CN104112714A - Core shell, core box and core system - Google Patents
Core shell, core box and core system Download PDFInfo
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- CN104112714A CN104112714A CN201310138417.XA CN201310138417A CN104112714A CN 104112714 A CN104112714 A CN 104112714A CN 201310138417 A CN201310138417 A CN 201310138417A CN 104112714 A CN104112714 A CN 104112714A
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- core
- core shell
- chimeric
- shell
- casket
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention provides a core shell, core box and core system. The core system includes a plurality of core shells and the core box; the core box is in embedded electrical connection with the core shells through a core box embedding connection side surface; the core shells are in embedded electrical connection with each other through core shell embedding connection surfaces; and the core box is in electric connection with the core shells through core box electric connection side surfaces. The core system composed of the core shells and the core box is advantageous in convenient installation and disassembly, no reliance on any carrying media, high convenience and flexibility. The core shells in the core system can be used repeatedly, and therefore, development cost and production cost can be effectively reduced.
Description
Technical field
The present invention relates to integrated circuit fields, particularly a kind of core shell, core casket and core system.
Background technology
Integrated circuit is widely used in every field in life-such as consumer product, household supplies, automobile, information technology, telecommunications, military affairs and space application.Integrated circuit (integrated circuit, IC), it is the chip of our general indication, its conventionally adopt certain technique by the circuit elements device of One's name is legion such as the elements such as transistor, diode, resistance, electric capacity and inductance are integrated on semiconductor wafer, by the wiring on wafer by numerous components and parts interconnection together.Chip is after completing making, conventionally chip package need to be got up, according to the difference of encapsulation technology, chip can be divided into: bare chip, shell chip, without shell chip, wafer-level package (Chip Scale Packag, CSP) chip, system in package (System In a Package, SIP) chip.Along with the continuous expansion of various electronic application functions, and the continuous increase of the kind of electronic application, chip used in electronic equipment is more and more, conventionally need to carry on medium being placed on one in a plurality of chipsets.Normally used lift-launch medium has two kinds: bread board (Bread Board) and printed circuit board (PCB) (Printed Circuit Board, PCB).
For the method using bread board as lift-launch medium, with wire jumper, the components and parts such as chip are coupled together and realize certain application function on bread board exactly, this mode is used for experimental system verification, be well suited for the few system of number of chips, it can increase and decrease very easily components and parts or change line, but small scale and the performance of the system of building by the method are low.
For the method using printed circuit board (PCB) as lift-launch medium, exactly by a plurality of chips welding on a printed circuit board (PCB) designing and realize certain application function, then one or polylith printed circuit board combination are become to form an electronic application together, such as PC, mobile phone etc.Because can place the chip of One's name is legion on pcb board, the advantage such as therefore there is the large-scale production of being suitable for, cost is low and reliability is strong.After but chip welds on pcb board, be just difficult for changing, be also difficult for increasing again number of chips, very dumb.
Progressively expansion along with the circuit function of electronic application, number of chips and kind used in electronic application are more and more, in addition, needs along with the expansion upgrading as terminal electronic product, require increase and decrease or transposing chip convenient flexibly, so that the exploitation of electronic application and use are more flexible, more convenient, thereby reduce its development and production cost.
Summary of the invention
The object of the present invention is to provide a kind of core shell, core casket and core system, to solve chip used difficult change in electronic application of the prior art, problem that flexibility ratio is low, improve the flexibility ratio of electronic application, make chip wherein be easy to increase and decrease and transposing, make it possess high flexibility and multifunctionality, thereby realize the object that reduces development cost and production cost.
For solving the problems of the technologies described above, the invention provides a kind of core shell, be used for encapsulating a chip, the core shell of a plurality of inclosure chips is put into a core casket and is formed an electronic application, wherein, described core shell comprises that one for encapsulating the housing of described chip, and described housing comprises: at least two chimeric joint faces of core shell, and for core shell is chimeric is electrically connected to another.
Optionally, in described core shell, described housing also comprises at least one core shell junction that is electrically connected, for being electrically connected to described core casket.
Optionally, in described core shell, described housing is hexahedron, described two chimeric joint faces of core shell are the chimeric joint face of the first core shell and the chimeric joint face of the second core shell, lay respectively at described hexahedral two sides that are oppositely arranged, on the chimeric joint face of described the first core shell, have at least one core shell projection, have at least one core shell groove on the chimeric joint face of described the second core shell, described core shell groove is for realizing chimeric electrical connection with the core shell projection of core shell described in another.
Optionally, in described core shell, between described core shell projection and core shell groove, be interference fit.
Optionally, in described core shell, described core shell projection is metal-cored shell projection, and the inner surface of described core shell groove scribbles metal coating.
Optionally, in described core shell, described core shell projection is hemisphere core shell projection, and described core shell groove is hemisphere core shell groove.
Optionally, in described core shell, described core shell projection is cylindricality core shell projection, and described core shell groove is cylindricality core shell groove.
Optionally, in described core shell, described core shell projection is aciculiform core shell projection, and described core shell groove is aciculiform core shell groove.
