CN104115567A - Thermally conductive and electrically insulating link between at least one electronic component and a completely or partially metal radiator - Google Patents

Thermally conductive and electrically insulating link between at least one electronic component and a completely or partially metal radiator Download PDF

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Publication number
CN104115567A
CN104115567A CN201280069727.4A CN201280069727A CN104115567A CN 104115567 A CN104115567 A CN 104115567A CN 201280069727 A CN201280069727 A CN 201280069727A CN 104115567 A CN104115567 A CN 104115567A
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CN
China
Prior art keywords
metal
radiator
printed circuit
pcb
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280069727.4A
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Chinese (zh)
Inventor
L.本达尼
M.阿斯克尔
F.德拉波特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes de Controle Moteur SAS
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Priority to CN201911165656.8A priority Critical patent/CN110891363A/en
Publication of CN104115567A publication Critical patent/CN104115567A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10075—Non-printed oscillator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1009—Electromotor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Abstract

The invention relates to a method for producing a thermally conductive and electrically insulating link between at least one electronic component (2) and a completely or partially metal radiator (5), in which the electronic component (2) and the radiator (5) form part of an assembly (1) also comprising a printed circuit (4) disposed between the electronic component (2) and the radiator (5), said printed circuit (4) comprising at least one metal layer (8, 9) and a metal insert (13). According to the method, at least one metal surface (11, 12, 15, 16, 17) is anodised and the heat from the electronic component (2) is dissipated through said surface to the radiator (5), said metal surface belonging to one of the following: the electronic component (2), the printed circuit (4) or the radiator (5).

Description

At least one electronic unit and the wholly or in part heat conduction between metal heat sink and electric insulation link
Technical field
The present invention relates to heat conduction between at least one electronic unit and radiator and the manufacture of electric insulation connecting portion.In the context of the present invention, statement " electric insulation connecting portion " it must be understood that as representing to guarantee the continuity of the signal of telecommunication and the connecting portion of their insulation." electric insulation " defines according to standard I PC TM650.
Still in the context of the present invention, when connecting portion has value and is the thermal resistance of 1.5 ℃/W to 3.5 ℃/W for the power of 10W to 20W, described connecting portion is heat conduction.
Conventionally, in order to measure the thermal resistance of printed circuit board (PCB), MOS transistor can be soldered to this printed circuit board (PCB), and electric current can be injected into this transistorized internal body diodes.The printed circuit board (PCB) specification of voltage measurement in any side of this printed circuit board (PCB) based on being announced by manufacturer provides variations in temperature.
Once the thermal resistance of known printed circuit board (PCB), can process in the same manner and comprise the assembly of printed circuit board (PCB) and carrier and measure the voltage in any side of this assembly.The thermal resistance of assembly can be released thus, and therefore by deducting the thermal resistance of printed circuit board (PCB), the thermal resistance of carrier is released.
The present invention especially but be not the electronic unit of power switch can be applicable to exclusively as forming a part for inverter.This inverter for example belongs to inverter/charger circuit, and it comprises electric notor in addition, and is incorporated in electronic or motor vehicle driven by mixed power.
Background technology
Electronic unit and radiator form a part for the assembly that comprises printed circuit board (PCB), and the heat of being distributed by electronic unit is passed to radiator by this printed circuit board (PCB).As example as shown in FIG. 1, be known that metal insert 100 (it is for example made of copper) be inserted in printed circuit board (PCB), to promote the heat produced by electronic unit 101 to be delivered to radiator 102.When electronic unit 101 is supplied with high voltage and/or high electric current, large calorimetric is produced, and the electric insulation needing between electronic unit 101 and radiator 102 increases.
The layer plug that patent application EP 2 023 706 has described being arranged between radiator and electronic unit carries out anodization.Plug-in unit extends beyond printed circuit board (PCB) to radiator.
Patent US 6 449 158 has described electronic unit has been arranged in the chamber in printed circuit board (PCB), and the anodization aluminium lamination of planting between this electronic unit and radiator.Thus, electronic unit is not printed the exterior face carrying of circuit board.
