CN104064661A - Illuminating Device With Semiconductor Light Device - Google Patents
Illuminating Device With Semiconductor Light Device Download PDFInfo
- Publication number
- CN104064661A CN104064661A CN201310729407.3A CN201310729407A CN104064661A CN 104064661 A CN104064661 A CN 104064661A CN 201310729407 A CN201310729407 A CN 201310729407A CN 104064661 A CN104064661 A CN 104064661A
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- CN
- China
- Prior art keywords
- light
- semiconductor light
- emitting elements
- diffusion
- basic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The invention provides an illuminating device with a semiconductor light device and without light diffusion components separted from a bsae component supporting a light element of a semiconductor, light of the light element of the semiconductor can be diffused. The illuminating device with the semiconductor light device comprises a base component (14), a first conducting component (20) and a second conducting component (21), a semiconductor light element (31) on the surface of the base part and connected with the fist and second conducting components, diffusing part of the light and transparent components (35, 39) on the surface of the base part and covering the semiconductor light component and a diffusion film (43) formed in the surface of the transparent components, wherein the first and second conducting components are arranged on the surface of the base component and electrically connected with a power supply; the first and second conducting components are separted; and illuminating light emitted by the semiconductor light component can be diffused and passes through the transparent components.
Description
Technical field
The present invention relates to the ligthing paraphernalia that one possesses semiconductor light-emitting elements (LED).
Background technology
As the conventional example of ligthing paraphernalia of utilizing semiconductor light-emitting elements (LED), for example, there is the disclosed ligthing paraphernalia of patent documentation 1.
This ligthing paraphernalia possesses: basic components that insulating properties material forms, be fixed on the contact of basic components and be fixed on the LED unit of basic components.LED unit possesses the substrate and the LED(semiconductor light-emitting elements that is installed on this substrate with contact conducting integratedly), LED is exposed to outside by the window that exposes that is formed at basic components.Because contact is connected with power supply by cable, therefore, in the time that the electric power of power generation is supplied to LED by cable and contact, LED is luminous.
With regard to the light producing with regard to LED, due near brightness centrality LED uprise, therefore, way is all the time, in above-mentioned ligthing paraphernalia, diffusion eyeglass is installed on to basic components, and the light that LED produces is spread by diffusion eyeglass.
But be only difficult to make the light of LED generation to spread fully with existing diffusion eyeglass, easily produce brightness disproportionation or irregular colour.Therefore, way is all the time, in the dead ahead of diffusion eyeglass, to configure the flat diffuser plate (LSD) (patent documentation 2) separating with diffusion eyeglass (and basic components).Owing to utilizing the words of diffuser plate can make the light penetrating from each LED spread fully (can make the disperse state homogenization more of light), also can obtain enough brightness even if therefore reduce the quantity of LED.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2012-164613 communique
Patent documentation 2: TOHKEMY 2008-241987 communique
Summary of the invention
(problem that invention will solve)
In recent years, strong request was provided with electronic equipment (for example liquid crystal display) lightening of ligthing paraphernalia.In addition, for display etc., be also hopeful to reduce the market demand of brightness disproportionation.
But, for brightness disproportionation is reduced, if with the state configuration diffuser plate that separates of diffusion eyeglass (and basic components), because the thickness of the ligthing paraphernalia entirety that basic components, LED unit, diffusion eyeglass and diffuser plate are possessed as inscape becomes large, therefore can not meet this requirement.
In addition, if the quantity of attempting by diffuser plate or increase LED are set reduces brightness disproportionation, the number of components of ligthing paraphernalia will become many so, causes manufacturing cost to rise.
The object of the present invention is to provide a kind of ligthing paraphernalia that possesses semiconductor light-emitting elements, without using the light diffusing member separating with the basic components of support semiconductor light-emitting component, and the light that can make semiconductor light-emitting elements produce fully spreads.
(technical scheme of technical solution problem)
The ligthing paraphernalia that possesses semiconductor light-emitting elements of the present invention, is characterized in that possessing: basic components; The first conductive component and the second conductive component, be formed at the surface of these basic components, can both and be separated from each other with power sourced electric conducting; Semiconductor light-emitting elements, is installed on the surface of described basic components, can with described the first conductive component and described the second conductive component electrically conducting; Light transparent member, is installed on the surface of described basic components, covers described semiconductor light-emitting elements, and the illumination light that described semiconductor light-emitting elements sends sees through this light transparent member in diffusion; Diffusion barrier, is formed at the surface of this light transparent member, when making the part diffusion of illumination light, it is seen through.
Described light transparent member also can for the surface at described basic components and and described semiconductor light-emitting elements between form the light transmission cap assembly in space.
Also described semiconductor light-emitting elements can be fixed on to the bottom surface of the surperficial recess that is formed at described basic components, the encapsulant of light transmission be arranged to the bottom surface of described recess.
(effect of invention)
Ligthing paraphernalia of the present invention, for the basic components that are fixed with semiconductor light-emitting elements, the light transparent member that the illumination light that installation semiconductor light-emitting elements sends can see through in diffusion, and form diffusion barrier on the surface of light transparent member.
Therefore, the illumination light that semiconductor light-emitting elements produces, after being diffused by light transparent member, is further diffused by diffusion barrier.Therefore, without the light diffusing member separating with basic components is set, and can make illumination light spread fully.
Therefore can reduce the semiconductor light-emitting elements that is arranged at ligthing paraphernalia.
In addition, owing to not needing to arrange light diffusing member, therefore can reduce the quantity of the parts of ligthing paraphernalia, reduce manufacturing cost.
In addition, owing to not needing that the light diffusing member separating with basic components is set, therefore can reduce the thickness of ligthing paraphernalia entirety.
Brief description of the drawings
Fig. 1 be the ligthing paraphernalia of one embodiment of the present invention omission light transmission cap assembly and bonding wire and the stereogram of observing from top that illustrates.
Fig. 2 is the vertical view that cuts off the conduction panel before processing.
Fig. 3 be ligthing paraphernalia omission light transmission cap assembly and the vertical view that illustrates.
Fig. 4 is the sectional view along the IV-IV arrow line of Fig. 1.
Fig. 5 is the stereogram of base and the ligthing paraphernalia that is fixed on base.
Fig. 6 is the sectional view of the central portion of light transmission cap assembly.
Fig. 7 is vertical view when ligthing paraphernalia is fixed on to base and the connector of the cable with connector is connected in to ligthing paraphernalia.
Fig. 8 is the pattern vertical view that has omitted the ligthing paraphernalia of illustrated Fig. 7 of light transmission cover and base.
Symbol description
10 ligthing paraphernalias
11 radiators
12 upper end protuberances (recess)
14 resin portion (basic components)
15 circular depressions (recess)
16 circular through holes
17 connection recesses
18 connecting holes
19 conduction panels
20 first conductive components
The 20A connecting portion that connects up
20B cable connecting portion
21 second conductive components
The 21A connecting portion that connects up
21B cable connecting portion
22A22B bracket part
23 bracket connecting portions
24 first cut off bridger
25 second cut off bridger
26 the 3rd cut off bridger
28 reflectance coatings
29 LED fixed parts
31 LED(semiconductor light-emitting elements)
33 bonding wires
35 encapsulants (light transparent member)
37 bases
39 light transmission cap assemblies (light transparent member)
40 diffusion eyeglasses
41 teats
42 connection teats
43 diffusion barriers
45 cables with connector
46 cables
47 electric wires
48 cover pipe
49 connectors
50 insulators.
Embodiment
Below, with reference to accompanying drawing, one embodiment of the present invention is described.And below all around in explanation and upper and lower direction are taking the direction of the arrow in scheming as benchmark.
The ligthing paraphernalia 10 of present embodiment possesses radiator 11 and is integrally formed in the resin portion 14(basic components on the top of radiator 11).
Radiator 11 is the integrally formed product that are made up of the metal of aluminium etc., its thermal conductivity ratio resin portion 14 height.Be equipped with the upper end protuberance 12 of low dimensional cylindrical shape (low cun of Yen post shapes) on the top of radiator 11, above upper end protuberance 12, formed by plane.
Overlook and be such as roughly square resin portion 14, by insulating properties and high resin material (liquid crystal polymer etc.) formation of thermal endurance.Above resin portion 14, be formed with and overlook as circular circular depressions 15, be formed with in the bottom surface of circular depressions 15 overlook into circular and with the circular through hole 16 of upper end protuberance 12 same diameter.What as shown in Figure 4, the upper end protuberance 12 of radiator 11 was embedded in the inner face of circular through hole 16(circular depressions 15 of resin portion 14 and upper end protuberance 12 is equivalent to " recess " in technical solution of the present invention above).Two bights on the diagonal that is positioned at resin portion 14 are concaved with and connect with recess 17.In addition, above resin portion 14, be formed with four connecting holes 18.
Ligthing paraphernalia 10 possesses and the inside of resin portion 14 and the integrated metal parts in surface of resin portion 14.This metal parts is that the metal plate stamping pressing formation of the conductivity of such as brass, beryllium copper, corson alloy (コ Le ソ ン Xi Copper alloy) etc., heat conductivity, excellent rigidity is formed.
This metal parts possesses each two the first conductive components 20 and the second conductive component 21.The first conductive component 20 possesses circular-arc wiring connecting portion 20A and the cable connecting portion 20B being connected with wiring connecting portion 20A.In addition, the second conductive component 21 possesses the wiring connecting portion 21A of circular-arc (with wiring connecting portion 20A same shape) and the cable connecting portion 21B being connected with wiring connecting portion 21A.As shown in the figure, wiring connecting portion 20A, 21A, expose on the surface (bottom surface of circular depressions 15) of resin portion 14, and cable connecting portion 20B, 21B are connecting with exposing on the surface of recess 17.
This first conductive component 20 and the second conductive component 21 stage before ligthing paraphernalia 10 is manufactured forms respectively a part for a conduction panel 19.Conduction panel 19 is the shape shown in Fig. 2, and its global shape is the long size tabular (Fig. 1 only illustrates a part for conduction panel 19) of extending along fore-and-aft direction.The left and right sides portion of conduction panel 19 is made up of the bracket part 22A extending along fore-and-aft direction, 22B, in many places, bracket part 22A and bracket part 22B is connected to each other with the bracket connecting portion 23 uniformly-spaced arranging at fore-and-aft direction.In addition, two the first conductive components 20 all pass through two first, and to cut off bridge parts 24 integrated with bracket part 22A, 22B and bracket connecting portion 23 respectively, two the second conductive components 21 all pass through one second cut off bridge part 25 and bracket connecting portion 23 integrated.In addition, the first conductive component 20 of adjacency and the second conductive component 21 interconnect by one the 3rd cut-out bridge part 26.
Resin portion 14 is integrated through shaping stroke and the radiator 11 of twice.In the time that the shaping stroke of first stage of resin portion 14 completes, the perfect aspect of conduction panel 19 and the first stage of resin portion 14() integrated.After the primary shaping stroke of resin portion 14 completes, when cutting off bridger 24, second by first of conduction panel 19 and cut off bridger 25 and the 3rd and cut off bridger 26 while cutting off by omitting illustrated shearing device, with the perfect aspect of first stage of resin portion 14() integrated the first conductive component 20 and the second conductive component 21 become the state being separated from each other.
On upper end protuberance 12, the bottom surface (being positioned at the position of the ring-type of the outer circumferential side of upper end protuberance 12) of circular depressions 15 and the inner peripheral surface (annular wall of conical in shape) of circular depressions 15, by pad printer (diagram omit), with form (continuously) printing reflectance coating 28 integratedly of the film of 30 μ m thickness.Reflectance coating 28, in the polyurethane resin as main component, has mixed titanium oxide (TiO2) as colouring agent etc., and entirety has insulating properties.Reflectance coating 28, owing to containing colouring agent, therefore be white, different from radiator 11 colors (tone) that formed by aluminium, its (light) visible reflectance is than radiator 11 and resin portion 14 height (particularly, use visible reflectance to be more than 90%, preferably use more than 95% reflectance coating).Be formed in addition the reflectance coating 28 above of upper end protuberance 12, form with the pattern of a part above of avoiding upper end protuberance 12.That is to say, as shown in the figure, on upper end protuberance 12, multiple to avoid (amounting to 36) overlook the pattern formation into the region of rectangle.Respectively overlook as the region of rectangle forms respectively LED fixed part 29, reflectance coating 28 above and between LED fixed part 29, produce the difference in height of the thickness that is equivalent to reflectance coating 28.
Be fixed with the roughly LED31(semiconductor light-emitting elements of rectangular shape in each LED support portion 29).As shown in the figure, the flat shape of each LED31 and LED fixed part 29 roughly the same (than LED fixed part 29 undersized).When for LED fixed part 29 fixed L ED31, first bonding agent (diagram omit) is applied in each LED fixed part 29(upper end protuberance 12 above), then omit illustrated LED conveyer LED31 loaded in each LED fixed part 29.As mentioned above, due on reflectance coating 28 and produced the difference in height (because LED fixed part 29 becomes the recess being surrounded by reflectance coating 28) of the thickness that is equivalent to reflectance coating 28 between LED fixed part 29, therefore can simply and accurately LED31 be installed to (chimeric) in each LED fixed part 29.In addition, due on reflectance coating 28 and produced the difference in height of the thickness that is equivalent to reflectance coating 28 between LED fixed part 29, therefore can suppress to be applied in LED fixed part 29(upper end protuberance 12 above) bonding agent flow to surrounding's (reflectance coating 28 sides) of LED fixed part 29.In addition, above-mentioned LED conveyer has the inductor of identification hue difference, and above-mentioned LED conveyer, in the hue difference (boundary line) between perception reflex film 28 and LED fixed part 29, loads LED31 in LED fixed part 29.Therefore, LED31 correctly can be loaded in LED fixed part 29.
Be exposed to adjacent LED31 above and the terminal forming (diagram is omitted), each other by the thick line shown in bonding wire 33(Fig. 3) connect, and when the terminal that is positioned at the LED31 of the position relative with wiring connecting portion 20A connects by bonding wire 33 with wiring connecting portion 20A, the terminal and the wiring connecting portion 21A that are positioned at the LED31 of the position relative with wiring connecting portion 21A connect by bonding wire 33.In addition the wiring connecting portion 20A of front side and the wiring connecting portion 21A of rear side are connected by bonding wire 33, and the wiring connecting portion 20A of rear side and the wiring connecting portion 21A of front side are also connected by bonding wire 33.
In addition, in the circular depressions 15 of resin portion 14, be provided with the sealant 35(light transparent member being formed by thermoset resin material or the uv curing resin material etc. with light transmission and insulating properties), will connect up connecting portion 20A, wiring connecting portion 21A, reflectance coating 28, LED31 and bonding wire 33 of sealant 35 covers.As shown in Figure 4, because the surface of sealant 35 consists of curved surface (sphere or aspheric surface), therefore sealant 35 can be brought into play lens function (diffusion function of light).
Ligthing paraphernalia 10, possess can dismounting with respect to resin portion 14 light transmission cap assembly 39(light transparent member).Light transmission cap assembly 39 is made up of translucent material, and be the hollow part of lower aperture, possess integratedly: roughly hemispheric diffusion eyeglass 40(is with reference to Fig. 6), from the bottom of diffusion eyeglass 40 four teats 41 outstanding to side and four projections 42 for connection that project respectively below teat 41.In addition, in the surface of diffusion eyeglass 40 (above), be coated with diffusion barrier 43 by bat printing (or silk screen printing or ink jet printing also can).Diffusion barrier 43 be polyurethane resin using light transmission as main component, and mixed oxidization titanium (TiO2) etc. forms in this polyurethane resin, its thickness is the tens of μ m of number μ m-.
Light transmission cap assembly 39, by with respect to carrying out chimericly with connecting hole 18 corresponding to projection 42 with four connections, can install removably with respect to resin portion 14.
Below the radiator 11 of ligthing paraphernalia 10, be fixed on the base 37 that formed by metallic plate above.
The cable 45 with connector that can dismounting with respect to ligthing paraphernalia 10, by two cables 46 and the integrated formation of connector 49.Have flexual cable 46, possess the electric wire 47 that the many wires of boundling form and the covering pipe 48 being made up of the surperficial insulating material that covers electric wire 47, the two ends of each cable 46 cover pipe 48 electric wire 47 are exposed by removing.Connector 49 has insulator 50 and the first contact and the second contact (diagram is omitted) that insulating material forms.The first contact and the second contact are to be all made up of conductive material (metal etc.), insert the inner space of insulator 50 with stationary state.In the first contact and one end of the second contact respectively crimping (connection) have an end of two wires 47.
As shown in Figure 7, at a recess 17 for connection of ligthing paraphernalia 10, can connect removably the connector 49 with the cable 45 of connector.In the time that connector 49 is connected in connection recess 17, the first contact and the second contact be contact cable taking connecting portion 20B and cable connecting portion 21B respectively.Should be connected to two cables 46 of the cable 45 of connector anode and the negative electrode of power supply.
In the time that the illustrated mains switch of omission switches to ON by OFF, due to the electric current of power generation, flow to the parallel circuits being formed by the first conductive component 20, the second conductive component 21, LED31 and bonding wire 33 via cable 46, therefore each LED31(is in Fig. 8, gather the whole LED that compares the central part of ligthing paraphernalia 10 and be positioned at left side and represent with LED31A, gather the whole LED31 that compares this central part and be positioned at right side and represent with LED31B) luminous.In addition, when above-mentioned mains switch switches to OFF by ON, because electric current is cut off to the supply of LED31, therefore each LED31 turns off the light.
A part for the illumination light that each LED31 penetrates, spreads directive encapsulant 35 sides when remaining illumination light reflects by reflectance coating 28 by encapsulant 35 when seeing through encapsulant 35.See through illumination light directive diffusion eyeglass 40 sides of encapsulant 35.When a part for the illumination light of directive diffusion eyeglass 40 spreads by diffusion eyeglass 40, the outside of directive diffusion eyeglass 40, remaining illumination light reflects (further, passing through the eyeglass of directive diffusion once again 40 sides after encapsulant 35 or reflectance coating 28 reflections) to the inside by diffusion eyeglass 40.A part for the illumination light of advancing on one side to the diffuse outside of diffusion eyeglass 40 on one side, when diffusion by diffusion barrier 43, the outside of directive diffusion barrier 43.In addition, the remaining illumination light of advancing on one side to the diffuse outside of diffusion eyeglass 40 on one side, by diffusion barrier 43(and diffusion eyeglass 40) reflection to the inside (and after by reflectance coating 28, encapsulant 35,40 reflections of diffusion eyeglass once again directive diffusion barrier 43 sides).
So, the illumination light penetrating from each LED31, by diffusion fully (and reflection), forms the very luminous intensity distribution state of homogeneous (brightness disproportionation or irregular colour tail off) by encapsulant 35, diffusion eyeglass 40 and diffusion barrier 43.Thereby, without with resin portion 14(and radiator 11) (upward) position of separating arranges light diffusing member (for example diffuser plate (LSD)), can make fully illumination light diffusion.
Therefore can reduce the quantity of the LED31 that is arranged at ligthing paraphernalia 10.
In addition, owing to there is no need to arrange and resin portion 14(and radiator 11) light diffusing member that separates, therefore can make the overall thickness (size up and down) of ligthing paraphernalia 10 diminish.
In addition, owing to there is no need to arrange and resin portion 14(and radiator 11) light diffusing member that separates, therefore can reduce the quantity of the parts of ligthing paraphernalia 10, reduction manufacturing cost.
In addition, due to the heat of each LED31 generation, conduct to radiator 11 and from the Lower Half of radiator 11 (do not covered by resin portion 14 and expose part) heat release via reflectance coating 28, simultaneously, owing to carrying out heat release from base 37 from radiator 11 conducts to base 37, therefore can make the heat of LED31 efficiently to outside heat release.Therefore can prevent the reduction of the luminous efficiency of the LED31 being caused by high temperature.In addition, owing to the many large-scale LED elements of caloric value can being used as LED31, therefore can make light quantity increase.
Above, describe the present invention based on the respective embodiments described above, but the present invention is not limited to above-mentioned execution mode, can takes various distortion to implement.
For example, the surface that can make to spread eyeglass 40 is on the basis of asperities (having trickle concavo-convex face), forms diffusion barrier 43 on the surface of diffusion eyeglass 40.Like this, diffusion barrier 43 is more stable with respect to the surperficial formation state (tightlock status) of diffusion eyeglass 40.In addition, due to the surperficial trickle concavo-convex of diffusion eyeglass 40 and corresponding diffusion barrier 43 inner faces trickle concavo-convex with it, can bring into play the function of diffusion and indirect illumination light, therefore can make the more homogeneous of luminous intensity distribution state of illumination light.
The inside (below) that also can make to spread in addition eyeglass 40 is asperities (having trickle concavo-convex face).Also can make in this case the more homogeneous of luminous intensity distribution state of illumination light.
In addition, also can the surface of encapsulant 35 (above) form diffusion barrier 43.The encapsulant 35 forming by this way, can bring into play the diffusion eyeglass 40(light transmission cap assembly 39 that is formed with diffusion barrier 43 with surface) identical technique effect.
In addition, the surface at encapsulant 35 like this (above) form diffusion barrier 43, both can form diffusion barrier 43 on the surface of light transmission cap assembly 39, also can not form.In addition, in the case of the surface of encapsulant 35 (above) form diffusion barrier 43, also light transmission cap assembly 39 can be omitted.
In addition, at diffusion eyeglass 40(light transmission cap assembly 39) surface form diffusion barrier 43, also encapsulant 35 can be omitted.
In addition, change the wiring connecting portion 20A of adjacency and the connected mode of passing through bonding wire 33 connecting up between connecting portion 21A by above-mentioned mode, thereby, the circuit being made up of can be become to the mode different from above-mentioned parallel circuits the first conductive component 20, the second conductive component 21, LED31 and bonding wire 33.In addition also can, by there is the cable 45 with connector of connector 49 at two ends, multiple ligthing paraphernalias 10 be connected to each other.
In addition, also can between radiator 11 and base 37, insert the sheet material of thermal conductivity or the bonding agent of thermal conductivity.
Claims (3)
1. a ligthing paraphernalia that possesses semiconductor light-emitting elements, is characterized in that, possesses:
Basic components;
The first conductive component and the second conductive component, be formed at the surface of these basic components, can both and be separated from each other with power sourced electric conducting;
Semiconductor light-emitting elements, is installed on the surface of described basic components, can with described the first conductive component and described the second conductive component electrically conducting;
Light transparent member, is installed on the surface of described basic components, covers described semiconductor light-emitting elements, and the illumination light that described semiconductor light-emitting elements sends sees through this light transparent member in diffusion;
Diffusion barrier, is formed at the surface of this light transparent member, when making the part diffusion of described illumination light, it is seen through.
2. the ligthing paraphernalia that possesses semiconductor light-emitting elements according to claim 1, is characterized in that,
Described light transparent member be the surface of described basic components and and described semiconductor light-emitting elements between form the light transmission cap assembly in space.
3. the ligthing paraphernalia that possesses semiconductor light-emitting elements according to claim 1 and 2, is characterized in that,
Described semiconductor light-emitting elements is fixed on to the bottom surface of the surperficial recess that is formed at described basic components,
The encapsulant of light transmission is arranged to the bottom surface of described recess.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013055997A JP5904671B2 (en) | 2013-03-19 | 2013-03-19 | Luminaire provided with semiconductor light emitting device |
| JP2013-055997 | 2013-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104064661A true CN104064661A (en) | 2014-09-24 |
Family
ID=51552285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310729407.3A Pending CN104064661A (en) | 2013-03-19 | 2013-12-26 | Illuminating Device With Semiconductor Light Device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5904671B2 (en) |
| KR (1) | KR20140114724A (en) |
| CN (1) | CN104064661A (en) |
| TW (1) | TWI580901B (en) |
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| US20120020083A1 (en) * | 2009-04-02 | 2012-01-26 | Koninklijke Philips Electronics N.V. | Reflector with mixing chamber |
| US10546846B2 (en) * | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
| US8587011B2 (en) * | 2010-12-28 | 2013-11-19 | Panasonic Corporation | Light-emitting device, light-emitting module, and lamp |
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2013
- 2013-03-19 JP JP2013055997A patent/JP5904671B2/en not_active Expired - Fee Related
- 2013-08-05 KR KR1020130092366A patent/KR20140114724A/en not_active Application Discontinuation
- 2013-10-23 TW TW102138204A patent/TWI580901B/en not_active IP Right Cessation
- 2013-12-26 CN CN201310729407.3A patent/CN104064661A/en active Pending
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| CN1881635A (en) * | 1999-04-22 | 2006-12-20 | 奥斯兰姆奥普托半导体股份有限两合公司 | Led light source with lens |
| US20050269587A1 (en) * | 2004-06-04 | 2005-12-08 | Loh Ban P | Power light emitting die package with reflecting lens and the method of making the same |
| US20090283779A1 (en) * | 2007-06-14 | 2009-11-19 | Cree, Inc. | Light source with near field mixing |
| JP2009218434A (en) * | 2008-03-11 | 2009-09-24 | Sharp Corp | Optical space transmission device |
| CN102113119A (en) * | 2008-05-29 | 2011-06-29 | 克利公司 | Light source with near field mixing |
| CN101661979A (en) * | 2008-08-28 | 2010-03-03 | 采钰科技股份有限公司 | Semiconductor device and method for fabricating same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201437557A (en) | 2014-10-01 |
| JP2014182908A (en) | 2014-09-29 |
| KR20140114724A (en) | 2014-09-29 |
| TWI580901B (en) | 2017-05-01 |
| JP5904671B2 (en) | 2016-04-20 |
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