CN103869231B - A kind of probe card automatic replacing options of wafer acceptability test - Google Patents
A kind of probe card automatic replacing options of wafer acceptability test Download PDFInfo
- Publication number
- CN103869231B CN103869231B CN201410059971.3A CN201410059971A CN103869231B CN 103869231 B CN103869231 B CN 103869231B CN 201410059971 A CN201410059971 A CN 201410059971A CN 103869231 B CN103869231 B CN 103869231B
- Authority
- CN
- China
- Prior art keywords
- probe card
- board
- type
- automatic
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The present invention discloses the automatic replacing options of probe card of a kind of wafer acceptability test, wherein, step one: automatic job distribution system carries out inquiring about the probe card type needed for this test by Recipe the man-hour of sending of WAT test;Step 2: automatic job distribution system queries needs the probe card type sent on the board of work;If the probe card type on board is consistent with required probe card type, card need not be changed, if the probe card type on board and required probe card Type-Inconsistencies, need to change card;Step 3: the probe card in board is swapped out by board automatic-exchanging system, meanwhile, board automatic-exchanging system selects the probe card of desirable type and this probe card is changed to board;Step 4: the probe card of desirable type changes to rear Lot test and starts.The present invention is used to realize the automatic replacing of probe card, the use frequency of balance probe card, the problem being effectively prevented from occurring misplacing card when manually changing card by probe card Stoker, probe card handling system and automatic-exchanging system.
Description
Technical field
The present invention relates to a kind of semiconductor test field, particularly relate to a kind of wafer acceptability and survey
The automatic replacing options of probe card of examination.
Background technology
(Wafer Acceptance Test is called for short: WAT) in existing wafer acceptability test
Probe card is all that the probe card type needed according to manufacturing method thereof (Recipe) by operator is entered
Row is manually changed, this substitute mode inefficiency, and easily occurs misplacing the feelings of probe card
Condition.Meanwhile, artificial probe card is changed it cannot be guaranteed that the utilization rate of probe card of same type keeps
Unanimously, easily occur that a few probe card excessively use, and the shape that other probe card is on the shelf
Condition.And probe card be manually replaced with in order to WAT board realize full-automation test barrier
Hinder.
Summary of the invention
In view of the above problems, the present invention provides the probe card of a kind of wafer acceptability test automatic
Replacing options.
The present invention solves the technical scheme that technical problem used:
A kind of probe card automatic replacing options of wafer acceptability test, wherein, step one:
Automatic job distribution system carries out inquiring about this by manufacturing method thereof man-hour of sending of wafer acceptability test
Probe card type needed for secondary test;Step 2: automatic job distribution system queries needs to send the machine of work
Probe card type on platform;If the probe card type on board is consistent with required probe card type
Then need not change card, if the probe card type on board and required probe card Type-Inconsistencies, need
Card to be changed;Step 3: the probe card in board is swapped out by board automatic-exchanging system, meanwhile,
Board automatic-exchanging system selects the probe card of desirable type and this probe card is changed to board;Step
Rapid four: the probe card of desirable type changes to the test of rear wafer batch and starts.
The automatic replacing options of probe card of above-mentioned a kind of wafer acceptability test, wherein, bag
Include probe card handling system, in step 3, the probe that probe card handling system will swap out in board
Card is transported to probe card row.
The automatic replacing options of probe card of above-mentioned a kind of wafer acceptability test, wherein, visits
The probe card of desirable type is transported to board by pin card handling system.
The automatic replacing options of probe card of above-mentioned a kind of wafer acceptability test, wherein, step
In rapid three, board automatic-exchanging system selects in the probe card of desirable type accumulative testing time
A few probe card.
The automatic replacing options of probe card of above-mentioned a kind of wafer acceptability test, wherein, step
In rapid four, during test, the accumulative pricking times of the probe card of desirable type is counted system by board.
The automatic replacing options of probe card of above-mentioned a kind of wafer acceptability test, wherein, institute
Probe card is had to leave in probe card row.
The automatic replacing options of probe card of above-mentioned a kind of wafer acceptability test, wherein, machine
Probe card information is had on platform.
Technique scheme has the advantage that or beneficial effect:
Probe card is realized by probe card row, probe card handling system and automatic-exchanging system
Automatically change, the use frequency of balance probe card, be effectively prevented from when manually changing card occurring misplacing
The problem of card.
Accompanying drawing explanation
With reference to appended accompanying drawing, more fully to describe embodiments of the invention.But, appended
Accompanying drawing is merely to illustrate and illustrates, is not intended that limitation of the scope of the invention.
Fig. 1 is the automatic replacing options of probe card of a kind of wafer acceptability test of the present invention
Flow chart.
Detailed description of the invention
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, but not as this
The restriction of invention.
Fig. 1 is the automatic replacing options of probe card of a kind of wafer acceptability test of the present invention
Flow chart, shown in Figure 1.
A kind of probe card automatic replacing options of the wafer acceptability test of the present invention, including with
Lower step:
Step one: automatic job distribution system 1 carries out passing through Recipe the man-hour of sending of WAT test
Inquire about the probe card type needed for this test;
Step 2: the existing spy needing to send on the board 3 of work is read in automatic job distribution system 1 inquiry
Pin card type information;If the probe card type on board 3 is consistent with required probe card type,
Card need not be changed, if the probe card type on board 3 and required probe card Type-Inconsistencies, need
Card to be changed;
Step 3: the probe card in board 3 is swapped out by board automatic-exchanging system, meanwhile, machine
Platform automatic-exchanging system selects the probe card of desirable type and this probe card is changed to board 3;
Step 4: after the probe card of desirable type changes to, wafer batch (Lot) test starts.
The present invention the most also has a following embodiment:
In further embodiment of the present invention, continuing with shown in Figure 1.Also include probe
Card handling system.If the probe card type on board 3 and required probe card Type-Inconsistencies,
Needs change card, in step 3, and the probe card carrying that probe card handling system will swap out in board 3
Arrange (Stoker) 2 to probe card, and the probe card of desirable type is removed by probe card handling system
Transport to board 3.
In further embodiment of the present invention, in step 3, the probe card at desirable type has many
When card can select, tired in the probe card of board automatic-exchanging system prioritizing selection desirable type
One probe card of measurement examination least number of times, and the probe card of desirable type is transported to board 3.
In further embodiment of the present invention, in step 4, after required probe card changes to board 3
Test starts, and during test, the accumulative pricking times of the probe card of desirable type is counted and is by board 3
System.
In further embodiment of the present invention, all probe card leave in probe card Stoker2.
In further embodiment of the present invention, existing probe card information on board.
In sum, use a kind of automatic replacing options of WAT probe card of the present invention, pass through
Probe card Stoker, probe card handling system and automatic-exchanging system realize the automatic of probe card
Change, the use frequency of balance probe card, be effectively prevented from when manually changing card occurring misplacing card
Problem.
The foregoing is only preferred embodiment of the present invention, not thereby limit the enforcement of the present invention
Mode and protection domain, to those skilled in the art, it should can appreciate that all utilizations
Equivalent done by description of the invention and diagramatic content and obviously change gained
The scheme arrived, all should be included in protection scope of the present invention.
Claims (6)
1. the automatic replacing options of the probe card of a wafer acceptability test, it is characterised in that
Step one: automatic job distribution system carries out passing through processing procedure the man-hour of sending of wafer acceptability test
Method inquires about the probe card type needed for this test;
Step 2: automatic job distribution system queries needs the probe card type sent on the board of work;As
Really the probe card type on board is consistent with required probe card type, need not change card, if board
On probe card type and required probe card Type-Inconsistencies then need to change card;
Step 3: the probe card in board is swapped out by board automatic-exchanging system, meanwhile, board
Automatic-exchanging system selects the probe card of desirable type and this probe card is changed to board;
Step 4: the probe card of desirable type changes to the test of rear wafer batch and starts;
Including probe card handling system, in step 3, probe card handling system swaps out in board
Probe card be transported to probe card row.
The probe card of the wafer acceptability test side of replacing automatically the most according to claim 1
Method, it is characterised in that the probe card of desirable type is transported to board by probe card handling system.
The probe card of the wafer acceptability test side of replacing automatically the most according to claim 1
Method, it is characterised in that in step 3, board automatic-exchanging system selects the probe of desirable type
The probe card that in card, accumulative testing time is minimum.
The probe card of the wafer acceptability test side of replacing automatically the most according to claim 1
Method, it is characterised in that in step 4, board adding up the probe card of desirable type during test
Pricking times counts system.
The probe card of the wafer acceptability test side of replacing automatically the most according to claim 2
Method, it is characterised in that all probe card leave in probe card row.
The probe card of the wafer acceptability test side of replacing automatically the most according to claim 1
Method, it is characterised in that have probe card information on board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410059971.3A CN103869231B (en) | 2014-02-21 | 2014-02-21 | A kind of probe card automatic replacing options of wafer acceptability test |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410059971.3A CN103869231B (en) | 2014-02-21 | 2014-02-21 | A kind of probe card automatic replacing options of wafer acceptability test |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103869231A CN103869231A (en) | 2014-06-18 |
CN103869231B true CN103869231B (en) | 2017-01-04 |
Family
ID=50907975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410059971.3A Active CN103869231B (en) | 2014-02-21 | 2014-02-21 | A kind of probe card automatic replacing options of wafer acceptability test |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103869231B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110297110B (en) * | 2018-03-21 | 2022-02-15 | 科磊股份有限公司 | Probe structure, clamp, containing box, automatic probe replacing system and method |
CN108535622A (en) * | 2018-04-28 | 2018-09-14 | 德淮半导体有限公司 | Wafer tester, system and method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6246250B1 (en) * | 1998-05-11 | 2001-06-12 | Micron Technology, Inc. | Probe card having on-board multiplex circuitry for expanding tester resources |
CN101105504A (en) * | 2006-07-10 | 2008-01-16 | 中芯国际集成电路制造(上海)有限公司 | Probe card device |
TW201314215A (en) * | 2011-07-06 | 2013-04-01 | Celadon Systems Inc | Test apparatus having a probe card and connector mechanism |
CN103336256A (en) * | 2013-06-26 | 2013-10-02 | 上海华力微电子有限公司 | WAT probe card intelligent processing system and method |
CN103413771A (en) * | 2013-06-04 | 2013-11-27 | 上海华力微电子有限公司 | Dispatching method of wafer acceptance test machine |
-
2014
- 2014-02-21 CN CN201410059971.3A patent/CN103869231B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6246250B1 (en) * | 1998-05-11 | 2001-06-12 | Micron Technology, Inc. | Probe card having on-board multiplex circuitry for expanding tester resources |
CN101105504A (en) * | 2006-07-10 | 2008-01-16 | 中芯国际集成电路制造(上海)有限公司 | Probe card device |
TW201314215A (en) * | 2011-07-06 | 2013-04-01 | Celadon Systems Inc | Test apparatus having a probe card and connector mechanism |
CN103413771A (en) * | 2013-06-04 | 2013-11-27 | 上海华力微电子有限公司 | Dispatching method of wafer acceptance test machine |
CN103336256A (en) * | 2013-06-26 | 2013-10-02 | 上海华力微电子有限公司 | WAT probe card intelligent processing system and method |
Also Published As
Publication number | Publication date |
---|---|
CN103869231A (en) | 2014-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106708909A (en) | Data quality detection method and apparatus | |
JP2019077549A (en) | Shelf management system and shelf management method | |
CN105990170B (en) | Analytical method of wafer yield and device | |
CN103617508A (en) | Configurable business rule plug-in extension apparatus and business rule plug-in extension method | |
KR20160044320A (en) | Method and apparatus for item put-away task management | |
CN103869231B (en) | A kind of probe card automatic replacing options of wafer acceptability test | |
US20190188545A1 (en) | Radio-frequency identification-based shelf level inventory counting | |
CN108259346A (en) | A kind of equivalent route item establishing method and device | |
CN108259334A (en) | A kind of equivalent route item establishing method and device | |
CN109783956A (en) | Maximum jump time violation repairing method and system based on region division | |
CN104199738B (en) | A kind of more data processing equipment collaboration working methods and system | |
CN108648156A (en) | Desultory point labeling method, device, electronic equipment and storage medium in point cloud data | |
CN108063101B (en) | Sampling method for wafer defect test | |
CN106330759A (en) | Method and device for adjusting ACL table items | |
CN104539557B (en) | Counting messages report CPU method and device | |
CN104979232A (en) | Method for storing wafer transfer box and system for realizing storage of wafer transfer box | |
KR20010092650A (en) | Apparatus and method for generating map data | |
Sankle et al. | Single sampling plans for variables indexed by AQL and AOQL with measurement error | |
CN111768136A (en) | Inventory scheduling method and device | |
CN104700435A (en) | Method for compressing layout data by using OASIS (organization for the advancement of structured information standards) graphic arrays | |
CN106356325B (en) | A kind of device and method applied to the scheduling of Equipment for Heating Processing wafer transfer | |
CN105679690B (en) | The method for improving test wafer service life | |
CN103135021B (en) | The silicon chip level volume production method of testing of super-small chip | |
CN102543960A (en) | Integrated circuit for testing | |
CN105912596A (en) | Method and device for operation of databases |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |