CN103855148A - Led filament and lighting device - Google Patents
Led filament and lighting device Download PDFInfo
- Publication number
- CN103855148A CN103855148A CN201410014680.2A CN201410014680A CN103855148A CN 103855148 A CN103855148 A CN 103855148A CN 201410014680 A CN201410014680 A CN 201410014680A CN 103855148 A CN103855148 A CN 103855148A
- Authority
- CN
- China
- Prior art keywords
- bonding area
- crystal bonding
- led filament
- fluorescent glue
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention is applied to the field of lighting technologies and provides an LED filament and a lighting device. The LED filament comprises a metal framework and fluorescence gel. At least one surface of the metal framework is provided with a solid crystal area, a plurality of LED chips are arranged on the solid crystal areas, and the portion, where the solid crystal areas are located, of the metal framework is covered with the fluorescence gel. In this way, light emitted by the LED chips on the solid crystal areas can excite the surrounding fluorescence gel to generate light in needed colors, and therefore the problem of blue leakage of the LED filament can be solved. Thus, the LED filament can be widely applied to various lighting devices and is excellent in lighting effect.
Description
Technical field
The invention belongs to lighting technical field, relate in particular to a kind of LED filament and lighting device.
Background technology
At present, LED filament light sources product is mainly by transparent ceramic or glass substrate forming wiring board, thereby reaches the luminous object of wide-angle.But transparent ceramic and glass substrate are expensive, make complexity, and thermal conductivity is low, generally use power <1W, and encapsulation finished product cannot fundamentally solve Lou blue problem.
Summary of the invention
The object of the embodiment of the present invention is to provide a kind of LED filament, is intended to solve existing LED filament and has the blue problem of leaking.
The embodiment of the present invention is achieved in that a kind of LED filament, comprises metallic framework and fluorescent glue, and crystal bonding area is established at least one surface of described metallic framework, and multiple LED chips are located at described crystal bonding area, and described fluorescent glue wraps the part metals skeleton at place, crystal bonding area.
Another object of the embodiment of the present invention is to provide a kind of lighting device, and described lighting device adopts above-mentioned LED filament.
Crystal bonding area is located at metallic framework by the embodiment of the present invention, then wrapped the part metals skeleton at place, crystal bonding area by fluorescent glue, be located at like this optical excitation periphery fluorescent glue that the LED chip of described crystal bonding area sends and produce the light of required color, leak blue problem thereby solve LED filament.Thereby this LED filament can be widely used in various lighting devices, illuminating effect is splendid.
Brief description of the drawings
Fig. 1 is the structural representation of the LED filament that provides of the embodiment of the present invention;
Fig. 2 is the side-looking structure chart of Fig. 1;
Fig. 3 is the structural representation of the metallic framework that provides of the embodiment of the present invention;
Fig. 4 is the side-looking structure chart of Fig. 3;
Fig. 5 is the structural representation (being only connected extension and bending part by plastic parts) of the metallic framework that provides of the embodiment of the present invention;
Fig. 6 is Fig. 5 B-B schematic cross-section;
Fig. 7 is in the cross sectional representation of crystal bonding area shown in Fig. 1 (having offered through hole).
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Crystal bonding area is located at metallic framework by the embodiment of the present invention, then wrapped the part metals skeleton at place, crystal bonding area by fluorescent glue, be located at like this optical excitation periphery fluorescent glue that the LED chip of described crystal bonding area sends and produce the light of required color, leak blue problem thereby solve LED filament.
Below in conjunction with specific embodiment, realization of the present invention is described in detail.
As shown in Fig. 1～4, the LED filament that the embodiment of the present invention provides comprises metallic framework 1 and fluorescent glue 2, crystal bonding area 11 is established on described metallic framework 1 at least one surface, and multiple LED chips 3 are located at described crystal bonding area 11, and described fluorescent glue 2 wraps the part metals skeleton at 11 places, crystal bonding area.Be located at like this optical excitation periphery fluorescent glue that the LED chip 3 of described crystal bonding area 11 sends and produce the light of required color, leak blue problem thereby solve LED filament.Passage using described metallic framework 1 as chip support, heat radiation, electrical interconnection herein, thermal conductivity and intensity are all higher, have promoted the reliability of this LED filament, can make in other words more high-power LED filament.
Conventionally, described LED filament can be both bilateral single electrode, can be also monolateral bipolar electrode, flexible design.As shown in Figure 3,4, the LED filament that the present embodiment provides is taked bilateral single electrode pattern, and wherein said metallic framework 1 two ends are weld zone 12, and 11You one end, described crystal bonding area and weld zone 12 disconnect, so the positive and negative electrode of this LED filament is disconnected, and destroy less to whole metallic framework 1.Certainly, 11 two ends, described crystal bonding area all disconnect and also can with corresponding weld zone 12.
