CN103869231A - Probe card automatic changing method for wafer acceptance test (WAT) - Google Patents
Probe card automatic changing method for wafer acceptance test (WAT) Download PDFInfo
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- CN103869231A CN103869231A CN201410059971.3A CN201410059971A CN103869231A CN 103869231 A CN103869231 A CN 103869231A CN 201410059971 A CN201410059971 A CN 201410059971A CN 103869231 A CN103869231 A CN 103869231A
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Abstract
The invention discloses a probe card automatic changing method for a wafer acceptance test (WAT). The probe card automatic changing method for the WAT comprises the steps that 1, an automatic dispatching system inquires the probe card type needed by the test by virtue of Recipe when the automatic dispatching system performs dispatching for the WAT; 2, the automatic dispatching system inquires the probe card type on a machine in need of being dispatched, wherein the card does not need to be changed if the probe card type on the machine is consistent with the needed probe card type, and the card needs to be changed if the probe card type on the machine is inconsistent with the needed probe card type; 3, a machine automatic changing system takes out the probe card from the machine, and meanwhile, the machine automatic changing system selects the probe card in the needed type and changes the probe card into the machine; 4, the Lot test begins after the probe card in the needed type is replaced. Automatic changing of the probe card is realized by virtue of the probe card Stoker, a probe card handling system and the automatic changing system, the use frequency of the probe card can be balanced, and the problem of misplacing of a card during manual switch of the card can be effectively avoided.
Description
Technical field
The present invention relates to a kind of semiconductor test field, the probe that relates in particular to a kind of wafer acceptability test is changed method automatically.
Background technology
Existing wafer acceptability test (Wafer Acceptance Test, be called for short: WAT) probe is all that the probe type being needed according to manufacturing method thereof (Recipe) by operating personnel is manually changed, this substitute mode inefficiency, and easily there is misplacing the situation of probe.Meanwhile, manually change the utilization rate that probe can not ensure the probe of same type and be consistent, easily occur that a few probe are excessively used, and other probe situation on the shelf.And probe be manually replaced with the obstacle of realizing full-automatic test for WAT board.
Summary of the invention
In view of the above problems, the probe that the invention provides a kind of wafer acceptability test is changed method automatically.
The technical scheme that technical solution problem of the present invention adopts is:
The probe of wafer acceptability test is changed a method automatically, wherein, step 1: automatic job distribution system carry out wafer acceptability test send inquire about this by manufacturing method thereof man-hour to test required probe type; Step 2: automatic job distribution system queries need to be sent the probe type on the board of work; If the probe type on board is consistent with required probe type, need not change card, if the probe type on board and required probe Type-Inconsistencies need to change card; Step 3: board automatic-exchanging system swaps out the probe in board, meanwhile, board automatic-exchanging system is selected the probe of required type and this probe is changed to board; Step 4: the probe of required type changes to batch test of rear wafer and starts.
The probe of above-mentioned a kind of wafer acceptability test is changed method automatically, wherein, comprises probe handling system, and in step 3, the probe swapping out in board is transported to probe row by probe handling system.
The probe of above-mentioned a kind of wafer acceptability test is changed method automatically, and wherein, the probe of required type is transported to board by probe handling system.
The probe of above-mentioned a kind of wafer acceptability test is changed method automatically, and wherein, in step 3, board automatic-exchanging system is selected a minimum probe of accumulative total testing time in the probe of required type.
The probe of above-mentioned a kind of wafer acceptability test is changed method automatically, and wherein, in step 4, when test, the accumulative total pricking times of the probe of required type is counted system by board.
The probe of above-mentioned a kind of wafer acceptability test is changed method automatically, and wherein, all probe leave in probe row.
The probe of above-mentioned a kind of wafer acceptability test is changed method automatically, wherein, has probe information on board.
Technique scheme tool has the following advantages or beneficial effect:
By the automatic replacing that probe is arranged, probe handling system and automatic-exchanging system are realized probe, the frequency of utilization of balance probe, avoids occurring misplacing while manually changing card the problem of card effectively.
Brief description of the drawings
With reference to appended accompanying drawing, to describe more fully embodiments of the invention.But appended accompanying drawing only, for explanation and elaboration, does not form limitation of the scope of the invention.
Fig. 1 is the process flow diagram that the probe of a kind of wafer acceptability test of the present invention is changed method automatically.
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
Fig. 1 is the process flow diagram that the probe of a kind of wafer acceptability test of the present invention is changed method automatically, shown in Figure 1.
The probe of a kind of wafer acceptability test of the present invention is changed method automatically, comprises the following steps:
Step 1: automatic job distribution system 1 carry out WAT test send inquire about this by Recipe man-hour to test required probe type;
Step 2: the existing probe type information on the board 3 that need to send work is read in 1 inquiry of automatic job distribution system; If the probe type on board 3 is consistent with required probe type, need not change card, if the probe type on board 3 and required probe Type-Inconsistencies need to change card;
Step 3: board automatic-exchanging system swaps out the probe in board 3, meanwhile, board automatic-exchanging system is selected the probe of required type and this probe is changed to board 3;
Step 4: after the probe of required type changes to, wafer batch (Lot) test starts.
The present invention also has following embodiment on the basis of the above:
In further embodiment of the present invention, please continue shown in Figure 1.Also include probe handling system.If the probe type on board 3 and required probe Type-Inconsistencies, need to change card, in step 3, the probe swapping out in board 3 is transported to probe row (Stoker) 2 by probe handling system, and the probe of required type is transported to board 3 by probe handling system.
In further embodiment of the present invention, in step 3, in the time that the probe of required type has multiple cards to select, a minimum probe of accumulative total testing time in the preferential probe of selecting required type of board automatic-exchanging system, and the probe of required type is transported to board 3.
In further embodiment of the present invention, in step 4, required probe changes to the rear test of board 3 and starts, and when test, the accumulative total pricking times of the probe of required type is counted system by board 3.
In further embodiment of the present invention, all probe leave in probe Stoker2.
In further embodiment of the present invention, existing probe information on board.
In sum, use a kind of WAT probe of the present invention automatically to change method, realize the automatic replacing of probe by probe Stoker, probe handling system and automatic-exchanging system, the frequency of utilization of balance probe, avoids occurring misplacing while manually changing card the problem of card effectively.
The foregoing is only preferred embodiment of the present invention; not thereby limit embodiments of the present invention and protection domain; to those skilled in the art; the scheme that being equal to of should recognizing that all utilizations instructions of the present invention and diagramatic content done replaces and apparent variation obtains, all should be included in protection scope of the present invention.
Claims (7)
1. the probe of wafer acceptability test is changed a method automatically, it is characterized in that,
Step 1: automatic job distribution system carry out wafer acceptability test send inquire about this by manufacturing method thereof man-hour to test required probe type;
Step 2: automatic job distribution system queries need to be sent the probe type on the board of work; If the probe type on board is consistent with required probe type, need not change card, if the probe type on board and required probe Type-Inconsistencies need to change card;
Step 3: board automatic-exchanging system swaps out the probe in board, meanwhile, board automatic-exchanging system is selected the probe of required type and this probe is changed to board;
Step 4: the probe of required type changes to batch test of rear wafer and starts.
2. the probe of wafer acceptability test is changed method automatically according to claim 1, it is characterized in that, comprises probe handling system, and in step 3, the probe swapping out in board is transported to probe row by probe handling system.
3. the probe of wafer acceptability test is changed method automatically according to claim 2, it is characterized in that, the probe of required type is transported to board by probe handling system.
4. the probe of wafer acceptability test is changed method automatically according to claim 1, it is characterized in that, in step 3, board automatic-exchanging system is selected a minimum probe of accumulative total testing time in the probe of required type.
5. the probe of wafer acceptability test is changed method automatically according to claim 1, it is characterized in that, in step 4, when test, the accumulative total pricking times of the probe of required type is counted system by board.
6. the probe of wafer acceptability test is changed method automatically according to claim 3, it is characterized in that, all probe leave in probe row.
7. the probe of wafer acceptability test is changed method automatically according to claim 1, it is characterized in that, has probe information on board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410059971.3A CN103869231B (en) | 2014-02-21 | 2014-02-21 | A kind of probe card automatic replacing options of wafer acceptability test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410059971.3A CN103869231B (en) | 2014-02-21 | 2014-02-21 | A kind of probe card automatic replacing options of wafer acceptability test |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103869231A true CN103869231A (en) | 2014-06-18 |
| CN103869231B CN103869231B (en) | 2017-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410059971.3A Active CN103869231B (en) | 2014-02-21 | 2014-02-21 | A kind of probe card automatic replacing options of wafer acceptability test |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108535622A (en) * | 2018-04-28 | 2018-09-14 | 德淮半导体有限公司 | Wafer tester, system and method |
| CN110297110A (en) * | 2018-03-21 | 2019-10-01 | 科磊股份有限公司 | Probe structure, fixture, container, automation probe replacement system and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6246250B1 (en) * | 1998-05-11 | 2001-06-12 | Micron Technology, Inc. | Probe card having on-board multiplex circuitry for expanding tester resources |
| CN101105504A (en) * | 2006-07-10 | 2008-01-16 | 中芯国际集成电路制造(上海)有限公司 | Probe card device |
| TW201314215A (en) * | 2011-07-06 | 2013-04-01 | Celadon Systems Inc | Test apparatus having a probe card and connector mechanism |
| CN103336256A (en) * | 2013-06-26 | 2013-10-02 | 上海华力微电子有限公司 | WAT probe card intelligent processing system and method |
| CN103413771A (en) * | 2013-06-04 | 2013-11-27 | 上海华力微电子有限公司 | Dispatching method of wafer acceptance test machine |
-
2014
- 2014-02-21 CN CN201410059971.3A patent/CN103869231B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6246250B1 (en) * | 1998-05-11 | 2001-06-12 | Micron Technology, Inc. | Probe card having on-board multiplex circuitry for expanding tester resources |
| CN101105504A (en) * | 2006-07-10 | 2008-01-16 | 中芯国际集成电路制造(上海)有限公司 | Probe card device |
| TW201314215A (en) * | 2011-07-06 | 2013-04-01 | Celadon Systems Inc | Test apparatus having a probe card and connector mechanism |
| CN103413771A (en) * | 2013-06-04 | 2013-11-27 | 上海华力微电子有限公司 | Dispatching method of wafer acceptance test machine |
| CN103336256A (en) * | 2013-06-26 | 2013-10-02 | 上海华力微电子有限公司 | WAT probe card intelligent processing system and method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110297110A (en) * | 2018-03-21 | 2019-10-01 | 科磊股份有限公司 | Probe structure, fixture, container, automation probe replacement system and method |
| CN110297110B (en) * | 2018-03-21 | 2022-02-15 | 科磊股份有限公司 | Probe structure, clamp, containing box, automatic probe replacing system and method |
| CN108535622A (en) * | 2018-04-28 | 2018-09-14 | 德淮半导体有限公司 | Wafer tester, system and method |
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| Publication number | Publication date |
|---|---|
| CN103869231B (en) | 2017-01-04 |
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