units 5, heat-sink unit 5 is comprised of the first radiating subassembly 51 and the second radiating subassembly 52, the first radiating subassembly 51 comprises many first dividing plates 511, between adjacent two the first dividing plates 511, be formed for the mobile runner of refrigeration working medium 512, the first radiating subassembly 51 also comprise be positioned at runner 512 both sides for refrigeration working medium, enter and flow out runner enter matter mouth 513 and pledge mouth 514, enter matter mouth 513 and pledge mouth 514 respectively with enter matter unit 3 and pledge unit 4 is connected, guarantee smooth and easy inflow and the outflow of refrigeration working medium, the structure of the second radiating subassembly 52 is identical with the structure of the first radiating subassembly 51, comprises many second partitions 521, between adjacent two second partitions 521, is formed for the mobile runner of refrigeration working medium 522.
The runner 512 of the first radiating subassembly 51 and the runner 522 of the second radiating subassembly 52 are all herringbone, enter matter mouth 513 place's runners and become 20 ° of angles with vertical direction, when the first radiating subassembly 51 and the second radiating subassembly 52 form heat-sink unit 5, adopt form staggered relatively, therefore the runner of the first radiating subassembly 51 and the second radiating subassembly 52 is the angle of 40 °, so just can make two strands of refrigeration working mediums become the angle of 40 ° to enter runner, form convection current to a certain degree, and after flow in also have identical convection current, refrigeration working medium constantly mixes in this runner replacing, heat transfer effect is higher than common individual layer heat abstractor.
Fig. 4 is the plan structure schematic diagram of heat-sink unit in the present embodiment.
Fig. 5 is the structure enlarged drawing of heat-sink unit in Fig. 4.
As shown in Figure 4 and Figure 5, the first radiating subassembly 51 takes stacked mode to be connected with the second radiating subassembly 52, the first dividing plate 511 of the first radiating subassembly 51 and the second partition 521 of the second radiating subassembly 52 are X-type cross, the cavity that formation allows refrigeration working medium therefrom pass through, runner 512 and runner 522 are because of the intersection of dividing plate, mutually overlapping, but not exclusively overlap, formed the runner 6 of sinuous spiral fashion, refrigeration working medium can arbitrarily flow between two radiating subassemblies, node 7 is the first dividing plate 511 and the crossing intersection point of second partition 521, not only can make the structure of whole heat-sink unit 5 more stable, anti-pressure ability is better, can also make refrigeration working medium when by node, produce flow-disturbing, strengthened the flow velocity of fluid, and flow-disturbing can also make the better mixed convection of fluid in the different runners of each layer, further increase heat exchange efficiency.
During practical application, can be according to actual conditions, select the heat-sink unit 5 of respective numbers to superpose, between each heat-sink unit 5, also can carry out stacked, further to increase the heat exchange length of runner.
Fig. 6 is the structural representation of the heat-sink unit of observing along A direction in Fig. 3.
As shown in Figure 6, pledge mouth position at the first radiating subassembly 51 and the second radiating subassembly 52, the first dividing plate 511 and second partition 521 are cross-linked slightly, be not X-type cross, this kind of structure is mainly in order to fix the first dividing plate 511 and second partition 521 positions, make whole system more firm, the convenient work of the dividing plate interconnection away from pledge mouth.
In the present invention, between the first dividing plate 511 and second partition 521 and cover plate 1 and heat-sink unit 2, all adopt the technology that welding is merged in diffusion to weld, diffusion is merged solder technology and is processed as newer micro-processing technology both at home and abroad, it be rely on storeroom surface to produce atom diffusion and mutually combine into the similar integral body of the fine structure of material own, can realize: 1) bound fraction does not have thermal contact resistance, the microchannel cold plates good airproof performance welding with this, withstand voltage height, can bear high pressure ratio; 2) can realize multilayer Micro Channel Architecture, number of active lanes can be hundreds and thousands of, and layout and large I regulate as required.
Heat abstractor in the present invention is mainly used in dissipation from electronic devices and traditional refrigerating industry field, when being applied to dissipation from electronic devices, the hydraulic diameter of runner is the ratio of the net sectional area of refrigeration working medium and the contact length of refrigeration working medium and solid wall surface, is 10-1000 μ m; When being applied to traditional refrigerating industry system, the hydraulic diameter of runner is 0.6mm to 3mm.
In the present invention, the cross section of the runner of radiating subassembly can be rectangle, the shape such as trapezoidal, and the angle of runner and vertical direction is not limited only to 20 °, under condition easy to process, can choose arbitrarily in the reasonable scope.
Embodiment effect and effect
The heat abstractor that the present embodiment provides, comprise the heat-sink unit that at least one is comprised of the first radiating subassembly and the second radiating subassembly, for refrigeration working medium flow into and flow out heat-sink unit enter matter unit and pledge unit, the heat abstractor providing according to the present embodiment, in heat-sink unit, the first dividing plate of the first radiating subassembly and the second partition in the second radiating subassembly are the intersection of definite shape, dividing plate between adjacent two heat-sink units also can be the intersection of definite shape, the cavity that formation allows refrigeration working medium therefrom pass through, crosspoint between dividing plate is refrigeration working medium mobilely provides disturbance, increased heat exchange efficiency, intersection makes sinuous the spiraling of runner of heat abstractor in the present embodiment simultaneously, increased the length of heat transfer process, improved heat transfer effect, in addition, in the heat abstractor that the present embodiment provides, the runner of each radiating subassembly is herringbone, enter matter mouth place's runner and vertical direction angled, the runner that enters matter mouth of adjacent two radiating subassemblies is also angled, make the refrigeration working medium that enters two radiating subassemblies form convection current to a certain degree, further improve heat transfer effect.
The invention is not restricted to the scope of the specific embodiment; to those skilled in the art; as long as various variations described claim limit and definite the spirit and scope of the present invention in; these variations are apparent, and all utilize innovation and creation that the present invention conceives all at the row of protection.
Claims (6)
1. a heat abstractor, the heat radiation for electronic device or refrigeration device, is characterized in that, comprising:
At least one heat-sink unit for dispelling the heat, described heat-sink unit is used for filling refrigeration working medium,
Described heat-sink unit comprises the first stacked radiating subassembly and the second radiating subassembly,
Described the first radiating subassembly comprises many first dividing plates, and described the second radiating subassembly comprises many second partitions, is formed for allowing described refrigeration working medium mobile runner therein between two adjacent described the first dividing plates or second partition,
The intersection that is definite shape between described the first dividing plate and described second partition, forms the cavity that allows described refrigeration working medium therefrom pass through; And
Be installed on the described heat-sink unit left and right sides, for described refrigeration working medium flow into and flow out described heat-sink unit enter matter unit and pledge unit.
2. heat abstractor according to claim 1, is characterized in that:
Wherein, described the first radiating subassembly and described the second radiating subassembly also comprise: be positioned at described runner both sides for described refrigeration working medium, enter and flow out described runner a plurality ofly enter matter mouth and a plurality of pledge mouth, described in enter matter mouth and described pledge mouth respectively and described in enter matter unit and described pledge unit is connected.
3. heat abstractor according to claim 2, is characterized in that, also comprises:
Cover plate, covers the both sides up and down of described heat-sink unit.
4. heat abstractor according to claim 1, is characterized in that:
Wherein, the described runner of described radiating subassembly is herringbone.
5. heat abstractor according to claim 1, is characterized in that:
Wherein, between the dividing plate of described heat-sink unit and between described heat-sink unit and described cover plate, all adopting diffusion to merge solder technology connects.
