CN103801489B - Manufacture of substrates and apparatus for manufacturing substrate - Google Patents
Manufacture of substrates and apparatus for manufacturing substrate Download PDFInfo
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- CN103801489B CN103801489B CN201310344687.6A CN201310344687A CN103801489B CN 103801489 B CN103801489 B CN 103801489B CN 201310344687 A CN201310344687 A CN 201310344687A CN 103801489 B CN103801489 B CN 103801489B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Compression, Expansion, Code Conversion, And Decoders (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Image Processing (AREA)
Abstract
The invention provides a kind of manufacture of substrates and apparatus for manufacturing substrate.Manufacture of substrates of the present invention considers that the distortion of substrate is to form film while the time lengthening because of the correction process of view data shared by device and cost can be suppressed to increase.Prepare the packed data of the Image Data Compression of the raster format of the shape by being defined in the film that substrate should be formed.Measure the deflection in the in-plane direction of substrate.According to measured deflection, to packed data in the compressed format state implement the insertion of pixel or Transformatin and generate distortion and revise data.On substrate, film is formed according to generated distortion correction data.
Description
Technical field
The application advocates the priority of No. 2012-241784th, the Japanese patent application based on application on November 1st, 2012.The full content of this application is by reference to being applied in this description.
The present invention relates to a kind of formation on substrate and define manufacture of substrates and the apparatus for manufacturing substrate of the film of flat shape.
Background technology
There will be a known following technology, namely from nozzle head spue comprise thin-film material drop come the surface of substrate formed film (such as patent document 1).
In this film formation technology, such as substrate uses printed base plate, and thin-film material uses solder resist.Printed base plate comprises base material and distribution, and the position of regulation is welded with electronic building brick etc.Solder resist exposes the conductor part welded electronic building brick etc., covers the part not needing to weld.With solder resist is coated after whole, use optical etching technology to form the method for opening and compare and can reduce manufacturing cost.
Patent document 1: Japanese Unexamined Patent Publication 2004-104104 publication
Deform on printed base plate because of heat treatment of carrying out in the Substrate manufacture stage etc.Preferably according to the distortion occurred on substrate, the pattern of the film formed in its surface is revised.In general, the pattern of solder resist is obtained by the view data of lattice cypress form.By nozzle head spue thin-film material drop form film time, generate the view data of raster format from the view data of the lattice cypress form defined the pattern of film.The control of nozzle head is carried out according to the view data of this raster format.
After substrate is moved to film forming device and film formed before, detect the alignment mark on substrate, thus carry out the contraposition of substrate.By the deflection of multiple alignment mark position calculation substrate.According to the distortion calculated, correct the view data of lattice cypress form or the view data of raster format.
As an example, to the length of side be 500mm foursquare region in the 2400dpi view data that defines of pattern be approximately made up of 22.3 hundred million pixels.The view data of raster format is 2 dimension continuous datas, when therefore changing the value of 1 pixel, produces the impact changing other nearly all pixels.Even if when distributing 1 Bit data to 1 pixel, the size of view data also becomes about 266MB.Therefore, need for a long time when carrying out image data correction process.The time lengthening shared by film forming device is caused because carrying out the correction process of view data.
Before substrate is moved to film forming device, measures the deflection of substrate, carry out the correction of view data, thus the time because of the correction process of view data shared by film forming device can be shortened.But, in the method, except being equipped on the checkout gear of the alignment mark of film forming device, also need to arrange another alignment mark detection device for measuring deflection.Therefore, the cost increase of device entirety is caused.
Summary of the invention
The object of the present invention is to provide a kind of time lengthening because of the correction process of view data shared by device and cost can be suppressed to increase while, consider that the distortion of substrate comes film forming manufacture of substrates and apparatus for manufacturing substrate.
A viewpoint according to the present invention provides a kind of manufacture of substrates, and it has:
Prepare the operation of the packed data that definition should be formed in the Image Data Compression of the raster format of the shape of the film on substrate;
Measure the operation of the deflection in the in-plane direction of described substrate;
According to measured described deflection, by generating with the insertion or Transformatin of implementing pixel under the state keeping compressed format the operation that data are revised in distortion to described packed data; And
Data film forming operation is on the substrate revised according to described distortion.
Another viewpoint according to the present invention provides a kind of apparatus for manufacturing substrate, wherein,
Described apparatus for manufacturing substrate has:
Objective table, keeps substrate;
Nozzle unit, is provided with multiple substrate towards remaining on described objective table and spues the nozzle bore of thin-film material drop;
Travel mechanism, makes a wherein side of described objective table and described nozzle unit move relative to the opposing party;
Position detecting device, detects in the position being held in the mark that the substrate of described objective table is formed; And
Control device, controls described travel mechanism and described nozzle unit,
Described control device controls as follows:
Store the packed data of the Image Data Compression of raster format, the shape of the film that the image definition data of wherein said raster format should be formed on the substrate,
According to the position calculation of the described mark detected in described position detecting device substrate face in the deflection in direction,
According to the described deflection calculated, revise data by generating distortion to described packed data with the insertion or Transformatin of implementing pixel under keeping compressed format state,
Revising data according to described distortion, forming film on the substrate by carrying out control to described travel mechanism and described nozzle unit.
Invention effect
By to the packed data of definition Thinfilm pattern to implement insertion or the Transformatin of pixel under keeping compressed format state, thus can the processing time be shortened.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the apparatus for manufacturing substrate based on embodiment 1.
Fig. 2 is the stereogram of nozzle unit.
In Fig. 3, Fig. 3 A is the top view of substrate and the nozzle unit do not deformed, and Fig. 3 B is the top view of the example representing the Thinfilm pattern formed on 1 printed circuit board (PCB).
Fig. 4 is the top view of the substrate deformed.
Fig. 5 is the flow chart of the manufacture of substrates based on embodiment 1.
In Fig. 6, Fig. 6 A is the line chart of an example of the local of the view data representing raster format.Fig. 6 B is the chart of the form representing the x direction packed data view data of raster format compressed in the x-direction.
In Fig. 7, Fig. 7 A is the line chart will represented by the profile not implementing to be out of shape the pattern that the x direction packed data of correcting process defines and the reduced outline of substrate that deformed, and Fig. 7 B is only at the line chart of parallel with x direction 1 profile tieing up substrate when direction deforms and the profile of pattern that defines with the x direction packed data not implementing to be out of shape correcting process together reduced representation by supposition y direction does not deform.
In Fig. 8, Fig. 8 A is the line chart of the profile in correcting unit region representing pixel in 1 correcting unit region and deformed, and Fig. 8 B is the line chart of the profile in correcting unit region representing the insertion of pixel and the pixel distribution after removing and deformed.
In Fig. 9, Fig. 9 A and Fig. 9 B is the view data of local light grid type and the chart of packed data that represent 1 pixel column.
Figure 10 is the view data of local light grid type and the chart of packed data that represent 1 pixel column.
In Figure 11, Figure 11 A represents the line chart with each profile in the correcting unit region of the x direction packed data definition after revising the distortion on x direction, and Figure 11 B represents to re-establish the line chart of the profile of the pattern in multiple correcting unit region in same pixel row continuous print mode in the pixel column in correcting unit region.
In Figure 12, Figure 12 A represents with the profile of the pattern of x Direction distortion correction data definition and the line chart of the profile of substrate that deformed, Figure 12 B be represent region by path make flexible in the y-direction with the profile of the pattern of x Direction distortion correction data definition after the line chart of profile of pattern.
In Figure 13, Figure 13 A and Figure 13 B is the chart of the form representing the x direction packed data adopted in the variation 1 of embodiment 1.
In Figure 14, Figure 14 A and Figure 14 B is the line chart of the configuration represented to add the pixel before and after pixel based on the method for embodiment 1, and Figure 14 C and Figure 14 D is the line chart representing the configuration adding the pixel before and after pixel with the method for the variation 2 based on embodiment 1.
In Figure 15, Figure 15 A is the line chart profile of the pattern defined with x Direction distortion correction data together illustrated with the profile of substrate deformed, and Figure 15 B will be assumed to the distortion not producing x direction on substrate and only at the line chart that parallel with y direction 1 profile tieing up substrate when direction deforms and the profile of pattern that defines with x Direction distortion correction data together represent.
Figure 16 is the chart of the example representing y direction packed data.
Figure 17 is the line chart of the profile representing the pattern that the xy Direction distortion correction data obtained with the insertion and Transformatin by carrying out pixel to y direction packed data define.
Figure 18 is the top view of objective table based on the apparatus for manufacturing substrate of embodiment 3 and nozzle unit.
In figure: 20-platform, 21-travel mechanism, 22-objective table, 24-support unit, 27-substrate, 28-filming apparatus, 29-alignment mark, 30-nozzle unit, 31-nozzle unit supporting device, 32-printed circuit board (PCB), 33-film, 34-nozzle head, 35-nozzle fixture, 36-solidification light source, 37-nozzle bore, 38-nozzle face, 39-opening, 40, 41-correcting unit region, the view data of 42-raster format, 43-pixel, the pixel that 43a-is inserted into, 43v-removes the region after pixel, the pixel of 43L-pixel column left end, 45-x direction packed data, 46-y direction packed data, 50-is not to implement the profile of the pattern of the x direction packed data definition of being out of shape correcting process, the profile of the substrate that 51-has deformed, 52-re-establishes the profile of the pattern in correcting unit region, the profile of the pattern that 53-defines with x Direction distortion correction data, 54-inserts the region of " W " pixel, 55-passage zone, the profile of the pattern that 56-defines with y direction packed data, 57-re-establishes the profile of the pattern in correcting unit region, 58-inserts the region of " W " pixel, the profile in the strained correcting unit region of 59-, 60, 61-region, 70-control device, 71-input unit, 72-output device, 80-posture adjusting mechanism.
Detailed description of the invention
[embodiment 1]
Based on the schematic diagram of the apparatus for manufacturing substrate of embodiment 1 shown in Fig. 1.Platform 20 is supported with objective table 22 by travel mechanism 21.The substrates such as printed base plate 27 are maintained at the upper surface (holding surface) of objective table 22.The definition direction parallel with the holding surface of objective table 22 is set to x direction and y direction and the normal direction of holding surface is set to the xyz rectangular coordinate system in z direction.Travel mechanism 21 make objective table 22 in the x-direction and y direction move.
By support unit 24 bearing nozzles unit 30 and filming apparatus 28 above platform 20.Nozzle unit 30 is liftably bearing on support unit 24 via nozzle unit supporting device 31.Nozzle unit 30 and filming apparatus 28 opposed with the substrate 27 remained on objective table 22.Filming apparatus 28 is taken the Wiring pattern be formed on the surface of substrate 27, alignment mark, the Thinfilm pattern etc. be formed on substrate 27.Shooting and the view data that obtains is input to control device 70.Nozzle unit 30 spues from multiple nozzle bore towards substrate 27 the thin-film material drop (drops of such as solder resist etc.) of photo-curable (such as ultra-violet solidified).The thin-film material spued is attached to the surface of substrate 27.
Control device 70 pairs of travel mechanisms 21, nozzle unit 30 and filming apparatus 28 control.Store in control device 70 view data of the raster format that the shape of the Thinfilm pattern that will be formed on substrate 27 defines or the view data (packed data) etc. compressed.Operator inputs the numeric data needed for various instruction (command) and control by input unit 71 pairs of control device 70.Control device 70 exports various information from output device 72 couples of operators.
The stereogram of nozzle unit 30 shown in Fig. 2 (Fig. 1).On nozzle fixture 35, arrangement is provided with multiple such as 4 nozzle heads 34 in the y-direction.Multiple nozzle bore 37 is in nozzle face 38 upper shed opposed with objective table 22 (Fig. 1) of each nozzle head 34.Multiple nozzle bore 37 is arranged in 2 row in the x-direction.Multiple nozzle bores 37 of 4 nozzle heads 34 configure different position in the x direction, are on the whole spacedly distributed in the x direction.
Between nozzle head 34 and the outside of two ends nozzle head 34 be separately installed with solidification light source 36.Solidification light source 36 pairs of substrates 27 (Fig. 1) irradiates solidification uses up such as ultraviolet.
In Fig. 3 A, the top view of the substrate 27 and nozzle unit 30 do not deformed is shown.1 substrate 27 is configured with multiple printed circuit board (PCB) 32.Substrate 27 is so-called jigsaw (multiaspect gets panel).In Fig. 3 A, 8 printed circuit board (PCB)s 32 are configured to the ranks shape that 4 row 2 arrange.Substrate 27 is formed multiple alignment mark 29.Shown in Fig. 3 A in the corner of substrate 27, each substantial middle on 4 limits and the approximate centre of substrate 27 be configured with the example of alignment mark 29.
Nozzle unit 30 is provided with multiple nozzle bore 37.Multiple nozzle bore 37 is in the x direction to be spacedly distributed.In Fig. 3 A, reduced representation becomes nozzle bore 37 to be arranged in row, but in fact as shown in Figure 2, nozzle bore 37 is configured to multiple row.
One example of the pattern of the film 33 formed on 1 printed circuit board (PCB) 32 shown in Fig. 3 B.Hatched region is had to be formed with the film 33 of solder resist drawing of Fig. 3 B.Multiple opening 39 is distributed with in film 33.Opening 39 with the position of electronic building brick is installed and is formed with that the position etc. of through hole is corresponding to be configured.
Then, the formation method of film is described.Make substrate 27 in the y-direction while movement, according to the view data defined the flat shape of the film that will be formed, to spue thin-film material drop from nozzle bore 37.This action is called " scanning ".The thin-film material drop land spued from nozzle bore 37 are to substrate 27.Irradiate solidification from solidification light source 36 (Fig. 2) facing to the thin-film material fallen substrate 27 to use up.Thus, at least skin section of thin-film material is solidified.In 1 scanning, be distributed with in the scope of nozzle bore 37 in the x direction, film 33 can be formed.Change substrate 27 and nozzle unit 30 relative position in the x direction and carry out Multiple-Scan, thus film 33 can be formed in the almost whole region on substrate 27 surface.
The top view of the substrate 27 deformed shown in Fig. 4.According to the distortion of substrate 27, the relative position of multiple alignment mark 29 changes.By detecting the position of alignment mark 29, the deflection of substrate 27 in x direction and y direction can be calculated.Such as on x direction and y direction, deflection can approximately linear change between 2 alignment marks 29.In the whole region of substrate 27 during simple deformation, also alignment mark 29 only can be configured in the corner of substrate 27.By increasing the number of alignment mark 29, complicated distortion can be detected.
The surface of substrate 27 is divided into multiple correcting unit region 40.The region of correcting unit shown in Fig. 4 40 is configured to the example of the ranks shape that 4 row 4 arrange.According to the distortion of substrate 27, carry out the correction of view data by correcting unit region 40.
Based on the flow chart of the manufacture of substrates of embodiment 1 shown in Fig. 5.In step SA1, compression is carried out to prepare packed data to the view data of the raster format of the flat shape of the film that definition will be formed.This packed data is such as generated by the upper position processing device of control device 70 (Fig. 1).The packed data generated is input to control device 70.
One example of the local of the view data 42 of raster format shown in Fig. 6 A.The view data 42 of raster format by the x-direction and multiple pixels 43 of arranging of y direction form.One in the value of " W " and " B " is assigned in each pixel 43." B " and " W " represents respectively makes the pixel of thin-film material drop land and the pixel of non-land.The areas adjacent of the opening 39 of circular is formed shown in Fig. 6 A.
The x direction packed data 45 shown in Fig. 6 B, the view data 42 of the raster format shown in Fig. 6 A compressed in the x-direction.Being compressed by the data rows that continuous print pixel is formed in the x direction of the view data 42 of raster format, and mark with multiple key element.Each key element comprises distinguished symbol that value " W " to pixel 43 and " B " distinguish and represents the numerical value being assigned the number of times of the continuous pixels of the value of distinguished symbol.
In step SA2 (Fig. 5), make to remain on (Fig. 1) on objective table 22 by film forming substrate 27.In step SA3, taken by the alignment mark 29 (Fig. 4) of filming apparatus 28 (Fig. 1) to substrate 27.The view data be taken is input to control device 70.In step SA4 (Fig. 5), control device 70 is by resolving the position calculating alignment mark 29 to the view data of alignment mark 29.Filming apparatus 28 plays the effect as the position detecting device detected the position of alignment mark 29.
In step SA5, according to the x direction of the position calculation substrate 27 of the alignment mark 29 calculated and the deflection in y direction.In step SA6, x direction packed data 45 (Fig. 6 B) is carried out to the process of inserting pixel or removing pixel, thus generate distortion correction data.With reference to figure 7A ~ Figure 11 B, the process of step SA6 is described.
In Fig. 7 A with line chart reduced representation with the profile 50 not implementing to be out of shape the pattern that the x direction packed data 45 (Fig. 6 B) of correcting process defines and the profile 51 of substrate 27 deformed.In Fig. 7 A, exaggeration represents distortion.The profile 50 of the pattern before distortion correction such as represents with the rectangle with the limit parallel with x direction and y direction.The profile 51 of substrate 27 in the x-direction and y Direction distortion.The inner area of the profile 50 of the pattern before distortion correction is divided into multiple correcting unit region 40.Correcting unit region 40 is configured to by such as arranging from the 1st row to 4 of 4 row of the 4th row and A row ~ D row the ranks shape formed.Identification code A ~ the D arranged and line number are arranged and specify 1 correcting unit region 40.Such as, the correcting unit region 40 of the 3rd row arranged by B is marked as " B3 ".
As shown in Figure 7 B, be assumed to not deform in y-direction and only tie up on direction parallel with x direction 1 and deform.The profile 51 of the substrate deformed is by parallel with x direction 2 edges and form the edge extended in the y-direction that the end of this edge connects each other.The edge parallel with x direction overlaps with the edge parallel with x direction of the profile 50 of being out of shape the pattern before revising.The profile 59 in each correcting unit region 40 also comprises 2 edges parallel with x direction.
Pixel 43 in 1 correcting unit region 40 shown in Fig. 8 A and the profile 59 in correcting unit region 40 deformed.In 1 correcting unit region 40, the quantity of the pixel 43 arranged in the x-direction is N number of.The profile 59 in the correcting unit region 40 deformed is to have the upper base parallel with x direction and trapezoidally representing of going to the bottom.
By the deflection in the x direction of every a line of the Deformation calculation pixel 43 in the x direction on the deflection in the x direction on the position of the upper base of profile 59 and the position of going to the bottom.As an example, at upper base and between going to the bottom, deflection approximately linear change in y-direction.Be illustrated as one the length that upper base is compressed into the pixel being equivalent to (N-2) individual amount, the example of the length extending into the pixel being equivalent to (N+3) individual amount of going to the bottom in Fig. 8 A.
Insertion or the removal of pixel is carried out, with the size close to the profile 59 deformed by the pixel column be made up of the pixel 43 arranged in the x-direction.Specifically, n decile is carried out along short transverse in correcting unit region 40.At this, " n " equals to add 1 and the value obtained in the number of pixels being equivalent to the residual quantity between the length of upper base and the length of going to the bottom.N=6 in example shown in Fig. 8 A.Determine the insertion number of pixel by the region of n decile or remove number.In the region of bottom, according to pixels row is inserted with 3 pixels.In the region of the top, according to pixels capable removal 2 pixels.
The insertion of pixel shown in Fig. 8 B and the pixel distribution after removing and the profile 59 in correcting unit region 40 deformed.Be inserted with pixel 43a and remove the pixel of region 43v.About each pixel column, the impartial dispersion in the x direction of the insertion position of pixel and removal position.The pixel column being inserted with pixel 43a extends in the x-direction, and the pixel column removing pixel reduces in the x-direction.Thus, the profile in region that distributes of pixel is close with the profile 59 in the correcting unit region 40 deformed.
With reference to figure 9A, the process that pixel column inserts pixel is described.In Fig. 9 A, view data and the packed data of the local light grid type of 1 pixel column is shown.5 " B " pixels, 4 " W " pixels, 7 " B " pixels and 6 " W " pixels are continuous successively in the x-direction.The packed data of this pixel column is labeled as " B5W4B7W6 ".
To being described from the situation inserting pixel 43a from left to right between the 13rd pixel 43 and the 14th pixel 43.The value inserting the pixel 43 of the both sides of the position of pixel 43a is " B ", and the value of therefore inserted pixel 43a is also set to " B ".Be contained in continuous print 7 pixels 43 represented with packed data " B7 " from the 13rd and the 14th pixel 43 from left to right.In the compressed data, only key element " B7 " is corrected to the insertion that " B8 " comes and carry out pixel.
As shown in Figure 9 B, when the value of a wherein side of the pixel 43 of the both sides of the position (from from left to right between the 16th pixel 43 and the 17th pixel 43) of insertion pixel 43a is " B ", when another value is " W ", the value of the pixel 43a inserted can be set to any one in " B " and " W ".Now, by the key element " B7 " of packed data being modified to " B8 " or key element " W6 " being modified to " W7 " to carry out adding of pixel 43a.
With reference to Figure 10, the process of removing pixel from pixel column is described.The view data of the local light grid type of 1 pixel column shown in Figure 10 and packed data.The example removed from the 13rd pixel 43 is from left to right described.From 1 that the 13rd pixel is from left to right continuous print 7 " B " pixels represented with " B7 " in the compressed data.In order to remove from the 13rd pixel 43 from left to right, the key element " B7 " of packed data is corrected to " B6 ".
As above-mentioned, without the need to launching x direction packed data 45 (Fig. 6 B), just state insertion and the Transformatin of pixel can be carried out by easy order in the compressed format.
Each profile in the correcting unit region 40 defined with the x direction packed data 45 (Fig. 9 A, Fig. 9 B, Figure 10) after correcting the distortion on x direction shown in Figure 11 A.If the position of the pixel 43 of the left end of fixed pixel row, then correcting unit region 40 outer is formed as trapezoidal parallel with y-axis in limit, left side.
As shown in Figure 11 B, re-establish multiple correcting unit region 40, to make in the pixel column in correcting unit region 40, identical pixel column is continuous.When re-establishing, make the position of pixel 43L of the left end in the correcting unit region 40 of the leftmost side (A row) consistent with the limit, left side of the profile 51 of the substrate 27 deformed shown in Fig. 7 B.By re-establishing the profile 52 of the pattern obtained with the correcting unit region 40 of the packed data of the correction of being out of shape in x direction definition, a pair edge comprising 2 limits parallel with x direction and connected in the y-direction each other the end on these 2 limits.In general, a pair edge that the profile 52 of the pattern re-established extends in the y-direction is not parallel with y-axis separately, and neither 1 straight line.
The rectangle of the profile 52 containing the pattern re-established in definition.This rectangular opposite side overlaps with the edge parallel with x direction of the profile 52 of the pattern re-established.In this rectangular interior zone, insert " W " pixel in the profile 52 than the pattern re-established closer to the region 54 in outside.In order to insert " W " pixel in region 54, in packed data after re-establishing (packed data of definition profile 52), add key element " Bi " (i is natural number) at the left end of each pixel column and right-hand member.The view data inserting " W " pixel is called " x Direction distortion correction data ".With the profile 53 of the pattern of x Direction distortion correction data definition for rectangle.
In step SA7 (Fig. 5), according to the deflection in y direction determine from nozzle bore 37 (Fig. 2) thin-film material drop spue the moment (spue frequency) or substrate 27 (Fig. 1) towards the translational speed of y direction (scanning direction).With reference to figure 12A and Figure 12 B, the process of step SA7 is described.
In Figure 12 A, illustrate with the profile 53 of the pattern of x Direction distortion correction data definition and the profile 51 of substrate that deformed.In the internal representation pixel 43 of the profile 53 of the pattern defined with x Direction distortion correction data.Equal with the spacing in y direction with the spacing in the x direction of the pixel 43 of x adjustment in direction data definition.
The inside of the profile 53 of the pattern defined with x Direction distortion correction data is divided into multiple passage zone 55 in the x direction.Each passage zone 55 is sized in x direction scan below the width in the x direction in the region that thin-film material can be made to adhere to 1 of nozzle unit 30 time.
Shown in Figure 12 B, region 55 by path, make to stretch in the y-direction with the profile 53 of the pattern of x Direction distortion correction data definition, thus the size size in the y direction of passage zone 55 being set to the y direction in the region of the correspondence of the profile 51 than the substrate deformed is larger.If make passage zone 55 stretch in the y-direction, then the spacing in y-direction of the pixel 43 in passage zone 55 changes.The spacing of pixel 43 in y-direction and sweep speed when nozzle unit 30 is scanned in the y-direction or corresponding from the spue frequency (moment) of thin-film material drop of nozzle bore 37.In each passage zone 55, the translational speed in spue moment and the y direction (scanning direction) towards substrate 27 (Fig. 1) of the thin-film material drop from nozzle bore 37 can be determined by the spacing of the pixel in the y direction after flexible.Also can be set to the wherein side fixedly spued in moment and translational speed, and adjust a loose side in spue moment and translational speed.
In step SA8 (Fig. 5), according to the x Direction distortion correction data generated in step SA6, spue moment or the substrate 27 (Fig. 1) determined in step SA7, towards under the condition of the speed of y direction movement, carry out the formation of film.
[variation 1 of embodiment 1]
With reference to figure 13A and Figure 13 B, in the manufacture of substrates of the variation 1 based on embodiment 1 the form of x direction packed data 45 that is suitable for and the order of x direction packed data 45 being carried out to the process of inserting pixel or removing pixel be described.As shown in Figure 6B, in adopted in embodiment 1 x direction packed data 45 by the distinguished symbol of " W " or " B " and get this distinguished symbol value pixel in the x-direction continuous print number of times form 1 key element.
The form of the x direction packed data 45 adopted in the variation 1 of embodiment 1 shown in Figure 13 A.By the pixel column arranged in the x-direction, to pixel column from left end successively appended sequence number #1, #2, #3 ...In the variation 1 of embodiment 1, each key element of x direction packed data 45 comprises the distinguished symbol of " W " or " B " and the sequence number of pixel.The sequence number of pixel 43 represents the left end of the continuous print pixel of the value of getting distinguished symbol and the pixel 43 of right-hand member.Such as " B1-5 " refer to be distributed in from the value of 5 pixels of sequence number #1 to #5 be " B ".
Between the pixel 43 of sequence number #13 and the pixel 43 of sequence number #14, the process of pixel 43a is inserted shown in Figure 13 B.The key element " B10-16 " of packed data comprises the pixel 43 of sequence number #13 and #14.When inserting pixel 43a, " B10-16 " is rewritten into " B10-17 ".Now, owing to reducing successively than the sequence number of sequence number #14 pixel 43 more on the right side, therefore in x direction packed data 45, the sequence number being contained in each key element also reduces successively.Such as, key element " W17-22 " is rewritten into " W18-23 ".When removing pixel 43, comprise in the key element of the sequence number of the sequence number being greater than removed pixel 43, successively, carry each sequence number.
Any one in embodiment 1 and variation 1 thereof, is all conceived to be set with the continuous print pixel 43 of identical value to carry out the compression of pixel data in 43 of the pixel of x direction arrangement.By in the view data (packed data) compressed, definition has the left end of the part of the continuous pixels of the number of the continuous pixels of identical value or identical value and the position of right-hand member.
In embodiment 1 and variation 1, the deflection according to the x direction of substrate 27 (Fig. 4) corrects the packed data defined the flat shape of film.In addition, the translational speed of spue moment or the substrate 27 of thin-film material drop is determined according to the deflection in the y direction of substrate 27 (Fig. 4).Its result, when substrate 27 is out of shape on x direction and y direction, the conductive pattern of the substrate 27 after also can making the flat shape of formed film and being out of shape is integrated.Thus, in the manufacture of substrates based on embodiment 1 and variation 1 thereof, the impact of substrate deformation can be relaxed.
In addition, in embodiment 1 and variation 1 thereof, as shown in Fig. 9 A, Fig. 9 B, Figure 10, in order to relax the impact of the distortion in the x direction of substrate 27 (Fig. 4), without the need to the data rows launching to be made up of continuous print pixel in the x direction by the packed data compressed, under the state compressed, carried out insertion and the Transformatin of pixel.In order to relax the impact of distortion in y-direction, without the need to carrying out insertion and the Transformatin of pixel to packed data.Therefore, with the view data of plaid matching Bai Geshi or when being carried out insertion and the Transformatin of pixel by the view data of the raster format before compressing compared with, the processing time of the impact for relaxing distortion can be shortened.
[variation 2 of embodiment 1]
With reference to figure 14A ~ Figure 14 D, the variation 2 of embodiment 1 is described.In embodiment 1, as shown in Figure 8 B, the pixel 43a impartial dispersion in the x-direction of inserting is exercised by the pixel in 1 correcting unit region 40.
As shown in Figure 14 A, study about the situation containing foursquare opening 39 in the film that will be formed.Be assumed to by the boundary line of correcting unit region 40 (Fig. 8 A) timesharing such as n in the y-direction by the inside of opening 39, and less at the deflection in x direction than region 61 on the lower than the boundary line deflection of region 60 in x direction by the top.When by the position of insertion pixel, equalization is distributed in the x-direction, the such as position of the arrow of Figure 14 A is chosen to be inserts position.In region 60 by the top, the position of inserting pixel overlaps with opening 39, and in region 61 on the lower, the position of inserting pixel is departed from from opening 39.
To insert the configuration of the pixel of the x direction packed data definition after pixel shown in Figure 14 B.In region 60 by the top, opening 39 size in the x direction increases, and in region 61 on the lower, opening 39 is unchanged in the size in x direction.Therefore, the flat shape as foursquare opening 39 is lost shape from square.In addition, obtain following result, in the region 61 that deflection is relatively large, do not make opening 39 be out of shape, and in the region 60 that deflection is relatively little, opening 39 is extended in the x-direction fruit.
As shown in Figure 14 C, in the method for the variation 2 based on embodiment 1, when the position of insertion pixel overlaps with opening 39, the position that pixel is inserted deviates to the edge of opening 39.
With the configuration of the pixel by inserting the x direction packed data definition after pixel based on the method for the variation 2 of embodiment 1 shown in Figure 14 D.In any one in region 60 by the top and region 61 on the lower, the size of opening 39 in x direction all can not change.Therefore, it is possible to prevent the shape of opening 39 from losing shape.
[embodiment 2]
With reference to figure 15A ~ Figure 17, the manufacture of substrates based on embodiment 2 is described.Below, the difference with embodiment 1 is described, about identical incomplete structure explanation.Operation from the step SA1 shown in Fig. 5 to step SA6 jointly uses embodiment 1 with embodiment 2.
Together represent with the profile 53 of the pattern of the x Direction distortion correction data generated in step SA6 (Fig. 5) definition with the profile 51 of the substrate deformed in Figure 15 A.Profile 53 is identical with the profile 53 of the pattern defined with the x Direction distortion correction data obtained in the method based on the embodiment 1 shown in Figure 11 B.
As shown in fig. 15b, be assumed to the distortion that x direction does not occur in substrate 27 (Fig. 4), only tie up on direction deforming parallel with y direction 1.The edge that the profile 51 of the substrate deformed extends in the y-direction becomes the straight line parallel with y-axis.In x Direction distortion correction data, as shown in Fig. 9 A, Fig. 9 B, Figure 10, compressed by the data rows that continuous print pixel is formed in the x-direction.These x Direction distortion correction data are converted to relative to the data rows be made up of continuous print pixel in the y-direction by the y direction packed data compressed.
The data rows be made up of continuous print pixel 43 in the y-direction shown in Figure 16 and by the example of y direction packed data 46 compressed.Each key element of y direction packed data 46 comprises distinguished symbol that value " W " to pixel 43 and " B " distinguish and represents the numerical value of pixel 43 that the value of distinguished symbol is assigned with continuous print number of times in the y-direction.
As shown in fig. 15b, the profile 56 of the pattern defined with y direction packed data 46 (Figure 16) is identical with the profile 53 of the pattern defined with x Direction distortion correction data.Regional Gravity in the profile 56 of the pattern defined with y direction packed data 46 is newly distinguished into multiple correcting unit region 41.
As shown in figure 17, by correcting unit region 41, according to the deflection in y direction, y direction packed data 46 (Figure 16) is carried out to insertion and the Transformatin of pixel.This process with relative to the pixel of the x direction packed data 45 shown in Fig. 8 A of embodiment 1 and Fig. 8 B is inserted and Transformatin identical.As shown in Figure 11 A of embodiment 1 and Figure 11 B, re-establish the correcting unit region 41 of insertion and the removal carrying out pixel.The edge extended in the x-direction re-establishing the profile 57 of the pattern in correcting unit region 41 cannot become 1 straight line parallel relative to x-axis.
" W " pixel is inserted in the region 58 in the outside of the edge that the profile 57 of the pattern re-established extends in the x-direction.The outer of region that the profile 57 of the pattern re-established and region 58 are synthesized into is formed as rectangle.Xy Direction distortion correction data are obtained by inserting " W " pixel in region 58.
According to xy Direction distortion correction data, the substrate 27 (Fig. 4) deformed forms film.In embodiment 2, carry out the distortion correction process identical with x direction in y-direction.In example 2, also can shorten to the processing time needed for impact of the distortion relaxing substrate 27 (Fig. 4) identically with embodiment 1.
[embodiment 3]
Based on the objective table 22 of the apparatus for manufacturing substrate of embodiment 3 and the top view of nozzle unit 30 shown in Figure 18.Below the difference with embodiment 1 is described, about identical incomplete structure explanation.Apparatus for manufacturing substrate based on embodiment 3 has and adjusts the posture of nozzle unit 30, with the posture adjusting mechanism 80 making the orientation of nozzle bore 37 change.If the orientation of nozzle bore 37 tilted relative to x direction, then the x durection component of the spacing of nozzle bore 37 changes.Substrate 27 is maintained above objective table 22.
Control device 70 is according to substrate 27 deflection in the x direction, and the orientation making the posture of nozzle unit 30 change over nozzle bore 37 is tilted relative to x direction.By this postural change, the x component of the spacing of nozzle bore 37 changes according to deflection.Its result, can relax the impact of substrate 27 distortion in the x direction.
Describe the present invention according to above embodiment, but the present invention is not limited thereto, such as those skilled in the art are obviously known such as can carry out various change, improvement, combination etc.
Claims (8)
1. a manufacture of substrates, wherein, has:
Prepare the operation of the packed data that definition should be formed in the Image Data Compression of the raster format of the shape of the film on substrate;
Measure the operation of the deflection in the in-plane direction of described substrate;
According to measured described deflection, by generating with the insertion or Transformatin of implementing pixel under the state keeping compressed format the operation that data are revised in distortion to described packed data; And
Data film forming operation is on the substrate revised according to described distortion,
The operation forming described film comprises:
The operation that the posture that the nozzle unit making to have multiple nozzle bore arranges along the 1st direction with described nozzle bore is opposed with described substrate; And
Make a wherein side of described substrate and described nozzle unit relative to the opposing party along and the 2nd direction movement that intersects of described 1st direction while, make thin-film material drop intermittently spue and form the operation of described film.
2. manufacture of substrates according to claim 1, wherein,
Described packed data is compressed on described 1st direction,
In the operation generating described distortion correction data, according to the deflection on described 1st direction of described substrate, described packed data is implemented to insertion or the Transformatin of pixel.
3. manufacture of substrates according to claim 2, wherein,
Described manufacture of substrates also has following operation: according to the deflection on described 2nd direction of described substrate, determine to make a wherein side of described nozzle unit and described substrate relative to the translational speed of the opposing party along described 2nd direction movement and the thin-film material drop from described nozzle bore spue in the moment at least one
In the operation forming described film, with determine described translational speed and described in the operation of at least one that spues in the moment determined translational speed or the moment that spues form described film.
4. the manufacture of substrates according to Claims 2 or 3, wherein,
After the operation measuring described deflection and before forming the operation of described film, also comprise following operation: according to the deflection on described 1st direction, change the posture of described nozzle unit to make the orientation of described nozzle bore relative to the mode that described 1st direction tilts.
5. an apparatus for manufacturing substrate, wherein, comprising:
Objective table, keeps substrate;
Nozzle unit, is provided with multiple substrate towards remaining on described objective table and spues the nozzle bore of thin-film material drop;
Travel mechanism, makes a wherein side of described objective table and described nozzle unit move relative to the opposing party;
Position detecting device, detects in the position being held in the mark that the substrate of described objective table is formed; And
Control device, controls described travel mechanism and described nozzle unit,
Described control device controls as follows:
Store the packed data of the Image Data Compression of raster format, the shape of the film that the image definition data of wherein said raster format should be formed on the substrate,
According to the position of the described mark detected by described position detecting device, the deflection in direction in the face calculating described substrate,
According to the described deflection calculated, revise data by generating distortion to described packed data with the insertion or Transformatin of implementing pixel under keeping compressed format state,
Revising data according to described distortion, forming film on the substrate by carrying out control to described travel mechanism and described nozzle unit.
6. apparatus for manufacturing substrate according to claim 5, wherein,
Described nozzle bore arranges along the 1st direction,
Described packed data is compressed on described 1st direction,
Described control device controls as follows:
According to the deflection on described 1st direction of described substrate, generate described distortion by the insertion or Transformatin described packed data being implemented to pixel and revise data,
Make a wherein side of described substrate and described nozzle unit relative to the opposing party along and the 2nd direction movement that intersects of described 1st direction while, make thin-film material drop intermittently spue from described nozzle bore and form described film.
7. apparatus for manufacturing substrate according to claim 6, wherein,
Described control device also controls as follows:
According to the deflection on described 2nd direction of described substrate, determine to make a wherein side of described nozzle unit and described substrate relative to the translational speed of the opposing party along described 2nd direction movement and the thin-film material drop from described nozzle bore spue in the moment at least one
Described film is formed by carrying out control with the translational speed determined or the moment that spues to described travel mechanism or described nozzle unit.
8. the apparatus for manufacturing substrate according to claim 6 or 7, wherein,
Described apparatus for manufacturing substrate also has posture adjusting mechanism, and the stance adjustment of described nozzle unit becomes the orientation of described nozzle bore is changed by described posture adjusting mechanism,
Described control device, according to the deflection on described 1st direction of described substrate, changes the posture of described nozzle unit relative to the mode that described 1st direction tilts with the orientation of described nozzle bore.
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| JP2012-241784 | 2012-11-01 | ||
| JP2012241784A JP6053459B2 (en) | 2012-11-01 | 2012-11-01 | Substrate manufacturing method and substrate manufacturing apparatus |
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| KR (1) | KR101436755B1 (en) |
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| CN105499069B (en) * | 2014-10-10 | 2019-03-08 | 住友重机械工业株式会社 | Membrane formation device and film forming method |
| JP6862041B2 (en) * | 2016-08-10 | 2021-04-21 | 住友重機械工業株式会社 | Membrane forming method and film forming apparatus |
| JP6714102B2 (en) * | 2016-12-13 | 2020-06-24 | 株式会社Ｆｕｊｉ | Data converter and additive manufacturing system |
| JP6968505B2 (en) * | 2018-05-17 | 2021-11-17 | 住友重機械工業株式会社 | Ink application device and ink application method |
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| JP2014093349A (en) | 2014-05-19 |
| JP6053459B2 (en) | 2016-12-27 |
| KR101436755B1 (en) | 2014-09-01 |
| TW201417903A (en) | 2014-05-16 |
| KR20140055978A (en) | 2014-05-09 |
| TWI492792B (en) | 2015-07-21 |
| CN103801489A (en) | 2014-05-21 |
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