CN103921363A - Method for recycling wafer cutting waste mortar - Google Patents
Method for recycling wafer cutting waste mortar Download PDFInfo
- Publication number
- CN103921363A CN103921363A CN201410176832.9A CN201410176832A CN103921363A CN 103921363 A CN103921363 A CN 103921363A CN 201410176832 A CN201410176832 A CN 201410176832A CN 103921363 A CN103921363 A CN 103921363A
- Authority
- CN
- China
- Prior art keywords
- mortar
- cutting
- waste
- old
- density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention discloses a method for recycling wafer cutting waste mortar. The method includes the following steps that the waste mortar used in wafer cutting is taken and filtered through a filter bag; the waste mortar is mixed and stirred again after adjustment, and mortar density testing is carried out through a density tester in the mixing process to achieve a mortar density capable of meeting use requirements of squaring; a stainless steel filter screen is additionally arranged on a mortar circulation port of a squarer cutting chamber, and a mortar tank double-layer filter screen is replaced by a single-layer filter screen; the groove gap of a home roll used in square forming is designed to be 157.0 mm; equipment technological parameters are adjusted, and segmented cutting is adopted; the whole machining process is monitored, and the size of produced polycrystal square ingots is controlled. According to the method, the wafer cutting waste mortar is recycled for squaring linear cutting of ingots, the defect that traditional cutting technologies relay on new sand and new liquid is overcome mainly through technology research and development and technology update, the wafer cutting waste mortar is applied to polycrystal ingot squaring, and therefore the consumption of auxiliary materials of an enterprise is reduced and enterprise benefits are improved.
Description
Technical field
The present invention is specifically related to the waste and old mortar secondary cycle of a kind of section and utilizes method.
Background technology
Solar silicon wafers demand mainly comes from solar cell manufacture, and at present China's solar cell yield occupies first of global various countries, and therefore China's silicon chip enterprise is mainly domestic enterprise and supplies raw materials, and portioned product is to Europe and the outlet of area, North America.Photovoltaic market application by present photovoltaic product that wide-range, diversified trend adapt to various demands by constantly come out except large-scale grid-connected photovoltaic power station, distributed power generation, with build the photovoltaic generating system that combines, low profile photovoltaic system, from net photovoltaic system also by rapid rising.
Within 2013, along with country is to photovoltaic industry policy adjustment and support, photovoltaic installation demand is by fast development, and this will drive the growth of China's silicon chip industry requirement.But solar silicon wafers cuts, still cost is higher, thereby enterprise development and economic benefit are restricted, also there is a certain distance in silicon chip product quality, technical merit and advanced international standard, be mainly reflected in that innovation ability is lower, manufacturing technology level level is uneven, reducing silicon chip cost will be the development topic of photovoltaic industry
Evolution line cutting technology is photovoltaic silicon wafer cutting industry important component part, the at present domestic and international photovoltaic industry mortar used of tradition evolution cutting is that new liquid fresh sand is according to certain proportional arrangement (as domestic 1:1.1) substantially, there is the defects such as supplementary product onsumption is large, benefit is low, due to the development of new material technology, more and more higher for the requirement that reduces auxiliary material consumption.Be also simultaneously photovoltaic silicon wafer industry constantly to high efficiency, future development cheaply.Improve core competitiveness and realize the transformation from increase in size type to quality and efficiency.
Summary of the invention
Goal of the invention: the invention provides the waste and old mortar secondary cycle of a kind of section and utilize method.
Technical scheme: the waste and old mortar secondary cycle of a kind of section is utilized method, comprises the steps:
(1) choose the used waste and old mortar of silicon chip cutting, every cylinder mortar use amount is about 320L-330L, uses filter bag to filter while extracting waste and old mortar; Filtering Main Function is that the impurity producing in section cutting process is removed, and while preventing evolution operation, breaks.
(2) due to the used waste sand pulp density of section be 1.625-1.63Kg ㎡ do not meet evolution mortar cutting instructions for use: evolution use slurry density for 1.667-1.669Kg ㎡, to again prepare adjustment to the waste and old mortar of cutting into slices, allocate by the new sand that adds 50 Kg--60 Kg (1200#) in mortar a mixing bowl the inside, stir, in allocation process, use density tester to carry out slurry density test, reach evolution instructions for use slurry density 1.667-1.669Kg ㎡;
(3) excavation machine cutting chamber mortar circulation port place added to stainless steel screen pack, mortar jar double-layer filtering net be respectively to 80 orders and 150 orders change individual layer 800 object screen packs into; Prevent from causing broken string to cause size less than normal because producing impurity in evolution process.
(4) home roll evolution being used is that 156.8mm changes 157.0mm slot pitch into by original slot pitch; The main cause strengthening causes crystal hem width size to open little for preventing waste and old mortar cutting force not.
(5) technical parameter is adjusted, important technological parameters changes cutting tension force into 80N by original 75N, flow by 140 original L min change into 145L min, because polycrystal silicon ingot exists impurity layer, cutting technique is taked segmented cutting by spy, impurity layer is mainly distributed in that polycrystal silicon ingot head is about 20-25mm, afterbody is about 30--40 mm, and cutting technique changes in detail:
(6) whole process is monitored, polycrystalline side's ingot size Control of production is 156.3 ± 0.3.
As optimization: in described step 1, filter bag is 150-180 order.
As optimization: in described step 2, the density of waste and old mortar is 1.625-1.63Kg ㎡.
As optimization: in described step 2, mixing time is 3.5-4 hours.
Beneficial effect: the present invention is used in the cutting of ingot casting evolution line to the waste and old mortar secondary of cutting into slices, mainly overcome traditional cutting technique by technical research, technological change and rely on the new liquid of fresh sand, make its waste and old mortar of cutting into slices for polycrystalline cast ingot evolution, thereby reduce enterprise's supplementary product onsumption, improve the performance of enterprises.Can meet and exceed the similar level of domestic and international same domain, effectively solve ingot casting evolution line and cut the dependence to the new liquid of fresh sand, and can promote to photovoltaic industry.
The present invention prepares adjustment again to the waste and old mortar of cutting into slices, excavation machine cutting chamber mortar circulation port place is added to stainless steel screen pack, mortar jar double-layer filtering net is respectively to 80 orders and 150 orders change individual layer 800 object screen packs into, prevent from causing broken string to cause size less than normal because producing impurity in evolution process.
The home roll that evolution is used is that 156.8mm changes 157.0mm slot pitch into by original slot pitch; The main cause strengthening causes crystal hem width size to open little for preventing waste and old mortar cutting force not.
Technical parameter is adjusted, and important technological parameters changes cutting tension force into 80N by original 75N, flow by 140 original L min change into 145L min, because polycrystal silicon ingot exists impurity layer, special cutting technique is taked to segmented cutting.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention will be described in detail.
Specific embodiment 1:
The waste and old mortar secondary cycle of a kind of section is utilized method, comprises the steps:
(1) choose the used waste and old mortar of silicon chip cutting, every cylinder mortar use amount is about 320L, uses filter bag to filter while extracting waste and old mortar, and wherein filter bag is 150 orders;
(2) the waste and old mortar of cutting into slices is prepared to adjustment again, the density of waste and old mortar is 1.625Kg ㎡, allocate by the new sand that adds 50 Kg (1200#) in mortar a mixing bowl the inside, stir, mixing time is 3.5 hours, in allocation process, use density tester to carry out slurry density test, reach evolution instructions for use slurry density 1.667Kg ㎡;
(3) excavation machine cutting chamber mortar circulation port place added to stainless steel screen pack, mortar jar double-layer filtering net be respectively to 80 orders and 150 orders change individual layer 800 object screen packs into;
(4) home roll evolution being used is that 156.8mm changes 157.0mm slot pitch into by original slot pitch;
(5) technical parameter is adjusted, important technological parameters changes cutting tension force into 80N by original 75N, flow by 140 original L min change into 145L min, because polycrystal silicon ingot exists impurity layer, special cutting technique is taked to segmented cutting, impurity layer is mainly distributed in that polycrystal silicon ingot head is about 20mm, afterbody is about 30mm;
(6) whole process is monitored, polycrystalline side's ingot size Control of production is 156.
Specific embodiment 2:
The waste and old mortar secondary cycle of a kind of section is utilized method, comprises the steps:
(1) choose the used waste and old mortar of silicon chip cutting, every cylinder mortar use amount is about 330L, uses filter bag to filter while extracting waste and old mortar, and wherein filter bag is 180 orders;
(2) the waste and old mortar of cutting into slices is prepared to adjustment again, the density of waste and old mortar is 1.63Kg ㎡, allocate by the new sand that adds 60 Kg (1200#) in mortar a mixing bowl the inside, stir, mixing time is 4 hours, in allocation process, use density tester to carry out slurry density test, reach evolution instructions for use slurry density 1.669Kg ㎡;
(3) excavation machine cutting chamber mortar circulation port place added to stainless steel screen pack, mortar jar double-layer filtering net be respectively to 80 orders and 150 orders change individual layer 800 object screen packs into;
(4) home roll evolution being used is that 156.8mm changes 157.0mm slot pitch into by original slot pitch;
(5) technical parameter is adjusted, important technological parameters changes cutting tension force into 80N by original 75N, flow by 140 original L min change into 145L min, because polycrystal silicon ingot exists impurity layer, special cutting technique is taked to segmented cutting, impurity layer is mainly distributed in that polycrystal silicon ingot head is about 25mm, afterbody is about 40 mm;
(6) whole process is monitored, polycrystalline side's ingot size Control of production is 156.6.
Specific embodiment 3:
The waste and old mortar secondary cycle of a kind of section is utilized method, comprises the steps:
(1) choose the used waste and old mortar of silicon chip cutting, every cylinder mortar use amount is about 325L, uses filter bag to filter while extracting waste and old mortar, and wherein filter bag is 170 orders;
(2) the waste and old mortar of cutting into slices is prepared to adjustment again, the density of waste and old mortar is 1.628Kg ㎡, allocate by the new sand that adds 55Kg (1200#) in mortar a mixing bowl the inside, stir, mixing time is 3.8 hours, in allocation process, use density tester to carry out slurry density test, reach evolution instructions for use slurry density 1.668Kg ㎡;
(3) excavation machine cutting chamber mortar circulation port place added to stainless steel screen pack, mortar jar double-layer filtering net be respectively to 80 orders and 150 orders change individual layer 800 object screen packs into;
(4) home roll evolution being used is that 156.8mm changes 157.0mm slot pitch into by original slot pitch;
(5) technical parameter is adjusted, important technological parameters changes cutting tension force into 80N by original 75N, flow by 140 original L min change into 145L min, because polycrystal silicon ingot exists impurity layer, special cutting technique is taked to segmented cutting, impurity layer is mainly distributed in that polycrystal silicon ingot head is about 23mm, afterbody is about 37mm;
(6) whole process is monitored, polycrystalline side's ingot size Control of production is 156.3.
Claims (4)
1. the waste and old mortar secondary cycle of section is utilized a method, it is characterized in that: comprise the steps:
(1) choose the used waste and old mortar of silicon chip cutting, every cylinder mortar use amount is about 320L-330L, uses filter bag to filter while extracting waste and old mortar;
(2) the waste and old mortar of cutting into slices is prepared to adjustment again, allocate by the new sand that adds 50 Kg--60 Kg (1200#) in mortar a mixing bowl the inside, stir, in allocation process, use density tester to carry out slurry density test, reach evolution instructions for use slurry density 1.667-1.669Kg ㎡;
(3) excavation machine cutting chamber mortar circulation port place added to stainless steel screen pack, mortar jar double-layer filtering net be respectively to 80 orders and 150 orders change individual layer 800 object screen packs into;
(4) home roll evolution being used is that 156.8mm changes 157.0mm slot pitch into by original slot pitch;
(5) technical parameter is adjusted, important technological parameters changes cutting tension force into 80N by original 75N, flow by 140 original L min change into 145L min, because polycrystal silicon ingot exists impurity layer, special cutting technique is taked to segmented cutting, impurity layer is mainly distributed in that polycrystal silicon ingot head is about 20-25mm, afterbody is about 30--40 mm;
(6) whole process is monitored, polycrystalline side's ingot size Control of production is 156.3 ± 0.3.
2. the waste and old mortar secondary cycle of section as claimed in claim 1 is utilized method, it is characterized in that: in described step 1, filter bag is 150-180 order.
3. the waste and old mortar secondary cycle of section as claimed in claim 1 is utilized method, it is characterized in that: in described step 2, the density of waste and old mortar is 1.625-1.63Kg ㎡.
4. the waste and old mortar secondary cycle of section as claimed in claim 1 is utilized method, it is characterized in that: in described step 2, mixing time is 3.5-4 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410176832.9A CN103921363B (en) | 2014-04-29 | A kind of waste and old mortar secondary cycle Application way of cutting into slices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410176832.9A CN103921363B (en) | 2014-04-29 | A kind of waste and old mortar secondary cycle Application way of cutting into slices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103921363A true CN103921363A (en) | 2014-07-16 |
| CN103921363B CN103921363B (en) | 2016-11-30 |
Family
ID=
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105522657A (en) * | 2015-12-04 | 2016-04-27 | 湖南红太阳光电科技有限公司 | Secondary recycling method of silicon rod slicing waste mortar |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0990498A1 (en) * | 1998-09-10 | 2000-04-05 | Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft | Method and device for cutting wafers from a hard brittle ingot |
| US6113473A (en) * | 1997-04-25 | 2000-09-05 | G.T. Equipment Technologies Inc. | Method and apparatus for improved wire saw slurry |
| CN201998337U (en) * | 2010-10-26 | 2011-10-05 | 深圳市拓日新能源科技股份有限公司 | System for recovering cutting fluid and silicon carbide in waste mortar of siliconchip cutting |
| CN202826099U (en) * | 2012-08-09 | 2013-03-27 | 海润光伏科技股份有限公司 | Double-way cutting system for solar silicon wafer |
| JP2013166193A (en) * | 2012-02-15 | 2013-08-29 | Nippon Steel & Sumitomo Metal Corp | Method for cutting hard brittle ingot |
| CN103522431A (en) * | 2013-10-21 | 2014-01-22 | 山西潞安太阳能科技有限责任公司 | Silicon wafer cutting technology |
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6113473A (en) * | 1997-04-25 | 2000-09-05 | G.T. Equipment Technologies Inc. | Method and apparatus for improved wire saw slurry |
| EP0990498A1 (en) * | 1998-09-10 | 2000-04-05 | Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft | Method and device for cutting wafers from a hard brittle ingot |
| CN201998337U (en) * | 2010-10-26 | 2011-10-05 | 深圳市拓日新能源科技股份有限公司 | System for recovering cutting fluid and silicon carbide in waste mortar of siliconchip cutting |
| JP2013166193A (en) * | 2012-02-15 | 2013-08-29 | Nippon Steel & Sumitomo Metal Corp | Method for cutting hard brittle ingot |
| CN202826099U (en) * | 2012-08-09 | 2013-03-27 | 海润光伏科技股份有限公司 | Double-way cutting system for solar silicon wafer |
| CN103522431A (en) * | 2013-10-21 | 2014-01-22 | 山西潞安太阳能科技有限责任公司 | Silicon wafer cutting technology |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105522657A (en) * | 2015-12-04 | 2016-04-27 | 湖南红太阳光电科技有限公司 | Secondary recycling method of silicon rod slicing waste mortar |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103014852A (en) | Casting method of efficient polycrystalline silicon ingot | |
| CN102092102B (en) | Crystal-block bonding rod slicing process | |
| CN102729277B (en) | Hob type slicer | |
| CN202482487U (en) | Crystal multi-die growth device through adopting EFG (edge-defined, film-fed growth) method | |
| CN108162217A (en) | A kind of processing method of silico briquette | |
| CN103921363A (en) | Method for recycling wafer cutting waste mortar | |
| CN104493988B (en) | A kind of high viscosity mortar cutting technique for silicon chip cutting | |
| CN103773587B (en) | A kind of mortar generated in silicon chip cutting online recycling method and device thereof | |
| CN201752669U (en) | Artificial mica synthesis stepped crushing screening machine | |
| CN102528956A (en) | Modular combined on-line recycling treatment system for drained slurry generated by cutting silicon crystal using multi-wire-saw | |
| CN103921363B (en) | A kind of waste and old mortar secondary cycle Application way of cutting into slices | |
| CN105821473B (en) | A kind of efficient ingot preparation method of fritting for gluing crucible rate with low bottom | |
| CN101891194A (en) | Preparation method of semiconductor wafer cutting blade material | |
| CN103921361A (en) | Steel wire technology for cutting solar silicon wafers | |
| CN202388638U (en) | Device for cutting seed crystals by multiple wire electrodes | |
| CN103194792A (en) | Growth method of 9-inch czochralski silicon for manufacturing pseudo-single crystal seed | |
| CN109097821A (en) | A kind of processing of casting single crystal seed crystal and laying method | |
| CN205796692U (en) | Oil pipe line defecator adjusted by a kind of mortar recovery system cutting oil | |
| CN202239581U (en) | Energy-saving overhead cast plate machine system | |
| CN201272745Y (en) | Slag cement base production apparatus | |
| CN202462989U (en) | Feeding bottom plate of paper box grid plate machine | |
| CN208839655U (en) | A kind of preparation facilities of anode ternary precursor powder | |
| CN203064536U (en) | Secondary feeding cone-shaped hopper of raw material batching station | |
| CN208133351U (en) | Full-automatic silicon water-circulation filtering device for monocrystalline one machining process | |
| CN105316762A (en) | Preparation method of low-attenuation and high-efficiency N-type mono-like |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |