CN103560121A - Frame csp package with bumping optimization technology based on chips of different sizes and production process thereof - Google Patents
Frame csp package with bumping optimization technology based on chips of different sizes and production process thereof Download PDFInfo
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- CN103560121A CN103560121A CN201310387860.0A CN201310387860A CN103560121A CN 103560121 A CN103560121 A CN 103560121A CN 201310387860 A CN201310387860 A CN 201310387860A CN 103560121 A CN103560121 A CN 103560121A
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- chip
- silver coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention discloses a frame csp package with bumping optimization technology based on chips of different sizes and a production process thereof. The package is mainly formed by a lead frame, a silver plated layer, balls, chips, bonding wires and a plastic body. The main flows of the production process are wafer thinning, dicing, frame and silver plated layer processing, ball planting on the silver plated layer, chip installation, pressing welding, plastic packaging, the etching of the lead frame and the obtainment of a finished product. The manufacture of special shapes of the chips of the package is not needed, a fact that the chips of different sizes can be on the same frame to complete the production process without special design can be realized, the production cost is saved, and the production capacity of the product is raised.
Description
Technical field
Patent of the present invention relates to a kind of encapsulation field based on framework csp, further says a kind of framework csp packaging part and manufacture craft thereof of planting ball optimisation technique that adopt based on different size chip, belongs to integrated antenna package technical field.
Background technology
CSP (Chip Scale Package) encapsulation is the meaning of wafer-level package.CSP encapsulation is the memory chip encapsulation technology of latest generation, compares with BGA encapsulation, and under equal space, CSP encapsulation can improve memory capacity three times.Not only volume is little for CSP encapsulation internal memory, simultaneously also thinner, has greatly improved the reliability of memory chip after long-play, and line impedance significantly reduces, and the chip speed of service is also greatly improved thereupon.The center pin form of CSP encapsulation memory chip has shortened the conduction distance of signal effectively, and its decay reduces thereupon, and anti-interference, the noiseproof feature of chip also can be increased dramatically, and this also makes the access time ratio of CSP have very big raising.Also there is the features such as many I/O terminal number, good electrical property and good in thermal property.
First design framework redevelopment framework is all wanted in existing csp shell frame products exploitation, and design cycle and construction cycle are all long, and with last framework, can only encapsulate the chip of same size, makes production cost height and production efficiency lower.
Summary of the invention
Defect for above-mentioned conventional framework, the object of this invention is to provide a kind of framework csp packaging part and manufacture craft thereof of planting ball optimisation technique that adopt based on different size chip, make IC chip in encapsulation process, no longer be subject to the restriction of Frame Design, can directly be connected with framework, save the step of design framework.Can meet a framework and realize the advanced technologies that different size chip encapsulates simultaneously simultaneously, no longer with last framework, can only be encapsulated the chip of same size, because chip no longer needs to make special figure, the chip that can realize different size also can complete production procedure without particular design on same framework, save production cost, improve the production capacity of product.
Different size chip adopts the framework csp packaging part plant ball optimisation technique, mainly by lead frame, silver coating, plant ball, chip, bonding line and plastic-sealed body and form.Described lead frame is connected by silver coating with chip, bonding line is connected to lead frame from chip, on silver coating, there is the ball of planting, plastic-sealed body has surrounded lead frame, silver coating, has planted ball, chip and bonding line, chip, bonding line, plants power supply and signalling channel that ball and lead frame have formed circuit.On described lead frame, there is silver coating, on silver coating, have the ball of planting and chip, plant ball at the two ends of chip, silver coating, plant ball and chip all in a side of lead frame.On described lead frame, there are some sections of silver coatings, every section of size that silver coating is different length, corresponding chip is also the chip of different size.
Plant ball for gold, copper or alloying pellet.
Bonding line is gold thread, copper cash or alloy wire.
Different size chip adopts a manufacture craft for the framework csp packaging part of planting ball optimisation technique, and main flow process is as follows: on wafer attenuate → scribing → framework silver coating → silver coating, plant ball → upper core → pressure welding → plastic packaging → etched lead frame frame → finished product.
Accompanying drawing explanation
Fig. 1 is lead frame profile;
Fig. 2 is the silver-plated rear profile of lead frame;
Fig. 3 is that lead frame is planted ball profile;
Fig. 4 is product profile after upper core;
Fig. 5 is product profile after pressure welding;
Fig. 6 is plastic packaged products profile;
Fig. 7 is product profile and finished product profile after etched lead frame frame.
In figure, 1 is lead frame, and 2 is silver coating, and 3 for planting ball, and 4 is chip, and 5 is bonding line, and 6 is plastic-sealed body.
embodiment
As shown in the figure, a kind of framework csp packaging part plant ball optimisation technique that adopts based on different size chip, mainly by lead frame 1, silver coating 2, plant ball 3, chip 4, bonding line 5 and plastic-sealed body 6 and form.Described lead frame 1 is connected by silver coating 2 with chip 4, bonding line 5 is connected to lead frame 1 from chip 4, on silver coating 2, there is the ball of planting 3, plastic-sealed body 6 has surrounded lead frame 1, silver coating 2, has planted ball 3, chip 4 and bonding line 5, chip 4, bonding line 5, plants power supply and signalling channel that ball 3 and lead frame 1 have formed circuit.On described lead frame 1, there is silver coating 2, on silver coating 2, have the ball of planting 3 and chip 4, plant ball 3 at the two ends of chip 4, silver coating 2, plant ball 3 and chip 4 all in a side of lead frame 1.On described lead frame 1, there are some sections of silver coatings 2, every section of size that silver coating 2 is different length, corresponding chip 4 is also the chip of different size.
Plant ball 3 for gold, copper or alloying pellet.
Different size chip adopts a manufacture craft for the framework csp packaging part of planting ball optimisation technique, and main flow process is as follows: on wafer attenuate → scribing → framework silver coating → silver coating, plant ball → upper core → pressure welding → plastic packaging → etched lead frame frame → finished product.
As shown in the figure, a kind of manufacture craft that adopts the framework csp packaging part of planting ball optimisation technique based on different size chip, it carries out according to following concrete steps:
(1) wafer attenuate: thickness thinning 50 μ m～200 μ m, roughness Ra 0.10mm～0.05mm;
(2) scribing: the above wafer of 150 μ m is with common Q FN scribing process, but thickness is at the following wafer of 150 μ m, uses double-pole scribing machine and technique thereof;
(3) framework silver coating, on silver coating, plant ball: silver coating 2 and plant ball with conventional csp technique, different, silver coating 2 is some sections, every section of silver coating 2 length dimensions are different;
(4) upper core, pressure welding, plastic packaging: upper core, pressure welding, plastic packaging are with normal csp technique, different, and the size of the size of chip 4 and silver coating 2 is corresponding;
(5) etched lead frame frame: complete after plastic packaging at product, use etching solution by after the whole etchings of lead frame 1, silver coating 2 can all expose, and can do contact point and directly form connection.
The present invention can be used for single-chip package and also can be used for multi-chip stacking encapsulation.
The present invention adopts a kind of novel ball technique of planting, this technique is by planting ball, can realize the welding of directly carrying out chip on framework, save the loaded down with trivial details step of design framework and higher production cost, this method flexibility is high, owing to can realize the production procedure of sizes chip on same framework simultaneously, further improves production total value, significantly improve product reliability, and realize and reduce production cost.
Claims (2)
1. based on different size chip, adopt the framework csp packaging part plant ball optimisation technique, it is characterized in that: mainly by lead frame (1), silver coating (2), plant ball (3), chip (4), bonding line (5) and plastic-sealed body (6) and form; Described lead frame (1) is connected by silver coating (2) with chip (4), bonding line (5) is connected to lead frame (1) from chip (4), on silver coating (2), there is the ball of planting (3), plastic-sealed body (6) has surrounded lead frame (1), silver coating (2), has planted ball (3), chip (4) and bonding line (5), chip (4), bonding line (5), plants power supply and signalling channel that ball (3) and lead frame (1) have formed circuit; On described lead frame (1), there is silver coating (2), on silver coating (2), have the ball of planting (3) and chip (4), plant ball (3) at the two ends of chip (4), silver coating (2), plant ball (3) and chip (4) all in a side of lead frame (1); On described lead frame (1), there are some sections of silver coatings (2), the size that every section of silver coating (2) is different length, corresponding chip (4) is also the chip of different size.
2. based on different size chip, adopt a manufacture craft for the framework csp packaging part of planting ball optimisation technique, it is characterized in that: it carries out according to following concrete steps:
(1) wafer attenuate: thickness thinning 50 μ m～200 μ m, roughness Ra 0.10mm～0.05mm;
(2) scribing: the above wafer of 150 μ m is with common Q FN scribing process, but thickness is at the following wafer of 150 μ m, uses double-pole scribing machine and technique thereof;
(3) framework silver coating, on silver coating, plant ball: silver coating (2) and plant ball with conventional csp technique, different, silver coating (2) is some sections, every section of silver coating (2) length dimension is different;
(4) upper core, pressure welding, plastic packaging: upper core, pressure welding, plastic packaging are with normal csp technique, different, and the size of the size of chip (4) and silver coating (2) is corresponding;
(5) etched lead frame frame: complete after plastic packaging at product, use etching solution by after the whole etchings of lead frame (1), silver coating (2) can all expose, and can do contact point and directly form connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310387860.0A CN103560121A (en) | 2013-08-31 | 2013-08-31 | Frame csp package with bumping optimization technology based on chips of different sizes and production process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310387860.0A CN103560121A (en) | 2013-08-31 | 2013-08-31 | Frame csp package with bumping optimization technology based on chips of different sizes and production process thereof |
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| Publication Number | Publication Date |
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| CN103560121A true CN103560121A (en) | 2014-02-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310387860.0A Pending CN103560121A (en) | 2013-08-31 | 2013-08-31 | Frame csp package with bumping optimization technology based on chips of different sizes and production process thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1190252A (en) * | 1997-02-05 | 1998-08-12 | 华通电脑股份有限公司 | Bead array type integrated circut package method |
| US5894108A (en) * | 1997-02-11 | 1999-04-13 | National Semiconductor Corporation | Plastic package with exposed die |
| CN201681932U (en) * | 2010-04-26 | 2010-12-22 | 江苏长电科技股份有限公司 | Encapsulation structure of multi-chip inversion and passive device |
| CN203481222U (en) * | 2013-08-31 | 2014-03-12 | 华天科技（西安）有限公司 | Framework CSP package based on chips of different sizes and adopting ball mounting optimization technology |
-
2013
- 2013-08-31 CN CN201310387860.0A patent/CN103560121A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1190252A (en) * | 1997-02-05 | 1998-08-12 | 华通电脑股份有限公司 | Bead array type integrated circut package method |
| US5894108A (en) * | 1997-02-11 | 1999-04-13 | National Semiconductor Corporation | Plastic package with exposed die |
| CN201681932U (en) * | 2010-04-26 | 2010-12-22 | 江苏长电科技股份有限公司 | Encapsulation structure of multi-chip inversion and passive device |
| CN203481222U (en) * | 2013-08-31 | 2014-03-12 | 华天科技（西安）有限公司 | Framework CSP package based on chips of different sizes and adopting ball mounting optimization technology |
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Application publication date: 20140205 |
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