CN103901735B - Silicon chip penetrating mechanism - Google Patents
Silicon chip penetrating mechanism Download PDFInfo
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- CN103901735B CN103901735B CN201210587477.5A CN201210587477A CN103901735B CN 103901735 B CN103901735 B CN 103901735B CN 201210587477 A CN201210587477 A CN 201210587477A CN 103901735 B CN103901735 B CN 103901735B
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- silicon chip
- ejection pin
- flexible sucker
- pedestal
- chip penetrating
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Abstract
The invention discloses a kind of silicon chip penetrating mechanism, comprise: pedestal, driving mechanism, guiding mechanism, web joint and ejection pin, described driving mechanism is fixed on described pedestal, described ejection pin and guiding mechanism are fixed on described web joint, and, described silicon penetrating mechanism also comprises flexible sucker, and described flexible sucker is arranged at the top of described ejection pin and is connected with described ejection pin, and the inner side of described flexible sucker connects the apical side height of height lower than described ejection pin.The present invention has set up flexible sucker at the top of ejection pin, and flexible sucker is comparatively soft relative to the nonmetallic materials rigidity adopted in prior art, can fit tightly warpage sheet and ultrathin section, vacuum is not revealed, and ensure that effective absorption of silicon chip.
Description
Technical field
The present invention relates to lithographic equipment and manufacture field, particularly a kind of silicon chip penetrating mechanism.
Background technology
Along with the development of semicon industry, increasing advanced technology has been applied in the middle of this industry.Existing lithographic equipment is divided into two classes substantially, and a class is stepping lithographic equipment, and mask pattern single exposure is imaged on an exposure area of eyeglass; Another kind of is step-scan lithographic equipment, and mask pattern is not single exposure imaging, but passes through the scanning mobile imaging of projection light field.In step-scan lithographic equipment, work stage mainly comprises coarse motion platform, micropositioner and penetrating mechanism.Wherein, penetrating mechanism coordinates silicon chip transmission system to complete the handing-over function of silicon chip.Penetrating mechanism has the catenary motion function of single-degree-of-freedom, and has Incision Machine's, and the carrying realizing silicon chip is fixed and joins.
In the prior art, some ejection pins of penetrating mechanism are all connected with drive unit.When carrying out the handing-over of silicon chip, penetrating mechanism vacuum suction lives silicon chip, and then carries out the ejection of silicon chip, time upper slice, moved to sucker face by the stroke most significant digit of penetrating mechanism, silicon chip is steadily positioned on sucker; During bottom sheet, penetrating mechanism by some ejection pins absorption silicon chip, and by silicon chip by the ejection of sucker face to transmit machine hand position, realize bottom sheet function.A kind of silicon chip mechanical hand device has been disclosed in prior art, comprise: base plate, driving mechanism, gear train and the bearing plate in order to accept silicon chip, driving mechanism and gear train are fixed on base plate, and driving mechanism drives bearing plate to realize the catenary motion of silicon chip by gear train.The program solves the part of transmission manipulator loss in the past driving force, reduce the problem of transmission efficiency, but this transmission manipulator is when adsorbing warpage sheet and ultrathin section, often occur that vacuum can not be adsorbed completely, or adsorb hypodynamic problem, cause carrying out, in vertical ejection campaign, the serious problems such as silicon chip landing occur.Warpage sheet, to be out of shape serious ultrathin section flatness under gravity poor, after the some ejection pins by penetrating mechanism support, within the scope of ejection pin, the gap between silicon chip and ejection pin upper surface is larger, vacuum leak is serious, makes ejection pin well can not adsorb silicon chip.The bearing plate of this mechanism is directly connected with external vacuum pipeline simultaneously, and the vacuum of absorption silicon chip is provided by this passage.The drawback of this structure be will inevitably have a cable in the control of penetrating mechanism pull power, cause having certain parasitic stiffness and parasitic damping, affect control accuracy.
Summary of the invention
The invention provides a kind of silicon chip penetrating mechanism, to overcome warpage sheet in prior art, the silicon chip landing problem of ultrathin section because not caused by adsorbing completely.
For solving the problems of the technologies described above, the invention provides a kind of silicon chip penetrating mechanism, comprise: pedestal, driving mechanism, guiding mechanism, web joint and ejection pin, described driving mechanism is fixed on described pedestal, described ejection pin and guiding mechanism are fixed on described web joint, preferably, also comprise flexible sucker, described flexible sucker is arranged at the top of described ejection pin and is connected with described ejection pin.
As preferably, described flexible sucker adopts silastic material to make.
As preferably, the shape of described flexible sucker is bowl-type or bellow-shaped.
As preferably, described flexible sucker is connected with described ejection pin by bonding mode.
As preferably, the inner side of described flexible sucker connects the apical side height of height lower than described ejection pin.
As preferably, described guiding mechanism is air-float guide rail.
As preferably, described guiding mechanism comprises the axis of guide, slide block and restriction rotating mechanism, wherein, the described axis of guide and restriction rotating mechanism are all fixed on described pedestal, the described axis of guide is through the center of described web joint, and described slide block is arranged on the surrounding of the described axis of guide and is connected with described web joint.
As preferably, be also provided with malleation through hole in described silicon chip penetrating mechanism, described malleation through hole arrives the interface of the described axis of guide and slide block through described pedestal and the axis of guide.
As preferably, one end of described pedestal is provided with the positive-pressure rotary joint corresponding with described malleation through hole.
As preferably, described driving mechanism is voice coil motor.
As preferably, described driving mechanism comprises mover and stator, and wherein, described stator is connected with described pedestal, and described mover is connected with described web joint.
As preferably, the number of described ejection pin is at least 3.
As preferably, be provided with vacuum through holes in described silicon chip penetrating mechanism, described vacuum through holes passes described pedestal, guiding mechanism, web joint and ejection pin successively until the bottom of described flexible sucker.
As preferably, one end of described pedestal is provided with the vacuum adapter corresponding with described vacuum through holes.
Compared with prior art, the present invention has the following advantages: the present invention has set up flexible sucker at the top of ejection pin, flexible sucker is comparatively soft relative to the nonmetallic materials rigidity adopted in prior art, warpage sheet and ultrathin section can be fitted tightly, vacuum is not revealed, ensure that effective absorption of silicon chip.Vacuum passage is realized by internal duct design simultaneously, can avoid there is exterior line in motion process further and connect and the parasitic capacity of introducing, thus avoid external disturbance on the impact controlling servo, improve penetrating mechanism motion control accuracy.
Accompanying drawing explanation
Fig. 1 is the structural representation of silicon chip penetrating mechanism in the embodiment of the invention;
Fig. 2 is the structural representation of bowl-type flexible sucker in the embodiment of the invention;
Structural representation when Fig. 3 is flexible sucker absorption silicon chip in the embodiment of the invention;
Fig. 4 is the structural representation of bellow-shaped flexible sucker in the embodiment of the invention.
In figure: 10-pedestal, 20-driving mechanism, 201-mover, 202-stator, 30-guiding mechanism, the 301-axis of guide, 302-slide block, 303-limit rotating mechanism, 40-web joint, 50-ejection pin, 60-flexible sucker, 70-malleation through hole, 70a-positive-pressure rotary joint, 80-vacuum through holes, 80a-vacuum adapter, 90-silicon chip.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.It should be noted that, accompanying drawing of the present invention all adopts the form of simplification and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
Please refer to Fig. 1, and composition graphs 2 ~ 4, the invention provides a kind of silicon chip penetrating mechanism, comprise: pedestal 10, driving mechanism 20, guiding mechanism 30, web joint 40 and ejection pin 50, described driving mechanism 20 is fixed on described pedestal 10, and described ejection pin 50 and guiding mechanism 30 are fixed on described web joint 40.Preferably, described silicon chip penetrating mechanism also comprises a flexible sucker 60, and described flexible sucker 60 is arranged at the top of described ejection pin 50 and is connected with described ejection pin 50.Particularly, because the rigidity of described flexible sucker 60 is lower, compared with the nonmetallic materials that the rigidity adopted in prior art is larger, flexible sucker 60 can better adsorb silicon chip 90, even if described silicon chip 90 is warpage sheet or ultrathin section, flexible sucker 60 still can fit tightly silicon chip 90, ensures that vacuum is not revealed, avoids silicon chip 90 to come off in adsorption process.
Please refer to Fig. 2 ~ 4, and composition graphs 1, described flexible sucker 60 adopts silastic material to make, the flexible sucker 60 that described silastic material is made, there is anti-aging, nontoxic, high-low temperature resistant and elastomeric feature, can ensure that flexible sucker 60 is closely fitted warpage sheet and ultrathin section, ensure that vacuum is not revealed.
Please refer to Fig. 2 and Fig. 4, the shape of described flexible sucker 60 is bowl-type or bellow-shaped, guarantees the adsorbability of described flexible sucker 60, and preferably, described flexible sucker 60 is connected with described ejection pin 50 by bonding mode, and method is simple, be convenient to realize.Because flexible sucker 60 is after 90s at absorption silicon chip, metaboly as shown in Figure 3 can be there is, therefore, in the present embodiment, the inner side of flexible sucker 60 connects the apical side height of height lower than described ejection pin 50, guarantees that flexible sucker 60 can not be affected in the flatness that absorption silicon chip is after 90s.
Continue referring to Fig. 1, described guiding mechanism 30 is air-float guide rail, therefore, does not need lubricant grease to lubricate in shown guiding mechanism 30, thus avoids lubricant grease particle volatilization pollution silicon chip 90, thus ensure that the reliability of described silicon chip penetrating mechanism.Preferably, described guiding mechanism 30 comprises the axis of guide 301, slide block 302 and restriction rotating mechanism 303, wherein, the described axis of guide 301 and restriction rotating mechanism 303 are all fixed on described pedestal 10, the described axis of guide 301 is through the center of described web joint 40, and described slide block 302 is arranged on the surrounding of the described axis of guide 301 and is connected with described web joint 40.Particularly, slide block 302 is under the drive of described driving mechanism 20, move up and down along the described axis of guide 301, thus drive described ejection pin 50 to complete absorption and the transfer operation of silicon chip 90, described restriction rotating mechanism 303, for limiting described slide block 302, avoids the relative rotary motion produced between slide block 302 and the axis of guide 301 circumferentially.
As preferably, be also provided with malleation through hole 70 in described silicon chip penetrating mechanism, described malleation through hole 70 arrives the interface of the described axis of guide 301 and slide block 302 through described pedestal 10 and the axis of guide 301.Preferably, one end of described pedestal 10 is provided with the positive-pressure rotary joint 70a corresponding with described malleation through hole 70.Particularly, barotropic gas enters into described silicon chip penetrating mechanism by described positive-pressure rotary joint 70a, and the interface place of the axis of guide 301 and slide block 302 is arrived by malleation through hole 70, and form malleation air film herein, realize frictionless motion between slide block 302 and the described axis of guide 301.
Continue referring to Fig. 1, described driving mechanism 20 is voice coil motor, and preferably, described driving mechanism 20 comprises mover 201 and stator 202, and wherein, described stator 202 is connected with described pedestal 10, and described mover 201 is connected with described web joint 40.Particularly, mover 201 drives web joint 40 and ejection pin 50 to move up and down, thus flexible sucker 60 is adsorbed and mobile silicon chip 90.Adopt voice coil motor as driving mechanism 20 in the present embodiment, adopt air-float guide rail as guiding mechanism 30, make described silicon chip penetrating mechanism reach very high control accuracy, perfect further silicon chip penetrating mechanism performance.
As preferably, in the present embodiment, the number of described ejection pin 50 is at least 3, certainly, the number of described flexible sucker 60 is identical with the number of described ejection pin 50, and more than 3 ejection pins 50 can be good at holding described silicon chip 90, guarantee that silicon chip 90 obscission can not occur.
Continue referring to Fig. 1, be provided with vacuum through holes 80 in described silicon chip penetrating mechanism, described vacuum through holes 80 passes described pedestal 10, guiding mechanism 30, web joint 40 and ejection pin 50 successively until the bottom of described flexible sucker 60.Preferably, one end of described pedestal 10 is provided with the vacuum adapter 80a corresponding with described vacuum through holes 80.Particularly, during described silicon chip penetrating mechanism work, vacuum enters into vacuum through holes 80 by vacuum adapter 80a, and arrive described flexible sucker 60 by final in ejection pin 50, flexible sucker 60 starts to adsorb silicon chip 90.The present embodiment is by realizing the absorption of silicon chip 90 at silicon chip penetrating mechanism indoor design pipeline and vacuum through holes 80, without the need to using cable, avoid the parasitic capacity introduced because exterior line connects in motion process, thus avoid external disturbance on the impact controlling servo, improve the control accuracy of silicon chip penetrating mechanism.
Preferably, in the present embodiment, the described axis of guide 301 is divided into zone of positive pressure, region of no pressure and seal area 3 regions by described malleation through hole 70 and vacuum through holes 80, wherein, region of no pressure and zone of positive pressure are kept apart by seal area, avoid, between barotropic gas and vacuum gas, crosstalk occurs.It should be noted that, number due to described ejection pin 50 is multiple, and the output port number of vacuum through holes 80 is corresponding with the number of described ejection pin 50, therefore, the structure of the vacuum through holes 80 in Figure of description 1 of the present invention is only signal, and the structure and layout of vacuum through holes 80 are not limited in shown in accompanying drawing 1.
In sum, silicon chip penetrating mechanism of the present invention, comprise: pedestal 10, driving mechanism 20, guiding mechanism 30, web joint 40 and ejection pin 50, described driving mechanism 20 is fixed on described pedestal 10, and described ejection pin 50 and guiding mechanism 30 are fixed on described web joint 40.Preferably, described silicon chip penetrating mechanism also comprises a flexible sucker 60, and described flexible sucker 60 is arranged at the top of described ejection pin 50 and is connected with described ejection pin 50.The flexible sucker 60 that the present invention increases newly can better adsorb silicon chip 90, even if described silicon chip 90 is warpage sheet or ultrathin section, flexible sucker 60 still can fit tightly silicon chip 90, ensures that vacuum is not revealed, avoids silicon chip 90 to come off in adsorption process; Can avoid in motion process, there is exterior line to connect and the parasitic capacity of introducing simultaneously, thus avoid external disturbance on the impact controlling servo, improve penetrating mechanism motion control accuracy.
Obviously, those skilled in the art can carry out various change and modification to invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (12)
1. a silicon chip penetrating mechanism, comprise: pedestal, driving mechanism, guiding mechanism, web joint and ejection pin, described driving mechanism is fixed on described pedestal, described ejection pin and guiding mechanism are fixed on described web joint, it is characterized in that, also comprise flexible sucker, described flexible sucker is arranged at the top of described ejection pin and is connected with described ejection pin, and the inner side of described flexible sucker connects the apical side height of height lower than described ejection pin;
Be provided with vacuum through holes in described silicon chip penetrating mechanism, described vacuum through holes passes described pedestal, guiding mechanism, web joint and ejection pin successively until the bottom of described flexible sucker.
2. silicon chip penetrating mechanism as claimed in claim 1, is characterized in that, described flexible sucker adopts silastic material to make.
3. silicon chip penetrating mechanism as claimed in claim 1, it is characterized in that, the shape of described flexible sucker is bowl-type or bellow-shaped.
4. silicon chip penetrating mechanism as claimed in claim 1, it is characterized in that, described flexible sucker is connected with described ejection pin by bonding mode.
5. silicon chip penetrating mechanism as claimed in claim 1, it is characterized in that, described guiding mechanism is air-float guide rail.
6. silicon chip penetrating mechanism as claimed in claim 5, it is characterized in that, described guiding mechanism comprises the axis of guide, slide block and restriction rotating mechanism, wherein, the described axis of guide and restriction rotating mechanism are all fixed on described pedestal, the described axis of guide is through the center of described web joint, and the surrounding that described slide block is arranged on the described axis of guide moves along the axis of guide and is connected with described web joint.
7. silicon chip penetrating mechanism as claimed in claim 6, is characterized in that, be also provided with malleation through hole in described silicon chip penetrating mechanism, and described malleation through hole arrives the interface of the described axis of guide and slide block through described pedestal and the axis of guide.
8. silicon chip penetrating mechanism as claimed in claim 7, it is characterized in that, one end of described pedestal is provided with the positive-pressure rotary joint corresponding with described malleation through hole.
9. silicon chip penetrating mechanism as claimed in claim 1, it is characterized in that, described driving mechanism is voice coil motor.
10. silicon chip penetrating mechanism as claimed in claim 9, it is characterized in that, described driving mechanism comprises mover and stator, and wherein, described stator is connected with described pedestal, and described mover is connected with described web joint.
11. silicon chip penetrating mechanisms as claimed in claim 1, it is characterized in that, the number of described ejection pin is at least 3.
12. silicon chip penetrating mechanisms as claimed in claim 1, is characterized in that, one end of described pedestal is provided with the vacuum adapter corresponding with described vacuum through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210587477.5A CN103901735B (en) | 2012-12-28 | 2012-12-28 | Silicon chip penetrating mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210587477.5A CN103901735B (en) | 2012-12-28 | 2012-12-28 | Silicon chip penetrating mechanism |
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| Publication Number | Publication Date |
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| CN103901735A CN103901735A (en) | 2014-07-02 |
| CN103901735B true CN103901735B (en) | 2016-02-03 |
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| CN201210587477.5A Active CN103901735B (en) | 2012-12-28 | 2012-12-28 | Silicon chip penetrating mechanism |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252791B (en) * | 2015-06-12 | 2019-02-19 | 睿励科学仪器（上海）有限公司 | Silicon wafer sucking disc |
| CN109597279B (en) * | 2017-09-30 | 2023-09-29 | 上海微电子装备（集团）股份有限公司 | Vacuum adsorption hand, substrate handing-over device and photoetching machine |
| CN110032044B (en) * | 2018-01-12 | 2021-03-19 | 上海微电子装备（集团）股份有限公司 | Substrate handover mechanism, photoetching machine and substrate handover method |
| CN110824850B (en) * | 2018-08-10 | 2021-02-02 | 上海微电子装备（集团）股份有限公司 | Silicon wafer handing-over manipulator and silicon wafer handing-over device |
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| US6279976B1 (en) * | 1999-05-13 | 2001-08-28 | Micron Technology, Inc. | Wafer handling device having conforming perimeter seal |
| US6942265B1 (en) * | 2002-10-23 | 2005-09-13 | Kla-Tencor Technologies Corporation | Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto |
| CN201171044Y (en) * | 2008-01-25 | 2008-12-24 | 沈阳芯源微电子设备有限公司 | Apparatus for adsorbing base plate |
| CN102074458A (en) * | 2010-11-19 | 2011-05-25 | 华中科技大学 | Chip peeling device |
| CN102569151A (en) * | 2010-12-30 | 2012-07-11 | 上海微电子装备有限公司 | Silicon wafer mechanical hand |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006033498A1 (en) * | 2004-09-24 | 2006-03-30 | Hanmi Semiconductor Co., Ltd. | Chuck table for semiconductor manufacturing process |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6279976B1 (en) * | 1999-05-13 | 2001-08-28 | Micron Technology, Inc. | Wafer handling device having conforming perimeter seal |
| US6942265B1 (en) * | 2002-10-23 | 2005-09-13 | Kla-Tencor Technologies Corporation | Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto |
| CN201171044Y (en) * | 2008-01-25 | 2008-12-24 | 沈阳芯源微电子设备有限公司 | Apparatus for adsorbing base plate |
| CN102074458A (en) * | 2010-11-19 | 2011-05-25 | 华中科技大学 | Chip peeling device |
| CN102569151A (en) * | 2010-12-30 | 2012-07-11 | 上海微电子装备有限公司 | Silicon wafer mechanical hand |
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| CN103901735A (en) | 2014-07-02 |
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Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Co-patentee after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Co-patentee before: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |