CN103855145A - LED lamp filament and illumination device - Google Patents
LED lamp filament and illumination device Download PDFInfo
- Publication number
- CN103855145A CN103855145A CN201410013430.7A CN201410013430A CN103855145A CN 103855145 A CN103855145 A CN 103855145A CN 201410013430 A CN201410013430 A CN 201410013430A CN 103855145 A CN103855145 A CN 103855145A
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- substrate
- led filament
- bonding area
- led
- led lamp
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Abstract
The invention provides an LED lamp filament and an illumination device. The LED lamp filament and the illumination device are suitable for the technical field of illumination. The LED lamp filament comprises a substrate and fluorescent adhesives. A plurality of bent die bonding regions are formed in the middle of the substrate, a plurality of LED chips are arranged along the bent die bonding regions in sequence, and the die bonding regions and the LED chips are completely coated with the fluorescent adhesives. In this way, a dark region on the reverse side of the substrate is divided into a plurality of small dispersed dark regions, the area of each small dark region will be decreased in the corresponding die bonding region corner due to the optical coupling effect, total reflection of emitted light happens easily in the fluorescent adhesives because the thicknesses of fluorescent adhesives on the two sides of the LED chips in the bent die bonding regions differ, light can be conveniently mixed in the fluorescent adhesives, the light can be reflected to the reverse side of the substrate through the thick side of the fluorescent adhesives, and the light color uniformity of the whole LED lamp is improved. The LED lamp filament can be widely applied to all kinds of light-emitting devices.
Description
Technical field
The invention belongs to lighting technical field, relate in particular to a kind of LED filament and ligthing paraphernalia.
Background technology
At present, LED filament product is by BT plate or FR4, and the opaque substrate such as metal substrate is made, and after lighting, tends to have dark space at substrate back, and photochromic consistency is poor, affects illuminating effect.
Summary of the invention
The object of the embodiment of the present invention is to provide a kind of LED filament, is intended to solve the poor problem of the photochromic consistency of existing LED filament.
The embodiment of the present invention is achieved in that a kind of LED filament, comprises substrate and fluorescent glue, and described substrate middle part is for forming the crystal bonding area of multiple bendings, and multiple LED chips sequentially arrange along described bending, by the completely coated crystal bonding area of described fluorescent glue and LED chip.
Another object of the embodiment of the present invention is to provide a kind of ligthing paraphernalia, and described ligthing paraphernalia adopts above-mentioned LED filament.
The embodiment of the present invention makes the crystal bonding area of LED filament substrate mold multiple bendings, multiple LED chips sequentially arrange along described bending, like this substrate back dark space is divided into multiple discrete little dark spaces, and in crystal bonding area corner, because the each little dark space of optical coupling effect will further reduce, again because LED chip both sides fluorescent glue variable thickness in described bending causes, its light sending is easy to generation total reflection in fluorescent glue, this is not only beneficial to light and mixes in fluorescent glue, can also make light by the thicker lateral reflection of fluorescent glue to substrate back, so improve the photochromic consistency of whole LED filament.Thereby this LED filament can be widely used in various ligthing paraphernalias.
Accompanying drawing explanation
Fig. 1 is the structural representation (simultaneously illustrating the light sending in the LED chip of rake) of the LED filament that provides of the embodiment of the present invention;
Fig. 2 is Figure 1A-A schematic cross-section;
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The embodiment of the present invention makes the crystal bonding area of LED filament substrate mold multiple bendings, multiple LED chips sequentially arrange along described bending, like this substrate back dark space is divided into multiple discrete little dark spaces, and in crystal bonding area corner, because the each little dark space of optical coupling effect will further reduce, again because LED chip both sides fluorescent glue variable thickness in described bending causes, its light sending is easy to generation total reflection in fluorescent glue, this is not only beneficial to light and mixes in fluorescent glue, can also make light by the thicker lateral reflection of fluorescent glue to substrate back, so improve the photochromic consistency of whole LED filament.
Below in conjunction with specific embodiment, realization of the present invention is described in detail.
As shown in Figure 1, 2, the LED filament that the embodiment of the present invention provides comprises substrate 1 and fluorescent glue 2, described substrate 1 middle part is the crystal bonding area 11 that forms multiple bendings, and multiple LED chips 3 sequentially arrange along described bending, by the completely coated crystal bonding area 11 of described fluorescent glue 2 and LED chip 3.Wherein, described substrate 1 is BT plate or FR4, the opaque substrate such as metal substrate.So described substrate 1 dark space, the back side is divided into multiple discrete little dark spaces, and in crystal bonding area 11 corners, because the each little dark space of optical coupling effect will further reduce, again because the 3 both sides fluorescent glue variable thickness of LED chip in described bending cause, its light sending is easy to the interior generation total reflection of fluorescent glue 2, this is not only beneficial to light and mixes in fluorescent glue 2, can also make light by the thicker lateral reflection of fluorescent glue to substrate 1 back side, so improved the photochromic consistency of whole LED filament.
As preferably, described bending is by left flat part 16, right flat part 17 and form with the rake 18 of right flat part 17 in order to be connected left flat part 16, and the opaque board structure of making is thus simple, and cost is low.Especially, all set firmly three LED chips 3 in described left flat part 16 and right flat part 17, set firmly a LED chip 3 in described rake 18.These LED chips 3 act synergistically, and make substrate 1 front, back side colour temperature and brightness consistent.
Substrate 1 containing described bending in the embodiment of the present invention first processes by machining, chemical etching or other forming method.Then, make the interconnected circuit of LED chip 3 and external electrical in 11 designs of described crystal bonding area.Then, by fluorescent glue 2 described in the technological forming such as injection moulding or mold pressing, make it entirely to wrap up the part substrate at LED chip 3 and place, 11(Ji crystal bonding area, crystal bonding area), thus realize similar incandescent lamp illumination effect.
Conventionally, described LED filament can be both bilateral single electrode, can be also monolateral bipolar electrode, flexible design.As shown in Figure 1, the LED filament that the present embodiment provides is taked bilateral single electrode pattern, and wherein said substrate 1 two ends are weld zone 12, and 11You one end, described crystal bonding area and weld zone 12 disconnect, so the positive and negative electrode of this LED filament is disconnected, and destroy less to whole substrate 1.Certainly, 11 two ends, described crystal bonding area all disconnect and also can with corresponding weld zone 12.
Wherein, establish an extension 14 with the weld zone 12 that described crystal bonding area 11 disconnects, described extension 14 is parallel to the flat part at 11 places, one end, crystal bonding area, as shown in Figure 1.Locate extension 14 and flat part at this by described fluorescent glue 2, make it to be separated by a distance, and be parallel to each other.This structural design, after described fluorescent glue 2 moulding, has strengthened the bonding strength of the gap of described crystal bonding area 11 and weld zone 12, further promotes the reliability of this LED filament.
For strengthening button glue power, guarantee described fluorescent glue 2 and substrate 1 bond strength, establish to fill the through hole 15 of fluorescent glue near the end of crystal bonding area 11 in described weld zone 12.The through hole 15 of this increase has reduced the area of the excessive glue of described fluorescent glue, also can shorten the distance of described fluorescent glue at the substrate 1 excessive glue in surface.As preferably, described through hole 15 is only filled by fluorescent glue near the part of crystal bonding area 11, so both can reach aforementioned effect, can save again described fluorescent glue.The surface of described substrate 11 is coated with silverskin or golden film, strengthens this LED filament light extraction efficiency with this.Wherein, described fluorescent glue 2 is for being mixed with the thermosets (as silica gel, epoxy resin) of fluorescent material, and it is square, circular or oval that its cross section may be molded to.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (8)
1. a LED filament, is characterized in that, comprises substrate and fluorescent glue, and described substrate middle part is for forming the crystal bonding area of multiple bendings, and multiple LED chips sequentially arrange along described bending, by the completely coated crystal bonding area of described fluorescent glue and LED chip.
2. LED filament as claimed in claim 1, is characterized in that, described bending is by left flat part, right flat part and form in order to the rake that is connected left flat part and right flat part.
3. LED filament as claimed in claim 1 or 2, is characterized in that, described substrate two ends are weld zone, and described crystal bonding area has at least one end and weld zone to disconnect.
4. LED filament as claimed in claim 3, is characterized in that, establishes an extension with the weld zone that described crystal bonding area disconnects, and described extension is parallel to the flat part at place, one end, crystal bonding area.
5. LED filament as claimed in claim 4, is characterized in that, the through hole of fluorescent glue is established to fill in described weld zone near the end of crystal bonding area.
6. the LED filament as described in claim 4 or 5, is characterized in that, described substrate surface is coated with silverskin or golden film.
7. LED filament as claimed in claim 6, is characterized in that, the cross section of described fluorescent glue is square, circular or oval.
8. a ligthing paraphernalia, is characterized in that, described ligthing paraphernalia adopts the LED filament as described in any one in claim 1～7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410013430.7A CN103855145B (en) | 2014-01-13 | 2014-01-13 | A kind of LED filament and ligthing paraphernalia |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410013430.7A CN103855145B (en) | 2014-01-13 | 2014-01-13 | A kind of LED filament and ligthing paraphernalia |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103855145A true CN103855145A (en) | 2014-06-11 |
| CN103855145B CN103855145B (en) | 2017-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410013430.7A Expired - Fee Related CN103855145B (en) | 2014-01-13 | 2014-01-13 | A kind of LED filament and ligthing paraphernalia |
Country Status (1)
| Country | Link |
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| CN (1) | CN103855145B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538389A (en) * | 2014-12-29 | 2015-04-22 | 四川柏狮光电技术有限公司 | Metal substrate LED lamp filament and preparing method thereof |
Citations (9)
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| US6371637B1 (en) * | 1999-02-26 | 2002-04-16 | Radiantz, Inc. | Compact, flexible, LED array |
| TW540168B (en) * | 2002-03-11 | 2003-07-01 | Harvatek Corp | LED package with metal substrates protrusion outside the glue |
| US20050162850A1 (en) * | 2002-08-26 | 2005-07-28 | Luk John F. | Flexible LED lighting strip |
| CN101360947A (en) * | 2006-09-12 | 2009-02-04 | 罗仲炜 | Integrally formed single piece light emitting diode light wire |
| CN101471335A (en) * | 2007-09-25 | 2009-07-01 | 三洋电机株式会社 | Light emitting module and method for manufacturing the same |
| CN102738361A (en) * | 2011-03-31 | 2012-10-17 | 山一电机股份有限公司 | Luminous-body flexible board and luminous device |
| JP2013149431A (en) * | 2012-01-18 | 2013-08-01 | Sharp Corp | Linear light source and method for manufacturing the same, and liquid crystal display device |
| CN203367277U (en) * | 2013-07-01 | 2013-12-25 | 临安市新三联照明电器有限公司 | A cylindrical LED filament |
| CN203746847U (en) * | 2014-01-13 | 2014-07-30 | 深圳市瑞丰光电子股份有限公司 | LED filament and illumination device |
-
2014
- 2014-01-13 CN CN201410013430.7A patent/CN103855145B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6371637B1 (en) * | 1999-02-26 | 2002-04-16 | Radiantz, Inc. | Compact, flexible, LED array |
| TW540168B (en) * | 2002-03-11 | 2003-07-01 | Harvatek Corp | LED package with metal substrates protrusion outside the glue |
| US20050162850A1 (en) * | 2002-08-26 | 2005-07-28 | Luk John F. | Flexible LED lighting strip |
| CN101360947A (en) * | 2006-09-12 | 2009-02-04 | 罗仲炜 | Integrally formed single piece light emitting diode light wire |
| CN101471335A (en) * | 2007-09-25 | 2009-07-01 | 三洋电机株式会社 | Light emitting module and method for manufacturing the same |
| CN102738361A (en) * | 2011-03-31 | 2012-10-17 | 山一电机股份有限公司 | Luminous-body flexible board and luminous device |
| JP2013149431A (en) * | 2012-01-18 | 2013-08-01 | Sharp Corp | Linear light source and method for manufacturing the same, and liquid crystal display device |
| CN203367277U (en) * | 2013-07-01 | 2013-12-25 | 临安市新三联照明电器有限公司 | A cylindrical LED filament |
| CN203746847U (en) * | 2014-01-13 | 2014-07-30 | 深圳市瑞丰光电子股份有限公司 | LED filament and illumination device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538389A (en) * | 2014-12-29 | 2015-04-22 | 四川柏狮光电技术有限公司 | Metal substrate LED lamp filament and preparing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103855145B (en) | 2017-09-15 |
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Granted publication date: 20170915 Termination date: 20180113 |