CN104048183A

CN104048183A - Lighting device

Info

Publication number: CN104048183A
Application number: CN201310079133.8A
Authority: CN
Inventors: 沈育浓
Original assignee: CHANGCHUNTENG HOLDING Co Ltd
Current assignee: CHANGCHUNTENG HOLDING Co Ltd
Priority date: 2013-03-13
Filing date: 2013-03-13
Publication date: 2014-09-17

Abstract

The invention relates to a lighting device. The lighting device comprises a body, a light source module and a light transmissible shell, wherein the body is provided with a standard metallic lamp base which is connected to the lower end part of the body; the light source module comprises a light-emitting diode (LED) wafer array, a fluorescent powder layer and a pair of conductive wires, wherein the LED wafer array is formed through connecting a plurality of LED wafers together in series, the fluorescent powder layer is used for coating the LED wafers, and the conductive wires are electrically connected with the LED wafers, so as to supply power to the LED wafers; the light transmissible shell is connected to the upper end part of the body and can cover the LED wafers.

Description

Ligthing paraphernalia

Technical field

The present invention relates to a kind of ligthing paraphernalia.

Background technology

In lighting field, tradition is to take incandescent lamp bulb as large.Yet under the front topic of energy-conservation and environmental protection, incandescent lamp bulb is day by day replaced by LED bulb.Yet current LED bulb is luminous for 180 degree mostly, its brightness, light shape and traditional incandescent lamp bulb differ greatly, and not liked by consumer.

In addition, current LED bulb on the market still has deficiency aspect heat radiation, causes the problem of the lost of life.

In view of this, this case inventor is then engaged in the many years of experience of the sector with it, and in line with excelsior spirit, active research improvement, has the present invention's " a kind of ligthing paraphernalia of super brightness " to produce then.

Summary of the invention

According to a feature of the present invention, a kind of ligthing paraphernalia is provided, this ligthing paraphernalia comprises: a body, and this body has a base portion, a upwardly extending heat-conducting part in the top from this base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section; At least one metal bar, this metal bar from the base portion of this body extend up to heat-conducting part by this body so that one end projection of this metal bar in the tip exterior of this heat-conducting part, the end of the projection of this metal bar in one end of the tip exterior of this heat-conducting part is partly shaped to rectangular shape to have the mounting surface of five general planar; One light source module, this light source module comprises that five loading plate and several each in a corresponding mounting surface that is respectively installed on this metal bar are installed on a pair of LED wafer array of answering on loading plate operationally; And one the base portion that is set in this body with can be light source module and the coated light transmitting shell in the inner of heat-conducting part.

According to another characteristic of the invention, a kind of ligthing paraphernalia is provided, this ligthing paraphernalia comprises: a body, and this body has a base portion, a upwardly extending heat-conducting part in the top from this base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section, at least one metal bar, this metal bar from the base portion of this body extend up to heat-conducting part by this body so that one end projection of this metal bar in the tip exterior of this heat-conducting part, the projection of this metal bar has partly been formed a perforation at the end of this one end of the tip exterior of this heat-conducting part, one light source module, this light source module comprises a high heat conduction loading plate with a wafer mounting surface of being made by transparent high heat sink material, this loading plate is installed to the end part that is formed with this perforation of this metal bar, one is arranged on the LED wafer array being formed by several LED wafers in the wafer mounting surface of this loading plate operationally, LED wafer on this loading plate exposes to the open air via this perforation, partly make to cover the wafer mounting surface of this loading plate and the back side relative with this wafer mounting surface can cover these LED wafers with the end of coated this metal bar, this photic zone is to form with the insulation light transmissive material doped with phosphor powder, and one the base portion that is set in this body with can be light source module and the coated light transmitting shell in the inner of heat-conducting part.

According to another feature again of the present invention, a kind of ligthing paraphernalia is provided, this ligthing paraphernalia comprises: a body, and this body has a base portion, a upwardly extending heat-conducting part in the top from this base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section; One base portion from this body extends up to by the metal bar of the heat-conducting part of this body, and one end projection of this metal bar is outside at the heat-conducting part of this body; One light source module, this light source module comprises a loading plate with a wafer mounting surface being supported by this metal bar, and a LED wafer array being installed on operationally in the wafer mounting surface of this loading plate; And one the base portion that is set in this body with can be light source module and the coated light transmitting shell in the inner of heat-conducting part.

According to another feature more of the present invention, a kind of ligthing paraphernalia is provided, this ligthing paraphernalia comprises: a body, and this body has a base portion, a upwardly extending heat-conducting part in the top from this base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section; One base portion from this body extends up to by the metal bar of the heat-conducting part of this body, and one end projection of this metal bar is outside at the heat-conducting part of this body; One light source module, this light source module comprises that one is installed on the LED wafer array that cuts into predetermined array when wafer cuts of the top part of this metal bar operationally; And one the base portion that is set in this body with can be light source module and the coated light transmitting shell in the inner of heat-conducting part.

According to a separately feature more of the present invention, a kind of ligthing paraphernalia is provided, this ligthing paraphernalia comprises: a body, and this body has a base portion, a upwardly extending heat-conducting part in the top from this base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section, one cooling device, this cooling device comprises the radially venthole and being communicated with atmosphere that a radially blowhole, being communicated with atmosphere that is formed at the base portion of this body is formed at the base portion of this body and is formed at the base portion of this body and the accommodating axial passage of piston being communicated with this blowhole and this venthole, and this cooling device more comprises one and can axially movably be placed in the perforation and that piston, in this axial passage is formed at the heat-conducting part of this body and be placed in this passage can guide this piston along the axially movable guide rod of this passage, one light source module, this light source module comprises that one has the projection of one end part the outside and other end is partly positioned at this passage and away from the metal bar of this guide rod at the heat-conducting part of this body, and one is positioned at the projection of this metal bar operationally at the LED Chips for Communication array of end part of the heat-conducting part outside of this body, and one the base portion that is set in this body with can be light source module and the coated light transmitting shell in the inner of heat-conducting part, by this, when the running of this LED Chips for Communication array and this piston are positioned at the ready position near this other end part of this metal bar, the heat producing because of the running of LED Chips for Communication array is transmitted in this passage via metal bar, now hot-air makes piston move towards the other end of the location guide of passage, at the same time, outside cold air enters body interior via blowhole and hot-air in the enclosure enters body interior via one of them perforation, these gases are because the valve at top land is opened by guide rod and is expelled to body exterior by piston and via venthole, after gas is expelled to body exterior, piston is got back to this ready position again.

According to another characteristic of the invention, a kind of ligthing paraphernalia is provided, this ligthing paraphernalia comprises: a body, and this body has a base portion, a upwardly extending heat-conducting part in the top from this base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section; One cooling device, this cooling device comprises the radially venthole and being communicated with atmosphere that a radially blowhole, being communicated with atmosphere that is formed at the base portion of this body is formed at the base portion of this body and is formed at the base portion of this body and the accommodating axial passage of piston being communicated with this blowhole and this venthole, and this cooling device more comprises one and is placed in the perforation that fan and in this passage is formed at the heat-conducting part of this body; One is positioned at the projection of this metal bar operationally at the LED Chips for Communication array of end part of the heat-conducting part outside of this body; And one the base portion that is set in this body with can be light source module and the coated light transmitting shell in the inner of heat-conducting part, when the running of this fan, cold air enters body interior and a part of cold air enters in shell and from being positioned at the through hole admission passage of the opposite side of heat-conducting part and by venthole, discharges body exterior again from perforation from blowhole.

According to another feature again of the present invention, a kind of ligthing paraphernalia is provided, this ligthing paraphernalia comprises: a body, and this body has a base portion, a upwardly extending heat-conducting part in the top from this base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section; One light source module, this light source module comprises a flexible substrate and several LED Chips for Communication being installed on operationally on this substrate, and this flexible substrate attaches to the heat-conducting part of this body so that be all provided with LED Chips for Communication on each surface of the end part of this heat-conducting part; And one the base portion that is set in this body with can be light source module and the coated light transmitting shell in the inner of heat-conducting part.

According to another feature more of the present invention, a kind of ligthing paraphernalia is provided, and this lighting device comprises: a body, and this body has one and is connected to this body lower end standard light fixture metab partly; One light source module, this light source module comprises the fluorescent bisque of a LED Chips for Communication array being formed by several LED Chips for Communication that are connected in series together, coated these LED Chips for Communication and is a pair ofly electrically connected can supply the conductor wire of these LED Chips for Communication electric power with these LED Chips for Communication; And one the upper end part that is connected to this body with can be the coated light transmitting shell in the inner of these LED Chips for Communication.

According to a feature more of the present invention, a kind of ligthing paraphernalia is provided, and this ligthing paraphernalia comprises: a body, and this body has one and is connected to this body lower end standard light fixture metab partly; One light source module, this light source module comprises on a transparent substrates that is laid with the circuit tracks surface of predetermining circuit track, several surface that is installed on operationally this substrate with the fluorescent bisque of LED Chips for Communication, coated these LED Chips for Communication and this substrate of circuit trace electrical connection that can be corresponding with these and is a pair ofly electrically connected can supply the conductor wire of these LED Chips for Communication electric power with the corresponding circuit trace of this substrate; And one the upper end part that is connected to this body with can be the coated light transmitting shell in the inner of these LED Chips for Communication.

According to another feature more of the present invention, a kind of ligthing paraphernalia is provided, and this ligthing paraphernalia comprises: a body, one is connected to the standard light fixture metab of this body, one light source module, this light source module comprises the heat pipe of a tool conduction and thermal conductivity, one substrate, several lip-deep LED Chips for Communication of this transparent substrates that are installed on operationally, cover the fluorescent bisque of these LED Chips for Communication and a pair of and these LED Chips for Communication electrical connection can supply the conductor wire of these LED Chips for Communication electric power, this substrate is installed on the top part of this heat pipe, the bottom of this heat pipe partly extends to this base and is electrically connected with the supply terminals of this base, this is electrically connected to this heat pipe to the one in conductor wire and this is electrically connected to the earth point of this base to the another one in conductor wire, and one be connected to this body with can be the coated light transmitting shell in the inner of these LED Chips for Communication.

According to another characteristic of the invention, a kind of ligthing paraphernalia is provided, this ligthing paraphernalia comprises: a body, and this body has a base portion, a upwardly extending heat-conducting part in the top from this base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section; One light source module, this light source module comprises a flexible substrate and several LED Chips for Communication being installed on operationally on this substrate, and this flexible substrate attaches to the heat-conducting part of this body so that be all provided with LED Chips for Communication on each surface of the end part of this heat-conducting part; And one the base portion that is set in this body with can be light source module and the coated light transmitting shell in the inner of heat-conducting part.

According to another feature of the present invention, a kind of ligthing paraphernalia is provided, and this ligthing paraphernalia comprises: a body, and this body has a base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section, one light source module, this light source module comprises the LED Chips for Communication at least one base portion upper surface that is installed on operationally this body, there is a vertical leaded light part and horizontal leaded light light pipe partly with one, this light pipe is mounted so that the main light-emitting area of this at least one LED Chips for Communication and the vertical leaded light of this light pipe are partly aimed at, therefore the light from this at least one LED Chips for Communication transmitting is incident to the vertical leaded light part of this light pipe and partly advances toward the horizontal leaded light of this light pipe, the horizontal leaded light part of this light pipe is inner be formed with several micro-bubbles so that light when striking bubble, reflect to this horizontal light guide section especially portion and the horizontal light guide section of this light pipe especially portion be coated with a fluorescent bisque and send being excited by light the light of wanting color, and one the base portion that is connected to this body light source module can be coated on to the light transmitting shell in it.

According to a feature more again of the present invention, a kind of ligthing paraphernalia is provided, and this ligthing paraphernalia comprises: a body, and this body has a base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section, one light source module, this light source module comprises the LED Chips for Communication at least one base portion upper surface that is installed on operationally this body, there is a vertical leaded light part and horizontal leaded light light pipe partly with one, this light pipe is mounted so that the main light-emitting area of this at least one LED Chips for Communication and the vertical leaded light of this light pipe are partly aimed at, therefore the light from this at least one LED Chips for Communication transmitting is incident to the vertical leaded light part of this light pipe and partly advances toward the horizontal leaded light of this light pipe, the horizontal leaded light part of this light pipe is inner to be formed with several fluorescent powder particles and to want the light of color and refraction to this horizontal light guide section portion especially so that light excites to send when striking fluorescent powder particle, and one the base portion that is connected to this body light source module can be coated on to the light transmitting shell in it.

Accompanying drawing explanation

Figure 1A to 1C is the schematic diagram that shows the ligthing paraphernalia of the present invention's the first preferred embodiment;

Fig. 1 D is the schematic diagram of the ligthing paraphernalia of demonstration the present invention second preferred embodiment;

Fig. 2 A and 2B are the schematic diagrames that shows the ligthing paraphernalia of the present invention's the 3rd preferred embodiment;

Fig. 3 A and 3B are the variation examples that is presented at the light source module using in ligthing paraphernalia of the present invention;

Fig. 3 C and 3D are the variation examples that is presented at the light source module shown in Fig. 3 A and 3B;

Fig. 4 A to 4C is the schematic diagram that shows the ligthing paraphernalia of the present invention's the 4th preferred embodiment;

Fig. 5 A to 5C is the schematic diagram that shows the ligthing paraphernalia of the present invention's the 5th preferred embodiment;

Fig. 5 D is the variation of light source module of the ligthing paraphernalia of a demonstration the 5th preferred embodiment;

Fig. 6 A and 6B are the schematic diagrames that shows the ligthing paraphernalia of sixth embodiment of the invention;

Fig. 7 is the schematic diagram that shows the ligthing paraphernalia of seventh embodiment of the invention;

Fig. 8 A and 8B are the schematic diagrames that shows the ligthing paraphernalia of the present invention's the 8th preferred embodiment;

Fig. 9 A and 9B are the schematic diagrames that shows the ligthing paraphernalia of the present invention's the 9th preferred embodiment;

Fig. 9 C is the schematic diagram of variation of light source module of the lighting device of demonstration the present invention the 9th preferred embodiment;

Fig. 9 D is the schematic diagram of another variation of light source module of the lighting device of demonstration the present invention the 9th preferred embodiment;

Fig. 9 E is the schematic diagram of variation of light source module of the lighting device of demonstration the present invention the 9th preferred embodiment;

Figure 10 A and 10B are the schematic diagrames that shows the lighting device of the present invention's the tenth preferred embodiment;

Figure 11 A and 11B are the schematic diagrames of variation that shows the lighting device of the present invention's the tenth preferred embodiment;

Figure 12 is the schematic diagram of the ligthing paraphernalia with conventional waxes candle lamp shell of demonstration the present invention first preferred embodiment;

Figure 13 A and 13B are the schematic diagrames that is presented at another form of the variation of lighting device shown in Figure 11 A and 11B;

Figure 14 A and 14B are the schematic diagrames that is presented at another form of the variation of lighting device shown in Figure 11 A and 11B;

Figure 15 A and 15B are the schematic diagrames that shows the lighting device of the present invention's the 11 preferred embodiment;

Figure 16 A to 16D is the schematic diagram that shows the ligthing paraphernalia of the present invention's the 12 preferred embodiment;

Figure 17 A to 17D is the schematic diagram of another form that is presented at the light source module of lighting device shown in Fig. 8 A and 8B;

Figure 18 A to 18C is the schematic diagram that shows the ligthing paraphernalia of the present invention's the 13 preferred embodiment; And

Figure 18 D is the schematic diagram of another form that is presented at the light source module of ligthing paraphernalia shown in Figure 18 A to 18C.

The specific embodiment

In the detailed description of preferred embodiment of the present invention, same or similar element is to be indicated by identical label, and their detailed description will be omitted in the back.In addition,, for clear announcement feature of the present invention, the element in accompanying drawing is not described by actual ratio.

Figure 1A to 1C is the schematic diagram that shows the ligthing paraphernalia of the present invention's the first preferred embodiment.

Figure 1A is a signal combination part sectional plain-view drawing that shows the ligthing paraphernalia of this first preferred embodiment.Refer to shown in Figure 1A, the ligthing paraphernalia of first embodiment of the invention comprises a body 1, a light source module 2 and a light transmitting shell 3.

This body 1 is to be made by good heat radiating material.In the present embodiment, this body 1 is to be made by ceramic material.Certainly, the material that this body 1 also can have good heat radiating characteristic by any other is made, as the metal material as aluminium.Or the body 1 that should form with ceramic material is to come sintering to form with energy improving radiating effect doped with other applicable materials.

This body 1 has a base portion 10, a upwardly extending heat-conducting part 11 in the top from this base portion 10, a bottom from this base portion 10 to the spiro-locking section 12 of downward-extension and a screw lock in the standard light fixture metab 13 of this spiro-locking section 12.

One end projection of three metal bars 14 (14a, 14b, 14c) with heat conduction and conducting function is in the tip exterior of this heat-conducting part 11 and its other end extends downwardly into this base portion 10.Both 14a in these three metal bars 14, this other end of 14b further extends and arrives this spiro-locking section 12 and become electrical connection state with the earth point of this standard lamp base 13 with supply terminals respectively from this base portion 10, metal (copper) on plug metal and AC line heat radiation by this, reaches thermoelectricity unification function.As shown at Fig. 1 C, be partly the formed mounting surface 14d of five general planar of the end of the projection of another root metal bar 14c in this one end of the tip exterior of this heat-conducting part 11.

Should be noted that these three metal bars 14 can be also the heat pipes with conduction and thermal conduction characteristic.

This light source module 2 comprises at least one loading plate 20 and at least one LED wafer 21 being arranged on operationally on this loading plate 20.

In the present embodiment, this light source module 2 comprises the loading plate 20 of the wafer mounting surface that five each tool one back side is relative with this back side with.These loading plates 20 attach to the end part that is arranged on this metal bar 14c under the corresponding mounting surface 14d of end part of this metal bar 14c at its back side.

In the present embodiment, a LED wafer array is installed operationally in the wafer mounting surface of each loading plate 20.The LED wafer 21 that each LED wafer array is connected and/or is connected in parallel by several one-tenth forms.These LED wafers 21 can be white light wafers, or can be the blue light wafers that is coated with fluorescent bisque.Or these LED wafers 21 can be to arrange can send red wafer, green wafer and the blue light wafer of white light according to predetermined way.For example, these LED wafers 21 can be the same with the wafer described in patent of invention ZL200910138969.4 case in patent of invention ZL200810185991.X case as this case inventor.

The anode electrode of these LED wafers 21 and negative electrode are electrically connected to respectively this two metal bar 14a directly or indirectly, and 14b is being supplied with electric power via them.Certainly, these LED wafers 21 can be also the LED wafers 21 of any other color.

One light transmitting shell 3 is connected to the base portion 10 of this body 1 light source module 2 and heat-conducting part 11 can be coated in the inner to complete the ligthing paraphernalia of the present embodiment.The size that should be noted that this light transmitting shell 3 roughly conforms to the size of the light transmitting shell of conventional incandescent bulb.

Although the shape of this light transmitting shell 3 is the examples that are shaped as with traditional spheroidal incandescent lamp bulb in the present embodiment, the shape of this light transmitting shell 3 can be also that the shape of the light transmitting shell used with traditional MR-16, PAR30, PAR38, C35, candle lamp etc. light fixture is consistent.As shown in Figure 12, this light transmitting shell 3 is candle lamp light transmitting shell used.

Should be noted that each LED wafer matrix can be MxN mode arbitrarily, wherein, M and N are to be all 1 or above natural number.In this way, these LED wafers 21 can be connected on demand and/or and are unified into the high pressure wafer of any scope from 6V to 480V.Certainly, these LED wafers 21 also can be connected on demand and/or and are unified into the high pressure wafer to any scope outside 480V scope at 6V.

In addition, each LED wafer matrix can be when wafer cuts, to cut into predetermined matrix form.Certainly, each LED wafer matrix can be also that several independently wafers of connecting by any way and/or be connected in parallel form.

In addition, in the internal layer of this light transmitting shell 3 and/or outer on can be provided with metal or nonmetallic heat conduction and heat sink material, similarly be that the height as ITO, Al2O3, BnO3 etc. is led heat sink material, to increase, lead the surface area of heat radiation and strengthen and lead radiating effect.

Fig. 1 D is the schematic diagram of the ligthing paraphernalia of demonstration the present invention second preferred embodiment.

As shown at Fig. 1 D, different from the first preferred embodiment, in the present embodiment, the other end of these metal bars 14 is not electrically connected with earth point and the supply terminals of standard lamp base 13.This ligthing paraphernalia more comprises that one is placed in the power supply device 15 in this spiro-locking section 12.This power supply device 15 has by wire 152 and is connected to respectively the earth point of standard lamp base 13 and the input electrode of supply terminals 150, and via corresponding metal bar 14, is connected to the anode electrode of LED wafer 21 and the output electrode of negative electrode 151 by wire 152.Because how the output electrode 151 of power supply device 15 and the anode electrode of LED wafer 21 and negative electrode are electrically connected, are well-known and are not the feature of the application's case, in this, repeat no more for this reason.

Fig. 2 A and 2B are the schematic diagrames that shows the ligthing paraphernalia of the present invention's the 3rd preferred embodiment.

As shown at this isometric drawing, the place different from the second embodiment is that this ligthing paraphernalia more comprises the heat dissipation metal fin device 4 that is connected to the heat-conducting part 11 of body 1 by screw.Certainly, this heat dissipation metal fin device 4 can be connected on the heat-conducting part 11 of body 1 by other suitable modes.By the setting of these heat dissipation metal fin devices 4, the heat energy of deriving from light source module 2 via metal bar 14 and the heat-conducting part 11 of body 1 sees through these heat dissipation metal fin devices 4 and dissipates rapidly, and then obtains better radiating effect.

Should be noted that these heat dissipation metal fin devices 4 can with metal bar 14 directly or indirectly physical connection to increase thermoelectricity unification heat conduction and heat radiation effect.

Fig. 3 A and 3B are the variation examples that is presented at the light source module using in ligthing paraphernalia of the present invention.

As depicted in the figures, in the present embodiment, the end of the projection of metal bar 14c in this one end of the tip exterior of this heat-conducting part 11 has partly been formed a perforation 140.This light source module 2A comprises a high heat conduction loading plate 20A, and in the present embodiment, this high heat conduction loading plate 20A is made by transparent high heat sink material, similarly be sapphire (sapphire), quartzy etc. as.Certainly, this high heat conduction loading plate 20A is made by any other applicable material.

The one LED wafer array being formed by several LED wafers 21 is arranged in the wafer mounting surface of this loading plate 20A operationally.This loading plate 20A be installed to this metal bar 14c the end part that is formed with this perforation 140 so that the LED wafer 21 on this loading plate 20A via this perforation 140, expose to the open air.

In the end that this loading plate 20A is installed of this metal bar 14c, partly go up the photic zone 141 that is formed with coated this end part with the insulation light transmissive material doped with phosphor powder.The wafer mounting surface of this photic zone 141 this loading plate of covering 20A and the back side relative with this wafer mounting surface are can cover these LED wafers 21.

In the present embodiment, the insulation light transmissive material of formation photic zone 141 is doped with phosphor powder.

Should be noted that identically with above embodiment, this LED wafer matrix can be MxN mode arbitrarily, and wherein, M and N are to be all 1 or above natural number.In this way, this LED wafer 21 can be connected on demand and/or and is unified into the high pressure wafer of any scope from 6V to 480V.In addition, this LED wafer matrix can be when LED wafers for communication cuts, to cut into predetermined matrix form.

Should be noted that when this LED wafer matrix be while cutting into predetermined matrix form when LED wafers for communication cuts, this high guidance support plate 20A can be omitted.

Fig. 3 C and 3D are the variation examples that is presented at light source module shown in Fig. 3 A and 3B.

As shown at Fig. 3 C and 3D, in the present embodiment, the end of the projection of metal bar 14c in this one end of the tip exterior of this heat-conducting part 11 is partly formed with a longitudinal fluting 142 so that this end is partly formed with two relative clamping plate 142a, 142b.In each clamping plate 142a, on 142b, be formed with one be formed on another clamping plate 142a, the perforation 1420 that the perforation 1420 on 142b is aimed at.

This light source module 2A comprise one with at the identical high heat conduction loading plate 20A shown in Fig. 3 A and 3B.This loading plate 20A is placed in this groove 142 so that two apparent surfaces' of this loading plate 20A part region is by corresponding clamping plate 142a, and the perforation 1420 of 142b exposes to the open air.

In this two apparent surface of this loading plate 20A by corresponding clamping plate 142a, a LED wafer array being formed by several LED wafers 21 is installed respectively on the part region that the perforation 1420 of 142b exposes to the open air operationally.With identical described in above embodiment, these LED wafers 21 can be connected and/or and are unified into the high pressure wafer of any scope from 6V to 480V.In addition, each LED wafer matrix can be when cutting, to cut into predetermined matrix form.

In this groove 142 and these perforations 1420, with the insulation light transmissive material doped with phosphor powder, be formed with a photic zone 141 so that this loading plate 20A and these LED wafers 21 are covered by photic zone 141.

Should be noted that on the surface outside the other three orientations of this loading plate 20A and also LED wafer array can be installed on demand operationally.

Fig. 4 A to 4B is the schematic diagram that shows the ligthing paraphernalia of the present invention's the 4th preferred embodiment.

Different from the first preferred embodiment, this light source module comprises that a transparent carrier plate 20B and is arranged on lip-deep LED wafer 21 arrays of this loading plate 20B operationally.

This loading plate 20B can be identical with at the loading plate 20A shown in Fig. 3 A and 3B and be supported in the end part of the tip exterior of this heat-conducting part 11 by the projection of these three metal bars 14.The wafer mounting surface of this loading plate 20B is substantially vertical with these metal bars 14.Due to this loading plate, 20B is made by transparent material, therefore when these LED wafer 21 runnings, can produce the luminous effect of 360 degree.

Should be noted that identically with above-described embodiment, these LED wafer 21 arrays can be MxN modes arbitrarily, and each LED wafer 21 matrix can be when cutting, to cut into predetermined matrix form.

Fig. 4 C is the schematic diagram of variation of light source module of the ligthing paraphernalia of demonstration the present invention the 3rd preferred embodiment.

As shown at Fig. 4 C, a transparent cover body 210 with heat conduction function covers on these LED wafers 21 and with these metal bar 14 physical connections further strengthens heat-conducting effect.

Fig. 5 A to 5C is the schematic diagram that shows the ligthing paraphernalia of the present invention's the 5th preferred embodiment.

As shown at Fig. 5 A to 5C, in the present embodiment, this light source module 2 comprises LED wafer 21 matrixes that formed by several series connection and/or the LED wafer 21 that is connected in parallel when LED wafer (not shown) is cut.The anode electrode of the predetermined LED wafer 21 in these LED wafer 21 matrixes and negative electrode are supplied with electric power with corresponding metal bar 14 electrical connections with the metal bar 14 that can be connected to power supply via these.

Fig. 5 D is the variation that shows the light source module 2 of the 5th preferred embodiment ligthing paraphernalia.

As shown at Fig. 5 D, this light source module 2 comprises at least two transparency carrier 20C and and is installed on operationally between these two transparency carrier 20C and is LED wafer 21 arrays in the one being installed on operationally in these two transparency carrier 20C, by the LED wafer 21 in this array, contact with these two transparency carrier 20C, the heat energy that these LED wafers 21 produce when running is more promptly derived and is left because area of dissipation increases simultaneously.These transparency carriers 20C can be with described in Fig. 3 A and 3B identical.

Identical as described in previous described embodiment, these LED wafer 21 arrays can be by individually several and be installed on operationally the lip-deep series connection of this transparency carrier and/or the LED wafer 21 that is connected in parallel forms, or can be by consisting of several series connection and/or the LED wafer 21 that is connected in parallel when LED wafer (not shown) is cut.

Fig. 6 A and 6B are the schematic diagrames that shows the ligthing paraphernalia of sixth embodiment of the invention.

As shown at Fig. 6 A and 6B, in the present embodiment, this ligthing paraphernalia more comprises a cooling device.This cooling device comprises the radially venthole 101 and being communicated with atmosphere that a radially blowhole being communicated with atmosphere 100, that is formed at the base portion 10 of this body 1 is formed at the base portion 10 of this body 1 and is formed at the base portion 10 of this body 1 and the accommodating axial passage 102 of piston being communicated with this blowhole 100 and this venthole 101.This cooling device more comprises one and can axially movably be placed in the perforation 104 and that piston 103, in this axial passage 102 is formed at the heat-conducting part 11 of this body 1 and be placed in this path 10 2 can guide this piston 103 along the axially movable guide rod 105 of this path 10 2.This guide rod 105 is to be driven by a runner 106 being rotatably installed in this base portion 10.

The operation principles that should be noted that this cooling device is in fact suitable with a stirling engine.

In the present embodiment, the end relative with light source module 2 that supports the metal bar 14 of this light source module 2 is provided with one end away from this guide rod 105 that a heat radiation fin device 16 and this heat radiation fin device 16 are placed in this path 10 2.

When 2 runnings of this light source module and this piston 103 are positioned at shown in Fig. 6 B the ready position near heat radiation fin device, the heat producing because of 2 runnings of light source module is transmitted in this path 10 2 via heat radiation fin device, and now hot-air makes piston 103 move arrival one final position (seeing Fig. 6 A) towards the other end of the location guide 105 of path 10 2.At the same time, outside cold air enters body 1 hot-air inner and in shell 3 via blowhole 100 and enters body 1 inside via one of them perforation 104.These gases are because the valve 1030 at piston 103 tops is opened by guide rod 105 and is expelled to body 1 outside by piston 103 and via venthole 101.After gas is expelled to body 1 outside, piston 103 is got back to this ready position again.

By as above constructing, the hot-air in shell 3 can effectively be discharged, and promotes the life-span of ligthing paraphernalia.

Fig. 7 is the schematic diagram that shows the ligthing paraphernalia of seventh embodiment of the invention.

As shown in FIG. 7, the places different from the 5th embodiment are to be, piston 103 and guide rod 105 in this path 10 2 are removed, and the substitute is a cooling fan 107.When 107 running of this fan, cold air enters body interior and a part of cold air enters in shell 3 and from being positioned at through hole 108 admission passages 102 of the opposite side of heat-conducting part 11 and by venthole 101, discharges body 1 outsides again from perforation 104 from blowhole 100.

In addition, in the present embodiment, this body 1 has more at least one intercommunicating pore 109 that is communicated with this path 10 2 and spiro-locking section 12, and at least one is communicated with this spiro-locking section 12 and outside passage 110, therefore, when 107 running of this fan, the cold air being produced by fan 107 can enter the spiro-locking section 12 of putting supply unit via intercommunicating pore 109 and via passage 110, discharge to reach the effect that reduces spiro-locking section 12 internal temperatures again.

Fig. 8 A and 8B are the schematic diagrames that shows the ligthing paraphernalia of the present invention's the 8th preferred embodiment.

As shown at Fig. 8 A and 8B, the place not identical with the first preferred embodiment is that this light source module 2 comprises a flexible substrate 20D and several LED Chips for Communication 21 that is arranged on operationally this substrate 20D.This flexible substrate 20D attaches to the heat-conducting part 11 of this body so that be all provided with LED Chips for Communication 21 on each surface of the end part of this heat-conducting part 11.

Fig. 9 A and 9B are the schematic diagrames that shows the ligthing paraphernalia of the present invention's the 9th preferred embodiment.

As shown at Fig. 9 A and 9B, the ligthing paraphernalia of the present embodiment comprise standard light fixture metab 13 that a body 1, is connected to this body 1, a light source module 2, with a light transmitting shell 3 that is connected to this body 1.

This light source module 2 comprises the fluorescent bisque 23 of a LED array being formed by several LED wafers 21 that are connected in series together, coated these LED Chips for Communication 21 and is a pair ofly electrically connected can supply the conductor wire 22 of these LED Chips for Communication 21 electric power with these LED Chips for Communication 21.

In the present embodiment, the transparent substrates layer 210 of these LED Chips for Communication 21 is not cut when LED wafers for communication experience cutting processing procedure, and except first and last LED Chips for Communication 21, the N-shaped electrode of each LED Chips for Communication 21 via the p-type electrode of conductor 24 each LED Chips for Communication 21 with the p-type electrode electrical connection of an adjacent LED Chips for Communication 21 below via conductor 24 and the N-shaped electrode electrical connection of an adjacent LED Chips for Communication 21 above.

This is the conductor wires with suitable intensity to conductor wire 22.This is electrically connected to the p-type electrode of this first LED Chips for Communication 21 to the upper end of the one in conductor wire 22 and this is electrically connected to the N-shaped electrode of this last LED Chips for Communication 21 to the upper end of the another one in conductor wire 22.

This is to be electrically connected to by rights AC power to each the other end in conductor wire 22.In the present embodiment, this is earth point and the supply terminals that is electrically connected to respectively this metab 13 to each the other end in conductor wire 22.

This can be to have the miniature heat pipe of conduction and thermal conductivity to conductor wire 22 or can be that surface has coefficient of heat transfer 300mk to 1200mk and so on to bore the conductor wire of carbon (DLC) layer.

Should be noted that this fluorescent bisque 23 can be as the same with the fluorescent bisque described in patent of invention ZL200910138969.4 case in patent of invention ZL200810185991.X case this case inventor.

Fig. 9 C is the schematic diagram of variation of light source module of the lighting device of demonstration the present invention the 9th preferred embodiment.

As shown at Fig. 9 C, in this changes these LED Chips for Communication 21 except first with last LED Chips for Communication 21, the N-shaped electrode of each LED Chips for Communication 21 is electrically connected via wire 25 and the N-shaped electrode of an adjacent LED Chips for Communication 21 above in routing mode via the p-type electrode of wire 25 each LED Chips for Communication 21 with the p-type electrode electrical connection of an adjacent LED Chips for Communication 21 below in routing mode.

Fig. 9 D is the schematic diagram of another variation of light source module of the lighting device of demonstration the present invention the 9th preferred embodiment.

As shown at Fig. 9 D, in this changes, this light source module 2 more comprises one and has a transparent substrates 20E who is laid with the circuit tracks surface 200 of predetermining circuit track 201.These LED Chips for Communication 21 are the LED Chips for Communication 21 that are installed on operationally to cover crystalline substance (flip-chip) mode individually on the surface 200 of this substrate 20E, and except first and last LED Chips for Communication 21, the N-shaped electrode of each LED Chips for Communication 21 via the p-type electrode of corresponding conductive traces 201 each LED Chips for Communication 21 with the p-type electrode electrical connection of an adjacent LED Chips for Communication 21 below via corresponding conductive traces 201 and the N-shaped electrode electrical connection of an adjacent LED Chips for Communication 21 above.

Fig. 9 E is the schematic diagram of variation of light source module of the lighting device of demonstration the present invention the 9th preferred embodiment.

As shown at Fig. 9 E, in this changes, this light source module 2 more comprises one and has a transparent substrates 20E who is laid with the circuit tracks surface 200 of predetermining circuit track 201.These LED Chips for Communication 21 are the LED Chips for Communication 21 that are placed in individually on the surface 200 of this substrate 20E, and except first and last LED Chips for Communication 21, the N-shaped electrode of each LED Chips for Communication 21 in routing mode via the p-type electrode of wire 25 each LED Chips for Communication 21 with the p-type electrode electrical connection of an adjacent LED Chips for Communication 21 below in routing mode via wire 25 and the N-shaped electrode electrical connection of an adjacent LED Chips for Communication 21 above.

Figure 10 A and 10B are the schematic diagrames that shows the lighting device of the present invention's the tenth preferred embodiment.

As shown at Figure 10 A and 10B, the place different from the 9th preferred embodiment be this light source module 2 comprise two as in the 8th preferred embodiment described in LED Chips for Communication 21 arrays.These two LED Chips for Communication 21 arrays are connected in series.

Figure 11 A and 11B are the schematic diagrames of variation that shows the lighting device of the present invention's the tenth preferred embodiment.

As shown at Figure 11 A and 11B, the place different from the 9th preferred embodiment is that these two LED Chips for Communication 21 arrays are to connect in parallel.

Figure 13 A and 13B are the schematic diagrames that is presented at another form of the variation of lighting device shown in Figure 11 A and 11B.

As shown at Figure 13 A and 13B, a tool conduction is electrically connected with top part and these light-emittingdiodes 21 arrays of the heat pipe 26 of thermal conductivity, and the bottom of this heat pipe 26 is partly connected electrically to the earth point of this base 13.The bottom part of this heat pipe 26 is spiraled extension can reach Maximum Contact surface in order to radiating effect along the internal face of this base 13.Should be noted that this heat pipe 26 can be effectively at this, be provided with heat in the heating chamber (that is, shell 3 inside) of LED Chips for Communication 21 be transmitted to do not have LED Chips for Communication 21 without in thermal source chamber (that is, in base 13).

Figure 14 A and 14B are the schematic diagrames that is presented at another form of the variation of lighting device shown in Figure 11 A and 11B.

As shown at Figure 14 A and 14B, a tool conduction is electrically connected with top part and these light-emittingdiodes 21 arrays of the heat pipe 26 of thermal conductivity, and the bottom of this heat pipe 26 is partly connected electrically to the supply terminals of this base 13.

Figure 15 A and 15B are the schematic diagrames that shows the lighting device of the present invention's the 11 preferred embodiment.

As shown at Figure 15 A and 15B, the ligthing paraphernalia of the present embodiment comprise standard light fixture metab 13 that a body 1, is connected to this body 1, a light source module 2, with a light transmitting shell 3 that is connected to this body 1.

This light source module 2 comprise a tool conduction and thermal conductivity heat pipe 26, a substrate 20F, several lip-deep LED wafer 21 that is installed on operationally this transparent substrates 20F, cover the fluorescent bisque 23 of these LED Chips for Communication 21 and be a pair ofly electrically connected can supply the conductor wire 22 of these LED Chips for Communication 21 electric power with these LED Chips for Communication 21.

This substrate 20F is installed on the top part of this heat pipe 26.The bottom of this heat pipe 26 partly extends to this base 13 and is electrically connected with the supply terminals of this base 13.

This is electrically connected to this heat pipe 26 to the one in conductor wire 22 and this is electrically connected to the earth point of this base 13 to the another one in conductor wire 22.

Figure 16 A to 16D is the schematic diagram that shows the lighting device of the present invention's the 12 preferred embodiment.

As shown at Figure 16 A to 16D, different from previous embodiment, this light source module 2 comprises a flexible substrate 20G and several lip-deep LED wafer 21 that is installed on operationally this substrate 20G.This substrate 20G attaches to the heat-conducting part 11 of this body 1 so that be all provided with LED Chips for Communication 21 on each surface of the end part of this heat-conducting part 11.

Figure 17 A to 17D is the schematic diagram of another form of light source module 2 that shows the lighting device of the present invention's the 12 preferred embodiment.

As shown at Figure 17 A to 17D, this light source module 2 comprises a flexible substrate 20H and several lip-deep LED wafer 21 that is installed on operationally this substrate 20H.This substrate 20H attaches to the heat-conducting part 11 of this body 1 so that be all provided with LED Chips for Communication 21 on each surface of the end part of this heat-conducting part 11.

Figure 18 A to 18C is the schematic diagram that shows the lighting device of the present invention's the 13 preferred embodiment.

As shown at Figure 18 A to 18C, the ligthing paraphernalia of the present embodiment comprise standard light fixture metab 13 that a body 1, with the spiro-locking section of a base portion and from base portion to downward-extension is connected to the spiro-locking section of this body 1, a light source module 2, with a light transmitting shell 3 that is connected to the upper end part of this body 1.

This body 1 has a upper surface 17.This light source module 2 comprises several LED Chips for Communication 21 that are installed on operationally on this upper surface 17.In the view of the present embodiment, show two LED Chips for Communication 21.This light source module 2 more comprises a light pipe 27 for U-shaped roughly.This light pipe 27 is mounted so that the main light-emitting area of these LED Chips for Communication 21 is partly aimed at the corresponding vertical leaded light of this light pipe 27, and therefore the light from these LED Chips for Communication 21 transmittings is incident to the vertical leaded light part of this light pipe 27 and partly advances toward this two vertical leaded light of connection horizontal leaded light partly of this light pipe 27.

In the present embodiment, the horizontal leaded light of this light pipe 27 part inner be formed with several micro-bubbles 270 so that light when striking bubble 270, reflect to this horizontal light guide section especially portion and the horizontal light guide section of this light pipe 27 especially portion be coated with a fluorescent bisque 271 exciting and send the light of wanting color by light.

Figure 18 D is the schematic diagram of another form of light source module 2 of the lighting device of demonstration the present invention the 13 preferred embodiment.

As shown in the figure, be that from different shown in Figure 18 C the horizontal leaded light part inside of this light pipe 27 is formed with several fluorescent powder particles 272 to replace these bubbles and this fluorescent bisque.

In sum, " ligthing paraphernalia " of the present invention, really can the above-mentioned disclosed structure of mat, device, reaches object and the effect of expection, and does not see also unexposed use of publication before application, meets the important documents such as novelty, progress of patent of invention.

Only, above-mentioned taken off accompanying drawing and explanation, be only embodiments of the invention, non-for limiting embodiments of the invention; Generally people's bodyguard of being familiar with this skill, it complies with feature category of the present invention, and other equivalences of doing change or modify, and all should be encompassed in the protection domain of following this case.

The main element conventional letter table of accompanying drawing

1 body

10 base portions

11 heat-conducting parts

12 spiro-locking sections

13 standard light fixture metabs

14 metal bars

140 perforation

141 photic zones

142 longitudinal flutings

1420 perforations

142a clamping plate

142b clamping plate

14a metal bar

14b metal bar

14c metal bar

14d mounting surface

15 power supply devices

150 input electrodes

151 output electrodes

152 wires

16 fin devices

100 blowholes

101 ventholes

102 passages

103 pistons

1030 valves

104 perforations

105 guide rods

106 runners

107 cooling devices

108 through holes

109 intercommunicating pores

110 passages

2 light source modules

2A light source module

20 loading plates

200 surfaces

201 circuit trace

20A loading plate

20B loading plate

20C transparency carrier

20D flexible substrate

20E substrate

20F substrate

21 LED wafers

210 basalises

22 conductor wires

23 fluorescent bisques

24 conductors

25 wires

26 heat pipes

3 light transmitting shell

4 heat dissipation metal fin devices

Claims

1. a ligthing paraphernalia, comprises:

One body, this body has a base portion, a upwardly extending heat-conducting part in the top from this base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section;

At least one metal bar, this metal bar from the base portion of this body extend up to heat-conducting part by this body so that one end projection of this metal bar in the tip exterior of this heat-conducting part, the end of the projection of this metal bar in one end of the tip exterior of this heat-conducting part is partly shaped to rectangular shape to have the mounting surface of five general planar;

One light source module, this light source module comprises that loading plate in the mounting surface of five correspondences that are respectively installed on this metal bar and several each are installed on the LED wafer array on the loading plate of a correspondence operationally; And

One base portion that is set in this body is being coated light transmitting shell in the inner light source module and heat-conducting part.

2. ligthing paraphernalia as claimed in claim 1, is characterized in that, each LED wafer matrix can be MxN mode arbitrarily, and wherein, M and N are all 1 or above natural number

3. ligthing paraphernalia as claimed in claim 2, is characterized in that, each LED wafer matrix can be when wafer cuts, to cut into predetermined matrix to form.

4. ligthing paraphernalia as claimed in claim 1, it is characterized in that, more comprising two base portions from this body extends up to by the metal bar of the heat-conducting part of this body, the anode electrode of one end of the one in this two metal bar and these LED wafer arrays is electrically connected and the supply terminals electrical connection of its other end and this standard lamp base, and the negative electrode of one end of the another one in this two metal bar and these LED wafer arrays is electrically connected and the earth point electrical connection of its other end and this standard lamp base.

5. ligthing paraphernalia as claimed in claim 1, is characterized in that, in the internal layer of this light transmitting shell and the one or both in skin, is to be provided with heat conduction and heat sink material.

6. ligthing paraphernalia as claimed in claim 1, it is characterized in that, more comprise a power supply device being placed in this spiro-locking section, this power supply device has the input electrode of the earth point and the supply terminals that are connected to respectively standard lamp base, and is connected to respectively the output electrode of anode electrode and the negative electrode of LED wafer.

7. ligthing paraphernalia as claimed in claim 1, it is characterized in that, the heat dissipation metal fin device that more comprises the heat-conducting part that is connected to body, setting by these heat dissipation metal fin devices, the heat energy of deriving from light source module via the heat-conducting part of body sees through these heat dissipation metal fin devices and dissipates rapidly, and then obtains better radiating effect.

8. a ligthing paraphernalia, comprises:

At least one metal bar, this metal bar from the base portion of this body extend up to heat-conducting part by this body so that one end projection of this metal bar in the tip exterior of this heat-conducting part, the projection of this metal bar has partly been formed a perforation at the end of this one end of the tip exterior of this heat-conducting part;

One light source module, this light source module comprises

The one high heat conduction loading plate with a wafer mounting surface of being made by transparent high heat sink material, this loading plate is installed to the end part that is formed with this perforation of this metal bar,

One is arranged on the LED wafer array being formed by several LED wafers in the wafer mounting surface of this loading plate operationally, and the LED wafer on this loading plate exposes to the open air via this perforation, and

The end part of one coated this metal bar is can cover the wafer mounting surface of this loading plate and the back side relative with this wafer mounting surface can cover these LED wafers, and this photic zone is to form with the insulation light transmissive material doped with phosphor powder; And

9. ligthing paraphernalia as claimed in claim 8, is characterized in that, each LED wafer matrix can be MxN mode arbitrarily, and wherein, M and N are all 1 or above natural number

10. ligthing paraphernalia as claimed in claim 9, is characterized in that, each LED wafer matrix can be when wafer cuts, to cut into predetermined matrix to form.

11. ligthing paraphernalias as claimed in claim 8, it is characterized in that, more comprising two base portions from this body extends up to by the metal bar of the heat-conducting part of this body, one end of one in this two metal bar is the supply terminals electrical connection of its other end and this standard lamp base with the anode electrode electrical connection of these LED wafer arrays, and the negative electrode of one end of the another one in this two metal bar and these LED wafer arrays is electrically connected and the earth point electrical connection of its other end and this standard lamp base.

12. ligthing paraphernalias as claimed in claim 8, is characterized in that, in the internal layer of this light transmitting shell and the one or both in skin, are to be provided with heat conduction and heat sink material.

13. ligthing paraphernalias as claimed in claim 8, it is characterized in that, more comprise a power supply device being placed in this spiro-locking section, this power supply device has the input electrode of the earth point and the supply terminals that are connected to respectively standard lamp base, and is connected to respectively the output electrode of anode electrode and the negative electrode of LED wafer.

14. ligthing paraphernalias as claimed in claim 8, it is characterized in that, the heat dissipation metal fin device that more comprises the heat-conducting part that is connected to body, setting by these heat dissipation metal fin devices, the heat energy of deriving from light source module via the heat-conducting part of body sees through these heat dissipation metal fin devices and dissipates rapidly, and then obtains better radiating effect.

15. ligthing paraphernalias as claimed in claim 8, is characterized in that, more comprise the lip-deep LED wafer array that by several LED wafers formed relative with this wafer mounting surface that another is arranged on this loading plate operationally.

16. 1 kinds of ligthing paraphernalias, comprise:

One base portion from this body extends up to by the metal bar of the heat-conducting part of this body, and one end projection of this metal bar is outside at the heat-conducting part of this body;

One light source module, this light source module comprises

One loading plate with a wafer mounting surface being supported by this metal bar, and

One is installed on the LED wafer array in the wafer mounting surface of this loading plate operationally; And

17. ligthing paraphernalias as claimed in claim 16, is characterized in that, this LED wafer array can be when wafer cuts, to cut into predetermined matrix to form.

18. ligthing paraphernalias as claimed in claim 16, is characterized in that, in the internal layer of this light transmitting shell and the one or both in skin, are to be provided with heat conduction and heat sink material.

19. ligthing paraphernalias as claimed in claim 16, it is characterized in that, more comprise a transparent cover body and two with heat conduction function from the outstanding heat-conducting metal rod of this heat-conducting part, this lid covers on these LED wafers and with these heat-conducting metal rod physical connections further strengthens heat-conducting effect.

20. 1 kinds of ligthing paraphernalias, comprise:

One base portion from this body extends up to by the metal bar of the heat-conducting part of this body, and one end of this metal bar is that projection is outside at the heat-conducting part of this body;

One light source module, this light source module comprises that one is installed on the LED wafer array that cuts into predetermined array when wafer cuts of the top part of this metal bar operationally; And

21. ligthing paraphernalias as claimed in claim 20, is characterized in that, in the internal layer of this light transmitting shell and the one or both in skin, are to be provided with heat conduction and heat sink material.

22. 1 kinds of ligthing paraphernalias, comprise:

One cooling device, this cooling device comprises the radially venthole and being communicated with atmosphere that a radially blowhole, being communicated with atmosphere that is formed at the base portion of this body is formed at the base portion of this body and is formed at the base portion of this body and the accommodating axial passage of piston being communicated with this blowhole and this venthole, and this cooling device more comprises one and can axially movably be placed in the perforation and that piston, in this axial passage is formed at the heat-conducting part of this body and be placed in this passage can guide this piston along the axially movable guide rod of this passage;

One light source module, this light source module comprises

One has the projection of one end part the outside and other end is partly positioned at this passage and away from the metal bar of this guide rod at the heat-conducting part of this body, and

One is positioned at the projection of this metal bar operationally at the LED Chips for Communication array of end part of the heat-conducting part outside of this body; And

One base portion that is set in this body is with can be light source module and the coated light transmitting shell in the inner of heat-conducting part,

By this, when the running of this LED Chips for Communication array and this piston are the ready position being positioned near this other end part of this metal bar, the heat producing because of the running of LED Chips for Communication array is transmitted in this passage via metal bar, now hot-air makes piston move towards the other end of the location guide of passage, at the same time, outside cold air enters body interior via blowhole and hot-air in the enclosure enters body interior via one of them perforation, these gases are because the valve at top land is opened by guide rod and is expelled to body exterior by piston and via venthole, after gas is expelled to body exterior, piston is got back to this ready position again.

23. 1 kinds of ligthing paraphernalias, comprise:

One cooling device, this cooling device comprises the radially venthole and being communicated with atmosphere that a radially blowhole, being communicated with atmosphere that is formed at the base portion of this body is formed at the base portion of this body and is formed at the base portion of this body and the accommodating axial passage of piston being communicated with this blowhole and this venthole, and this cooling device more comprises one and is placed in the perforation that fan and in this passage is formed at the heat-conducting part of this body;

When the running of this fan, cold air enters body interior and a part of cold air enters in shell and from being positioned at the through hole admission passage of the opposite side of heat-conducting part and by venthole, discharges body exterior again from perforation from blowhole.

24. ligthing paraphernalias as claimed in claim 23, it is characterized in that, this body has more at least one intercommunicating pore that is communicated with this passage and spiro-locking section, and at least one is communicated with this spiro-locking section and outside passage, therefore, when the running of this fan, the cold air being produced by fan can enter the spiro-locking section of putting supply unit via intercommunicating pore and via passage, discharge to reach the effect that reduces spiro-locking section internal temperature again.

25. 1 kinds of ligthing paraphernalias, comprise:

One light source module, this light source module comprises a flexible substrate and several LED Chips for Communication being installed on operationally on this substrate, and this flexible substrate attaches to the heat-conducting part of this body so that be all provided with LED Chips for Communication on each surface of the end part of this heat-conducting part; And

26. ligthing paraphernalias as claimed in claim 25, is characterized in that, these LED Chips for Communication are one another in series and/or are connected in parallel.

27. 1 kinds of ligthing paraphernalias, comprise:

One body, this body has a base portion, a bottom from this base portion to the spiro-locking section of downward-extension and a screw lock in the standard light fixture metab of this spiro-locking section;

One light source module, this light source module comprises the LED Chips for Communication on the upper surface of the base portion that at least one is installed on this body operationally, there is a vertical leaded light part and horizontal leaded light light pipe partly with one, this light pipe is mounted so that the main light-emitting area of this at least one LED Chips for Communication and the vertical leaded light of this light pipe are partly aimed at, therefore the light from this at least one LED Chips for Communication transmitting is incident to the vertical leaded light part of this light pipe and partly advances toward the horizontal leaded light of this light pipe, the horizontal leaded light part of this light pipe is inner be formed with several micro-bubbles so that light when striking bubble, reflect to this horizontal light guide section especially portion and the horizontal light guide section of this light pipe especially portion be coated with a fluorescent bisque and send being excited by light the light of wanting color, and

One base portion that is connected to this body is being coated on the light transmitting shell in it light source module.

28. 1 kinds of ligthing paraphernalias, comprise:

One light source module, this light source module comprises the LED Chips for Communication on the upper surface of the base portion that at least one is installed on this body operationally, there is a vertical leaded light part and horizontal leaded light light pipe partly with one, this light pipe is mounted so that the main light-emitting area of this at least one LED Chips for Communication and the vertical leaded light of this light pipe are partly aimed at, therefore the light from this at least one LED Chips for Communication transmitting is incident to the vertical leaded light part of this light pipe and partly advances toward the horizontal leaded light of this light pipe, the horizontal leaded light part of this light pipe is inner to be formed with several fluorescent powder particles and to want the light of color and refraction to this horizontal light guide section portion especially so that light excites to send when striking fluorescent powder particle, and

29. ligthing paraphernalias as described in claim 27 or 28, it is characterized in that, this light pipe has roughly a fall-U-shaped shape, and this light pipe is mounted so that the main light-emitting area of these LED Chips for Communication is partly aimed at the corresponding vertical leaded light of this light pipe.

30. 1 kinds of ligthing paraphernalias, comprise:

One body, this body has a standard light fixture metab that is connected to the lower end part of this body;

One light source module, this light source module comprises the fluorescent bisque of a LED Chips for Communication array being formed by several LED Chips for Communication that are connected in series together, coated these LED Chips for Communication and is a pair ofly electrically connected can supply the conductor wire of these LED Chips for Communication electric power with these LED Chips for Communication; And

The one upper end part that is connected to this body is being coated light transmitting shell in the inner these LED Chips for Communication.

31. ligthing paraphernalias as claimed in claim 30, it is characterized in that, the transparent substrates layer of these LED Chips for Communication is not cut when LED wafers for communication experience cutting processing procedure, and except first and last LED Chips for Communication, the N-shaped electrode of each LED Chips for Communication carrys out each LED Chips for Communication with the p-type electrode electrical connection of an adjacent LED Chips for Communication below p-type electrode via conductor comes and the N-shaped electrode electrical connection of an adjacent LED Chips for Communication above via conductor.

32. ligthing paraphernalias as claimed in claim 31, it is characterized in that, this is the conductor wire with suitable intensity to conductor wire, this is electrically connected to the p-type electrode of this first LED Chips for Communication to the upper end of the one in conductor wire and this is electrically connected to the N-shaped electrode of this last LED Chips for Communication to the upper end of the another one in conductor wire, and this is electrically connected to respectively earth point and the supply terminals of this metab by rights to each the other end in conductor wire.

33. ligthing paraphernalias as claimed in claim 32, is characterized in that, this can be to have the miniature heat pipe of conduction and thermal conductivity to conductor wire or can be that surface has coefficient of heat transfer 300mk to 1200mk and so on to bore the conductor wire of carbon (DLC) layer.

34. lighting devices as claimed in claim 31, is characterized in that, this conductor is wire.

35. 1 kinds of ligthing paraphernalias, comprise:

One light source module, this light source module comprises on a transparent substrates that is laid with the circuit tracks surface of predetermining circuit track, several surface that is installed on operationally this substrate with the fluorescent bisque of LED Chips for Communication, coated these LED Chips for Communication and this substrate of circuit trace electrical connection that can be corresponding with these and is a pair ofly electrically connected can supply the conductor wire of these LED Chips for Communication electric power with the corresponding circuit trace of this substrate; And

36. ligthing paraphernalias as claimed in claim 35, it is characterized in that, these LED Chips for Communication are to cover crystal type, to be installed on operationally individually the lip-deep LED Chips for Communication of this substrate, and except first and last LED Chips for Communication, the N-shaped electrode of each LED Chips for Communication carrys out each LED Chips for Communication with the p-type electrode electrical connection of an adjacent LED Chips for Communication below p-type electrode via corresponding conductive traces comes to be electrically connected with the N-shaped electrode of an adjacent LED Chips for Communication above via corresponding conductive traces.

37. ligthing paraphernalias as claimed in claim 35, is characterized in that, this can be to have the miniature heat pipe of conduction and thermal conductivity to conductor wire or can be that surface has coefficient of heat transfer 300mk to 1200mk and so on to bore the conductor wire of carbon (DLC) layer.

38. lighting devices as claimed in claim 35, it is characterized in that, these LED Chips for Communication are the lip-deep LED Chips for Communication that are placed in individually this substrate, and except first and last LED Chips for Communication, the N-shaped electrode of each LED Chips for Communication carrys out each LED Chips for Communication with the p-type electrode electrical connection of an adjacent LED Chips for Communication below via wire p-type electrode in routing mode comes and the N-shaped electrode electrical connection of an adjacent LED Chips for Communication above via wire in routing mode.

39. ligthing paraphernalias as described in claim 36 or 38, it is characterized in that, this is the conductor wire with suitable intensity to conductor wire, this is electrically connected to the p-type electrode of this first LED Chips for Communication to the upper end of the one in conductor wire and this is electrically connected to the N-shaped electrode of this last LED Chips for Communication to the upper end of the another one in conductor wire, and this is electrically connected to respectively earth point and the supply terminals of this metab by rights to each the other end in conductor wire.

40. lighting devices as claimed in claim 30, it is characterized in that, this light source module more comprises another LED Chips for Communication array being formed by several LED Chips for Communication that are connected in series together, and these LED Chips for Communication arrays are to be electrically connected in series or in parallel.

41. lighting devices as claimed in claim 35, it is characterized in that, this light source module more comprises on another transparent substrates that is laid with the circuit tracks surface of predetermining circuit track, several surface that is installed on operationally this substrate with the LED Chips for Communication of circuit trace electrical connection and the fluorescent bisque of coated these LED Chips for Communication and this substrate that can be corresponding with these, and the LED Chips for Communication being installed on this two substrates is to be electrically connected in series or in parallel.

42. ligthing paraphernalias as described in claim 40 or 41, it is characterized in that, the heat pipe that more comprises a tool conduction and thermal conductivity, the top part of this heat pipe and these LED Chips for Communication electrical connections, and the bottom of this heat pipe is partly connected electrically to the earth point of this base, the bottom of this heat pipe part is spiraled extension can reach Maximum Contact surface in order to radiating effect along the internal face of this base.

43. ligthing paraphernalias as described in claim 40 or 41, it is characterized in that, the heat pipe that more comprises a tool conduction and thermal conductivity, the top part of this heat pipe and the electrical connection of these LED Chips for Communication, and the bottom of this heat pipe is partly connected electrically to the supply terminals of this base.

44. 1 kinds of ligthing paraphernalias, comprise:

One body;

One is connected to the standard light fixture metab of this body;

One light source module, this light source module comprises the heat pipe of a tool conduction and thermal conductivity, one substrate, several lip-deep LED Chips for Communication that are installed on operationally this transparent substrates, cover the fluorescent bisque of these LED Chips for Communication and a pair of and these LED Chips for Communication electrical connection can supply the conductor wire of these LED Chips for Communication electric power, this substrate is installed on the top part of this heat pipe, the bottom of this heat pipe partly extends to this base and is electrically connected with the supply terminals of this base, this is electrically connected to this heat pipe to the one in conductor wire and this is electrically connected to the earth point of this base to the another one in conductor wire, and

One is connected to this body these LED Chips for Communication can be coated to light transmitting shell in the inner.