Optionally, in described core shell, described core shell projection is square core shell projection, and described core shell groove is square core shell groove.
Optionally, in described core shell, described core shell electrical connection face comprises the first core shell junction and the second core shell junction that is electrically connected that is electrically connected, be respectively described hexahedral upper surface and lower surface, the be electrically connected both sides of junction of described the first core shell are respectively arranged with the first core shell bus, and the both sides of described the second joint face are respectively arranged with the second core shell bus.
Optionally, in described core shell, described the first core shell bus is metal raised line or metal coating bar, and described the second core shell bus is metal raised line or metal coating bar.
Optionally, in described core shell, each pin of described chip is electrically connected to described core shell projection, core shell groove, the first core shell bus or the second core shell bus respectively.
Optionally, in described core shell, described in each, on the chimeric joint face of core shell, at least embed at least one magnetic stripe is set, the polarity of the magnetic stripe on the chimeric joint face of described the first core shell is contrary with the polarity of magnetic stripe on the chimeric joint face of described the second core shell.
Optionally, in described core shell, a Light-Emitting Diode is set on described housing, described Light-Emitting Diode is for representing the operating state of the chip in described housing.
Optionally, in described core shell, the material of described housing is non-conductive material.
Accordingly, the present invention also provides a kind of core casket, and for taking in a plurality of described core shells, described core casket comprises:
One bottom surface;
The chimeric connection of the core casket side being connected with described bottom surface, for chimeric electrical connection of described core shell;
Two core caskets that are oppositely arranged that are connected with described bottom surface are electrically connected to side, and described core casket is electrically connected to side and surrounds an accommodation space with the chimeric side that is connected of described bottom surface and core casket, for taking in described core shell;
Wherein, on the outer surface of the chimeric connection of described core casket side, be provided with a plurality of connecting keys, described connecting key is electrically connected to described core shell projection or core shell groove.
Optionally, in described core casket, described core casket also comprises at least one conduction retractable member and a shell fragment, one end of described conduction retractable member connects with the chimeric medial surface that is connected side of described core casket, the other end of described conduction retractable member arranges one chimeric, be used for and chimeric electrical connection of the chimeric joint face of described core shell, described chimeric is electrically connected to described connecting key by described conduction retractable member, described shell fragment is arranged at two described core caskets and is electrically connected between side, and described core shell is fixed between described conduction retractable member and shell fragment.
Optionally, in described core casket, described core casket also comprises at least one contact rod, one end of described contact rod connects with the chimeric medial surface that is connected side of described core casket, the other end of described contact rod arranges one chimeric, be used for and chimeric electrical connection of the chimeric joint face of described core shell, described chimeric is electrically connected to described connecting key by described contact rod.
Optionally, in described core casket, described chimeric is chimeric an of projection chimeric or groove, for realizing chimeric electrical connection with described core shell projection or core shell groove.
Optionally, in described core casket, described core casket is electrically connected to the free end of side to a lateral buckling of described bottom surface, the inner surface that is electrically connected to the bending side place of side at described core casket is provided with the first core casket bus, for being electrically connected to described the first core shell bus, in described bottom surface, be provided with the second core casket bus, for being electrically connected to described the second core shell bus.
Optionally, in described core casket, described the first core casket bus is electrically connected to a described connecting key, and described the second core casket bus is electrically connected to connecting key described in another.
Optionally, in described core casket, two described core caskets are electrically connected to the integral multiple that the distance between side is the width of its interior core shell of placement.
Optionally, in described core casket, described core casket is electrically connected to the free end of side and the integral multiple that the distance between described bottom surface is the thickness of its interior core shell of placement.
Optionally, in described core casket, described core casket is electrically connected to one end of side and the distance between the other end for placing the integral multiple of the thickness of the core shell in it, and described bottom surface is positioned at described core casket and is electrically connected on side core casket described in distance and is electrically connected on the position of one end of side or the integral multiple of the other end.
Optionally, in described core casket, the material of described core casket is non-conductive material.
In addition, the present invention also provides a kind of core system, comprising:
A plurality of described core shells; And
Described core casket;
Wherein, described core casket is by the chimeric connection of described core casket side and chimeric electrical connection of described core shell, between described core shell, by the chimeric electrical connection of the chimeric joint face of described core shell, and by described core casket, is electrically connected to side and is electrically connected to described core shell.
The invention provides a kind of core shell, core casket and core system.Described core shell is used for encapsulating a chip, the core shell of a plurality of inclosure chips is put into a core casket and is formed an electronic application, and wherein, described core shell comprises that one for encapsulating the housing of described chip, described housing comprises: at least two chimeric joint faces of core shell, and for core shell is chimeric is electrically connected to another.Adopt above-mentioned core shell, chip can be positioned in described housing, housing just can be realized chimeric electrical connection by the chimeric joint face of core shell each other.That is to say, comprise different chips and can realize and being electrically connected to by the mutual chimeric electrical connection between housing at interior core shell, and can remove at any time above-mentioned chimeric electrical connection according to different needs, delete unwanted chip or again increase new chip.That is, the above-mentioned increase and decrease to chip, only needs to remove the original chimeric electrical connection of each core shell, and according to new demand, each core shell is reconfigured to chimeric connection and can complete, convenient, flexible.
In addition, core casket of the present invention is used for taking in a plurality of described core shells, and described core casket comprises: a bottom surface; The chimeric connection of the core casket side being connected with described bottom surface, for chimeric electrical connection of described core shell; Two core caskets that are oppositely arranged that are connected with described bottom surface are electrically connected to side, and described core casket is electrically connected to side and surrounds an accommodation space with the chimeric side that is connected of described bottom surface and core casket, for taking in described core shell; Wherein, on the outer surface of the chimeric connection of described core casket side, be provided with a plurality of connecting keys, described connecting key is electrically connected to described core shell projection or core shell groove.Above-mentioned core casket can be taken in a plurality of core shells, a plurality of core shells can be gathered together and form an electronic application.For above-mentioned electronic application, if need to occur some core shell wherein losing efficacy, need replacing or electronic application because expansion need to increase new core shell or some core shell need to be deleted, the core shell that only needs in above-mentioned electronic application need to be deleted or replace is removed, and changes or increase the core shell of core.Above-mentioned to the increase and decrease of core shell and do not rely on the lift-launch medium designing in advance, being connected between the connection between each core shell and core shell and core casket do not need wire jumper or welding, connection between connection between each core shell and core shell-and-core casket is all a kind of chimeric electrical connections, therefore both for convenience detach also convenient installations, and do not rely on any lift-launch medium, each core shell in convenient, flexible and above-mentioned electronic application can be reused, thereby has effectively reduced development cost and production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the core shell of the embodiment of the present invention one;
Fig. 2 A is the vertical view of the housing in the embodiment of the present invention one;
Fig. 2 B is the right view of the housing in the embodiment of the present invention one;
Fig. 2 C is the front view of the housing in the embodiment of the present invention one;
Fig. 2 D is the rearview of the housing in the embodiment of the present invention one;
Fig. 3 is the front view of the core casket in the embodiment of the present invention two;
Fig. 4 is the front view of the core casket of another embodiment of the present invention;
Fig. 5 A is along the profile of I-I ' face in Fig. 3;
Fig. 5 B is along the profile of II-II ' face in Fig. 3;
Fig. 6 to Fig. 7 is the process schematic diagram that the embodiment of the present invention two SMIS shells pack core casket into;
Fig. 8 is the equivalent circuit diagram of Fig. 7;
Fig. 9 is the structural representation of the core system of further embodiment of this invention;
Figure 10 is along the profile of I-I ' face in Fig. 9;
Figure 11 is the profile of the core system of yet another embodiment of the invention;
Figure 12 is the also profile of the core system of an embodiment of the present invention.
Embodiment
The core shell, core casket and the core system that the present invention are proposed below in conjunction with the drawings and specific embodiments are described in further detail.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of the aid illustration embodiment of the present invention lucidly.
Embodiment mono-
As shown in Figure 1, the present embodiment provides a core shell 100, and described core shell 100 comprises a housing 102, and described housing 102 is for encapsulating a chip 101.Described chip 101 can be the bare chip that process does not encapsulate completely, also can be the chip encapsulating through once, for example, shell chip, without shell chip, wafer-level package (Chip Scale Packag, CSP) chip and system in package (System In a Package, SIP) chip etc.Described housing 102 can be the housing of hollow, can be also the solid housing (shown in figure is the housing of hollow) that adopts packing material plastotype to form.Conventionally, the material selection non-conductive material of described housing 102, such as plastics etc.
As shown in Figure 2 A, described housing 102 comprises two chimeric joint faces 1021 of core shell.In the present embodiment, described housing 102 is hexahedron, wherein, two chimeric joint faces 1021 of core shell are respectively the chimeric joint face 10211 of the first core shell and the chimeric joint face 10212 of the second core shell, and the chimeric joint face 10211 of described the first core shell and the chimeric joint face 10212 of the second core shell lay respectively at described hexahedral two sides that are oppositely arranged.On the chimeric joint face 10211 of described the first core shell, there are shown at least one core shell projection 103(figure three), on the chimeric joint face 10212 of described the second core shell, there are shown at least one core shell groove 104(figure three), described core shell groove 104 is realized chimeric electrical connection for the core shell projection 103 with another core shell 100.
As shown in Figure 2 A and 2 B, in order to realize the chimeric electrical connection of a core shell and another core shell, described core shell projection 103 and core shell groove 104 all must be set to conductivity, and for example described core shell projection 103 is metal bump, the inner surface metallizing coating of described core shell groove 104.Shape for core shell projection 103 and core shell groove 104 does not need to do any restriction, for example, core shell projection 103 can be set to hemispherical projections, column-shaped projection, aciculiform core shell projection or square core shell projection, and corresponding core shell groove 104 can be set to hemisphere core shell groove, cylindricality core shell groove, aciculiform core shell groove or square core shell groove.In addition, in order to realize the closely chimeric of core shell projection 103 and core shell groove 104, described core shell projection 103 and core shell groove 104 can be designed to interference fit.Preferably, described core shell projection 103 is aciculiform core shell projection, and when core shell groove 104 is aciculiform core shell groove simultaneously, the chimeric effect of described core shell projection 103 and core shell groove 104 is optimum.
Continue with reference to figure 2B, described housing 102 also comprises two core shells junction 1022 that is electrically connected, be respectively the first core shell junction 10221 and the second core shell junction 10222 that is electrically connected that is electrically connected, described the first core shell junction 10221 and the second core shell junction 10222 that is electrically connected that is electrically connected is separately positioned on described hexahedral upper surface and lower surface, the be electrically connected both sides of junction 10221 of described the first core shell are respectively arranged with the first core shell bus 105, and the both sides of described the second joint face 10222 are respectively arranged with the second core shell bus 106.Described the first core shell bus 105 and the second core shell bus 106 can be set to metal raised line or metal coating bar.When described core shell is placed into core casket, described core shell can be realized and being electrically connected to core casket by the first core shell bus 105 and the second core shell bus 106.
In conjunction with Fig. 1, Fig. 2 A and Fig. 2 B, each pin that is placed on the chip 101 in core shell 100 is electrically connected to described core shell projection 103, core shell groove 104, the first core shell bus 105 or the second core shell bus 106 respectively.That is to say, described core shell projection 103 on core shell 100, core shell groove 104, the first core shell bus 105 and the second core shell bus 106 have represented each pin of chip 101, by the core shell projection 103 of different core shells and the mutual chimeric electrical connection of core shell groove 104, by the first core shell bus 105, the second core shell bus 106, be electrically connected to core casket simultaneously, can realize the mutual electrical connection of each pin of the chip that different core shells comprise.
According to the difference of the number of pins of described chip 101, can set the quantity of described core shell projection 103, core shell groove 104, the first core shell bus 105 and the second core shell bus of varying number.When the pin number of described chip 101 is larger, when more core shell projection 103 and core shell groove 104 cannot be set on the chimeric joint face 1021 of core shell, can on core shell is electrically connected junction 1022, arrange and increase the first core shell bus 105 and/or the second core shell bus 106.
As shown in Fig. 2 A, Fig. 2 C and Fig. 2 D, in order to prevent the chimeric setup error of core shell, can described in each, on the chimeric joint face 1021 of core shell, at least embed at least one magnetic stripe (two magnetic stripes 1071,1072 shown in figure) is set, and the polarity of the magnetic stripe 1071 on the chimeric joint face 10211 of described the first core shell is contrary with the polarity of magnetic stripe 1072 on the chimeric joint face 10212 of described the second core shell.When the chimeric joint face of the first core shell of a core shell is relative with the chimeric joint face of the first core shell of another core shell, will be identical and repel each other because of the polarity of magnetic stripe that is arranged at the chimeric joint face of described the first core shell, avoided the chimeric mistake of the chimeric joint face of the first core shell of two core shells.Simultaneously, when the chimeric joint face of the first core shell of a core shell is relative with the chimeric joint face of the second core shell of another core shell, can be because being arranged at the polarity of magnetic stripe of the chimeric joint face of described the first core shell and the polarity of the magnetic stripe of the chimeric joint face of the second core shell inhale mutually on the contrary mutually, thus make chimeric tightr of two core shells.
Continuation, with reference to figure 1 and Fig. 2 A, in order to distinguish the different operating state of the chip 101 in core shell 100, arranges a light-emitting diode 108 in the junction 10221 that can be electrically connected at the first core shell of housing 102.Can control by chip 101 characteristics of luminescence of described light-emitting diode 108, such as color, brightness or flicker frequency etc., to judge the operating state of inside chip 101 according to the characteristics of luminescence of light-emitting diode 108.
In the present embodiment; described housing 102 is hexahedron; should be understood that; the shape of described housing 102 is not limited to hexahedron; also can be octahedron or decahedron; as long as just can realize object of the present invention as long as described housing 102 comprises at least two chimeric joint faces 1021 of core shell, all belong in protection scope of the present invention.
Embodiment bis-
The present embodiment provides a kind of core casket, for taking in the core shell of a plurality of embodiment mono-.
As shown in Figure 3, described core casket comprises that a bottom surface 201, the chimeric connection of the core casket side 202 being connected with described bottom surface 201, two core caskets that are oppositely arranged that are connected with described bottom surface 201 are electrically connected to sides 203, and described bottom surface 201, the chimeric connection of core casket side 202 and two core caskets are electrically connected to space that side 203 surrounds for taking in core shell 100.Conventionally, the material of described core casket is non-conductive material.Plastics for example.
Continuation is with reference to figure 3, and described core casket also comprises 3 conduction retractable member shown at least one conduction retractable member 204(figure) and a shell fragment 205, on the outer surface of the chimeric connection of described core casket side 202, be provided with a plurality of connecting keys 2021.One end of described conduction retractable member 204 connects with the chimeric medial surface that is connected side 202 of described core casket, the other end of described conduction retractable member 204 arranges one chimeric 206, chimeric 206 is chimeric an of projection chimeric or groove, for the core shell groove 104 with the chimeric joint face 1022 of described core shell or core shell projection 103 chimeric electrical connections, described chimeric 206 is electrically connected to described connecting key 2021 by described conduction retractable member 204.Described shell fragment 205 is arranged at two described core caskets and is electrically connected between side 202, and described core shell 100 is fixed between described conduction retractable member 204 and shell fragment 205.
In the present embodiment, by described conduction retractable member 204 and shell fragment 205, described core shell 100 is fixing.When the quantity of core shell 100 is few, do not need stronger bed knife just core shell 100 can be fixed in core casket.As shown in Figure 4, in another embodiment of the present invention, described core casket also comprises at least one contact rod 2041, one end of described contact rod 2041 connects with the chimeric medial surface that is connected side 202 of described core casket, the other end of described contact rod 2041 arranges one chimeric 206, be used for and chimeric electrical connection of the chimeric joint face 1022 of described core shell, described chimeric 206 is electrically connected to described connecting key 2021 by described contact rod 2041.When the quantity of core shell 100 is few, only, by chimeric 206 chimeric be connected chimeric with the chimeric joint face 1022 of described core shell on contact rod 2041, can realize described core shell 100 is fixed on to the object in core casket.
As described in embodiment mono-, each pin that core shell projection 103 on described core shell 100 and core shell groove 104 have represented respectively chip 101, by being electrically connected to of core shell projection 103 or core shell groove 104 and described connecting key 2021, the pin of chip 101 can be connected on connecting key 2021.That is to say, each connecting key 2021 of core casket can represent each pin of chip 101.In order to guarantee that each connecting key 2021 represents respectively the pin of a chip 101, conventionally, require to be positioned over the quantity that the core shell projection 103 of the core shell 100 in described core casket or the quantity of core shell groove 104 are less than the connecting key 2021 of core casket.
As shown in Fig. 3 and Fig. 5 A, described core casket is electrically connected to the free end of side 203 to a lateral buckling of described bottom surface 201, the inner surface that is electrically connected to the bending side place of side 203 at described core casket is provided with the first core casket bus 2031, in the time of in core shell 100 is placed into core casket, described the first core casket bus 2031 touches with described the first core shell bus 105, thereby completed being electrically connected to of the first core casket bus 2031 and described the first core shell bus 105.In addition, in described bottom surface 201, be provided with the second core casket bus 2011, in like manner, in the time of in core shell 100 is placed into core casket, also can realizes the second core casket bus 2011 and be electrically connected to described the second core shell bus 106.
In conjunction with Fig. 3, Fig. 5 A and Fig. 5 B, described the first core casket bus 2031 and the second core casket bus 2011 are electrically connected to a connecting key 2021 respectively.Therefore, the first core shell bus 105 is electrically connected to a connecting key 2021 by the first core casket bus 2011, and the second core shell bus 106 is electrically connected to another connecting key 2021 by the second core casket bus 2011.In conjunction with above-mentioned discussion, described core shell projection 103 on core shell 100, core shell groove 104, the first core shell bus 105 and the second core shell bus 106 represent each pin of chip 101, and core shell projection 103, core shell groove 104, the first core shell bus 105 and the second core shell bus 106 have been realized and being electrically connected to a connecting key 2021 respectively by core casket.That is to say, each connecting key 2021 of core casket has represented each pin of chip 101.
After a plurality of core shells 100 are mutual chimeric, can realize interconnecting of chip 101 in a core shell 100, a plurality of core shells 100 after mutually chimeric are being placed into core casket, just a plurality of chips 101 can be joined together to form to an electronic application, and the input and output pin of this electronic application be connected to a plurality of connecting keys 2021 of core casket.That is to say, the electronic application being formed by a plurality of core shells 100 and core casket, do not need to rely on the lift-launch carrier designing in advance, need between each core shell 100, not carry out wire jumper yet, can complete the combination of a plurality of core shells 100, and 2021 input and output pins that can be used as whole electronic application of a plurality of connecting keys of core casket.
Below in conjunction with accompanying drawing 6 to accompanying drawing 7, describe the process that core shell 100 is packed into core casket in detail.
First, as shown in Figure 6, core shell MS0 is pushed through and is entered in core casket from shell fragment 205, and the core shell projection of the core shell groove of the chimeric joint face of the second core shell of core shell MS0 or the chimeric joint face of the first core shell is aimed to described chimeric 206, make core shell MS0 and described chimeric 206 chimeric; After letting go, conduction retractable member 204 can be pushed into shell fragment 205 places through core shell MS0, and with shell fragment 205, described core shell MS0 is fixed.Specifically, when chimeric 206 be projection chimeric time, with the core shell groove of the chimeric joint face of the second core shell, aim at chimeric 206 and carry out chimeric electrical connection; When being chimeric of groove for chimeric 206, the core shell projection of the chimeric joint face of the first core shell of take is aimed at chimeric 206 and is carried out chimeric electrical connection (being chimeric shown in figure be chimeric projection).
Then, as shown in Figure 7, according to above-mentioned steps, core shell SL1, SL2, SL3, SL4 and SL5 are packed in core casket successively.Core shell groove by the chimeric joint face of the first core shell between each core shell is connected with mutual chimeric realization machinery and the electricity of the core shell projection of the chimeric joint face of the second core shell.
Continuation is with reference to figure 7, in the present embodiment, on described each core shell, has 3 core shells projections, 3 core shell grooves and 2 the first core shell buss and 2 the second core shell buss; 3 core shell projections are respectively BL, BC and BR; 3 core shell grooves are respectively FL, FC and FR; 2 the first core shell buss are respectively that PL and PR(are not shown); 2 the second core shell buss are respectively that GL and GR(are not shown).Described core casket has 7 connecting keys, and 7 connecting keys are respectively MPL, MGL, ML, MC, MR, MGR and MPR.
By chimeric electrical connection between the chimeric electrical connection between each core shell and individual core shell-and-core casket, core shell groove between adjacent core shell and core shell projection can be coupled together and are connected respectively to connecting key ML, MC and MR, the first core shell bus PL of each core shell is all connected to connecting key MPL, the first core shell bus PR of each core shell is all connected to connecting key MPR, the second core shell bus GL of each core shell is all connected to connecting key MGL, the second core shell bus GR of each core shell is all connected to connecting key MGR, forms electricity system as shown in Figure 8.
As shown in Figure 9 and Figure 10, in order to make core shell can pack smoothly core casket into and in being stably fixed at core casket, conventionally core casket and core shell are divided into different kinds according to size, for of a sort core shell, there is identical width (W), and the described core caskets of two of the core casket of the core shell of corresponding a certain class are electrically connected to the integral multiple (shown in figure is the situation of 2 times) of the width (W) that the distance (K) between sides is such core shell.When the distance (K) of core casket is 2 times of width (W) of core shell, in core casket, can place two column width is the core shell of W, and the width that can certainly be staggeredly placed is the core shell of W and the core shell that width is 2W.
Along with the increase of the quantity of the core shell of placing in core casket, also can be in described core casket the core shell of placement of multiple layers multiple row.As shown in figure 11, described core casket is electrically connected to the free end of side and the integral multiple that the distance (H1) between described bottom surface is the thickness (D) of its interior core shell of placement.When the distance H 1 of core casket is 2 times of thickness D of core shell, in core casket, can place a layer thickness is the core shell of 2D, and the thickness that can certainly be staggeredly placed is the core shell of D and the core shell that thickness is 2D.
Along with the continuous expansion of electronic application function, the value volume and range of product of the needed chip of electronic application is also on the increase.In order to place the more core shell of more kind in a core casket.Except the core casket of the single-side multi-layer multiple row as shown in Fig. 9 and Figure 11, can also use the core casket of double-sided multi-layer multiple row.Specifically, as shown in figure 12, described core casket is electrically connected to one end of side and the distance between the other end (H2) for placing the integral multiple of the thickness (D) of the core shell in it, and described bottom surface is positioned at described core casket and is electrically connected on side core casket described in distance and is electrically connected on the position of one end of side or the integral multiple of the other end.
By the core casket of above-mentioned single-side multi-layer multiple row or double-sided multi-layer multiple row, can be that the value volume and range of product of the core shell that holds in core casket is expanded greatly, using jumbo core casket to make to set up on a large scale electronic application flexibly becomes possibility.Along with the increase of the quantity of open ended core shell in core casket, the quantity of the connecting key arranging on core casket also needs to increase accordingly.
In addition, the core system that utilizes the core shell of embodiment mono-and the core casket of embodiment bis-to form also belongs to protection scope of the present invention.Specifically, described core system comprises a plurality of described core shells and described core casket; Wherein, described core casket is by the chimeric connection of described core casket side and chimeric electrical connection of described core shell, between described core shell, by the chimeric electrical connection of the chimeric joint face of described core shell, and by described core casket, is electrically connected to side and is electrically connected to described core shell.
As mentioned above, between a plurality of core shells, by mutual chimeric connection, and put into core casket and can form a core system with certain function.Utilize the mutual chimeric connection between core shell, and utilize core casket to take in the thought that a plurality of core shells form a core system, can, by enclosing the mutual chimeric connection of core shell of base unit chip, form the elementary core system with certain function; Using elementary core system as higher leveled chip, enclose in higher leveled core shell again, and by the mutual chimeric connection of a plurality of higher leveled core shells, and put into higher leveled core casket, can form the higher leveled core system with higher function; The like, can form senior core system with better function, scale is huger.According to formed any other core system of level of foregoing invention thought, all in protection scope of the present invention.
In sum, adopt above-mentioned core shell, chip can be positioned in described housing, housing just can be realized chimeric electrical connection by the chimeric joint face of core shell each other.That is to say, comprise different chips and can realize and being electrically connected to by the mutual chimeric electrical connection between housing at interior core shell, and can remove at any time above-mentioned chimeric electrical connection according to different needs, delete unwanted chip or again increase new chip.The above-mentioned increase and decrease to chip, only needs to remove the original chimeric electrical connection of each core shell, and according to new demand, each core shell is reconfigured to chimeric connection and can complete, convenient, flexible.
In addition, adopt core casket provided by the present invention can take in a plurality of core shells, a plurality of core shells can be gathered together and form an electronic application.For above-mentioned electronic application, if need to occur some core shell wherein losing efficacy, need replacing or electronic application because expansion need to increase new core shell or some core shell need to be deleted, the core shell that only needs in above-mentioned electronic application need to be deleted or replace is removed, and changes or increases new core shell.Above-mentioned to the increase and decrease of core shell and do not rely on the lift-launch medium designing in advance, between connection between each core shell and core shell and core casket, be connected and need wire jumper or welding, connection between connection between each core shell and core shell-and-core casket is all a kind of chimeric electrical connections, therefore both for convenience detach also convenient installations, and do not rely on any lift-launch medium, each core shell in convenient, flexible and above-mentioned electronic application can be reused, thereby has effectively reduced development cost and production cost.
Foregoing description is only the description to preferred embodiment of the present invention, the not any restriction to the scope of the invention, and any change, modification that the those of ordinary skill in field of the present invention is done according to above-mentioned disclosure, all belong to the protection range of claims.
Claims (26)
1. a core shell, be used for encapsulating a chip, the core shell of a plurality of inclosure chips is put into a core casket and is formed an electronic application, it is characterized in that, described core shell comprises that one for encapsulating the housing of described chip, described housing comprises: at least two chimeric joint faces of core shell, and for core shell is chimeric is electrically connected to another.
2. core shell as claimed in claim 1, is characterized in that, described housing also comprises at least one core shell junction that is electrically connected, for being electrically connected to described core casket.
3. core shell as claimed in claim 2, it is characterized in that, described housing is hexahedron, described two chimeric joint faces of core shell are the chimeric joint face of the first core shell and the chimeric joint face of the second core shell, lay respectively at described hexahedral two sides that are oppositely arranged, on the chimeric joint face of described the first core shell, there is at least one core shell projection, on the chimeric joint face of described the second core shell, have at least one core shell groove, described core shell groove is for realizing chimeric electrical connection with the core shell projection of core shell described in another.
4. core shell as claimed in claim 3, is characterized in that, between described core shell projection and core shell groove, is interference fit.
5. core shell as claimed in claim 3, is characterized in that, described core shell projection is metal-cored shell projection, and the inner surface of described core shell groove scribbles metal coating.
6. core shell as claimed in claim 5, is characterized in that, described core shell projection is hemisphere core shell projection, and described core shell groove is hemisphere core shell groove.
7. core shell as claimed in claim 5, is characterized in that, described core shell projection is cylindricality core shell projection, and described core shell groove is cylindricality core shell groove.
8. core shell as claimed in claim 5, is characterized in that, described core shell projection is aciculiform core shell projection, and described core shell groove is aciculiform core shell groove.
9. core shell as claimed in claim 5, is characterized in that, described core shell projection is square core shell projection, and described core shell groove is square core shell groove.
10. core shell as claimed in claim 3, it is characterized in that, described core shell electrical connection face comprises the first core shell junction and the second core shell junction that is electrically connected that is electrically connected, be respectively described hexahedral upper surface and lower surface, the be electrically connected both sides of junction of described the first core shell are respectively arranged with the first core shell bus, and the both sides of described the second joint face are respectively arranged with the second core shell bus.
11. core shells as claimed in claim 10, is characterized in that, described the first core shell bus is metal raised line or metal coating bar, and described the second core shell bus is metal raised line or metal coating bar.
12. core shells as claimed in claim 10, is characterized in that, each pin of described chip is electrically connected to described core shell projection, core shell groove, the first core shell bus or the second core shell bus respectively.
13. core shells as claimed in claim 1, it is characterized in that, described in each, on the chimeric joint face of core shell, at least embed at least one magnetic stripe is set, the polarity of the magnetic stripe on the chimeric joint face of described the first core shell is contrary with the polarity of magnetic stripe on the chimeric joint face of described the second core shell.
14. core shells as claimed in claim 1, is characterized in that, a Light-Emitting Diode is set on described housing, and described Light-Emitting Diode is for representing the operating state of the chip in described housing.
15. core shells as claimed in claim 1, is characterized in that, the material of described housing is non-conductive material.
16. 1 kinds of core caskets, for taking in a plurality of core shells as described in claim 1 to 15 any one, is characterized in that, comprising:
One bottom surface;
The chimeric connection of the core casket side being connected with described bottom surface, for chimeric electrical connection of described core shell;
Two core caskets that are oppositely arranged that are connected with described bottom surface are electrically connected to side, and described core casket is electrically connected to side and surrounds an accommodation space with the chimeric side that is connected of described bottom surface and core casket, for taking in described core shell;
Wherein, on the outer surface of the chimeric connection of described core casket side, be provided with a plurality of connecting keys, described connecting key is electrically connected to described core shell projection or core shell groove.
17. core caskets as claimed in claim 16, it is characterized in that, also comprise at least one conduction retractable member and a shell fragment, one end of described conduction retractable member connects with the chimeric medial surface that is connected side of described core casket, the other end of described conduction retractable member arranges one chimeric, be used for and chimeric electrical connection of the chimeric joint face of described core shell, described chimeric is electrically connected to described connecting key by described conduction retractable member, described shell fragment is arranged at two described core caskets and is electrically connected between side, described core shell is fixed between described conduction retractable member and shell fragment.
18. core caskets as claimed in claim 16, it is characterized in that, also comprise at least one contact rod, one end of described contact rod connects with the chimeric medial surface that is connected side of described core casket, the other end of described contact rod arranges one chimeric, be used for and chimeric electrical connection of the chimeric joint face of described core shell, described chimeric is electrically connected to described connecting key by described contact rod.
19. core caskets as described in claim 17 or 18, is characterized in that, described chimeric is chimeric of chimeric an of projection or groove, for realizing chimeric electrical connection with described core shell projection or core shell groove.
20. core caskets as claimed in claim 16, it is characterized in that, described core casket is electrically connected to the free end of side to a lateral buckling of described bottom surface, the inner surface that is electrically connected to the bending side place of side at described core casket is provided with the first core casket bus, for being electrically connected to described the first core shell bus, in described bottom surface, be provided with the second core casket bus, for being electrically connected to described the second core shell bus.
21. core caskets as claimed in claim 20, is characterized in that, described the first core casket bus is electrically connected to a described connecting key, and described the second core casket bus is electrically connected to connecting key described in another.
22. core caskets as claimed in claim 16, is characterized in that, two described core caskets are electrically connected to the integral multiple that the distance between side is the width of its interior core shell of placement.
23. core caskets as described in claim 16 or 22, is characterized in that, the free end that described core casket is electrically connected to side with the distance between described bottom surface for placing the integral multiple of the thickness of its interior core shell.
24. core caskets as described in claim 16 or 22, it is characterized in that, described core casket is electrically connected to one end of side and the distance between the other end for placing the integral multiple of the thickness of the core shell in it, and described bottom surface is positioned at described core casket and is electrically connected on side core casket described in distance and is electrically connected on the position of one end of side or the integral multiple of the other end.
25. core caskets as claimed in claim 16, is characterized in that, the material of described core casket is non-conductive material.
26. 1 kinds of core systems, comprising:
A plurality of core shells as described in claim 1 to 15 any one; And
Core casket as described in claim 16 to 25 any one;
Wherein, described core casket is by the chimeric connection of described core casket side and chimeric electrical connection of described core shell, between described core shell, by the chimeric electrical connection of the chimeric joint face of described core shell, and by described core casket, is electrically connected to side and is electrically connected to described core shell.
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| CN201310138417.XA CN104112714B (en) | 2013-04-19 | 2013-04-19 | Core shell, core casket and core system |
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| CN201310138417.XA CN104112714B (en) | 2013-04-19 | 2013-04-19 | Core shell, core casket and core system |
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| JPH10178388A (en) * | 1996-11-18 | 1998-06-30 | Internatl Business Mach Corp <Ibm> | Extremely small electronic module with optically and mutually connected structure |
| US6008530A (en) * | 1997-05-29 | 1999-12-28 | Nec Corporation | Polyhedral IC package for making three dimensionally expandable assemblies |
| US20030032246A1 (en) * | 2001-08-09 | 2003-02-13 | Masatake Nagaya | Semiconductor device arrangement and method of fabricating the same |
| KR20060073183A (en) * | 2004-12-24 | 2006-06-28 | 김관석 | A toy using blocks |
| CN101213677A (en) * | 2005-05-30 | 2008-07-02 | 奥斯兰姆奥普托半导体有限责任公司 | Housing body and method for production thereof |
| KR101210304B1 (en) * | 2011-06-21 | 2012-12-18 | 박미희 | The modular construction kit of circuit elements |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10178388A (en) * | 1996-11-18 | 1998-06-30 | Internatl Business Mach Corp <Ibm> | Extremely small electronic module with optically and mutually connected structure |
| US6008530A (en) * | 1997-05-29 | 1999-12-28 | Nec Corporation | Polyhedral IC package for making three dimensionally expandable assemblies |
| US20030032246A1 (en) * | 2001-08-09 | 2003-02-13 | Masatake Nagaya | Semiconductor device arrangement and method of fabricating the same |
| KR20060073183A (en) * | 2004-12-24 | 2006-06-28 | 김관석 | A toy using blocks |
| CN101213677A (en) * | 2005-05-30 | 2008-07-02 | 奥斯兰姆奥普托半导体有限责任公司 | Housing body and method for production thereof |
| KR101210304B1 (en) * | 2011-06-21 | 2012-12-18 | 박미희 | The modular construction kit of circuit elements |
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