Need to guarantee that the heat being produced by electronic unit is delivered to radiator well, guarantees the electric insulation that is satisfied with between radiator and electronic unit simultaneously.
Summary of the invention
The object of the invention is to meet this demand, and the present invention utilizes a method to meet this demand according to an one aspect, the method for manufacturing heat conduction and electric insulation connecting portion between at least one electronic unit and radiator, this radiator is completely or partially made of metal, electronic unit and radiator form a part for assembly, this assembly also comprises the printed circuit board (PCB) being arranged between electronic unit and radiator, and this printed circuit board (PCB) comprises at least one metal level and metal insert
In the method, heat is dissipated to radiator by least one metal surface from electronic unit, and this at least one metal surface is by anodization, and described metal surface belongs in metal parts, printed circuit board (PCB) and radiator.
Plug-in unit can be included in the height of printed circuit board (PCB) fully, that is, plug-in unit is not outstanding over printed circuit board (PCB) towards electronic unit towards radiator yet.
Printed circuit board (PCB) can be arranged between electronic unit and radiator fully,, when radiator, printed circuit board (PCB) and electronic unit are pressed this sequence stack along axis, there is no plane perpendicular to this axis, it cuts off radiator and printed circuit board (PCB) or cuts off printed circuit board (PCB) and electronic unit.
Electronic unit is for example carried by the one side of printed circuit board (PCB), and this face is defined for the surface that receives these parts.In the following description, term " face of printed circuit board (PCB) " is understood to the exterior face of printed circuit board (PCB).
According to the present invention, only shallow superficial layer can be by anodization, and it is not the situation in patent US 6 449158 for example, and wherein, aluminium lamination is whole by anodization.
This surface of anodization or these surfaces make to guarantee electric insulation, and hinder heat, from electronic unit, by described surface, are not passed to radiator.In addition, by anodization, manufacture this electric insulation not expensive.
Electronic unit can comprise the packing with at least one metal part, and described packing is partly shelved on via described metal on the receiving surface of printed circuit board (PCB), and the described metal part of packing can be by anodization.This anodized surface of packing forms in this anodizing metallic surfaces of assembly or anodizing metallic surfaces.
Radiator can have the metal surface contacting with printed circuit board (PCB), and the described surface of radiator can be by anodization.This anodized surface of radiator forms in this anodizing metallic surfaces or anodizing metallic surfaces.Radiator is for example completely or partially made of aluminum, and this material has gratifying electricity and hot attribute is simultaneously cheap and light.
Radiator can be made by single parts, and in this case, a part for these parts is subject to anodization.As variant, by anodized parts, be attached to radiator, and the surface of the parts of this link forms the anodizing metallic surfaces of radiator before.
Metal insert can have Construction integration, for example, by single parts, made.
Metal insert can be made of copper.
According to the first embodiment of the present invention, metal insert is embedded in the remainder of printed circuit board (PCB).According to this first embodiment, printed circuit board (PCB) comprises at least two metal levels, and the first metal layer is plugged between metal insert and electronic unit, and the second metal level is plugged between metal insert and radiator.Each metal level can be made of copper.
According to the first variant of this first embodiment, the face towards electronic unit of the first metal layer is by anodization completely or partially.This anodized of the first metal layer forms in this anodizing metallic surfaces of assembly or anodizing metallic surfaces.
According to the second variant of this first embodiment, or with above-mentioned the first variant combination, the face towards radiator of the second metal level is by anodization completely or partially.This anodized of the second metal level forms in this anodizing metallic surfaces of assembly or anodizing metallic surfaces.
According to another variant of the first embodiment of the present invention, if or suitably, according to the above-mentioned first or second variant, metal insert can have the first contact-making surface with the corresponding contact Surface Contact of the first metal layer, with the second contact-making surface of corresponding contact Surface Contact with the second metal level, at least one following surface can be by anodization:
-described the first contact-making surface,
The described corresponding contact surface of-the first metal layer,
-described the second contact-making surface,
The described corresponding contact surface of-described the second metal level,
Thus, in this anodizing metallic surfaces of this anodized surface formation assembly or anodizing metallic surfaces.
If needed, the heat being produced by electronic unit can dissipate by a plurality of anodizing metallic surfaces.
According to a second embodiment of the present invention, metal insert can not be embedded in the remainder of printed circuit board (PCB).
Printed circuit board (PCB) can comprise two metal levels, is for example made of copper, and prepreg layer, chamber can be fabricated to by these layers.
Prepreg layer can have printed circuit board (PCB) thickness 20 to 90%, for example, between 50% to 80%.
Metal insert is for example arranged in this chamber, is particularly press fit in this chamber, and has the contact-making surface contacting with electronic unit.This contact-making surface of metal insert can be by anodization, then forms in this anodizing metallic surfaces of assembly or anodizing metallic surfaces.
According to this second embodiment, when plug-in unit is arranged in while running through in chamber, it can not extend in the thickness of the second metal level, and the part of manufacturing in this second metal level of chamber can completely or partially be filled with resin.The second metal level can be the skin of printed circuit board (PCB), and the face of the second metal level forms the exterior face of printed circuit board (PCB), and resin can be arranged in chamber, thereby the described exterior face of printed circuit board (PCB) is flat substantially, comprises with chamber and flushing.
As variant, plug-in unit does not extend in the thickness of the first metal layer, and extends in prepreg layer and the second metal level, and the part of manufacturing in the first metal layer of chamber is completely or partially filled with resin, as above about the second metal level, describe, obtain especially plane surface.
As another variant, plug-in unit only extends in the part of thickness for the first metal layer or the second metal level, and the part not occupied by the plug-in unit in the first or second metal level of chamber is completely or partially filled with resin.Plane surface can as abovely obtain.
Except the first embodiment of the invention in the situation that, plug-in unit can have the contact-making surface contacting with radiator, and the described contact-making surface of plug-in unit can be by anodization.This anodized of plug-in unit who belongs to printed circuit board (PCB) forms in this anodizing metallic surfaces of assembly or anodizing metallic surfaces.
According to a further aspect in the invention, another theme of the present invention is assembly, and described assembly comprises:
-at least one electronic unit,
-radiator, is completely or partially made of metal, and
-printed circuit board (PCB), is arranged between radiator and electronic unit, and described printed circuit board (PCB) comprises at least one metal level and metal insert,
At least one in electronic unit, printed circuit board (PCB) and radiator comprises at least one metal surface, and the heat being fallen apart by electronic unit is passed to radiator by this metal surface, and described metal surface is by anodization.
It is obtained that said modules allows to describe advantage.
Plug-in unit can be arranged between electronic unit and radiator.
All or some feature of describing about said method can combine with all assemblies described above.
Electronic unit is for example the electronic unit having higher than the nominal power of 1kW.When being supplied with electrical power, the thermal power of being distributed by these parts can for example be included between 10W to 50W.
These parts for example form a part for the inverter of inverter/charger circuit, and this circuit comprises electric notor in addition, and are incorporated in electronic or motor vehicle driven by mixed power.
According to a further aspect in the invention, another theme of the present invention is a kind of structure at least one electronic unit, and this structure comprises:
-printed circuit board (PCB), one face limits electronic unit receiving surface, and printed circuit board (PCB) comprises metal insert; With
-radiator, it is completely or partially made of metal, and radiator has the anodized surface towards printed circuit board (PCB).
Radiator is for example made of aluminum, and in this case, anodization permission aluminium lamination is arranged as with printed circuit board (PCB) and contacts.
According to a further aspect in the invention, another theme of the present invention is a kind of structure at least one electronic unit, and this structure comprises:
-printed circuit board (PCB), one face limits electronic unit receiving surface, and printed circuit board (PCB) comprises metal insert and at least one metal level; With
-radiator, radiator has the surface towards printed circuit board (PCB),
Metal insert is embedded in the remainder of printed circuit board (PCB), and comprises the contact-making surface with the corresponding contact Surface Contact of the metal level of printed circuit board (PCB).
According to a further aspect in the invention, another theme of the present invention is a kind of structure at least one electronic unit, and this structure comprises:
-printed circuit board (PCB), one face limits electronic unit receiving surface, and printed circuit board (PCB) comprises metal insert; With
-radiator, radiator has the surface towards printed circuit board (PCB),
Metal insert is arranged in running through in chamber of manufacturing in printed circuit board (PCB), thereby the part of described plug-in unit forms a part for electronic unit receiving surface, and the described part of plug-in unit is by anodization.
Accompanying drawing explanation
During in the following description of reading non-limiting example of the present invention with reference to accompanying drawing, will understand better the present invention, in the accompanying drawings:
Fig. 1 illustrate described according to the exemplary components of prior art,
Fig. 2 is schematically illustrated according to the assembly of first embodiment of the invention variant,
Other variants of Fig. 3 and 4 schematically illustrated first embodiment of the invention,
Fig. 5 is schematically illustrated according to the assembly of second embodiment of the invention variant, and
Other variants of Fig. 6 and 7 schematically illustrated second embodiment of the invention.
Embodiment
Fig. 2 illustrates the assembly 1 according to first embodiment of the invention.This assembly 1 comprises electronic unit 2, power transistor for example, and such as field-effect transistor, and structure 3, parts have been linked to this structure 3, for example, by soldering.Parts 2 for example have the nominal power greater than or equal to 1kW, and when it is provided with electrical power, produce the thermal power of 10W to 50W.Electronic unit 2 can sustain the voltage of about 430V and the electric current of about 13A.
Structure 3 comprises printed circuit board (PCB) 4 and radiator 5 in the example shown, and radiator is made of aluminum especially.
In considered example, printed circuit board (PCB) 4 has the form of multilayer, comprises the first bronze medal layer 8, the second bronze medal layer 9 and is plugged on the prepreg layer 10 between copper layer 8 and 9.
The first bronze medal layer 8 has face 11, and it limits the receiving surface of printed circuit board (PCB), and electronic unit 2 is linked to this receiving surface.
The second bronze medal layer 9 has the face 12 towards radiator 5, and it limits another outer surface of printed circuit board (PCB) 4.
As shown, comparable each the copper layer 8 and 9 of prepreg layer 10 is thick.
Printed circuit board (PCB) 4 comprises metal insert 13 in addition, for example, be made of copper.In the example shown in Fig. 2, plug-in unit 13 is comprised in the chamber of only manufacturing in prepreg layer 10, and is not comprised in the thickness in copper layer 8 and 9.Plug-in unit 13 is arranged with respect to electronic unit 2 and radiator 5, thereby the heat of being dispersed by these parts 2 passes to radiator 5 via plug-in unit 13.
Printed circuit board (PCB) 4 shown in Fig. 2 is for example by Schweizer Electronic tMthe printed circuit board (PCB) welding under standard FR4 6L Insert In-LAY.
In the example shown in Fig. 2, the outer surface 12 of printed circuit board (PCB) contacts with the anodized surface 15 of radiator 5.This anodized surface 15 for example obtains by a part for the metal derby of formation radiator 5 is carried out to anodization.
As variant, for example metal parts made of aluminum before being linked to radiator 5 by first anodization, to limit the contact surface contacting with printed circuit board (PCB) 4 of radiator.
This anodized surface 15 make can electron gain parts 2 and radiator 5 between gratifying electric insulation, and poorly do not affect the heat radiation from electronic unit 2 to radiator 5.Thus, the connecting portion between electron gain parts 2 and radiator 5, its electric insulation allows the heat radiation of expectation simultaneously.
Because surface is 15 by anodization, radiator 5 can contact with printed circuit board (PCB) 4 via anodization layer, and described layer for example has the thickness being included between 10 μ m to 30 μ m, and that radiator is approximately 2mm is thick.
In the example shown in Fig. 3 and 4, it has shown the variant of the assembly 1 of the Fig. 2 before printed circuit board (PCB) 4 and radiator 5 are assembled, and radiator does not have anodized surface.In example in Fig. 3, electric insulation obtains by each face is carried out to anodization, and plug-in unit 13 is faced metal level 8 or 9 via described.
Plug-in unit 13 for example has towards the face 16 of the first bronze medal layer 8 with towards the face 17 of the second bronze medal layer 9, and this two sides 16 and 17 is by anodization.If needed, contact-making surface 16 and 17 corresponding contact surface (belonging to respectively the first bronze medal layer 9 and the second bronze medal layer 10) can be also by anodization or alternatively by anodization.
In example in Fig. 4, the part contacting with electronic unit 2 of receiving surface 11 and the exterior face 12 being limited by the second bronze medal layer 9 are by anodization.Refer again to the example in Fig. 4, electronic unit 2 can comprise packing, and at least it is made of metal with the part that printed circuit board (PCB) 4 contacts, and this metal part of packing can be by anodization.
In another example (not shown), assembly 1 can be used whole anodized surface of listing in the example of Fig. 2 to 4.
The variant of assembly 1 is according to a second embodiment of the present invention referring now to Fig. 5 to 7 description.
In these examples, chamber 20 is manufactured in the layer 8 to 10 of printed circuit board (PCB) 4, and plug-in unit is press fit in this chamber 20.At this, plug-in unit 13 is comprised in the thickness of the first bronze medal layer 8 and prepreg layer 10.Plug-in unit 13 contacts with electronic unit 2 via its face 16.But plug-in unit is not comprised in the thickness of the second bronze medal layer 9, thereby, flushing ground with the second bronze medal layer 9, chamber 20 is not occupied by plug-in unit 13.Printed circuit board (PCB) 4 shown in Fig. 3 and 4 is for example by Ruwel International tMsoldering under standard FR4 2LCopper In-LAY.
Resin 22 is injected in the part of manufacturing in the second bronze medal layer 9 of chamber 20, and this resin is for example U90 2 kV/125 ℃ standard blue mucous membrane not.Resin 22 can be arranged and make, and outer surface 12 keeps flat, and no matter the existence in the second bronze medal layer 9 of chamber 20.The feather edge of resin 22 can be arranged as thus with the remainder of exterior face 12 and flush.
Be similar to the example in Fig. 2, the surface 15 of radiator 5 can be by anodization, and when radiator is integrated structure, this surface 15 forms a part for radiator, or belongs to the anodized part of elder generation of the another part that is linked to radiator 5.If needed, this anodization can be dark anodization, and forms the layer of 10 μ m to 30 μ m thickness, and via this layer, radiator contacts with printed circuit board (PCB).
In the example shown in Fig. 6 and 7, the variant that it has shown the assembly in printed circuit board (PCB) 4 and radiator 5 Fig. 5 before assembled, has been used for obtain other devices of electric insulation between electronic unit 2 and radiator 5.
In example in Fig. 6, radiator does not have anodized surface, but this face 16 contacting with electronic unit 2 of plug-in unit is by anodization.When electronic unit is comprised in the packing with the metal part contacting with plug-in unit 13, the described metal part of this packing is by anodization.
In example in Fig. 7, by face 12 anodization to the second bronze medal layer 9, obtain electric insulation.
In an example (not shown), assembly 1 can be used whole anodized surface of listing in the example of Fig. 5 to 7.
The example that the invention is not restricted to just describe.
As long as heat conduction and electric insulation connecting portion by one or more metal surfaces anodization is set up, do not depart from scope of the present invention between electronic unit 2 and radiator 5.
Although used term " anodized surface ", the present invention is not only contained surface anodization and is processed and also contain dark anodization, that is, the part of the formation outside of anodized surface also in a part for its thickness by anodization.
Expression way " comprises " or " comprising one " it must be understood that for " comprising at least one ", except pointing out in addition.

Claims (11)

1. one kind for manufacturing the method for heat conduction and electric insulation connecting portion between at least one electronic unit (2) and radiator (5), this radiator is completely or partially made of metal, electronic unit (2) and radiator (5) form a part for assembly (1), this assembly comprises the printed circuit board (PCB) (4) being arranged between electronic unit (2) and radiator (5) in addition, a face (11) of this printed circuit board (PCB) (4) is defined for the surface that receives electronic unit (2), printed circuit board (PCB) (4) comprises at least one metal level (8, 9) and metal insert (13), this metal insert (13) is included in the height of printed circuit board (PCB) (4) fully,
In the method, heat is dissipated to radiator (5) by least one metal surface (11,12,15,16,17) from electronic unit (2), this at least one metal surface is by anodization, and described metal surface belongs in electronic unit (2), printed circuit board (PCB) (4) and radiator (5).
2. the method for claim 1, wherein, electronic unit (2) comprises the packing with at least one metal part, described packing is partly shelved on the receiving surface (11) of printed circuit board (PCB) (4) via described metal, and wherein, the described metal part of packing can be by anodization.
3. method as claimed in claim 1 or 2, wherein, radiator (5) has the surface (15) contacting with printed circuit board (PCB) (4), and wherein, the described surface (15) of radiator (5) is by anodization.
4. the method as described in any one in aforementioned claim, wherein, printed circuit board (PCB) (4) comprises at least two metal levels (8,9), the first metal layer (8) is plugged between metal insert (13) and electronic unit (2), and the second metal level (9) is plugged between metal insert (13) and radiator (5).
5. method as claimed in claim 4, wherein, receiving surface (11) is limited by the face towards electronic unit (2) of the first metal layer (8), and described receiving surface (11) is completely or partially by anodization.
6. the method as described in claim 4 or 5, wherein, the face towards radiator (5) of the second metal level (9) (12) is by anodization completely or partially.
7. the method as described in any one in aforementioned claim 4 to 6, wherein, metal insert (13) has the first contact-making surface (16) with the corresponding contact Surface Contact of the first metal layer (8), the second contact-making surface (17) with corresponding contact Surface Contact with the second metal level (9), and wherein, with lower at least one by anodization:
-described the first contact-making surface (16),
The described corresponding contact surface of-described the first metal layer (8),
-described the second contact-making surface (17), and
The described corresponding contact surface of-described the second metal level (9).
8. the method as described in any one in aforementioned claims 1 to 3, wherein, metal insert (13) has the contact-making surface (16) contacting with electronic unit (2), and wherein, the described contact-making surface (16) of plug-in unit (13) is by anodization.
9. method as claimed in claim 8, wherein, printed circuit board (PCB) (4) comprises the first metal layer (8), the second metal level (9) and prepreg layer (10), run through chamber (20) and be fabricated to by described layer (8,9,10), the part of manufacturing in this second metal level (9) of described chamber (20) can completely or partially be filled with resin (22).
10. an assembly (1), comprising:
-at least one electronic unit (2),
-radiator (5), is completely or partially made of metal, and
-printed circuit board (PCB) (4), be arranged between radiator (5) and electronic unit (2), described printed circuit board (PCB) (4) has the surperficial face (11) that receives electronic unit (2) that is defined for, and described printed circuit board (PCB) (4) comprises at least one metal level (8,9) and metal insert (13), this metal insert (13) is included in the height of printed circuit board (PCB) (4) fully
At least one in electronic unit (2), printed circuit board (PCB) (4) and radiator (5) comprises at least one metal surface (11,12,15,16,17), the heat being distributed by electronic unit (2) is passed to radiator (5) by this metal surface, and described metal surface is by anodization.
11. assemblies as claimed in claim 10, metal insert (13) is made by single parts.
CN201280069727.4A 2011-12-15 2012-12-10 Thermally conductive and electrically insulating link between at least one electronic component and a completely or partially metal radiator Pending CN104115567A (en)

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FR1161692A FR2984679B1 (en) 2011-12-15 2011-12-15 THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING CONNECTION BETWEEN AT LEAST ONE ELECTRONIC COMPONENT AND A RADIATOR IN ALL OR METALLIC PORTION
FR1161692 2011-12-15
PCT/FR2012/052862 WO2013088047A1 (en) 2011-12-15 2012-12-10 Thermally conductive and electrically insulating link between at least one electronic component and a completely or partially metal radiator

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FR2984679A1 (en) 2013-06-21
FR2984679B1 (en) 2015-03-06
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KR20140107442A (en) 2014-09-04
EP2792220B1 (en) 2017-01-18

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