CN104103533B - Welding method of welding wire - Google Patents
Welding method of welding wire Download PDFInfo
- Publication number
- CN104103533B CN104103533B CN201310130630.6A CN201310130630A CN104103533B CN 104103533 B CN104103533 B CN 104103533B CN 201310130630 A CN201310130630 A CN 201310130630A CN 104103533 B CN104103533 B CN 104103533B
- Authority
- CN
- China
- Prior art keywords
- corner
- weld pad
- soldered ball
- line
- corner regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- 238000005476 soldering Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
Abstract
A method of bonding a wire, comprising: forming a welding wire into a welding ball through a welding pin; welding the solder ball on a solder pad with at least one corner area through the welding pin; and pushing part of the solder ball to the corner area of the solder pad by the soldering pin so as to enlarge the contact area of the solder ball on the solder pad. Therefore, the invention can strengthen the binding force between the solder ball and the solder pad so as to prevent the solder ball from falling off from the solder pad.
Description
Technical field
The present invention relates to a kind of welding method of bonding wire, particularly relate to a kind of to strengthen the adhesion between soldered ball and weld pad
Welding method.
Background technology
Technology with electronic product towards compact trend, and semiconductor technology is maked rapid progress, wafer or half
The spacing of the circuit of conductor device is more and more small so that is followed as the size of the weld pad of import and export (I/O) and is gradually reduced, thus
The circuit of semiconductor package part also moves towards ultra-fine spacing (ultra fine pitch) by thin space (fine pitch).
But, because of the diminution of the size of weld pad, the problem for easily producing the soldered ball or solder joint of bonding wire to be come off from weld pad, with
Cause causes product failure and increases many manufacturing costs.
Fig. 1 is the schematic top plan view for illustrating the contact area A being in the prior art welded in soldered ball 10 on weld pad 11.As schemed
Shown, the soldered ball 10 of such as circle etc is welded on for example square weld pad 11 using bonding wire, and the soldered ball 10 and weld pad 11
Between contact area be A.
Due to the diminution of the size of the weld pad 11, that is, the length L and width W of the weld pad 11 more and more small, so should
The contact area A that soldered ball 10 is welded on the weld pad 11 also diminishes therewith so that the adhesion between the soldered ball 10 and the weld pad 11
Decline, easily cause the soldered ball 10 and come off from the weld pad 11, cause product failure and increase manufacturing cost.
Therefore, above-mentioned problem of the prior art how is overcome, it is real into the problem for desiring most ardently solution at present.
The content of the invention
In view of the disadvantages of above-mentioned prior art, it is a primary object of the present invention to provide a kind of welding side of bonding wire
Method, can strengthen the adhesion between the soldered ball and the weld pad, to prevent the soldered ball from being come off from the weld pad.
The welding method of bonding wire of the invention, including：Bonding wire is formed by soldered ball by capillary；By the capillary by the soldered ball
It is welded in at least weld pad of a corner regions；And the corner region of part soldered ball to the weld pad is elapsed by the capillary
Domain, to expand the soldered ball in the contact area on the weld pad.
From the foregoing, it will be observed that the welding method of bonding wire of the invention, main that the soldered ball passage of part is arrived into weld pad by capillary
An at least corner regions, to increase the contact area between the soldered ball and the weld pad.Thus, the present invention can strengthen the soldered ball and the weldering
Adhesion between pad, to prevent the soldered ball from being come off from the weld pad, and then avoids causing product failure and increasing manufacturing cost.
Brief description of the drawings
Fig. 1 is to illustrate in the prior art by ball bond in the schematic top plan view of the contact area on weld pad；
Fig. 2A is to illustrate the capillary by bonding equipment of the invention by ball bond in the schematic perspective view on weld pad；
Fig. 2 B are to illustrate the present invention according to the welding portion of Fig. 2A to pass through capillary by the ball bond of bonding wire on weld pad
Amplify schematic side view；
Fig. 3 A be according to the line segment SS of Fig. 2 B illustrate the present invention by ball bond in the contact area on weld pad and first to
The schematic top plan view in fourth corner region；
Fig. 3 B be according to Fig. 3 A illustrate soldered ball of the present invention respectively along first and second line passage part to first and
The schematic top plan view of the second corner regions；And
Fig. 3 C be according to Fig. 3 B illustrate the present invention elapse the soldered ball of part to the 3rd respectively along the 3rd and the 4th line and
The schematic top plan view in fourth corner region.
Symbol description
10 soldered balls
11 weld pads
20 bonding equipments
201 welding portions
21 capillaries
211 heads
22 bonding wires
221 ends
222 soldered balls
23 weld pads
231 upper surfaces
241 first corners
242 second corners
243 the third angles fall
244 fourth corners
251 first corner regions
252 second corner regions
253 the third angles are settled in an area domain
254 fourth corner regions
26 central points
271 first lines
272 second lines
273 the 3rd lines
274 the 4th lines
A contacts area
The contacts area of A1 first
The contacts area of A2 second
The contacts area of A3 the 3rd
The contacts area of A4 the 4th
L length
W width
SS line segments
The first angles of θ 1
The second angles of θ 2.
Specific embodiment
Embodiments of the present invention are illustrated below by way of particular specific embodiment, those skilled in the art can be by this explanation
Content disclosed in book understands further advantage of the invention and effect easily.
It should be clear that structure, ratio, size depicted in this specification institute accompanying drawings etc., is only used to coordinate specification to be taken off
The content shown, for understanding and the reading of those skilled in the art, is not limited to enforceable qualifications of the invention, institute
Not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are sent out this is not influenceed
Under bright effect that can be generated and the purpose to be reached, all should still fall obtain what can be covered in disclosed technology contents
In the range of.
Meanwhile, in this specification it is cited such as " on ", " one ", " first ", " second ", " line " and " corner regions "
Term, is also only and is easy to understanding for narration, and is not used to limit enforceable scope of the invention, the change of its relativeness or tune
It is whole, under without essence change technology contents, when being also considered as enforceable category of the invention.
Fig. 2A is the three-dimensional signal that be welded in for soldered ball 222 on weld pad 23 by the capillary 21 for illustrating the present invention by bonding equipment 20
Figure, Fig. 2 B are to illustrate the present invention according to the welding portion 201 of Fig. 2A the soldered ball 222 of bonding wire 22 is welded in into weld pad by capillary 21
Amplification schematic side view on 23.
As shown in Fig. 2A to Fig. 2 B, capillary 21 clamping bonding wire 22 (such as solder, copper cash or the gold thread of bonding equipment 20 are first passed through
Deng), to expose outside head 211 lower section of the end 221 in the capillary 21 of the bonding wire 22, and the end 221 of the bonding wire 22 is leaned on
The upper surface 231 of near or contact pad 23.Then, the end 221 of the bonding wire 22 is sintered to form the soldered ball of such as circle etc
222, and the soldered ball 222 is welded in the upper surface 231 of the weld pad 23 by the capillary 21.
Additionally, as shown in Figure 2 A, after be welded in the soldered ball 222 on the weld pad 23 and solder joint is formed by the capillary 21, can
Being moved along the first line 271, the second line 272, the 3rd line 273 and/or the 4th line 274 by the bonding equipment 20 should
Capillary 21, makes the capillary 21 elapse the first to fourth corner regions at least one of which of part soldered ball 222 to the weld pad 23,
To expand the soldered ball 222 in the contact area on the weld pad 23.
Fig. 3 A be according to the line segment SS of Fig. 2 B illustrate the present invention by soldered ball 222 be welded in contact area A on weld pad 23 and
The schematic top plan view of first to fourth corner regions 251-254, Fig. 3 B be according to Fig. 3 A illustrate the present invention respectively along first with
Second line 271-272 elapses the soldered ball 222 of part to the schematic top plan view of first and second corner regions 251-252, Fig. 3 C
It is to illustrate the present invention according to Fig. 3 B to elapse the soldered ball 222 of part to the 3rd and the respectively along the 3rd and the 4th line 273-274
The schematic top plan view of four corner regions 253-254.
As shown in Figure 3A, the soldered ball 222 is to be welded in the upper surface 231 of the weld pad 23, and the soldered ball 222 and the weld pad 23
Between contact area be A, the central point 26 of the soldered ball 222 can be same as the central point 26 of the upper surface 231 of the weld pad 23.
In the present embodiment, the weld pad 23 is square or rectangular, and with four corner regions, including have respectively
First corner regions 251 and the second corner regions 252 in the first relative corner 241 and the second corner 242 and have respectively
Relative the third angle falls and 243 is settled in an area domain 253 and fourth corner region 254 with the third angle of fourth corner 244.But not as
Limit, in other embodiments, the weld pad 23 or a variety of shapes, or having less than or more than four corner regions
And four corners.It is to be understood that the corner regions that dotted line is illustrated in schema are not limited to its scope or area.
As shown in Figure 3 B, referring to Fig. 2A to Fig. 2 B and Fig. 3 A.When the soldered ball 222 is welded in the weldering by the capillary 21
The upper surface 231 of pad 23 and after forming solder joint, then by the bonding equipment 20 along the soldered ball 222 central point 26 with this first jiao
Fall 241 the first line 271 and/or second line 272 in the central point 26 and second corner 242 moves the capillary 21, make
The capillary 21 elapses first corner regions 251 and/or the second corner regions 252 of part soldered ball 222 to the weld pad 23, to expand
The big soldered ball 222 is in the contact area A on the weld pad 23.
In detail, in the present embodiment, when the weld pad 23 is for square, by taking XY coordinates as an example, X-axis to first line
271 first angle θ 1 is equal to 45 degree, and equal to 225 degree, (45 degree of first angle θ 1 add the angle of X-axis to second line 272
Upper 180 degree)；And when the weld pad 23 is rectangle, first angle θ 1 is more than or less than 45 degree, X-axis to second line 272
Angle be more than or less than 225 degree.The capillary 21 from central point 26 respectively along first line 271 and second line 272,
By the part soldered ball 222, each passage, to first corner regions 251 and second corner regions 252, thus increases by first and connects
Contacting surface accumulates A1 and the second contact area A2, the contact area between the soldered ball 222 and the weld pad 23 is expanded as A+A1+A2.
But, in other embodiments, for example the weld pad 23 only has first corner regions 251 and second corner region
During 252 one of which of domain, the capillary 21 also can be from central point 26 along first line 271 or second line 272, by part
The soldered ball 222 is elapsed to first corner regions 251 or second corner regions 252, thus increase the first contact area A1 or
Second contact area A2, makes the contact area between the soldered ball 222 and the weld pad 23 expand as A+A1 or A+A2.
As shown in Figure 3 C, referring to Fig. 2A to Fig. 2 B and Fig. 3 A to Fig. 3 B.When the capillary 21 elapses the part soldered ball
222 to after first corner regions 251 and/or the second corner regions 252 of the weld pad 23, then by the bonding equipment 20 along the weldering
The central point 26 of ball 222 and the third angle fall 243 the 3rd line 273 and/or the central point 26 and the fourth corner 244
4th line 274 moves the capillary 21, the capillary 21 is elapsed the part soldered ball 222 to the third angle of the weld pad 23 and settles in an area domain
253 and/or fourth corner region 254, to expand the soldered ball 222 in the contact area A on the weld pad 23.
In detail, in the present embodiment, when the weld pad 23 is for square, by taking XY coordinates as an example, X-axis to the 3rd line
273 second angle θ 2 is equal to 135 degree, and the angle of X-axis to the 4th line 274 is equal to 315 degree of (135 degree of second angle θ 2
Plus 180 degree).The line in first corner 241 and second corner 242 be orthogonal to the third angle fall 243 with the fourth corner
244 line, that is, first line 271 and second line 272 it is each with the 3rd line 273 and the 4th line 274
From 90 degree of difference, the angle and the second line 272 and the 4th line 274 of the first line 271 of expression and the 3rd line 273
Angle is 90 degree.
And when the weld pad 23 is rectangle, second angle θ 2 is more than or less than 135 degree, X-axis to the 4th line 274
Angle be more than or less than 315 degree；First corner 241 is not orthogonal to the third angle then and falls with the line in second corner 242
243 with the line of the fourth corner 244, that is, first line 271 and second line 272 and the 3rd line 273 and
4th line 274 is each differed by more than or less than 90 degree, represents angle, the Yi Ji of the first line 272 and the 3rd line 273
It is 90 degree that the angle of two lines 272 and the 4th line 274 is non-.
The capillary 21 from central point 26 respectively along the 3rd line 273 and the 4th line 274, by the part soldered ball
222 each passage to the third angles settle in an area domain 253 and the fourth corner region 254, thus increase the 3rd contact area A3 and the
Four contact area A4, make the contact area between the soldered ball 222 and the weld pad 23 expand as A+A1+A2+A3+A4.
But, in other embodiments, for example the weld pad 23 only has first corner regions 251 and second corner region
When the one of which of domain 252 and the third angle settle in an area domain 253 with 254 one of which of fourth corner region, the capillary 21 also may be used
From central point 26 along first line 271 or the line 273 of the second line 272 and the 3rd or the 4th line 274,
The part soldered ball 222 is elapsed to first corner regions 251 or second corner regions 252 and the third angle and is settled in an area domain
253 or the fourth corner region 254, thus increase the first contact area A1 or the second contact area A2 and the 3rd contact surface
Product A3 or the 4th contact area A4, makes the contact area between the soldered ball 222 and the weld pad 23 expand as A+A1+A3, A+A1+A4, A
+ A2+A3 or A+A2+A4.
From the foregoing, it will be observed that the welding method of bonding wire of the invention, the soldered ball of part is elapsed to each respectively by capillary mainly
Individual corner regions, to increase the contact area between the soldered ball and the weld pad.Thus, the present invention can strengthen between the soldered ball and the weld pad
Adhesion, to prevent the soldered ball from being come off from the weld pad, and then avoid causing product failure and increasing manufacturing cost.
Above-described embodiment is only used to illustrative principle of the invention and its effect, not for the limitation present invention.Appoint
What those skilled in the art can modify under without prejudice to spirit and scope of the invention to above-described embodiment.Therefore originally
The rights protection scope of invention, should be as listed by claims.
Claims (8)
1. a kind of welding method of bonding wire, it includes：
Bonding wire is formed by soldered ball by capillary；
By the capillary by the ball bond on at least weld pad of a corner regions；And
The soldered ball by the capillary from the weld pad elapses the corner regions of part soldered ball to the weld pad, with by pushing part
The soldered ball is divided to expand the soldered ball in the contact area on the weld pad.
2. the welding method of bonding wire according to claim 1, it is characterised in that the weld pad has the first corner regions and the
Two corner regions, and first corner regions and the second corner regions have the first relative corner and the second corner respectively, should
Capillary passage part soldered ball to first corner regions and second corner regions at least one.
3. the welding method of bonding wire according to claim 1, it is characterised in that the weld pad has the first corner regions and the
Three corner regions, and first corner regions and the third angle settle in an area domain respectively have the first corner fall with the third angle, the capillary
Passage part the soldered ball to first corner regions and the third angle settle in an area domain at least one.
4. the welding method of bonding wire according to claim 3, it is characterised in that the ball bond is formed on the weld pad
Solder joint, the solder joint fall with first corner and the third angle respectively formed line angle be equal to 90 degree.
5. the welding method of bonding wire according to claim 3, it is characterised in that the ball bond is formed on the weld pad
Solder joint, the solder joint fall with first corner and the third angle respectively formed line angle be more than or less than 90 degree.
6. the welding method of bonding wire according to claim 3, it is characterised in that the weld pad also have the second corner regions and
Fourth corner region, and second corner regions and fourth corner region have the second corner and fourth corner, the capillary respectively
Passage part the soldered ball to first corner regions to the fourth corner region at least one.
7. the welding method of bonding wire according to claim 6, it is characterised in that the company in first corner and second corner
Line is orthogonal to the line that the third angle falls with the fourth corner.
8. the welding method of bonding wire according to claim 6, it is characterised in that the company in first corner and second corner
Line is not orthogonal to the line that the third angle falls with the fourth corner.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102112051A TWI487046B (en) | 2013-04-03 | 2013-04-03 | Method of welding a solder wire |
| TW102112051 | 2013-04-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104103533A CN104103533A (en) | 2014-10-15 |
| CN104103533B true CN104103533B (en) | 2017-06-23 |
Family
ID=51671565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310130630.6A Expired - Fee Related CN104103533B (en) | 2013-04-03 | 2013-04-16 | Welding method of welding wire |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104103533B (en) |
| TW (1) | TWI487046B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4925083A (en) * | 1987-02-06 | 1990-05-15 | Emhart Deutschland Gmbh | Ball bonding method and apparatus for performing the method |
| TW483078B (en) * | 2001-05-18 | 2002-04-11 | Taiwan Semiconductor Mfg | Manufacturing method of stitch bond circuit |
| TW200532839A (en) * | 2004-03-18 | 2005-10-01 | United Test Ct Inc | Substrate for solder joint |
| TWM310449U (en) * | 2006-10-25 | 2007-04-21 | Lingsen Precision Ind Ltd | Welding pin for wire welding on integrated circuit |
-
2013
- 2013-04-03 TW TW102112051A patent/TWI487046B/en not_active IP Right Cessation
- 2013-04-16 CN CN201310130630.6A patent/CN104103533B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4925083A (en) * | 1987-02-06 | 1990-05-15 | Emhart Deutschland Gmbh | Ball bonding method and apparatus for performing the method |
| TW483078B (en) * | 2001-05-18 | 2002-04-11 | Taiwan Semiconductor Mfg | Manufacturing method of stitch bond circuit |
| TW200532839A (en) * | 2004-03-18 | 2005-10-01 | United Test Ct Inc | Substrate for solder joint |
| TWM310449U (en) * | 2006-10-25 | 2007-04-21 | Lingsen Precision Ind Ltd | Welding pin for wire welding on integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201440150A (en) | 2014-10-16 |
| TWI487046B (en) | 2015-06-01 |
| CN104103533A (en) | 2014-10-15 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
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| CF01 | Termination of patent right due to non-payment of annual fee |