CN103715102A - Lead frame band with improved package separation - Google Patents
Lead frame band with improved package separation Download PDFInfo
- Publication number
- CN103715102A CN103715102A CN201210371977.5A CN201210371977A CN103715102A CN 103715102 A CN103715102 A CN 103715102A CN 201210371977 A CN201210371977 A CN 201210371977A CN 103715102 A CN103715102 A CN 103715102A
- Authority
- CN
- China
- Prior art keywords
- nead frame
- band
- frame band
- encapsulating material
- material piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
Abstract
The invention relates to a lead frame band with improved package separation, and provides the metal lead frame band which is used for manufacturing a package electrical device. A joint part of the lead frame band and the electrical device are encapsulated in an encapsulation material block, so that the lead frame band can be physically fixed on device package. Later, the device package and the lead frame band are physically separated, and residual metal exposed on separation device package is not left.
Description
Technical field
The present invention relates in general to the metal pins frame strip that supports electric device encapsulation, and relates more particularly to the support chip for nead frame band.
Background technology
Metal pins frame strip is generally used for for example, supporting electric device encapsulation during conventional manufacturing step (pin adjustment and formation, encapsulation symbolism (symbolization) and electric test).For example, for example, by electric device (it can for example contain one or more building blocks, integrated circuit (IC)-components) being encapsulated in encapsulating material (molding compounds of applying) piece, thereby produce each device package during encapsulation moulding technology.Nead frame band comprises the support chip with bonding part, and this bonding part is encapsulated in associated sealing in piece together with electric device.This is fixed to device package by nead frame band physics.After completing the manufacturing step of expectation, by device package from nead frame band physical separation.
In conventional separation circuit, device package is forced to stamp out nead frame band.This pressure punching press fractures the support chip of nead frame band in the edge that seals piece, leaves the residual metal being exposed in the discrete device encapsulation edge that " breaks ".As be discussed in more detail below, this exposing metal is disadvantageous under some circumstances.
In view of aforementioned, expectation provides electric device encapsulation is not left to the residual metal being exposed to discrete device encapsulation from the separation of metal pins frame strip.
Summary of the invention
Accompanying drawing explanation
Fig. 1 diagram shows according to the nead frame band of the support electric device encapsulation of prior art.
Fig. 2 diagram shows the support chip of prior art nead frame band.
Fig. 3 diagram shows at the nead frame band after separating from Fig. 2, the residual metal on the device package of Fig. 1.
Fig. 4 diagram shows the example of the prior art electric device encapsulation of the residual metal adverse effect that is subject to Fig. 3.
Fig. 5 diagram shows the nead frame band according to example embodiment of the present invention.
Fig. 6 diagram shows at the nead frame band after separating from Fig. 5, the remaining cavity in electric device encapsulation.
Fig. 7 diagram shows the nead frame band according to further example embodiment of the present invention.
Fig. 8 shows and can use the operation of carrying out according to the nead frame band of example embodiment of the present invention.
Embodiment
Fig. 1 shows the conventional nead frame band 11 that supports electric device encapsulation 12 with the diagram of top view mode.Although (in Fig. 1-7, each architectural feature must not be shown to scale, and for understanding the present invention, fully describes whole features in detail at this.) Fig. 1 shows a pair of almost parallel of nead frame band 11 coplanar long and thin metal band portion 13.The metallic support sheet 14 extending from metal strap portions 13 is roughly coplanar with band portion, and perpendicular to this band portion.Each extends from their corresponding associated band portions 13 toward each other to relative support chip 14, to support associated device package 12.As shown in FIG. 1, band portion 13 has support chip 14, and support chip 14 extends from two opposite flanks of band portion 13, makes nead frame band 11 to encapsulate 12 rectangle matrix (not shown) by supporting device.Although clearly do not illustrate in Fig. 1, device package 12 can be configured to dual-in-line (DIP) encapsulation, and wherein pin extends from encapsulating 12 opposite flank 17.
Fig. 2 is the diagrammatic top view how each support chip 14 of being shown in further detail Fig. 1 supports associated device package 12.Each device package 12 comprises the electric device (it can consist of for example a plurality of building block devices) being encapsulated in encapsulating material piece 16.Each support chip 14 comprises with associated device and is encapsulated in together the T shape bonding part 15 in associated encapsulating material piece 16.Therefore, nead frame band 11 is fixed to piece 16 by physics, and is one or more manufacturing operations (for example aforementioned exemplary) supporting device encapsulation 12 thus.
After the manufacturing operation that completes expectation, device package 12 is forced to stamp out nead frame band 11.The position that this pressure punching operation makes metallic support sheet 14 occur from piece 16 at it fractures, thus by device package 12 from nead frame band 11 physical separation.At this after separating, each T shape metal bond part 15 is retained in associated device package, and wherein the metal edge that " fractures " is exposed to the surface of sealing piece 16.Fig. 3 is a diagram side view from nead frame band 11 after separatings in device package 12, shows the metal break-off edges 31 of exposure.
As above mentioned, the metal break-off edges 31 in the exposure shown in Fig. 3 is disadvantageous under some circumstances.For illustration purposes, provide following example.Fig. 4 is the diagrammatic top view of example device encapsulation 12.The device package 12 of Fig. 4 is isolating device encapsulation, and it comprises forming protection (for example, integrated circuit) device 41 and forming protected (for example, integrated circuit) device 42 by Bonding (being represented by illustrated in dashed lines) coupling.Protection device 41 and protected device 42 are coupled to respectively line side pin 43 and protected side pin 44 by further Bonding.As illustrated by arrow diagram in Fig. 4, the pin of respectively organizing at 43 and 44 places generally distributes along the gamut of the side 17 of device package 12.Protection device 41 on line side is designed to suppress undesirable interference, for example due to voltage spikes.As an example, automobile application is disposed digital data processing circuit conventionally in the environment with due to voltage spikes interference occurs relatively frequently.Protection device 41 suppresses to disturb, and thus by protected device 42(for example, microprocessor or microcontroller circuit) and may occur in the interference and insulation on line side pin 43, thus allow that protected device 42 receives the data of expectation from pin 43.
Maximum voltage isolating power at the device package of type shown in Fig. 4 can reduce according to the parameter that is sometimes referred to as " distance of creeping ".Creep distance corresponding to the part distance that does not contain exposing metal between line side pin 43 and protected side pin 44.The distance of creeping is longer, and maximum voltage isolating power is higher.Can find out, the metal break-off edges 31(of the exposure of Fig. 3 in Fig. 4 the example at 45 and 46 places) the attainable distance of creeping has been produced to the upper limit.For example, a conventional example of the device package 12 of Fig. 4 has total distance of about 4.42mm between its line side pin 43 and protection side pin 44 thereof.Be arranged in the exposure at 45 and 46 places metal break-off edges (referring to Fig. 3 31) there is the length (in the direction between pin 43 and 44) of about 0.24mm.Therefore, in this example, the metal break-off edges of exposure by the attainable distance limit of creeping of maximum in 4.42-0.24=4.18mm.
Example embodiment of the present invention provides the nead frame band with support chip, and this support chip is configured to allow when device package is stamped out nead frame band that they are from sealing piece withdrawal.Fig. 5 is the view that is similar to Fig. 2, shows the metal pins frame strip 51 according to example embodiment of the present invention.The band portion 13 of Fig. 5 has the roughly coplanar support chip 54 from its substantially vertical extension.Support chip 54 comprises bonding part 55, and it is encapsulated in associated sealing in piece 16 together with associated electric device.Bonding part 55 is configured to, when associated device package 12 is stamped out nead frame band 51, allows from piece 16 and regain completely.In certain embodiments, identical with the structure of nead frame band 11 shown in Fig. 1 and 2 in the structure of the nead frame band 51 shown in Fig. 5, except the support chip 14 of Fig. 1 and 2 by example as shown in Figure 5 support chip 54 substitute.
As seen from Figure 5, in certain embodiments, support chip 54 is configured in size " stem " part corresponding to the T shape support chip 14 of Fig. 1 and 2,, in support chip 14, band portion 13 is connected to the part of " cap " part of T shape that is.Therefore, support chip 54 is configured to have the shape of essentially rectangular, three edges of this shape definition, and wherein two edges are roughly parallel to each other.Two parallel edges extend from band portion 13, and stop at the place, opposite end that is positioned at free-ended the 3rd edge of support chip 54.In the example of Fig. 5, parallel edge has approximately uniform length, and the 3rd edge is roughly parallel to band portion 13.Because the support chip of Fig. 5 54 does not have " cap " of the T shape support chip 14 of Fig. 2, so when device package 12 is forced to stamp out nead frame band 51, the bonding part 55 being encapsulated in piece 16 is retracted from piece 16.Support chip 54 does not fracture, and does not have residual metal to stay in piece 16.
Fig. 6 is and the side view of Fig. 3 similar side view roughly to show the device package of the Fig. 5 after the nead frame band 51 that is stamped out.As shown in FIG. 6, seal piece 16 and there is (in the roughly the same position of metal break-off edges 31 with Fig. 3) corresponding to the cavity 61 of the bonding part 55 of regaining.Therefore, can find out, use the nead frame band 51 with support chip 54 that the distance of creeping of device package (example device package as shown in Figure 4) is maximized.Because at line side pin 43(also referring to Fig. 4) and protected side pin 44 between there is no the metal that exposes, so the distance of creeping is the whole distances (4.42mm in aforementioned exemplary) between pin 43 and pin 44.
Different embodiment are used different support chip sizes.Different embodiment are used the difference configuration of adjusting by different way, while being stamped from nead frame band with convenient device package, allow that the bonding part of support chip is regained from sealing piece.Fig. 7 shows the nead frame band 71 according to example embodiment of the present invention.Nead frame band 71 has taper support sheet 74, and this support chip 74 is roughly coplanar with band portion 13, and has the opposite edges that converge towards each other along with when band portion 13 extends.The edge converging stops at the place, opposite end that is positioned at free-ended the 3rd edge of support chip 74.In the example of Fig. 7, the 3rd edge is roughly parallel to band portion 13.Support chip 74 tapers to the second narrower width at its free end from the first width at band portion 13.In certain embodiments, the second narrower width is identical with the width of the support chip 54 of Fig. 5.In certain embodiments, the free end of support chip 74 is identical with the distance of band portion 13 with the free end of the distance of band portion 13 and the support chip of Fig. 5 54.The bonding part 75 of support chip 74 is encapsulated in piece 16.Tapered configurations contributes to bonding part 75 to regain from piece 16.In certain embodiments, the edge that converges of support chip 74 has approximately uniform cone angle.In certain embodiments, nead frame band 71 has the structure identical with the nead frame band 11 of Fig. 1 and 2, except the support chip 14 of Fig. 1 and 2 by example as shown in Figure 7 support chip 74 substitute.
Fig. 8 shows can be to the operation of carrying out according to each nead frame band of example embodiment of the present invention.81, the bonding part of support chip is encapsulated in and seals in piece together with electric device (it can comprise one or more composition devices), to nead frame band physics is fixed to and seals piece.82, by nead frame band with seal piece physical separation (for example, in certain embodiments, by piece being stamped out to nead frame band), bonding part is regained from sealing piece, and the nead frame band that do not fracture.
Although be described in detail exemplary embodiment of the present invention in the above, this does not limit the scope of the invention, and it can be implemented with various embodiment.
Claims (20)
1. be configured to support a plurality of nead frame bands of sealing electric device, it comprises:
Band portion; And
From described band portion, extend a plurality of, described in each, sheet has bonding part, described bonding part is suitable for being encapsulated in together in encapsulating material piece with associated electric device, to described nead frame band physics is fixed to described encapsulating material piece, described in each, bonding part is configured to allow that described bonding part is from the described encapsulating material piece withdrawal of association, so that by described nead frame band and described encapsulating material piece physical separation.
2. nead frame band as claimed in claim 1, wherein said bonding part and described band portion are roughly coplanar.
3. nead frame band as claimed in claim 2, wherein described in each, bonding part has a plurality of peripheral edges.
4. nead frame band as claimed in claim 3, wherein described in first and second, edge mutually extends and leaves substantially in parallel from described band portion, and stops at the respective end place at edge described in the 3rd.
5. nead frame band as claimed in claim 4, the length approximately equal at wherein said the first and second edges.
6. nead frame band as claimed in claim 3, wherein described in first and second, edge extends and leaves from described band portion, and converges towards each other.
7. nead frame band as claimed in claim 6, wherein said the first and second edges stop at the respective end place at edge described in the 3rd.
8. be configured to support a plurality of nead frame bands of sealing electric device, it comprises:
Band portion; And
From described band portion, extend a plurality of, described in each, sheet has bonding part, described bonding part is suitable for being encapsulated in together in encapsulating material piece with associated electric device, to described nead frame band physics is fixed to described encapsulating material piece, described in each, bonding part is configured to allow described nead frame band and associated described encapsulating material piece physical separation in the situation that not fractureing described nead frame band.
9. nead frame band as claimed in claim 8, wherein said bonding part and described band portion are roughly coplanar.
10. nead frame band as claimed in claim 9, wherein described in each, bonding part has a plurality of peripheral edges.
11. nead frame bands as claimed in claim 10, wherein described in first and second, edge mutually extends and leaves substantially in parallel from described band portion, and stops at the respective end place at edge described in the 3rd.
12. nead frame bands as claimed in claim 11, the length approximately equal at wherein said the first and second edges.
13. nead frame bands as claimed in claim 10, wherein described in first and second, edge extends and leaves from described band portion, and converges towards each other.
14. nead frame bands as claimed in claim 13, wherein said the first and second edges stop at the respective end place at edge described in the 3rd.
15. nead frame bands as claimed in claim 8, wherein said electric device comprises a plurality of building block devices.
16. 1 kinds are configured to the nead frame band that support package is enclosed in a plurality of electric devices in corresponding encapsulating material piece, and it comprises:
For allowing that described nead frame band is fixed to the device of described encapsulating material piece by physics; And
For allow the device of described nead frame band and described encapsulating material piece physical separation in the situation that not fractureing described nead frame band.
17. 1 kinds of methods of using nead frame band, it comprises:
A part for described nead frame band is encapsulated in encapsulating material piece together with electric device, to described nead frame band physics is fixed to described encapsulating material piece; And
By described nead frame band and described encapsulating material piece physical separation, comprise the described part of described nead frame band is regained from described encapsulating material piece.
18. methods as claimed in claim 17, are included in encapsulating material piece described in described nead frame band upper support, and wherein said physical separation comprises described encapsulating material piece is stamped out to described nead frame band.
19. 1 kinds of methods of using nead frame band, it comprises:
A part for described nead frame band is encapsulated in encapsulating material piece together with electric device, to described nead frame band physics is fixed to described encapsulating material piece; And
In the situation that not fractureing described nead frame band, by described nead frame band and described encapsulating material piece physical separation.
20. methods as claimed in claim 19, are included in encapsulating material piece described in described nead frame band upper support, and wherein said physical separation comprises described encapsulating material piece is stamped out to described nead frame band.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210371977.5A CN103715102A (en) | 2012-09-28 | 2012-09-28 | Lead frame band with improved package separation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210371977.5A CN103715102A (en) | 2012-09-28 | 2012-09-28 | Lead frame band with improved package separation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103715102A true CN103715102A (en) | 2014-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210371977.5A Pending CN103715102A (en) | 2012-09-28 | 2012-09-28 | Lead frame band with improved package separation |
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| Country | Link |
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| CN (1) | CN103715102A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391439A (en) * | 1990-09-27 | 1995-02-21 | Dai Nippon Printing Co., Ltd. | Leadframe adapted to support semiconductor elements |
| US6335223B1 (en) * | 1997-01-20 | 2002-01-01 | Matsushita Electronics Corporation | Method for producing a resin-sealed semiconductor device |
| US20050179118A1 (en) * | 2004-02-13 | 2005-08-18 | Semiconductor Components Industries, Llc | Method of forming a semiconductor package and leadframe therefor |
| CN101118891A (en) * | 2002-07-01 | 2008-02-06 | 株式会社瑞萨科技 | Semiconductor device |
-
2012
- 2012-09-28 CN CN201210371977.5A patent/CN103715102A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391439A (en) * | 1990-09-27 | 1995-02-21 | Dai Nippon Printing Co., Ltd. | Leadframe adapted to support semiconductor elements |
| US6335223B1 (en) * | 1997-01-20 | 2002-01-01 | Matsushita Electronics Corporation | Method for producing a resin-sealed semiconductor device |
| CN101118891A (en) * | 2002-07-01 | 2008-02-06 | 株式会社瑞萨科技 | Semiconductor device |
| US20050179118A1 (en) * | 2004-02-13 | 2005-08-18 | Semiconductor Components Industries, Llc | Method of forming a semiconductor package and leadframe therefor |
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Application publication date: 20140409 |
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