6. heat abstractor according to claim 1, is characterized in that:
Wherein, the hydraulic diameter scope of the described runner in described heat-sink unit is any one in grade and micron order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410406702.XA CN104165538B (en) | 2014-08-18 | 2014-08-18 | Heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410406702.XA CN104165538B (en) | 2014-08-18 | 2014-08-18 | Heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104165538A true CN104165538A (en) | 2014-11-26 |
| CN104165538B CN104165538B (en) | 2016-03-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410406702.XA Active CN104165538B (en) | 2014-08-18 | 2014-08-18 | Heat abstractor |
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| Country | Link |
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| CN (1) | CN104165538B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105526813A (en) * | 2015-12-10 | 2016-04-27 | 上海理工大学 | Microchannel heat radiator |
| CN105545455A (en) * | 2015-12-08 | 2016-05-04 | 上海理工大学 | Vehicle heat radiator device |
| CN109611807A (en) * | 2019-02-12 | 2019-04-12 | 乐清市优通软连接有限公司 | A kind of radiating piece for LED illumination lamp |
| CN109640601A (en) * | 2019-01-31 | 2019-04-16 | 英特换热设备(浙江)有限公司 | A kind of radiator cooling with medium, and the air conditioning frequency converter with the radiator, electronic equipment |
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| CN1544874A (en) * | 2003-11-14 | 2004-11-10 | 洪 张 | Counter current or cross flow plate type air heat exchanger formed by injection assembly molding |
| CN2660466Y (en) * | 2003-10-15 | 2004-12-01 | 尤晓栋 | Fin type heat exchanging modular |
| US6988534B2 (en) * | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
| JP2009068836A (en) * | 2002-08-07 | 2009-04-02 | Denso Corp | Counter-stream-mode oscillating-flow heat transport apparatus and cooling device |
| CN102313401A (en) * | 2011-10-18 | 2012-01-11 | 杭州沈氏换热器有限公司 | Microchannel heat exchanger |
| CN204007264U (en) * | 2014-08-18 | 2014-12-10 | 上海理工大学 | Heat abstractor |
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Patent Citations (6)
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| JP2009068836A (en) * | 2002-08-07 | 2009-04-02 | Denso Corp | Counter-stream-mode oscillating-flow heat transport apparatus and cooling device |
| US6988534B2 (en) * | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
| CN2660466Y (en) * | 2003-10-15 | 2004-12-01 | 尤晓栋 | Fin type heat exchanging modular |
| CN1544874A (en) * | 2003-11-14 | 2004-11-10 | 洪 张 | Counter current or cross flow plate type air heat exchanger formed by injection assembly molding |
| CN102313401A (en) * | 2011-10-18 | 2012-01-11 | 杭州沈氏换热器有限公司 | Microchannel heat exchanger |
| CN204007264U (en) * | 2014-08-18 | 2014-12-10 | 上海理工大学 | Heat abstractor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105545455A (en) * | 2015-12-08 | 2016-05-04 | 上海理工大学 | Vehicle heat radiator device |
| CN105526813A (en) * | 2015-12-10 | 2016-04-27 | 上海理工大学 | Microchannel heat radiator |
| CN109640601A (en) * | 2019-01-31 | 2019-04-16 | 英特换热设备(浙江)有限公司 | A kind of radiator cooling with medium, and the air conditioning frequency converter with the radiator, electronic equipment |
| CN109611807A (en) * | 2019-02-12 | 2019-04-12 | 乐清市优通软连接有限公司 | A kind of radiating piece for LED illumination lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104165538B (en) | 2016-03-23 |
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Address after: 200093 Shanghai military road, Yangpu District, No. 516 Co-patentee after: SHANGHAI SUNGLOW PACKAGING TECHNOLOGY CO., LTD. Patentee after: University of Shanghai for Science and Technology Address before: 200093 Shanghai military road, Yangpu District, No. 516 Co-patentee before: Shanghai Sunglow Printing Co., Ltd. Patentee before: University of Shanghai for Science and Technology |