Wherein, a bending part 13 is established with that one end that weld zone 12 disconnects in described crystal bonding area 11, establishes an extension 14 with the weld zone 12 that described crystal bonding area 11 disconnects, and described extension 14 is parallel to bending part 13, as shown in Figure 3,4.Locate extension 14 and bending part 13 at this by described fluorescent glue 2, make it to be separated by a distance, and be parallel to each other.This structural design, after described fluorescent glue 2 moulding, has strengthened the bonding strength of the gap of described crystal bonding area 11 and weld zone 12, further promotes the reliability of this LED filament.Also can locate linking by the plastic parts 16 after solidifying to described extension 14, bending part 13 separately herein, make described extension 14 be parallel to bending part 13, thereby the positive and negative electrode disconnecting is engaged togather, as shown in Figure 5,6.Described extension 14 and bending part 13 are embedded in this plastic parts 16, can be to be partly or entirely wrapped in plastic cement, so ensure that positive and negative electrode position is relatively stable, at not easy fracture of gap, have improved the bulk strength of described metallic framework 1 simultaneously.Wherein, described plastic parts 16 can be made up of transparent or other colouring plastic (as thermoplastic or thermosetting material).
For strengthening button glue power, ensure described fluorescent glue 2 and metallic framework 1 bond strength, establish to fill the through hole 15 of fluorescent glue near the end of crystal bonding area 11 in described weld zone 12.The through hole 15 of this increase has reduced the area of the excessive glue of described fluorescent glue, also can shorten the distance of described fluorescent glue at the metallic framework 1 excessive glue in surface.As preferably, described through hole 15 is only filled by fluorescent glue near the part of crystal bonding area 11, so both can reach aforementioned effect, can save again described fluorescent glue.The surface of described crystal bonding area 11 is coated with nickel film, silverskin or golden film, strengthens this LED filament light extraction efficiency with this.
For optimizing this LED filamentray structure, described metallic framework 1 overall length b is not less than 8mm, and the width a of described weld zone is greater than 0.2mm, and thickness e is greater than 0.1mm, is less than 0.5mm; The length c of described crystal bonding area 11 is greater than 50% of metallic framework 1 overall length b, and the width d of described crystal bonding area 11 is greater than 0.3mm.Described fluorescent glue 2 is for being mixed with the thermosets of fluorescent material, and its length f is greater than the length c of described crystal bonding area 11, and width g is not less than the width d of described crystal bonding area 11, and thickness h is greater than 0.3mm, so that the part metals skeleton at 11 places, crystal bonding area is wrapped.It is square, circular or oval that the cross section of described fluorescent glue 2 can be.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (12)
1. a LED filament, is characterized in that, comprises metallic framework and fluorescent glue, and described metallic framework middle part is crystal bonding area, and multiple LED chips are located at described crystal bonding area, and described fluorescent glue wraps the part metals skeleton at place, crystal bonding area.
2. LED filament as claimed in claim 1, is characterized in that, described metallic framework two ends are weld zone, and described crystal bonding area has at least one end and weld zone to disconnect.
3. LED filament as claimed in claim 1 or 2, is characterized in that, a bending part is established in that one end that described crystal bonding area and weld zone disconnect, and establishes an extension with the weld zone that described crystal bonding area disconnects, and described extension is parallel to bending part.
4. LED filament as claimed in claim 3, is characterized in that, by the plastic parts after solidifying, described extension, bending part location is connected, and makes described extension be parallel to bending part.
5. LED filament as claimed in claim 1 or 2, is characterized in that, described crystal bonding area is established multiple in order to fill the through hole of fluorescent glue, and each through hole is between adjacent LED chip.
6. LED filament as claimed in claim 3, is characterized in that, the through hole of fluorescent glue is established to fill in described weld zone near the end of crystal bonding area.
7. LED filament as claimed in claim 6, is characterized in that, described through hole is only filled by fluorescent glue near the part of crystal bonding area.
8. the LED filament as described in claim 6 or 7, is characterized in that, the surface of described crystal bonding area is coated with nickel film, silverskin or golden film.
9. LED filament as claimed in claim 3, is characterized in that, described metallic framework overall length b is not less than 8mm, and the width a of described weld zone is greater than 0.2mm, and thickness e is greater than 0.1mm, is less than 0.5mm; The length c of described crystal bonding area is greater than 50% of metallic framework overall length b, and the width d of described crystal bonding area is greater than 0.3mm.
10. LED filament as claimed in claim 9, is characterized in that, described fluorescent glue is the thermosets that is mixed with fluorescent material, and its length f is greater than the length c of described crystal bonding area, and width g is not less than the width d of described crystal bonding area, and thickness h is greater than 0.3mm.
11. LED filaments as claimed in claim 10, is characterized in that, the cross section of described fluorescent glue is square, circular or oval.
12. 1 kinds of lighting devices, is characterized in that, described lighting device adopts the LED filament as described in any one in claim 1～11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410014680.2A CN103855148B (en) | 2014-01-06 | 2014-01-13 | LED filament and illuminator |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2014100058356 | 2014-01-06 | ||
| CN201410005835.6 | 2014-01-06 | ||
| CN201420006625 | 2014-01-06 | ||
| CN201410005835 | 2014-01-06 | ||
| CN201420006625.4 | 2014-01-06 | ||
| CN2014200066254 | 2014-01-06 | ||
| CN201410014680.2A CN103855148B (en) | 2014-01-06 | 2014-01-13 | LED filament and illuminator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103855148A true CN103855148A (en) | 2014-06-11 |
| CN103855148B CN103855148B (en) | 2017-03-08 |
Family
ID=50862603
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410014680.2A Expired - Fee Related CN103855148B (en) | 2014-01-06 | 2014-01-13 | LED filament and illuminator |
| CN201420019691.5U Expired - Fee Related CN203733836U (en) | 2014-01-06 | 2014-01-13 | LED filament and illuminating device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420019691.5U Expired - Fee Related CN203733836U (en) | 2014-01-06 | 2014-01-13 | LED filament and illuminating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN103855148B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855148B (en) * | 2014-01-06 | 2017-03-08 | 深圳市瑞丰光电子股份有限公司 | LED filament and illuminator |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW540168B (en) * | 2002-03-11 | 2003-07-01 | Harvatek Corp | LED package with metal substrates protrusion outside the glue |
| US20050041424A1 (en) * | 1999-11-18 | 2005-02-24 | Color Kinetics, Inc. | Systems and methods for converting illumination |
| RU2369943C2 (en) * | 2007-03-19 | 2009-10-10 | Валентин Николаевич Щербаков | Light-emitting diode matrix |
| KR20100052031A (en) * | 2008-11-10 | 2010-05-19 | 서울반도체 주식회사 | Led module |
| CN102709454A (en) * | 2012-05-30 | 2012-10-03 | 上舜照明（中国）有限公司 | Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof |
| CN203367277U (en) * | 2013-07-01 | 2013-12-25 | 临安市新三联照明电器有限公司 | A cylindrical LED filament |
| CN203733836U (en) * | 2014-01-06 | 2014-07-23 | 深圳市瑞丰光电子股份有限公司 | LED filament and illuminating device |
-
2014
- 2014-01-13 CN CN201410014680.2A patent/CN103855148B/en not_active Expired - Fee Related
- 2014-01-13 CN CN201420019691.5U patent/CN203733836U/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050041424A1 (en) * | 1999-11-18 | 2005-02-24 | Color Kinetics, Inc. | Systems and methods for converting illumination |
| TW540168B (en) * | 2002-03-11 | 2003-07-01 | Harvatek Corp | LED package with metal substrates protrusion outside the glue |
| RU2369943C2 (en) * | 2007-03-19 | 2009-10-10 | Валентин Николаевич Щербаков | Light-emitting diode matrix |
| KR20100052031A (en) * | 2008-11-10 | 2010-05-19 | 서울반도체 주식회사 | Led module |
| CN102709454A (en) * | 2012-05-30 | 2012-10-03 | 上舜照明（中国）有限公司 | Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof |
| CN203367277U (en) * | 2013-07-01 | 2013-12-25 | 临安市新三联照明电器有限公司 | A cylindrical LED filament |
| CN203733836U (en) * | 2014-01-06 | 2014-07-23 | 深圳市瑞丰光电子股份有限公司 | LED filament and illuminating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN203733836U (en) | 2014-07-23 |
| CN103855148B (en) | 2017-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103840071B (en) | A kind of LED lamp bar manufacture method and LED lamp bar | |
| CN105226167A (en) | A kind of flexible LED filament of full angle luminescence and manufacture method thereof | |
| JP2016539480A (en) | Spiral LED filament and light bulb using the spiral LED filament | |
| CN103700652A (en) | Spiral LED package lamp filament | |
| CN104347610A (en) | Embedded LED device, manufacture method thereof, and luminescence device | |
| CN102024804B (en) | Mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness | |
| CN203850298U (en) | An LED lamp filament | |
| CN204922861U (en) | Illumination is with light source and lighting device | |
| CN103851388B (en) | A kind of LED filament substrate and illuminator | |
| CN103855147A (en) | LED lamp filament and lamp | |
| CN103390714A (en) | Integral type LED (Light Emitting Diode) encapsulation structure and method | |
| CN203787425U (en) | LED filament and illuminator | |
| CN203733836U (en) | LED filament and illuminating device | |
| CN103872033A (en) | LED (light-emitting diode) lamp filament and illuminator | |
| CN103855146A (en) | Led filament and lighting device | |
| JP2015015406A (en) | Led module and lighting device having the same | |
| CN204240091U (en) | Illumination light source and lighting device | |
| JP5635659B1 (en) | Surface light emitter unit and unit connector | |
| CN105757467A (en) | LED light-emitting lamp bar as well as LED filament bulb lamp and LED lamp tube using same | |
| CN203644775U (en) | LED filament and lighting apparatus | |
| CN104819390A (en) | Light source for irradiation and irradiation device | |
| CN203746847U (en) | LED filament and illumination device | |
| CN203733794U (en) | LED filament and lamp | |
| CN103236434B (en) | A kind of LED bulb light machine module of transparency carrier | |
| JP2018032748A (en) | Light-emitting device, illumination apparatus and manufacturing method of light-emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170308 Termination date: 20180113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |