CN103801489A

CN103801489A - Substrate manufacturing method and substrate manufacturing apparatus

Info

Publication number: CN103801489A
Application number: CN201310344687.6A
Authority: CN
Inventors: 白石达朗; 冈本裕司
Original assignee: Sumitomo Heavy Industries Ltd
Current assignee: Sumitomo Heavy Industries Ltd
Priority date: 2012-11-01
Filing date: 2013-08-08
Publication date: 2014-05-21
Anticipated expiration: 2033-08-08
Also published as: CN103801489B; JP2014093349A; KR20140055978A; JP6053459B2; TW201417903A; KR101436755B1; TWI492792B

Abstract

The invention provides a substrate manufacturing method and a substrate manufacturing apparatus. The substrate manufacturing method can suppress longer occupied time and the increasing cost of the apparatus because of the correction processing of image data to form a thin film in the consideration of the deformation of a substrate. The method includes the steps of preparing compression data formed by the compression of thin-film shaped grating-format image data which is defined on the substrate, and measuring the deformation amount of the substrate in the in-plane direction, generating deformation correction data by performing the inserting or removing processing of pixels on the compression data in a compression format based on the measured deformation amount, and forming the thin film on the substrate based on the generated deformation correction data.

Description

Manufacture of substrates and apparatus for manufacturing substrate

Technical field

The application advocates the priority of No. 2012-241784th, Japanese patent application based on November 1st, 2012 application.The full content of this application is by reference to being applied in this description.

The present invention relates to a kind of manufacture of substrates and apparatus for manufacturing substrate that forms the film that has defined flat shape on substrate.

Background technology

Known have a following technology, comes to form film (for example patent documentation 1) on the surface of substrate from the nozzle head drop that comprises thin-film material that spues.

In this film formation technology, for example substrate uses printed base plate, and thin-film material uses solder resist.Printed base plate comprises base material and distribution, on the position of regulation, is welded with electronic building brick etc.Solder resist exposes the conductor part that electronic building brick etc. is welded, and covers the part that does not need welding.With solder resist is coated after whole, use optical etching technology to form the method for opening and compare and can reduce manufacturing cost.

Patent documentation 1: TOHKEMY 2004-104104 communique

Because heat treatment of carrying out in the Substrate manufacture stage etc. deforms on printed base plate.Preferably, according to the distortion occurring on substrate, the pattern of the film forming is in its surface revised.In general, the pattern of solder resist is obtained by the view data of lattice cypress form.Spue thin-film material drop while forming film by nozzle head, generate the view data of raster format from the view data of lattice cypress form that the pattern of film is defined.The control of nozzle head is carried out according to the view data of this raster format.

After substrate is moved into film forming device and before film formation, detect the alignment mark on substrate, thereby carry out the contraposition of substrate.By the deflection of multiple alignment mark position calculation substrates.According to the distortion calculating, proofread and correct the view data of lattice cypress form or the view data of raster format.

As an example, the 2400dpi view data that the pattern in the foursquare region that is 500mm to the length of side defines is approximately made up of 22.3 hundred million pixels.The view data of raster format is 2 dimension continuous datas, while therefore changing the value of 1 pixel, produces the impact that changes other nearly all pixels.Even when 1 pixel is distributed to 1 Bit data, the size of view data also becomes about 266MB.Therefore, carry out when image data correction is processed needing for a long time.Because the correction processing of carrying out view data causes the shared time lengthening of film forming device.

Before substrate is moved into film forming device, measure the deflection of substrate, carry out the correction of view data, thereby can shorten the shared time of correction processing film forming device because of view data.But, in the method, except being equipped on the checkout gear of alignment mark of film forming device, also need to be provided for measuring another alignment mark detection device of deflection.Therefore, cause the cost of device entirety to rise.

Summary of the invention

The object of the present invention is to provide a kind of can the inhibition to process when installing shared time lengthening and cost and increase because of the correction of view data, consider that the distortion of substrate comes film forming manufacture of substrates and apparatus for manufacturing substrate.

A viewpoint according to the present invention provides a kind of manufacture of substrates, and it has:

The operation of the packed data that the Image Data Compression of the raster format of the shape of the film that preparation should form definition on substrate forms;

Measure the operation of the deflection in direction in face of described substrate;

According to measured described deflection, generate the operation of being out of shape correction data by insertion or the Transformatin of implementing pixel under the state with maintenance compressed format to described packed data; And

According to described distortion correction data film forming operation on described substrate.

Another viewpoint according to the present invention provides a kind of apparatus for manufacturing substrate, wherein,

Described apparatus for manufacturing substrate has:

Objective table, keeps substrate;

Nozzle unit, is provided with multiple towards remaining on the spue nozzle bore of thin-film material drop of substrate on described objective table;

Travel mechanism, makes a wherein side of described objective table and described nozzle unit move with respect to the opposing party;

Position detecting device, detects the position of the mark forming on the substrate that is held in described objective table; And

Control device, controls described travel mechanism and described nozzle unit,

Described control device is controlled as follows:

The packed data that storage forms the Image Data Compression of raster format, the shape of the film that the image definition data of wherein said raster format should form on described substrate,

According to the deflection of direction in the face of substrate described in the position calculation of the described mark detecting in described position detecting device,

According to the described deflection calculating, by described packed data is generated to distortion correction data with insertion or the Transformatin of implementing pixel under maintenance compressed format state,

According to described distortion correction data, by described travel mechanism and described nozzle unit are controlled on described substrate and formed film.

Invention effect

By to the packed data of definition Thinfilm pattern to keep implementing insertion or the Transformatin of pixel under compressed format state, thereby can shorten the processing time.

Accompanying drawing explanation

Fig. 1 is the schematic diagram of the apparatus for manufacturing substrate based on embodiment 1.

Fig. 2 is the stereogram of nozzle unit.

In Fig. 3, Fig. 3 A is the substrate that do not deform and the top view of nozzle unit, and Fig. 3 B is the top view that is illustrated in an example of the Thinfilm pattern forming on 1 printed circuit board (PCB).

Fig. 4 is the top view of the substrate that deformed.

Fig. 5 is the flow chart of the manufacture of substrates based on embodiment 1.

In Fig. 6, Fig. 6 A is the line chart that represents a local example of the view data of raster format.Fig. 6 B is the chart that represents the view data of raster format to compress in the x-direction the form of the x direction packed data forming.

In Fig. 7, Fig. 7 A is by the line chart of the profile reduced representation of the profile of the pattern being defined by the x direction packed data of not implementing to be out of shape correcting process and the substrate that deformed, and Fig. 7 B does not deform on will supposition y direction and the profile of substrate while only deforming in the 1 dimension direction parallel with x direction and not implement the together line chart of reduced representation of profile of pattern of the x direction packed data definition of being out of shape correcting process.

In Fig. 8, Fig. 8 A represents 1 pixel in correcting unit region and the line chart of the profile in the correcting unit region that deformed, Fig. 8 B be represent the insertion of pixel and remove after pixel distribution and the line chart of the profile in the correcting unit region that deformed.

In Fig. 9, Fig. 9 A and Fig. 9 B are the view data of local light grid type and the charts of packed data that represents 1 pixel column.

Figure 10 is the view data of local light grid type and the chart of packed data that represents 1 pixel column.

In Figure 11, Figure 11 A is the line chart that represents each profile in the correcting unit region defining with the x direction packed data after the distortion in x direction is revised, and Figure 11 B is the line chart that represents to re-establish in the continuous mode of same pixel row in the pixel column in correcting unit region the profile of the pattern in multiple correcting units region.

In Figure 12, Figure 12 A is the line chart representing with the profile of the profile of the pattern of x Direction distortion correction data definition and the substrate that deformed, and Figure 12 B represents that region by path makes the line chart of the profile of the pattern after flexible in the y-direction with the profile of the pattern of x Direction distortion correction data definition.

In Figure 13, Figure 13 A and Figure 13 B are the charts that is illustrated in the form of the x direction packed data adopting in the variation 1 of embodiment 1.

In Figure 14, Figure 14 A and Figure 14 B are the line charts that represents to append with the method based on embodiment 1 configuration of pixel pixel before and afterwards, and Figure 14 C and Figure 14 D are the line charts that represents to append with the method for the variation 2 based on embodiment 1 configuration of pixel pixel before and afterwards.

In Figure 15, Figure 15 A is the line chart that the profile of the pattern with x Direction distortion correction data definition and the profile of the substrate that deforms are together illustrated, Figure 15 B does not produce the distortion of x direction by being assumed to and the profile of substrate while only having deformed in the 1 dimension direction parallel with y direction and the line chart that together represents with the profile of the pattern of x Direction distortion correction data definition on substrate.

Figure 16 is the chart that represents an example of y direction packed data.

Figure 17 is the line chart representing with the profile of the pattern by y direction packed data being carried out to the insertion of pixel and the xy Direction distortion correction data definition that Transformatin obtains.

Figure 18 is the objective table of the apparatus for manufacturing substrate based on embodiment 3 and the top view of nozzle unit.

In figure: 20-platform, 21-travel mechanism, 22-objective table, 24-support unit, 27-substrate, 28-filming apparatus, 29-alignment mark, 30-nozzle unit, 31-nozzle unit supporting device, 32-printed circuit board (PCB), 33-film, 34-nozzle head, 35-nozzle fixture, 36-solidifies with light source, 37-nozzle bore, 38-nozzle face, 39-opening, 40, 41-correcting unit region, the view data of 42-raster format, 43-pixel, the pixel that 43a-is inserted into, 43v-removes the region after pixel, the pixel of 43L-pixel column left end, 45-x direction packed data, 46-y direction packed data, 50-is not to implement to be out of shape the profile of pattern of x direction packed data definition of correcting process, the profile of the substrate that 51-has deformed, 52-re-establishes the profile of the pattern in correcting unit region, 53-is with the profile of the pattern of x Direction distortion correction data definition, 54-inserts the region of " W " pixel, region, 55-path, 56-is with the profile of the pattern of y direction packed data definition, 57-re-establishes the profile of the pattern in correcting unit region, 58-inserts the region of " W " pixel, the profile in the strained correcting unit of 59-region, 60, 61-region, 70-control device, 71-input unit, 72-output device, 80-posture adjusting mechanism.

The specific embodiment

[embodiment 1]

The schematic diagram of the apparatus for manufacturing substrate based on embodiment 1 shown in Fig. 1.On platform 20, be supported with objective table 22 by travel mechanism 21.Upper surface (maintenance face) at objective table 22 maintains the substrates such as printed base plate 27.The definition direction parallel with the maintenance face of objective table 22 is made as x direction and y direction and the normal direction that keeps face is made as to the xyz rectangular coordinate system of z direction.Travel mechanism 21 makes objective table 22 in the x-direction and y direction moves.

Above platform 20, support nozzle unit 30 and filming apparatus 28 by support unit 24.Nozzle unit 30 is liftably bearing on support unit 24 via nozzle unit supporting device 31.Nozzle unit 30 and filming apparatus 28 is with to remain on substrate 27 on objective table 22 opposed.Filming apparatus 28 to be formed at substrate 27 lip-deep Wiring pattern, alignment mark, be formed at Thinfilm pattern on substrate 27 etc. and take.The view data of taking and obtain is input to control device 70.Nozzle unit 30 from multiple nozzle bores such as, such as, towards the spue thin-film material drop (drops of solder resist etc.) of photo-curable (ultra-violet solidified) of substrate 27.The thin-film material spuing is attached to the surface of substrate 27.

Control device 70 is controlled travel mechanism 21, nozzle unit 30 and filming apparatus 28.In control device 70, store the view data of the raster format that the shape to being formed on the Thinfilm pattern on substrate 27 defines or by view data of its compression (packed data) etc.Operator is inputted various instructions (command) and controls required numeric data control device 70 by input unit 71.Control device 70 is exported various information from output device 72 to operator.

The 30(of nozzle unit shown in Fig. 2 Fig. 1) stereogram.On nozzle fixture 35, arrange multiple for example 4 nozzle heads 34 are installed in the y-direction.Multiple nozzle bores 37 each nozzle head 34 with objective table 22(Fig. 1) opposed nozzle face 38 upper sheds.Multiple nozzle bores 37 are arranged in 2 row in the x-direction.Multiple nozzle bores 37 of 4 nozzle heads 34 are configured in the different position in x direction, on the whole in x direction, are spacedly distributed.

Between nozzle head 34 and the outside of two ends nozzle head 34 be separately installed with and solidify with light source 36.Solidify with light source 36 substrate 27(Fig. 1) irradiate to solidify and use up for example ultraviolet ray.

In Fig. 3 A, the substrate 27 that do not deform and the top view of nozzle unit 30 are shown.On 1 substrate 27, dispose multiple printed circuit board (PCB)s 32.Substrate 27 is so-called jigsaw (multiaspect is got panel).In Fig. 3 A, 8 printed circuit board (PCB)s 32 are configured to the ranks shape that 4 row 2 are listed as.On substrate 27, be formed with multiple alignment marks 29.Shown in Fig. 3 A, dispose the example of alignment mark 29 in four jiaos of substrate 27, each substantial middle on 4 limits and the approximate centre of substrate 27.

On nozzle unit 30, be provided with multiple nozzle bores 37.Multiple nozzle bores 37 in x direction to be spacedly distributed.In Fig. 3 A, reduced representation becomes nozzle bore 37 to be arranged in row, but in fact as shown in Figure 2, nozzle bore 37 is configured to multiple row.

One example of the pattern of the film 33 forming on 1 printed circuit board (PCB) 32 shown in Fig. 3 B.There is hatched region to be formed with the film 33 of solder resist drawing of Fig. 3 B.In film 33, be distributed with multiple openings 39.Opening 39 with the position of electronic building brick is installed and is formed with the corresponding configuration such as position of through hole.

Then, the formation method of film is described.When substrate 27 is moved in the y-direction, according to the view data that the flat shape of the film that will form is defined, from the nozzle bore 37 thin-film material drop that spues.This action is called to " scanning ".The thin-film material drop land that spue from nozzle bore 37 are to substrate 27.From solidifying with light source 36(Fig. 2) irradiate curing using up facing to the thin-film material of falling substrate 27.Thus, at least skin section of thin-film material occurs to solidify.In 1 scanning, in x direction, be distributed with in the scope of nozzle bore 37, can form film 33.Change substrate 27 with nozzle unit 30 relative position in x direction and carry out Multiple-Scan, thereby can form film 33 in the almost whole region on substrate 27 surfaces.

The top view of the substrate 27 having deformed shown in Fig. 4.According to the distortion of substrate 27, the relative position of multiple alignment marks 29 changes.By detecting the position of alignment mark 29, can calculate the deflection of substrate 27 in x direction and y direction.For example, in x direction and y direction, deflection can change by approximately linear between 2 alignment marks 29.In the whole region of substrate 27, when simple deformation, also alignment mark 29 only can be configured in to four jiaos of substrate 27.By increasing the number of alignment mark 29, can detect complicated distortion.

The surface of substrate 27 is divided into multiple correcting units region 40.The region of correcting unit shown in Fig. 4 40 is configured to the example of the ranks shape that 4 row 4 are listed as.According to the distortion of substrate 27, carry out the correction of view data by correcting unit region 40.

The flow chart of the manufacture of substrates based on embodiment 1 shown in Fig. 5.The view data of the raster format of the flat shape of the film that will form definition in step SA1 compresses to prepare packed data.This packed data is for example by control device 70(Fig. 1) upper position processing device generate.The packed data generating is input to control device 70.

A local example of the view data 42 of raster format shown in Fig. 6 A.The view data 42 of raster format by the x-direction and y direction arrange multiple pixels 43 form.In each pixel 43, be assigned in the value of " W " and " B "." B " and " W " represents respectively to make the pixel of thin-film material drop land and the pixel of land not.Shown in Fig. 6 A, be formed with near the region of opening 39 of circular.

Shown in Fig. 6 B, the view data 42 of the raster format shown in Fig. 6 A is compressed to the x direction packed data 45 forming in the x-direction.The data rows that the pixel by continuous in x direction of the view data 42 of raster format forms is compressed, and with multiple key element marks.Each key element comprises the distinguished symbol that value " W " to pixel 43 and " B " distinguish and represents the numerical value of the number of times of the continuous pixels of the value that is assigned distinguished symbol.

Step SA2(Fig. 5) in, make to remain on (Fig. 1) on objective table 22 by film forming substrate 27.In step SA3, by filming apparatus 28(Fig. 1) alignment mark 29(Fig. 4 to substrate 27) take.The view data being taken is input to control device 70.Step SA4(Fig. 5) in, control device 70 is by resolving to calculate the position of alignment mark 29 to the view data of alignment mark 29.Filming apparatus 28 plays the effect as the position detecting device that the position of alignment mark 29 is detected.

In step SA5, according to the deflection of the x direction of the position calculation substrate 27 of the alignment mark 29 having calculated and y direction.In step SA6, to x direction packed data 45(Fig. 6 B) insert the processing of pixel or removal pixel, thus generate distortion correction data.With reference to figure 7A～Figure 11 B, the processing of step SA6 is described.

In Fig. 7 A with line chart reduced representation not implement to be out of shape x direction packed data 45(Fig. 6 B of correcting process) profile 50 of pattern and the profile 51 of the substrate 27 that deformed of definition.In Fig. 7 A, exaggeration represents distortion.The profile 50 of the pattern before distortion is revised for example represents with the rectangle with the limit parallel with x direction and y direction.The profile 51 of substrate 27 in the x-direction and y Direction distortion.The inner area of the profile 50 of the pattern before distortion is revised is divided into multiple correcting units region 40.Correcting unit region 40 is configured to by being for example listed as from 4 of 4 row of the 1st row to the 4 row and A row～D row the ranks shape forming.Identification code A～D to row and line number are arranged and are specified 1 correcting unit region 40.For example, the correcting unit region 40 of the 3rd row of B row is marked as to " B3 ".

As shown in Figure 7 B, be assumed to and in y direction, do not deform and only in parallel with x direction 1 dimension direction, deform.The edge of extending in the y-direction that the profile 51 of the substrate having deformed is connected each other by the end of the Ji Duigai edge, 2 edges parallel with x direction forms.The edge parallel with x direction of the profile 50 of the pattern before the edge parallel with x direction revised with distortion overlaps.The profile 59 in each correcting unit region 40 also comprises 2 edges parallel with x direction.

The profile 59 in the pixel 43 shown in Fig. 8 A in 1 correcting unit region 40 and the correcting unit region 40 having deformed.In 1 correcting unit region 40, the quantity of the pixel 43 of arranging is in the x-direction N.Trapezoidal represent of the profile 59 in the correcting unit region 40 having deformed to there is the upper base parallel with x direction and to go to the bottom.

By the deflection of the x direction of every a line of the Deformation calculation pixel 43 of the deflection of the locational x direction of the upper base of profile 59 and the locational x direction of going to the bottom.As an example, at upper base and between going to the bottom, deflection approximately linear in y direction changes.In Fig. 8 A as a length that has exemplified upper base and be compressed into the pixel that is equivalent to (N-2) individual amount, the example of the length that extends into the pixel that is equivalent to (N+3) individual amount of going to the bottom.

The pixel column forming by the pixel 43 by arranging in the x-direction carries out insertion or the removal of pixel, to approach the size of the profile 59 having deformed.Particularly, n decile is carried out to along short transverse in correcting unit region 40.At this, the number of pixels that " n " equals the residual quantity between the length that is equivalent to the length of upper base and go to the bottom add 1 and value.N=6 in example shown in Fig. 8 A.Determine the insertion number of pixel or remove number by the region of n decile.In region below, according to pixels row is inserted with 3 pixels.In the region of the top, according to pixels row is removed 2 pixels.

The profile 59 in the pixel distribution after the insertion of pixel shown in Fig. 8 B and removal and the correcting unit region 40 having deformed.Be inserted with pixel 43a and remove the pixel of region 43v.About each pixel column, the impartial dispersion in x direction of the insertion position of pixel and removal position.The pixel column that is inserted with pixel 43a extends in the x-direction, and the pixel column of removing pixel dwindles in the x-direction.The profile in the region that thus, pixel distributes approaches with the profile 59 in the correcting unit region 40 deforming.

With reference to figure 9A, the processing of inserting pixel on pixel column is described.In Fig. 9 A, view data and the packed data of the local light grid type of 1 pixel column is shown.5 " B " pixels, 4 " W " pixels, 7 " B " pixels and 6 " W " pixels are continuous successively in the x-direction.The packed data of this pixel column is labeled as " B5W4B7W6 ".

To describing from the situation of inserting from left to right pixel 43a between the 13rd pixel 43 and the 14th pixel 43.The value of inserting the pixel 43 of the both sides of the position of pixel 43a is " B ", and the value of the pixel 43a that therefore inserted is also made as " B ".From the 13rd and the 14th pixel 43 are contained in 7 the continuous pixels 43 that represent with packed data " B7 " from left to right.In packed data, only key element " B7 " is proofreaied and correct as " B8 " is next and carry out the insertion of pixel.

As shown in Figure 9 B, when a wherein side's the value of pixel 43 of both sides of the position (from from left to right between the 16th pixel 43 and the 17th pixel 43) of inserting pixel 43a is " B ", when another value is " W ", the value of the pixel 43a inserting can be made as any in " B " and " W ".Now, carry out appending of pixel 43a by the key element of packed data " B7 " being modified to " B8 " or key element " W6 " being modified to " W7 ".

With reference to Figure 10, the processing of removing pixel from pixel column is described.View data and the packed data of the local light grid type of 1 pixel column shown in Figure 10.Describe removing from the example of the 13rd pixel 43 from left to right.Be 1 in 7 continuous " B " pixels that represent with " B7 " packed data from the 13rd pixel from left to right.In order to remove from the 13rd pixel 43 from left to right, the key element of packed data " B7 " is proofreaied and correct as " B6 ".

As above-mentioned, without launching x direction packed data 45(Fig. 6 B), just can carry out with compressed format state insertion and the Transformatin of pixel by easy order.

Shown in Figure 11 A with x direction packed data 45(Fig. 9 A, Fig. 9 B, Figure 10 after the distortion in x direction is proofreaied and correct) each profile in the correcting unit region 40 of definition.If the position of the pixel 43 of the left end of fixed pixel row, correcting unit region 40 outer is formed as trapezoidal parallel with y axle in limit, left side.

As shown in Figure 11 B, re-establish multiple correcting units region 40, so that in the pixel column in correcting unit region 40, identical pixel column is continuous.While re-establishing, make the position of pixel 43L of the left end in the correcting unit region 40 of the leftmost side (A row) consistent with the limit, left side of the profile 51 of the substrate having deformed 27 shown in Fig. 7 B.The profile 52 of the pattern that the correcting unit region 40 defining by the packed data re-establishing to have carried out the correction of being out of shape in x direction obtains, comprises 2 limits parallel with x direction and a pair of edge that the end on these 2 limits is connected each other in the y-direction.In general, a pair of edge that the profile 52 of the pattern re-establishing is extended is in the y-direction not parallel with y axle separately, and neither 1 straight line.

Definition contains the rectangle of the profile 52 of the pattern having re-established.This rectangular opposite side overlaps with the edge parallel with x direction of the profile 52 of the pattern re-establishing.In this rectangular interior zone, insert " W " pixel in the region 54 in the profile 52 more close outsides of the pattern than having re-established.For in the interior insertion in region 54 " W " pixel, in the packed data (packed data of definition profile 52) after re-establishing, append key element " Bi " (i is natural number) at left end and the right-hand member of each pixel column.The view data of inserting " W " pixel is called to " x Direction distortion correction data ".Take the profile 53 of the pattern of x Direction distortion correction data definition as rectangle.

Step SA7(Fig. 5) in, determine from nozzle bore 37(Fig. 2 according to the deflection of y direction) spue the moment (frequency spues) or substrate 27(Fig. 1 of thin-film material drop) towards the translational speed of y direction (scanning direction).With reference to figure 12A and Figure 12 B, the processing of step SA7 is described.

In Figure 12 A, the profile 51 with the profile 53 of the pattern of x Direction distortion correction data definition and the substrate that deformed is shown.In the internal representation pixel 43 of the profile 53 of the pattern with x Direction distortion correction data definition.Spacing with the x direction of the pixel 43 of x adjustment in direction data definition equates with the spacing of y direction.

The internal separation of the profile 53 of the pattern with x Direction distortion correction data definition is become to the region, multiple path 55 in x direction.Region, each path 55 is sized to can to make with 1 time of nozzle unit 30 scanning in x direction below the width of x direction in the region that thin-film material adheres to.

Shown in Figure 12 B, region 55 by path, make with the profile 53 of the pattern of x Direction distortion correction data definition flexible in the y-direction, thereby the size of the y direction in region, path 55 is made as larger than the size of the y direction in the corresponding region of the profile of the substrate having deformed 51.If make region, path 55 flexible in the y-direction, the spacing in y direction of the pixel 43 in region, path 55 changes.The sweep speed of the spacing of the pixel 43 in y direction when nozzle unit 30 is scanned in the y-direction or corresponding from the spue frequency (moment) of thin-film material drop of nozzle bore 37.In region, each path 55, can by the spacing of the pixel of the y direction after flexible determine from the thin-film material drop of nozzle bore 37 spue the moment and towards substrate 27(Fig. 1) the translational speed of y direction (scanning direction).Also can be made as a wherein side who fixedly spues in moment and translational speed, and adjust a loose side in spue moment and translational speed.

Step SA8(Fig. 5) in, according to the x Direction distortion correction data that generate in step SA6, spue moment or substrate 27(Fig. 1 of in step SA7, determining) under the condition of the speed that moves towards y direction, carry out the formation of film.

[variation 1 of embodiment 1]

With reference to figure 13A and Figure 13 B, the form to x direction packed data 45 applicable in the manufacture of substrates of the variation 1 based on embodiment 1 and the order of processing that x direction packed data 45 is inserted pixel or removes pixel describe.As shown in Figure 6B, the distinguished symbol by " W " or " B " in the x direction packed data 45 adopting in embodiment 1 and get this distinguished symbol value pixel in the x-direction continuous number of times form 1 key element.

The form of the x direction packed data 45 adopting in the variation 1 of embodiment 1 shown in Figure 13 A.By the pixel column of arranging in the x-direction, to pixel column from left end successively appended sequence number #1, #2, #3 ...In the variation 1 of embodiment 1, each key element of x direction packed data 45 comprises " W " or the distinguished symbol of " B " and the sequence number of pixel.The sequence number of pixel 43 represents the left end of continuous pixel and the pixel of right-hand member 43 of the value of getting distinguished symbol.For example " B1-5 " refers to that the value that is distributed in 5 pixels from sequence number #1 to #5 is " B ".

The processing of inserting pixel 43a shown in Figure 13 B between the pixel 43 of sequence number #13 and the pixel 43 of sequence number #14.The key element " B10-16 " of packed data comprises the pixel 43 of sequence number #13 and #14.While inserting pixel 43a, " B10-16 " is rewritten into " B10-17 ".Now, owing to reducing successively than the sequence number of sequence number #14 pixel 43 more on the right side, therefore, in x direction packed data 45, the sequence number that is contained in each key element also reduces successively.For example, key element " W17-22 " is rewritten into " W18-23 ".Remove when pixel 43, in the key element of the sequence number that comprises the sequence number that is greater than removed pixel 43, carry each sequence number on successively.

Any in embodiment 1 and variation 1 thereof, be all conceived to the pixel of arranging in x direction 43 in be set with identical value continuous pixel 43 carry out the compression of pixel data.In compressed view data (packed data), definition has the number of continuous pixels of identical value or the left end of part of the continuous pixels of identical value and the position of right-hand member.

In embodiment 1 and variation 1, according to substrate 27(Fig. 4) the deflection of x direction proofread and correct the packed data that the flat shape of film is defined.In addition, according to substrate 27(Fig. 4) the deflection of y direction determine the translational speed of spue moment or the substrate 27 of thin-film material drop.Its result, when substrate 27 is out of shape in x direction and y direction, the conductive pattern of the substrate 27 after the flat shape that also can make formed film and distortion is integrated.Thus, in the manufacture of substrates based on embodiment 1 and variation 1 thereof, can relax the impact of substrate distortion.

In addition, in embodiment 1 and variation 1 thereof, as shown in Fig. 9 A, Fig. 9 B, Figure 10, in order to relax substrate 27(Fig. 4) the impact of the distortion in x direction, without the compressed packed data of data rows that launches to be formed by pixel continuous in x direction, under compressed state, carry out insertion and the Transformatin of pixel.In order to relax the impact of the distortion in y direction, without the insertion and the Transformatin that packed data are carried out to pixel.Therefore, with the view data of plaid matching Bai Geshi or compressed before the view data of raster format while carrying out the insertion of pixel and Transformatin compared with, can shorten processing time of the impact for relaxing distortion.

[variation 2 of embodiment 1]

With reference to figure 14A～Figure 14 D, the variation 2 of embodiment 1 is described.In embodiment 1, as shown in Figure 8 B, exercise pixel 43a impartial dispersion the in the x-direction of inserting by the pixel in 1 correcting unit region 40.

As shown in Figure 14 A, study about the situation that contains foursquare opening 39 in the film that will form.Being assumed to correcting unit region 40(Fig. 8 A) boundary line of the timesharing such as n is in the y-direction by the inside of opening 39, and less at the deflection of x direction than region 61 on the lower at the deflection of x direction than the top side's in boundary line region 60.To insert the position impartial point timing in the x-direction of pixel, for example position of the arrow of Figure 14 A is chosen to be inserts position.In top side's region 60, the position of inserting pixel overlaps with opening 39, in region 61 on the lower, inserts the position of pixel and departs from from opening 39.

The configuration of the pixel defining with the x direction packed data after insertion pixel shown in Figure 14 B.In top side's region 60, the size of opening 39 in x direction increases, and in region 61 on the lower, opening 39 is unchanged in the size of x direction.Therefore, lose shape from square as the flat shape of foursquare opening 39.In addition, obtain following result, in the relatively large region 61 of deflection, do not make opening 39 be out of shape, and in the relatively little region 60 of deflection, opening 39 is extended to fruit in the x-direction.

As shown in Figure 14 C, in the method for the variation 2 based on embodiment 1, insert the position of pixel while overlapping with opening 39, make position that pixel is inserted deviate to the edge of opening 39.

Shown in Figure 14 D, insert the configuration of the pixel of pixel x direction packed data definition afterwards with the method for the variation 2 by based on embodiment 1.In any in top side's region 60 and region 61 on the lower, opening 39 all can not change in the size of x direction.The shape that therefore, can prevent opening 39 is lost shape.

[embodiment 2]

With reference to figure 15A～Figure 17, the manufacture of substrates based on embodiment 2 is described.Below, to describing with the difference of embodiment 1, about identical incomplete structure explanation.Operation from the step SA1 shown in Fig. 5 to step SA6 is jointly used among embodiment 1 and embodiment 2.

In Figure 15 A by with at step SA6(Fig. 5) in the profile 53 of pattern of the x Direction distortion correction data definition that generates together represent with the profile 51 of the substrate having deformed.The profile 53 of the pattern of the x Direction distortion correction data definition obtaining in the method for profile 53 and the embodiment 1 with based on shown in Figure 11 B is identical.

As shown in Figure 15 B, be assumed to Fig. 4 at substrate 27() in there is not the distortion of x direction, only in the 1 dimension direction parallel with y direction, deform.The edge that the profile 51 of the substrate having deformed is extended in the y-direction becomes the straight line parallel with y axle.In x Direction distortion correction data, as shown in Fig. 9 A, Fig. 9 B, Figure 10, the data rows being made up of continuous in the x-direction pixel is compressed.This x Direction distortion correction data transaction is become with respect to the compressed y direction of the data rows being made up of continuous in the y-direction pixel packed data.

One example of the data rows being formed by continuous in the y-direction pixel 43 shown in Figure 16 and compressed y direction packed data 46.Each key element of y direction packed data 46 comprises the distinguished symbol that value " W " to pixel 43 and " B " distinguish and represents pixel 43 numerical value of continuous number of times in the y-direction that the value of distinguished symbol is assigned with.

As shown in Figure 15 B, with y direction packed data 46(Figure 16) profile 56 of pattern of definition is identical with the profile 53 of the pattern with x Direction distortion correction data definition.Regional Gravity And in the profile 56 of the pattern defining with y direction packed data 46 is newly distinguished into multiple correcting units region 41.

As shown in figure 17, by correcting unit region 41, according to the deflection of y direction to y direction packed data 46(Figure 16 B) carry out insertion and the Transformatin of pixel.This processing insert with the pixel of the x direction packed data 45 shown in Fig. 8 A and Fig. 8 B with respect to embodiment 1 and Transformatin identical.As shown in Figure 11 A of embodiment 1 and Figure 11 B, re-establish the correcting unit region 41 of insertion and the removal of carrying out pixel.The edge of extending in the x-direction that re-establishes the profile 57 of the pattern in correcting unit region 41 cannot become 1 straight line parallel with respect to x axle.

" W " pixel is inserted in the region 58 in the outside of the edge of extending in the x-direction in the profile 57 of the pattern re-establishing.The outer rectangle that is formed as in the region that the profile of the pattern re-establishing 57 and region 58 are synthesized into.Obtain xy Direction distortion correction data by insert " W " pixel in region 58.

According to xy Direction distortion correction data, the substrate 27(Fig. 4 deforming) the upper film that forms.In embodiment 2, in y direction, carry out the distortion identical with x direction and proofread and correct processing.In embodiment 2, also can shorten in the same manner and relax substrate 27(Fig. 4 with embodiment 1) required processing time of impact of distortion.

[embodiment 3]

The objective table 22 of the apparatus for manufacturing substrate based on embodiment 3 shown in Figure 18 and the top view of nozzle unit 30.Below to describing with the difference of embodiment 1, about identical incomplete structure explanation.Apparatus for manufacturing substrate based on embodiment 3 has to be adjusted the posture of nozzle unit 30, so that the posture adjusting mechanism 80 that the orientation of nozzle bore 37 changes.If the orientation of nozzle bore 37 is tilted with respect to x direction, the x durection component of the spacing of nozzle bore 37 changes.Above objective table 22, maintain substrate 27.

Control device 70 is the deflection in x direction according to substrate 27, and the orientation that makes the posture of nozzle unit 30 change over nozzle bore 37 is tilted with respect to x direction.By this postural change, the x component of the spacing of nozzle bore 37 changes according to deflection.Its result, can relax the impact of the distortion of substrate 27 in x direction.

Describe the present invention according to above embodiment, but the present invention is not limited thereto, such as those skilled in the art are obviously known can for example carry out various changes, improvement, combination etc.

Claims

1. a manufacture of substrates, wherein, has:

2. manufacture of substrates according to claim 1, wherein,

The operation that forms described film comprises:

Posture and the opposed operation of described substrate that the nozzle unit with multiple nozzle bores is arranged along the 1st direction with described nozzle bore; And

A wherein side who makes described substrate and described nozzle unit with respect to the opposing party along and described the 1st direction the 2nd direction of intersecting when moving, thin-film material drop intermittently spued and form the operation of described film,

Described packed data is compressed in described the 1st direction,

Generating in the operation of described distortion correction data, according to the deflection in described the 1st direction of described substrate, described packed data is implemented to insertion or the Transformatin of pixel.

3. manufacture of substrates according to claim 2, wherein,

Described manufacture of substrates also has following operation: according to the deflection in described the 2nd direction of described substrate, determine make translational speed that a wherein side of described nozzle unit and described substrate moves along described the 2nd direction with respect to the opposing party and from the thin-film material drop of described nozzle bore spue in the moment at least one.

Forming in the operation of described film, with determine described translational speed and described at least one the operation that spues in the moment determined translational speed or the moment that spues form described film.

4. according to the manufacture of substrates described in claim 2 or 3, wherein,

After the operation of measuring described deflection and before forming the operation of described film, also comprise following operation: according to the deflection in described the 1st direction, so that the mode that the orientation of described nozzle bore is tilted with respect to described the 1st direction changes the posture of described nozzle unit.

5. an apparatus for manufacturing substrate, wherein, comprising:

Objective table, keeps substrate;

Control device, controls described travel mechanism and described nozzle unit,

Described control device is controlled as follows:

According to the position of the described mark detecting by described position detecting device, calculate the deflection of the interior direction of face of described substrate,

6. apparatus for manufacturing substrate according to claim 5, wherein,

Described nozzle bore is arranged along the 1st direction,

Described packed data is compressed in described the 1st direction,

Described control device is controlled as follows:

According to the deflection in described the 1st direction of described substrate, generate described distortion correction data by insertion or the Transformatin of described packed data being implemented to pixel,

When the 2nd direction that a wherein side of described substrate and described nozzle unit is intersected with respect to the opposing party edge and described the 1st direction moves, make thin-film material drop intermittently spue and form described film from described nozzle bore.

7. apparatus for manufacturing substrate according to claim 6, wherein,

Described control device is also controlled as follows:

According to the deflection in described the 2nd direction of described substrate, determine make translational speed that a wherein side of described nozzle unit and described substrate moves along described the 2nd direction with respect to the opposing party and from the thin-film material drop of described nozzle bore spue in the moment at least one

Described travel mechanism or described nozzle unit are controlled to form described film by the translational speed to determine or the moment that spues.

8. according to the apparatus for manufacturing substrate described in claim 6 or 7, wherein,

Described apparatus for manufacturing substrate also has posture adjusting mechanism, and described posture adjusting mechanism becomes the orientation of described nozzle bore is changed by the stance adjustment of described nozzle unit,

Described control device is according to the deflection in described the 1st direction of described substrate, and the mode tilting with respect to described the 1st direction with the orientation of described nozzle bore changes the posture of described nozzle unit.