CN103851600A - Radiating module and light emitting device - Google Patents
Radiating module and light emitting device Download PDFInfo
- Publication number
- CN103851600A CN103851600A CN201210505233.8A CN201210505233A CN103851600A CN 103851600 A CN103851600 A CN 103851600A CN 201210505233 A CN201210505233 A CN 201210505233A CN 103851600 A CN103851600 A CN 103851600A
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- China
- Prior art keywords
- load bearing
- heat abstractor
- light
- bearing unit
- bogey
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000007788 liquid Substances 0.000 claims description 7
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- 230000005693 optoelectronics Effects 0.000 claims description 2
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- 230000000694 effects Effects 0.000 description 3
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- 150000002739 metals Chemical class 0.000 description 3
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- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention discloses a radiating module and a light emitting device. The radiating module comprises a bearing device and a plurality of heat sources. The bearing device comprises a body part and a plurality of through-penetration parts, and the through-penetration parts penetrate through the body part. The heat sources are located on the body part and are opposite to the through-penetration parts, so that the air flows through the heat sources through the through-penetration parts, and the heat source radiating efficiency is improved.
Description
Technical field
The present invention relates to a kind of radiating module and light-emitting device, in detail, relate to a kind of radiating module and light-emitting device that improves radiating efficiency.
Background technology
Existing light-emitting device comprises multiple luminescence units and a housing (Housing), and wherein said luminescence unit is contained in this housing.Although this case cover residence is stated luminescence unit and can be protected described luminescence unit, but, so can hinder cross-ventilation, affect radiating efficiency.Because described luminescence unit conventionally can produce a large amount of heat in the time working; if heat energy cannot in time be got rid of, will make the performance of described luminescence unit impaired, cause its poor operation efficiency; if when described luminescence unit is light emitting diode, also has the problem of color drift.Moreover described existing luminescence unit is generally full slice system, or is connected to each other with fin each other, so, easily has heat and concentrate and mutually exchange because of heat the shortcomings such as impact each other.
In addition,, after the size of housing is fixed, the number of its luminescence unit that can hold is determined immediately, thereby cannot be expanded to hold more luminescence unit again; As held more luminescence unit, can only change the housing of large-size.So, the range of application of this existing light-emitting device is restricted, and its cost is also higher on manufacturing.
Therefore, be necessary to provide a kind of radiating module and light-emitting device of innovation, to address the above problem.
Summary of the invention
The invention provides a kind of radiating module, it comprises a bogey and multiple thermal source.This bogey has a body and multiple portion of running through, described in the portion of running through run through this body.Described thermal source is positioned on this body, and the position of described thermal source is for to run through between portion with respect to described, thereby air is flowed through between described thermal source via the described portion of running through, to promote the radiating efficiency of described thermal source.Thus, can effectively reduce the operating temperature of described thermal source.
The present invention also provides a kind of light-emitting device, and it comprises multiple light-emitting components, a bogey and multiple heat abstractor.This bogey has a body, multiple portion and multiple connecting portion of running through, and described in the portion of running through run through this body.Described in each, light-emitting component is attached to a first end of heat abstractor described in each, described in each, the first end of heat abstractor is attached on this body, described heat abstractor is positioned on described connecting portion, to make described light-emitting component corresponding to described connecting portion, and the position of described heat abstractor is for to run through between portion with respect to described, thereby air is flowed through between described heat abstractor, to promote the radiating efficiency of described heat abstractor via the described portion of running through.Thus, can effectively reduce the operating temperature of described light-emitting component.
Brief description of the drawings
Fig. 1 shows the schematic perspective view of an embodiment of radiating module of the present invention;
Fig. 2 shows the elevational schematic view of an embodiment of radiating module of the present invention;
Fig. 3 shows the elevational schematic view of the bogey in radiating module of the present invention;
Fig. 4 shows the schematic perspective view of another embodiment of radiating module of the present invention;
Fig. 5 shows the generalized section of an embodiment of the heat abstractor in radiating module of the present invention;
Fig. 6 shows the generalized section of another embodiment of the heat abstractor in radiating module of the present invention;
Fig. 7 shows the generalized section of another embodiment of the heat abstractor in radiating module of the present invention;
Fig. 8 shows the schematic perspective view of another embodiment of radiating module of the present invention;
Fig. 9 shows the schematic perspective view of another embodiment of radiating module of the present invention;
Figure 10 shows the elevational schematic view of another embodiment of radiating module of the present invention;
Figure 11 shows the perspective exploded view of the radiating module of Fig. 9;
Figure 12 shows the schematic perspective view of another embodiment of radiating module of the present invention;
Figure 13 shows the elevational schematic view of another embodiment of load bearing unit in radiating module of the present invention;
Figure 14 shows the elevational schematic view of the bogey being made up of the load bearing unit of Figure 13;
Figure 15 shows the elevational schematic view of another embodiment of load bearing unit in radiating module of the present invention;
Figure 16 shows the elevational schematic view of the bogey being made up of the load bearing unit of Figure 15;
Figure 17 shows the elevational schematic view of another embodiment of load bearing unit in radiating module of the present invention; And
Figure 18 shows the elevational schematic view of the bogey being made up of the load bearing unit of Figure 17.
Main element symbol description
One embodiment of 1 radiating module of the present invention
Another embodiment of 1a radiating module of the present invention
Another embodiment of 1b radiating module of the present invention
Another embodiment of 1c radiating module of the present invention
Another embodiment of 1d radiating module of the present invention
2 heat abstractors
Another embodiment of 2a heat abstractor of the present invention
Another embodiment of 2b heat abstractor of the present invention
10 bogeys
10a bogey
10b bogey
10c bogey
12 thermals source
14 stem portion
16 load bearing units
18 load bearing units
Another embodiment of 18a load bearing unit
Another embodiment of 18b load bearing unit
Another embodiment of 18c load bearing unit
20 hollow tubes
21 sidewalls
22 radiating fins
24 first seal covers
26 second seal covers
28 cooling fluids
32 substrates
34 crystal grain
36 wires
38 adhesive materials
101 bodies
101a body
101b body
101c body
102 run through portion
102a runs through portion
102b runs through portion
102c runs through portion
103 connecting portions
181 supporting parts
182 extensions
211 hollow cavities
212 first openings
213 second openings
261 potholes
262 through holes
321 first surfaces
322 second surfaces.
Detailed description of the invention
Please refer to Fig. 1 and Fig. 2, show respectively solid and the elevational schematic view of an embodiment of radiating module of the present invention.This radiating module 1 comprises a bogey 10, multiple thermal source 12 and multiple heat abstractor 2.
Please refer to Fig. 3, show the elevational schematic view of the bogey in radiating module of the present invention.This bogey 10 has a body 101, multiple portion 102 and multiple connecting portion 103 of running through.In the present embodiment, described connecting portion 103 is multiple carrying open-works, and described connecting portion 103(carrying open-work) and described in run through portion 102 and run through this body 101.In the present embodiment, the body 101 of this bogey 10 is a flat board, its material be can heat conduction metal or plastics that can not heat conduction.The described portion 102 of running through is for multiple open-works, itself and described connecting portion 103(carrying open-work) all run through this flat board, and described in run through portion 102 and described connecting portion 103(carries open-work) be all arrayed.Preferably, at every two connecting portion 103(carrying open-work) between there is one and run through portion 102, this connecting portion 103(carry open-work) be circle, and this to run through portion 102 be rectangle.
Refer again to Fig. 1 and Fig. 2, described thermal source 12 is optoelectronic semiconductor component or light-emitting component, for example, at least comprise light emitting diode, photodiode, photovoltaic cell, solar cell, electroluminescent diode, laser diode, power amplifier or integrated circuit component.In the present embodiment, described thermal source 12 is light-emitting component, for example light emitting diode (LED) element, and therefore this radiating module 1 is light-emitting device.
Thermal source described in each (light-emitting component) 12 is attached to a first end (lower end) of heat abstractor 2 described in each, and described in each, the first end of heat abstractor 2 (lower end) is attached on this body 101.That is described thermal source (light-emitting component) 12 is positioned on this body 101 by described heat abstractor 2.Described in each, heat abstractor 2 is positioned at connecting portion 103(carrying open-work described in each) upper, to make described in each thermal source (light-emitting component) 12 correspondences (appearing) in connecting portion 103(carrying open-work described in each) and do not covered by this body 101.Therefore, in the present embodiment, described heat abstractor 2 is arrayed.
The position of described heat abstractor 2 and described thermal source (light-emitting component) 12 is for to run through between portion 102 with respect to described, thereby air is flowed through between described heat abstractor 2 or between described thermal source (light-emitting component) 12, to promote the radiating efficiency of described heat abstractor 2 and described thermal source (light-emitting component) 12 via the described portion 102 of running through.In other words, described in run through the passage that portion 102 is circulation of air, to increase thermal convection current.
Please refer to Fig. 4, show the schematic perspective view of another embodiment of radiating module of the present invention.The radiating module 1a of the present embodiment and the radiating module 1 of Fig. 1 are roughly the same, and wherein identical element is given identical numbering.The radiating module 1a of the present embodiment and the radiating module 1 of Fig. 1 different be in, in the present embodiment, described in each, second end (upper end) of heat abstractor 2 is directly attached to the connecting portion 103 on the body 101 of this bogey 10, and forms a Hanging type structure.Therefore, the connecting portion 103 of the present embodiment is not carrying open-work.
Please refer to Fig. 5, show the generalized section of an embodiment of the heat abstractor in radiating module of the present invention.This heat abstractor 2 is a heat pipe, and it comprises a hollow tube 20, one first seal cover 24, one second seal cover 26 and a cooling fluid 28.This hollow tube 20 has a sidewall 21 and multiple radiating fin 22.This sidewall 21 is a shell body, and it defines a hollow cavity 211.This hollow cavity 211 has the first opening 212 and one second opening 213.Described radiating fin 22 is stretched out with radial by these sidewall 21 outsides, to increase radiating efficiency.This sidewall 21 and described radiating fin 22 are integrated and form for aluminium extrusion moulding or aluminium die casting.But in other embodiments, described radiating fin 22 is for being connected to the sidewall 21 of this hollow tube 20.The material of this sidewall 21 and described radiating fin 22 is aluminium or copper, preferably, and can doping iron alloy, the material of magnesium alloy, other metals or high heat-conduction coefficient.
These the first seal cover 24 these first openings 212 of sealing, and these the second seal cover 26 these second openings 213 of sealing, make this hollow cavity 211 form a complete totally enclosed space, and preferably, the hollow cavity 211 of this sealing is a vacuum environment.This first seal cover 24 and this second seal cover 26 are fixed in sidewall 21 inner sides of this hollow tube 20, and its juncture can be close-fitting, welding (such as argon welding or laser spot welding), some glue or sealed etc.In the present embodiment, the material of this first seal cover 24 and this second seal cover 26 is aluminium or copper, preferably, and can doping iron alloy, the material of magnesium alloy, other metals or high heat-conduction coefficient.In the present embodiment, this second seal cover 26 also comprises a pothole 261, in order to place this cooling fluid 28.
This cooling fluid 28 is positioned at the hollow cavity 211 of this sealing.This cooling fluid 28 at least comprise water, methyl alcohol, ethanol, acetone, ammoniacal liquor, paraffin, oil, halocarbon (CFCs) or other as
flourinert or
the cooling liquid of Novec, wherein appoints the two or more mixture.The boil-off gas forming after these cooling fluid 28 heat absorptions can be interior mobile at this hollow cavity 211, and then form heat exchange across this sidewall 21 and described radiating fin 22 with external environment, is finally condensed into liquid coolant 28.The liquid coolant 28 that this condensation forms flows back to this second seal cover 26 along this sidewall 21.
In the present embodiment, this heat abstractor 2 also comprises a capillary structure.This capillary structure is positioned at this sidewall 21(shell body) inner side to define this hollow cavity 211, make this boil-off gas can this hollow cavity 211 interior flow, and then across this sidewall 21(shell body) form heat exchange with external environment, be finally condensed into liquid coolant.This capillary structure is that wire netting, metal powder burn solution or groove.In the present embodiment, this capillary structure is multiple grooves, is positioned at sidewall 21 inner sides of this hollow tube 20, and along the axial setting of this hollow tube 20, uses for this cooling fluid 28 and flow therein.
In the present embodiment, this radiating module (light-emitting device) 1 also comprises multiple substrates 32, and it is metal base printed circuit board (Metal Core PCB, MCPCB), and has a first surface 321 and a second surface 322.This thermal source (light-emitting diode) 12 is positioned at the second surface 322 of this substrate 32, and it comprises a crystal grain 34, many wires 36 and an adhesive material 38.This crystal grain 34 sticks to the second surface 322 of this substrate 32, the second surface 322 of described wire 36 these crystal grain 34 of electrical connection and this substrate 32, and coated this crystal grain 34 of this adhesive material 38 and described wire 36.
The first surface 321 of this substrate 32 is attached to this second seal cover 26, and therefore, the heat of crystal grain 34 that this cooling fluid 28 can absorb this thermal source (light-emitting diode) 12 flows this hollow cavity 211 is interior to form a boil-off gas.In other words the heat that, the crystal grain 34 of this thermal source (light-emitting diode) 12 produces can be discharged rapidly by this heat abstractor 2.
The working method of this heat abstractor 2 is as follows.These the second seal cover 26 belows contact this thermal source (light-emitting diode) 12, and in the time that this thermal source (light-emitting diode) 12 produces heat, the below of this hollow tube 20 is higher temperatures place, and the top of this hollow tube 20 is lower temperature place.Now this cooling fluid 28 absorbs the heat of this thermal source (light-emitting diode) 12 and forms a boil-off gas.This boil-off gas know from experience in this hollow cavity 211, flow to this hollow tube 20 above.Because the top of this hollow tube 20 is to touch lower temperature place, so in the time that this boil-off gas arrives this end, just start to produce condensation, now heat is exactly the outside of being passed to lower temperature by this boil-off gas by this sidewall 21 and described radiating fin 22.Meanwhile, this boil-off gas is known from experience and is condensed into liquid, and these liquid coolant 28 that produce after because of condensation flow back to this second seal cover 26 via the effect of the capillarity (Capillary Pumping) of this capillary structure.So thereby circulation can continue to carry out improving radiating effect.
Please refer to Fig. 6, show the generalized section of another embodiment of the heat abstractor in radiating module of the present invention.The heat abstractor 2a of the present embodiment and the heat abstractor 2 of Fig. 5 are roughly the same, and wherein identical element is given identical numbering.The heat abstractor 2a of the present embodiment and the heat abstractor 2 of Fig. 5 different be in, in the present embodiment, this second seal cover 26 also has a through hole 262, this through hole 262 runs through this second seal cover 26 and is communicated with this pothole 261.This substrate 32 is positioned at this through hole 262, and seals this through hole 262, thereby makes this cooling fluid 28 directly be contacted the first surface 321 of this substrate 32.In the present embodiment, one mating substance (not shown) is between the first surface 321 and side and this second seal cover 26 of this substrate 32, in order to engage this substrate 32 and this second seal cover 26, and this mating substance is cold welding agent, the ceramic cold welding agent of filling pore, the sticker with high thermal conductivity coefficient or adhesion glue.This mating substance is except the function engaging, and it has the function of sealing concurrently, to prevent that this cooling fluid 28 from oozing out.In addition, in other embodiments, this substrate 32 also has a hole, is communicated to through hole 262 and this pothole 261 of this second seal cover 26, thereby makes this cooling fluid 28 be entered the hole of this substrate 32.Preferably, this hole is through hole, and it runs through this substrate 32, and appears this thermal source (light-emitting diode) 12, thereby makes this cooling fluid 28 directly be contacted this thermal source (light-emitting diode) 12.
Please refer to Fig. 7, show the generalized section of another embodiment of the heat abstractor in radiating module of the present invention.The heat abstractor 2b of the present embodiment is not heat pipe, and it comprises a hollow tube 20.This hollow tube 20 has a sidewall 21 and multiple radiating fin 22.This sidewall 21 is a shell body, and it defines a hollow cavity 211.This hollow cavity 211 has the first opening 212 and one second opening 213, and in order to containing electronic components or structural detail, it does not hold cooling fluid.Described radiating fin 22 is stretched out with radial by these sidewall 21 outsides, to increase radiating efficiency.This sidewall 21 and described radiating fin 22 are integrated and form for aluminium extrusion moulding or aluminium die casting.The material of this sidewall 21 and described radiating fin 22 is aluminium or copper, preferably, and can doping iron alloy, the material of magnesium alloy, other metals or high heat-conduction coefficient.The first surface 321 of this substrate 32 is attached to this hollow tube 20.Therefore the heat that, the crystal grain 34 of this thermal source (light-emitting diode) 12 produces can be discharged rapidly by this heat abstractor 2.
Please refer to Fig. 8, show the schematic perspective view of another embodiment of radiating module of the present invention.The radiating module 1b of the present embodiment and the radiating module 1 of Fig. 1 are roughly the same, and wherein identical element is given identical numbering.The radiating module 1b of the present embodiment and the radiating module 1 of Fig. 1 different be in, in the present embodiment, this bogey 10a comprises a stem portion 14 and multiple load bearing unit 16.Load bearing unit 16 carrying heat abstractor 2 and thermal source (light-emitting diode) 12 described in each described in each described in each, and there is a junction 103(carrying open-work) to appear this thermal source (light-emitting diode) 12.Described load bearing unit 16 is removably connected to this stem portion 14 and forms dendritic module, and described load bearing unit 16 each interval one gaps.Described load bearing unit 16 and this stem portion 14 forms the body 101a of this bogey 10a, and the 102a of portion is run through described in forming in the gap of 16 of described load bearing units.
Please refer to Fig. 9 and Figure 10, show respectively solid and the elevational schematic view of another embodiment of radiating module of the present invention.The radiating module 1c of the present embodiment and the radiating module 1 of Fig. 1 are roughly the same, and wherein identical element is given identical numbering.Not existing together of the radiating module 1c of the present embodiment and the radiating module 1 of Fig. 1 is as described below.In the present embodiment, this bogey 10b has a body 101b, the multiple 102b of portion and multiple connecting portion 103(carrying open-work that runs through), described connecting portion 103(carrying open-work) and described in run through the 102b of portion and run through this body 101b.In the present embodiment, this body 101b is a flat board, described in to run through the 102b of portion be multiple open-works, itself and described connecting portion 103(carrying open-work) all run through this flat board.The described 102b of portion, the described connecting portion 103(of running through carries open-work) and all non-arrayed of described heat abstractor 2.Every four adjacent connecting portion 103(carrying open-works) be arranged in parallelogram and these four connecting portion 103(carrying open-works) between there is one and run through the 102b of portion.This connecting portion 103(carries open-work) be circular, and this to run through the 102b of portion be parallelogram.
Please refer to Figure 11, show the perspective exploded view of the radiating module of Fig. 9.This thermal source (light-emitting component) 12 is attached to the first end (lower end, i.e. this second seal cover 26) of this heat abstractor 2, and the first end of this heat abstractor 2 (lower end) is attached on this body 101b.Meanwhile, this thermal source (light-emitting component) 12 is positioned at this connecting portion 103(carrying open-work).Therefore, this substrate 32 and this connecting portion 103(carrying open-work) be similarly circular, and the external diameter of this substrate 32 is slightly less than this connecting portion 103(carrying open-work) aperture.
Please refer to Figure 12, show the schematic perspective view of another embodiment of radiating module of the present invention.The radiating module 1d of the present embodiment and the radiating module 1c of Fig. 9 and Figure 10 are roughly the same, and wherein identical element is given identical numbering.The radiating module 1d of the present embodiment and the radiating module 1c of Fig. 9 and Figure 10 different be in, in the present embodiment, this bogey 10c comprises multiple load bearing units 18.Described in each, load bearing unit 18 has a supporting part 181 and multiple extension 182, these supporting part 181 these thermals source of carrying (light-emitting diode) 12.Described extension 182 is connected to this supporting part 181 and by the outside radiated entends of this supporting part 181.Described load bearing unit 18 utilizes described extension 182 removably to connect each other to form the body 101c of this bogey 10c, and described extension 182 runs through the 102c of portion described in crossing.Between described extension 182, be mechanism's connection and electrical connection.The mode that this mechanism connects includes but not limited to that engaging, sealed, fastener coordinate and chute joint etc.In addition, in the present embodiment, the external form of described load bearing unit 18 is incomplete same.
Please refer to Figure 13, show the elevational schematic view of another embodiment of load bearing unit in radiating module of the present invention.The load bearing unit 18a of the present embodiment and the load bearing unit 18 of Figure 12 are roughly the same, and wherein identical element is given identical numbering.The load bearing unit 18a of the present embodiment and the load bearing unit 18 of Figure 12 different be in, in the present embodiment, this load bearing unit 18a has a supporting part 181 and four extensions 182, described extension 182 is by the outside radiated entends of this supporting part 181, and described extension 182 angle to each other all equates (being 90 degree).
Please refer to Figure 14, show the elevational schematic view of the bogey being formed by the load bearing unit of Figure 13.The bogey 10c of the present embodiment and the bogey 10c of Figure 12 are roughly the same, and wherein identical element is given identical numbering.The bogey 10c of the present embodiment and the bogey 10c of Figure 12 different be in, in the present embodiment, this bogey 10c comprises multiple identical load bearing unit 18a, and wherein the load bearing unit 18a of four connections crosses one and runs through the 102c of portion, and this to run through the 102c of portion be quadrangle haply.As shown in the figure, described load bearing unit 18a can connect other load bearing units again, forms a modular construction and expand, and increases the number of this thermal source (light-emitting diode) 12, to improve light source output lumen.In addition,, in the time expanding, described heat abstractor 2 can be because of thermally coupled impact each other.
Please refer to Figure 15, show the elevational schematic view of another embodiment of load bearing unit in radiating module of the present invention.The load bearing unit 18b of the present embodiment and the load bearing unit 18a of Figure 13 are roughly the same, and wherein identical element is given identical numbering.The load bearing unit 18b of the present embodiment and the load bearing unit 18a of Figure 13 different be in, in the present embodiment, this load bearing unit 18b has a supporting part 181 and three extensions 182, described extension 182 is by the outside radiated entends of this supporting part 181, and described extension 182 angle to each other all equates (being 120 degree).
Please refer to Figure 16, show the elevational schematic view of the bogey being formed by the load bearing unit of Figure 15.The bogey 10c of the present embodiment and the bogey 10c of Figure 14 are roughly the same, and wherein identical element is given identical numbering.The bogey 10c of the present embodiment and the bogey 10c of Figure 14 different be in, in the present embodiment, the load bearing unit 18b of six connections crosses one and runs through the 102c of portion, and this to run through the 102c of portion be hexagon haply.As shown in the figure, described load bearing unit 18b can connect other load bearing units again, and forms a modular construction.
Please refer to Figure 17, show the elevational schematic view of another embodiment of load bearing unit in radiating module of the present invention.The load bearing unit 18c of the present embodiment and the load bearing unit 18a of Figure 13 are roughly the same, and wherein identical element is given identical numbering.The load bearing unit 18c of the present embodiment and the load bearing unit 18a of Figure 13 different be in, in the present embodiment, this load bearing unit 18c has a supporting part 181 and six extensions 182, described extension 182 is by the outside radiated entends of this supporting part 181, and described extension 182 angle to each other all equates (being 60 degree).
Please refer to Figure 18, show the elevational schematic view of the bogey being formed by the load bearing unit of Figure 17.The bogey 10c of the present embodiment and the bogey 10c of Figure 14 are roughly the same, and wherein identical element is given identical numbering.The bogey 10c of the present embodiment and the bogey 10c of Figure 14 different be in, in the present embodiment, the load bearing unit 18c of three connections crosses one and runs through the 102c of portion, and this to run through the 102c of portion be triangle haply.As shown in the figure, described load bearing unit 18c can connect other load bearing units again, and forms a modular construction.
But above-described embodiment is only explanation principle of the present invention and effect thereof, but not in order to limit the present invention.Therefore, those skilled in the art modifies to above-described embodiment and changes and still do not depart from spirit of the present invention.Interest field of the present invention should be as listed in the application's claim.
Claims (21)
1. a radiating module, comprising:
One bogey, has a body and multiple portion of running through, described in the portion of running through run through this body; And
Multiple thermals source, are positioned on this body, and the position of described thermal source is for to run through between portion with respect to described, thereby air is flowed through between described thermal source via the described portion of running through, to promote the radiating efficiency of described thermal source.
2. radiating module according to claim 1, wherein said thermal source is multiple optoelectronic semiconductor components, and it is light emitting diode, photodiode, photovoltaic cell, solar cell, electroluminescent diode, laser diode, power amplifier or integrated circuit component.
3. radiating module according to claim 1, also comprises:
Multiple heat abstractors, described in each, thermal source is attached to a first end of heat abstractor described in each, described in each, the first end of heat abstractor is attached on this body, and described in each, heat abstractor has a hollow cavity, and wherein said heat abstractor is a radiating fin.
4. radiating module according to claim 3, wherein said heat abstractor further comprises a cooling fluid, is positioned at this hollow cavity, flows to form a boil-off gas in order to the heat that absorbs this thermal source in this heat abstractor.
5. radiating module according to claim 4, also comprises multiple radiating fins, is connected to heat abstractor described in each.
6. radiating module according to claim 4, wherein described in each, heat abstractor is a heat pipe, it comprises a shell body and a capillary structure, this capillary structure is positioned at the madial wall of this shell body to define this hollow cavity, described boil-off gas can be flowed in this hollow cavity, and then form heat exchange across this shell body and external environment, be finally condensed into liquid coolant.
7. radiating module according to claim 6, wherein the material of this shell body is metal, and this capillary structure is that wire netting, metal powder burn solution or groove.
8. radiating module according to claim 1, wherein the body of this bogey is a flat board, described in the portion of running through be multiple open-works, described open-work runs through this flat board.
9. radiating module according to claim 1, wherein this bogey comprises a stem portion and multiple load bearing unit, described in each, load bearing unit carries thermal source described in each, described load bearing unit is connected to this stem portion, and described load bearing unit each interval one gap, described load bearing unit and this stem portion form the body of this bogey, and portion is run through described in forming in gap between described load bearing unit.
10. radiating module according to claim 1, wherein this bogey comprises multiple load bearing units, described in each, load bearing unit has a supporting part and multiple extension, described supporting part carries this thermal source, described extension is connected to this supporting part and by the outside radiated entends of this supporting part, described load bearing unit utilizes described extension to be connected to each other to form the body of this bogey, and described extension runs through portion described in crossing.
11. radiating modules according to claim 10, the wherein said portion of running through is triangle, quadrangle or other polygons.
12. 1 kinds of light-emitting devices, comprising:
Multiple light-emitting components;
One bogey, has a body, multiple portion and multiple connecting portion of running through, and described in the portion of running through run through this body; And
Multiple heat abstractors, described in each, light-emitting component is attached to a first end of heat abstractor described in each, described in each, the first end of heat abstractor is attached on this body, described heat abstractor is positioned on described connecting portion, to make described light-emitting component corresponding to described connecting portion, and the position of described heat abstractor is for to run through between portion with respect to described, thereby air is flowed through between described heat abstractor via the described portion of running through, to promote the radiating efficiency of described heat abstractor.
13. light-emitting devices according to claim 12, also comprise a cooling fluid, described in each, heat abstractor has a hollow cavity, and this ECL, in this hollow cavity, flows to form a boil-off gas in order to the heat that absorbs this light-emitting component in this heat abstractor.
14. light-emitting devices according to claim 13, wherein described in each, heat abstractor is a heat pipe, it comprises a shell body and a capillary structure, this capillary structure is positioned at the madial wall of described shell body to define this hollow cavity, this boil-off gas can be flowed in this hollow cavity, and then form heat exchange across this shell body and external environment, be finally condensed into liquid coolant.
15. light-emitting devices according to claim 12, wherein said connecting portion is multiple carrying open-works, it runs through this body, and described light-emitting component is emerging in described carrying open-work.
16. light-emitting devices according to claim 13, also comprise multiple substrates, described in each, substrate has a first surface and a second surface, and this light-emitting component is positioned at the second surface of this substrate, and the first surface of this substrate is attached to the first end of this heat abstractor.
17. light-emitting devices according to claim 16, wherein the first end of this heat abstractor has a through hole, and this through hole of this base plate seals, thereby makes this cooling fluid be contacted this substrate.
18. light-emitting devices according to claim 17, wherein this substrate also has a hole, is communicated to this through hole, thereby makes this cooling fluid be entered the hole of this substrate.
19. light-emitting devices according to claim 12, wherein the body of this bogey is a flat board, described in the portion of running through be multiple open-works, it runs through this flat board.
20. light-emitting devices according to claim 12, wherein this bogey comprises a stem portion and multiple load bearing unit, described in each, load bearing unit carries described in each thermal source and has connecting portion described in each, described load bearing unit is connected to this stem portion, and described load bearing unit each interval one gap, described load bearing unit and this stem portion form the body of this bogey, and portion is run through described in forming in gap between described load bearing unit.
21. light-emitting devices according to claim 12, wherein this bogey comprises multiple load bearing units, described in each, load bearing unit has a supporting part and multiple extension, this supporting part carries this thermal source and has this connecting portion, described extension is connected to this supporting part and by the outside radiated entends of this supporting part, described load bearing unit utilizes described extension to be connected to each other to form the body of this bogey, and described extension runs through portion described in crossing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210505233.8A CN103851600A (en) | 2012-11-30 | 2012-11-30 | Radiating module and light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210505233.8A CN103851600A (en) | 2012-11-30 | 2012-11-30 | Radiating module and light emitting device |
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| Publication Number | Publication Date |
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| CN103851600A true CN103851600A (en) | 2014-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210505233.8A Pending CN103851600A (en) | 2012-11-30 | 2012-11-30 | Radiating module and light emitting device |
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